TWI558281B - Method for sticking gummed paper and main board sticking the gummed paper useing the method - Google Patents

Description

Adhesive paper sticking method and motherboard formed by the method

The invention relates to a bonding method and a motherboard formed by the method, and particularly relates to a bonding method of adhesive tape and a motherboard formed by sticking adhesive tape by the method.

At present, in the manufacturing process of the circuit board, a mask cover is needed to prevent the components of the high frequency part from radiating energy outward and to avoid the high frequency radiation in the environment from affecting the normal operation of the circuit. Generally, the mask cover includes an upper cover and a lower cover, wherein the lower cover is a frame structure for dividing the electronic components on the main board into a plurality of areas, the upper cover is engaged with the lower cover, and is in contact with the surface of the component . However, if the upper cover is directly attached to the electronic component on the main board, it is necessary to cover the electronic component with a layer of adhesive tape to prevent the upper cover from directly contacting the component. Generally, the adhesive tape is directly attached to the main board. When the main board is divided into many areas, the adhesive paper needs to be attached to the areas one by one, which wastes a lot of time and manpower, and the mounting accuracy is not high.

In view of this, it is necessary to provide a bonding method by which a motherboard having a high mounting accuracy can be obtained.

In addition, it is also necessary to provide a motherboard that is adhered by this method, which can increase the placement accuracy.

An adhesive tape sticking method for sticking adhesive tape on a motherboard to prevent a meta on a motherboard The device is in direct contact with the mask cover, and the mask cover comprises a mask cover upper cover and a cover cover lower cover. The cover cover lower cover divides the main board into a plurality of regions, and the adhesive tape attaching method comprises the following steps: the adsorption process: Adhesive paper is adsorbed on the PET release film; punching process: punching the PET release film and the adhesive paper adsorbed on the PET release film; mounting process: aligning the PET release film with the cover of the cover Adhesive paper is adhered to the cover of the mask cover; peeling process: peeling off the PET release film from the cover of the cover; installation process: the cover of the cover is fastened to the cover of the cover.

A main board is covered with a mask cover, and the mask cover comprises a mask cover upper cover and a cover cover lower cover, and the main board is divided into a plurality of areas by the cover cover lower cover, the plurality of areas and the cover cover Between the corresponding number of adhesive tapes, the back side of the adhesive tape is adhered to the cover of the cover.

After adsorbing the adhesive tape on the PET release film, the PET release film and the adhesive tape are punched out, and the PET release film is placed on the cover of the cover, and the PET release film is peeled off, so that the adhesive tape is adhered to the mask. Close the cover and fasten the cover cover to the cover cover. Therefore, the adhesive tape is attached to the main board more accurately.

100‧‧‧ motherboard

1‧‧‧ Subject

2‧‧‧ mask cover

3‧‧‧ Cover cover

4‧‧‧ Cover cover

5‧‧‧Adhesive tape

6‧‧‧PET release film

1 is a schematic exploded view of a motherboard of the present invention.

2 is an exploded perspective view of a motherboard in an embodiment of the present invention.

Figure 3 is a flow chart of the adhesive tape mounting method of the present invention.

Please refer to Figure 1 and Figure 2. The main board 100 includes a main body 1 and a cover 2 . The main body 1 is provided with components. The mask cover 2 includes a mask cover lower cover 3 and a cover cover upper cover 4. The cover lower cover 3 is a frame structure, and the cover cover lower cover 3 will be an element on the main body 1. The piece is divided into a plurality of independent regions. In the present embodiment, the number of the independent regions is nine. The cover cover 4 is adhered to the cover lower cover 3 by the adhesive tape 5.

In this embodiment, the adhesive tape 5 has a backing on one side and no adhesive on one side, and the adhesive side of the adhesive tape 5 is adhered to the cover 4 of the cover, and the distribution of the adhesive tape 5 on the cover 4 of the cover is provided. One-to-one correspondence with a plurality of areas divided by the cover cover lower cover 3. When the cover cover 4 is covered on the cover lower cover 3, the main body 1 is adhered to the cover cover 4 by a plurality of areas divided by the cover lower cover 3 and the cover cover 4 The adhesive tape 5 is separated to prevent the components on the main body 1 from being in direct contact with the cover cap 4 and being damaged. Wherein, the adhesive tape 5 is made of an insulating material, and the mask cover upper cover 4 and the mask cover lower cover 3 form a sealed space for preventing the components of the high frequency portion from radiating energy outward and avoiding high in the environment. The frequency radiation affects the normal operation of the circuit.

Referring to FIG. 3 at the same time, the bonding method comprises the following steps: an adsorption process: adsorbing the non-adhesive side of the adhesive tape 5 on a PET release film 6, wherein the PET release film 6 has good adsorption and fit. The adhesive paper 5 can be adsorbed on the PET release film 6 by static electricity (S201); the blanking process: punching the PET release film 6 and the adhesive tape 5 adsorbed on the PET release film 6 so that The outer shape of the PET release film 6 is substantially the same as the inner frame of the cover 4 of the cover, and the adhesive tape 5 is precisely distributed on the PET release film 6, the shape and the number of the adhesive tape 5 and the cover cover 3 of the cover The shape and the number of the plurality of divided regions are matched one by one (S202); the mounting process: the PET release film 6 is compared with the cover cap 4, and the PET release film 6 and the cover are covered 4 When completely overlapped, the adhesive tape 5 is adhered to the lower surface of the cover 4 by the adhesive of the adhesive tape 5, so that the distribution and adhesive of the adhesive tape 5 on the cover 4 of the cover cover The distribution of the regions into which the body 1 is divided is the same (S203); the peeling process: peeling off the PET release film 6 from the cover cap 4 (S204); mounting process: fastening the cover cover 4 to the cover under the cover 3 (S205).

In step S202, the adhesive tape 5 is precisely distributed on the PET release film 6 with a tolerance of +/- 0.1 MM.

While the preferred embodiment of the invention has been illustrated and described, it will be understood by those skilled in the art that the <RTIgt; Therefore, it is intended that the invention not be limited to the embodiments disclosed herein,

1‧‧‧ Subject

3‧‧‧ Cover cover

4‧‧‧ Cover cover

5‧‧‧Adhesive tape

6‧‧‧PET release film

Claims (8)

An adhesive tape bonding method for adhering adhesive tape to a main board to prevent direct contact between components on the main board and the cover, the cover cover including a cover cover and a cover cover, the cover cover The board is divided into a plurality of regions, and the improvement is that the adhesive tape bonding method comprises the following steps: an adsorption process: adsorbing the adhesive paper on the PET release film; and a blanking process: separating the PET release film and adsorbing on the PET Adhesive tape punching on the film; placement process: the PET release film is attached to the cover of the mask and the adhesive tape is adhered to the cover of the cover; the peeling process: the PET release film is covered from the cover Peeling; installation procedure: Snap the cover of the mask cover to the lower cover of the cover. The adhesive tape sticking method according to claim 1, wherein after the punching process, the outer shape of the PET release film is substantially the same as the inner frame of the cover of the cover, and the adhesive tape is precisely distributed in the PET release type. On the film, the shape and the number of the adhesive sheets match the shape and the number of the plurality of regions divided by the main cover. The adhesive tape sticking method according to claim 2, wherein the adhesive paper has a distribution tolerance of +/- 0.1 mm on the PET release film. The adhesive tape sticking method according to claim 1, wherein the adhesive paper has a backing on one side and no backing on one side, wherein the non-adhesive side is used for adsorbing on the PET release film, and has a backing. One side is attached to the cover of the mask cover. A main board is covered with a mask cover, and the mask cover comprises a mask cover upper cover and a cover cover lower cover. The main board is divided into a plurality of areas by the cover cover lower cover, and the improvement is: the plurality of areas and A corresponding number of adhesive sheets are included between the cover of the mask cover, and the adhesive side of the adhesive tape is adhered to the cover of the cover. The motherboard of claim 5, wherein the corresponding number of adhesive sheets have a shape that matches the shape of the plurality of regions of the main board partitioned by the cover. The motherboard of claim 5, wherein the adhesive-free side of the adhesive sheet is in contact with a plurality of regions on the main board. The main board of claim 5, wherein the adhesive tape is made of an insulating material.