JP2011216541A - Fixture of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixture of a substrate that achieves to work swiftly, simply, and easily.SOLUTION: The fixture of the substrate includes a support plate 1 having the rigidity, and a double-sided adhesive sheet 3 which is detachably sticky to a surface of this support plate 1 for detachably, stickily holding a thinned semiconductor wafer W. A non-sticky layer 4 is sandwiched and laminated between the surface of the support plate 1 and part of the double-sided adhesive sheet 3, and an air hole 2 opposing to the non-sticky layer 4 is perforated in a thickness direction in the support plate 1. As there is no need of using a dedicated thick inner ring and outer ring, it is possible to attempt a reduction of cost, and in addition it is possible to enhance the workability of the work and to expect to work swiftly, simply, and easily.

Description

  The present invention relates to a substrate fixing jig used when holding a substrate made of a thinned semiconductor wafer or the like.

  The semiconductor wafer is thinned by back grinding on the back surface from the viewpoint of adapting to a thin semiconductor package after the completion of the previous process, but with this thinning, the strength and rigidity are reduced and the wafer is easily bent. There is a risk of damage during processing and transport. Therefore, conventionally, a thinned semiconductor wafer is held on a fixing jig to ensure strength and rigidity, and the semiconductor wafer is held on a fixing jig for various processing, processing, and transportation. (See Patent Documents 1 and 2).

  For example, as shown in FIG. 4, this type of fixing jig includes a rigid inner ring 10 and an outer ring 11 that are fitted to each other, and flexibility is provided between the inner ring 10 and the outer ring 11. The peripheral portion of the pressure-sensitive adhesive sheet 12 is sandwiched without any gap, and the thinned semiconductor wafer W is detachably adhered to the surface of the pressure-sensitive adhesive sheet 12.

  When assembling such a fixing jig, the outer peripheral surface of the pressure-sensitive adhesive sheet 12 is properly aligned with the outer peripheral surface of the inner ring 10, and then the outer ring 11 is tightly fitted to the inner ring 10. If the peripheral edge of the adhesive sheet 12 is sandwiched between the two, the fixing jig can be assembled. On the other hand, when disassembling the fixing jig, the fixing jig can be disassembled by removing the outer ring 11 from the inner ring 10 and peeling the adhesive sheet 12 from the outer peripheral surface of the inner ring 10.

JP 2009-194183 A Japanese Patent Laid-Open No. 2001-60559

  The conventional substrate fixing jig is configured as described above, and it is necessary to use the dedicated thick inner ring 10 and outer ring 11 which are tightly fitted, so that the workability of the work is poor and complicated. There is a problem that there is.

  The present invention has been made in view of the above, and an object thereof is to provide a substrate fixing jig capable of speeding up, simplifying, and facilitating operations.

In order to solve the above problems, the present invention comprises a support plate and a double-sided pressure-sensitive adhesive sheet that sticks and holds the thinned substrate detachably attached to the support plate, and the support plate and a part of the double-sided pressure-sensitive adhesive sheet A non-adhesive layer is interposed between the support plate and the support plate is provided with air holes facing the non-adhesive layer.
The support plate is a borosilicate glass plate, and the double-sided pressure-sensitive adhesive sheet is formed of a slightly adhesive silicone rubber, and the thinned semiconductor wafer can be adhered and held on the surface.

  Here, the support plate, the double-sided pressure-sensitive adhesive sheet, and the non-adhesive layer in the claims can be appropriately formed into a flat circular shape, an elliptical shape, a rectangular shape, a polygonal shape, or the like as necessary. The thinned substrate includes at least φ100 mm, 150 mm, 200 mm, 300 mm, and 450 mm semiconductor wafers, thin glass substrates, and the like thinned by back grinding. A part of the double-sided pressure-sensitive adhesive sheet corresponds to a central part or a peripheral part of the facing surface facing the support plate of the double-sided pressure-sensitive adhesive sheet. Heat resistance etc. can be suitably given to a non-adhesion layer as needed. Further, the air hole is not particularly limited.

According to the present invention, there is an effect that work can be speeded up, simplified, and facilitated.
Also, if the support plate is a borosilicate glass plate, a lower coefficient of thermal expansion can be easily obtained compared to the case where the support plate is blue plate glass or crown glass, and it can be made less susceptible to the influence of temperature changes. . Furthermore, if the double-sided PSA sheet is formed of a slightly adhesive silicone rubber, excellent heat resistance, weather resistance, flame retardancy, and the like can be obtained.

It is a section explanatory view showing typically an embodiment of a substrate fixing jig concerning the present invention. It is a plane explanatory view showing typically an embodiment of a substrate fixing jig concerning the present invention. It is a plane explanatory view showing typically a 2nd embodiment of a substrate fixing jig concerning the present invention. It is sectional explanatory drawing which shows typically the fixing jig of the board | substrate in the past.

  Hereinafter, the embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, a substrate fixing jig in the present embodiment is provided with a rigid support plate 1 and the support plate 1. A flexible double-sided pressure-sensitive adhesive sheet 3 that holds the thinned semiconductor wafer W, and a non-adhesive layer 4 is interposed between the support plate 1 and a part of the double-sided pressure-sensitive adhesive sheet 3. 1 is formed with air holes 2.

  The support plate 1, the double-sided adhesive sheet 3, and the non-adhesive layer 4 are larger than the semiconductor wafer W from the viewpoint of securing the strength and rigidity of the thinned semiconductor wafer W and weakening the adhesiveness of the double-sided adhesive sheet 3. Formed in size. In the support plate 1, the double-sided pressure-sensitive adhesive sheet 3, and the non-sticky layer 4, the support plate 1 and the double-sided pressure-sensitive adhesive sheet 3 are formed in substantially the same size, and the non-sticky layer 4 is more than the support plate 1 and the double-sided pressure-sensitive adhesive sheet 3. It is formed small.

  The support plate 1 is a predetermined silicon plate (for example, a large silicon wafer) or glass plate, preferably borosilicate having excellent chemical durability, considering that the fixing jig is set in a solder reflow apparatus in a heating environment. Glass plate is used. The support plate 1 is formed in a flat planar rectangle on both front and back surfaces, and round air holes 2 facing near the corners of the non-adhesive layer 4 are perforated in the thickness direction. It functions to facilitate the peeling of the double-sided pressure-sensitive adhesive sheet 3 adhered to the surface.

  The semiconductor wafer W is formed of a silicon wafer having a diameter of 200 mm or 300 mm as in the conventional case, and after the previous process, the semiconductor wafer W is thinned by back grinding on the back surface from the viewpoint of adapting to a thin semiconductor package. The thinned semiconductor wafer W has a thickness of 100 μm or less.

  The double-sided pressure-sensitive adhesive sheet 3 is made of a thin, single-layer silicone rubber that is excellent in heat resistance, weather resistance, flame resistance, etc., considering that the fixing jig is set in a solder reflow device in a heating environment. It is done. This double-sided pressure-sensitive adhesive sheet 3 is formed in a flat rectangular shape corresponding to the support plate 1 and has flat adhesive surfaces on both sides, and is adhered to the surface of the support plate 1 in a detachable manner and thinned. The back surface of the semiconductor wafer W is detachably adhered.

  The non-adhesive layer 4 is formed into a flat rectangular shape with a low thermal expansion coefficient thin polyimide film excellent in heat resistance in consideration of being set in, for example, a solder reflow apparatus, and is laminated on the surface central portion of the support plate 1. It faces a part of the back surface of the double-sided PSA sheet 3 and covers the air holes 2 of the support plate 1.

  The non-adhesive layer 4 adheres to a part of the back surface of the double-sided pressure-sensitive adhesive sheet 3, specifically, the central portion of the back surface, reduces the adhesive region with respect to the support plate 1, and peels off the double-sided pressure-sensitive adhesive sheet 3 adhered to the support plate 1. To make it easier. Therefore, as for the back surface of the double-sided pressure-sensitive adhesive sheet 3, the central portion facing the non-adhesive layer 4 does not adhere to the surface of the support plate 1, and the non-central portion not facing the non-adhesive layer 4, that is, the peripheral portion is the surface of the support plate 1. Adhere to.

  In the above configuration, when the thinned semiconductor wafer W is held by the fixing jig, the semiconductor wafer W is adhered to the surface of the double-sided pressure-sensitive adhesive sheet 3 without a gap, and the double-sided pressure-sensitive adhesive sheet 3 is not adhered to the surface of the support plate 1. If the adhesive layer 4 is adhered with no gap, the semiconductor wafer W that is easily bent can be held by the fixing jig, and sufficient strength and rigidity can be secured.

  During these operations, it is necessary to cover the air holes 2 by laminating the non-adhesive layer 4 at the center of the surface of the support plate 1 to contribute to the subsequent peeling operation. Further, even if the double-sided pressure-sensitive adhesive sheet 3 is adhered to the surface of the support plate 1 via the non-adhesive layer 4, and then the semiconductor wafer W is adhered to the surface of the double-sided pressure-sensitive adhesive sheet 3, the semiconductor wafer W that is easily bent into the fixing jig. Can be held.

  The semiconductor wafer W thinned in the fixing jig in this way is applied to the exposed surface, solder paste is applied to the exposed surface, or flux is printed and a plurality of solder balls are arranged, and then set in a high-temperature solder reflow apparatus. Is done. At the time of this solder reflow, since the support plate 1 is made of a borosilicate glass plate and the double-sided pressure-sensitive adhesive sheet 3 is made of silicone rubber, the semiconductor wafer W is very unlikely to be adversely affected by the temperature change of the solder reflow apparatus.

  Next, when it is desired to remove the thinned semiconductor wafer W from the fixing jig, air is circulated between the support plate 1, the double-sided pressure-sensitive adhesive sheet 3, and the non-adhesive layer 4 using the air holes 2. If the double-sided pressure-sensitive adhesive sheet 3 is gradually peeled off from the surface of the support plate 1 and then the double-sided pressure-sensitive adhesive sheet 3 is bent from the end and peeled off from the semiconductor wafer W, the thinned semiconductor wafer W can be easily removed. .

  At this time, air is pumped into the air holes 2 to deform the non-adhesive layer 4 and slightly float from the surface of the support plate 1, and air flows between the support plate 1, the double-sided adhesive sheet 3, and the non-adhesive layer 4. Can be made. In addition, since the non-adhesive layer 4 adheres only to the periphery of the back surface of the double-sided pressure-sensitive adhesive sheet 3 on the surface of the support plate 1 and does not require a large force for peeling, both sides of the support plate 1 can be removed from the support plate 1 without damage. The pressure-sensitive adhesive sheet 3 can be easily peeled off.

  According to the above configuration, since it is not necessary to use the dedicated thick inner ring 10 and outer ring 11 as the fixing jig, the running cost can be reduced. In addition, since it is not necessary to tightly fit the inner ring 10 and the outer ring 11 and the workability of the work can be improved, the speeding up, simplification, and facilitation of the work can be greatly expected.

Next, FIG. 3 shows a second embodiment of the present invention. In this case, the support plate 1, the double-sided pressure-sensitive adhesive sheet 3, and the non-adhesive layer 4 are respectively provided so as to correspond to the shape of the semiconductor wafer W. It is designed to form a planar circle. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.
In the present embodiment, it is obvious that the same operational effects as those in the above embodiment can be expected, and that the configuration of the fixing jig can be expected to be diversified.

  In the above embodiment, a glass plate is used as the support plate 1, but a plate made of glass epoxy or the like may be used. Moreover, a non-adhesive layer 4 may be deformed by inserting a finger or a pin into the air hole 2 of the support plate 1, and air may flow between the support plate 1, the double-sided adhesive sheet 3, and the non-adhesive layer 4. . Furthermore, when heat resistance is not particularly required, a film such as polyethylene terephthalate can be used as the non-adhesive layer 4.

DESCRIPTION OF SYMBOLS 1 Support plate 2 Air hole 3 Double-sided adhesive sheet 4 Non-adhesion layer W Semiconductor wafer (substrate)

Claims (2)

  A support plate and a double-sided adhesive sheet that adheres and holds the thinned substrate that is detachably adhered to the support plate, and a non-adhesive layer is interposed between the support plate and a part of the double-sided adhesive sheet, A fixing jig for a substrate, wherein an air hole facing the non-adhesive layer is provided in the support plate.   2. The substrate fixing jig according to claim 1, wherein the supporting plate is a borosilicate glass plate, the double-sided adhesive sheet is formed of a slightly adhesive silicone rubber, and the thinned semiconductor wafer is adhered and held on the surface. .

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