JP2010100682A - Heat-dissipating resin composition, substrate for led mounting, and reflector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-dissipating resin composition for forming a molded product having well balanced heat dissipation, heat resistance, impact resistance, electrical insulation, water resistance and light reflection properties; and to provide a substrate for LED mounting and a reflector. <P>SOLUTION: The composition contains [A] a polyamide resin, [B] a boron nitride particle having a specific particle size, [C] a glass fiber, [D] a titanium oxide particle, and [E] a hindered amine-based light stabilizer of formula, wherein the component [A] contains ≥30 mass% of a polyamide having a repeating unit derived from a hexamethylene terephthalamide, based on the total amount of the component [A]. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heat-dissipating resin composition, an LED mounting substrate, and a reflector, and more specifically, molding excellent in balance among heat dissipation, heat resistance, impact resistance, insulation, water resistance and light reflection characteristics. The present invention relates to a heat dissipating resin composition that gives a product, an LED mounting substrate including the heat dissipating resin composition, and a reflector.

Conventionally, an LED element is used as a light source such as an indicator lamp because it is small in size, has a long life, and is excellent in power saving. In recent years, LED elements with higher luminance have been manufactured at a relatively low cost, and their use as light sources to replace fluorescent lamps and incandescent lamps has been studied. When applying to such a light source, in order to obtain a large illuminance, a plurality of LED elements are arranged on a surface mount type LED package, that is, a base substrate made of metal such as aluminum (LED mounting substrate), for example, A method of arranging a reflector that reflects light in a predetermined direction around each LED element is frequently used. However, since LED elements generate heat during light emission, in such a type of LED lighting device, a temperature increase during light emission of the LED elements leads to a decrease in luminance, a shortened life of the LED elements, and the like. Therefore, an LED lighting device having a structure in which a bare chip of an LED element is mounted on a base substrate made of a metal having high heat dissipation property and heat generated during light emission is diffused to the base substrate has been proposed (for example, Patent Document 1 and 2).
And in patent document 3, the thermal radiation resin composition used for formation of the board | substrate for LED mounting containing a copolyester, scale-like boron nitride, or the reflector arrange | positioned by this board | substrate for LED mounting. It is disclosed.
Patent Document 4 discloses a polyamide resin composition containing polyamides 4 and 6, a thermally conductive filler made of boron nitride, silicon nitride, alumina or the like, and a fibrous reinforcing material such as ceramic fiber or glass fiber. Is disclosed.

JP-A-62-149180 JP 2002-344031 A International Publication No. 2008-53753 JP-A-3-79663

Polyamide resins are known to give molded products with excellent mechanical properties, heat resistance, and the like. In particular, molded products constituting electronic parts and the like that require heat dissipation are shown in Patent Document 4 above. Such compositions are widely used. However, although the composition containing polyamide 4 or 6 shows a certain improvement effect in thermal conductivity, heat resistance, light reflection characteristics, etc., it is still not sufficient, and improved in impact resistance, water resistance, etc. Was demanded. In particular, when a composition containing polyamide 4 or 6 is used for forming a heat dissipation member such as a substrate on which an LED is mounted or a reflector, the composition has excellent water resistance, that is, low water absorption. For example, the occurrence of blisters can be suppressed during reflow soldering. Moreover, it is anticipated that the LED lighting apparatus etc. with which the brightness | luminance was stabilized will be obtained when the reflection characteristic with respect to light is excellent and also it is excellent in durability. Therefore, optimization of preferred polyamide resins, heat conductive materials and light stabilizers constituting the composition has been demanded.
The present invention relates to a heat dissipating resin composition that gives a molded product having a good balance among heat dissipation, heat resistance, impact resistance, insulation, water resistance and light reflection characteristics, and an LED including the heat dissipating resin composition An object is to provide a mounting substrate and a reflector.

〔式中、Ｒ^１、Ｒ^２、Ｒ^３、Ｒ^４及びＲ^５は、互いに、同一又は異なって、炭素数１〜１０のアルキル基、炭素数６〜２０のアリール基、又は、炭素数７〜２０のアラルキル基である。〕
上記ポリアミド樹脂〔Ａ〕及び上記窒化ホウ素粒子〔Ｂ〕の合計量を１００質量％とした場合、ポリアミド樹脂〔Ａ〕の割合が１５〜９５質量％、窒化ホウ素粒子〔Ｂ〕の割合が５〜８５質量％であり、上記ポリアミド樹脂〔Ａ〕及び上記窒化ホウ素粒子〔Ｂ〕の合計量を１００質量部とした場合、上記ガラス繊維〔Ｃ〕の含有量が１〜５０質量部であり、上記酸化チタン粒子〔Ｄ〕の含有量が０．１〜５０質量部であり、上記光安定剤〔Ｅ〕の含有量が０．０１〜１０質量部であることを特徴とする放熱性樹脂組成物。
２．上記酸化チタン粒子〔Ｄ〕が、シロキサン処理された酸化チタン粒子である上記１に記載の放熱性樹脂組成物。
３．上記１又は２に記載の放熱性樹脂組成物を含むことを特徴とするＬＥＤ実装用基板。
４．上記１又は２に記載の放熱性樹脂組成物を含むことを特徴とするリフレクター。
５．上記１又は２に記載の放熱性樹脂組成物を含むことを特徴とする、リフレクター部を備えるＬＥＤ実装用基板。 The present invention is as follows.
1. [A] Polyamide resin, [B] Boron nitride particles, [C] Glass fibers, [D] Titanium oxide particles and [E] A heat-dissipating resin composition comprising the above polyamide resin [A] Contains 30% by mass or more of polyamide having a repeating unit derived from hexamethylene terephthalamide with respect to the entire polyamide resin [A], and the boron nitride particles [B] were obtained by measuring the particle size distribution. The particle diameters D ₁₀ and D ₉₀ when the cumulative volume is 10% and 90% are 4 to 6 μm and 35 to 50 μm, respectively, and the ratio D ₉₀ / D ₁₀ between D ₁₀ and D ₉₀ is 7 To 11 and the light stabilizer [E] is a hindered amine compound having the following structure:

[In formula, R < ¹ >, R < ² >, R < ³ >, R < ⁴ > and R < ⁵ > are mutually the same or different, and a C1-C10 alkyl group, a C6-C20 aryl group, or C7. -20 aralkyl groups. ]
When the total amount of the polyamide resin [A] and the boron nitride particles [B] is 100% by mass, the ratio of the polyamide resin [A] is 15 to 95% by mass, and the ratio of the boron nitride particles [B] is 5 to 5%. When the total amount of the polyamide resin [A] and the boron nitride particles [B] is 100 parts by mass, the content of the glass fiber [C] is 1 to 50 parts by mass, The content of titanium oxide particles [D] is 0.1 to 50 parts by mass, and the content of the light stabilizer [E] is 0.01 to 10 parts by mass. .
2. 2. The heat-dissipating resin composition as described in 1 above, wherein the titanium oxide particles [D] are siloxane-treated titanium oxide particles.
3. An LED mounting substrate comprising the heat-dissipating resin composition as described in 1 or 2 above.
4). A reflector comprising the heat dissipating resin composition as described in 1 or 2 above.
5). An LED mounting substrate comprising a reflector portion, comprising the heat-dissipating resin composition according to 1 or 2 above.

According to the heat-dissipating resin composition of the present invention, it is possible to give a molded product having an excellent balance among heat-dissipating property, heat resistance, impact resistance, insulating properties, water resistance and light reflection characteristics. That is, the thermal emissivity is 0.7 or more, the thermal conductivity is 3.5 W / (m · K) or more, the thermal deformation temperature is 270 ° C. or more, and the Charpy impact strength is 1.0 kJ / m. ² or more, the surface resistivity is 1 × 10 ¹³ Ω or more, the water absorption is 0.15% or less, and the light reflectance after the light resistance test is 80% or more. . In general, when the resin molded product is exposed to light, the light reflectance is greatly reduced compared to the initial value, but when the molded product comprising the heat-dissipating resin composition of the present invention is exposed to light, as described above, Since the reflectance can be suppressed to 80% or more, the reduction thereof can be suppressed, so that it is suitable for forming LED mounting substrates, reflectors, and the like having excellent durability as constituent members of LED lighting devices.
When the titanium oxide particles [D] are siloxane-treated titanium oxide particles, the light reflectance after the light resistance test is further improved.

  According to the LED mounting substrate of the present invention, the balance among heat dissipation, heat resistance, impact resistance, insulation, water resistance and light reflection characteristics is excellent. In addition, even when an LED element or the like is disposed on this LED mounting board, for example, when reflow soldering is performed, no blistering or deformation is involved, so that an LED having excellent dimensional stability. A lighting device can be provided. And this LED illuminating device can suppress the fall of the luminous efficiency in a LED element, and the fall of a brightness | luminance, and can be used for a long period of time.

  According to the reflector of the present invention, the balance among heat dissipation, heat resistance, impact resistance, insulation, water resistance, and light reflection characteristics is excellent. In addition, even when an LED element or the like is disposed on this reflector, for example, when reflow soldering is performed, no blisters are generated or deformed, so an LED composite member with excellent dimensional stability is provided. Can be given. And this LED composite member can suppress the fall of the luminous efficiency in a LED element, and the fall of a brightness | luminance, and can be used for a long period of time.

  According to the LED mounting substrate provided with the reflector portion of the present invention, the balance among heat dissipation, heat resistance, impact resistance, insulation, water resistance and light reflection characteristics is excellent. In addition, even when an LED element or the like is disposed on an LED mounting substrate provided with this reflector portion, for example, when performing reflow soldering, there is no occurrence of blisters, deformation, etc., so dimensional stability It is possible to provide an excellent LED lighting device. And this LED illuminating device can suppress the fall of the luminous efficiency in a LED element, and the fall of a brightness | luminance, and can be used for a long period of time.

〔式中、Ｒ^１、Ｒ^２、Ｒ^３、Ｒ^４及びＲ^５は、互いに、同一又は異なって、炭素数１〜１０のアルキル基、炭素数６〜２０のアリール基、又は、炭素数７〜２０のアラルキル基である。〕 1. Heat-dissipating resin composition The heat-dissipating resin composition of the present invention comprises [A] polyamide resin (hereinafter also referred to as “component [A]”), [B] boron nitride particles (hereinafter also referred to as “component [B]”). ), [C] glass fiber (hereinafter also referred to as “component [C]”), [D] titanium oxide particles (hereinafter also referred to as “component [D]”), and [E] light stabilizer ( (Hereinafter also referred to as “component [E]”), wherein the component [A] contains a polyamide having a repeating unit derived from hexamethylene terephthalamide as a whole in this component [A]. In contrast, the component [B] contains 30% by mass or more, and the particle size D ₁₀ and D ₉₀ when the cumulative volume obtained by measuring the particle size distribution is 10% and 90% are 4 to 6 μm and a 35～50Myuemu, and _the ratio of _{D 10} and _{D 90 90 /} D ₁₀ is 7 to 11, the component [E], when a hindered amine compound containing the following structure, in which the total amount of the components [A] and the component [B] is 100 mass%, When the ratio of the component [A] is 15 to 95% by mass, the ratio of the component [B] is 5 to 85% by mass, and the total amount of the component [A] and the component [B] is 100 parts by mass, The content of the component [C] is 1 to 50 parts by mass, the content of the component [D] is 0.1 to 50 parts by mass, and the content of the component [E] is 0.01 to 10 parts. It is a mass part.

[In formula, R < ¹ >, R < ² >, R < ³ >, R < ⁴ > and R < ⁵ > are mutually the same or different, and a C1-C10 alkyl group, a C6-C20 aryl group, or C7. -20 aralkyl groups. ]

1-1. Polyamide resin [A]
This component [A] is a resin containing a polyamide having a repeating unit derived from hexamethylene terephthalamide (hereinafter referred to as “polyamide (A1)”) in an amount of 30% by mass or more based on the entire component [A]. is there. That is, the component [A] may be only the polyamide (A1) or a combination of this polyamide (A1) and another polyamide.

  The polyamide (A1) is a polyamide having a repeating unit derived from hexamethylene terephthalamide (hereinafter referred to as “repeating unit (a1)”), and usually contains a diamine containing hexamethylene diamine and terephthalic acid. It is a homopolyamide or a copolyamide produced by a condensation polymerization reaction with a dicarboxylic acid.

The content ratio of hexamethylenediamine contained in the diamine is preferably 30 to 100% by mass, more preferably 70 to 100% by mass. Examples of other diamines include aliphatic diamines, alicyclic diamines, and aromatic diamines, which may be used alone or in combination of two or more. Specific examples include tetramethylene diamine, undecamethylene diamine, dodecamethylene diamine, tridecamethylene diamine, 1,9-nonane diamine, 2-methyl-1,8-octane diamine, 2,2,4-trimethylhexamethylene diamine. 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, 1,3-bisaminomethylcyclohexane, 1,4-bisaminomethylcyclohexane, m-phenylenediamine, p-phenylenediamine, m-xylylene Examples include range amine and p-xylylenediamine.
Moreover, the content rate of the terephthalic acid contained in the said dicarboxylic acid becomes like this. Preferably it is 30-100 mass%, More preferably, it is 70-100 mass%. Examples of other dicarboxylic acids include aliphatic dicarboxylic acids, alicyclic dicarboxylic acids, and aromatic dicarboxylic acids, and these may be used alone or in combination of two or more. Specific examples include adipic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, 1,1,3-tridecanedioic acid, 1,3-cyclohexanedicarboxylic acid, isophthalic acid, naphthalenedicarboxylic acid, dimer acid, and the like. Can be mentioned.

When the polyamide (A1) is a polyamide produced by a polycondensation reaction between a diamine composed solely of hexamethylenediamine and a dicarboxylic acid composed solely of terephthalic acid, the polyamide is a repeating derivative derived from hexamethylene terephthalamide. Polyamide 6, T containing 100 mol% of unit (a). The polyamide (A1) may be polyamide 6, T, or 1 selected from the repeating unit (a1), hexamethylene isophthalamide, 2-methylpentamethylene terephthalamide, hexamethylene adipamide, caproamide and the like. It may be modified polyamide 6, T composed of other repeating units of species or more. The content of the repeating unit (a1) contained in the modified polyamide 6, T is preferably 20 mol% or more and less than 100 mol%, more preferably 30 to 95 mol%, still more preferably 40 to 80 mol%, particularly preferably. It is 50-70 mol%.
As the polyamide (A1), polyamide 6, T and modified polyamide 6, T can be used in combination.
When the component [A] contains the polyamide (A1) having the above-described configuration, a molded product having excellent heat resistance, impact resistance, light reflection characteristics, and water resistance can be obtained.

  The content ratio of the polyamide (A1) contained in the component [A] is 30% by mass or more, preferably 50 to 100% by mass, more preferably 80 to 100% by mass with respect to the entire component [A]. is there. When the content of the polyamide (A1) is in the above range, a molded product having an excellent balance among heat dissipation, heat resistance, impact resistance, insulation, water resistance and light reflection characteristics can be obtained.

  When the component [A] contains other polyamide, the other polyamide is particularly limited as long as it is a resin having an amide bond [—NH—C (═O) —] in the repeating unit of the polymer main chain. However, either a homopolyamide or a copolyamide may be used, or a combination thereof may be used. Other polyamides include polycondensation of a diamine not containing hexamethylene diamine and a dicarboxylic acid containing terephthalic acid; a polycondensation of a diamine containing hexamethylene diamine and a dicarboxylic acid not containing terephthalic acid; Resins obtained by polycondensation of diamine not containing carboxylic acid and dicarboxylic acid not containing terephthalic acid; ring-opening polymerization of lactam compound; polycondensation of aminocarboxylic acid, etc. can be used. Polyamide 6, Polyamide 6, 6, Polyamide 4,6, Polyamide 11, Polyamide 12, Polyamide 6,10, Polyamide 6,12, Polyamide 6 / 6,6, Polyamide 6 / 6,12, Polyamide MXD (m-xylylenediamine), 6, Polyamide 6, I, polyamide 6/6, I, polyamide 6, 6/6, I, poly De 6/12/6, I, polyamide 6,6 / 12/6, I, polyamide 9, T, and the like.

  When the said component [A] contains another polyamide, the content rate of another polyamide is 30 mass% or less with respect to the said whole component [A], Preferably it is 0-20 mass%, More preferably, it is 0. -10 mass%. When the content of the other polyamide is in the above range, a molded product having an excellent balance among heat dissipation, heat resistance, impact resistance, insulation, water resistance and light reflection characteristics can be obtained.

1-2. Boron nitride particles [B]
This component [B] has a stable structure such as a hexagonal structure (h-BN), a zinc blende structure (c-BN), a wurtzite structure (w-BN), and a rhombohedral structure (r-BN). If it is a particle | grains which consist of boron nitride, it will not specifically limit. In the present invention, any boron nitride can be used, but particles composed of hexagonal boron nitride are preferred. A composition containing boron nitride particles having a hexagonal crystal structure is superior in heat dissipation, thermal conductivity, heat resistance, and insulation compared to a composition containing boron nitride particles having another structure. Therefore, for example, the above-described effect becomes remarkable both when the heat-dissipating resin composition of the present invention is used as the LED mounting substrate and when the reflector is used. Moreover, the composition containing boron nitride particles having a hexagonal crystal structure can reduce wear of a mold used when various molded articles are obtained.
The purity of the component [B] is preferably 98% or more, more preferably 99% or more.

  The volume average particle diameter of the component [B] is preferably 2 to 100 μm, more preferably 3 to 50 μm, still more preferably 5 to 30 μm, particularly preferably from the viewpoints of heat dissipation, thermal conductivity, heat resistance and insulation. Is 12-20 μm. In particular, when boron nitride particles having a volume average particle diameter in the range of 12 to 20 μm are used, the composition has excellent fluidity, excellent workability of the molded product, and heat dissipation, thermal conductivity and heat resistance of the resulting molded product. The property is particularly excellent. The volume average particle diameter can be measured by a laser diffraction method, a liquid phase precipitation method (light transmission method) or the like.

Further, heat radiation, from the viewpoints of heat resistance, thermal conductivity and insulating properties, particle diameter D ₁₀ of the cumulative volume obtained by measuring the particle size distribution of the component [B] is 10%, preferably 3-8 μm, more preferably 4-8 μm, still more preferably 4-7 μm, particularly preferably 4-6 μm, and the particle diameter D ₉₀ when the cumulative volume is 90% is preferably 10 μm or more, more preferably Is 20 to 60 μm, more preferably 30 to 55 μm, and particularly preferably 35 to 50 μm. _The ratio _D 90 _{/ D 10} of _{D 10} and _{D 90} is preferably 3 to 15, more preferably 6 to 12, more preferably from 7 to 11. Thereby, the further outstanding heat dissipation, heat conductivity, heat resistance, and insulation can be obtained.

The specific surface area of the component [B], heat dissipation, thermal conductivity, in view of heat resistance and insulation properties, preferably not more than ^8m 2 / g, more preferably 1 to 4 m ² / g, more preferably 1.5 ˜3 m ² / g.
The aspect ratio of the component [B] is preferably 3 or more, more preferably 4 or more, and still more preferably 5 to 10.
The tap density of the component [B] is preferably 0.5 g / cm ³ or more, more preferably 0.7 g / cm ³ or more.
Furthermore, the L value of the component [B] is preferably 93 or more, more preferably 95 or more.
When the physical properties of the component [B] are in the above ranges, a molded product excellent in heat dissipation, thermal conductivity, and light reflection characteristics can be obtained. Note that different types of boron nitride particles may be used in combination as long as they constitute each of the above ranges.
In the present invention, the component [B] is more preferably dispersed than the aggregated type in which primary particles are aggregated.

  The content ratio of the components [A] and [B] contained in the heat-dissipating resin composition of the present invention is 15 to 95% by mass and 5 to 85% by mass when the total of these components is 100% by mass. , Preferably 30 to 75 mass% and 25 to 70 mass%, more preferably 40 to 70 mass% and 30 to 60 mass%, still more preferably 50 to 65 mass% and 35 to 50 mass%. When the content ratios of the components [A] and [B] are in the above range, the obtained molded product is excellent in heat dissipation, thermal conductivity, insulation, and heat resistance.

1-3. Glass fiber [C]
If this component [C] is a well-known thing, it will not specifically limit. Examples of the raw glass include silicate glass, borosilicate glass, and phosphate glass. Examples of the glass include E glass, C glass, A glass, S glass, M glass, AR glass, and L glass. It is done. As said component [C], E glass and C glass are preferable.
In addition, this component [C] is a known synthetic resin emulsion, water-soluble synthetic resin, coupling agent (amine, silane, epoxy, etc.), film forming agent, lubricant, surfactant, antistatic agent, etc. Surface treatment with a sizing agent containing

The length of the component [C] is not particularly limited, and may be either a long fiber type (roving) or a short fiber type (chopped strand). A combination of these can also be used. The cross-sectional shape of the component [C] is not particularly limited.
The average length of the component [C] used in the production of the heat-dissipating resin composition of the present invention is preferably 1 to 10 mm, more preferably 2 to 6 mm, and the average diameter is preferably 5 to 25 μm. Preferably it is 8-20 micrometers. The residual average fiber length of the component [C] contained in the molded product obtained using the heat-dissipating resin composition of the present invention is preferably 150 to 1,000 μm, more preferably 200 to 800 μm, still more preferably. 250-700 μm. If the residual average fiber length is in the above range, the rigidity of the obtained molded product is further improved.
The residual average fiber length is measured, for example, by cutting out a part of a molded product, heating it to 800 ° C. to decompose the resin component, and then image-analyzing the fiber length of the remaining glass fiber. .

  In the heat-dissipating resin composition of the present invention, the content of the component [C] is 1 to 50 parts by mass when the total amount of the components [A] and [B] is 100 parts by mass, preferably Is 5 to 30 parts by mass, more preferably 5 to 25 parts by mass, and still more preferably 8 to 20 parts by mass. When the content of the component [C] is in the above range, for example, the rigidity of the molded product at a high temperature (for example, 250 ° C. to 280 ° C.) such as in a reflow furnace can be maintained. Excellent impact. When there is too little content of said component [C], it exists in the tendency for heat resistance to fall.

1-4. Titanium oxide particles [D]
This component [D] is not specifically limited, A rutile type structure may be sufficient and an anatase structure may be sufficient. Moreover, you may use in combination the titanium oxide particle which has each structure.
As said component [D], a silanol, a silane coupling agent, etc. to the particle | grains which have a coating part which consists of inorganic compounds, such as a silica, an alumina, aluminum phosphate, a zirconia, and the titanium oxide particle which is not restricted to the presence or absence of this coating part Organic silane compounds, siloxanes, aminosilanes, titanium coupling agents, particles surface-treated with organic compounds such as polyols such as alcohol amines and polyethylene glycols, or particles having a coating portion made of these organic compounds can also be used. .
Incidentally, the organic silane compound, for example, the general formula _{R n -Si- (OR ') 4} -n wherein, R represents an alkyl group, to 10 carbon atoms containing at least one vinyl group and methacryl group R ′ is a methyl group or an ethyl group, and n is an integer of 1 to 3. ], The particles surface-treated with this compound are usually those in which the alkoxy group in this compound is hydrolyzed to form silanol, and the silanols are further polycondensed to form an oligomer having a siloxane bond. Or a polymer, a mixture thereof, or the like.
In the present invention, it is preferable to use siloxane-treated titanium oxide particles because of excellent light reflection characteristics over a long period of time.

  The number average particle diameter of the component [D] is preferably 0.1 to 0.26 μm, and more preferably 0.12 to 0.24 μm, because of excellent light reflection characteristics. When this number average particle diameter is too small, the reflection characteristics tend to be lowered. On the other hand, if it is too large, the impact resistance tends to decrease.

  In the heat-dissipating resin composition of the present invention, the content of the component [D] is 0.1 to 50 parts by mass when the total amount of the components [A] and [B] is 100 parts by mass. Preferably, it is 1-40 mass parts, More preferably, it is 5-30 mass parts, More preferably, it is 7-25 mass parts. When the content of the component [D] is in the above range, the resulting molded article is excellent in light reflection characteristics. If the content of the component [D] is too small, the above effect may not be obtained. On the other hand, if the amount is too large, the impact resistance may decrease.

〔式中、Ｒ^１、Ｒ^２、Ｒ^３、Ｒ^４及びＲ^５は、互いに、同一又は異なって、炭素数１〜１０のアルキル基、炭素数６〜２０のアリール基、又は、炭素数７〜２０のアラルキル基である。〕 1-5. Light stabilizer [E]
This component [E] is a hindered amine compound containing the following structure.

[In formula, R < ¹ >, R < ² >, R < ³ >, R < ⁴ > and R < ⁵ > are mutually the same or different, and a C1-C10 alkyl group, a C6-C20 aryl group, or C7. -20 aralkyl groups. ]

  Examples of the hindered amine compound containing the above structure include tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) -1,2,3,4-butanetetracarboxylate, bis (1,2,2, 6,6-pentamethyl-4-piperidyl) sebacate, 2- (3,5-di-tert-butyl-4-hydroxyphenyl) -2-n-butyl-bis (1,2,2,6,6-pentamethyl) -4-piperidyl) malonate, 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, 2- (3,5-di-tert-butyl-4-hydroxybenzyl) -2-n-butyl-bis (1,2,2,6,6-pentamethyl-4-piperidyl) malonate, 1,2,3,4-butanetetracarboxylic acid and 2,2,6,6-tetramethyl-4-piperidyl Condensate of benzene and β, β, β ′, β′-tetramethyl-3,9- (2,4,8,10-tetraoxaspiro [5.5] undecane) diethanol, 1,2, A condensate of 3,4-butanetetracarboxylic acid, 1,2,2,6,6-pentamethyl-4-piperidinol and tridecyl alcohol, 1,2,3,4-butanetetracarboxylic acid, 1 , 2,2,6,6-pentamethyl-4-piperidinol and β, β, β ′, β′-tetramethyl-3,9- (2,4,8,10-tetraoxaspiro [5.5] And a condensate with undecane) diethanol. These compounds may be used alone or in combination. Of these, 1,2,3,4-butanetetracarboxylic acid, 2,2,6,6-tetramethyl-4-piperidinol, and β, β, β ′, β′-tetramethyl-3 , 9- (2,4,8,10-tetraoxaspiro [5.5] undecane) diethanol is preferred.

  In the heat-dissipating resin composition of the present invention, the content of the component [E] is 0.01 to 10 parts by mass when the total amount of the components [A] and [B] is 100 parts by mass. Preferably, it is 0.05-10 mass parts, More preferably, it is 0.1-5 mass parts, More preferably, it is 0.2-5 mass parts. When the content of the component [E] is in the above range, the resulting molded article is excellent in light reflection characteristics. When there is too little content of said component [E], the said effect may not be acquired. On the other hand, when too much, heat resistance may fall.

1-6. Additive The heat-dissipating resin composition of the present invention may contain an additive depending on the purpose and application. This additive includes fillers, colorants, other light stabilizers, heat stabilizers, antioxidants, UV absorbers, anti-aging agents, antistatic agents, plasticizers, lubricants, flame retardants, mold release agents, Antibacterial agents, crystal nucleating agents, flow modifiers, impact modifiers and the like can be mentioned, and any known compounds can be used. In addition, when using the heat-radiating resin composition of the present invention for forming a molded product colored in white, such as an LED mounting substrate or a reflector, an additive is used so that the composition can maintain its color. Is selected.

As the filler, a granular filler, other fibrous fillers excluding the component [C], and the like can be used. Other fibrous fillers include inorganic fibers such as ceramic whiskers and organic fibers such as carbon fibers and aramid fibers.
When the heat-radiating resin composition of the present invention contains a filler, the content is preferably 5 to 35 parts by mass when the total amount of the components [A] and [B] is 100 parts by mass. More preferably, it is 10-30 mass parts, More preferably, it is 10-20 mass parts.

As the colorant, any of inorganic pigments, organic pigments and dyes excluding the component [D] may be used. Moreover, you may use combining these. In addition, zinc oxide, aluminum oxide, magnesium oxide, aluminum nitride, silicon nitride, calcium titanate, and the like, which are usually white compounds used as fillers, may be used.
When the heat-radiating resin composition of the present invention contains a colorant, the content is preferably 5 to 30 parts by mass when the total amount of the components [A] and [B] is 100 parts by mass. More preferably, it is 5-25 mass parts, More preferably, it is 10-20 mass parts.

  Examples of the other light stabilizer include 1,6-hexamethylenebis- (N, N-dimethylsemicarbazide), 1,1,1 ′, 1′-tetramethyl-4,4 ′-(methylenedi-p-phenylene). ) Semicarbazone compounds such as disemicarbazide. These can be used alone or in combination of two or more.

  Examples of the heat stabilizer include hindered phenol compounds, phosphite compounds, and thioether compounds. These can be used alone or in combination of two or more. Of these, hindered phenol compounds are preferred. The hindered phenol compound and the phosphite compound also act as an antioxidant.

  Examples of hindered phenol compounds include 1,6-hexanediol-bis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], triethylene glycol-bis [3- (3-tert -Butyl-5-methyl-4-hydroxyphenyl) propionate], glycerol tris [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], pentaerythritol tetrakis [3- (3,5- Di-tert-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, thiodiethylenebis [3- (3,5-di-tert -Butyl-4-hydroxyphenyl) propionate], N, N′-he San-1,6-diylbis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionamide], 2,4-dimethyl-6- (1-methylpentadecyl) phenol, diethyl [[ 3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] phosphonate, calcium diethylbis [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] phosphonate 4,6-bis (octylthiomethyl) -o-cresol, ethylenebis (oxyethylene) bis [3- (5-tert-butyl-4-hydroxy-m-tolyl) propionate], hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 1,3,5-tris (3 -Di-tert-butyl-4-hydroxybenzyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 1,3,5-tris [(4-tert-butyl -3-hydroxy-2,6-xylyl) methyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 2,6-tert-butyl-4- (4 6-bis (octylthio) -1,3,5-triazin-2-ylamino) phenol, 3,9-bis {2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy ] -1,1-dimethylethyl} -2,4,8,10-tetraoxaspiro [5,5] undecane and the like. These compounds may be used alone or in combination.

  Examples of the phosphite compound include tris (2,4-di-tert-butylphenyl) phosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, and bis [2,4- Bis (1,1-dimethylethyl) -6-methylphenyl] ethyl ester phosphorous acid, tetrakis (2,4-di-tert-butylphenyl) [1,1-biphenyl] -4,4′-diylbisphos Phonite, bis (nonylphenyl) pentaerythritol diphosphite, bisstearyl pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, 2,2′- Methylenebis (4,6-di-tert-butyl-1-phenyloxy) (2-ethylhexene) Ruoxy) phosphorus, tetra (tridecyl) -4,4′-butylidene-bis (2-tert-butyl-5-methylphenyl) diphosphite, hexatridecyl-1,1,3-tris (3-tert-butyl-6) -Methyl-4-oxyphenyl) -3-methylpropane triphosphite, mono (dinonylphenyl) mono-p-nonylphenyl phosphite, tris (monononylphenyl) phosphite, diphenylisodecyl phosphite, trisdecyl phosphite And triphenyl phosphite. These compounds may be used alone or in combination.

  When the heat-radiating resin composition of the present invention contains a heat stabilizer, the content is preferably 0.1 to 0.1 when the total amount of the components [A] and [B] is 100 parts by mass. 5.0 parts by mass, more preferably 0.5 to 3.0 parts by mass, still more preferably 0.5 to 2.0 parts by mass. When the heat stabilizer is used in this range, it is possible to obtain a molded product that hardly undergoes discoloration, deterioration, etc. during processing and long-term use.

  Examples of the antioxidant include hindered amine compounds, hydroquinone compounds, hindered phenol compounds, phosphite compounds, and sulfur-containing compounds. These can be used alone or in combination of two or more.

  Examples of the ultraviolet absorber include benzophenone compounds, benzotriazole compounds, triazine compounds, salicylate compounds, cyanoacrylate compounds, benzoic acid compounds, oxalic acid anilide compounds, nickel metal complex salts, and the like. These can be used alone or in combination of two or more.

  Examples of benzophenone compounds include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxybenzophenone, 2 , 2'-dihydroxy-4,4'-dimethoxybenzophenone and other 4-substituted benzophenones, 2-hydroxy-4-methoxy-2'-carboxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone 3 Hydrates, 2-hydroxy-4-n-octoxybenzophenone, 2,2 ′, 4,4′-tetrahydroxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, bis (5-benzoyl-4-hydroxy-2) -Methoxyphenyl) methane, 2 Hydroxy-4-methoxybenzophenone-5-sulfonic acid and the like.

  Examples of the benzotriazole compounds include 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-tert-butylphenyl) benzotriazole, 2- (2′-hydroxy-3′-tert-butyl-5′-methylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-tert-butylphenyl) -5 Chlorobenzotriazole, 2- (2′-hydroxy-5′-tert-octylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-tert-amylphenyl) benzotriazole, 2- ( 2'-hydroxy-3 ', 5'-di-tert-butylphenyl) benzotriazole, 2- [2'-hydroxy-3' (3 ", 4", 5 ", 6" -tetrahydrophthalimidomethyl) -5'-methylphenyl] benzotriazole, 2,2'-methylenebis [4- (1,1,3,3-tetramethylbutyl)- 6- (2H-benzotriazol-2-yl) phenol], benzotriazole derivatives and the like.

Examples of triazine compounds include 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[(hexyl) oxy] -phenol, 2- [4-[(2-hydroxy- 3-dodecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine, 2- [4-[(2-hydroxy-3- Tridecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4dimethylphenyl) -1,3,5-triazine, 2,4-bis (2,4-dimethylphenyl) -6 -(2-hydroxy-4-isooctyloxyphenyl) -1,3,5-triazine, 2- [4-[(2-hydroxy-3- (2'-ethyl) hexyl) oxy] -2-hydroxyphenyl ]- 4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine, 2,4-bis (2-hydroxy-4-butoxyphenyl) -6- (2,4-bisbutoxyphenyl)- 1,3,5-triazine, 2- [2-hydroxy-4- (1-octyloxycarbonylethoxy) phenyl] -4,6-bis (4-phenylphenyl) -1,3,5-triazine, these Examples include modified products, polymers, derivatives and the like using one or more of them.
Examples of the modified product include 2- (4,6-bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl) -5-hydroxyphenyl and oxirane (for example, having 10 to 16 carbon atoms). Product of 2- (2,4-dihydroxyphenyl) -4,6-bis- (2,4-dimethylphenyl) -1,3,5-triazine and (2- And a reaction product with ethylhexyl) glycidic acid ester.

Examples of salicylate compounds include phenyl salicylate, p-tert-butylphenyl salicylate, and p-octylphenyl salicylate.
Examples of cyanoacrylate compounds include 2-ethylhexyl-2-cyano-3,3-diphenyl acrylate, ethyl-2-cyano-3,3-diphenyl acrylate, ethyl α-cyano-β, β-diphenylacrylate, α- Examples include cyano-β, β-diphenyl acrylate isooctyl.
Examples of benzoic acid compounds include methyl o-benzoylbenzoate, resorcinol-monobenzoate, 2,4-di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate, paraaminobenzoic acid, paraamino Benzoic acid monoglycerol ester, ethyl N, N-dipropoxyparaaminobenzoate, ethyl N, N-diethoxyparaaminobenzoate, methyl N, N-dimethylparaaminobenzoate, ethyl N, N-dimethylparaaminobenzoate, N, N-dimethyl paraamino butyl benzoate etc. are mentioned.
Examples of the oxalic acid anilide compound include 2-ethoxy-5-tert-butyl-2′-ethyl bisanilide, 2-ethoxy-2-ethyl oxalic acid bisanilide, and the like.

  Examples of the metal complex salts include nickel bis-octylphenylsulfamide, [2,2′-thiobis (4-tert-octylphenolate)]-n-butylamine nickel, [2,2′-thiobis (4-tert-octylpheno). Rate)]-2-ethylhexylamine nickel, nickel dibutyldithiocarbamate, nickel salt of ethyl-3,5-di-tert-butyl-4-hydroxybenzyl phosphate, nickel compounds such as nickel thiobisphenol complex, etc. It is done.

  When the heat-radiating resin composition of the present invention contains an ultraviolet absorber, the content is preferably 0.5 to when the total amount of the components [A] and [B] is 100 parts by mass. 3.0 mass parts, More preferably, it is 0.5-2.5 mass parts, More preferably, it is 1.0-2.0 mass parts. When the ultraviolet absorber is used in this range, a molded product having excellent light reflection characteristics can be obtained.

Examples of the anti-aging agent include naphthylamine compounds, diphenylamine compounds, p-phenylenediamine compounds, quinoline compounds, hydroquinone derivative compounds, monophenol compounds, bisphenol compounds, trisphenol compounds, polyphenol compounds. Thiobisphenol compound, hindered phenol compound, phosphite compound, imidazole compound, nickel dithiocarbamate salt compound, phosphate compound and the like. These can be used alone or in combination of two or more.
When the heat-radiating resin composition of the present invention contains an anti-aging agent, the content thereof is preferably 0.5 to when the total amount of the components [A] and [B] is 100 parts by mass. 3.0 mass parts, More preferably, it is 0.5-2.5 mass parts, More preferably, it is 1.0-2.0 mass parts.

Examples of the plasticizer include phthalates such as dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diisobutyl phthalate, dioctyl phthalate, butyl octyl phthalate, di- (2-ethylhexyl) phthalate, diisooctyl phthalate, and diisodecyl phthalate; dimethyl adipate , Diisobutyl adipate, di- (2-ethylhexyl) adipate, diisooctyl adipate, diisodecyl adipate, octyl decyl adipate, di- (2-ethylhexyl) azelate, diisooctyl azelate, diisobutyl azelate, dibutyl sebacate, di- Fatty acid esters such as (2-ethylhexyl) sebacate, diisooctyl sebacate; trimellitic acid isodecyl ester, trimellitic acid octy Esters, trimellitic acid esters such as trimellitic acid n-octyl ester, trimellitic acid isononyl ester; di- (2-ethylhexyl) fumarate, diethylene glycol monooleate, glyceryl monoricinolate, trilauryl phosphate, tristearyl phosphate , Tri- (2-ethylhexyl) phosphate, epoxidized soybean oil, polyether ester and the like. These can be used alone or in combination of two or more.
When the heat-radiating resin composition of the present invention contains a plasticizer, the content is preferably 0.5 to 3 when the total amount of the components [A] and [B] is 100 parts by mass. 0.0 part by mass, more preferably 0.5 to 2.5 parts by mass, and still more preferably 1.0 to 2.0 parts by mass.

Examples of the lubricant include fatty acid ester, hydrocarbon resin, paraffin, higher fatty acid, oxy fatty acid, fatty acid amide, alkylene bis fatty acid amide, aliphatic ketone, fatty acid lower alcohol ester, fatty acid polyhydric alcohol ester, fatty acid polyglycol ester, aliphatic Examples include alcohol, polyhydric alcohol, polyglycol, polyglycerol, metal soap, silicone, and modified silicone. These can be used alone or in combination of two or more.
When the heat-radiating resin composition of the present invention contains a lubricant, the content thereof is preferably 0.1 to 3 when the total amount of the components [A] and [B] is 100 parts by mass. 5 mass parts, More preferably, it is 0.1-2.0 mass parts, More preferably, it is 0.3-1.0 mass part.

Examples of the flame retardant include organic flame retardants, inorganic flame retardants, and reactive flame retardants. These can be used alone or in combination of two or more.
Organic flame retardants include brominated epoxy compounds, brominated alkyltriazine compounds, brominated bisphenol epoxy resins, brominated bisphenol phenoxy resins, brominated bisphenol polycarbonate resins, brominated polystyrene resins, brominated crosslinked polystyrene resins Halogenated flame retardants such as brominated bisphenol cyanurate resin, brominated polyphenylene ether, decabromodiphenyl oxide, tetrabromobisphenol A and oligomers thereof; trimethyl phosphate, triethyl phosphate, tripropyl phosphate, tributyl phosphate, tripentyl phosphate, toki Hexyl phosphate, tricyclohexyl phosphate, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate Phosphate esters such as phosphate, cresyl diphenyl phosphate, dicresyl phenyl phosphate, dimethyl ethyl phosphate, methyl dibutyl phosphate, ethyl dipropyl phosphate, hydroxyphenyl diphenyl phosphate, compounds modified with these substituents, various condensed types Phosphorus ester compounds, phosphorus flame retardants such as phosphazene derivatives containing phosphorus element and nitrogen element; polytetrafluoroethylene, guanidine salts, silicone compounds, phosphazene compounds, and the like. These can be used alone or in combination of two or more.

Examples of the inorganic flame retardant include aluminum hydroxide, antimony oxide, magnesium hydroxide, zinc borate, zirconium compound, molybdenum compound, and zinc stannate. These can be used alone or in combination of two or more.
Reactive flame retardants include tetrabromobisphenol A, dibromophenol glycidyl ether, brominated aromatic triazine, tribromophenol, tetrabromophthalate, tetrachlorophthalic anhydride, dibromoneopentyl glycol, poly (pentabromobenzyl polyacrylate) , Chlorendic acid (hett acid), chlorendic anhydride (hett acid anhydride), brominated phenol glycidyl ether, dibromocresyl glycidyl ether and the like. These can be used alone or in combination of two or more.

When the heat-radiating resin composition of the present invention contains a flame retardant, the content is preferably 5 to 15 parts by mass when the total amount of the components [A] and [B] is 100 parts by mass. More preferably, it is 10-15 mass parts.
In addition, when making a heat dissipation resin composition of this invention contain a flame retardant, it is preferable to use a flame retardant adjuvant. As this flame retardant aid, antimony trioxide, antimony tetroxide, antimony pentoxide, sodium antimonate, antimony tartrate and other antimony compounds, zinc borate, barium metaborate, hydrated alumina, zirconium oxide, Examples include ammonium polyphosphate and tin oxide. These can be used alone or in combination of two or more.

1-7. Production method of composition The heat-dissipating resin composition of the present invention comprises the above-mentioned components [A], [B], [C], [D], [E], and additives used as necessary. It can be manufactured by weighing it so as to have the predetermined content, supplying it to an extruder, a Banbury mixer, a kneader, a roll, a feeder ruder, and kneading. The method for supplying the raw material components is not particularly limited, and the respective components may be mixed and kneaded in a lump, or may be kneaded in multiple stages and divided.
In addition, although kneading | mixing temperature is selected by the kind of the said thermoplastic resin, and content of the said heat conductive filler, it is 290 degreeC-330 degreeC normally.

1-8. Properties of the composition The heat-dissipating resin composition of the present invention comprises the component [A] as a matrix, the components [B], [C], [D] and additives are uniformly dispersed. Regardless of the content ratio, it is possible to obtain a molded article excellent in molding processability and excellent in balance among heat dissipation, heat resistance, impact resistance, insulation, water resistance and light reflection characteristics. That is, the thermal emissivity measured under the conditions described later is 0.7 or more, the thermal conductivity at 25 ° C. is 3.5 W / (m · K) or more, and the thermal deformation temperature according to ISO 75 is 270. ° C or higher, Charpy impact strength according to ISO 179 is 1.0 kJ / m ² or higher, surface resistivity measured by the conditions described later is 1 × 10 ¹³ Ω or higher, and water absorption is 0.15 % And the light reflectivity after the light resistance test can be 80% or more.
Since the heat-dissipating resin composition of the present invention has excellent properties as described above, it is suitable for forming an LED mounting substrate, a reflector disposed on the LED mounting substrate, and the like.

2. Molded Article The LED mounting substrate of the present invention includes the heat-dissipating resin composition of the present invention. Moreover, the reflector of this invention is characterized by including the heat-radiating resin composition of the said invention.
The board | substrate for LED mounting and reflector of this invention are the components of a surface mount type LED package, and can be demonstrated using the schematic sectional drawing (FIGS. 1-3) in the case of the form of wire bonding mounting.
1 and 2 includes an LED mounting substrate 11a, a reflector 12, an LED element 13, an electrode 14, a lead wire 15 connecting the LED element 13 and the electrode 14, and a transparent seal. A stop (or gap) 16 and a lens 17 are provided.

2-1. LED Mounting Substrate The shape of the LED mounting substrate of the present invention is usually a flat plate shape such as a square or a circle. The cross-sectional shape may be uniformly flat, and the surface on which the LED element is disposed may be provided with a concave portion, a convex portion, a through hole, or the like according to the purpose, application, or the like. For example, according to FIG. 1, a concave portion is provided on one surface (upper side of the drawing) of the substrate 11a, and the LED element 13 is disposed on the bottom surface of the concave portion.
Further, a groove or the like may be provided on the surface of the substrate 11a where the LED element 13 is not provided in order to improve heat dissipation by increasing the surface area.

The LED mounting substrate of the present invention may be a large substrate that can include a plurality of LED elements, but may be a small substrate that can include one LED element. Therefore, the size of the LED mounting substrate of the present invention is selected according to the purpose, application, and the like.
The thickness of the LED mounting substrate of the present invention (thickness of a portion not provided with a concave portion, a convex portion, etc.) is selected according to the purpose, application, and the like.

The surface-mounted LED package 1 of FIGS. 1 and 2 is an embodiment in which an LED mounting substrate 11a and a reflector 12 that reflects light in a predetermined direction around a light emitting LED element 13 are separately prepared and assembled. . A surface-mount type LED package as shown in FIG. 3 may be used. That is, the surface-mounted LED package 1 of FIG. 3 includes an LED mounting substrate 11b having a reflector portion 12b, an LED element 13, an electrode 14, a lead wire 15 connecting the LED element 13 and the electrode 14, and a transparent seal. In this embodiment, a stop (or gap) 16 and a lens 17 are provided. In addition, about the shape of the reflector part 12b, it is the same as that of the reflector 12 in FIG.1 and FIG.2, and it demonstrates in the below-mentioned "2-2. Reflector."
As is apparent from FIG. 3, the LED mounting substrate of the present invention is an LED mounting substrate in which the LED mounting substrate 11a and the reflector 12 shown in FIG. 1 are in a continuous phase (an LED mounting substrate including a reflector portion 12b). ) 11b. If it is the board | substrate 11b for LED mounting provided with this reflector part, compared with the conventional manufacturing method, a surface mount type LED package can be obtained with a small number of parts and a small manufacturing process, and it is excellent in a performance surface and a cost surface.

2-2. Reflector (reflector part)
The reflector 12 of the present invention may be used in combination with the LED mounting substrate 11a of the present invention, or may be used in combination with an LED mounting substrate made of other materials.
The reflector 12 of the present invention and the reflector portion 12b in the LED mounting substrate 11b mainly have an action of reflecting light from the LED element 13 toward the lens 17 on the inner surface thereof.
These shapes generally conform to the shape of the end portion (joint portion) of the lens 17 and are usually cylindrical or circular such as a square, a circle, or an ellipse. 1 and 2, the reflector 12 is a cylindrical body (annular body). In FIG. 1, all end faces of the reflector 12 are in contact with the surface of the LED mounting substrate 11a. It has been fixed. On the other hand, in FIG. 2, the end portion 122 (right side of the drawing) of the reflector 12 is in contact with and fixed to the LED mounting substrate 11a, and the end portion 121 (left side of the drawing) of the reflector 12 is fixed to the LED mounting substrate 11a. It is in contact with and fixed to the side. In addition, in order to improve the directivity of the light from the LED element 13, the inner surface of the reflector 12 of this invention and the reflector part 12b in the said board | substrate 11b for LED mounting may be expanded upward in the taper shape ( (See FIG. 1).
Further, the reflector 12 of the present invention and the reflector portion 12b in the LED mounting substrate 11b can be used as a lens holder when the end portion on the lens 17 side is processed into a shape corresponding to the shape of the lens 17. Can function.

The reflector 12 of the present invention and the reflector portion 12b in the LED mounting substrate 11b may include a concave portion, a convex portion, a through-hole, and the like depending on the purpose and application. For example, according to FIG. 2, the reflector 121 includes a through hole, and the electrode 14 is disposed through the through hole.
Moreover, when the reflector 12 of the present invention and the reflector portion 12b of the LED mounting substrate 11b have a high degree of whiteness, the LED element substrate 11b has a high reflectance with respect to the light emitted from the LED element. Although a characteristic can be obtained, in order to obtain a higher reflection characteristic, a light reflection layer may be formed on the inner wall surface. The thickness of the light reflecting layer is preferably 25 μm or less, more preferably 20 μm or less, and still more preferably 15 μm or less, from the viewpoint of reducing thermal resistance.

2-3. Surface Mount Type LED Package Using the LED mounting substrate and reflector of the present invention, a surface mount type LED package in a wire bonding mounting form as shown in FIGS. 1 to 3 can be easily obtained.
The LED element 13 emits radiant light (generally UV or blue light in a white light LED), for example, an active layer made of AlGaAs, AlGaInP, GaP or GaN sandwiched between n-type and p-type cladding layers. A semiconductor chip (light emitter) having a double heterostructure, for example, has a hexahedral shape with a side length of about 0.5 mm. As described above, when not in the form of wire bonding mounting, the lead wire 15 is not used and the chip is flip-chip mounted on the wiring pattern disposed near the LED element 13 via the bump. be able to.
The electrode 14 is a connection terminal for supplying a drive voltage, and is disposed through the reflector 12 of the present invention or a through hole provided in the reflector portion 12b of the LED mounting substrate 11b.
The lead wire 15 electrically connects the LED element 13 and the electrode 14. When the lead wire 15 has the transparent sealing portion 16, the lead wire 15 is embedded in the transparent sealing portion 16.
The lens 17 is usually made of resin, can have various structures depending on the purpose, application, etc., and may be colored.

Moreover, the part represented with the code | symbol 16 in FIGS. 1-3 may be a transparent sealing part, and may be a space | gap part as needed. This portion is usually a transparent sealing portion filled with a material that provides translucency and insulation, and is applied by a direct contact with the lead wire 15 and indirectly applied in wire bonding mounting. Prevents electrical problems caused by the lead wire 15 being disconnected, disconnected, or short-circuited from the connection portion with the LED element 13 and / or the connection portion with the electrode 14 due to vibration, impact, or the like. be able to. At the same time, the LED element 13 can be protected from moisture, dust, etc., and the reliability can be maintained over a long period of time.
In addition, the said transparent sealing part may also contain the inorganic type and / or organic type fluorescent substance which converts the wavelength of the light emitted from the LED element into a predetermined wavelength as needed.

The material (transparent encapsulant composition) that imparts light-transmitting properties and insulating properties usually includes silicone, epoxy silicone, epoxy resin, acrylic resin, polyimide resin, polycarbonate resin, and the like. Among these, silicone is particularly preferable from the viewpoints of heat resistance, weather resistance, low shrinkage, and discoloration resistance. Moreover, these components can be used individually by 1 type or in combination of 2 or more types. The transparent sealant composition is preferably a composition in which a curable component among the above components, a curing agent that cures the component, and a curing catalyst, if necessary, are blended.
The transparent sealant composition may contain a fluorescent substance, a reaction inhibitor, an antioxidant, a light stabilizer, a discoloration inhibitor, and the like.

The transparent sealant composition containing silicone will be described. Silicone may be either rubber or resin. The composition may be any of an addition reaction curable type, a condensation reaction curable type, a UV curable type, and the like, but an addition reaction curable composition is preferable in that it can be quickly cured. Of these, room temperature curable or heat curable compositions are preferred.
The addition reaction curable composition is preferably a composition in which silicone, a curing agent that cures the silicone, and a curing catalyst, if necessary, are blended. This composition is usually a composition comprising a silicone having a functional group such as a vinyl group, a polymer having a Si-H bond in the molecule, and a curing catalyst (platinum catalyst, palladium catalyst, etc.). . For example, products such as Toray Dow Corning can be used.

〔式中、Ｒ^１、Ｒ^２、Ｒ^４及びＲ^５は、互いに、同一又は異なって、炭素数１〜１０のアルキル基、炭素数６〜２０のアリール基、又は、炭素数７〜２０のアラルキル基である。〕
従って、放熱性樹脂組成物に、添加剤を配合する場合には、硬化阻害物質ではない添加剤が選択される。尚、硬化阻害物質は、通常、硬化触媒の種類に依存するものであり、例えば、アミン化合物、アミド化合物、ニトリル化合物、シアナート化合物、オキシモ化合物、ニトロソ化合物、ヒドラゾ化合物、アゾ化合物、キレート化合物等の窒素元素を含む有機化合物；ホスフィン化合物、亜リン酸エステル等のリン元素を含む有機化合物；硫化物、チオ化合物等の硫黄元素を含む有機化合物；錫元素、ヒ素元素、アンチモン元素、セレン元素、テルル元素、鉛元素等を含むイオン性化合物；アセチレン等の多重結合を有する有機化合物等が知られている。 In the transparent sealant composition containing the above-mentioned silicone, other components added as necessary are as described above, but the composition is prepared so as not to contain a curing inhibitor. In addition, when a curing inhibitor is contained in the molded product composed of the heat-dissipating resin composition of the present invention, when the transparent sealant composition is used, the addition reaction does not proceed or is difficult to proceed. There is. As a result, the adhesiveness with the molded product is lowered. For example, when the heat-dissipating resin composition of the present invention contains a phosphorus flame retardant, or when the composition contains a hindered amine light stabilizer having the following structure, the transparent encapsulant composition: Curing may not be sufficient.

[In formula, R < ¹ >, R < ² >, R < ⁴ > and R < ⁵ > are mutually the same or different, and a C1-C10 alkyl group, a C6-C20 aryl group, or C7-C20. Aralkyl group. ]
Therefore, when an additive is added to the heat-dissipating resin composition, an additive that is not a curing inhibitor is selected. The curing inhibitor usually depends on the type of curing catalyst. For example, amine compounds, amide compounds, nitrile compounds, cyanate compounds, oximo compounds, nitroso compounds, hydrazo compounds, azo compounds, chelate compounds, etc. Organic compounds containing nitrogen elements; Organic compounds containing phosphorus elements such as phosphine compounds and phosphites; Organic compounds containing sulfur elements such as sulfides and thio compounds; Tin elements, arsenic elements, antimony elements, selenium elements, tellurium Ionic compounds containing elements, lead elements, etc .; organic compounds having multiple bonds such as acetylene are known.

Below, an example of the manufacturing method of the surface mounting type LED package (FIG. 1) of a wire bonding mounting form is demonstrated.
First, the heat-dissipating resin composition of the present invention is formed into a flat plate-shaped LED mounting substrate 11a having a recess and a cylindrical shape (annular shape) by injection molding using a mold having a cavity space with a predetermined shape. A reflector 12 having a through hole in which the electrode 14 can be inserted from the inner surface to the outer surface is formed. Thereafter, separately prepared LED elements 13, electrodes 14 and lead wires are fixed to the LED mounting substrate 11a and the reflector 12 with an adhesive or a bonding member. Next, a transparent sealing agent composition containing silicone or the like is injected into the recess formed by the LED mounting substrate 11 a and the reflector 12, and is cured by heating, drying, or the like to form the transparent sealing portion 16. Then, the lens 17 is arrange | positioned on the transparent sealing part 16, and the surface mount type LED package shown in FIG. 1 is obtained. Alternatively, the composition may be cured after the lens 17 is placed in an uncured state of the transparent sealant composition.

2-4. LED Lighting Device Surface-Mounted LED Package Having LED Mounting Substrate of the Present Invention, Surface-Mounted LED Package Having Reflector of the Present Invention, or Surface-Mounted LED Having LED Mounting Substrate with Reflector Section of the Present Invention An LED lighting device can be obtained using the package. FIG. 4 shows a schematic cross-sectional view of an LED lighting device using the surface-mount type LED package of FIG.
The LED lighting device 2 of FIG. 4 is an aspect including two surface-mount LED packages, the surface-mount LED package of FIG. 1, the electrodes 14 constituting the package, and a bias voltage for causing the LED elements to emit light. A wiring pattern 22 for connecting an application power source (not shown) and a lighting device substrate 21 including the wiring pattern 22 are provided. Furthermore, you may provide the housing for covering these surface mount type LED packages and the board | substrate 21 for illuminating devices.

  Although the structure of the board | substrate 21 for illuminating devices is not specifically limited, For example, as FIG. 4, it is set as the 2 layer type | mold of the board | substrate 211 (preferably resin-made heat sink) and the board | substrate 212 (preferably resin-made heat sink). The substrate 211 may include a wiring pattern. In FIG. 4, since the surface-mount LED package (of FIG. 1) includes the LED mounting substrate 11a having excellent heat dissipation and insulation, the LED mounting substrate 11a in the substrate 211 and the substrate 212 is provided. The part below is opened as a through hole.

  EXAMPLES The present invention will be described in more detail with reference to the following examples. However, the present invention is not limited to such examples as long as the gist of the present invention is not exceeded. In the examples, parts and% are based on mass unless otherwise specified.

1. Raw material components of heat-dissipating resin composition The raw material components used for the preparation of the composition are shown below.
1-1. Polyamide resin [A]
(1) A1
Modified polyamide 6, T “Aren AE4200” (trade name) manufactured by Mitsui Chemicals, Inc. was used. The melting point is 320 ° C.
(2) A2
Polyamide 4,6 “Stanyl TS300” (trade name) manufactured by DSM Japan Ltd. was used. The melting point is 295 ° C.

1-2. Boron nitride particles [B]
(1) B1
“Denkaboron nitride powder SGP” (trade name) manufactured by Denki Kagaku Kogyo Co., Ltd. was used. It has a hexagonal structure, a specific surface area of 2 m ² / g, a tap density of 0.8 g / cm ³ , and a volume average particle size by liquid phase precipitation method of 18.0 μm. The particle diameters D ₁₀ and D ₉₀ when the cumulative volume obtained by measuring the particle size distribution is 10% and 90% are 5.4 μm and 41.6 μm, respectively (D ₉₀ / D ₁₀ = 7 7).
(2) B2
“Denkaboron nitride powder HGP” (trade name) manufactured by Denki Kagaku Kogyo Co., Ltd. was used. It has a hexagonal structure, a specific surface area of 11 m ² / g, a tap density of 0.4 g / cm ³ , and a volume average particle size by liquid phase precipitation method of 5.0 μm. The particle diameters D ₁₀ and D ₉₀ are 1.9 μm and 10.6 μm, respectively (D ₉₀ / D ₁₀ = 5.6).
(3) B3
“Denkaboron nitride powder SGPS” (trade name) manufactured by Denki Kagaku Kogyo Co., Ltd. was used. It has a hexagonal structure, a specific surface area of 2 m ² / g, a tap density of 0.5 g / cm ³ , and a volume average particle size by liquid phase precipitation method of 12.0 μm. The particle diameters D ₁₀ and D ₉₀ are 4.3 μm and 27.0 μm, respectively (D ₉₀ / D ₁₀ = 6.3).

1-3. Glass fiber [C]
A chopped strand glass fiber “Microglass RES03-TP89Z” (trade name) manufactured by NSV Vetrotex was used. The glass fiber diameter is 13 μm, a silane coupling agent is used for the surface treatment, and an acrylic polymer is used as the sizing agent.
1-4. Titanium oxide particles [D]
(1) D1
A siloxane-treated titanium oxide “Taipaque PF691” (trade name) manufactured by Ishihara Sangyo Co., Ltd. was used. The rutile structure has an average particle diameter of 0.21 μm.
(2) D2
Titanium oxide “Taipaque CR-60-2” (trade name) not treated with siloxane by Ishihara Sangyo Co., Ltd. was used. The rutile structure has an average particle diameter of 0.21 μm.

1-5. Light stabilizer [E]
(1) E1
1,2,3,4-butanetetracarboxylic acid, 2,2,6,6-tetramethyl-4-piperidinol, β, β, β ′, β′-tetramethyl-3,9- (2, 4,8,10-tetraoxaspiro [5.5] undecane) condensate with diethanol (trade name “Adekastab LA-63P”, manufactured by ADEKA) was used.
(2) E2
Bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate (trade name “ADK STAB LA-77”, manufactured by ADEKA) was used.

1-6. Other components (1) Thermally conductive filler Alumina “AC9500” (trade name) manufactured by Admatechs Corporation was used. The average particle size is 7.4 μm.
(2) Thermal stabilizer 3,9-bis {2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethylethyl} -2,4,8 , 10-tetraoxaspiro [5,5] undecane (trade name “ADK STAB AO-80”, manufactured by ADEKA) was used.

2. Production and Evaluation of Heat Dissipating Resin Composition Examples 1-1 to 1-6 and Comparative Examples 1-1 to 1-9
The heat-dissipating resin composition used for manufacturing the composite is a plastic optical research equipped with the above-mentioned raw material components by a Henschel mixer based on the blending ratios shown in Tables 1 to 3, and then equipped with a weakly kneaded screw. Using a twin screw extruder “BT-40-S2-30-L” (model name), melt screw kneading was performed at a temperature of 310 ° C. with a screw rotation speed of 100 rpm to obtain pellets (heat dissipating resin composition).

Each composition was evaluated as follows. The results are shown in Tables 1 to 3.
2-1. Thermal Emissivity The pellet was subjected to injection molding using a mold to prepare a test piece having a size of 150 × 150 × 3 mm. Thereafter, the thermal emissivity of the test piece was measured at an ambient temperature of 25 ° C. by a reflection energy measurement method by infrared detection using a thermo spot sensor “TSS-5X” (model name) manufactured by Japan Sensor. In addition, the melting temperature of the pellet at the time of injection molding is 310 ° C., and the temperature of the mold is 150 ° C.
2-2. Thermal conductivity A melt obtained by melting the above pellets at 310 ° C. was injected from below a mold having a cavity space having a diameter of 10 mm and a length of 50 mm to produce a cylindrical body having a diameter of 10 mm and a length of 50 mm. The temperature of the mold is 150 ° C.
Then, it cut out so that it might become a disk with a thickness of 1.5 mm in the substantially center part of the cylindrical body, and this was made into the test piece (diameter 10mm and thickness 1.5mm). In order to measure the thermal conductivity with respect to the flow direction of the heat-dissipating resin composition, a probe was applied to each of the upper and lower surfaces of the test piece, and a laser flash method thermal constant measuring device “TR- 7000R "(model name) and measured at 25 ° C.
2-3. Thermal deformation temperature Measured under conditions of a load of 1.80 MPa according to ISO75.
2-4. Charpy impact strength Charpy impact strength (Edgewise Impact, with notch) at room temperature was measured according to ISO179. The measurement conditions are as follows.
Specimen type: Type 1
Notch type: Type A
Load: 2J
2-5. Linear expansion coefficient Charpy impact strength measurement test piece (size 80 × 10 × 4 mm) was cut into a size of 40 × 10 × 4 mm from the center, and this was used as a linear expansion coefficient measurement test piece. . The test piece was subjected to a linear expansion coefficient measuring device manufactured by Sanmec Co., and the linear expansion at a temperature of 20 ° C. to 70 ° C. was measured.
2-6. Surface Specific Resistance The pellet was subjected to injection molding using a mold to produce a circular test piece having a diameter of 200 mm and a thickness of 2 mm. Subsequently, the surface specific resistance of this test piece was measured using a high resistance meter “4339B” (model name) manufactured by Agilent Technologies. In addition, the melting temperature of the pellet at the time of injection molding is 310 ° C., and the temperature of the mold is 150 ° C.
2-7. Light reflectance With respect to the test piece used for the measurement of the thermal conductivity, the reflectance with respect to ultraviolet rays (wavelength 460 nm) was incident on an ultraviolet-visible near-infrared spectrophotometer “V-670” (model name) manufactured by JASCO Corporation. Measurements were made at an angle of 60 degrees.
In addition, using the UV long life fade meter “FAL-5H • B” (model name) manufactured by Suga Test Instruments Co., Ltd., the same test piece used for the measurement of the thermal conductivity was 135 V, 16 A, temperature 83 ° C., Exposure (light irradiation) was performed for 400 hours under conditions without rain. The light reflectance of this exposed test piece was also measured in the same manner as described above.
2-8. Dielectric Breakdown Characteristics The pellets were subjected to injection molding using a mold to produce test pieces having a size of 100 × 100 × 1 mm. Next, this test piece was left for 48 hours in a constant temperature and humidity chamber adjusted to a temperature of 23 ° C. and a relative humidity of 62%, and then dielectric breakdown characteristics were measured according to ASTM D149. In addition, the melting temperature of the pellet at the time of injection molding is 310 ° C., and the temperature of the mold is 150 ° C.
2-9. Blister resistance The pellets were subjected to injection molding using a mold to prepare test pieces having a size of 127 × 12.7 × 0.8 mm. Next, this test piece was immersed in water at a temperature of 23 ° C. for 24 hours, and after the immersion, it was fixed to a glass epoxy substrate having a thickness of 1.6 mm. In addition, the melting temperature of the pellet at the time of injection molding is 310 ° C., and the temperature of the mold is 150 ° C.
Thereafter, the integrated product was passed through a desktop far-infrared reflow furnace in which the temperature of the preheating part was 150 ° C. ± 3 ° C. and the maximum temperature of the reflowing part was arbitrarily adjusted (passing time in the preheating part: 120 Second, passage time of reflow part: 60 seconds). And the surface of the test piece after passing through the reflow part was visually observed, and the temperature of the reflow part when the blister was generated was measured.
2-10. Water resistance The pellets were subjected to injection molding using a mold, and circular test pieces having a diameter of 50 mm and a thickness of 3.2 mm were produced by injection molding. Next, the test piece was completely dried, immersed in water at a temperature of 23 ° C. for 24 hours, the amount of change in weight before and after immersion was calculated, the increased amount was taken as the water absorption rate, and the water resistance was evaluated. In addition, the melting temperature of the pellets at the time of injection molding is 310 ° C., and the temperature of the mold is 150 ° C.

From Tables 1 to 3, the following can be understood.
Comparative Example 1-1 is an example using a composition containing boron nitride particles (B2) outside the scope of the present invention, and the heat conductivity was low, the heat dissipation property was not sufficient, and the heat resistance was also inferior. Comparative Example 1-2 is an example using a composition containing boron nitride particles (B3) outside the scope of the present invention, and the heat conductivity was low, the heat dissipation property was not sufficient, and the heat resistance was also inferior. Comparative Example 1-3 is an example using a composition containing no boron nitride particles, and was inferior in thermal emissivity, thermal conductivity, heat resistance, light reflectance after light resistance test, and dielectric breakdown characteristics. Comparative example 1-4 is an example using the composition which does not contain glass fiber, and heat resistance was inferior. Comparative Example 1-5 is an example in which a composition containing no light stabilizer was used, and the light reflectance after the light resistance test was inferior. Comparative Example 1-6 was an example in which the content of boron nitride particles (B1) was large outside the scope of the present invention, and the impact resistance was poor. Comparative Example 1-7 was an example using polyamide 4 and 6 without including polyamide 6 and T, and the light reflectance after the water resistance and light resistance test was inferior. Comparative Example 1-8 is an example using a composition containing a light stabilizer (E2) outside the scope of the present invention, and the light reflectance after the light resistance test was inferior. Comparative Example 1-9 is an example using a composition containing a thermally conductive filler instead of the boron nitride particles according to the present invention, the thermal conductivity is low and the heat dissipation is not sufficient, and the impact resistance and light resistance test Later light reflectance was also poor.
On the other hand, Examples 1-1 to 1-6 are examples using the heat-dissipating resin composition of the present invention, the thermal conductivity is 3.5 W / (m · K) or more, and the thermal deformation temperature is 270. ° C or higher, Charpy impact strength of 1.0 kJ / m ² or higher, surface specific resistance of 1 × 10 ¹³ Ω or higher, water absorption of 0.15% or lower, light reflectance after light resistance test Was 80% or more, indicating excellent performance. In particular, Examples 1-1 to 1-4 were excellent in balance among heat dissipation, heat resistance, impact resistance, insulation, water resistance, and light reflection characteristics.

3. Production of LED mounting substrate Example 2-1
The pellet made of the heat-dissipating resin composition of Example 1-1 was melted at 310 ° C., and this melt was injected into a mold having a cavity space that was rectangular and formed a circular recess at the center. (Mold temperature: 150 ° C.) to obtain an LED mounting substrate 11a (about 7 mm long, about 4 mm wide, about 1 mm thick) as shown in FIG.

Examples 2-2 to 2-6
Except having used each pellet which consists of a heat-radiating resin composition of Examples 1-2 to 1-6, it carried out similarly to Example 2-1, and obtained the board | substrate 11a for LED mounting as shown in FIG.

Example 2-7
A pellet made of the heat-dissipating resin composition of Example 1-1 was melted at 310 ° C., and this melt was extended into a cylindrical shape, and a penetration for inserting an electrode connected to the LED element into the extended inner wall A hole is formed, and is injected into a mold having a rectangular shape and a cavity space that forms a circular recess on the end side from the center (mold temperature: 150 ° C.), as shown in FIG. In addition, an LED mounting substrate 11b (about 10 mm in length, about 4 mm in width, and about 2 mm in maximum height in the reflector portion) having a reflector portion was obtained.

Examples 2-8 to 2-12
Except that each pellet made of the heat-dissipating resin composition of Examples 1-2 to 1-6 was used, in the same manner as Example 2-7, LED mounting substrate 11b having a reflector portion as shown in FIG. Got.

4). Production of reflector Example 3-1
The pellet made of the heat-dissipating resin composition of Example 1-1 was melted at 310 ° C., and the melt was cylindrical and the inner surface was tapered toward one opening, and connected to the LED element. A substantially cylindrical reflector 12 (diameter: about 3 mm, wall thickness) as shown in FIG. 1 is injected into a mold having a cavity space for forming a through hole for inserting an electrode (mold temperature: 150 ° C.). About 0.5 mm).

Examples 3-2 to 3-6
A substantially cylindrical reflector 12 as shown in FIG. 1 was obtained in the same manner as in Example 2-7, except that each pellet made of the heat-dissipating resin composition of Examples 1-2 to 1-6 was used.

The heat-dissipating resin composition of the present invention is a constituent member of an LED lighting device and is suitable for forming a member that requires heat dissipation, heat resistance, impact resistance, insulation, water resistance, and light reflection characteristics. is there.
And the board | substrate for LED mounting and reflector of this invention are suitable for formation of a light-emitting device, an illuminating device, etc. provided with an LED element.

It is the schematic which shows an example of the cross-sectional structure of a surface mount type LED package provided with the board | substrate for LED mounting of this invention, and a reflector. It is the schematic which shows the other example of the cross-section of a surface mount type LED package provided with the board | substrate for LED mounting of this invention, and a reflector. It is the schematic which shows the other example of the cross-section of a surface mount type LED package provided with the board | substrate for LED mounting (LED mounting board provided with a reflector part) of this invention. It is the schematic which shows an example of the cross-section of an LED illuminating device provided with a surface mount type LED package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Surface mount type LED package 11a; LED mounting board | substrate 11b; LED mounting board | substrate 11c provided with a reflector part; Metal LED mounting board | substrate 12; Reflector 12b; Reflector part 13; LED element 14; Electrode 15; ; Transparent sealing part (or void part)
17; Lens 18; Insulating base 2; LED illumination device 21; Illumination device substrate 22;

Claims (5)

[A] polyamide resin, [B] boron nitride particles, [C] glass fibers, [D] titanium oxide particles and [E] a heat-dissipating resin composition comprising a light stabilizer,
The polyamide resin [A] includes a polyamide having a repeating unit derived from hexamethylene terephthalamide, in an amount of 30% by mass or more based on the whole polyamide resin [A],
The boron nitride particles [B] have a particle diameter D ₁₀ and D ₉₀ of 4 to 6 μm and 35 to 50 μm, respectively, when the cumulative volume obtained by measuring the particle size distribution is 10% and 90%, and _the ratio _D 90 _{/ D 10} of _{D 10} and _{D 90} of a 7 to 11,
The light stabilizer [E] is a hindered amine compound containing the following structure:

[In formula, R < ¹ >, R < ² >, R < ³ >, R < ⁴ > and R < ⁵ > are mutually the same or different, and a C1-C10 alkyl group, a C6-C20 aryl group, or C7. -20 aralkyl groups. ]
When the total amount of the polyamide resin [A] and the boron nitride particles [B] is 100% by mass, the ratio of the polyamide resin [A] is 15 to 95% by mass, and the ratio of the boron nitride particles [B] is 5 to 85% by mass,
When the total amount of the polyamide resin [A] and the boron nitride particles [B] is 100 parts by mass, the content of the glass fiber [C] is 1 to 50 parts by mass, and the titanium oxide particles [D] The heat-radiating resin composition is characterized in that the content of the light stabilizer [E] is 0.01 to 10 parts by mass.   The heat-dissipating resin composition according to claim 1, wherein the titanium oxide particles [D] are siloxane-treated titanium oxide particles.   An LED mounting substrate comprising the heat-dissipating resin composition according to claim 1.   A reflector comprising the heat dissipating resin composition according to claim 1.   An LED mounting substrate comprising a reflector portion, comprising the heat-dissipating resin composition according to claim 1.

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