JP6973831B2 - Wire bonding equipment - Google Patents

Wire bonding equipment Download PDF

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Publication number
JP6973831B2
JP6973831B2 JP2020539106A JP2020539106A JP6973831B2 JP 6973831 B2 JP6973831 B2 JP 6973831B2 JP 2020539106 A JP2020539106 A JP 2020539106A JP 2020539106 A JP2020539106 A JP 2020539106A JP 6973831 B2 JP6973831 B2 JP 6973831B2
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Japan
Prior art keywords
wire
tail
lead
capillary
bonding
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JP2020539106A
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Japanese (ja)
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JPWO2020184338A1 (en
Inventor
直希 関根
康雄 長島
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Shinkawa Ltd
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Shinkawa Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
    • H01L2224/85947—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by mechanical means, e.g. "pull-and-cut", pressing, stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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Description

本発明は、キャピラリを用いてウェッジボンディング方式のワイヤボンディングを行う装置に関する。 The present invention relates to a device for performing wire bonding of a wedge bonding method using a capillary.

ワイヤボンディング装置は、例えば、基板のリードと半導体チップのパッドとの間を細線のワイヤで接続するために用いられる。ワイヤボンディングは、次のようにして行われる。すなわち、ワイヤボンディング用のボンディングツール（以下、ツールとも言う）と共にワイヤをリードに向かって下降させる。そして、ツール先端でワイヤをリードに押し付け、超音波振動を加えながら両者を接合させて第１ボンド（１ｓｔボンド）とする。第１ボンドの後はツールを引き上げてワイヤを延出し、適当なループを形成しながらパッドの上方に移動する。パッドの上方に来るとツールを下降させる。そして、ツール先端でワイヤをパッドに押し付け、超音波振動を加えながら両者を接合させて第２ボンド（２ｎｄボンド）を行う。第２ボンドの後は、クランパでワイヤの移動を止めながらツールを引き上げてワイヤを第２ボンド点のところで切断する。これを繰り返して、基板の複数のリードと半導体チップの複数のパッドとの間の接続が行われる。 The wire bonding apparatus is used, for example, to connect a lead of a substrate and a pad of a semiconductor chip with a thin wire. Wire bonding is performed as follows. That is, the wire is lowered toward the lead together with a bonding tool for wire bonding (hereinafter, also referred to as a tool). Then, the wire is pressed against the lead with the tip of the tool, and the two are joined while applying ultrasonic vibration to form the first bond (1st bond). After the first bond, the tool is pulled up to extend the wire and move above the pad, forming a suitable loop. When it comes above the pad, it lowers the tool. Then, the wire is pressed against the pad with the tip of the tool, and the two are joined while applying ultrasonic vibration to perform a second bond (2nd bond). After the second bond, the tool is pulled up while stopping the movement of the wire with a clamper to cut the wire at the second bond point. By repeating this, the connection between the plurality of leads of the substrate and the plurality of pads of the semiconductor chip is made.

ところで、ワイヤボンディングの方式としては、ボールボンディング方式とウェッジボンディング方式が知られている。ボールボンディング方式は、高電圧スパーク等でＦＡＢ（Ｆｒｅｅ Ａｉｒ Ｂａｌｌ）を形成できる金線等を用い、ツールとしては、その長手方向軸の周りについて回転対称形のチャンファ部を先端に有するキャピラリを用いる。 By the way, as a wire bonding method, a ball bonding method and a wedge bonding method are known. As the ball bonding method, a gold wire or the like capable of forming a FAB (Free Air Ball) by a high voltage spark or the like is used, and as a tool, a capillary having a rotationally symmetric chamfer portion around its longitudinal axis is used.

ウェッジボンディング方式は、アルミニウム線等を用いてＦＡＢを形成せず、ボンディング用のツールとしてキャピラリではなく、ワイヤガイドと押圧面を先端に有するウェッジボンディング用のツールを用いる。ウェッジボンディングでは、ツール先端において、ワイヤガイドに沿ってワイヤを斜めに押圧面側に出し、押圧面でワイヤ側面をボンディング対象物に押し付けてボンディングする。したがって、ツールの先端で押圧面からワイヤが横向きに出る形となり、ツールの先端はその長手方向軸の周りについて回転対称形になっていない（例えば、特許文献１参照）。 The wedge bonding method does not form a FAB using an aluminum wire or the like, and uses a wedge bonding tool having a wire guide and a pressing surface at the tip instead of a capillary as a bonding tool. In wedge bonding, at the tip of the tool, the wire is slanted toward the pressing surface along the wire guide, and the side surface of the wire is pressed against the object to be bonded by the pressing surface for bonding. Therefore, the tip of the tool has a shape in which the wire protrudes sideways from the pressing surface, and the tip of the tool is not rotationally symmetric about its longitudinal axis (see, for example, Patent Document 1).

ウェッジボンディング用のツールの先端は回転対称形になっていないので、パッド、リードの配置によっては、そのままではワイヤガイドの方向がワイヤの接続方向と合わないことが生じる。そのために、ツールを保持するボンディングヘッドを回転式にし、または、ボンディング対象物を保持するボンディングステージを回転することが行われる。そこで、先端が回転対称形であるキャピラリを用い、キャピラリ先端でワイヤ側面を押圧して接合する方法が提案されている（例えば特許文献２，３参照）。 Since the tip of the tool for wedge bonding is not rotationally symmetric, the direction of the wire guide may not match the wire connection direction as it is, depending on the arrangement of the pads and leads. For that purpose, the bonding head that holds the tool is rotated, or the bonding stage that holds the bonding object is rotated. Therefore, a method has been proposed in which a capillary having a rotationally symmetric tip is used and the side surface of the wire is pressed by the tip of the capillary to join them (see, for example, Patent Documents 2 and 3).

特許文献３には、先端が回転対称形であり、先端の底面が平面（ワイヤの押圧面）となっているツール（キャピラリ）によりウェッジボンディングを行う方法が記載されている。特許文献３のウェッジボンディング方法は、第２ボンド点へのボンディングの後に、クランパを開としてツールを上昇させ、次の第１ボンド点から次の第２ボンド点に向かう直線（次のワイヤ方向）に沿って移動させ、ツール先端に次のワイヤ方向に沿ったワイヤ（ワイヤテール）を延出させた状態でワイヤを切断する。この方法によると、ツール先端に次のワイヤ方向に向かってワイヤテールを折り曲げておくことができるので、次のボンディングの際にこのワイヤの折れ曲がった部分をツール先端で押圧することによって、ボンディングヘッドを回転させずにウェッジボンディングすることができる。 Patent Document 3 describes a method of performing wedge bonding with a tool (capillary) in which the tip is rotationally symmetric and the bottom surface of the tip is a flat surface (pressing surface of a wire). In the wedge bonding method of Patent Document 3, after bonding to the second bond point, the clamper is opened to raise the tool, and a straight line from the next first bond point to the next second bond point (next wire direction). It is moved along the wire, and the wire is cut with the wire (wire tail) extending along the next wire direction at the tip of the tool. According to this method, the wire tail can be bent toward the next wire at the tip of the tool, and the bonding head can be pressed by pressing the bent part of this wire with the tip of the tool during the next bonding. Wedge bonding can be performed without rotating.

特開昭５８−９３３２号公報Japanese Unexamined Patent Publication No. 58-9332 米国特許出願公開第２００５／０１６７４７３号明細書U.S. Patent Application Publication No. 2005/01647373 特開２０１２−２５６８６１号公報Japanese Unexamined Patent Publication No. 2012-256861

図１０は、特許文献３のウェッジボンディング方法により、ワイヤ１０８４を基板のリード１０７４に第１ボンドし、半導体チップ１０７２のパッド１０７３に第２ボンドした一例を示す図である。図１０に示すように、キャピラリを用いたウェッジボンディングの場合、第１ボンド点である接合部１０８３に連なって、ワイヤ１０８４方向に沿って延びる長めの接合部テール１０８３ａ（ワイヤテールとも言う）が形成される。なお、図１０では、理解を促すために、各接合部テール１０８３ａが少し長めに描かれている。近年、隣り合うリード１０７４間の間隔が狭くなってきており、隣り合うワイヤ１０８４のワイヤ方向が大きく変化する場合があるため、図１０の破線の内側に示すように、ワイヤ１０８４方向に沿って延びる接合部テール１０８３ａがリード１０７４からはみ出す可能性がある。それにより、隣り合う接合部テール１０８３ａ同士が接触（ショート）することが危惧される。 FIG. 10 is a diagram showing an example in which the wire 1084 is first bonded to the lead 1074 of the substrate and second bonded to the pad 1073 of the semiconductor chip 1072 by the wedge bonding method of Patent Document 3. As shown in FIG. 10, in the case of wedge bonding using a capillary, a long joint tail 1083a (also referred to as a wire tail) extending along the wire 1084 direction is formed so as to be connected to the joint 1083 which is the first bond point. Will be done. In FIG. 10, each joint tail 1083a is drawn slightly longer in order to promote understanding. In recent years, the distance between adjacent leads 1074 has become narrower, and the wire direction of adjacent wires 1084 may change significantly. Therefore, as shown inside the broken line in FIG. 10, the wires extend along the wire 1084 direction. The joint tail 1083a may protrude from the lead 1074. As a result, there is a concern that the adjacent joint tails 1083a may come into contact with each other (short).

本発明の目的は、ボンディングツールとしてキャピラリを用い、ウェッジボンディング方式により、ワイヤを被実装部材（基板など）のリードに第１ボンドし、半導体チップのパッド（電極）に第２ボンドするワイヤボンディング装置において、第１ボンド点に連なって形成される接合部テール同士の接触を防ぐようにすることにある。 An object of the present invention is a wire bonding apparatus that uses a capillary as a bonding tool, first bonds a wire to a lead of a mounted member (such as a substrate) by a wedge bonding method, and second bonds to a pad (electrode) of a semiconductor chip. The purpose is to prevent contact between the joint tails formed in succession to the first bond point.

本発明のワイヤボンディング装置は、被実装部材のリードと半導体ダイの電極とをワイヤで接続するワイヤボンディング装置であって、ワイヤが挿通されるキャピラリと、ワイヤが接続されるリードの形状を取得する形状取得手段と、ワイヤが次に接続されるリードの形状に基づいて、キャピラリの端部から延出するワイヤテールの延出方向を算出する算出手段と、リードと電極とをワイヤで接続した後、上記延出方向にキャピラリを移動させてワイヤを切断してワイヤテールを形成する切断手段とを備える、ことを特徴とする。 The wire bonding device of the present invention is a wire bonding device that connects a lead of a mounted member and an electrode of a semiconductor die with a wire, and acquires the shape of a capillary through which the wire is inserted and a lead to which the wire is connected. After connecting the lead and the electrode with a wire, the shape acquisition means, the calculation means for calculating the extension direction of the wire tail extending from the end of the capillary based on the shape of the lead to which the wire is next connected, and the calculation means. It is characterized by comprising a cutting means for forming a wire tail by moving a capillary in the extending direction to cut a wire.

本発明のワイヤボンディング装置において、ワイヤテールの上記延出方向はテール延出方向であり、形状取得手段は、ワイヤが次に接続されるリードのワイヤが接続される箇所が延びる方向であるリード方向を認識し、切断手段は、テール延出方向がリード方向と同じ方向になるようにワイヤテールを形成する、としてもよい。 In the wire bonding apparatus of the present invention, the extension direction of the wire tail is the tail extension direction, and the shape acquisition means is the lead direction in which the portion of the lead to which the wire is connected next is extended. The cutting means may form the wire tail so that the tail extending direction is the same as the lead direction.

本発明のワイヤボンディング装置において、ワイヤテールの上記延出方向はテール延出方向であり、キャピラリの先端から延出したワイヤテールを引っ掛ける段部を有する折り曲げステーションと、キャピラリを折り曲げステーションに移動させ、ワイヤテールを段部に沿った位置に配置した後、テール延出方向にワイヤテールを折り曲げる折り曲げ手段と、をさらに備える、としてもよい。 In the wire bonding apparatus of the present invention, the extension direction of the wire tail is the tail extension direction, and the bending station having a step portion for hooking the wire tail extending from the tip of the capillary and the capillary are moved to the bending station. After arranging the wire tail at a position along the step portion, a bending means for bending the wire tail in the tail extending direction may be further provided.

本発明のワイヤボンディング装置において、リードと電極とを接続したワイヤの方向と、ワイヤが次に接続されるリードのワイヤが接続される箇所が延びる方向であるリード方向とのなす角度である第１角度を取得し、第１角度が所定の角度よりも小さい場合には切断手段によってワイヤテールを形成し、第１角度が所定の角度以上である場合には、折り曲げ手段によってワイヤテールの形成を行う、としてもよい。 In the wire bonding apparatus of the present invention, the first angle is the angle between the direction of the wire connecting the lead and the electrode and the lead direction which is the direction in which the wire of the lead to which the wire is connected is extended. The angle is acquired, and when the first angle is smaller than a predetermined angle, the wire tail is formed by the cutting means, and when the first angle is equal to or larger than the predetermined angle, the wire tail is formed by the bending means. , May be.

本発明のワイヤボンディング装置において、上記算出手段は、第１の算出手段であり、上記切断手段は、第１の切断手段であり、ワイヤテールの上記延出方向は第１のテール延出方向であり、ワイヤが次に接続されるリードと電極の間を結ぶ直線の方向を、キャピラリの端部から延出するワイヤテールの延出方向である第２のテール延出方向として算出する第２の算出手段と、リードと電極とをワイヤで接続した後、第２のテール延出方向にキャピラリを移動させてワイヤを切断してワイヤテールを形成する第２の切断手段と、をさらに備える、としてもよい。 In the wire bonding apparatus of the present invention, the calculation means is the first calculation means, the cutting means is the first cutting means, and the extension direction of the wire tail is the first tail extension direction. A second tail extension direction is calculated as the direction of the straight line connecting the lead to which the wire is next connected and the electrode, which is the extension direction of the wire tail extending from the end of the capillary. Further, the calculation means and the second cutting means for forming the wire tail by moving the capillary in the second tail extending direction after connecting the lead and the electrode with a wire are further provided. It is also good.

本発明のワイヤボンディング装置において、リードに形成される接合部と接合部から突出した接合部テールを合わせた第１の長さを取得し、第１の長さが、被実装部材のリード間の最小間隔より大きくなる場合には、第１の切断手段によってワイヤテールを形成し、第１の長さが、上記最小間隔よりも同じか小さくなる場合には第２の切断手段によってワイヤテールを形成する、としてもよい。 In the wire bonding apparatus of the present invention, the first length of the joint formed on the lead and the joint tail protruding from the joint is obtained, and the first length is between the leads of the mounted member. If it is larger than the minimum spacing, the wire tail is formed by the first cutting means, and if the first length is the same as or smaller than the minimum spacing, the wire tail is formed by the second cutting means. May be done.

本発明によれば、被実装部材の次のリードの形状に基づいて、キャピラリの端部から延出するワイヤテールの延出方向を算出し、リードと電極をワイヤで接続した後、当該延出方向にキャピラリを移動させてワイヤを切断してワイヤテールを形成する。よって、次のリードにワイヤを接続（接合）した際に、当該リードにその形状が考慮された接合部テールが形成されるので、被実装部材の各リードから各接合部テールがはみだすことが防がれる。そのため、隣り合うリードの接合部テール同士の接触が防がれる。 According to the present invention, the extension direction of the wire tail extending from the end of the capillary is calculated based on the shape of the next lead of the mounted member, the lead and the electrode are connected by a wire, and then the extension is performed. The capillary is moved in the direction to cut the wire to form the wire tail. Therefore, when the wire is connected (joined) to the next lead, the joint tail is formed in consideration of the shape of the lead, so that the joint tail does not protrude from each lead of the mounted member. It comes off. Therefore, contact between the joint tails of adjacent leads can be prevented.

本発明の実施形態におけるワイヤボンディング装置の構成を示す系統図である。It is a system diagram which shows the structure of the wire bonding apparatus in embodiment of this invention. 本発明の実施形態におけるワイヤボンディング装置のキャピラリの先端部の側断面図である。It is a side sectional view of the tip of the capillary of the wire bonding apparatus in embodiment of this invention. 本発明の実施形態におけるワイヤボンディング装置のキャピラリの先端部の底面図である。It is a bottom view of the tip of the capillary of the wire bonding apparatus in embodiment of this invention. 本発明の実施形態におけるワイヤボンディング装置のウェッジボンディング後の半導体チップのパッドと基板のリードと接続ワイヤの一例を示す図である。It is a figure which shows an example of the pad of a semiconductor chip, the lead of a substrate, and the connection wire after wedge bonding of the wire bonding apparatus in embodiment of this invention. 本発明の実施形態におけるワイヤボンディング装置の動作を示すフローチャートである。It is a flowchart which shows the operation of the wire bonding apparatus in embodiment of this invention. 本発明の実施形態のワイヤボンディング装置のワイヤ折り曲げ動作を示す説明図である。It is explanatory drawing which shows the wire bending operation of the wire bonding apparatus of this invention. 本発明の実施形態のワイヤボンディング装置のワイヤ折り曲げ動作を示す説明図である。It is explanatory drawing which shows the wire bending operation of the wire bonding apparatus of this invention. 本発明の実施形態のワイヤボンディング装置のワイヤ折り曲げ動作を示す説明図である。It is explanatory drawing which shows the wire bending operation of the wire bonding apparatus of this invention. 本発明の実施形態のワイヤボンディング装置による基板のリードへのウェッジボンディング動作を示す説明図である。It is explanatory drawing which shows the wedge bonding operation to the lead of the substrate by the wire bonding apparatus of embodiment of this invention. 本発明の実施形態のワイヤボンディング装置による基板のリードへのウェッジボンディング動作を示す説明図である。It is explanatory drawing which shows the wedge bonding operation to the lead of the substrate by the wire bonding apparatus of embodiment of this invention. 本発明の実施形態のワイヤボンディング装置によるキャピラリの上昇動作を示す説明図である。It is explanatory drawing which shows the ascending operation of a capillary by the wire bonding apparatus of embodiment of this invention. 本発明の実施形態のワイヤボンディング装置による基板のリードから半導体チップのパッドへのルーピング動作を示す説明図である。It is explanatory drawing which shows the looping operation from the lead of a substrate to the pad of a semiconductor chip by the wire bonding apparatus of this invention. 本発明の実施形態のワイヤボンディング装置による半導体チップのパッドへのウェッジボンディング動作を示す説明図である。It is explanatory drawing which shows the wedge bonding operation to the pad of the semiconductor chip by the wire bonding apparatus of this invention. 本発明の実施形態のワイヤボンディング装置によるワイヤテール延出動作を示す説明図である。It is explanatory drawing which shows the wire tail extension operation by the wire bonding apparatus of embodiment of this invention. 本発明の実施形態のワイヤボンディング装置によるテールカット動作を示す説明図である。It is explanatory drawing which shows the tail cut operation by the wire bonding apparatus of embodiment of this invention. 本発明の実施形態のワイヤボンディング装置による次のリードへの移動動作を示す説明図である。It is explanatory drawing which shows the moving operation to the next lead by the wire bonding apparatus of embodiment of this invention. 本発明の実施形態のワイヤボンディング装置によるワイヤ折り曲げ動作の説明図である。It is explanatory drawing of the wire bending operation by the wire bonding apparatus of embodiment of this invention. 本発明の実施形態のワイヤボンディング装置によるワイヤテール延出動作およびテールカット動作の説明図である。It is explanatory drawing of the wire tail extension operation and the tail cut operation by the wire bonding apparatus of embodiment of this invention. 本発明の別の実施形態のワイヤボンディング装置によるワイヤ折り曲げ動作の説明図である。It is explanatory drawing of the wire bending operation by the wire bonding apparatus of another embodiment of this invention. 本発明の別の実施形態のワイヤボンディング装置によるワイヤテール延出動作およびテールカット動作の説明図である。It is explanatory drawing of the wire tail extension operation and the tail cut operation by the wire bonding apparatus of another embodiment of this invention. 従来技術のワイヤボンディング装置のウェッジボンディング後の半導体チップのパッドと基板のリードと接続ワイヤの一例を示す図である。It is a figure which shows an example of the pad of the semiconductor chip, the lead of a substrate, and the connection wire after wedge bonding of the wire bonding apparatus of the prior art.

以下、図面を参照しながら本発明の実施形態について説明する。以下で述べる各部材の形状、配置、材質等は、説明のための例示であって、ワイヤボンディング装置や、ワイヤボンディング装置により製造される半導体装置の仕様等に合わせて適宜変更が可能である。全ての図において同様の要素には同一の符号を付し、重複する説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. The shape, arrangement, material, and the like of each member described below are examples for explanation, and can be appropriately changed according to the specifications of the wire bonding apparatus and the semiconductor apparatus manufactured by the wire bonding apparatus. Similar elements are designated by the same reference numerals in all figures, and duplicate description is omitted.

図１は、ワイヤボンディング装置１０の構成を示す系統図である。図１において、信号線は一点鎖線で示す。ワイヤボンディング装置１０は、ボンディングツールとしてキャピラリ１６を用い、ワイヤ８１としてアルミニウム線を用い、ウェッジボンディング方式で、２つのボンディング対象物をワイヤ８１で接続する装置である。図１では、ワイヤボンディング装置１０の構成要素ではないが、ボンディング対象物としての半導体チップ７２と基板７１が示されている。なお、本実施形態において、ウェッジボンディング方式とは、ワイヤ先端にＦＡＢを形成せず、超音波、圧力を用いて行うボンディング方式をいう。 FIG. 1 is a system diagram showing the configuration of the wire bonding apparatus 10. In FIG. 1, the signal line is indicated by a chain double-dashed line. The wire bonding apparatus 10 is an apparatus in which a capillary 16 is used as a bonding tool, an aluminum wire is used as a wire 81, and two bonding objects are connected by a wire 81 by a wedge bonding method. Although it is not a component of the wire bonding apparatus 10, FIG. 1 shows a semiconductor chip 72 and a substrate 71 as bonding objects. In this embodiment, the wedge bonding method refers to a bonding method in which FAB is not formed at the tip of the wire and ultrasonic waves and pressure are used.

ワイヤボンディング装置１０は、ボンディングステージ１４と、ＸＹステージ２０と、コンピュータ６０を含む。ボンディングステージ１４は、２つのボンディング対象物である半導体チップ７２と基板７１とを搭載するボンディング対象物保持台であり、基板７１の下面を吸着固定する。 The wire bonding apparatus 10 includes a bonding stage 14, an XY stage 20, and a computer 60. The bonding stage 14 is a bonding object holding table on which the semiconductor chip 72 and the substrate 71, which are two bonding objects, are mounted, and the lower surface of the substrate 71 is adsorbed and fixed.

半導体チップ７２は、シリコン基板にトランジスタ等を集積化して電子回路としたもので、電子回路としての入力端子と出力端子等が半導体チップ７２の上面に複数のパッド７３（電極とも言う。図１には１つのパッド７３を示す）として引き出されている。 The semiconductor chip 72 is an electronic circuit obtained by integrating transistors and the like on a silicon substrate, and has a plurality of pads 73 (also referred to as electrodes) having input terminals and output terminals as electronic circuits on the upper surface of the semiconductor chip 72. Indicates one pad 73).

基板７１は、エポキシ樹脂基板に所望の配線をパターニングしたもので、半導体チップ７２の下面を固定するチップパッド（不図示）と、その周囲に配置される複数のリード７４（図１には１つのリード７４を示す）と、チップパッドや複数のリード７４から引き出された基板としての入力端子と出力端子を有する。ワイヤボンディングは、基板７１のリード７４と半導体チップ７２のパッド７３との間をワイヤ８１で接続することで行われる。なお、半導体チップ７２が実装されている部材（被実装部材）は基板７１以外に、例えばリードフレームがある。被実装部材がリードフレームの場合には、ワイヤボンディングにより、リードフレームのリードと半導体チップ７２のパッド７３との間をワイヤ８１で接続することになる。 The substrate 71 is an epoxy resin substrate in which desired wiring is patterned, and has a chip pad (not shown) for fixing the lower surface of the semiconductor chip 72 and a plurality of leads 74 (one in FIG. 1) arranged around the chip pad (not shown). It has a lead 74) and an input terminal and an output terminal as a substrate drawn from a chip pad or a plurality of leads 74. Wire bonding is performed by connecting the lead 74 of the substrate 71 and the pad 73 of the semiconductor chip 72 with a wire 81. The member on which the semiconductor chip 72 is mounted (mounted member) includes, for example, a lead frame in addition to the substrate 71. When the mounted member is a lead frame, the lead of the lead frame and the pad 73 of the semiconductor chip 72 are connected by wire 81 by wire bonding.

ボンディングステージ１４の上面には、キャピラリ１６の先端から延び出たワイヤ（ワイヤテール８２）を折り曲げるための折り曲げステーション７８が設けられている。折り曲げステーション７８は、円柱状の部材であり、上面７５と、上面７５の略中央に形成された孔７６を有する。孔７６の直径はワイヤ８１の直径よりも大きくなっており、孔７６の内面７６ａは円筒面である。折り曲げステーション７８の上面７５は平面で、上面７５と孔７６の内面７６ａとは段部を構成している。 A bending station 78 for bending a wire (wire tail 82) extending from the tip of the capillary 16 is provided on the upper surface of the bonding stage 14. The folding station 78 is a columnar member and has an upper surface 75 and a hole 76 formed substantially in the center of the upper surface 75. The diameter of the hole 76 is larger than the diameter of the wire 81, and the inner surface 76a of the hole 76 is a cylindrical surface. The upper surface 75 of the bending station 78 is a flat surface, and the upper surface 75 and the inner surface 76a of the hole 76 form a stepped portion.

ＸＹステージ２０は、ボンディングヘッド２１を搭載し、ボンディングステージ１４に対し、ボンディングヘッド２１をＸＹ平面内の所望の位置に移動させる移動台である。ＸＹ平面は、ボンディングステージ１４の上面と平行な平面である。Ｙ方向は、後述する超音波トランスデューサ１３の長手方向に平行な方向である。図１に、Ｘ方向、Ｙ方向と、ＸＹ平面に垂直な方向であるＺ方向を示した。 The XY stage 20 is a moving table on which the bonding head 21 is mounted and the bonding head 21 is moved to a desired position in the XY plane with respect to the bonding stage 14. The XY plane is a plane parallel to the upper surface of the bonding stage 14. The Y direction is a direction parallel to the longitudinal direction of the ultrasonic transducer 13 described later. FIG. 1 shows the X direction, the Y direction, and the Z direction, which is a direction perpendicular to the XY plane.

ボンディングヘッド２１は、ＸＹステージ２０に固定されて搭載され、Ｚ方向モータ１９を内蔵する。Ｚ方向モータ１９の回転制御によってＺ駆動アーム２３が回動する。Ｚ駆動アーム２３には、超音波トランスデューサ１３と、クランパ１７が取り付けられている。Ｚ駆動アーム２３は、Ｚ方向モータ１９の回転制御によって、ボンディングヘッド２１に設けられる回動中心（例えばＺ方向モータ１９の出力軸）の周りに回動可能な部材である。Ｚ駆動アーム２３の回動によって、超音波トランスデューサ１３を介してキャピラリ１６がＺ方向に移動する。なお、ボンディングヘッド２１に設けられる回動中心は、必ずしもＺ方向モータ１９の出力軸ではなく、Ｚ駆動アーム２３、超音波トランスデューサ１３、クランパ１７等を含めた全体の重心位置を考慮し、回転負荷が軽減される位置に設定される。ＸＹステージ２０とＺ駆動アーム２３が、移動機構１８を構成する。 The bonding head 21 is fixedly mounted on the XY stage 20 and incorporates a Z-direction motor 19. The Z drive arm 23 is rotated by the rotation control of the Z direction motor 19. An ultrasonic transducer 13 and a clamper 17 are attached to the Z drive arm 23. The Z drive arm 23 is a member that can rotate around a rotation center (for example, the output shaft of the Z direction motor 19) provided in the bonding head 21 by controlling the rotation of the Z direction motor 19. The rotation of the Z drive arm 23 causes the capillary 16 to move in the Z direction via the ultrasonic transducer 13. The rotation center provided in the bonding head 21 is not necessarily the output shaft of the Z-direction motor 19, but is a rotational load in consideration of the position of the center of gravity of the entire body including the Z drive arm 23, the ultrasonic transducer 13, the clamper 17, and the like. Is set to a position where is reduced. The XY stage 20 and the Z drive arm 23 constitute the moving mechanism 18.

超音波トランスデューサ１３は、根元部がＺ駆動アーム２３に取り付けられ、先端部にワイヤ８１を挿通するキャピラリ１６が取り付けられる細長い棒部材である。超音波トランスデューサ１３には超音波振動子１５が取り付けられ、超音波振動子１５を駆動することで発生する超音波エネルギをキャピラリ１６に伝達する。したがって、超音波トランスデューサ１３は、超音波振動子１５からの超音波エネルギを効率よくキャピラリ１６に伝達できるように、先端側に行くほど先細りとなるホーン形状に形成される。 The ultrasonic transducer 13 is an elongated rod member to which a root portion is attached to the Z drive arm 23 and a capillary 16 through which a wire 81 is inserted is attached to the tip portion. An ultrasonic vibrator 15 is attached to the ultrasonic transducer 13, and the ultrasonic energy generated by driving the ultrasonic transducer 15 is transmitted to the capillary 16. Therefore, the ultrasonic transducer 13 is formed in a horn shape that tapers toward the tip side so that the ultrasonic energy from the ultrasonic transducer 15 can be efficiently transmitted to the capillary 16.

図２Ａは、キャピラリ１６の先端部の側断面図であり、図２Ｂは、キャピラリ１６の先端部の底面図である。キャピラリ１６は、棒状体であり、ワイヤが挿通される長手方向に延びた貫通孔１６ｂと、先端の貫通孔１６ｂの周縁に設けられてボンディング対象にワイヤを押圧する押圧面１６ａとを有するボンディングツールである。かかるキャピラリ１６としては、ボールボンディングに用いられるセラミック製のキャピラリをそのまま用いることができる。ボールボンディングに用いられるキャピラリは、ＦＡＢを保持しやすいように、貫通孔の先端面側に適当なチャンファと呼ばれる隅部形状が設けられているが、本実施形態のウェッジボンディング方式では、ボールボンディング用のキャピラリを用い、このキャピラリの貫通孔の先端面側の下面に、平面である押圧面１６ａを備える。 FIG. 2A is a side sectional view of the tip portion of the capillary 16, and FIG. 2B is a bottom view of the tip portion of the capillary 16. The capillary 16 is a rod-shaped body, and is a bonding tool having a through hole 16b extending in the longitudinal direction through which the wire is inserted and a pressing surface 16a provided on the peripheral edge of the through hole 16b at the tip and pressing the wire against the bonding target. Is. As the capillary 16, the ceramic capillary used for ball bonding can be used as it is. The capillary used for ball bonding is provided with an appropriate corner shape called a chamfa on the tip surface side of the through hole so as to easily hold the FAB. However, in the wedge bonding method of the present embodiment, the capillary is used for ball bonding. The capillary of the above is used, and a flat pressing surface 16a is provided on the lower surface of the capillary on the front end surface side of the through hole.

ウェッジボンディング用のツールは、先端部に、長手方向に対し斜めに設けられるワイヤガイドと、ワイヤの側面を押圧するための押圧面を有するので、ツールの長手方向軸の周りに回転対称でなく、ワイヤは、ワイヤガイドの方向に沿った方向性を有して横方向に突き出す。このようなウェッジボンディング用のツールを用いると、リード、パッドの配置によっては、そのままではワイヤガイドの方向がワイヤの接続方向と合わないことが生じる。 The tool for wedge bonding has a wire guide provided at an angle to the longitudinal direction at the tip and a pressing surface for pressing the side surface of the wire, so that the tool is not rotationally symmetric about the longitudinal axis of the tool. The wire has a symmetry along the direction of the wire guide and protrudes laterally. When such a wedge bonding tool is used, the direction of the wire guide may not match the wire connection direction as it is, depending on the arrangement of the leads and pads.

例えば、基板７１の中央部に半導体チップ７２が搭載され、半導体チップ７２の周辺部に沿って一周するように複数のパッド７３が配置され、基板７１にも、半導体チップ７２の外側に沿って一周するように複数のリード７４が設けられる場合には、リード７４とパッド７３を結ぶワイヤの接続方向が複数のワイヤボンディングのそれぞれによって異なる。ワイヤガイドの方向をワイヤの接続方向に合わせるには、ウェッジボンディング用のツールを長手方向軸の周りに回転させるか、基板７１を回転させる必要がある。 For example, the semiconductor chip 72 is mounted in the center of the substrate 71, and a plurality of pads 73 are arranged so as to make a circle along the peripheral portion of the semiconductor chip 72, and the substrate 71 also makes a circle along the outside of the semiconductor chip 72. When a plurality of leads 74 are provided, the connection direction of the wire connecting the leads 74 and the pad 73 differs depending on each of the plurality of wire bonding. In order to align the direction of the wire guide with the connection direction of the wire, it is necessary to rotate the tool for wedge bonding around the longitudinal axis or rotate the substrate 71.

これに対し、キャピラリ１６の先端の押圧面１６ａは、キャピラリ１６の長手方向軸の周りに回転対称の形状であるので、リード７４とパッド７３を結ぶワイヤの接続方向がワイヤボンディングごとに異なっても、キャピラリ１６の先端から突き出るワイヤテール８２の方向を少し変更する整形処理を行うだけで済む。このため、ウェッジボンディングにキャピラリ１６を用いる。 On the other hand, since the pressing surface 16a at the tip of the capillary 16 has a shape that is rotationally symmetric about the longitudinal axis of the capillary 16, even if the connection direction of the wire connecting the lead 74 and the pad 73 is different for each wire bonding. It is only necessary to perform a shaping process for slightly changing the direction of the wire tail 82 protruding from the tip of the capillary 16. Therefore, the capillary 16 is used for wedge bonding.

一方で、ウェッジボンディングにキャピラリ１６を用いた場合、図１０に示すように、パッド１０７３またはリード１０７４に第１ボンド（図１０にはリード１０７４に第１ボンドした例を示す）した際に、第１ボンド点１０８３（接合部）に連なって、長めの接合部テール１０８３ａ（ワイヤテール）が形成される。これは、図５Ｄに示すように、キャピラリ１６の先端から折り曲がって突き出るワイヤテール８２が、キャピラリ１６の押圧面１６ａの外周端よりも外側に少し飛び出した状態で、第１ボンドが行われるためである。本実施形態のワイヤボンディング装置１０は、後で詳述するように、隣り合う、長い接合部テール１０８３ａ同士がショートしてしまうことが防がれるように、ボンディングを行う。 On the other hand, when the capillary 16 is used for wedge bonding, as shown in FIG. 10, when the first bond is made to the pad 1073 or the lead 1074 (FIG. 10 shows an example of the first bond to the lead 1074), the first bond is made. A long joint tail 1083a (wire tail) is formed so as to be connected to one bond point 1083 (joint). This is because, as shown in FIG. 5D, the first bond is performed in a state where the wire tail 82 that bends and protrudes from the tip of the capillary 16 protrudes slightly outward from the outer peripheral end of the pressing surface 16a of the capillary 16. Is. As will be described in detail later, the wire bonding apparatus 10 of the present embodiment performs bonding so as to prevent adjacent long joint tails 1083a from being short-circuited with each other.

図１に戻り、キャピラリ１６に挿通されるワイヤ８１は、アルミニウムの細線である。ワイヤ８１は、ボンディングヘッド２１から延びるワイヤホルダに設けられるワイヤスプール１１に巻回され、ワイヤスプール１１からクランパ１７を介してキャピラリ１６の中心部の貫通孔１６ｂ（図２Ａ参照）に挿通されて、キャピラリ１６の先端から突き出る。かかるワイヤ８１の材質としては、純アルミニウム細線の他に、シリコン、マグネシウム等を適当に混合させた細線等を用いることができる。ワイヤ８１の直径は、ボンディング対象物によって選択することができる。ワイヤ８１の直径の一例を挙げると、３０μｍである。 Returning to FIG. 1, the wire 81 inserted through the capillary 16 is a thin aluminum wire. The wire 81 is wound around a wire spool 11 provided in a wire holder extending from the bonding head 21, and is inserted from the wire spool 11 through a clamper 17 into a through hole 16b (see FIG. 2A) at the center of the capillary 16. It sticks out from the tip of 16. As the material of the wire 81, in addition to the pure aluminum fine wire, a fine wire obtained by appropriately mixing silicon, magnesium, or the like can be used. The diameter of the wire 81 can be selected depending on the object to be bonded. An example of the diameter of the wire 81 is 30 μm.

クランパ１７は、Ｚ駆動アーム２３に取り付けられ、ワイヤ８１の両側に配置される１組の挟み板を含む。クランパ１７は、向かい合う挟み板の間を開くことでワイヤ８１を自由移動状態とし、向かい合う挟み板の間を閉じることで、ワイヤ８１の移動を停止させる。クランパ１７は、Ｚ駆動アーム２３に取り付けられるので、キャピラリ１６と共に移動し、ワイヤ８１を適切に挟むことができる。クランパ１７の開閉は、クランパ開閉機構２７の作動によって行われる。 The clamper 17 includes a set of sandwich plates attached to the Z drive arm 23 and arranged on both sides of the wire 81. The clamper 17 puts the wire 81 in a free-moving state by opening the space between the sandwich plates facing each other, and stops the movement of the wire 81 by closing the space between the sandwich plates facing each other. Since the clamper 17 is attached to the Z drive arm 23, it can move together with the capillary 16 and appropriately pinch the wire 81. The clamper 17 is opened and closed by the operation of the clamper opening / closing mechanism 27.

ワイヤボンディング装置１０は、半導体チップ７２、基板７１などの画像を取得する撮像手段であるカメラ２８を含む。カメラ２８は、ボンディング中にボンディング対象物を撮像し、撮像した画像に基づいてキャピラリ１６のＸＹ方向の位置合わせが行なわれる。また、ボンディング開始前に、カメラ２８がボンディング対象物を撮像することにより、基板７１の各リード７４のＸＹ方向の位置データ、半導体チップ７２の各パッド７３のＸＹ方向の位置データ、および、基板７１の各リード７４の幅、長さ、傾き（延出方向）のデータ等が取得される。それらのデータは、記憶部３２に制御データ４０の一部として記憶される。なお、ボンディング開始前のデータの取得は、例えば同一仕様の半導体装置（半導体チップ７２と基板７１をワイヤボンディングした半導体装置）を連続して製造する場合には、先頭の半導体装置に対して行うだけでもよい。 The wire bonding apparatus 10 includes a camera 28 which is an image pickup means for acquiring an image of a semiconductor chip 72, a substrate 71, and the like. The camera 28 captures an image of the bonding object during bonding, and the capillary 16 is aligned in the XY direction based on the captured image. Further, before the start of bonding, the camera 28 captures an image of the object to be bonded, so that the position data of each lead 74 of the substrate 71 in the XY direction, the position data of each pad 73 of the semiconductor chip 72 in the XY direction, and the substrate 71. Data such as width, length, and inclination (extension direction) of each lead 74 of the above are acquired. Those data are stored in the storage unit 32 as a part of the control data 40. Note that the acquisition of data before the start of bonding is performed only on the leading semiconductor device, for example, in the case of continuously manufacturing a semiconductor device having the same specifications (semiconductor device in which a semiconductor chip 72 and a substrate 71 are wire-bonded). But it may be.

ここで、上記データの取得についてもう少し詳しく説明する。制御部３０は、記憶部３２からプログラムを読み出して実行することにより、形状取得手段として機能する。形状取得手段は、カメラ２８を用いて、ワイヤ８１が接続されるリード７４の形状を取得し、記憶部３２に記憶する。好ましくは、形状取得手段は、リード７４のワイヤ８１が接続される箇所が延びる方向であるリード方向を認識し、記憶部３２に記憶する。なお、形状取得手段は、基板７１の全てのリード７４のリード方向の認識をボンディング開始前に行なってもよいし、各リード７４がボンディングされるタイミングで、ワイヤ８１が次に接続されるリード７４のリード方向を認識してもよい。 Here, the acquisition of the above data will be described in a little more detail. The control unit 30 functions as a shape acquisition means by reading a program from the storage unit 32 and executing the program. The shape acquisition means acquires the shape of the lead 74 to which the wire 81 is connected by using the camera 28, and stores it in the storage unit 32. Preferably, the shape acquisition means recognizes the lead direction, which is the direction in which the portion of the lead 74 to which the wire 81 is connected extends, and stores the lead 74 in the storage unit 32. The shape acquisition means may recognize the lead direction of all the leads 74 of the substrate 71 before the start of bonding, or the lead 74 to which the wire 81 is connected next at the timing when each lead 74 is bonded. You may recognize the lead direction of.

図１に示す構成の説明に戻る。コンピュータ６０は、ワイヤボンディング装置１０の各要素の動作を全体として制御する。コンピュータ６０は、ＣＰＵを有する制御部３０と、インターフェース回路４４と、記憶部３２を含んで構成される。これらは互いにデータバス３１で接続される。 Returning to the description of the configuration shown in FIG. The computer 60 controls the operation of each element of the wire bonding apparatus 10 as a whole. The computer 60 includes a control unit 30 having a CPU, an interface circuit 44, and a storage unit 32. These are connected to each other by the data bus 31.

インターフェース回路４４は、制御部３０とワイヤボンディング装置１０の各要素との間に設けられる駆動回路またはバッファ回路である。本明細書では、インターフェース回路をＩ／Ｆとも記す。インターフェース回路４４は、ＸＹステージ２０に接続されるＸＹステージＩ／Ｆ、Ｚ方向モータ１９に接続されるＺ方向モータＩ／Ｆ、超音波振動子１５に接続される超音波振動子Ｉ／Ｆ、クランパ開閉機構２７に接続されるクランパ開閉機構Ｉ／Ｆ、カメラ２８に接続されるカメラＩ／Ｆなどを含む。 The interface circuit 44 is a drive circuit or a buffer circuit provided between the control unit 30 and each element of the wire bonding device 10. In this specification, the interface circuit is also referred to as an I / F. The interface circuit 44 includes an XY stage I / F connected to the XY stage 20, a Z direction motor I / F connected to the Z direction motor 19, and an ultrasonic vibrator I / F connected to the ultrasonic vibrator 15. It includes a clamper opening / closing mechanism I / F connected to the clamper opening / closing mechanism 27, a camera I / F connected to the camera 28, and the like.

記憶部３２は、各種プログラムと、制御データを格納する記憶装置である。各種プログラムは、ボンディング方向計算プログラム３３、第１のワイヤテール延出プログラム３４、第１のテールカットプログラム３５、第２のワイヤテール延出プログラム３６、第２のテールカットプログラム３７、ワイヤテール折り曲げプログラム３８、その他の制御処理に関する制御プログラム３９である。制御データ４０は、各種プログラムを実行するときに必要なデータ等である。 The storage unit 32 is a storage device that stores various programs and control data. The various programs include a bonding direction calculation program 33, a first wire tail extension program 34, a first tail cut program 35, a second wire tail extension program 36, a second tail cut program 37, and a wire tail bending program. 38, a control program 39 related to other control processes. The control data 40 is data or the like required when executing various programs.

制御部３０は、ボンディング方向計算プログラム３３、第１のワイヤテール延出プログラム３４、第１のテールカットプログラム３５、第２のワイヤテール延出プログラム３６、第２のテールカットプログラム３７、ワイヤテール折り曲げプログラム３８のそれぞれを記憶部３２から読み出して実行することにより、ボンディング方向計算手段、第１のワイヤテール延出手段、第１のテールカット手段（第１の切断手段、または、単に切断手段とも言う）、第２のワイヤテール延出手段、第２のテールカット手段（第２の切断手段とも言う）、ワイヤテール折り曲げ手段（単に折り曲げ手段とも言う）として機能する。なお、第２のワイヤテール延出プログラム３６と第２のテールカットプログラム３７は、第１のワイヤテール延出プログラム３４と第１のテールカットプログラム３５に代えて使用するプログラムであり、以降説明する最初の実施形態では使用しない。 The control unit 30 includes a bonding direction calculation program 33, a first wire tail extension program 34, a first tail cut program 35, a second wire tail extension program 36, a second tail cut program 37, and a wire tail bending. By reading each of the programs 38 from the storage unit 32 and executing the program 38, the bonding direction calculation means, the first wire tail extending means, the first tail cutting means (also referred to as the first cutting means, or simply the cutting means). ), A second wire tail extending means, a second tail cutting means (also referred to as a second cutting means), and a wire tail bending means (also simply referred to as a bending means). The second wire tail extension program 36 and the second tail cut program 37 are programs used in place of the first wire tail extension program 34 and the first tail cut program 35, and will be described below. Not used in the first embodiment.

次に、以上のように構成されたワイヤボンディング装置１０によって基板７１のリード７４と半導体チップ７２のパッド７３をワイヤで接続する工程について説明する。図３は、半導体チップ７２のパッド７３の一部と、基板のリード７４の一部を示す上面図である。図３を含め各図において、接合部テール８３ａ，１８３ａ，２８３ａ，３８３ａ，４８３ａは誇張して長めに描かれている。本実施形態では、最初に図３の右下に示す第１リード１７４と第１パッド１７３を第１接続ワイヤ１８４で接続し（第１ボンディング）、次に第１リード１７４の上側にある第２リード１７５と、第１パッド１７３の上側にある第２パッド２７３を第２接続ワイヤ２８４で接続する（第２ボンディング）。以下同様に図３に示す矢印ＡＲ１のように、各リード７４とパッド７３を反時計周りに順次接続していく（第ｎボンディング、ｎは整数）。なお、各ボンディングにおいて、基板のリードにワイヤを第１ボンドした後、ワイヤをルーピングし、半導体チップのパッドに第２ボンドする。 Next, a step of connecting the lead 74 of the substrate 71 and the pad 73 of the semiconductor chip 72 with a wire by the wire bonding apparatus 10 configured as described above will be described. FIG. 3 is a top view showing a part of the pad 73 of the semiconductor chip 72 and a part of the lead 74 of the substrate. In each figure including FIG. 3, the joint tails 83a, 183a, 283a, 383a, 483a are exaggerated and drawn long. In the present embodiment, the first lead 174 and the first pad 173 shown in the lower right of FIG. 3 are first connected by the first connection wire 184 (first bonding), and then the second lead 174 is located above the first lead 174. The lead 175 and the second pad 273 on the upper side of the first pad 173 are connected by the second connection wire 284 (second bonding). Similarly, as shown by the arrow AR1 shown in FIG. 3, each lead 74 and the pad 73 are sequentially connected counterclockwise (nth bonding, n is an integer). In each bonding, the wire is first bonded to the lead of the substrate, then the wire is looped, and the wire is second-bonded to the pad of the semiconductor chip.

制御部３０は、記憶部３２に格納されている制御プログラム３９、ボンディング方向計算プログラム３３、第１のワイヤテール延出プログラム３４、第１のテールカットプログラム３５、ワイヤテール折り曲げプログラム３８、および制御データ４０を読み出して、ボンディングを制御する。図５Ａに示すように、最初に、キャピラリ１６は、折り曲げステーション７８の孔７６よりも外側に位置しており、キャピラリ１６の先端の押圧面１６ａからワイヤテール８２が直線状に所定の長さだけ延出し、クランパ１７は閉とされている。 The control unit 30 includes a control program 39, a bonding direction calculation program 33, a first wire tail extension program 34, a first tail cut program 35, a wire tail bending program 38, and control data stored in the storage unit 32. 40 is read out to control bonding. As shown in FIG. 5A, first, the capillary 16 is located outside the hole 76 of the bending station 78, and the wire tail 82 is linearly formed by a predetermined length from the pressing surface 16a at the tip of the capillary 16. The extension and the clamper 17 are closed.

図４は、本実施形態におけるワイヤボンディング装置１０の動作を示すフローチャートである。まず、Ｓ１０１で、制御部３０は、整数ｎを１に初期設定する。次に、Ｓ１０２で、制御部３０は、ワイヤテール折り曲げプログラム３８を実行することにより、ワイヤテール折り曲げ手段として機能する。制御部３０（ワイヤテール折り曲げ手段）は、ＸＹステージ２０を制御して、図５Ａに示すように、ボンディングステージ１４に対してキャピラリ１６を移動させ、キャピラリ１６の中心が折り曲げステーション７８の孔７６の直上に来るようにする。そして、図５Ｂに示すように、キャピラリ１６が孔７６の直上に来たら、制御部３０は、Ｚ方向モータ１９を介してＺ駆動アーム２３を制御し、キャピラリ１６の先端の押圧面１６ａを折り曲げステーション７８の上面７５から少しだけ高い位置まで降下する。これにより、キャピラリ１６の先端から直線状に延出しているワイヤテール８２の先端は、折り曲げステーション７８の孔７６の中に入る。 FIG. 4 is a flowchart showing the operation of the wire bonding apparatus 10 in the present embodiment. First, in S101, the control unit 30 initially sets the integer n to 1. Next, in S102, the control unit 30 functions as a wire tail bending means by executing the wire tail bending program 38. The control unit 30 (wire tail bending means) controls the XY stage 20 to move the capillary 16 with respect to the bonding stage 14, with the center of the capillary 16 being the hole 76 of the bending station 78, as shown in FIG. 5A. Try to come directly above. Then, as shown in FIG. 5B, when the capillary 16 comes directly above the hole 76, the control unit 30 controls the Z drive arm 23 via the Z direction motor 19 and bends the pressing surface 16a at the tip of the capillary 16. It descends from the upper surface 75 of the station 78 to a slightly higher position. As a result, the tip of the wire tail 82 extending linearly from the tip of the capillary 16 enters the hole 76 of the bending station 78.

整数ｎは１に設定されているので、図４のＳ１０３に示すように、制御部３０は最初にボンディングする第１リード１７４の延出方向を取得する。記憶部３２には、制御データ４０の一部として、ボンディングを行う各リード７４の傾き（延出方向）が格納されている。制御部３０は、記憶部３２から第１リード１７４の延出方向を読み出して取得する。第１リード１７４の延出方向は、前述した形状取得手段により認識された第１リード１７４のリード方向である。 Since the integer n is set to 1, as shown in S103 of FIG. 4, the control unit 30 acquires the extension direction of the first lead 174 to be bonded first. The storage unit 32 stores the inclination (extending direction) of each lead 74 to be bonded as a part of the control data 40. The control unit 30 reads out the extension direction of the first read 174 from the storage unit 32 and acquires it. The extending direction of the first lead 174 is the lead direction of the first lead 174 recognized by the shape acquisition means described above.

次に、図４のＳ１０４で、制御部３０（ワイヤテール折り曲げ手段）は、ＸＹステージ２０を制御して、図６に示すように、キャピラリ１６の中心を第１リード１７４の延出方向１９１（図６，７参照）に沿ってパッドの側に水平に移動させる。すると、図５Ｃに示すように、孔７６の中に入っていたワイヤテール８２は孔７６の内面７６ａと折り曲げステーション７８の上面７５との角部（段部）に引っ掛かり、キャピラリ１６の水平移動に従って横方向に折り曲げられていく。そして、キャピラリ１６の中心が孔７６の外側まで移動すると、ワイヤテール８２は押圧面１６ａと上面７５との間に挟まれ、ワイヤテール８２はキャピラリ１６の貫通孔１６ｂに挿通されているワイヤ８１に対して略直角方向に折り曲げられる。そして、図６に示すように、折り曲げられたワイヤテール８２の先端は第１リード１７４の延出方向１９１に向いている。なお、前述した形状取得手段により第１リード１７４のリード方向以外のリード形状データが取得されている場合には、制御部３０を第１の算出手段（単に算出手段とも言う）として機能させ、形状取得手段により取得された第１リード１７４のリード形状に基づいて、キャピラリの端部から延出するワイヤテールの延出方向を算出してから、上記動作を行うとしてもよい。 Next, in S104 of FIG. 4, the control unit 30 (wire tail bending means) controls the XY stage 20, and as shown in FIG. 6, the center of the capillary 16 is centered on the extension direction 191 of the first lead 174 (1). Move horizontally to the side of the pad along (see FIGS. 6 and 7). Then, as shown in FIG. 5C, the wire tail 82 contained in the hole 76 is caught by the corner portion (step portion) between the inner surface 76a of the hole 76 and the upper surface 75 of the bending station 78, and follows the horizontal movement of the capillary 16. It is bent in the horizontal direction. Then, when the center of the capillary 16 moves to the outside of the hole 76, the wire tail 82 is sandwiched between the pressing surface 16a and the upper surface 75, and the wire tail 82 is inserted into the wire 81 inserted through the through hole 16b of the capillary 16. On the other hand, it can be bent in a direction substantially perpendicular to it. Then, as shown in FIG. 6, the tip of the bent wire tail 82 faces the extending direction 191 of the first lead 174. When the lead shape data other than the lead direction of the first lead 174 is acquired by the shape acquisition means described above, the control unit 30 is made to function as the first calculation means (also simply referred to as the calculation means) to form the shape. The above operation may be performed after calculating the extending direction of the wire tail extending from the end of the capillary based on the lead shape of the first lead 174 acquired by the acquiring means.

ワイヤテール８２の折り曲げが終わったら、図４のＳ１０５で、制御部３０は、整数ｎが１に設定されているので、ＸＹステージ２０を制御して、キャピラリ１６の中心を第１リード１７４の上に移動させる。 After the bending of the wire tail 82 is completed, in S105 of FIG. 4, the control unit 30 controls the XY stage 20 because the integer n is set to 1, so that the center of the capillary 16 is above the first lead 174. Move to.

キャピラリ１６の中心が第１リード１７４の上に移動したら、図４のＳ１０６で、制御部３０は、Ｚ駆動アーム２３を制御して、キャピラリ１６の先端を第１リード１７４の上に降下させる。そして、図５Ｅに示すように、制御部３０は、キャピラリ１６の先端から延出し、図７に示す第１リード１７４の延出方向１９１に沿って折り曲げられているワイヤテールの側面をキャピラリ１６の先端の押圧面１６ａによって第１リード１７４の上に押し付けると共に、超音波振動子１５を駆動して、キャピラリ１６でワイヤテール８２を第１リード１７４の上にウェッジボンディングにより接合する。この接合によって第１リード１７４の上面には接合部１８３が形成されると共に、それに連なって接合部テール１８３ａが形成される。キャピラリ１６の先端のワイヤテール８２が第１リード１７４の延出方向１９１に向いていた為、接合部テール１８３ａは、第１リード１７４の延出方向１９１に沿って形成される。 After the center of the capillary 16 has moved onto the first lead 174, in S106 of FIG. 4, the control unit 30 controls the Z drive arm 23 to lower the tip of the capillary 16 onto the first lead 174. Then, as shown in FIG. 5E, the control unit 30 extends from the tip of the capillary 16 and bends the side surface of the wire tail extending along the extending direction 191 of the first lead 174 shown in FIG. 7 to the side surface of the capillary 16. The pressing surface 16a at the tip presses the wire tail 174 onto the first lead 174, and the ultrasonic vibrator 15 is driven to join the wire tail 82 onto the first lead 174 by wedge bonding with the capillary 16. By this joining, a joining portion 183 is formed on the upper surface of the first lead 174, and a joining portion tail 183a is formed in connection with the joining portion 183. Since the wire tail 82 at the tip of the capillary 16 faces the extending direction 191 of the first lead 174, the joint tail 183a is formed along the extending direction 191 of the first lead 174.

第１リード１７４へのワイヤテール８２の接続が終了したら、図４のＳ１０７で、制御部３０は、Ｚ駆動アーム２３を制御して、キャピラリ１６の先端を上昇させる。そして、制御部３０は、ボンディング方向計算プログラム３３を実行することによりボンディング方向計算手段として機能する。記憶部３２の中には、制御データ４０の一部として、各リード７４のＸＹ方向の位置データと半導体チップ７２の各パッド７３のＸＹ方向の位置データが格納されている。制御部３０は記憶部３２から図７に示す第１リード１７４のＸＹ方向の位置データと、第１パッド１７３のＸＹ方向の位置データを読み出し、第１リード１７４と第１パッド１７３を結ぶ第１ボンディングの方向を第１ワイヤ方向１９２（第１の直線の方向）として計算する。制御部３０は、キャピラリ１６の先端を上昇させると共に、ＸＹステージ２０を制御して、キャピラリ１６の中心を図７に示す第１ワイヤ方向１９２に移動させる。また、この際、制御部３０は、クランパ開閉機構２７を制御してクランパ１７を開とする。これによって、図５Ｆに示すように、キャピラリ１６の先端からワイヤ８１が繰り出されながら、キャピラリ１６は図７に示す第１ワイヤ方向１９２に沿って斜め上方向に向かって上昇する。 After the connection of the wire tail 82 to the first lead 174 is completed, in S107 of FIG. 4, the control unit 30 controls the Z drive arm 23 to raise the tip of the capillary 16. Then, the control unit 30 functions as a bonding direction calculation means by executing the bonding direction calculation program 33. The storage unit 32 stores the position data in the XY direction of each lead 74 and the position data in the XY direction of each pad 73 of the semiconductor chip 72 as a part of the control data 40. The control unit 30 reads out the position data in the XY direction of the first read 174 and the position data in the XY direction of the first pad 173 from the storage unit 32, and connects the first lead 174 and the first pad 173. The bonding direction is calculated as the first wire direction 192 (the direction of the first straight line). The control unit 30 raises the tip of the capillary 16 and controls the XY stage 20 to move the center of the capillary 16 in the first wire direction 192 shown in FIG. 7. At this time, the control unit 30 controls the clamper opening / closing mechanism 27 to open the clamper 17. As a result, as shown in FIG. 5F, the capillary 16 rises diagonally upward along the first wire direction 192 shown in FIG. 7 while the wire 81 is unwound from the tip of the capillary 16.

次に、図４のＳ１０８で、制御部３０は、Ｚ駆動アーム２３とＸＹステージ２０を制御して、整数ｎが１に設定されているので、キャピラリ１６の先端を所定の高さまで上昇させたら、図５Ｇに示すように第１パッド１７３に向かってループ状に移動させる。この動作によってキャピラリ１６の中心は、図７に示す第１リード１７４の接合部１８３から第１パッド１７３に向かって第１ワイヤ方向１９２に沿って移動していく。 Next, in S108 of FIG. 4, the control unit 30 controls the Z drive arm 23 and the XY stage 20, and since the integer n is set to 1, if the tip of the capillary 16 is raised to a predetermined height. , As shown in FIG. 5G, is moved in a loop toward the first pad 173. By this operation, the center of the capillary 16 moves from the joint portion 183 of the first lead 174 shown in FIG. 7 toward the first pad 173 along the first wire direction 192.

そして、キャピラリ１６の中心が第１パッド１７３の直上まで移動したら、図４のＳ１０９で、制御部３０は、Ｚ駆動アーム２３を制御して、キャピラリ１６の先端を第１パッド１７３の上に降下させる。そして、図５Ｈに示すように、キャピラリ１６の先端から延出しているワイヤ８１の側面をキャピラリ１６の先端の押圧面１６ａによって第１パッド１７３の上に押し付けると共に、超音波振動子１５を駆動して、キャピラリ１６によりワイヤ８１の側面を第１パッド１７３の上にウェッジボンディングで接合する。この接合によって第１パッド１７３の上面には接合部１８５が形成される。このように、第１パッド１７３にワイヤ８１をウェッジボンディングにより接合すると、図５Ｈに示すように、第１リード１７４と第１パッド１７３の間は山形のループ状で、図７に示すようにＸＹ平面上では第１ワイヤ方向１９２に延びる直線状の第１接続ワイヤ１８４で接続される。 Then, when the center of the capillary 16 moves to directly above the first pad 173, the control unit 30 controls the Z drive arm 23 in S109 of FIG. 4 to lower the tip of the capillary 16 onto the first pad 173. Let me. Then, as shown in FIG. 5H, the side surface of the wire 81 extending from the tip of the capillary 16 is pressed onto the first pad 173 by the pressing surface 16a at the tip of the capillary 16, and the ultrasonic transducer 15 is driven. Then, the side surface of the wire 81 is joined to the first pad 173 by wedge bonding by the capillary 16. By this joining, a joining portion 185 is formed on the upper surface of the first pad 173. When the wire 81 is joined to the first pad 173 by wedge bonding in this way, as shown in FIG. 5H, a chevron loop is formed between the first lead 174 and the first pad 173, and as shown in FIG. 7, XY. On a plane, it is connected by a linear first connecting wire 184 extending in the direction of the first wire 192.

第１パッド１７３へのボンディングが終了すると、図４のＳ１１０で、制御部３０は、次にボンディングするリード７４、パッド７３があるかどうかを判断する。整数ｎは１に設定されており、（ｎ＋１）は２となり、本実施形態では、第２リード２７４と第２パッド２７３を接続する第２ボンディングがあるので、制御部３０は、図４のＳ１１０に示す、第（ｎ＋１）ボンディングがあると判断し、図４のＳ１１１に進む。 When the bonding to the first pad 173 is completed, in S110 of FIG. 4, the control unit 30 determines whether or not there is a lead 74 and a pad 73 to be bonded next. The integer n is set to 1, (n + 1) is 2, and in the present embodiment, there is a second bonding connecting the second lead 274 and the second pad 273, so that the control unit 30 is S110 in FIG. It is determined that there is the (n + 1) th bond shown in FIG. 4, and the process proceeds to S111 in FIG.

Ｓ１１１で、制御部３０は、次にボンディングする第２リード２７４の延出方向２９１（図７参照）を、記憶部３２から読み出して取得する。第２リード２７４の延出方向は、前述した形状取得手段により認識された第２リード２７４のリード方向である。そして、Ｓ１１２で、制御部３０は、図７に示す第１ワイヤ方向１９２と第２リード２７４の延出方向２９１の角度差θ１（第１角度とも言う）を計算し、この角度差θ１と所定の角度とを比較する。ここで所定の角度は、以降説明する、キャピラリ１６先端のワイヤテール８２の延出および切断の動作を行う際に、ワイヤテール８２に引っ張られて第１パッド１７３や第１パッド１７３上面の接合部１８５が損傷することがない程度の角度であり、本実施形態では、４５°とする。なお、この角度は４５°に限定されるものではない。 In S111, the control unit 30 reads out from the storage unit 32 and acquires the extension direction 291 (see FIG. 7) of the second lead 274 to be bonded next. The extending direction of the second lead 274 is the lead direction of the second lead 274 recognized by the shape acquisition means described above. Then, in S112, the control unit 30 calculates an angle difference θ1 (also referred to as a first angle) between the first wire direction 192 and the extension direction 291 of the second lead 274 shown in FIG. 7, and determines the angle difference θ1. Compare with the angle of. Here, the predetermined angle is pulled by the wire tail 82 when the wire tail 82 at the tip of the capillary 16 is extended and cut, which will be described later, and the joint portion on the upper surface of the first pad 173 or the first pad 173. The angle is such that the 185 is not damaged, and in the present embodiment, it is set to 45 °. Note that this angle is not limited to 45 °.

図４のＳ１１２で、角度差θ１は所定の角度差（４５°）よりも小さいので、Ｓ１１３に進む。Ｓ１１３で、制御部３０は、第１のワイヤテール延出プログラム３４を実行することにより、第１のワイヤテール延出手段として機能する。制御部３０（第１のワイヤテール延出手段）は、Ｚ駆動アーム２３とＸＹステージ２０を制御して、図７に示すように、キャピラリ１６の先端のＸＹ面での移動方向を第２リード２７４の延出方向２９１として、図５Ｉに示すようにキャピラリ１６の先端を斜め上方に向かって移動させる。これにより、キャピラリ１６の先端からワイヤテール８２が延出される。ワイヤテール８２は、接合部１８５の端部との境界部分で角度θ１だけ曲がる。なお、前述した形状取得手段により第２リード２７４のリード方向以外のリード形状データが取得されている場合には、制御部３０を第１の算出手段として機能させ、形状取得手段により取得された第２リード２７４のリード形状に基づいて、キャピラリの端部から延出するワイヤテールの延出方向を算出してから、上記動作を行うとしてもよい。なお、以下のテールカット動作も同様である。 In S112 of FIG. 4, since the angle difference θ1 is smaller than the predetermined angle difference (45 °), the process proceeds to S113. In S113, the control unit 30 functions as a first wire tail extension means by executing the first wire tail extension program 34. The control unit 30 (first wire tail extending means) controls the Z drive arm 23 and the XY stage 20, and as shown in FIG. 7, leads the tip of the capillary 16 in the moving direction on the XY plane to the second lead. As the extension direction 291 of 274, the tip of the capillary 16 is moved diagonally upward as shown in FIG. 5I. As a result, the wire tail 82 extends from the tip of the capillary 16. The wire tail 82 bends by an angle θ1 at the boundary portion with the end portion of the joint portion 185. When the lead shape data other than the lead direction of the second lead 274 is acquired by the shape acquisition means described above, the control unit 30 is made to function as the first calculation means, and the second lead is acquired by the shape acquisition means. 2 The above operation may be performed after calculating the extending direction of the wire tail extending from the end of the capillary based on the lead shape of the lead 274. The same applies to the following tail cut operation.

次に、図４のＳ１１４で、制御部３０は、キャピラリ１６の先端のワイヤテール８２の長さが所定の長さになったかどうかを判断する。ワイヤテール８２の長さが所定の長さになった場合には、Ｓ１１５で、制御部３０は、第１のテールカットプログラム３５を実行することで第１のテールカット手段として機能する。制御部３０（第１のテールカット手段）は、クランパ開閉機構２７を制御することにより、クランパ１７を閉とする。そして、制御部３０（第１のテールカット手段）は、Ｚ駆動アーム２３とＸＹステージ２０を制御して、キャピラリ１６の先端のＸＹ面での移動方向を第２リード２７４の延出方向２９１として、キャピラリ１６の先端を斜め上方に向かって移動させる。すると、図５Ｊに示すように、ワイヤテール８２は、一番強度が低下している第１パッド１７３と接合部１８５の境界で切断され、ワイヤテール８２は第１パッド１７３から切り離される。この際、図７に示すように、キャピラリ１６の先端から延出したワイヤテール８２は、ＸＹ面内では、第２リード２７４の延出方向２９１に延びている。すなわち、キャピラリの端部から延出するワイヤテール８２の延出方向と、第２リード２７４の延出方向２９１とが同じとなっている。なお、キャピラリの端部から延出するワイヤテールの延出方向を、テール延出方向、または、第１のテール延出方向と言うこともできる。 Next, in S114 of FIG. 4, the control unit 30 determines whether or not the length of the wire tail 82 at the tip of the capillary 16 has reached a predetermined length. When the length of the wire tail 82 becomes a predetermined length, in S115, the control unit 30 functions as the first tail cut means by executing the first tail cut program 35. The control unit 30 (first tail cutting means) closes the clamper 17 by controlling the clamper opening / closing mechanism 27. Then, the control unit 30 (first tail cutting means) controls the Z drive arm 23 and the XY stage 20, and sets the moving direction of the tip of the capillary 16 on the XY surface as the extending direction 291 of the second lead 274. , The tip of the capillary 16 is moved diagonally upward. Then, as shown in FIG. 5J, the wire tail 82 is cut at the boundary between the first pad 173 and the joint portion 185, which have the lowest strength, and the wire tail 82 is separated from the first pad 173. At this time, as shown in FIG. 7, the wire tail 82 extending from the tip of the capillary 16 extends in the extending direction 291 of the second lead 274 in the XY plane. That is, the extending direction of the wire tail 82 extending from the end of the capillary is the same as the extending direction 291 of the second lead 274. The extending direction of the wire tail extending from the end of the capillary can also be referred to as a tail extending direction or a first tail extending direction.

ワイヤテール８２を切断したら、図４のＳ１１６で、制御部３０は、整数ｎを１だけインクリメントして、Ｓ１０５に戻る。この際、整数ｎは１だけインクリメントされて２となっているので、図５Ｋに示すように制御部３０はキャピラリ１６の中心を第２リード２７４の直上に移動させる。 After cutting the wire tail 82, in S116 of FIG. 4, the control unit 30 increments the integer n by 1 and returns to S105. At this time, since the integer n is incremented by 1 to become 2, the control unit 30 moves the center of the capillary 16 directly above the second lead 274 as shown in FIG. 5K.

第２リード２７４の直上に移動させたら、先に説明したのと同様に、図４のＳ１０６で、制御部３０は、Ｚ駆動アーム２３を制御して、キャピラリ１６の先端を第２リード２７４の上に降下させる。そして、制御部３０は、キャピラリ１６の先端から延出し、図７に示す第２リード２７４の延出方向２９１に沿って折り曲げられているワイヤテール８２の側面をキャピラリ１６の先端の押圧面１６ａによって第２リード２７４の上に押し付けると共に、超音波振動子１５を駆動して、キャピラリ１６でワイヤテール８２を第２リード２７４の上にウェッジボンディングにより接合する。この接合によって第２リード２７４の上面には接合部２８３が形成されると共に、それに連なって接合部テール２８３ａが形成される。キャピラリ１６の先端のワイヤテール８２が第２リード２７４の延出方向２９１に向いていた為、接合部テール２８３ａは、第２リード２７４の延出方向２９１に沿って形成される。 After moving directly above the second lead 274, in S106 of FIG. 4, the control unit 30 controls the Z drive arm 23 to move the tip of the capillary 16 to the second lead 274 in the same manner as described above. Drop it up. Then, the control unit 30 extends from the tip of the capillary 16 and bends the side surface of the wire tail 82 along the extending direction 291 of the second lead 274 shown in FIG. 7 by the pressing surface 16a at the tip of the capillary 16. The wire tail 82 is bonded onto the second lead 274 by wedge bonding by pressing the wire tail 82 onto the second lead 274 and driving the ultrasonic transducer 15 with the capillary 16. By this joining, a joining portion 283 is formed on the upper surface of the second lead 274, and a joining portion tail 283a is formed in connection with the joining portion 283. Since the wire tail 82 at the tip of the capillary 16 faces the extending direction 291 of the second lead 274, the joint tail 283a is formed along the extending direction 291 of the second lead 274.

第２リード２７４にワイヤテール８２をボンディングすると、図４のＳ１０７〜Ｓ１０９で、制御部３０は、キャピラリ１６を上昇させて、第２パッド２７３に向かってルーピングし、第２パッド２７３にワイヤ８１の側面を押しつけて接合部２８５を形成し、第２リード２７４と第２パッド２７３の間を第２接続ワイヤ２８４で接続する。そして、図４のＳ１１０で、制御部３０は、第（ｎ＋１）ボンディングがあるかどうかを判断する。整数ｎは２に設定されており、（ｎ＋１）は３となり、本実施形態では、第３リード３７４と第３パッド３７３を接続する第３ボンディングがあるので、制御部３０は、図４のＳ１１０に示す、第（ｎ＋１）ボンディングがあると判断し、図４のＳ１１１に進む。 When the wire tail 82 is bonded to the second lead 274, in S107 to S109 of FIG. 4, the control unit 30 raises the capillary 16 and loops toward the second pad 273, and the wire 81 is attached to the second pad 273. The side surface is pressed to form a joint portion 285, and a second connection wire 284 connects between the second lead 274 and the second pad 273. Then, in S110 of FIG. 4, the control unit 30 determines whether or not there is a (n + 1) th bond. The integer n is set to 2, (n + 1) is 3, and in the present embodiment, there is a third bond connecting the third lead 374 and the third pad 373, so that the control unit 30 has S110 in FIG. It is determined that there is the (n + 1) th bond shown in FIG. 4, and the process proceeds to S111 in FIG.

次に、図４のＳ１１１で、制御部３０は、第３リード３７４の延出方向３９１を取得し、Ｓ１１２で、制御部３０は、図７に示す第２ワイヤ方向２９２（第２リード２７４と第２パッド２７３を結ぶ第２ボンディングの方向（第２の直線の方向））と第３リード３７４の延出方向３９１の角度差θ２（第１角度）を計算し、この角度差θ２と所定の角度とを比較する。図７に示すように、角度差θ２は所定の角度差（４５°）よりも小さいので、Ｓ１１３に進み、制御部３０は、第３リード３７４の延出方向３９１に沿ってキャピラリ１６を斜め上方に向かって上昇させる。そして、Ｓ１１３，Ｓ１１４で、制御部３０は、所定の長さだけワイヤテール８２を延出させた後、Ｓ１１５で、制御部３０は、クランパ１７を閉として、キャピラリ１６を第３リード３７４の延出方向３９１に沿って移動させてワイヤテール８２を切断する。これにより、キャピラリ１６の先端から延出したワイヤテール８２は、ＸＹ面内では、第３リード３７４の延出方向３９１に延びることになる。そして、図４のＳ１１６で、再度ｎを１だけインクリメントして図４のＳ１０５に戻る。 Next, in S111 of FIG. 4, the control unit 30 acquires the extension direction 391 of the third lead 374, and in S112, the control unit 30 obtains the second wire direction 292 (with the second lead 274) shown in FIG. The angle difference θ2 (first angle) between the direction of the second bonding connecting the second pads 273 (the direction of the second straight line) and the extending direction 391 of the third lead 374 is calculated, and the angle difference θ2 and a predetermined angle difference θ2 are calculated. Compare with the angle. As shown in FIG. 7, since the angle difference θ2 is smaller than the predetermined angle difference (45 °), the process proceeds to S113, and the control unit 30 obliquely upwards the capillary 16 along the extension direction 391 of the third lead 374. Raise towards. Then, in S113 and S114, the control unit 30 extends the wire tail 82 by a predetermined length, and then in S115, the control unit 30 closes the clamper 17 and extends the capillary 16 to the third lead 374. The wire tail 82 is cut by moving it along the exit direction 391. As a result, the wire tail 82 extending from the tip of the capillary 16 extends in the extending direction 391 of the third lead 374 in the XY plane. Then, in S116 of FIG. 4, n is incremented by 1 again to return to S105 of FIG.

そして、先の説明に従って、図４のＳ１０５〜Ｓ１０９を実行し、図３に示すように第３リード３７４と第３パッド３７３の間を第３接続ワイヤ３８４で接続する。第３リード３７４の上面には第３接合部３８３が形成されると共に、それに連なって接合部テール３８３ａが形成される。接合部テール３８３ａは、第３リード３７４の延出方向３９１に沿って延びている。 Then, according to the above description, S105 to S109 of FIG. 4 are executed, and as shown in FIG. 3, the third lead 374 and the third pad 373 are connected by the third connection wire 384. A third joint portion 383 is formed on the upper surface of the third lead 374, and a joint portion tail 383a is formed in connection with the third joint portion 383. The joint tail 383a extends along the extension direction 391 of the third lead 374.

次に、第４ボンディングがあるのでＳ１１０がＹｅｓとなり、Ｓ１１１に進み、第４リード４７４の延出方向４９１を取得する。そして、図４のＳ１１２で、図３に示す第３ワイヤ方向３９２（第３リード３７４と第３パッド３７３を結ぶ第３ボンディングの方向（第３の直線の方向））と第４リード４７４の延出方向４９１の角度差θ３（第１角度）を計算し、この角度差θ３と所定の角度とを比較する。ここで、図３に示すように、角度差θ３は所定の角度差（４５°）よりも大きい。この場合、Ｓ１１８に進み、制御部３０は、Ｚ駆動アーム２３を制御して、キャピラリ１６を略垂直に上昇させる。これにより、キャピラリ１６の先端からワイヤテール８２が延出される。 Next, since there is a fourth bonding, S110 becomes Yes, the process proceeds to S111, and the extension direction 491 of the fourth lead 474 is acquired. Then, in S112 of FIG. 4, the third wire direction 392 (the direction of the third bonding connecting the third lead 374 and the third pad 373 (the direction of the third straight line)) and the extension of the fourth lead 474 shown in FIG. The angle difference θ3 (first angle) in the exit direction 491 is calculated, and the angle difference θ3 is compared with a predetermined angle. Here, as shown in FIG. 3, the angle difference θ3 is larger than the predetermined angle difference (45 °). In this case, the process proceeds to S118, and the control unit 30 controls the Z drive arm 23 to raise the capillary 16 substantially vertically. As a result, the wire tail 82 extends from the tip of the capillary 16.

次に、図４のＳ１１９で、制御部３０は、キャピラリ１６の先端のワイヤテール８２の長さが所定の長さになった場合には、クランパ開閉機構２７を制御して、クランパ１７を閉とする。そして、制御部３０は、Ｚ駆動アーム２３を制御して、キャピラリ１６を略垂直に上昇させる。それにより、ワイヤテール８２は、キャピラリ１６から略直線状に延出した状態で切断される。 Next, in S119 of FIG. 4, when the length of the wire tail 82 at the tip of the capillary 16 reaches a predetermined length, the control unit 30 controls the clamper opening / closing mechanism 27 to close the clamper 17. And. Then, the control unit 30 controls the Z drive arm 23 to raise the capillary 16 substantially vertically. As a result, the wire tail 82 is cut in a state of extending substantially linearly from the capillary 16.

このように、図４のＳ１１２で、先のボンディングのワイヤ方向（図３では３９２）と、次のリードの延出方向（図３では４９１）の角度差が所定の角度より大きい場合、Ｓ１１８，Ｓ１１９を実行することにより、キャピラリ１６の先端から略直線状にワイヤテール８２を延出させて切断する。このように処理する理由は、先のボンディングのワイヤ方向と、次のリードの延出方向の角度差が大きい場合、図４のＳ１１３〜Ｓ１１５に従って、次のリードの延出方向に向かってキャピラリ１６を移動させてワイヤテール８２を引っ張ると、ワイヤテール８２が接合部３８５の端部の境界部分で大きな角度で曲がった状態で引っ張られることになるため、パッド３７３やパッド３７３の上面の接合部３８５が剥がれる（損傷する）可能性があるためである。 As described above, in S112 of FIG. 4, when the angle difference between the wire direction of the previous bonding (392 in FIG. 3) and the extension direction of the next lead (491 in FIG. 3) is larger than a predetermined angle, S118, By executing S119, the wire tail 82 extends substantially linearly from the tip of the capillary 16 and is cut. The reason for this processing is that when the angle difference between the wire direction of the previous bonding and the extension direction of the next lead is large, the capillary 16 is directed toward the extension direction of the next lead according to S113 to S115 of FIG. When the wire tail 82 is pulled by moving the wire tail 82, the wire tail 82 is pulled in a state of being bent at a large angle at the boundary portion of the end portion of the joint portion 385. This is because there is a possibility that the wire will come off (damage).

図４のＳ１１８，Ｓ１１９を経ると、キャピラリ１６の先端のワイヤテール８２は略直線状に延びており、次にボンディングを行う第４リード４７４の延出方向４９１に延びていない。そこで、キャピラリ１６を折り曲げステーション７８に移動させて、キャピラリ１６の先端のワイヤテール８２を、第４リード４７４の延出方向４９１に延びるように成形する。具体的には次のように動作させる。図４のＳ１１９の後、Ｓ１２０で、制御部３０は、ｎを１だけインクリメントし、ｎは４になる。そして、Ｓ１０２に戻り、制御部３０は、ワイヤテール折り曲げプログラム３８を実行することにより、ワイヤテール折り曲げ手段として機能する。制御部３０（ワイヤテール折り曲げ手段）は、キャピラリ１６を折り曲げステーション７８に移動させて、キャピラリ１６の先端から略直線状に延出しているワイヤテール８２の先端を、折り曲げステーション７８の孔７６の中に入れる（図５Ｂ参照）。そして、Ｓ１０３で、制御部３０は、次にボンディングする第４リード４７４の延出方向４９１（図３参照）を取得する。次に、Ｓ１０４で、制御部３０は、キャピラリ１６の中心を第４リード４７４の延出方向４９１（図３参照）に沿ってパッドの側に水平に移動させる。すると、図５Ｃに示すように、孔７６の中に入っていたワイヤテール８２は孔７６の内面７６ａと折り曲げステーション７８の上面７５との角部（段部）に引っ掛かり、キャピラリ１６の水平移動に従って横方向に折り曲げられていく。そして、キャピラリ１６の中心が孔７６の外側まで移動すると、ワイヤテール８２は押圧面１６ａと上面７５との間に挟まれ、ワイヤテール８２はキャピラリ１６の貫通孔に挿通されているワイヤ８１に対して略直角方向に折り曲げられる。そして、折り曲げられたワイヤテール８２は第４リード４７４の延出方向４９１に沿って延びる。 After passing through S118 and S119 in FIG. 4, the wire tail 82 at the tip of the capillary 16 extends substantially linearly, and does not extend in the extending direction 491 of the fourth lead 474 to be bonded next. Therefore, the capillary 16 is moved to the bending station 78, and the wire tail 82 at the tip of the capillary 16 is formed so as to extend in the extending direction 491 of the fourth lead 474. Specifically, it operates as follows. After S119 in FIG. 4, in S120, the control unit 30 increments n by 1, and n becomes 4. Then, returning to S102, the control unit 30 functions as a wire tail bending means by executing the wire tail bending program 38. The control unit 30 (wire tail bending means) moves the capillary 16 to the bending station 78, and inserts the tip of the wire tail 82 extending substantially linearly from the tip of the capillary 16 into the hole 76 of the bending station 78. (See Fig. 5B). Then, in S103, the control unit 30 acquires the extension direction 491 (see FIG. 3) of the fourth lead 474 to be bonded next. Next, in S104, the control unit 30 horizontally moves the center of the capillary 16 toward the pad along the extension direction 491 (see FIG. 3) of the fourth lead 474. Then, as shown in FIG. 5C, the wire tail 82 contained in the hole 76 is caught by the corner portion (step portion) between the inner surface 76a of the hole 76 and the upper surface 75 of the bending station 78, and follows the horizontal movement of the capillary 16. It is bent in the horizontal direction. Then, when the center of the capillary 16 moves to the outside of the hole 76, the wire tail 82 is sandwiched between the pressing surface 16a and the upper surface 75, and the wire tail 82 with respect to the wire 81 inserted through the through hole of the capillary 16. It can be bent in a direction approximately right angle. Then, the bent wire tail 82 extends along the extending direction 491 of the fourth lead 474.

そして、先の説明と同様に、図４のＳ１０５〜１０９を実行することで、図３に示すように第４リード４７４と第４パッド４７３の間を第４接続ワイヤ４８４で接続する。第４リード４７４の上面には接合部４８３が形成されると共に、それに連なって接合部テール４８３ａが形成される。Ｓ１０４の完了時点で、キャピラリ１６の先端のワイヤテール８２が第４リード４７４の延出方向４９１に沿って折り曲がっていた為、接合部テール４８３ａは、第４リード４７４の延出方向４９１に沿って形成される。 Then, as in the above description, by executing S105 to 109 in FIG. 4, the fourth lead 474 and the fourth pad 473 are connected by the fourth connection wire 484 as shown in FIG. A joint portion 483 is formed on the upper surface of the fourth lead 474, and a joint portion tail 483a is formed in connection with the joint portion 483. At the completion of S104, the wire tail 82 at the tip of the capillary 16 was bent along the extending direction 491 of the fourth lead 474, so that the joint tail 483a is along the extending direction 491 of the fourth lead 474. Is formed.

以上説明したようにボンディングを順次を行い、図４のＳ１１０で、次のボンディング（第（ｎ＋１）のボンディング）がない場合には、Ｓ１１７に進み、制御部３０は、所定のボンディング終了動作を実行した後、一連の処理を終了する。 Bonding is sequentially performed as described above, and if there is no next bonding (bonding of the (n + 1) th) in S110 of FIG. 4, the process proceeds to S117, and the control unit 30 executes a predetermined bonding end operation. After that, the series of processes is terminated.

次に、以上説明した本実施形態のワイヤボンディング装置１０の作用効果について説明する。 Next, the operation and effect of the wire bonding apparatus 10 of the present embodiment described above will be described.

以上説明した本実施形態のワイヤボンディング装置１０によれば、図３に示すように、基板（被実装部材）の各リード１７４，２７４，３７４，４７４・・の延出方向（リードのワイヤが接続される箇所が延びる方向）に沿って、各リード上面の各接合部テール１８３ａ，２８３ａ，３８３ａ，４８３ａ・・が延びるように形成される。そのため、各リードの上面から各接合部テールがはみ出すことを防ぐことができ、隣り合うリードの接合部テール同士の接触（ショート）を的確に防ぐことができる。 According to the wire bonding apparatus 10 of the present embodiment described above, as shown in FIG. 3, the lead wires 174, 274, 374, 474 ... of the substrate (mounted member) are extended (lead wires are connected). The joint tails 183a, 283a, 383a, 483a ... On the upper surface of each lead are formed so as to extend along the direction in which the portion is extended). Therefore, it is possible to prevent each joint tail from protruding from the upper surface of each lead, and it is possible to accurately prevent contact (short circuit) between the joint tails of adjacent leads.

また、以上説明した本実施形態のワイヤボンディング装置１０によれば、先のボンディングのワイヤ方向と次のリード（次にボンディングするリード）の延出方向との角度差が大きく、先のパッド７３にボンディングした後のキャピラリ１６の移動により、キャピラリ１６先端のワイヤテール８２を次のリードの延出方向に折り曲げることができない場合には、別途設けた折り曲げステーション７８によりワイヤテール８２を次のリードの延出方向に折り曲げることができる。 Further, according to the wire bonding apparatus 10 of the present embodiment described above, the angle difference between the wire direction of the previous bonding and the extending direction of the next lead (lead to be bonded next) is large, and the pad 73 has a large angle difference. If the wire tail 82 at the tip of the capillary 16 cannot be bent in the extending direction of the next lead due to the movement of the capillary 16 after bonding, the wire tail 82 is extended to the next lead by a separately provided bending station 78. Can be bent in the outward direction.

また、以上説明した本実施形態のワイヤボンディング装置１０によれば、ボンディングステージまたはボンディングツールを回転させることなく、ウェッジボンディングを行うことができる。そのため、従来のウェッジツールを用いたボンディング装置よりも高速にウェッジボンディングを行うことができる。また、ボンディングステージやボンディングツールを回転させることが必要なくなるので簡便な装置とすることができる。 Further, according to the wire bonding apparatus 10 of the present embodiment described above, wedge bonding can be performed without rotating the bonding stage or the bonding tool. Therefore, wedge bonding can be performed at a higher speed than a bonding device using a conventional wedge tool. Further, since it is not necessary to rotate the bonding stage and the bonding tool, it can be a simple device.

次に、別の実施形態について説明する。 Next, another embodiment will be described.

以上説明した実施形態では、リード７４上面の接合部テール８３ａを、常に、リード７４の延出方向に沿って形成していた。しかし、別の実施形態として、リード７４間の間隔が広い基板（被実装部材）、または、基板の中でリード７４間の間隔が広い部分については、隣り合うリードの接合部テール同士の接触のおそれがないため、リード７４上面の接合部テール８３ａをワイヤ方向に沿って形成してもよい。接合部テール８３ａをワイヤ方向に沿って形成する方法としては、特許文献３の第００３６段落〜第００７０段落、図４、図５Ａ〜図５Ｍ、図６に記載されている方法を適用することができる。特許文献３では、パッドに第１ボンドし、リードに第２ボンドするボンディングを行っているが、それを、リードに第１ボンドし、パッドに第２ボンドするボンディングに変更すればよい。以下に、本発明の図１に示したワイヤボンディング装置１０によって、リード７４上面の接合部テール８３ａをワイヤ方向に沿って形成する方法を簡単に説明する。 In the embodiment described above, the joint tail 83a on the upper surface of the lead 74 is always formed along the extending direction of the lead 74. However, as another embodiment, the substrate (mounted member) having a wide distance between the leads 74 or the portion of the substrate having a wide distance between the leads 74 is in contact with the joint tails of adjacent leads. Since there is no risk, the joint tail 83a on the upper surface of the lead 74 may be formed along the wire direction. As a method for forming the joint tail 83a along the wire direction, the methods described in paragraphs 0036 to 0070 of Patent Document 3, FIGS. 4, 5A to 5M, and FIG. 6 can be applied. can. In Patent Document 3, the first bond to the pad and the second bond to the lead are performed, but this may be changed to the first bond to the lead and the second bond to the pad. Hereinafter, a method of forming the joint tail 83a on the upper surface of the lead 74 along the wire direction by the wire bonding apparatus 10 shown in FIG. 1 of the present invention will be briefly described.

ここでは、図９に示すように、第１リード１７４と第１パッド１７３を第１接続ワイヤ１８４で接続（第１ボンディング）し、次に、第２リード２７４と第２パッド２７３を第２接続ワイヤ２８４で接続（第２ボンディング）する場合を例に、接合部テール１８３ａ，２８３ａをワイヤ方向に沿って形成する方法を説明する。まず、制御部３０は、第１リード１７４と第１パッド１７３を結ぶ直線の方向（第１ワイヤ方向１９２）を取得する。そして、制御部３０は、図８に示すように、折り曲げステーションの孔７６と上面を用いて、図４のＳ１０４で説明した方法と同様の方法により、キャピラリ１６の先端から延出するワイヤテール８２を第１ワイヤ方向１９２に沿って折り曲げる。なお、必要に応じて、制御部３０を第２の算出手段として機能させ、第１リード１７４と第１パッド１７３を結ぶ直線の方向を、キャピラリの端部から延出するワイヤテールの延出方向（第２のテール延出方向）として算出してから、上記動作を行うようにしてもよい。 Here, as shown in FIG. 9, the first lead 174 and the first pad 173 are connected by the first connection wire 184 (first bonding), and then the second lead 274 and the second pad 273 are secondly connected. A method of forming the joint tails 183a and 283a along the wire direction will be described by taking the case of connecting with the wire 284 (second bonding) as an example. First, the control unit 30 acquires the direction of the straight line connecting the first lead 174 and the first pad 173 (first wire direction 192). Then, as shown in FIG. 8, the control unit 30 extends from the tip of the capillary 16 by the same method as described in S104 of FIG. 4, using the hole 76 and the upper surface of the bending station. Is bent along the first wire direction 192. If necessary, the control unit 30 is made to function as a second calculation means, and the direction of the straight line connecting the first lead 174 and the first pad 173 is the extension direction of the wire tail extending from the end of the capillary. After calculating as (the second tail extending direction), the above operation may be performed.

そして、制御部３０は、図９に示すように、キャピラリ１６によりワイヤテール８２を第１リード１７４に第１ボンドし、ワイヤをルーピングして、第１パッド１７３に第２ボンドする。それにより、第１リード１７４と第１パッド１７３の間が第１接続ワイヤ１８４で接続される。第１リード１７４の上面には接合部１８３が形成されると共に、それに連なって接合部テール１８３ａが形成される。第１リード１７４に第１ボンドする前に、キャピラリ１６の先端のワイヤテール８２が第１ワイヤ方向１９２に折り曲がっていたことにより、接合部テール１８３ａは、第１ワイヤ方向１９２に沿って形成される。 Then, as shown in FIG. 9, the control unit 30 first bonds the wire tail 82 to the first lead 174 by the capillary 16, loops the wire, and second-bonds the wire tail 82 to the first pad 173. As a result, the first lead 174 and the first pad 173 are connected by the first connecting wire 184. A joint portion 183 is formed on the upper surface of the first lead 174, and a joint portion tail 183a is formed in connection with the joint portion 183. The joint tail 183a is formed along the first wire direction 192 because the wire tail 82 at the tip of the capillary 16 is bent in the first wire direction 192 before the first bond to the first lead 174. NS.

第１パッド１７３（先のパッド）にワイヤをボンディングした後、制御部３０は、第２リード２７４（次のリード）と第２パッド２７３（次のパッド）を結ぶ直線の方向（第２ワイヤ方向２９２）を取得する。そして、制御部３０は、上記した第１のワイヤテール延出プログラム３４に代えて、第２のワイヤテール延出プログラム３６を実行することにより、第２のワイヤテール延出手段として機能する。制御部３０（第２のワイヤテール延出手段）は、第１パッド１７３にワイヤをボンディングした後、クランパを開としてキャピラリ１６を上昇させて、図９に示すように、キャピラリ１６を第２ワイヤ方向２９２に沿って所定距離だけ移動させ、キャピラリ１６の貫通孔１６ｂからワイヤテール８２を第２ワイヤ方向２９２に沿った方向に延出させる。なお、必要に応じて、制御部３０を第２の算出手段として機能させ、第２リード２７４と第２パッド２７３を結ぶ直線の方向を、キャピラリの端部から延出するワイヤテールの延出方向（第２のテール延出方向）として算出してから、上記動作を行うとしてもよい。なお、以下のテールカット動作も同様である。 After bonding the wire to the first pad 173 (first pad), the control unit 30 determines the direction of a straight line connecting the second lead 274 (next lead) and the second pad 273 (next pad) (second wire direction). 292) is acquired. Then, the control unit 30 functions as a second wire tail extension means by executing the second wire tail extension program 36 instead of the first wire tail extension program 34 described above. The control unit 30 (second wire tail extending means) bonds the wire to the first pad 173, opens the clamper, raises the capillary 16, and raises the capillary 16 to the second wire as shown in FIG. The wire tail 82 is moved along the direction 292 by a predetermined distance, and the wire tail 82 is extended in the direction along the second wire direction 292 from the through hole 16b of the capillary 16. If necessary, the control unit 30 is made to function as a second calculation means, and the direction of the straight line connecting the second lead 274 and the second pad 273 is the extension direction of the wire tail extending from the end of the capillary. The above operation may be performed after calculating as (the second tail extending direction). The same applies to the following tail cut operation.

そして、制御部３０は、上記した第１のテールカットプログラム３５に代えて、第２のテールカットプログラム３７を実行することで第２のテールカット手段として機能する。制御部３０（第２のテールカット手段）は、キャピラリ１６の先端にワイヤテール８２を延出させた後、クランパを閉として、キャピラリ１６を第２ワイヤ方向２９２に沿った方向に移動させてワイヤテール８２を切断する。切断後、キャピラリ１６の先端から延出するワイヤテール８２は第２ワイヤ方向２９２に沿って折り曲がっている。すなわち、キャピラリの端部から延出するワイヤテール８２の延出方向と、第２ワイヤ方向２９２とが同じとなっている。なお、この際、キャピラリの端部から延出するワイヤテールの延出方向を、第２のテール延出方向と言うこともできる。 Then, the control unit 30 functions as a second tail cut means by executing the second tail cut program 37 instead of the first tail cut program 35 described above. The control unit 30 (second tail cutting means) extends the wire tail 82 to the tip of the capillary 16, closes the clamper, and moves the capillary 16 in the direction along the second wire direction 292 to wire. Cut the tail 82. After cutting, the wire tail 82 extending from the tip of the capillary 16 is bent along the second wire direction 292. That is, the extending direction of the wire tail 82 extending from the end of the capillary is the same as the second wire direction 292. At this time, the extending direction of the wire tail extending from the end of the capillary can also be referred to as the second tail extending direction.

次に、制御部３０は、図９に示すように、キャピラリ１６によりワイヤテール８２を第２リード２７４に第１ボンドし、ワイヤをルーピングして、第２パッド２７３に第２ボンドする。それにより、第２リード２７４と第２パッド２７３の間が第２接続ワイヤ２８４で接続される。第２リード２７４の上面には接合部２８３が形成されると共に、それに連なって接合部テール２８３ａが形成される。第２リード２７４に第１ボンドする前に、キャピラリ１６の先端のワイヤテール８２が第２ワイヤ方向２９２に折り曲がっていたことにより、接合部テール２８３ａは、第２ワイヤ方向２９２に沿って形成される。このようにして、リードとパッドの間をワイヤで接合していくことにより、各リード上面の接合部テールは、ワイヤ方向に沿って形成されることになる。以上が、接合部テールをワイヤ方向に沿って形成する方法の説明である。 Next, as shown in FIG. 9, the control unit 30 first bonds the wire tail 82 to the second lead 274 by the capillary 16, loops the wire, and second-bonds the wire tail 82 to the second pad 273. As a result, the second lead 274 and the second pad 273 are connected by the second connecting wire 284. A joint portion 283 is formed on the upper surface of the second lead 274, and a joint portion tail 283a is formed in connection with the joint portion 283. The joint tail 283a is formed along the second wire direction 292 because the wire tail 82 at the tip of the capillary 16 is bent in the second wire direction 292 before the first bond to the second lead 274. NS. By joining the leads and the pads with wires in this way, the joint tails on the upper surfaces of the leads are formed along the wire direction. The above is a description of the method of forming the joint tail along the wire direction.

さらに別の実施形態として、ワイヤボンディング装置１０は、接合部および接合部テールの長さと、基板のリード間の間隔に基づいて、選択的に、接合部テールの延出方向を変化させるようにしてもよい。例えば、図３に示すように、基板のリードにおける接合部（図３では接合部３８３）と接合部テール（図３では接合部テール３８３ａ）を合わせた長さＴＬ（第１の長さ、とも言う）が、リード間の最小間隔ＰＬより大きい場合には、隣り合う接合部テール同士（図３では接合部テール３８３ａ，２８３ａ）が接触する可能性がある。そのため、この場合には、図４に示すフローに従って制御を行い、制御部３０を第１のワイヤテール延出手段および第１のテールカット手段として機能させ、接合部テールの延出方向をリードの延出方向に合わせるようにする。一方、接合部と接合部テールを合わせた長さＴＬが、リード間の最小間隔ＰＬより同じか小さくなる場合には、図８，９で説明した制御を行い、制御部３０を第２のワイヤテール延出手段および第２のテールカット手段として機能させ、接合部テールの延出方向をワイヤ方向に合わせるようにする。このようにすれば、接合部テールの延出方向を最適化することができる。 In yet another embodiment, the wire bonding apparatus 10 selectively changes the extending direction of the joint tail based on the length of the joint and the joint tail and the distance between the leads of the substrate. May be good. For example, as shown in FIG. 3, the length TL (first length) of the joint portion (joint portion 383 in FIG. 3) and the joint portion tail (joint portion tail 383a in FIG. 3) in the lead of the substrate is combined. If it is larger than the minimum distance PL between the leads, adjacent joint tails (joint tails 383a and 283a in FIG. 3) may come into contact with each other. Therefore, in this case, control is performed according to the flow shown in FIG. 4, the control unit 30 functions as the first wire tail extending means and the first tail cutting means, and the extending direction of the joint tail is led. Try to match the extension direction. On the other hand, when the total length TL of the joint portion and the joint portion tail is the same as or smaller than the minimum distance PL between the leads, the control described with reference to FIGS. 8 and 9 is performed, and the control unit 30 is connected to the second wire. It functions as a tail extending means and a second tail cutting means so that the extending direction of the joint tail is aligned with the wire direction. By doing so, the extending direction of the joint tail can be optimized.

なお、オペレータが、不図示の入力装置を用いて、基板のリード毎に接合部テールの延出方向を個別に設定できてもよい。この場合、設定情報を制御データ４０の一部として記憶部３２に予め格納しておく。ワイヤボンディング装置１０は、ボンディングの際に、記憶部３２から設定情報を読み出して、設定情報に従って基板のリード毎に接合部テールの延出方向を変化させる。 It should be noted that the operator may be able to individually set the extension direction of the joint tail for each lead of the substrate by using an input device (not shown). In this case, the setting information is stored in advance in the storage unit 32 as a part of the control data 40. At the time of bonding, the wire bonding apparatus 10 reads setting information from the storage unit 32 and changes the extending direction of the joint tail for each lead of the substrate according to the setting information.

１０ ワイヤボンディング装置、１１ ワイヤスプール、１３ 超音波トランスデューサ、１４ ボンディングステージ、１５ 超音波振動子、１６ キャピラリ（ボンディングツール）、１６ａ 押圧面、１６ｂ 貫通孔、１７ クランパ、１８ 移動機構、１９ Ｚ方向モータ、２０ ＸＹステージ、２１ ボンディングヘッド、２３ Ｚ駆動アーム、２７ クランパ開閉機構、２８ カメラ、３０ 制御部、３１ データバス、３２ 記憶部、３３ ボンディング方向計算プログラム、３４ 第１のワイヤテール延出プログラム、３５ 第１のテールカットプログラム、３６ 第２のワイヤテール延出プログラム、３７ 第２のテールカットプログラム、３８ ワイヤテール折り曲げプログラム、３９ 制御プログラム、４０ 制御データ、４４ インターフェース回路、６０ コンピュータ、７１ 基板、７２ 半導体チップ、７３ パッド（電極）、７４ リード、７５ 上面、７６ 孔、７６ａ 内面、７８ 折り曲げステーション、８１ ワイヤ、８２ ワイヤテール、８３ 接合部（第１ボンド点）、８３ａ 接合部テール（ワイヤテール）、８４ 接続ワイヤ、８５ 接合部（第２ボンド点）、１７３ 第１パッド、１７４ 第１リード、１８３ 接合部、１８３ａ 接合部テール、１８４ 第１接続ワイヤ、１８５ 接合部、１９１ 第１リードの延出方向、１９２ 第１ワイヤ方向、２７３ 第２パッド、２７４ 第２リード、２８３ 接合部、２８３ａ 接合部テール、２８４ 第２接続ワイヤ、２８５ 接合部、２９１ 第２リードの延出方向（ワイヤテールの延出方向）、２９２ 第２ワイヤ方向、３７３ 第３パッド、３７４ 第３リード、３８３ 接合部、３８３ａ 接合部テール、３８４ 第３接続ワイヤ、３８５ 接合部、３９１ 第３リードの延出方向（ワイヤテールの延出方向）、３９２ 第３ワイヤ方向、４７３ 第４パッド、４７４ 第４リード、４８３ 接合部、４８３ａ 接合部テール、４８４ 第４接続ワイヤ、４８５ 接合部、４９１ 第４リードの延出方向、１０７２ 半導体チップ、１０７３ パッド、１０７４ リード、１０８３ 接合部（第１ボンド点）、１０８３ａ 接合部テール（ワイヤテール）、１０８４ ワイヤ。 10 wire bonding device, 11 wire spool, 13 ultrasonic transducer, 14 bonding stage, 15 ultrasonic transducer, 16 capillary (bonding tool), 16a pressing surface, 16b through hole, 17 clamper, 18 moving mechanism, 19 Z direction motor , 20 XY stage, 21 bonding head, 23 Z drive arm, 27 clamper opening / closing mechanism, 28 camera, 30 control unit, 31 data bus, 32 storage unit, 33 bonding direction calculation program, 34 first wire tail extension program, 35 1st tail cut program, 36 2nd wire tail extension program, 37 2nd tail cut program, 38 wire tail bending program, 39 control program, 40 control data, 44 interface circuit, 60 computer, 71 board, 72 semiconductor chips, 73 pads (electrodes), 74 leads, 75 top surfaces, 76 holes, 76a inner surfaces, 78 bending stations, 81 wires, 82 wire tails, 83 joints (first bond point), 83a joint tails (wire tails). ), 84 connection wire, 85 junction (second bond point), 173 first pad, 174 first lead, 183 junction, 183a junction tail, 184 first connection wire, 185 junction, 191 first lead. Extension direction, 192 1st wire direction, 273 2nd pad, 274 2nd lead, 283 joint, 283a joint tail, 284 2nd connection wire, 285 joint, 291 2nd lead extension direction (wire tail) 292 2nd wire direction, 373 3rd pad, 374 3rd lead, 383 joint, 383a joint tail, 384 3rd connection wire, 385 joint, 391 3rd lead extension direction ( Wire tail extension direction), 392 3rd wire direction, 473 4th pad, 474 4th lead, 483 joint, 483a joint tail, 484 4th connection wire, 485 joint, 491 4th lead extension Direction, 1072 semiconductor chip, 1073 pad, 1074 lead, 1083 junction (first bond point), 1083a junction wire Le (wire tail), 1084 wire.

Claims (6)

被実装部材のリードと半導体ダイの電極とをワイヤで接続するワイヤボンディング装置であって、
前記ワイヤが挿通されるキャピラリと、
前記ワイヤが接続されるリードの形状を取得する形状取得手段と、
前記ワイヤが次に接続されるリードの形状に基づいて、前記キャピラリの端部から延出するワイヤテールの延出方向を算出する算出手段と、
前記リードと前記電極とを前記ワイヤで接続した後、前記延出方向に前記キャピラリを移動させて前記ワイヤを切断して前記ワイヤテールを形成する切断手段とを備える、
ことを特徴とするワイヤボンディング装置。A wire bonding device that connects the leads of the mounted member and the electrodes of the semiconductor die with wires.
The capillary through which the wire is inserted and
A shape acquisition means for acquiring the shape of the lead to which the wire is connected, and
A calculation means for calculating the extension direction of the wire tail extending from the end of the capillary based on the shape of the lead to which the wire is next connected.
After connecting the lead and the electrode with the wire, the capillary is moved in the extending direction to cut the wire to form the wire tail.
A wire bonding device characterized by that. 請求項１に記載のワイヤボンディング装置であって、
前記ワイヤテールの前記延出方向はテール延出方向であり、
前記形状取得手段は、前記ワイヤが次に接続されるリードの前記ワイヤが接続される箇所が延びる方向であるリード方向を認識し、
前記切断手段は、前記テール延出方向が前記リード方向と同じ方向になるように前記ワイヤテールを形成する、
ことを特徴とするワイヤボンディング装置。The wire bonding apparatus according to claim 1.
The extension direction of the wire tail is the tail extension direction.
The shape acquisition means recognizes the lead direction, which is the direction in which the portion of the lead to which the wire is connected next extends.
The cutting means forms the wire tail so that the tail extending direction is the same as the lead direction.
A wire bonding device characterized by that. 請求項１に記載のワイヤボンディング装置であって、
前記ワイヤテールの前記延出方向はテール延出方向であり、
前記キャピラリの先端から延出した前記ワイヤテールを引っ掛ける段部を有する折り曲げステーションと、
前記キャピラリを前記折り曲げステーションに移動させ、前記ワイヤテールを前記段部に沿った位置に配置した後、前記テール延出方向に前記ワイヤテールを折り曲げる折り曲げ手段と、をさらに備える、
ことを特徴とするワイヤボンディング装置。The wire bonding apparatus according to claim 1.
The extension direction of the wire tail is the tail extension direction.
A bending station having a step for hooking the wire tail extending from the tip of the capillary, and a bending station.
Further provided is a bending means for moving the capillary to the bending station, arranging the wire tail at a position along the step, and then bending the wire tail in the tail extending direction.
A wire bonding device characterized by that. 請求項３に記載のワイヤボンディング装置であって、
前記リードと前記電極とを接続した前記ワイヤの方向と、前記ワイヤが次に接続されるリードの前記ワイヤが接続される箇所が延びる方向であるリード方向とのなす角度である第１角度を取得し、
前記第１角度が所定の角度よりも小さい場合には前記切断手段によって前記ワイヤテールを形成し、前記第１角度が所定の角度以上である場合には、前記折り曲げ手段によって前記ワイヤテールの形成を行う、
ことを特徴とするワイヤボンディング装置。The wire bonding apparatus according to claim 3.
Acquires a first angle which is an angle formed by the direction of the wire connecting the lead and the electrode and the lead direction which is the direction in which the point where the wire is connected of the lead to which the wire is connected next extends. death,
When the first angle is smaller than a predetermined angle, the wire tail is formed by the cutting means, and when the first angle is equal to or larger than the predetermined angle, the wire tail is formed by the bending means. conduct,
A wire bonding device characterized by that. 請求項１に記載のワイヤボンディング装置であって、
前記算出手段は、第１の算出手段であり、
前記切断手段は、第１の切断手段であり、
前記ワイヤテールの前記延出方向は第１のテール延出方向であり、
前記ワイヤが次に接続される前記リードと前記電極の間を結ぶ直線の方向を、前記キャピラリの端部から延出するワイヤテールの延出方向である第２のテール延出方向として算出する第２の算出手段と、
前記リードと前記電極とを前記ワイヤで接続した後、前記第２のテール延出方向に前記キャピラリを移動させて前記ワイヤを切断して前記ワイヤテールを形成する第２の切断手段と、をさらに備える、
ことを特徴とするワイヤボンディング装置。The wire bonding apparatus according to claim 1.
The calculation means is the first calculation means, and is
The cutting means is a first cutting means.
The extension direction of the wire tail is the first tail extension direction.
The direction of the straight line connecting the lead to which the wire is next connected and the electrode is calculated as the second tail extending direction which is the extending direction of the wire tail extending from the end of the capillary. 2 calculation means and
After connecting the lead and the electrode with the wire, a second cutting means for moving the capillary in the second tail extending direction to cut the wire to form the wire tail, and further. Prepare, prepare
A wire bonding device characterized by that. 請求項５に記載のワイヤボンディング装置であって、
前記リードに形成される接合部と前記接合部から突出した接合部テールを合わせた第１の長さを取得し、
前記第１の長さが、前記被実装部材のリード間の最小間隔より大きくなる場合には、前記第１の切断手段によって前記ワイヤテールを形成し、前記第１の長さが、前記最小間隔よりも同じか小さくなる場合には前記第２の切断手段によって前記ワイヤテールを形成する、
ことを特徴とするワイヤボンディング装置。
The wire bonding apparatus according to claim 5.
The first length obtained by combining the joint portion formed on the lead and the joint portion tail protruding from the joint portion is obtained.
When the first length is larger than the minimum distance between the leads of the mounted member, the wire tail is formed by the first cutting means, and the first length is the minimum distance. If it is the same or smaller than, the wire tail is formed by the second cutting means.
A wire bonding device characterized by that.
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