201138570 六、發明說明： 【發明所屬之技術領域】 [⑽1] 本發明涉及一種黏貼方法和利用該方法黏貼形成的主板 ，特別涉及一種膠紙黏貼方法和利用該方法黏貼膠紙而 形成的主板。 【先前技術·】 [0002] 目前電路主板在製造過程中，需要加上遮罩蓋來防止高 頻部分的元件向外輻射能量和避免環境中的高頻輻射影 響電路正常工作。一般來說，遮罩蓋包括上蓋與下蓋， 其中，下蓋為一框架結構，用於將主板上的電子元件分 成若干個區域，上蓋與下蓋卡合，並可與元器件表面接 觸。但是直接蓋上該上蓋容易損傷主板上的電子元件， 則需要在電子元器件上覆蓋一層膠紙防止上蓋與元器件 直接接觸。一般是藉由直接將膠紙貼在主板上，當主板 被分成的區域較多時，需要一一將膠紙貼在該些區域， 浪費大量的時間和人力，且貼裝精度不高。 【發明内容】 [0003] 有繁於此，有必要提供一種黏貼方法，藉由該黏貼方法 可得到一具有較高的貼裝精度的主板。 [0004] 另外，還有必要提供一種利用該方法黏貼的主板，能增 加貼裝精度。 [0005] 一種膠紙黏貼方法，用於將膠紙黏貼在主板上，防止主 板上的元器件與遮罩蓋直接接觸，遮罩蓋包括遮罩蓋上 蓋和遮罩蓋下蓋，該遮罩蓋下蓋將該主板分割成若干個 099113775 區域，該膠紙黏貼方法包括以下步驟：吸附工序：將膠紙 表單編號A0101 第4頁/共12頁 0992024271-0 201138570 [0006] Ο [0007] [0008]Ο [0009] 099113775 吸附在PET離型膜上；沖裁工序：將PET離型膜和吸附在 PET離型膜上的膠紙沖裁；貼裝工序：將PET離型膜對準 遮罩蓋上蓋後將膠紙黏附於遮罩蓋上蓋上；剝離工序： 將PET離型膜從遮罩蓋上蓋上剝離；安裝工序：將遮罩蓋 上蓋扣住遮罩蓋下蓋。 一種主板，該主板上覆蓋有遮罩蓋，遮罩蓋包括遮罩蓋 上蓋和遮罩蓋下蓋，該主板被遮罩蓋下蓋分割成若干個 區域，該若干個區域與遮罩蓋上蓋之間包括對應個數的 膠紙，該膠紙有背膠的一面黏貼在遮罩蓋上蓋上。 將膠紙吸附在PET離型膜上後，沖裁PET離型膜和膠紙， 將PET離型膜貼裝在遮罩蓋上蓋後，將PET離型膜剝離， 從而膠紙黏貼在遮罩蓋上蓋，將遮罩蓋上蓋扣住遮罩蓋 下蓋。從而膠紙較精確的貼在主板上。 【實施方式】 請參閱圖1及圖2。該主板100包括一主體1_一遮罩蓋2。 該主體1上設置有元器件。該遮罩蓋2包括有遮罩蓋下蓋3 及遮罩蓋上蓋4。遮罩蓋下蓋3為一框架結構，該遮罩蓋 下蓋3將主體1上的元器件分割成若干個獨立區域，在本 實施方式中，該獨立區域的個數為9個。遮罩蓋上蓋4藉 由膠紙5黏貼於該遮罩蓋下蓋3。 在本實施方式中，該膠紙5—面有背膠，一面無背膠，膠 紙5有背膠的一面黏貼於遮罩蓋上蓋4上，且膠紙5在遮罩 蓋上蓋4上的分佈與遮罩蓋下蓋3分割的若干個區域—— 對應。當遮罩蓋上蓋4覆蓋在遮罩蓋下蓋3上時，主體1被 遮罩蓋下蓋3分成的若干個區域與遮罩蓋上蓋4之間均由 表單編號A0101 第5頁/共12頁 0992024271-0 201138570 黏貼於遮罩蓋上蓋4上的膠紙5分隔開，從而避免主體1上 的元器件與遮罩蓋上蓋4直接接觸而損壞。其中，該膠紙 5由絕緣材料製成，該遮罩蓋上蓋4和該遮罩蓋下蓋3形成 一個密封的空間，用於防止高頻部分的元件向外輻射能 量和避免環境中的高頻輻射影響電路正常工作。 [0010] 請同時參閱圖3，該黏貼方法包括以下步驟： [0011] 吸附工序：將膠紙5無背膠的一面吸附在一 PET離型膜6上 ，其中，PET離型膜6具有良好的吸附性和貼合性，可藉 由靜電將膠紙5吸附於PET離型膜6上（S201); [0012] 沖裁工序：對PET離型膜6以及吸附於PET離型膜6上的膠 紙5進行沖裁，使得PET離型膜6外形與遮罩蓋上蓋4内框 大致相同，同時膠紙5精密分佈在PET離型膜6上，膠紙5 的形狀與個數與該遮罩蓋下蓋3將該主體1分割的若干個 區域的形狀和個數--匹配（S202); [0013] 貼裝工序：將PET離型膜6與遮罩蓋上蓋4進行比對，在 PET離型膜6與遮罩蓋上蓋4完全重合時，藉由膠紙5的背 膠，將膠紙5黏貼在遮罩蓋上蓋4的下表面，從而膠紙5在 遮罩蓋上蓋4上的分佈與主體1被分成的區域的分佈相同 (S203)； [0014] 剝離工序：將PET離型膜6從遮罩蓋上蓋4上剝離（S204) 9 [0015] 安裝工序：將遮罩蓋上蓋4扣住遮罩蓋下蓋3(S205 )。 [0016] 在步驟S202中，該膠紙5以+/-0. 1MM的公差精密分佈在 099113775 表單編號A0101 第6頁/共12頁 0992024271-0 201138570 PET離型膜6上。 [0017] 儘管對本發明的優選實施方式進行了說明和描述，但是 本領域的技術人員將領悟到該黏貼方法可能產生的其他 步驟，這些都不超出本發明的真正範圍。因此期望，本 • 發明並不局限於所公開的作為實現本發明所設想的最佳 模式的具體實施方式，本發明包括的所有實施方式都有 所附權利要求書的保護範圍内。 【圖式簡單說明】 [0018] 圖1係本發明之主板的爆炸示意圖。 Ο [0019] 圖2係本發明實施方式之主板在貼裝過程的分解示意圖。 [0020] 圖3係本發明之膠紙貼裝方法流程圖。 【主要元件符號說明】 [0021] 主板：100 [0022] 主體：1 [0023] 遮罩蓋：2 Ο ^ [0024] 遮罩蓋下蓋：3 [0025] 遮罩蓋上蓋：4 [0026] 膠紙：5 [0027] PET離型膜：6 099113775 表單編號A0101 第7頁/共12頁 0992024271-0201138570 VI. Description of the Invention: [Technical Field of the Invention] [(10) 1] The present invention relates to a pasting method and a motherboard formed by the method, and particularly to a method for attaching adhesive tape and a motherboard formed by adhering adhesive tape using the method. [Prior Art·] [0002] At present, in the manufacturing process of the circuit board, a mask cover is required to prevent the components of the high frequency portion from radiating energy outward and to prevent the high frequency radiation in the environment from affecting the normal operation of the circuit. Generally, the mask cover includes an upper cover and a lower cover, wherein the lower cover is a frame structure for dividing the electronic components on the main board into a plurality of areas, the upper cover is engaged with the lower cover, and is in contact with the surface of the component. However, if the upper cover is directly attached to the electronic component on the main board, it is necessary to cover the electronic component with a layer of adhesive tape to prevent the upper cover from directly contacting the component. Generally, the adhesive tape is directly attached to the main board. When the main board is divided into many areas, the adhesive paper needs to be attached to the areas one by one, which wastes a lot of time and manpower, and the mounting accuracy is not high. SUMMARY OF THE INVENTION [0003] In view of this, it is necessary to provide a bonding method by which a motherboard having a high mounting accuracy can be obtained. [0004] In addition, it is also necessary to provide a motherboard that is pasted by this method, which can increase the placement accuracy. [0005] A method for adhering adhesive tape for adhering adhesive tape to a main board to prevent direct contact between components on the main board and the cover, the cover cover including a cover cover and a cover cover, the cover The cover is divided into a plurality of 099113775 areas, and the adhesive tape bonding method comprises the following steps: adsorption process: the adhesive paper form number A0101 page 4 / total 12 pages 0992024271-0 201138570 [0006] Ο [0007] [ 0008]Ο [0009] 099113775 adsorbed on PET release film; blanking process: punching PET release film and adhesive paper adsorbed on PET release film; mounting process: aligning PET release film After the cover is covered, the adhesive tape is adhered to the cover of the cover; the peeling process: peeling off the PET release film from the cover of the cover; the installation process: the cover of the cover is fastened to the cover of the cover. A main board is covered with a mask cover, and the mask cover comprises a mask cover upper cover and a cover cover lower cover, and the main board is divided into a plurality of areas by the cover cover lower cover, the plurality of areas and the cover cover Between the corresponding number of adhesive tapes, the back side of the adhesive tape is adhered to the cover of the cover. After the adhesive tape is adsorbed on the PET release film, the PET release film and the adhesive tape are punched out, and the PET release film is attached to the cover of the mask cover, and the PET release film is peeled off, so that the adhesive tape is adhered to the mask. Close the cover and fasten the cover cover to the cover cover. Therefore, the adhesive tape is attached to the main board more accurately. Embodiments Please refer to FIG. 1 and FIG. 2 . The main board 100 includes a main body 1 - a cover 2 . The main body 1 is provided with components. The mask cover 2 includes a mask cover lower cover 3 and a cover cover upper cover 4. The mask cover lower cover 3 is a frame structure, and the cover cover lower cover 3 divides the components on the main body 1 into a plurality of independent regions. In the present embodiment, the number of the independent regions is nine. The cover cover 4 is adhered to the cover lower cover 3 by the adhesive tape 5. In this embodiment, the adhesive tape 5 has a backing on one side, no adhesive on one side, and a back side of the adhesive tape 5 adheres to the cover 4 of the cover, and the adhesive tape 5 is on the cover 4 of the cover. The distribution is corresponding to several areas of the cover cover 3 divided by the cover. When the cover upper cover 4 is overlaid on the cover lower cover 3, the main body 1 is divided by the cover cover lower cover 3 and the cover cover 4 by the form number A0101, page 5 / total 12 Page 0992024271-0 201138570 The adhesive tape 5 adhered to the cover 4 of the cover is separated to prevent the components on the main body 1 from being in direct contact with the cover 4 and being damaged. Wherein, the adhesive tape 5 is made of an insulating material, and the mask cover upper cover 4 and the mask cover lower cover 3 form a sealed space for preventing the components of the high frequency portion from radiating energy outward and avoiding high in the environment. The frequency radiation affects the normal operation of the circuit. [0010] Please refer to FIG. 3 at the same time, the bonding method comprises the following steps: [0011] adsorption step: adsorbing the non-adhesive side of the adhesive tape 5 on a PET release film 6, wherein the PET release film 6 has good Adsorption and adhesion, the adhesive paper 5 can be adsorbed on the PET release film 6 by static electricity (S201); [0012] Blanking process: on the PET release film 6 and on the PET release film 6 The adhesive tape 5 is punched out, so that the outer shape of the PET release film 6 is substantially the same as the inner frame of the cover 4 of the cover, and the adhesive tape 5 is precisely distributed on the PET release film 6, and the shape and number of the adhesive paper 5 The mask cover lower cover 3 matches the shape and the number of the plurality of regions divided by the main body 1 (S202); [0013] a mounting process: comparing the PET release film 6 with the cover cover 4, When the PET release film 6 and the cover cover 4 are completely overlapped, the adhesive tape 5 is adhered to the lower surface of the cover 4 by the adhesive of the adhesive tape 5, so that the adhesive tape 5 is covered on the cover 4 The distribution on the upper side is the same as the distribution of the area in which the main body 1 is divided (S203); [0014] The peeling process: peeling off the PET release film 6 from the cover cap 4 (S204) 9 [0015] The mask 4 buckled shield cover capped under cover 3 (S205). [0016] In step S202, the adhesive tape 5 is precisely distributed at a tolerance of +/- 0.1 mm. 099113775 Form No. A0101 Page 6 of 12 0992024271-0 201138570 PET release film 6. [0017] While the preferred embodiment of the present invention has been illustrated and described, those skilled in the art will appreciate that other steps that can be made by the pasting method are beyond the true scope of the present invention. It is therefore intended that the invention be not limited to the specific embodiments disclosed herein, and the embodiments of the invention are claimed. BRIEF DESCRIPTION OF THE DRAWINGS [0018] FIG. 1 is a schematic exploded view of a motherboard of the present invention. [0019] FIG. 2 is an exploded perspective view of a motherboard in an embodiment of the present invention. 3 is a flow chart of the adhesive tape mounting method of the present invention. [Main component symbol description] [0021] Main board: 100 [0022] Main body: 1 [0023] Cover cover: 2 Ο ^ [0024] Cover cover lower cover: 3 [0025] Cover cover: 4 [0026] Adhesive paper: 5 [0027] PET release film: 6 099113775 Form No. A0101 Page 7 / Total 12 Page 0992024271-0