TWI553677B - Thin inductive components embedded in the structure - Google Patents

Description

Thinned inductive component buried structure

A component connection structure, in particular, a thinned inductor component embedding structure in which a structure of at least two components constitutes a basic circuit is built in a susceptor, which contributes to planning of an electronic circuit in an electronic device, and improves electronic components. Configuration density on electronic circuits.

In response to the miniaturization of IC process technology and the trend of thin and light electronic information products, electronic components mounted on printed circuit boards have gradually evolved from plug-in components to surface mount devices (SMD).

Please refer to the first figure, which is a structural diagram of a conventional SMD inductor component. The magnetic core 1 has an upper end portion 11, a middle portion portion 14, and a lower end portion 12 and is I-shaped, and both side edges of the upper end portion 11 and the lower end portion 12 have grooves 111 and 111', 121 and 121', and the upper end portion 11 A recess 13 is formed in the surface adjacent to the grooves 111 and 111'. Further, the surfaces of the upper end portion 11 and the recessed portion 13 are coated with silver (not shown) to form a silver-plated surface. First, the coil 2 is wound around the middle portion 14 of the magnetic core 1, and the wiring portions 21, 22 of the coil 2 are bent and received in the recesses 13 and 111', and then the solder 16 is used for wiring. The portions 21 and 22 are fixed to the silver plating surface of the upper portion 11 described above.

However, although the height of the SMD inductive component is lower than that of the plug-in component, the thickness of the handheld electronic device is becoming thinner and thinner, and the above-mentioned SMD inductive component cannot be applied to the existing thinned handheld electronic device; specifically, the first The height of the SMD inductance element of the figure is the sum of the upper end portion, the middle portion and the lower end portion, and therefore the height of the SMD inductance element cannot be limited to 2 mm or less.

In addition, the inductive component of the first figure must first be coated with silver on the upper end portion 11 and the recessed portion 13, and then the solder portions 16 are used to fix the wiring portions 21, 22 to the silver plating surface of the upper portion 11 and must also be manually used. The connection portions 21 and 22 of the coil 2 are bent, so that the inductance element of the first figure can be electrically connected to the circuit through a manual process and through multiple processes. The state on the board.

Furthermore, since the existing wound inductor elements are wound around the magnetic core, the wound inductor element does not have a planar structure for vacuum adsorption or clamping, so the existing wound inductor can only be artificially The welding method is to solder the inductor component on the circuit board, and the wired inductor cannot be directly connected to the circuit board by means of automatic mechanical equipment, so it cannot be mass-produced, and is welded by manual welding, and the alignment accuracy is easily deviated. The problem.

In particular, the coil 2 only has the middle portion 14 of the magnetic core 1 for winding the wire, and cannot wrap all the portions of the magnetic core 1. Therefore, the number of winding turns of the coil 2 is limited, and the wire is openly disposed on the magnetic core. It also causes the inductance to be unacceptable. In particular, the existing SMD inductor components have a complicated structure, which is disadvantageous for mass production and lower production cost.

Please refer to the extremely thin inductor structure of the application of Taiwan Patent No. M490096. This case is also the structural design previously proposed by the inventor for reducing the thickness of the inductor structure, although the coil can be placed in the cavity of the pedestal. Means, and indeed achieve the purpose of effectively reducing the thickness of the inductor structure and increasing the inductance, only the inductor must be matched with other electronic components in the electronic circuit to play various circuits such as filtering, oscillation, phase shift or resonance.

Therefore, only a single component such as an inductor is disposed in the pedestal, but other components than the inductor still occupy the wiring space on the circuit board. Therefore, it is necessary to further provide a structure in which at least two components constitute a basic circuit in the pedestal. Rather than a single active component or a single passive component, the programming of the electronic circuit in the electronic device is further facilitated, and the density of the electronic component on the electronic circuit is increased, thereby reducing the space occupied by the component structure in the electronic device. The purpose is to apply to electronic devices that are increasingly thinner and more powerful.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a component connection structure which is compact in structure and easy to manufacture, and therefore, in mass production, production cost can be reduced, production yield and production efficiency can be improved.

Another object of the present invention is to provide a thinned inductive component embedding structure for use in a conventional thinned handheld electronic device, which reduces the space occupied by the component in the electronic device and contributes to the electronic device in the electronic device. Planning of the circuit.

In order to achieve the above object, a specific technical means of the present invention comprises a base, a cavity is formed on one surface of the base, the cavity has an accommodating space, and the base is preset with two terminals, wherein the two terminals Each of the top ends is formed with a bent portion, the bent portion is exposed outside the base, and the bottom ends of the two terminals each form a hook portion, wherein one of the hook portions is located inside the base, the hook Another portion of the portion is exposed outside the base, and another portion of the hook portion that is exposed outside the base is defined as a connecting portion; a coil is fixed in the chamber, and both ends of the coil are electrically connected The top end of the two terminals or the bent portion; an electronic component disposed in the chamber and disposed on one side of the coil, wherein the electronic component and the connecting portion form an electrical connection, wherein the base There are at least two vertical portions, each of which is provided with a terminal, and the two vertical portions are formed on a side of the base corresponding to the coil, and the base has a planar structure corresponding to the other side of the coil.

The main feature of the present invention is that the chamber is provided through the pedestal, so that the susceptor is provided with coils and electronic components that are perpendicular to each other (up and down stacking) or parallel stacking (left and right side by side), and the coil and the electronic component Through the terminals, the terminals can be connected in series or in parallel, thereby providing several basic circuits. For example, when the electronic component is a resistor, the thinned inductor component of the present invention is embedded into the resistor-inductor circuit; and when the electronic component is a capacitor In the case where the thinned inductor element of the present invention is embedded in a structure, it becomes a capacitance-inductor circuit, and thus can be used in a series or parallel resonant circuit, and can also be used in a filter circuit, a phase shift circuit, or other circuits. Therefore, it is advantageous for the application of electronic circuits.

Another feature of the present invention is that since the pedestal is provided with the chamber capable of accommodating one or several components, and the two terminals are preset at appropriate places of the susceptor, the thinned inductance component provided by the present invention is buried. the structure can be reduced to about 2mm, so that the thickness of the structural member to be connected becomes small, when the present invention is furthermore using a wire coil, inductance can easily exceed more than 100 μ H, and therefore more suitable for very light and thin The electronic device reduces the occupation space of the component in the electronic device and contributes to the planning of the electronic circuit in the electronic device.

Another main feature of the present invention is that the thinned inductive component embedded structure 100 provided by the present invention has a simple structure and is therefore easy to manufacture. In particular, the pedestal can be preset with the terminal 33, so that the base is actually assembled. The seat, the coil and the electronic component group are immediately available, which contributes to mass production while reducing production costs and increasing production yield and production efficiency.

In particular, the present invention has a planar structure on the other side of the corresponding coil of the susceptor, and thus can It can be accurately and quickly soldered to the circuit board by vacuum adsorption or clamping of the fixture or automated mechanical equipment, which is helpful for mass production and improved alignment accuracy.

Therefore, the component connection structure of the present invention is very suitable for use in an existing thinned handheld electronic device, reducing the occupation area of the component on the circuit board, so that more components are disposed on the circuit board, and the electronic component is improved on the electronic circuit. The configuration density makes the planning of electronic circuits in the electronic device more flexible and flexible.

[study]

1‧‧‧ magnetic core

2‧‧‧ coil

11‧‧‧Upper end

12‧‧‧ lower end

13‧‧‧Depression

14‧‧ mid-section

16‧‧‧Solder

21, 22‧‧ ‧ wiring department

111, 111’, 121, 121’‧‧‧ grooves

〔this invention〕

100‧‧‧Thin-shaped inductive component buried structure

3‧‧‧Base

31‧‧‧ chamber

33‧‧‧ terminals

35‧‧‧planar structure

331‧‧‧Bend

333‧‧‧Hook

333a‧‧‧Connecting Department

333b‧‧‧Internal Department

335‧‧‧Limited neck

5‧‧‧ coil

51‧‧‧Export

53‧‧‧Connecting terminal

7‧‧‧Electronic components

8‧‧‧Another electronic component

3a, 3b, 3c, 3d‧‧‧

The first figure is a structural diagram of a conventional SMD inductive component.

The second figure is an exploded perspective view of a first preferred embodiment of a thinned inductive component embedded structure of the present invention.

The third figure is a schematic view of the terminal of the thinned inductor element embedded structure of the present invention.

The fourth figure is a schematic view of the use of the I-shaped coil in the buried structure of the thinned inductor element of the present invention.

Fig. 5 is a side cross-sectional view showing a first preferred embodiment of the thinned inductor element embedding structure of the present invention.

Fig. 6A is an exploded perspective view showing a second preferred embodiment of the thinned inductor element embedding structure of the present invention.

Fig. 6B is an exploded perspective view showing a third preferred embodiment of the thinned inductor element embedding structure of the present invention.

Fig. 6C is an exploded perspective view showing a fourth preferred embodiment of the thinned inductor element embedding structure of the present invention.

Fig. 6D is an exploded perspective view showing a fifth preferred embodiment of the thinned inductor element embedding structure of the present invention.

Fig. 6E is an exploded perspective view showing a sixth preferred embodiment of the thinned inductor element embedding structure of the present invention.

Fig. 7A is an exploded perspective view showing a seventh preferred embodiment of the thinned inductor element embedding structure of the present invention.

Fig. 7B is an exploded perspective view showing the eighth preferred embodiment of the thinned inductor element embedding structure of the present invention.

Fig. 8 is an exploded perspective view showing a ninth preferred embodiment of the thinned inductor element embedding structure of the present invention.

The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

Referring to the second drawing, a perspective exploded view of a first preferred embodiment of a thinned inductive component embedding structure of the present invention, with reference to the fifth embodiment, a thinned inductor component embedding structure of the first preferred embodiment of the present invention Side section view. As shown in the second figure, the thinned inductor component embedding structure 100 of the present invention comprises at least a pedestal 3, a coil 5 and an electronic component 7, wherein a cavity 31 is formed on one surface of the pedestal 3. The chamber 31 has an accommodating space, and the pedestal 3 is preset with two terminals 33. The pedestal 3 is made of an insulating material, and the wall surrounding the chamber 31 may be discontinuous. Or continuity settings.

Referring to the third figure, a schematic diagram of a terminal of the thinned inductor element embedding structure of the present invention is shown in the third figure, and referring to the second figure, the top ends of the two terminals 33 each form a bent portion 331, and the bend is formed. The bottom portion 331 is exposed outside the base 3, and the bottom ends of the two terminals 33 are respectively formed with a hook portion 333, so that the two terminals 33 can be tightly fixed in the base 3 by the hook portion 333. One portion of the hook portion 333 is located inside the base 3, and another portion of the hook portion 333 is exposed outside the base 3. Here, the hook portion 333 is exposed outside the base 3. The other part is defined as a connecting portion 333a, and a part of the hook portion 333 located in the base 3 is determined It is an embedded part 333b.

As shown in the second and fifth figures, the coil 5 is fixed in the accommodating space of the chamber 31, and both ends of the coil 5 are electrically connected to the top end of the two terminals 33 or the bent portion 331; The electronic component 7 is also disposed in the chamber 31 and located on one side of the coil 5, wherein the electronic component 7 and the connecting portion 333a form an electrical connection with each other, and the base 3 corresponds to the coil 5 One side is a planar structure 35. The electronic component 7 is a capacitor, resistor, inductor or other suitable electronic component.

The coil 5 or the electronic component 7 is fixed in the chamber 31 by means of dispensing (not shown) or other suitable fixing means. Preferably, the dispensing in the chamber 31 corresponds to the coil. 5 or on one side of the electronic component 7, the coil 5 or the electronic component 7 is fixed to the bottom surface of the chamber 31 by dispensing.

In an embodiment of the present invention, the electronic component 7 is disposed on the lower side (as shown in FIG. 5) or the upper side of the coil 5, and can also be disposed on the front side, the rear side, the left side of the coil 5 or according to actual needs. Right. It is to be noted that the above-described arrangement of the electronic component 7 and the coil 5 is based on actual needs, and is merely illustrative of the scope of the invention.

Preferably, the pedestal 3 is quadrilateral, circular, triangular, polygonal or other suitable geometric shape. It should be noted that the shape of the pedestal of the present invention described above is for convenience of description, and is not intended to be limiting. The scope of the invention.

As shown in the second figure, the base 3 has at least two vertical portions 3a, 3b, each of which is provided with a terminal 33, and the two vertical portions 3a, 3b are formed on the base 3 corresponding to the One side of the coil 5; or, the vertical portions 3a, 3b are protruded from the base 3 corresponding to one side of the coil 5; the two vertical portions 3a, 3b may be disposed at either end of the base 3 Or disposed at the edge of the base 3.

In an embodiment of the invention, the uprights of the present invention further comprise two other vertical portions 3c, 3d and another electronic component 8 (refer to the seventh seventh B diagram), wherein the other two vertical portions 3c, 3d A terminal 33 is also provided, and the other electronic component 8 is electrically connected to the terminals of the other vertical portions 3c, 3d.

The above-mentioned vertical portions 3a, 3b, 3c, 3d are formed at the four end corners of the base 3 The connecting portions 333a are exposed from the vertical portions 3a, 3b, 3c, 3d; or the connecting portion 333a is exposed from any surface of the body of the base 3 (not shown), such as from the chamber 31. The bottom surface is exposed. Preferably, the two terminals 33 are disposed in the two vertical portions 3a, 3b in a diagonal relationship.

The vertical portions 3a, 3b, 3c, and 3d are all provided with a terminal 33. The coil 5 has four terminals 51 connected to the four terminals 33 to facilitate surface adhesion processing and reduce inductance and electronic components. The height and the hooks 333 of the terminals 33 enable the terminals 33 to be tightly fixed in the base 3.

Wherein, the wall portion surrounding the chamber 31 may also be constituted only by the vertical portions 3a, 3b, 3c, 3d, whereby the cost of the material can be effectively reduced, but the wall portion of the chamber 31 is enclosed. Not limited to this, it is still dependent on actual needs, that is, the formation of wall panels between any two sections also falls within the scope of the present invention.

The main feature of the present invention is that the chamber 31 is provided through the susceptor 3, so that the susceptor 3 is provided with a coil 5 and an electronic component 7 which are vertically (up-and-down stacked) or parallel (side-to-side). And the coil 5 and the electronic component 7 are connected to each other in series or in parallel through the terminals 33, thereby providing several basic circuits. For example, when the electronic component is a resistor, the thinned inductor component of the present invention is embedded in the structure 100 and becomes a resistor. - a Resistor-inductor circuit, which can be used by a filter circuit; and when the electronic component is a capacitor, the thinned inductor element of the present invention is embedded in the structure 100 to become a Capacitor-inductor circuit. Therefore, it can be used for series or parallel resonant circuits, and can also be used by filter circuits, phase shift circuits or other circuits, thus facilitating the application of electronic circuits.

Referring to FIG. 6A, a perspective exploded view of a second preferred embodiment of a thinned inductor element embedding structure of the present invention, referring to FIG. 6B, a third preferred embodiment of the thinned inductor element embedding structure of the present invention For a perspective exploded view of an example, referring to a sixth C-picture, a perspective exploded view of a fourth preferred embodiment of the thinned inductor element embedding structure of the present invention, see FIG. 6D, the thinned inductor element embedding structure of the present invention A perspective exploded view of a fifth preferred embodiment. As shown in FIG. 6A, the thinned inductor component embedding structure 100 of the present invention includes at least a pedestal 3 and a coil 5, and the susceptor 3 and the coil 5 in the second preferred embodiment are first and preferred. The examples are substantially the same, but the connecting portions 331 of the two terminals 33 provided in the susceptor 3 are mutually corresponding and spaced apart by a space D so that an electric field can naturally be generated between the connecting portions 331 of the two terminals 33 to store energy.

Wherein, the two terminals 33 are disposed on the diagonally opposite corners of the base 3 as shown in FIG. 6A; or the coil 5 uses a I-shaped coil having a lower inductance, as shown in FIG. 6B; or, two The terminals 33 can also be disposed on the same side of the base 3 as shown in FIG. Or, as shown in FIG. 6D, the coil 5 is another type of coil of the I-shaped type, and the coil 5 and the two terminals 33 are electrically connected to each other in an indirect connection manner. The indirect connection manner is the coil 5 itself. Further, two connection terminals 53 are disposed, and the two connection terminals 53 are respectively electrically connected to two ends of the winding of the coil 5 (similar to the terminal end 51 of the sixth c diagram) and the two terminals 33. The two connection terminals 53 are electrically connected. Electrically connected to the adjacent two terminals 33 by solder or a suitable solder material.

Referring to Figure 6E, a perspective exploded view of a sixth preferred embodiment of the thinned inductive component embedding structure of the present invention. As shown in the sixth E diagram, two I-shaped coils 5 are disposed, and are respectively disposed in the base 3 in a standing posture and a lying posture.

In the second preferred embodiment and the third preferred embodiment, the electronic component 7 is further disposed, and the electronic component 7 is disposed in the cavity 31 and disposed on one side of the coil 5, The electronic component 7 is electrically connected to the connection portion 333a at both ends of the gap D.

Another feature of the present invention is that by having the connecting portions 333a of the two terminals 33 at an appropriate interval D, when the two terminals 33 are energized, since the insulating medium (air in the environmental space) is naturally present in the interval D, Therefore, an electric field can be naturally formed between the connecting portions 333a of the two terminals 33 to store energy, so that a capacitance effect is naturally formed between the connecting portions 333a of the two terminals 33, so that the capacitors are not required to be substantially connected to the electronic components such as capacitors; It is of course also possible to electrically connect the electronic component 7, such as a capacitor, to the connection 333a of the two terminals 33 to obtain a plurality of different component characteristics (e.g., various desired capacitance values).

Therefore, the present invention can provide a small to large capacitance value for the circuit to be used, which is advantageous for the use of various electronic circuits.

Referring to FIG. 7A, an exploded perspective view of a seventh preferred embodiment of the thinned inductive component embedding structure of the present invention is based on the structure shown in FIG. A, and the leg of the present invention further includes two The vertical portions 3c, 3d, the other two vertical portions 3c, 3d are all provided with a terminal 33, which further comprises another electronic component 8, and the other electronic component 8 and the terminal 33 of the other two vertical portions 3c, 3d constitute an electrical Connecting; wherein the other electronic component 8 is a capacitor, a resistor, an inductor or other suitable Electronic component.

The main feature of the present invention is that, by the embodiment of the fourth preferred embodiment, the present invention can also provide an electronic circuit composed of three components, such as an RLC circuit, a CLC filter circuit or an LCL filter circuit, etc., which has at least a winding type. The circuit structure of the coil.

Referring to FIG. 7B, an exploded perspective view of an eighth preferred embodiment of the thinned inductor element embedding structure of the present invention. As shown in FIG. 7B, the coil 5 has two pairs of terminals 51, and each pair of terminals 51 is respectively connected to the electronic component 7 and the other electronic component 8, so that two independent series circuits can be formed. Such as independent RL circuit and LC circuit.

In a preferred embodiment of the present invention, the coil 5 is a ring-shaped wound coil, an I-shaped wound coil (refer to FIG. 4) or other suitable coils, and the inner wall surface of the chamber 31 is also Rings, or the vertical portions 3a, 3b, 3c, 3d are curved in accordance with one side of the coil 5, whereby the inner wall surface of the chamber 31 is brought into contact with the outer surface of the coil 5, and the coil 5 is lifted. The fixing effect in the base 3. It should be noted that the shape of the coil 5, the electronic component 7 and the chamber 31 in the above invention is only an example for convenience of description, and is not intended to limit the scope of the present invention, that is, as long as the coil 5 is The shapes or contours of the chambers 31 corresponding to each other fall within the scope of the present invention; the above-mentioned proposed shape of the coil 5 and the chamber 31 can correspond to each other, and is not limited to the overall shape, as long as it is Corresponding to one of the shapes, it is within the scope of the invention.

Referring to the eighth embodiment, a perspective exploded view of a ninth preferred embodiment of the thinned inductor element embedding structure of the present invention. As shown in the eighth figure, the body of the two terminals 33 has a narrow neck portion 335, and the limiting neck portion 335 is wound around either end of the coil 5 to prevent the coil 5 from being wound around the terminal 33. Moving up and down, it is sure to be tightly wound around the limit neck 335.

A feature of the present invention further includes that the base 3 is provided with the chamber 31 for accommodating one or several components, and the two terminals 33 are preset at appropriate positions of the base 3, so that the thinning provided by the present invention is provided. The inductive component embedded structure 100 can be reduced to about 2 mm, so that the thickness of the structure of the component connection is still very small. Moreover, if the wound coil of the present invention is used, the inductance can easily exceed 100 μH or more, so it is very suitable for getting thinner and lighter. The electronic device reduces the occupation space of the component in the electronic device and contributes to the planning of the electronic circuit in the electronic device.

In particular, the present invention has a planar structure 35 on the other side of the susceptor 3 corresponding to the coil 5. Therefore, vacuum adsorption or clamping of the fixture or automated mechanical equipment can be accurately and quickly soldered to the circuit board, which contributes to mass production and improved alignment accuracy.

In addition, the wire of the coil 2 of the present invention can wrap all the portions of the magnetic core 1, so that the number of turns of the coil 2 is greatly increased, and the coil 2 is buried in the chamber 31 of the susceptor 3, thereby greatly increasing the inductance. .

Another main feature of the present invention is that the thinned inductive component embedded structure 100 provided by the present invention has a compact structure and is therefore easy to manufacture. In particular, the base 3 can be pre-set with the terminal 33, so in actual assembly, The susceptor 3, the coil 5 and the electronic component 7 are immediately available, contributing to mass production, while reducing production costs and improving production yield and production efficiency.

Therefore, the component connection structure of the present invention is very suitable for use in an existing thinned handheld electronic device, reducing the occupation area of the component on the circuit board, so that more components are disposed on the circuit board, and the electronic component is improved on the electronic circuit. The configuration density makes the planning of electronic circuits in the electronic device more flexible and flexible.

The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.

100‧‧‧Thin-shaped inductive component buried structure

3‧‧‧Base

31‧‧‧ chamber

33‧‧‧ terminals

331‧‧‧Bend

333a‧‧‧Connecting Department

5‧‧‧ coil

51‧‧‧Export

3a, 3b, 3c, 3d‧‧‧

Claims (10)

A thinned inductive component embedded structure comprises: a base, a cavity is formed on one surface of the base, the cavity has an accommodating space, and the base is preset with two terminals, wherein the two terminals Each of the top ends is formed with a bent portion, the bent portion is exposed outside the base, and the bottom ends of the two terminals each form a hook portion, wherein one of the hook portions is located inside the base, the hook Another portion of the portion is exposed outside the base, and another portion of the hook portion that is exposed outside the base is defined as a connecting portion; a coil is fixed in the chamber, and both ends of the coil are electrically connected The top end of the two terminals or the bent portion; and an electronic component disposed in the chamber and disposed on one side of the coil, wherein the electronic component and the connecting portion form an electrical connection; wherein The base has at least two vertical portions, each of which is provided with a terminal formed on one side of the base corresponding to the coil, the base corresponding to the other side of the coil being a planar structure. A thinned inductive component embedded structure according to claim 1, wherein the coil or the electronic component is fixed in the chamber by dispensing. The thinned inductor element embedded structure according to claim 1, wherein the electronic component is a capacitor, a resistor or an inductor. The thinned inductor element embedded structure according to claim 1, wherein the two terminals are disposed in two vertical portions in a diagonal relationship. The thinned inductor element embedding structure according to claim 1, wherein the coil is in the shape of a loop of a wound coil, the inner wall surface of the chamber is also in the shape of a ring, or the coil is worked. In the shape, the coil and the two terminals are electrically connected to each other in an indirect connection manner. The indirect connection manner is that the coil itself is further provided with two connection terminals, and the two connection terminals are respectively connected with the two ends of the winding of the coil. And the two terminals constitute an electrical connection. The thinned inductor element embedding structure according to claim 1, wherein the bent portion of the two terminals further has a limiting neck for winding one end of the coil. The thinned inductor element embedding structure according to claim 1, wherein the vertical portion further comprises another vertical portion and another electronic component, wherein the other two vertical portions are each provided with a terminal, and the other electronic component The component is electrically connected to the terminals of the other two legs. A thinned inductive component embedded structure comprises: a base, a cavity is formed on one surface of the base, the cavity has an accommodating space, and the base is preset with two terminals, wherein the two terminals Each of the top ends is formed with a bent portion, the bent portion is exposed outside the base, and the bottom ends of the two terminals each form a hook portion, wherein one of the hook portions is located inside the base, the hook Another portion of the portion is exposed outside the base, and another portion of the hook portion that is exposed outside the base is defined as a connecting portion; and a coil is fixed in the chamber, and both ends of the coil are electrically Connecting to the top end of the two terminals or the bent portion; wherein the base has at least two vertical portions, each of the two vertical portions is configured with a terminal, and the two vertical portions are formed on a side of the base corresponding to the coil The connecting portions of the two terminals are corresponding to each other and spaced apart from each other. The thinned inductor element embedding structure according to claim 8 , further comprising an electronic component disposed in the chamber and disposed on one side of the coil, wherein the electronic component is The connection portions at both ends of the interval constitute an electrical connection. The thinned inductor element embedded structure according to claim 8, wherein the vertical portion further comprises another vertical portion and another electronic component, wherein the other two vertical portions are each provided with a terminal, and the other electronic component The component is electrically connected to the terminals of the other two legs.