TWI560161B - Apparatus for etching glass substrate and method of etching glass sustrate usnig the same - Google Patents

Apparatus for etching glass substrate and method of etching glass sustrate usnig the same

Info

Publication number
TWI560161B
TWI560161B TW103122213A TW103122213A TWI560161B TW I560161 B TWI560161 B TW I560161B TW 103122213 A TW103122213 A TW 103122213A TW 103122213 A TW103122213 A TW 103122213A TW I560161 B TWI560161 B TW I560161B
Authority
TW
Taiwan
Prior art keywords
etching glass
usnig
sustrate
same
glass substrate
Prior art date
Application number
TW103122213A
Other languages
English (en)
Chinese (zh)
Other versions
TW201524927A (zh
Inventor
Moon Hwan Kim
Original Assignee
Moon Hwan Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moon Hwan Kim filed Critical Moon Hwan Kim
Publication of TW201524927A publication Critical patent/TW201524927A/zh
Application granted granted Critical
Publication of TWI560161B publication Critical patent/TWI560161B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Surface Treatment Of Glass (AREA)
TW103122213A 2013-12-20 2014-06-27 Apparatus for etching glass substrate and method of etching glass sustrate usnig the same TWI560161B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130160110A KR101373306B1 (ko) 2013-12-20 2013-12-20 유리기판의 식각 장치 및 이를 이용하는 유리기판의 식각 방법

Publications (2)

Publication Number Publication Date
TW201524927A TW201524927A (zh) 2015-07-01
TWI560161B true TWI560161B (en) 2016-12-01

Family

ID=50648434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103122213A TWI560161B (en) 2013-12-20 2014-06-27 Apparatus for etching glass substrate and method of etching glass sustrate usnig the same

Country Status (2)

Country Link
KR (1) KR101373306B1 (ko)
TW (1) TWI560161B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108285274A (zh) * 2017-12-29 2018-07-17 江西沃格光电股份有限公司 防粘片刻蚀篮具、防粘片组件及玻璃片的刻蚀方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102286060B1 (ko) * 2017-06-01 2021-08-06 삼성디스플레이 주식회사 글라스 식각 장치 및 글라스 식각 방법
JP7183997B2 (ja) * 2019-08-29 2022-12-06 Ａｇｃ株式会社 ガラス基板の処理方法
KR20230036568A (ko) * 2021-09-06 2023-03-15 삼성디스플레이 주식회사 플렉서블 표시 장치용 커버 윈도우의 제조 방법 및 플렉서블 표시 장치의 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040200788A1 (en) * 2003-04-07 2004-10-14 Houng Suk Shon Cassette for receiving glass substrates

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4079579B2 (ja) 2000-06-23 2008-04-23 Ｎｅｃ液晶テクノロジー株式会社 ウェット処理装置
JP5790494B2 (ja) 2011-12-28 2015-10-07 日本電気硝子株式会社 ガラス基板のエッチング方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040200788A1 (en) * 2003-04-07 2004-10-14 Houng Suk Shon Cassette for receiving glass substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108285274A (zh) * 2017-12-29 2018-07-17 江西沃格光电股份有限公司 防粘片刻蚀篮具、防粘片组件及玻璃片的刻蚀方法

Also Published As

Publication number Publication date
TW201524927A (zh) 2015-07-01
KR101373306B1 (ko) 2014-03-11

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