TWI561351B - - Google Patents

Info

Publication number
TWI561351B
TWI561351B TW103145329A TW103145329A TWI561351B TW I561351 B TWI561351 B TW I561351B TW 103145329 A TW103145329 A TW 103145329A TW 103145329 A TW103145329 A TW 103145329A TW I561351 B TWI561351 B TW I561351B
Authority
TW
Taiwan
Application number
TW103145329A
Other versions
TW201532763A (zh
Inventor
Takayuki Fukushima
Daiki Miyagawa
Original Assignee
Kawasaki Heavy Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Heavy Ind Ltd filed Critical Kawasaki Heavy Ind Ltd
Publication of TW201532763A publication Critical patent/TW201532763A/zh
Application granted granted Critical
Publication of TWI561351B publication Critical patent/TWI561351B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW103145329A 2013-12-26 2014-12-24 末端執行器及基板搬送機器人 TW201532763A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013270275A JP6313972B2 (ja) 2013-12-26 2013-12-26 エンドエフェクタおよび基板搬送ロボット

Publications (2)

Publication Number Publication Date
TW201532763A TW201532763A (zh) 2015-09-01
TWI561351B true TWI561351B (zh) 2016-12-11

Family

ID=53478609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103145329A TW201532763A (zh) 2013-12-26 2014-12-24 末端執行器及基板搬送機器人

Country Status (7)

Country Link
US (1) US10297482B2 (zh)
EP (1) EP3091565A4 (zh)
JP (1) JP6313972B2 (zh)
KR (1) KR101863474B1 (zh)
CN (1) CN106062943B (zh)
TW (1) TW201532763A (zh)
WO (1) WO2015098752A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381257B2 (en) * 2015-08-31 2019-08-13 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate processing system with pair of blade members arranged in position out of vertical direction
JP7409800B2 (ja) * 2019-08-09 2024-01-09 川崎重工業株式会社 ロボット制御装置、ロボット、及びロボット制御方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040179932A1 (en) * 2002-07-22 2004-09-16 Jaswant Sandhu Robotic hand with multi-wafer end effector
WO2010103876A1 (ja) * 2009-03-13 2010-09-16 川崎重工業株式会社 エンドエフェクタを備えたロボット及びその運転方法
JP2013062352A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
CN103223674A (zh) * 2012-01-26 2013-07-31 株式会社安川电机 搬运机器人

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235147A (ja) * 1992-02-24 1993-09-10 Dainippon Screen Mfg Co Ltd 基板移載装置
JPH08139152A (ja) * 1994-11-04 1996-05-31 Dainippon Screen Mfg Co Ltd 基板交換装置及び基板交換方法
JPH1111663A (ja) * 1997-06-27 1999-01-19 Tokyo Electron Ltd 基板搬送装置
US20050188923A1 (en) * 1997-08-11 2005-09-01 Cook Robert C. Substrate carrier for parallel wafer processing reactor
JP3033738B2 (ja) 1998-07-29 2000-04-17 株式会社カイジョー ウエハ搬送装置およびウエハ搬送方法
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
JP2006313865A (ja) 2005-05-09 2006-11-16 Tatsumo Kk 基板保持装置
US9437469B2 (en) * 2007-04-27 2016-09-06 Brooks Automation, Inc. Inertial wafer centering end effector and transport apparatus
JP2010258170A (ja) * 2009-04-23 2010-11-11 Tokyo Electron Ltd 基板保持部材、基板搬送アーム及び基板搬送装置
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
JP6049970B2 (ja) 2011-08-10 2016-12-21 川崎重工業株式会社 エンドエフェクタ装置及び該エンドエフェクタ装置を備える基板搬送用ロボット
JP5553065B2 (ja) * 2011-09-22 2014-07-16 株式会社安川電機 基板搬送用ハンドおよび基板搬送ロボット

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040179932A1 (en) * 2002-07-22 2004-09-16 Jaswant Sandhu Robotic hand with multi-wafer end effector
WO2010103876A1 (ja) * 2009-03-13 2010-09-16 川崎重工業株式会社 エンドエフェクタを備えたロボット及びその運転方法
JP2013062352A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
CN103223674A (zh) * 2012-01-26 2013-07-31 株式会社安川电机 搬运机器人

Also Published As

Publication number Publication date
EP3091565A4 (en) 2017-08-02
WO2015098752A1 (ja) 2015-07-02
JP6313972B2 (ja) 2018-04-18
KR20160118247A (ko) 2016-10-11
US10297482B2 (en) 2019-05-21
CN106062943B (zh) 2018-12-14
EP3091565A1 (en) 2016-11-09
CN106062943A (zh) 2016-10-26
JP2015126135A (ja) 2015-07-06
KR101863474B1 (ko) 2018-05-31
US20160322247A1 (en) 2016-11-03
TW201532763A (zh) 2015-09-01

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