TWI555103B - Semiconductor device and wedge - shaped engagement device - Google Patents

Semiconductor device and wedge - shaped engagement device Download PDF

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Publication number
TWI555103B
TWI555103B TW103125365A TW103125365A TWI555103B TW I555103 B TWI555103 B TW I555103B TW 103125365 A TW103125365 A TW 103125365A TW 103125365 A TW103125365 A TW 103125365A TW I555103 B TWI555103 B TW I555103B
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Taiwan
Prior art keywords
joint
wedge
bonding
wire
tool
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TW103125365A
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Chinese (zh)
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TW201535549A (en
Inventor
takaaki Akahane
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Toshiba Kk
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Publication of TWI555103B publication Critical patent/TWI555103B/en

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Description

半導體裝置及楔形接合裝置 Semiconductor device and wedge bonding device [相關申請案] [Related application]

本申請案享有以日本專利申請案2014-48845號(申請日：2014年3月12日)為基礎申請案之優先權。本申請案藉由參照該基礎申請案而包含基礎申請案之全部內容。 This application claims priority from the application based on Japanese Patent Application No. 2014-48845 (filing date: March 12, 2014). This application contains the entire contents of the basic application by reference to the basic application.

本發明之實施形態係關於一種半導體裝置及楔形接合裝置。 Embodiments of the present invention relate to a semiconductor device and a wedge bonding device.

於使用楔形接合法之楔形接合中，於將導線接合於焊墊等時，有時因半導體晶片上之接合點與電路基板上之接合點之位置關係或拉繞導線之方向，而產生焊墊間短路或導線之開路。 In the wedge bonding using the wedge bonding method, when a wire is bonded to a pad or the like, a pad is sometimes generated due to a positional relationship between a bonding point on the semiconductor wafer and a bonding point on the circuit substrate or a direction in which the wire is wound. Short circuit or open circuit.

本發明提供一種抑制導線、焊墊間之開路、短路之產生之半導體裝置及製造其之楔形接合裝置。 The present invention provides a semiconductor device for suppressing generation of an open circuit or a short circuit between a wire and a pad, and a wedge bonding device for manufacturing the same.

本實施形態之半導體裝置包括電路基板及搭載於電路基板上之半導體晶片。半導體晶片於其上表面將具有長方形、且成為第1連接區域之接合用焊墊以使其短邊對向之方式於第1方向上排列有至少大於等於兩個。電路基板於上述第1方向上排列有至少大於等於兩個之成為第2連接區域之接合用引線。第1連接區域與對應於其之第2連接區域藉由利用楔形接合法之導線接合，而利用第1接合點、第2接合點、及第3接合點連接。第1及第2接合點具有大致橢圓形，且於第1連接區域上排列形成於與第1方向垂直之第2方向。第3接合點具有大致 橢圓形，且形成於第2連接區域上。第1接合點之長度方向朝向第2方向。於將連接第2接合點與第3接合點之方向作為第3方向之情形時，第2接合點之長度方向以成為係較第2方向更朝向第3方向之方向的方式形成。 The semiconductor device of this embodiment includes a circuit board and a semiconductor wafer mounted on the circuit board. The semiconductor wafer has at least two or more in the first direction in such a manner that the bonding pads having the rectangular shape and the first connection region have the short sides facing each other. In the circuit board, at least two or more bonding leads which are the second connection regions are arranged in the first direction. The first connection region and the second connection region corresponding thereto are joined by a wire bonding method using a wedge bonding method, and are connected by the first bonding point, the second bonding point, and the third bonding point. The first and second joints have a substantially elliptical shape and are arranged in the second direction perpendicular to the first direction in the first joint region. The third joint has a rough It is elliptical and formed on the second connection region. The longitudinal direction of the first joint is oriented in the second direction. When the direction in which the second joint and the third joint are connected is the third direction, the longitudinal direction of the second joint is formed so as to be closer to the third direction than the second direction.

10‧‧‧半導體晶片 10‧‧‧Semiconductor wafer

12‧‧‧焊墊 12‧‧‧ solder pads

14‧‧‧電路基板 14‧‧‧ circuit board

16‧‧‧引線 16‧‧‧ lead

18‧‧‧導線 18‧‧‧Wire

20‧‧‧尾端 20‧‧‧End

25‧‧‧第1接合點 25‧‧‧1st joint

26‧‧‧第2接合點 26‧‧‧2nd junction

27‧‧‧第3接合點 27‧‧‧3rd junction

30、32‧‧‧線 30, 32‧‧‧ line

34‧‧‧楔形工具 34‧‧‧ wedge tool

36‧‧‧按壓面 36‧‧‧ Pressing surface

38‧‧‧貫通孔 38‧‧‧through holes

40‧‧‧接合點 40‧‧‧ joints

42‧‧‧短路 42‧‧‧ Short circuit

44‧‧‧頸部 44‧‧‧ neck

50‧‧‧楔形接合裝置 50‧‧‧Wedge joint device

52‧‧‧架台 52‧‧‧ 台台

54‧‧‧接合平台 54‧‧‧Joining platform

56‧‧‧XY平台 56‧‧‧XY platform

58‧‧‧接合頭 58‧‧‧ Bonding head

60‧‧‧Z馬達 60‧‧‧Z motor

62‧‧‧Z驅動臂 62‧‧‧Z drive arm

64‧‧‧超音波換能器 64‧‧‧Ultrasonic Transducer

66‧‧‧超音波振動子 66‧‧‧Supersonic vibrator

68‧‧‧窗式夾具 68‧‧‧Window fixture

70‧‧‧導線夾 70‧‧‧Wire clamp

72‧‧‧導線捲軸 72‧‧‧ wire reel

74‧‧‧夾具開閉部 74‧‧‧Clamp opening and closing department

76‧‧‧控制部 76‧‧‧Control Department

78‧‧‧記憶體 78‧‧‧ memory

80‧‧‧第1接合程式 80‧‧‧1st joint program

82‧‧‧第2接合程式 82‧‧‧2nd joint program

84‧‧‧第3接合程式 84‧‧‧3rd joint program

86‧‧‧形成環路控制程式 86‧‧‧ Forming a loop control program

92‧‧‧控制程式 92‧‧‧Control program

94‧‧‧控制資料 94‧‧‧Control data

100‧‧‧電腦 100‧‧‧ computer

102‧‧‧XY平台I/F 102‧‧‧XY platform I/F

104‧‧‧Z馬達I/F 104‧‧‧Z motor I/F

106‧‧‧超音波振動子I/F 106‧‧‧Ultrasonic Vibrator I/F

108‧‧‧夾具開閉I/F 108‧‧‧Clamp opening and closing I/F

θ‧‧‧角度 Θ‧‧‧ angle

圖1係本實施形態中之楔形接合裝置之構成圖之一例。 Fig. 1 is a view showing an example of a configuration of a wedge-shaped joining device in the present embodiment.

圖2係模式性地表示楔形接合之概要之俯視圖之一例。 Fig. 2 is a view schematically showing an example of a plan view of a wedge joint.

圖3(a)~(c)係用以按照步驟順序說明本實施形態中之楔形接合之程序之圖之一例。 3(a) to 3(c) are diagrams for explaining an example of a procedure of wedge bonding in the present embodiment in order of steps.

圖4係用以模式性地說明楔形工具之構造之縱剖面圖之一例。 Fig. 4 is a view showing an example of a longitudinal sectional view for schematically explaining the structure of the wedge tool.

圖5(a)~(e)係用以按照步驟順序說明本實施形態中之楔形接合之程序之圖之一例。 5(a) to 5(e) are diagrams for explaining an example of a procedure of wedge bonding in the present embodiment in order of steps.

圖6係表示楔形接合方法之程序之流程圖之一例。 Fig. 6 is a view showing an example of a flow chart of a procedure of the wedge bonding method.

圖7(a)及(b)係於焊墊形成有一個接合點之情形時之俯視圖之一例。 7(a) and 7(b) are diagrams showing an example of a plan view in the case where the bonding pad is formed with one joint.

以下，一面參照圖式一面對實施形態進行說明。再者，圖式係模式性者，厚度與平面尺寸之關係、各層之厚度之比率等未必與實際情況一致。即便於表示相同部分之情形時，亦有根據圖式而相互之尺寸或比率不同地表示之情形。又，關於上下左右之方向，亦表示以半導體基板中之電路形成面側為上之情形時之相對性的方向，未必與以重力加速度方向為基準者一致。於本案說明書與各圖中，關於已經記述之圖，對於與上述者相同之要素標註相同之符號並適當省略詳細之說明。於以下之說明中，為說明之方便起見，存在使用XYZ正交座標系之情形。於該座標系中，將相對於半導體基板之表面而平行之方向且相互正交之2個方向設為X方向及Y方向，將相對於該等X方向及Y 方向之兩者而正交之方向設為Z方向。又，於接合裝置中，將平行於平台移動面之方向且相互正交之2個方向設為X方向及Y方向，將相對於該等X方向及Y方向之兩者而垂直之方向設為Z方向。 Hereinafter, an embodiment will be described with reference to the drawings. Furthermore, the pattern is modeled, the relationship between the thickness and the plane size, the ratio of the thickness of each layer, and the like are not necessarily consistent with the actual situation. In other words, when it is convenient to represent the same portion, there are cases in which the sizes or ratios are different from each other according to the drawings. In addition, the direction of the up, down, left, and right directions also indicates the relative orientation when the circuit forming surface side of the semiconductor substrate is on the upper side, and does not necessarily coincide with the gravity acceleration direction. In the present specification and the drawings, the same reference numerals are given to the same elements as those described above, and the detailed description thereof will be appropriately omitted. In the following description, for the convenience of explanation, there is a case where an XYZ orthogonal coordinate system is used. In the coordinate system, two directions orthogonal to each other in the direction parallel to the surface of the semiconductor substrate are referred to as an X direction and a Y direction, and the X direction and the Y direction are The direction orthogonal to both directions is set to the Z direction. Further, in the bonding apparatus, the two directions orthogonal to the direction in which the land is moved in the plane are orthogonal to the X direction and the Y direction, and the direction perpendicular to the X direction and the Y direction is set to be the vertical direction. Z direction.

(實施形態) (embodiment)

以下，參照圖1~圖7對實施形態進行說明。圖1係本實施形態中所使用之楔形接合裝置50之構成圖之一例。楔形接合裝置50係使用楔形工具34作為楔形接合用之工具，以楔形接合方式形成連接複數個接合對象物之楔形接合之裝置。於本發明之實施形態中，所謂楔形接合法係導線接合之一方法，係指於不在導線前端形成FAB(Free Air Ball，無空氣焊球)之情況下，使用壓力(壓接)、及由超音波振動所產生之能量而將導線接合於焊墊等之接合方式。 Hereinafter, an embodiment will be described with reference to Figs. 1 to 7 . Fig. 1 is an example of a configuration of a wedge bonding apparatus 50 used in the present embodiment. The wedge jointing device 50 uses a wedge-shaped tool 34 as a wedge-shaped joining tool to form a wedge-shaped joining device that connects a plurality of joining objects by wedge bonding. In the embodiment of the present invention, the method of the wire bonding method is a method in which the pressure (crimping) is used without forming a FAB (Free Air Ball) at the tip end of the wire. The bonding of the wire to the bonding pad or the like by the energy generated by the ultrasonic vibration.

如圖1所示，導線接合裝置50具有架台52、保持於架台52上之接合平台54及XY平台56、以及電腦100。接合平台54係載置作為接合對象物之半導體晶片10與電路基板14之接合對象物保持台。圖1表示載置有作為接合對象物之半導體晶片10與電路基板14之狀態。 As shown in FIG. 1, the wire bonding apparatus 50 has a gantry 52, a bonding platform 54 and an XY stage 56 held on the gantry 52, and a computer 100. The bonding stage 54 mounts a bonding object holding stage of the semiconductor wafer 10 and the circuit board 14 as bonding targets. FIG. 1 shows a state in which the semiconductor wafer 10 as the bonding target and the circuit substrate 14 are placed.

接合平台54於載置或排出電路基板14等時，可相對於架台52移動。接合平台54於接合處理之期間固定於架台52。作為接合平台54，可使用例如金屬製之移動台。接合平台54例如連接於楔形接合裝置50之接地電位等基準電位。於與半導體晶片10或電路基板14之間需要絕緣之情形時，可對接合平台54之必要部分實施絕緣處理。 The bonding stage 54 is movable relative to the gantry 52 when the circuit board 14 or the like is placed or discharged. The joining platform 54 is fixed to the gantry 52 during the joining process. As the joining platform 54, a mobile station made of, for example, metal can be used. The bonding stage 54 is connected to, for example, a reference potential such as a ground potential of the wedge bonding device 50. In the case where insulation is required between the semiconductor wafer 10 or the circuit substrate 14, an insulating portion of the bonding platform 54 may be subjected to insulation treatment.

半導體晶片10係將電晶體等積體化於矽基板而形成電子電路者。於半導體晶片10之上表面，作為電子電路之輸入端子與輸出端子等係作為複數個焊墊而引出。半導體晶片10之下表面係矽基板之背面，且係作為電子電路之接地電極。 The semiconductor wafer 10 is formed by integrating a transistor or the like on a germanium substrate to form an electronic circuit. On the upper surface of the semiconductor wafer 10, an input terminal, an output terminal, and the like as an electronic circuit are taken out as a plurality of pads. The lower surface of the semiconductor wafer 10 is the back surface of the substrate and serves as the ground electrode of the electronic circuit.

電路基板14例如係將所期望之配線於環氧樹脂基板上圖案化而成者。電路基板14具有將半導體晶片10之下表面電性及機械性地連接 並固定之晶片焊墊、配置於該晶片焊墊之周圍之複數條引線、及自晶片焊墊或複數條引線引出之作為電路基板之輸入端子與輸出端子。楔形接合係藉由以導線連接半導體晶片10上之焊墊與電路基板14上之引線之間而進行。 The circuit board 14 is formed by, for example, patterning a desired wiring on an epoxy resin substrate. The circuit substrate 14 has electrical and mechanical connection of the lower surface of the semiconductor wafer 10 And a fixed wafer pad, a plurality of leads arranged around the wafer pad, and an input terminal and an output terminal which are taken out from the die pad or the plurality of leads as a circuit substrate. The wedge bonding is performed by connecting wires between the pads on the semiconductor wafer 10 and the leads on the circuit substrate 14 by wires.

窗式夾具68設置於接合平台54上。窗式夾具68係於中央部具有開口之平板狀之構件，用於保持電路基板14。窗式夾具68以電路基板14之引線及半導體晶片10配置於中央部之開口中之方式定位，並且利用開口之周緣部按壓電路基板14，藉此將電路基板14固定於接合平台54。 A window clamp 68 is disposed on the engagement platform 54. The window clamp 68 is a flat member having an opening at the center portion for holding the circuit board 14. The window clamp 68 is positioned such that the lead of the circuit board 14 and the semiconductor wafer 10 are disposed in the opening of the center portion, and the circuit board 14 is pressed by the peripheral edge portion of the opening, whereby the circuit board 14 is fixed to the bonding platform 54.

XY平台56搭載接合頭58。XY平台56係使接合頭58移動至XY平面內之所期望之位置之移動台。XY平面係與架台52之上表面平行之平面。Y方向係與下述之安裝於接合臂(未圖示)之超音波換能器64之長度方向平行之方向。 The XY stage 56 is provided with a bonding head 58. The XY stage 56 is a mobile station that moves the bond head 58 to a desired position within the XY plane. The XY plane is a plane parallel to the upper surface of the gantry 52. The Y direction is a direction parallel to the longitudinal direction of the ultrasonic transducer 64 attached to the engagement arm (not shown) described below.

接合頭58固定並搭載於XY平台56。接合頭58內置有Z馬達60。接合頭58係藉由Z馬達60之驅動而被進行移動控制，且經由Z驅動臂62及超音波換能器64而使楔形工具34向Z方向移動之移動機構。作為Z馬達60，可使用例如線性馬達。 The bonding head 58 is fixed and mounted on the XY stage 56. The joint head 58 has a Z motor 60 built therein. The joint head 58 is a movement mechanism that is moved and controlled by the Z motor 60 and moves the wedge tool 34 in the Z direction via the Z drive arm 62 and the ultrasonic transducer 64. As the Z motor 60, for example, a linear motor can be used.

Z驅動臂62具有超音波換能器64及導線夾70。超音波換能器64係根部安裝於Z驅動臂62。於超音波換能器64之前端部，安裝有插通導線18之楔形工具34。於超音波換能器64安裝有超音波振動子66。超音波換能器64將藉由超音波振動子66驅動而產生之超音波能量傳送至楔形工具34。作為超音波振動子66，可使用例如壓電元件。 The Z drive arm 62 has an ultrasonic transducer 64 and a wire clamp 70. The ultrasonic transducer 64 is attached to the Z drive arm 62 at its root. At the front end of the ultrasonic transducer 64, a wedge tool 34 through which the wire 18 is inserted is mounted. An ultrasonic vibrator 66 is mounted to the ultrasonic transducer 64. The ultrasonic transducer 64 transmits the ultrasonic energy generated by the ultrasonic vibrator 66 to the wedge tool 34. As the ultrasonic vibrator 66, for example, a piezoelectric element can be used.

導線18捲繞於導線捲軸72，該導線捲軸72設置於自接合頭58延伸之導線固持器之前端。導線18自導線捲軸72經由導線夾70而插通至楔形工具34之貫通孔，且自楔形工具34之前端突出。 The wire 18 is wound around a wire reel 72 that is disposed at the front end of the wire holder that extends from the bond head 58. The wire 18 is inserted from the wire reel 72 through the wire clamp 70 into the through hole of the wedge tool 34 and protrudes from the front end of the wedge tool 34.

導線夾70係安裝於Z驅動臂62、且配置於導線18之兩側之1組夾 板。藉由將該對向之夾板之間打開而使導線18為可自由地延伸之狀態，藉由將對向之夾板之間閉合而可使導線18之延伸停止。 The wire clamp 70 is mounted on the Z drive arm 62 and disposed on one side of the wire 18 board. By extending the opposing plates between the opposing plates, the wires 18 are freely extendable, and the extension of the wires 18 can be stopped by closing the opposing plates.

電腦100係整體控制楔形接合裝置50之各要素之動作。電腦100具有作為CPU(Central Processing Unit，中央處理單元)之控制部76、各種介面電路、及記憶體78。該等相互利用內部匯流排96連接。 The computer 100 integrally controls the operation of each element of the wedge engagement device 50. The computer 100 has a control unit 76 as a CPU (Central Processing Unit), various interface circuits, and a memory 78. The interconnects are interconnected by an internal bus 96.

各種介面電路係設置於作為CPU之控制部76與楔形接合裝置50之各要素之間的驅動電路或緩衝電路。圖1中，將介面電路記載為I/F。電腦100具有連接於XY平台56之XY平台I/F102、連接於Z馬達60之Z馬達I/F104、連接於超音波振動子66之超音波振動子I/F106、及連接於夾具開閉部74之夾具開閉I/F108來作為各種介面電路。 The various interface circuits are provided in a drive circuit or a buffer circuit between the control unit 76 of the CPU and each element of the wedge bonding device 50. In Fig. 1, the interface circuit is described as I/F. The computer 100 has an XY stage I/F 102 connected to the XY stage 56, a Z motor I/F 104 connected to the Z motor 60, an ultrasonic vibrator I/F 106 connected to the ultrasonic vibrator 66, and a clip opening/closing unit 74. The jig opens and closes the I/F 108 as various interface circuits.

記憶體78係儲存各種程式與各種控制資料之記憶裝置。各種程式係與第1楔形接合處理相關之第1接合程式80、與第2楔形接合處理相關之第2接合程式82、與第3楔形接合處理相關之第3接合程式84、與環路控制相關之形成環路控制程式86、及與其他控制處理相關之控制程式92。又，記憶體78具有上述各種程式中所使用之控制資料94。 The memory 78 is a memory device that stores various programs and various control data. The first bonding program 80 related to the first wedge bonding process, the second bonding program 82 related to the second wedge bonding process, and the third bonding program 84 related to the third wedge bonding process are related to loop control. The loop control program 86 and the control program 92 associated with other control processes are formed. Further, the memory 78 has the control material 94 used in the above various programs.

圖2係模式性地表示本實施形態之半導體裝置中之楔形接合之概要的俯視圖(自上方觀察之圖)之一例，且表示半導體晶片10及電路基板14之一部分。如圖2所示，電路基板14於其上部具有引線16(焊墊)。電路基板14上之引線16使用例如金(Au)、銅(Cu)、鋁(Al)等導電性材料而形成。 FIG. 2 is a plan view schematically showing an outline of the wedge-shaped bonding in the semiconductor device of the present embodiment (a view seen from above), and shows a part of the semiconductor wafer 10 and the circuit board 14. As shown in FIG. 2, the circuit board 14 has leads 16 (pads) on its upper portion. The lead 16 on the circuit board 14 is formed using a conductive material such as gold (Au), copper (Cu), or aluminum (Al).

半導體晶片10安裝於電路基板14上。於半導體晶片10上形成有焊墊12。於圖中，表示有半導體晶片10之右下部分。於圖中，左上端成為半導體晶片10之中央部。焊墊12使用例如鋁(Al)而形成。焊墊12與引線16使用導線18而連接。導線18使用例如金(Au)、銅(Cu)、鋁(Al)等導電性材料而形成。 The semiconductor wafer 10 is mounted on the circuit substrate 14. A pad 12 is formed on the semiconductor wafer 10. In the figure, the lower right portion of the semiconductor wafer 10 is shown. In the figure, the upper left end becomes the central portion of the semiconductor wafer 10. The pad 12 is formed using, for example, aluminum (Al). Pad 12 and lead 16 are connected using wire 18. The wire 18 is formed using a conductive material such as gold (Au), copper (Cu), or aluminum (Al).

導線18係藉由楔形接合法而接合於焊墊12及引線16。複數個焊 墊12於與半導體晶片10之一邊平行之方向(於圖中為Y方向，以下有時稱為第1方向)上隔開間隔而排列為一行。焊墊12具有長方形，該長方形於相對於第1方向而垂直之方向(於圖中為X方向，以下有時稱為第2方向)上具有長度方向。複數個焊墊12於第1方向上使其短邊對向而排列。 The wire 18 is bonded to the pad 12 and the lead 16 by a wedge bonding method. Multiple welding The pads 12 are arranged in a row at intervals in a direction parallel to one side of the semiconductor wafer 10 (in the Y direction in the drawing, hereinafter sometimes referred to as a first direction). The pad 12 has a rectangular shape having a longitudinal direction in a direction perpendicular to the first direction (in the X direction in the drawing, hereinafter sometimes referred to as a second direction). The plurality of pads 12 are arranged in the first direction with their short sides facing each other.

形成於電路基板14上之引線16以較焊墊12大之間隔排列。引線16對向於焊墊12，且排列於第1方向上。各引線16具有長方形，該長方形於沿著連接引線16與焊墊12之線之方向(以下，有時稱為第3方向)具有長度方向。 The leads 16 formed on the circuit substrate 14 are arranged at a larger interval than the pads 12. The leads 16 are opposed to the pads 12 and arranged in the first direction. Each lead 16 has a rectangular shape having a longitudinal direction in a direction along the line connecting the lead 16 and the pad 12 (hereinafter sometimes referred to as a third direction).

焊墊12之長度方向(第2方向)與連接焊墊12及引線16之線之方向(第3方向)所成之角度，自位於半導體晶片10中央(於圖中為右端)之焊墊12向位於半導體晶片10端部(於圖中為左端)之焊墊12變大。此係因為，焊墊12之間隔較小而密集地排列，相對於此，引線16係較焊墊12之間隔大地排列。 The angle between the longitudinal direction of the pad 12 (the second direction) and the direction of the line connecting the pads 12 and the leads 16 (the third direction) is from the pad 12 located at the center of the semiconductor wafer 10 (the right end in the drawing). The pad 12 located at the end of the semiconductor wafer 10 (left end in the drawing) becomes larger. This is because the gaps of the pads 12 are small and densely arranged, whereas the leads 16 are arranged in a larger arrangement than the gaps of the pads 12.

焊墊12之長度方向(第2方向，下述之線32之方向)與連接焊墊12及引線16之線之方向(第3方向，下述之線30之方向)亦可不一致。半導體晶片10有形成較小面積之要求。因此，形成於半導體晶片10上之圖案以可儘量密集地填充之方式佈局。又，近來伴隨著半導體晶片10之功能之高度化，而產生將焊墊12形成得較多之情形。因此，半導體晶片10上之焊墊12以可於半導體晶片10上密集地佈局，且可形成多個焊墊12之方式，於排列方向上較短地形成。因此，有焊墊12成為於排列方向上具有短邊之長方形之情形。又，焊墊12為了於有限之半導體晶片10上之面積之範圍內儘可能多地佈局，而使鄰接之焊墊12間之間隔儘可能小，以焊墊12之長度方向成為同一方向之方式排列。因此，焊墊12為了使其長度方向與和引線16連接之線之方向一致，而難以傾斜地配置。因此，焊墊12之長度方向(第2方向)與連接焊墊12及引線 16之線之方向(第3方向)不一致之情形較多，於圖中隨著朝向Y方向左側，第2方向與第3方向所成之角度變大。 The longitudinal direction of the pad 12 (the second direction, the direction of the line 32 described below) and the direction of the line connecting the pads 12 and the leads 16 (the third direction, the direction of the line 30 described below) may not coincide. The semiconductor wafer 10 has a requirement to form a small area. Therefore, the pattern formed on the semiconductor wafer 10 is laid out in such a manner as to be as densely packed as possible. Further, recently, with the increase in the function of the semiconductor wafer 10, a large number of pads 12 have been formed. Therefore, the pads 12 on the semiconductor wafer 10 are formed in a short manner in the arrangement direction in such a manner that they can be densely arranged on the semiconductor wafer 10 and a plurality of pads 12 can be formed. Therefore, the pad 12 has a rectangular shape having a short side in the arrangement direction. Moreover, the pads 12 are arranged as much as possible within the area of the limited semiconductor wafer 10, so that the interval between the adjacent pads 12 is as small as possible, and the length direction of the pads 12 is in the same direction. arrangement. Therefore, the bonding pad 12 is difficult to be arranged obliquely in order to make the longitudinal direction thereof coincide with the direction of the line connecting the leads 16. Therefore, the length direction (second direction) of the pad 12 and the connection pads 12 and leads The direction of the line of 16 (the third direction) is often inconsistent, and the angle formed by the second direction and the third direction becomes larger as it goes to the left side in the Y direction in the drawing.

其次，於本實施形態中，對使用楔形接合法將導線18接合於焊墊12及引線16表面之步驟程序之一例進行說明。首先，對本實施形態中之楔形接合法中所使用之楔形工具34進行說明。 Next, in the present embodiment, an example of a procedure for bonding the lead wires 18 to the surfaces of the pads 12 and the leads 16 by the wedge bonding method will be described. First, the wedge tool 34 used in the wedge bonding method in the present embodiment will be described.

圖4表示用以模式性地說明楔形工具34之構造之縱剖面圖之一例。圖4表示楔形工具34於沿著用以插通導線18之貫通孔38之方向之方向上之縱剖面圖。楔形工具34具有用以通過導線18之貫通孔38。貫通孔38例如以自楔形工具34後方朝向底部(下部)貫通楔形工具34之方式形成。楔形工具34於底部具有按壓面36。於接合時，如圖中箭頭所示，導線18自楔形工具34之後方供給至貫通孔38，並自貫通孔38之前端部貫穿至楔形工具34底部，且通過按壓面36下部而向前方橫方向突出。該突出之部分於接合時，例如如下述之圖3(a)~(c)、圖5(a)~(e)所示成為尾端20。 FIG. 4 shows an example of a longitudinal cross-sectional view for schematically explaining the structure of the wedge tool 34. 4 is a longitudinal cross-sectional view showing the wedge tool 34 in a direction along a direction for inserting the through hole 38 of the wire 18. The wedge tool 34 has a through bore 38 for passage through the wire 18. The through hole 38 is formed, for example, from the rear of the wedge tool 34 toward the bottom (lower portion) through the wedge tool 34. The wedge tool 34 has a pressing surface 36 at the bottom. At the time of joining, as shown by the arrow in the figure, the wire 18 is supplied from the rear of the wedge tool 34 to the through hole 38, and penetrates from the front end of the through hole 38 to the bottom of the wedge tool 34, and passes forward through the lower portion of the pressing surface 36. The direction is outstanding. The protruding portion is the trailing end 20 as shown in Figs. 3(a) to (c) and Figs. 5(a) to 5(e), for example, at the time of joining.

再者，如上所述，自按壓面36通過貫通孔38並朝向楔形工具34後方之方向，於楔形接合時成為接合之接合方向，並且亦成為楔形工具34之移動方向。即，楔形工具34具有特定之接合方向及移動方向。因此，於使用楔形工具34之楔形接合時，為了使楔形工具34之方向與接合方向一致，而使楔形工具34旋轉，或使電路基板14旋轉。 Further, as described above, the self-pressing surface 36 passes through the through hole 38 and faces the rear of the wedge tool 34, becomes the joining direction of the joining at the time of the wedge engagement, and also becomes the moving direction of the wedge tool 34. That is, the wedge tool 34 has a specific joining direction and moving direction. Therefore, when the wedge-shaped joining of the wedge-shaped tool 34 is used, the wedge-shaped tool 34 is rotated or the circuit board 14 is rotated in order to make the direction of the wedge-shaped tool 34 coincide with the joining direction.

圖3(a)~(c)、及圖5(a)~(e)係用以按照步驟順序說明藉由導線18而將焊墊12與引線16之間連接(接合)之程序之圖之一例。圖6係表示楔形接合方法之程序之流程圖之一例。楔形接合方法之各程序對應於儲存於電腦100之記憶體78之各程式之處理程序，藉由控制部76而控制。以下，一面參照圖3(a)~(c)、圖5(a)~(e)、圖6、及圖7一面進行說明。本實施形態中，導線18首先接合於半導體晶片10上之焊墊12(第1連接區域)，其次接合於電路基板14上之引線16(第2連接區 域)。 3(a) to (c), and Figs. 5(a) to 5(e) are diagrams for explaining the procedure for connecting (joining) the bonding pad 12 and the lead 16 by the wire 18 in order of steps. An example. Fig. 6 is a view showing an example of a flow chart of a procedure of the wedge bonding method. Each program of the wedge bonding method is controlled by the control unit 76 corresponding to the processing program of each program stored in the memory 78 of the computer 100. Hereinafter, the description will be given with reference to FIGS. 3(a) to 3(c) and FIGS. 5(a) to 5(e), FIG. 6, and FIG. In the present embodiment, the lead wire 18 is first bonded to the pad 12 (first connection region) on the semiconductor wafer 10, and secondarily to the lead 16 on the circuit substrate 14 (second connection region). area).

首先，將搭載有作為接合對象物之半導體晶片10之電路基板14定位設置於接合平台54上，藉由窗式夾具68而固定。接合平台54位於初始狀態之場所。導線18自楔形工具34之後方傾斜地供給至楔形工具34之貫通孔38。導線18之前端部自楔形工具34前端突出特定之長度。如上所述，該突出之部分其後成為尾端20。 First, the circuit board 14 on which the semiconductor wafer 10 as the bonding target is mounted is positioned on the bonding stage 54 and fixed by the window clamp 68. The joining platform 54 is located in an initial state. The wire 18 is supplied obliquely from behind the wedge tool 34 to the through hole 38 of the wedge tool 34. The front end of the wire 18 projects a specific length from the front end of the wedge tool 34. As described above, the protruding portion thereafter becomes the trailing end 20.

其次，藉由控制部76而執行第1接合程式80。藉由第1接合程式80，控制部76輸出於焊墊12上形成第1接合點25之信號(指令)。藉由該指令而將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60，從而將楔形工具34移動至焊墊12之第1接合點25之預定形成位置上方(S101)。 Next, the first joining program 80 is executed by the control unit 76. The control unit 76 outputs a signal (command) for forming the first bonding point 25 on the pad 12 by the first bonding program 80. The signals from the XY stage I/F 62 and the Z motor I/F 64 are output to the XY stage 56 and the Z motor 60 by the command, thereby moving the wedge tool 34 to the predetermined formation position of the first joint 25 of the pad 12. Above (S101).

第1接合點25之預定形成位置設定於半導體晶片10之焊墊12上、且於圖3(a)中為X方向上側之位置，且作為座標資料儲存於控制資料94。楔形工具34之精密之位置控制係使用定位照相機等(未圖示)而進行。 The predetermined formation position of the first bonding pad 25 is set on the pad 12 of the semiconductor wafer 10, and is located on the upper side in the X direction in FIG. 3(a), and is stored as the coordinate data in the control material 94. The precise position control of the wedge tool 34 is performed using a positioning camera or the like (not shown).

其次，將來自XY平台I/F62與Z馬達I/F64之信號(指令)輸出至XY平台56與Z馬達60，以使楔形工具34之方向朝向第2方向(於圖中為X方向)之方式進行調整(S102)。繼而，將來自XY平台I/F62與Z馬達I/F64之信號(指令)輸出至XY平台56與Z馬達60，而使楔形工具34下降至焊墊12表面為止。 Next, the signals (commands) from the XY stage I/F 62 and the Z motor I/F 64 are output to the XY stage 56 and the Z motor 60 so that the direction of the wedge tool 34 faces the second direction (X direction in the figure). The mode is adjusted (S102). Then, signals (instructions) from the XY stage I/F 62 and the Z motor I/F 64 are output to the XY stage 56 and the Z motor 60, and the wedge tool 34 is lowered to the surface of the pad 12.

焊墊12中，於第1接合點25之預定形成位置上，於楔形工具34之按壓面36與焊墊12之間夾入有導線18，導線18被按壓於焊墊12表面。其次，將來自超音波振動子I/F106之信號(指令)輸出至超音波振動子66，使超音波振動子66動作。藉此，對按壓面36施加超音波振動。藉由被施加至按壓面36之超音波振動能量與利用Z馬達60之驅動控制而產生之按壓力，而將導線18接合於焊墊12。繼而，將來自XY平台 I/F62與Z馬達I/F64之信號(指令)輸出至XY平台56與Z馬達60，而使楔形工具34向按壓面36自第1接合點25離開之方向上升。 In the pad 12, at a predetermined position of the first bonding point 25, a wire 18 is sandwiched between the pressing surface 36 of the wedge tool 34 and the pad 12, and the wire 18 is pressed against the surface of the pad 12. Next, the signal (command) from the ultrasonic vibrator I/F 106 is output to the ultrasonic vibrator 66, and the ultrasonic vibrator 66 is operated. Thereby, ultrasonic vibration is applied to the pressing surface 36. The wire 18 is bonded to the pad 12 by the ultrasonic vibration energy applied to the pressing surface 36 and the pressing force generated by the driving control of the Z motor 60. Then, will come from the XY platform The signals (commands) of the I/F 62 and the Z motor I/F 64 are output to the XY stage 56 and the Z motor 60, and the wedge tool 34 is raised in the direction in which the pressing surface 36 is separated from the first joint point 25.

如此一來，如圖3(a)、圖5(a)所示，執行第1楔形接合處理，於焊墊12上形成第1接合點25(S103)。第1接合點25之接合面如圖3(a)等所示，俯視時具有大致橢圓形，其長度方向(接合方向)成為與線32相同之方向(第2方向)。又，尾端20於第2方向(於圖中為X方向)上延伸，故而接觸於鄰接之焊墊12之可能性非常低。 As a result, as shown in FIGS. 3(a) and 5(a), the first wedge bonding process is performed to form the first bonding point 25 on the pad 12 (S103). As shown in Fig. 3 (a) and the like, the joint surface of the first joint 25 has a substantially elliptical shape in plan view, and its longitudinal direction (joining direction) is the same direction as the line 32 (second direction). Further, the trailing end 20 extends in the second direction (X direction in the drawing), so that the possibility of contact with the adjacent pads 12 is extremely low.

其次，藉由控制部76而執行第2接合程式82。藉由第2接合程式82，控制部76輸出於引線16形成第2接合點26之指令。藉由該指令而將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60，從而將楔形工具34移動至引線16內之第2接合點26上方(S104)。 Next, the second engagement program 82 is executed by the control unit 76. The control unit 76 outputs a command for forming the second bonding point 26 on the lead 16 by the second bonding program 82. The signals from the XY stage I/F 62 and the Z motor I/F 64 are output to the XY stage 56 and the Z motor 60 by the command, thereby moving the wedge tool 34 above the second joint 26 in the lead 16 (S104) .

第2接合點26之位置設定於焊墊12(焊墊12)上之第1接合點25之晶片端側，且作為座標資料儲存於控制資料94。楔形工具34之精密之位置控制係使用定位照相機等(未圖示)而進行。 The position of the second bonding point 26 is set on the wafer end side of the first bonding pad 25 on the pad 12 (pad 12), and is stored as the coordinate data in the control material 94. The precise position control of the wedge tool 34 is performed using a positioning camera or the like (not shown).

又，將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60，以楔形工具34之方向朝向第3方向之方式進行調整(S105)。藉此，楔形工具34朝向與線30大致相同之方向(第3方向)。再者，楔形工具34之方向之調整除了於使楔形工具34移動至第2接合點26上方之後進行以外，亦可一面使楔形工具34向第2接合點26上方移動一面進行。 Further, the signals from the XY stage I/F 62 and the Z motor I/F 64 are output to the XY stage 56 and the Z motor 60, and the direction of the wedge tool 34 is adjusted so as to face the third direction (S105). Thereby, the wedge tool 34 faces in substantially the same direction (third direction) as the line 30. Further, the adjustment of the direction of the wedge tool 34 may be performed after the wedge tool 34 is moved over the second joint 26, and the wedge tool 34 may be moved upward over the second joint 26.

繼而，將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60，而使楔形工具34下降至引線16表面為止，將導線18按壓於引線16表面之第2接合點26之預定形成位置。於第2接合點26之預定形成位置上，於楔形工具34之按壓面36與焊墊12之間夾入導線18，導線18被按壓於引線16表面。 Then, the signals from the XY stage I/F 62 and the Z motor I/F 64 are output to the XY stage 56 and the Z motor 60, and the wedge tool 34 is lowered to the surface of the lead 16, and the wire 18 is pressed against the surface of the lead 16 The predetermined location of the joint 26 is formed. At a predetermined formation position of the second joint 26, the wire 18 is sandwiched between the pressing surface 36 of the wedge tool 34 and the pad 12, and the wire 18 is pressed against the surface of the lead 16.

其次，將來自超音波振動子I/F106之信號輸出至超音波振動子 66，使超音波振動子66動作。藉此，對按壓面36施加超音波振動。藉由被施加至按壓面36之超音波振動能量與利用Z馬達60之驅動控制而產生之按壓力，而將導線18與焊墊12接合。如此一來，如圖3(b)及圖5(b)所示，執行焊墊12上之第2楔形接合處理而形成第2接合點26(S106)。 Second, the signal from the ultrasonic vibrator I/F 106 is output to the ultrasonic vibrator. 66, the ultrasonic vibrator 66 is operated. Thereby, ultrasonic vibration is applied to the pressing surface 36. The wire 18 is bonded to the pad 12 by the ultrasonic vibration energy applied to the pressing surface 36 and the pressing force generated by the driving control of the Z motor 60. As a result, as shown in FIGS. 3(b) and 5(b), the second wedge bonding process on the bonding pad 12 is performed to form the second bonding point 26 (S106).

第2接合點26之接合面如圖3(b)所示，俯視時具有橢圓形，其長度方向(接合方向)成為與連接焊墊12及引線16之線30大致相同之方向(第3方向)。 As shown in Fig. 3(b), the joint surface of the second joint 26 has an elliptical shape in plan view, and its longitudinal direction (joining direction) is substantially the same direction as the line 30 connecting the pads 12 and the leads 16 (third direction). ).

再者，該楔形工具34之方向或第2接合點26之長度方向之精度受制於楔形接合裝置50之精度，並不限定於嚴格地與和線30相同之方向(即第3方向)一致。又，存在根據裝置不同而精度不同之情形，故而偏移量亦不固定。即，楔形工具34之方向或第2接合點26之長度方向，存在較線32與線30所成之角度θ大之情形，亦存在較線32與線30所成之角度θ小之情形。又，接合點25、26、27之接合形狀具有大致橢圓形，但有時亦因接合中之導線18之壓扁情況而於長度方向產生不均。 Further, the accuracy of the direction of the wedge tool 34 or the longitudinal direction of the second joint 26 is limited to the precision of the wedge bonding apparatus 50, and is not limited to strictly coincide with the direction (i.e., the third direction) which is the same as the line 30. Further, there are cases in which the accuracy differs depending on the device, and therefore the offset is not fixed. That is, the direction of the wedge tool 34 or the longitudinal direction of the second joint 26 may be larger than the angle θ formed by the line 32 and the line 30, and may be smaller than the angle θ formed by the line 32 and the line 30. Further, the joint shape of the joints 25, 26, and 27 has a substantially elliptical shape, but unevenness may occur in the longitudinal direction due to the flattening of the wires 18 during the joining.

因此，楔形工具34之方向或第2接合點26之長度方向，只不過係指較線32之方向(第2方向)更朝向線30之方向(第3方向)之方向、自線32向線30之方向旋轉任意角度之方向，並不係指嚴格地與線30之方向(第3方向)相同之方向。又，由於相同之理由，楔形工具34之方向或第1接合點25之長度方向只不過係指於不接觸於尾端20所鄰接之焊墊12之範圍相對於線32之方向(第2方向)而交叉之方向、或與線32之方向(第2方向)相同之方向，並不係指嚴格地限制為與線32之方向(第2方向)相同之方向。 Therefore, the direction of the wedge tool 34 or the longitudinal direction of the second joint 26 is simply the direction of the line 32 (the second direction) toward the direction of the line 30 (the third direction), from the line 32 to the line. The direction in which the direction of 30 is rotated by an arbitrary angle does not mean the direction strictly in the same direction as the direction of the line 30 (the third direction). Moreover, for the same reason, the direction of the wedge tool 34 or the longitudinal direction of the first joint 25 is merely a direction that does not contact the vicinity of the pad 12 adjacent to the trailing end 20 with respect to the direction of the line 32 (the second direction) The direction of the intersection or the direction of the line 32 (the second direction) is not strictly limited to the same direction as the direction of the line 32 (the second direction).

繼而，如圖5(c)、(d)所示，藉由控制部76而執行形成環路控制程式86。藉由形成環路控制程式86，控制部76輸出如下之信號(指令)， 即對楔形工具34進行操作，而自焊墊12(第1連接區域)上之第2接合點26，朝向引線16(第2連接區域)上之第3接合點27方向形成導線18之環路形狀(圓弧形狀)。藉由該指令，而將來自XY平台I/F102、Z馬達I/F104及夾具開閉I/F108之信號輸出至XY平台56、Z馬達60及導線夾70。於是，楔形接合裝置50如圖5(c)所示，於打開導線夾70之狀態下以使楔形工具34向上方上升之方式被驅動。 Then, as shown in FIGS. 5(c) and (d), the loop control program 86 is executed by the control unit 76. By forming the loop control program 86, the control unit 76 outputs a signal (instruction) as follows. That is, the wedge tool 34 is operated, and the second bonding point 26 on the bonding pad 12 (first connection region) forms a loop of the wire 18 toward the third bonding point 27 on the lead 16 (second connection region). Shape (arc shape). By this command, signals from the XY stage I/F 102, the Z motor I/F 104, and the jig opening/closing I/F 108 are output to the XY stage 56, the Z motor 60, and the lead clamp 70. Then, as shown in FIG. 5(c), the wedge bonding device 50 is driven to open the wedge tool 34 in a state where the wire clamp 70 is opened.

其次，將來自XY平台I/F102及Z馬達I/F104之信號輸出至XY平台56及Z馬達60。藉此，XY平台56及Z馬達60被移動驅動，藉此，楔形工具34向引線16內之第3接合點27之預定形成位置移動。第3接合點27之預定形成位置設定於電路基板14上之引線16上，且作為座標資料儲存於控制資料94。 Next, signals from the XY stage I/F 102 and the Z motor I/F 104 are output to the XY stage 56 and the Z motor 60. Thereby, the XY stage 56 and the Z motor 60 are moved and driven, whereby the wedge tool 34 moves to a predetermined forming position of the third joint 27 in the lead 16. The predetermined formation position of the third bonding point 27 is set on the lead 16 on the circuit board 14, and is stored as the coordinate data in the control material 94.

於楔形工具34向第3接合點27預定形成位置移動之期間，導線18自導線捲軸72陸續送出，自楔形工具34之前端延伸出必要之導線長度。藉此，如圖5(d)、(e)所示，導線18一面進行塑性變形，一面以朝向第3接合點27描畫環路形狀(圓弧形狀)之方式延伸(將此稱為形成環路)(S107)。 During the predetermined positional movement of the wedge tool 34 to the third joint 27, the wire 18 is successively fed from the wire spool 72, extending the necessary wire length from the front end of the wedge tool 34. As a result, as shown in FIGS. 5(d) and 5(e), the lead wire 18 is plastically deformed while extending in a loop shape (arc shape) toward the third joint 27 (this is called forming a loop). Road) (S107).

此時，結合於楔形工具34之移動，導線18被楔形工具34拉伸，故而經由導線18而於第2接合點26產生拉伸應力。然後，楔形工具34一面進行形成環路一面向第3接合點27預定形成位置之上方移動(S108)。 At this time, in conjunction with the movement of the wedge tool 34, the wire 18 is stretched by the wedge tool 34, so that tensile stress is generated at the second joint 26 via the wire 18. Then, the wedge-shaped tool 34 is moved upward to form a loop and faces the predetermined position of the third joint 27 (S108).

其次，藉由控制部76而執行第3接合程式84。藉由第3接合程式84，控制部76輸出於引線16形成第3接合點27之信號(指令)。此時，楔形工具34朝向線30方向(第3方向)。引線16(焊墊)具有長方形，其長度方向朝向線30方向(第3方向)。 Next, the third joining program 84 is executed by the control unit 76. The control unit 76 outputs a signal (command) for forming the third junction 27 on the lead 16 by the third bonding program 84. At this time, the wedge tool 34 faces the direction of the line 30 (the third direction). The lead 16 (pad) has a rectangular shape whose longitudinal direction faces the direction of the line 30 (third direction).

繼而，將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60，使楔形工具34下降至引線16表面為止，使導線18按壓於 引線16上之第3接合點27之預定形成位置。藉此，於引線16中，導線18被夾入於楔形工具34之按壓面36與引線16之間，導線18被按壓於引線16表面。 Then, signals from the XY stage I/F 62 and the Z motor I/F 64 are output to the XY stage 56 and the Z motor 60, and the wedge tool 34 is lowered to the surface of the lead 16 to press the wire 18 to The predetermined position of the third joint 27 on the lead 16 is formed. Thereby, in the lead 16, the wire 18 is sandwiched between the pressing surface 36 of the wedge tool 34 and the lead 16, and the wire 18 is pressed against the surface of the lead 16.

其次，將來自超音波振動子I/F106之信號輸出至超音波振動子66，使超音波振動子66動作。藉此，對按壓面36施加超音波振動。藉由施加至按壓面36之超音波振動能量與利用Z馬達60之驅動控制而產生之按壓力，將導線18與引線16接合。如此一來，進行引線16上之第3楔形接合處理，如圖3(c)及圖5(e)所示，形成第3接合點27(S109)。 Next, the signal from the ultrasonic vibrator I/F 106 is output to the ultrasonic vibrator 66, and the ultrasonic vibrator 66 is operated. Thereby, ultrasonic vibration is applied to the pressing surface 36. The wire 18 is joined to the lead 16 by the ultrasonic vibration energy applied to the pressing surface 36 and the pressing force generated by the drive control of the Z motor 60. In this manner, the third wedge bonding process on the lead 16 is performed, and as shown in FIGS. 3(c) and 5(e), the third bonding point 27 is formed (S109).

第3接合點27之接合面如圖3(c)所示，俯視時具有橢圓形，其長度方向(接合方向)朝向與線30大致相同之方向、即第3方向。 As shown in FIG. 3(c), the joint surface of the third joint 27 has an elliptical shape in a plan view, and its longitudinal direction (joining direction) faces a direction substantially the same as the line 30, that is, a third direction.

再者，由於與和楔形工具34之方向或第2接合點26之長度方向之精度相關之理由相同之理由，楔形工具34之方向或第3接合點27之長度方向只不過係指較線32之方向(第2方向)更朝向線30之方向(第3方向)之方向、自線32向線30之方向旋轉任意角度之方向，並不係指嚴格地與線30之方向(第3方向)相同之方向。 Further, since the reason for the accuracy of the direction of the wedge tool 34 or the longitudinal direction of the second joint 26 is the same, the direction of the wedge tool 34 or the length direction of the third joint 27 is merely the line 32. The direction (the second direction) is more toward the direction of the line 30 (the third direction), and the direction from the line 32 to the direction of the line 30 is rotated by an arbitrary angle, and does not mean strictly in the direction of the line 30 (the third direction). ) the same direction.

繼而，將來自XY平台I/F62、Z馬達I/F64及夾具開閉I/F108之信號輸出至XY平台56、Z馬達60及導線夾70。藉此，於將楔形工具34固定之情況下夾著導線18而拉伸，將導線18於第3接合點27後方切斷(S110)。根據以上方法而可形成本實施形態之楔形接合。 Then, signals from the XY stage I/F 62, the Z motor I/F 64, and the jig opening/closing I/F 108 are output to the XY stage 56, the Z motor 60, and the lead clamp 70. Thereby, when the wedge tool 34 is fixed, the wire 18 is stretched with the wire 18 interposed therebetween, and the wire 18 is cut after the third joint 27 (S110). According to the above method, the wedge bonding of this embodiment can be formed.

此處，例如，設想如下情形：未於焊墊12上設置如上述所說明之第1接合點25及第2接合點26般使長度方向(接合方向)不同之兩個接合點，如圖7(a)所示，形成長度方向(接合方向)朝向連接焊墊12與引線16之方向(線30方向)之一個接合點40。 Here, for example, it is assumed that two joint points having different length directions (joining directions) are not provided on the pad 12 as in the first joint 25 and the second joint 26 described above, as shown in FIG. As shown in (a), the longitudinal direction (joining direction) is formed toward one joint 40 of the direction in which the bonding pads 12 and the leads 16 are connected (the direction of the line 30).

於該情形時，導線18朝向線30之方向，故而尾端20前端向鄰接之焊墊12方向突出。鄰接之焊墊12間之距離較小，故而存在尾端20接觸於鄰接之焊墊12而於鄰接焊墊12間產生短路42之可能性。 In this case, the wire 18 faces the direction of the wire 30, so that the front end of the tail end 20 protrudes in the direction of the adjacent pad 12. The distance between adjacent pads 12 is small, so there is a possibility that the tail end 20 will contact the adjacent pads 12 to create a short circuit 42 between adjacent pads 12.

本實施形態中，第1接合點25之長度方向(接合方向)朝向焊墊12之長度方向(線32方向，於圖中為X方向)，故而尾端20亦朝向線32之方向。因此，尾端20接觸於鄰接之焊墊12之可能性極小。藉此，於鄰接焊墊12間產生短路之可能性極小。 In the present embodiment, the longitudinal direction (joining direction) of the first joint 25 is directed in the longitudinal direction of the pad 12 (the direction of the line 32, in the X direction in the drawing), and therefore the trailing end 20 is also oriented in the direction of the line 32. Therefore, the possibility that the tail end 20 is in contact with the adjacent pads 12 is extremely small. Thereby, the possibility of a short circuit between the adjacent pads 12 is extremely small.

又，例如設想如下情形：未於焊墊12上設置如上述所說明之第1接合點25及第2接合點26般使長度方向(接合方向)不同之兩個接合點，而如圖7(b)所示，形成長度方向(接合方向)朝向焊墊12之長度方向(線32方向，於圖中為X方向)之一個接合點40。於該情形時，接合點40之長度方向朝向線32之方向。 Further, for example, it is assumed that two joint points having different length directions (joining directions) are not provided on the pad 12 as in the first joint 25 and the second joint 26 described above, and as shown in FIG. 7 ( As shown in b), one joint point 40 in the longitudinal direction (joining direction) toward the longitudinal direction of the pad 12 (the direction of the line 32, in the X direction in the drawing) is formed. In this case, the length direction of the joint 40 is oriented in the direction of the line 32.

於該狀態下進行形成環路之情形時，在導線18之環路形成時施加之拉伸力向線30方向施加，但接合點40之接合方向與由導線18產生之拉伸力所施加之方向不同。因此，藉由由導線18產生之拉伸力，而使應力集中於接合點40端之一側之頸部44，故而有於該部位產生損傷(龜裂)而產生開路(斷線)不良之可能性。 When the loop is formed in this state, the tensile force applied at the time of forming the loop of the wire 18 is applied in the direction of the line 30, but the joining direction of the joint 40 is applied to the tensile force generated by the wire 18. The direction is different. Therefore, the stress is concentrated on the neck portion 44 on one side of the joint 40 by the tensile force generated by the wire 18, so that damage (cracking) occurs at the portion and an open circuit (broken wire) is generated. possibility.

本實施形態中，第2接合點26之長度方向(接合方向)朝向連接焊墊12與引線16之方向(線30方向，第3方向)。因此，於導線18之環路形成時施加之應力不會集中於頸部。因此，於該部位產生之龜裂受到抑制，從而產生導線18之開路(斷線)不良之可能性極小。 In the present embodiment, the longitudinal direction (joining direction) of the second joint 26 is directed in the direction in which the bonding pad 12 and the lead 16 are connected (the direction of the line 30, the third direction). Therefore, the stress applied when the loop of the wire 18 is formed does not concentrate on the neck. Therefore, cracks generated at the portion are suppressed, and there is little possibility that the open circuit (broken wire) of the wire 18 is defective.

如以上所說明般，根據本實施形態，於半導體晶片10上之焊墊12具有第1接合點25與第2接合點26。於第1接合點25，其長度方向(接合方向)朝向焊墊12之長度方向、即線32方向，故而尾端20亦朝向線32之方向。即，尾端20不朝向鄰接之焊墊12之方向。藉此，可抑制尾端20接觸於鄰接之焊墊12，可抑制鄰接之焊墊12間之短路之產生。 As described above, according to the present embodiment, the pad 12 on the semiconductor wafer 10 has the first bonding point 25 and the second bonding point 26. At the first joint 25, the longitudinal direction (joining direction) is directed in the longitudinal direction of the pad 12, that is, in the direction of the line 32, so that the trailing end 20 also faces the direction of the line 32. That is, the trailing end 20 does not face the direction of the adjacent pads 12. Thereby, it is possible to prevent the tail end 20 from coming into contact with the adjacent pads 12, and it is possible to suppress the occurrence of a short circuit between the adjacent pads 12.

又，本實施形態中，第2接合點26之長度方向(接合方向)朝向電路基板14上之引線16(引線16上之第3接合點27)之方向。藉此，可抑制於第2接合點26端之頸部產生由形成導線18之環路時所施加之應力 所致之龜裂，從而可抑制導線18之開路不良之產生。 Further, in the present embodiment, the longitudinal direction (joining direction) of the second joint 26 is directed in the direction of the lead 16 (the third joint 27 on the lead 16) on the circuit board 14. Thereby, it is possible to suppress the stress applied to the neck portion at the end of the second joint 26 by the loop forming the wire 18. The resulting cracking can suppress the occurrence of poor opening of the wire 18.

即，藉由應用本實施形態，可防止因導線18之尾端20之接觸所致之焊墊間短路，且抑制接合部分之導線頸部之損傷而抑制導線開路，進而提高導線連接之良率。 That is, by applying this embodiment, it is possible to prevent a short circuit between the pads due to the contact of the trailing end 20 of the wire 18, and to suppress the damage of the wire neck portion of the joint portion, thereby suppressing the wire open circuit, thereby improving the wire bond yield. .

(其他實施形態) (Other embodiments)

上述所說明之實施形態可應用於各種半導體裝置。例如，亦可應用於NAND型或NOR型之快閃記憶體、EPROM(erasable programmable read only memory，可抹除可程式化唯讀記憶體)、或DRAM(Dynamic Random Access Memory，動態隨機存取記憶體)、SRAM(static random access memory，靜態隨機存取記憶體)、及其他半導體記憶裝置、或各種邏輯元件、其他半導體裝置。 The embodiments described above are applicable to various semiconductor devices. For example, it can also be applied to NAND type or NOR type flash memory, EPROM (erasable programmable read only memory), or DRAM (Dynamic Random Access Memory). Body, SRAM (static random access memory), and other semiconductor memory devices, or various logic elements, other semiconductor devices.

如上所述，對本發明之幾個實施形態進行了說明，但該等實施形態係作為例而提出者，並不意圖限定發明之範圍。該等新穎之實施形態能以其他各種形態實施，可於不脫離發明之主旨之範圍內進行各種省略、置換、變更。該等實施形態或其變化包含於發明之範圍或主旨，並且包含於申請專利範圍所記載之發明及其均等之範圍。 The embodiments of the present invention have been described above, but the embodiments are presented as examples and are not intended to limit the scope of the invention. The present invention can be implemented in various other forms, and various omissions, substitutions and changes can be made without departing from the spirit of the invention. The scope of the invention and the scope of the invention are intended to be included within the scope of the invention and the scope of the invention.

10‧‧‧半導體晶片 10‧‧‧Semiconductor wafer

12‧‧‧焊墊 12‧‧‧ solder pads

14‧‧‧電路基板 14‧‧‧ circuit board

16‧‧‧引線 16‧‧‧ lead

18‧‧‧導線 18‧‧‧Wire

20‧‧‧尾端 20‧‧‧End

25‧‧‧第1接合點 25‧‧‧1st joint

26‧‧‧第2接合點 26‧‧‧2nd junction

27‧‧‧第3接合點 27‧‧‧3rd junction

30、32‧‧‧線 30, 32‧‧‧ line

θ‧‧‧角度 Θ‧‧‧ angle

Claims (5)

一種半導體裝置，其包括：電路基板；及半導體晶片，其搭載於上述電路基板上；且上述半導體晶片於其上表面以相互之長邊對向之方式，於第1方向排列有兩個以上之具有長方形之第1連接區域，上述電路基板於上述第1方向排列有至少兩個以上之第2連接區域，上述第1連接區域之第1及第2接合點和對應於上述第1連接區域之上述第2連接區域之第3接合點係利用一導線而連接，上述第1及第2接合點係於上述第1連接區域上排列形成於與第1方向交叉之第2方向，上述第1接合點之長度方向朝向上述第2方向，於將連接上述第2接合點與上述第3接合點之方向作為第3方向之情形時，第2接合點之長度方向係較上述第2方向更朝向上述第3方向。 A semiconductor device comprising: a circuit board; and a semiconductor wafer mounted on the circuit board; wherein the semiconductor wafer has two or more rows arranged in a first direction on a front surface thereof facing each other with a long side opposite to each other a first connection region having a rectangular shape, wherein the circuit board has at least two or more second connection regions arranged in the first direction, and the first and second junctions of the first connection region and the first connection region The third joint of the second connection region is connected by a single wire, and the first and second joints are arranged in the first connection region in a second direction intersecting with the first direction, and the first joint When the length direction of the dot faces the second direction, when the direction in which the second joint and the third joint are connected is the third direction, the longitudinal direction of the second joint is more toward the second direction than the second direction. The third direction. 如請求項1之半導體裝置，其中上述第2接合點之長度方向平行於上述第3方向。 The semiconductor device of claim 1, wherein a length direction of the second bonding point is parallel to the third direction. 如請求項1之半導體裝置，其中上述第2接合點之長度方向為與上述第3接合點之長度方向相同之方向。 The semiconductor device according to claim 1, wherein the longitudinal direction of the second joint is the same direction as the longitudinal direction of the third joint. 一種楔形接合裝置，其包括：平台，其可載置搭載有半導體晶片之電路基板；接合臂，其可安裝用以進行接合之工具；及控制部，其控制上述工具之動作；且於上述半導體晶片上具有第1連接區域，上述第1連接區域於 第1方向上排列有複數個，各者具有長方形，且其長度方向朝向與第1方向交叉之第2方向，於上述電路基板上具有第2連接區域，上述第2連接區域分別具有長方形，且其長度方向朝向連接上述第1連接區域與上述第2連接區域之第3方向，上述控制部進行如下控制：使上述工具移動至上述第1連接區域內之第1接合點上，形成上述第1接合點，且使上述工具移動至在上述第1連接區域內且沿著上述第2方向相鄰於第1接合點之第2接合點上，於將連接上述第1連接區域與第2連接區域之方向作為第3方向之情形時，以成為較上述第2方向更朝向上述第3方向之方向的方式控制上述工具來形成第2接合點，使上述工具以朝向上述第3方向之狀態一面進行形成環路一面移動至上述第2連接區域內之第3接合點上而形成第3接合點。 A wedge bonding apparatus comprising: a platform on which a circuit substrate on which a semiconductor wafer is mounted; an engagement arm that can be mounted with a tool for bonding; and a control unit that controls an operation of the tool; and the semiconductor The wafer has a first connection region, and the first connection region is a plurality of pixels are arranged in the first direction, each of which has a rectangular shape, and a longitudinal direction thereof faces a second direction intersecting the first direction, and has a second connection region on the circuit board, and the second connection region has a rectangular shape, and The longitudinal direction thereof is directed to a third direction connecting the first connection region and the second connection region, and the control unit controls to move the tool to the first joint in the first connection region to form the first And connecting the tool to the second joint adjacent to the first joint along the second direction in the first joint region, and connecting the first joint region and the second joint region When the direction is the third direction, the tool is controlled to form the second joint so as to be closer to the third direction than the second direction, and the tool is made to face the third direction. The loop is moved to the third joint in the second joint region to form a third joint. 如請求項4之楔形接合裝置，其中上述第2接合點之長度方向平行於上述第3方向。 The wedge bonding apparatus of claim 4, wherein a length direction of the second joint is parallel to the third direction.
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