TWI556912B - Chemical mechanical polishing conditioner with high quality abrasive particles - Google Patents

Description

High quality abrasive chemical mechanical polishing dresser

The invention relates to a chemical mechanical polishing dresser for high quality abrasives, in particular to a chemical mechanical polishing dresser suitable for removing high quality abrasives of risk diamonds.

Chemical Mechanical Polishing (CMP) is a common grinding process in various industries. The surface of various articles can be ground using a chemical polishing process, including ceramic, tantalum, glass, quartz, or metal wafers. In addition, with the rapid development of integrated circuits, chemical mechanical polishing can achieve large-area planarization, so it is one of the common wafer planarization techniques in semiconductor manufacturing.

In the chemical mechanical polishing process of semiconductors, the wafers (or other semiconductor components) are contacted by a polishing pad (Pad), and the polishing liquid is used in combination with the polishing pad to remove the wafer by chemical reaction and physical mechanical advantage. Impurity or uneven structure of the surface; when the polishing pad is used for a certain period of time, the grinding debris generated by the grinding process is accumulated on the surface of the polishing pad to cause grinding The effect and efficiency are reduced. Therefore, the surface of the polishing pad can be ground by a conditioner to re-roughen the surface of the polishing pad and maintain the optimum grinding state. However, in the preparation process of the dresser, the polishing layer formed by mixing the abrasive particles and the bonding layer is required to be disposed on the surface of the substrate, and the polishing layer is fixedly bonded to the surface of the substrate by hardening such as brazing or sintering. However, during the manufacture of the above-mentioned dresser, or when the dresser is finished with a polishing pad, the diamond particles may be broken. The so-called Risk Diamond makes the dresser defective, so it is necessary. A test is performed on the dresser and the risk diamond is removed to ensure that the subsequent use results in the desired abrasive effect. It is customary to check whether the polishing pad dresser has a risky diamond. Most of the methods are manually observed by optical microscopy (OM). Once a dangerous diamond is found, it is convenient to mark the position with a marker such as an oil-based pen and then take a photo. Finally, Manually align the front and back photos and remove the risk diamond by hand or mechanically to avoid risky diamonds remaining on the dresser.

A known method, such as the Republic of China Patent Publication No. 201102215, discloses a method and system for removing contaminants and/or debris from a polishing surface of a CMP pad during a CMP process. In one aspect, a method of removing debris from a polishing surface of a CMP pad during a CMP process can include rotating a CMP pad having a polished surface; and pressing a CMP pad dresser toward the CMP pad A polishing surface of the pad, wherein the CMP pad dresser includes a plurality of superabrasive particles coupled thereto, the plurality of superabrasive particles being oriented toward the CMP pad. The method may further comprise spraying a liquid jet onto the polishing surface of the CMP pad with a sufficient force to drive the CMP pad The debris on the polished surface.

Further, another known technique of the Republic of China Patent Publication No. 438650 discloses a method of recovering a diamond wheel in a chemical mechanical polishing process. The cerium oxide deposited on the diamond wheel is first rinsed with a water jet at a high pressure of 1500-6000 psi with DI Water. This removes most of the dust and places the diamond wheel. On a heating platform with a temperature of 40 ° C, using a carbon dioxide gas with a temperature of 0 ° C and a pressure of 800 to 6000 psi, with clean dry air, flushing the surface of the diamond wheel, the residual cerium oxide can be removed, and finally, The diamond wheel is placed in an ultrasonic sink and shaken with deionized water to remove any remaining impurities. After these three steps, most of the cerium oxide on the surface of the diamond wheel can be removed and the recycled diamond wheel can be recycled.

However, the water knife device of the above chemical mechanical polishing dresser is aimed at removing the debris of the surface of the dresser or the polishing pad during the grinding process to maintain the grinding performance between the dresser and the polishing pad, and cannot be improved. Risk diamond residue in the trimmer manufacturing process. Therefore, there is an urgent need to develop a high-quality abrasive chemical mechanical polishing dresser to remove the risk diamond on the surface of the dresser, thereby avoiding the scratching and damage of the polishing pad during the chemical mechanical grinding process.

One object of the present invention is to provide a high quality abrasive chemical mechanical polishing dresser for removing risk diamonds from the chemical mechanical polishing dresser by a water knife device, thereby avoiding risky diamonds in the chemical machine. Scratches and damage to the polishing pad during mechanical grinding.

In the process of manufacturing a general chemical mechanical polishing dresser, the solder powder and diamond particles of the metal alloy are mostly laid on the surface of the stainless steel substrate, and then heated and brazed, so that the diamond particles are fixed on the surface of the substrate by the solder alloy. That is, the production of the chemical mechanical polishing dresser is completed. However, in the actual fabrication process of the chemical mechanical polishing dresser, since some of the diamond particles contain diamonds having a twin crystal structure, an internal crack structure or a diamond with a low coverage ratio, the presence of the risk diamond may be The source of raw materials from the diamond particles themselves, or the defects caused by the diamond particles during the brazing process or the finishing process of the dresser, and the general diamond particles different from the crystal form provide excellent and stable grinding performance. Therefore, the present invention removes the risk diamond from the chemical mechanical polishing dresser by the waterjet device and the high pressure fluid, thereby avoiding the scratching and damage of the risky diamond to the polishing pad during the chemical mechanical polishing process. In addition, in addition to the removal of the risk diamond from the chemical mechanical polishing conditioner by the waterjet device and the high pressure fluid, the present invention can further fill the crystallized diamond particles in the position left after the risk diamond is removed. In order to maintain the number of diamond particles and the arrangement pattern of the original finisher surface.

In order to achieve the above object, a high-quality abrasive chemical mechanical polishing dresser of the present invention comprises: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding a layer, and the abrasive particles are fixed to the substrate by the bonding layer; wherein the high-quality abrasive chemical mechanical polishing conditioner can be moved through a water jet device and a high pressure fluid via a conveying device, and the high pressure Fluid through The waterjet device acts on the abrasive particles to remove one or a plurality of risk diamonds contained within the abrasive particles.

In the above-mentioned high-quality abrasive chemical mechanical polishing dresser of the present invention, the risk diamond may have a twin crystal structure, an internal crack structure or a diamond with a low coverage ratio, wherein the risk diamond may be derived from a diamond. The source of the raw material of the granule itself, or the defects caused by the diamond granule during the brazing process or the finishing process of the dresser, and the ordinary diamond granules which are different from the crystal form can provide excellent and stable grinding performance due to the Risk diamonds with a twin crystal structure, an internal crack structure or a diamond with a low coverage ratio are present in the interior or surface of the diamond particles, so the strength and crystal form of the diamond particles are destroyed, and the diamonds of the risk diamonds are caused to be ground. Performance is degraded.

In the chemical mechanical polishing dresser of the high quality abrasive of the present invention, the water jet device may include one or a plurality of nozzle devices, and the water jet device may include nozzle devices according to user requirements or the diamonds. The water jet device may comprise two to ten nozzle devices in one aspect of the invention; in another aspect of the invention, the waterjet device may comprise There are 3 to 5 nozzle devices. In addition, in the CMP polishing dresser of the high-quality abrasive of the present invention, the nozzle aperture of the nozzle device can be arbitrarily changed according to the user's requirements or the quality requirements of the abrasive particles, wherein one of the inventions In the aspect, the nozzle devices may have the same nozzle aperture; in another aspect of the invention, the nozzle devices may have different nozzle apertures, and the invention is not limited thereto.

In the chemical mechanical polishing dresser of the high quality abrasive of the present invention, the nozzle devices can form different spray angles, which is different from the traditional water jet cutter. Mostly limited to a single nozzle and a single angle cleaning function, the nozzle device of the present invention can be arbitrarily changed according to the user's requirements or the quality requirements of the abrasive particles to form the abrasive particles having various ejection angles toward the surface of the dresser. In addition, in the above-mentioned high-quality abrasive chemical mechanical polishing dresser of the present invention, the waterjet device may be a fixing mechanism, for example, a fixed waterjet, so that the high-pressure fluid is fixed by a waterjet device or a nozzle device. Acting on the fixed positions of the abrasive particles to remove the risk diamond contained in the abrasive particles, or the waterjet device may be a rotating mechanism, such as a rotary waterjet, to continuously rotate the high pressure fluid The waterjet device or nozzle device acts on the non-fixed position of the abrasive particles.

In the chemical mechanical polishing dresser of the high-quality abrasive of the present invention, the rotation speed of the rotating mechanism can be arbitrarily changed according to the demand of the user or the quality requirements of the abrasive particles, wherein the rotation speed of the rotating mechanism can be 5 rpm. /min) to 2,000 rpm; in one aspect of the invention, the rotational speed of the rotating mechanism may be from 10 rpm to 1,050 rpm. In addition, in the chemical mechanical polishing dresser of the high-quality abrasive of the present invention, the pressure of the high-pressure fluid acting on the abrasive particles may be arbitrarily changed according to user requirements or quality requirements of the abrasive particles, wherein the high-pressure fluid The pressure acting on the abrasive particles can range from 300 psi to 40,000 psi; in one aspect of the invention, the high pressure fluid can be applied to the abrasive particles at a pressure of from 1,000 psi to 32,000 psi.

In the high-quality abrasive chemical mechanical polishing dresser of the present invention, the high-quality abrasive chemical mechanical polishing dresser can be moved through the waterjet device and the high-pressure fluid via the conveying device, and the high-pressure fluid is transmitted through the waterjet device. Acting on the abrasive particles to remove one or more risk diamonds contained in the abrasive particles, and the moving speed of the conveying device may be arbitrarily changed according to user requirements or quality requirements of the abrasive particles. Wherein, the conveying speed of the conveying device may be from 10 mm/min to 1,000 mm/min.

In the chemical mechanical polishing dresser of the high quality abrasive of the present invention, the water jet device may have a lifting mechanism for adjusting the distance between the water jet device and the high quality abrasive dresser, and at the same time, the fixed high pressure fluid Under pressure, the pressure of the high-pressure fluid is applied to the abrasive particles by a change in the spacing, and further, the distance between the waterjet device and the high-quality abrasive dresser is visually required by the user or the quality requirements of the abrasive particles. The invention is not limited thereto as arbitrarily changed.

In the high quality abrasive chemical mechanical polishing conditioner of the present invention, the high pressure fluid may be any fluid capable of removing risky diamonds, such as pure water, ultrapure water, non-corrosive fluids, the like, or combinations thereof. The invention is not limited thereto. Wherein, the above-mentioned ultrapure water means that the main impurity substances in the water are removed by ion exchange resin, activated carbon and membrane method, the water having a specific resistance value of 18.2 MΩ·cm at 25 ° C, and the high pressure fluid can be reduced for trimming. Corrosion or damage caused by the bonding layer on the surface of the device.

In the chemical mechanical polishing dresser of the high quality abrasive of the present invention, the abrasive particles may be synthetic diamonds, natural diamonds, polycrystalline diamonds, or cubic boron nitride; in a preferred aspect of the invention, the The abrasive particles are synthetic diamonds. In another aspect, in the planarized chemical mechanical polishing conditioner of the present invention, the abrasive particles may have a particle diameter of 30 micrometers to 600 micrometers; In one aspect, the abrasive particles have a particle size of 200 microns.

In the chemical mechanical polishing dresser of the high-quality abrasive of the present invention, the composition of the bonding layer or the composition or size of the abrasive particles may be arbitrarily changed according to the conditions and requirements of the grinding process, and the composition of the bonding layer may be a ceramic material. The brazing material, the plating material, the metal material, or the polymer material, the present invention is not limited thereto. In one aspect of the invention, the bonding layer can be a solder layer, and the solder layer can be at least one selected from the group consisting of iron, cobalt, nickel, chromium, manganese, lanthanum, aluminum, copper, and combinations thereof. . In another aspect of the invention, the polymer material is an epoxy resin, a polyester resin, a polyacrylic resin, or a phenolic resin. In addition, in the planarized chemical mechanical polishing dresser of the present invention, the material and size of the substrate may be arbitrarily changed according to the conditions and requirements of the polishing process, wherein the material of the substrate may be stainless steel, die steel, metal alloy, The present invention is not limited to the ceramic material or the polymer material or a combination thereof. In a preferred aspect of the invention, the substrate may be made of a stainless steel substrate.

In summary, the high quality abrasive chemical mechanical polishing dresser according to the present invention can be used to remove the risk diamond in the abrasive particles, thereby avoiding scratches and damage to the polishing pad during the chemical mechanical polishing process.

10,20,30‧‧‧Chemical mechanical polishing dresser

11‧‧‧Conveyor

12,22,32‧‧‧waterjet device

120,220,320‧‧‧ nozzle device

13,23,33‧‧‧High pressure fluid

14‧‧‧ Lifting mechanism

101,201,301‧‧‧substrate

102,202,302‧‧‧bonding layer

103,203,303‧‧‧Abrasive granules

104,204,304‧‧‧Ranger diamonds

1A is a schematic view of a chemical mechanical polishing dresser of the high quality abrasive of the present invention.

1B is a chemical mechanical polishing dressing of a high quality abrasive according to Embodiment 1 of the present invention. Schematic diagram of the device.

2 is a schematic view of a chemical mechanical polishing dresser of a high quality abrasive according to a second embodiment of the present invention.

Fig. 3 is a schematic view showing the apparatus of the chemical mechanical polishing dresser of the high quality abrasive according to the third embodiment of the present invention.

The embodiments of the present invention are described below by way of specific examples, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. In addition, the present invention may be embodied or modified by various other embodiments without departing from the spirit and scope of the invention.

Example 1

The high quality abrasive chemical mechanical polishing dresser of the present invention can be used to remove the risk diamond of the chemical mechanical polishing dresser, thereby avoiding the damage and damage of the diamond to the polishing pad during the chemical mechanical polishing process. Please refer to FIG. 1. FIG. 1A is a schematic view of a chemical mechanical polishing dresser of a high quality abrasive, and FIG. 1B is a schematic view of a chemical mechanical polishing dresser of a high quality abrasive according to Embodiment 1 of the present invention. As shown in FIG. 1, the high-quality abrasive chemical mechanical polishing dresser 10 of the present invention comprises: a stainless steel substrate 101; a nickel-based metal solder bonding layer 102, and a plurality of abrasive particles 103, which are hardened by heating. The abrasive particles 103 are embedded and fixed to the bonding layer 102, and the abrasive particles 103 are fixed on the substrate 101 by the bonding layer 102; wherein the abrasive particles 103 have a particle diameter of 200 micrometers. Artificial drill The stone, and the abrasive particles 103 can be arranged in a conventional cloth drilling technique (for example, a template drilling), and the spacing and arrangement of the abrasive particles 103 can be controlled by a template (not shown). A plurality of diamonds 104 having a double crystal structure, an internal crack structure, or a low coverage ratio of the bonding layer are also present in the abrasive particles 103.

As shown in FIG. 1, the high quality abrasive chemical mechanical polishing dresser 10 can be moved through a water transfer device 12 and a high pressure fluid 13 via a transport device 11, wherein the water jet device 12 includes four nozzle devices 120. The four nozzle devices 120 are all connected to the same mother tube. In addition, the high pressure fluid 13 is pure water and acts on the surface of the chemical mechanical polishing dresser 10 through the waterjet device 12, and the nozzle device 120 can control the high voltage. The fluid 13 faces the abrasive particles 103 in a vertical or vertical angle, and the abrasive particles 103 are subjected to stress from the high pressure fluid 13 to have a risk of a twin crystal structure, an internal crack structure or a low coverage ratio of the bonding layer. The one or more risk diamonds 104 contained in the abrasive particles 103 are removed due to the poor adhesion strength to the bonding layer, and further, in the chemical mechanical polishing conditioner 10 of the high quality abrasive of the first embodiment, The high pressure fluid 13 is applied to the abrasive particles 103 at a pressure of from 1,000 psi to 32,000 psi, and the conveying device 11 is moved at a speed of from 10 mm/min to 1,000 mm/min mm/min. In addition, the waterjet device 12 further has a lifting mechanism 14 for adjusting the distance between the waterjet device 12 and the chemical mechanical polishing conditioner 10, and adjusting the spacing of the high pressure fluid 13 to act on the polishing. The pressure of the particles 103.

As shown in FIG. 1B, the high-quality abrasive chemical mechanical polishing dresser 10 is a bonding layer 102 composed of a metal solder alloy and abrasive particles. 103 is laid on the surface of the stainless steel substrate 101, and then heat-hardened to make the abrasive particles 103 fixed to the surface of the substrate 101 by the bonding layer 102, that is, the production of the high-quality abrasive chemical mechanical polishing conditioner 10. However, since the abrasive particles 103 contain a part of the risk diamond 104 having a twin crystal structure, an internal crack structure or a low binding ratio of the bonding layer, the present invention will utilize the water jet device 12 (please refer to FIG. 1A together) and the high voltage. The liquid 13 removes the risk diamond 104 from the chemical mechanical polishing conditioner 10, thereby avoiding the scratching and damage of the polishing pad 104 to the polishing pad during the chemical mechanical polishing process.

Example 2

Please refer to FIG. 2. FIG. 2 is a schematic diagram of a chemical mechanical polishing dresser of a high quality abrasive according to Embodiment 2 of the present invention. Embodiment 2 is substantially the same as the apparatus of the high-quality abrasive CMP apparatus 10 described in the foregoing Embodiment 1, except that the nozzle device 120 of Embodiment 1 can control the high-pressure fluid 13 to face the vertical angles. The particles 103 are ground, and the nozzle device 220 of Embodiment 2 can control the high pressure fluid 23 to face the abrasive particles 203 at various angles at the same time, and is more likely to have a risk of having a twin crystal structure, an internal crack structure or a low coverage ratio of the bonding layer. The 204 is detached due to the poor adhesion strength with the bonding layer 202, and the angle of the high-pressure fluid 23 toward the abrasive particles 203 is arbitrarily changed according to the needs of use, and the nozzle device different from the conventional waterjet device is designed as a single nozzle and a single jet. Angle, the conventional water jet device only has the general chip cleaning function, and cannot achieve the function of the risk removing diamond 204 required by the present invention. As shown in FIG. 2, the waterjet device 22 includes four nozzle devices 220, and the nozzle device 220 can control the high pressure fluid 23 (indicated by a dotted arrow in the figure) The abrasive particles 203 are polished toward the surface of the finisher 20 at different angles at the same time, so that the pressures at the respective points acting on the abrasive particles 203 are also different, which promotes the twin crystal structure, the internal crack structure or the bonding layer coverage ratio. Too low a risk diamond 204 can remove the risk diamond 204 from the bonding layer 202 on the substrate 201 to avoid scratching and damage to the polishing pad by the risk diamond 204 during chemical mechanical polishing.

Example 3

Please refer to FIG. 3. FIG. 3 is a schematic diagram of a chemical mechanical polishing dresser of a high quality abrasive according to Embodiment 3 of the present invention. Embodiment 3 is substantially the same as the apparatus of the high-quality abrasive chemical mechanical polishing conditioner 10 described in the foregoing Embodiment 1, except that the waterjet device 12 of Embodiment 1 is a fixed waterjet to make the high pressure The fluid 13 is applied to the fixed position of the abrasive particles 103 by the fixed waterjet device 12 or the nozzle device 120, and the waterjet device 32 of the third embodiment is a rotary waterjet, so that the high pressure fluid 33 is used. The water knife device 32 or the nozzle device 320 is continuously rotated to act on the non-fixed positions of the abrasive particles 303. As shown in FIG. 3, the waterjet device 32 is a rotary waterjet such that the high pressure fluid 33 acts on the surface of the chemical mechanical polishing conditioner 30 by continuously rotating the waterjet device 32 or the nozzle device 320. The non-fixed position of the abrasive particles 303, wherein the water jet device 32 rotates at a speed of 10 rpm to 1050 rpm, and can be arbitrarily changed according to the needs of the user. Since the high pressure fluid 33 acts on the non-fixed position of the abrasive particles 303, the risk of having a twin crystal structure, an internal crack structure, or a low adhesion ratio of the bonding layer is less likely to be caused by the bonding layer 302 on the substrate 301. 304 removed to The processing time of the high pressure fluid 33 acting on the abrasive particles 304 is shortened, and the risk diamond 304 on the chemical mechanical polishing conditioner 30 is effectively removed, thereby increasing the service life of the polishing pad.

In the above-mentioned high-quality abrasive chemical mechanical polishing dresser of the present invention, the waterjet device can be arbitrarily changed according to user requirements, for example, the number of nozzle devices, the nozzle aperture of the nozzle device, and the high-pressure fluid toward the abrasive particles. Angle, fixing mechanism or rotating mechanism design, adjusting the distance between the water jet device and the chemical mechanical polishing dresser by using the lifting mechanism, and further, adjusting the rotation speed of the rotating mechanism, the pressure of the high pressure fluid to act on the abrasive particles, and the conveying device Various parameters such as moving speed to meet user requirements or meet the quality requirements of the abrasive particles; therefore, the high quality abrasive chemical mechanical polishing dresser of the present invention can effectively remove the risk diamonds in the abrasive particles. To avoid the scratches and damage to the polishing pad caused by the risk diamond during the chemical mechanical grinding process.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

10‧‧‧Chemical mechanical polishing dresser

11‧‧‧Conveyor

12‧‧‧Waterjet device

120‧‧‧Nozzle device

13‧‧‧High pressure fluid

14‧‧‧ Lifting mechanism

Claims (17)

A high-quality abrasive chemical mechanical polishing dresser comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding layer, and the plurality of abrasive particles are embedded in the bonding layer The abrasive particles are fixed to the substrate by the bonding layer; wherein the high-quality abrasive chemical mechanical polishing conditioner moves through a water jet device and a high pressure fluid through a conveying device, and the high pressure fluid passes through the water knife The device acts on the abrasive particles to remove one or a plurality of risk diamonds contained in the abrasive particles; the risk diamond has a twin crystal structure, an internal crack structure, or a low coverage ratio of the bonding layer Diamond; the waterjet device includes one or more nozzle devices; the nozzle devices form different spray angles. The chemical mechanical polishing conditioner of the high quality abrasive according to the first aspect of the invention, wherein the waterjet device comprises three to five nozzle devices. A chemical mechanical polishing conditioner for high quality abrasives according to claim 1, wherein the nozzle devices have the same nozzle aperture. A chemical mechanical polishing conditioner for high quality abrasives according to claim 1, wherein the nozzle devices have different nozzle apertures. The chemical mechanical polishing dresser of the high quality abrasive according to claim 1, wherein the water jet device is a fixing mechanism for applying the high pressure fluid to the fixed position of the abrasive particles. A chemical mechanical polishing dresser for high quality abrasive according to claim 1, wherein the water jet device is a rotating mechanism that causes the high pressure fluid to act on the non-fixed position of the abrasive particles. The CMP polishing dresser of the high quality abrasive according to claim 6, wherein the rotating mechanism has a rotational speed of 10 rpm to 1050 rpm. A chemical mechanical polishing conditioner for high quality abrasives according to claim 1, wherein the high pressure fluid is applied to the abrasive particles at a pressure of from 1,000 psi to 32,000 psi. A chemical mechanical polishing dresser of the high quality abrasive according to claim 1, wherein the conveying speed of the conveying device is from 10 mm/min to 1,000 mm/min. The chemical mechanical polishing dresser of the high quality abrasive according to claim 1, wherein the water jet device has a lifting mechanism for adjusting the distance between the water jet device and the high quality abrasive dresser. The chemical mechanical polishing dresser of high quality abrasive according to claim 1, wherein the high pressure flow system is pure water, ultrapure water, and non-corrosive fluid. A chemical mechanical polishing dresser for high quality abrasive according to claim 1, wherein the abrasive particles are synthetic diamonds, natural diamonds, polycrystalline diamonds, or cubic boron nitride. The CMP abrasive dresser of the high quality abrasive according to claim 1, wherein the abrasive particles have a particle size of from 30 micrometers to 600 micrometers. The chemical mechanical polishing dresser of the high quality abrasive according to claim 1, wherein the bonding layer is composed of a ceramic material, a brazing material, a plating material, a metal material, or a polymer material. The chemical mechanical polishing dresser of the high quality abrasive according to claim 14, wherein the brazing material is at least one selected from the group consisting of iron, cobalt, nickel, chromium, manganese, cerium, aluminum, and combinations thereof. Group of. The chemical mechanical polishing dresser of the high-quality abrasive according to claim 14, wherein the polymer material is an epoxy resin, a polyester resin, a polyacrylic resin, or a phenol resin. The CMP polishing dresser of the high quality abrasive according to the first aspect of the invention, wherein the substrate is a stainless steel substrate, a mold steel substrate, a metal alloy substrate, a ceramic substrate, a polymer substrate or a combination thereof.