TWI550469B - Touch screen - Google Patents
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Description
本發明是有關於一種觸控螢幕。 The invention relates to a touch screen.
近年來觸控螢幕已經被大量應用在各種電子產品中，例如智慧型手機(Smart Phone)、平板電腦(Tablet Computer)、個人數位助理(PDA)或衛星導航(GPS)等電子產品多已採用觸控功能。現有的觸控螢幕大多是將一感應電路層配置於一基板的下表面。當在基板的下表面製作感應電路層時，感應電路層本身會產生本質應力，而感應電路層與基板之間的熱膨脹係數不匹配會導致熱應力的產生。因此，上述源自於感應電路層的本質應力與熱應力作用於基板之下表面時，會使得該下表面產生壓應力，並使得基板的上表面產生張應力，而導致基板之上、下表面的應力不匹配，使得基板強度急劇下降。 In recent years, touch screens have been widely used in various electronic products, such as smart phones, tablet computers, personal digital assistants (PDAs) or satellite navigation (GPS). Control function. Most of the existing touch screens have a sensing circuit layer disposed on the lower surface of a substrate. When the inductive circuit layer is fabricated on the lower surface of the substrate, the inductive circuit layer itself generates an intrinsic stress, and the thermal expansion coefficient mismatch between the inductive circuit layer and the substrate causes thermal stress to be generated. Therefore, when the intrinsic stress and thermal stress originating from the sensing circuit layer act on the lower surface of the substrate, compressive stress is generated on the lower surface, and tensile stress is generated on the upper surface of the substrate, resulting in upper and lower surfaces of the substrate. The stresses do not match, causing the substrate strength to drop dramatically.
另外，由於感應電路層通常是由透明導電材料(如ITO)藉由微影、蝕刻製程製作，在蝕刻區與非蝕刻區之間會因光學特性的不同而造成蝕刻痕問題，因此現有的觸控螢幕於製造過程中會再濺鍍一層指數匹配層(Index Matching Layer)來解決上述之光學問題，然而濺鍍此指數匹配層的真空濺鍍機台不僅昂貴，而且製造過程費時費工，徒增製造商的生產成本。 In addition, since the sensing circuit layer is usually fabricated by a transparent conductive material (such as ITO) by a lithography and etching process, an etching mark problem may occur between the etched region and the non-etched region due to the difference in optical characteristics, so the existing touch The control screen will be sputtered with an index matching layer during the manufacturing process (Index Matching Layer) solves the above optical problems. However, the vacuum sputtering machine that sputters the index matching layer is not only expensive, but also the manufacturing process takes time and labor, increasing the manufacturer's production cost.
因此，本發明之目的，即在提供一種能維持基板強度，並能消除感應電路層蝕刻痕的觸控螢幕。 Accordingly, it is an object of the present invention to provide a touch screen capable of maintaining substrate strength and eliminating etch marks from the sensing circuit layer.
於是，本發明觸控螢幕在一些實施態樣中，包含：一基板、一感應電路層，及一緩衝層。 Thus, in some embodiments, the touch screen of the present invention comprises: a substrate, a sensing circuit layer, and a buffer layer.
該感應電路層設置在該基板的下方。 The sensing circuit layer is disposed below the substrate.
該緩衝層設置在該基板與該感應電路層之間，使該感應電路層不接觸該基板，該緩衝層的楊氏係數小於該基板與該感應電路層的楊氏係數，且該緩衝層的折射率介於該基板的折射率與該感應電路層的折射率之間。 The buffer layer is disposed between the substrate and the sensing circuit layer such that the sensing circuit layer does not contact the substrate, and the Young's modulus of the buffer layer is smaller than a Young's modulus of the substrate and the sensing circuit layer, and the buffer layer is The refractive index is between the refractive index of the substrate and the refractive index of the sensing circuit layer.
在一些實施態樣中，該感應電路層的楊氏係數小於該基板的楊氏係數。 In some implementations, the Young's coefficient of the sensing circuit layer is less than the Young's modulus of the substrate.
在一些實施態樣中，該基板的折射率小於該感應電路層的折射率。 In some embodiments, the substrate has a refractive index that is less than a refractive index of the sensing circuit layer.
在一些實施態樣中，該緩衝層的楊氏係數範圍介於1×109帕斯卡至7×109帕斯卡之間。 In some embodiments, the buffer layer has a Young's modulus ranging from 1 x 10 9 Pascal to 7 x 10 9 Pascal.
在一些實施態樣中，該緩衝層的折射率範圍介於1.5至1.8之間。 In some embodiments, the buffer layer has a refractive index ranging between 1.5 and 1.8.
在一些實施態樣中，該緩衝層的厚度範圍介於50奈米至150奈米之間。 In some embodiments, the buffer layer has a thickness ranging from 50 nanometers to 150 nanometers.
在一些實施態樣中，該緩衝層主要是由一具有 金屬粒子的有機化合物材料所製成，且該緩衝層具有電絕緣性。 In some implementations, the buffer layer is mainly composed of one The organic compound material of the metal particles is made, and the buffer layer is electrically insulating.
在一些實施態樣中，該金屬粒子為選自於鈦或鋯或鈦與鋯之混合所組成的群體。 In some embodiments, the metal particles are selected from the group consisting of titanium or zirconium or a mixture of titanium and zirconium.
在一些實施態樣中，該有機化合物材料為聚甲基丙烯酸甲酯。 In some embodiments, the organic compound material is polymethyl methacrylate.
在一些實施態樣中，該基板之下表面定義出一視區，及至少一位於該視區之一側的非視區，該緩衝層與該感應電路層至少位於該視區。 In some implementations, the lower surface of the substrate defines a viewing zone and at least one non-viewing zone on one side of the viewing zone, the buffer layer and the sensing circuit layer being located at least in the viewing zone.
在一些實施態樣中，該緩衝層與該感應電路層還延伸至該非視區，在該非視區中，該緩衝層位於該基板與該感應電路層之間，且該緩衝層之位於該非視區的部分主要是由一具有碳粉的有機化合物材料或一具有染料的有機化合物材料所製成。 In some implementations, the buffer layer and the sensing circuit layer further extend to the non-viewing area. In the non-viewing area, the buffer layer is located between the substrate and the sensing circuit layer, and the buffer layer is located in the non-viewing layer. The portion of the region is mainly made of an organic compound material having carbon powder or an organic compound material having a dye.
在一些實施態樣中，還包含一訊號傳送層，該訊號傳送層的位置對應於該基板之非視區，且與該基板分別位於該緩衝層之兩相反側，並與該感應電路層電連接。 In some implementations, the method further includes a signal transmission layer, the signal transmission layer is located at a position corresponding to the non-view area of the substrate, and is located on opposite sides of the buffer layer from the substrate, and is electrically connected to the sensing circuit layer. connection.
在一些實施態樣中，還包含一位置對應於該基板之下表面並位在該非視區的遮蔽層，且該緩衝層與該感應電路層還延伸至該非視區，在該非視區中，該遮蔽層與該緩衝層分別位於該感應電路層之兩相反側。 In some implementations, the method further includes a shielding layer corresponding to the lower surface of the substrate and located in the non-viewing area, and the buffer layer and the sensing circuit layer further extend to the non-viewing area, in the non-viewing area, The shielding layer and the buffer layer are respectively located on opposite sides of the sensing circuit layer.
在一些實施態樣中，還包含一訊號傳送層，該訊號傳送層的位置對應於該基板之非視區，且與該感應電路層分別位於該遮蔽層之兩相反側，並與該感應電路層電 連接。 In some implementations, the method further includes a signal transmission layer, the signal transmission layer is located at a position corresponding to the non-view area of the substrate, and the sensing circuit layer is respectively located on opposite sides of the shielding layer, and the sensing circuit Layer electricity connection.
在一些實施態樣中，還包含一形成於該基板之下表面並位在該非視區的遮蔽層，且該緩衝層與該感應電路層還延伸至該非視區，在該非視區中，該遮蔽層與該感應電路層分別位於該緩衝層之兩相反側。 In some implementations, the method further includes a shielding layer formed on the lower surface of the substrate and located in the non-viewing region, and the buffer layer and the sensing circuit layer further extend to the non-viewing area, where the non-viewing area The shielding layer and the sensing circuit layer are respectively located on opposite sides of the buffer layer.
在一些實施態樣中，還包含一訊號傳送層，該訊號傳送層的位置對應於該基板之非視區，且與該遮蔽層分別位於該緩衝層之兩相反側，並與該感應電路層電連接。 In some implementations, the method further includes a signal transmission layer, the signal transmission layer is located at a position corresponding to the non-view area of the substrate, and the shielding layer is located on opposite sides of the buffer layer, and the sensing circuit layer Electrical connection.
在一些實施態樣中，還包含一位置對應於該基板之下表面並位在該非視區的遮蔽層，且該緩衝層與該感應電路層還延伸至該非視區，在該非視區中，該遮蔽層位於該緩衝層與該感應電路層之間。 In some implementations, the method further includes a shielding layer corresponding to the lower surface of the substrate and located in the non-viewing area, and the buffer layer and the sensing circuit layer further extend to the non-viewing area, in the non-viewing area, The shielding layer is located between the buffer layer and the sensing circuit layer.
在一些實施態樣中，還包含一訊號傳送層，該訊號傳送層的位置對應於該基板之非視區，且與該緩衝層分別位於該遮蔽層之兩相反側，並與該感應電路層電連接。 In some implementations, the method further includes a signal transmission layer, the signal transmission layer is located at a position corresponding to the non-view area of the substrate, and the buffer layer is located on opposite sides of the shielding layer, and the sensing circuit layer Electrical connection.
在一些實施態樣中，還包含一形成於該基板之下表面並位在該非視區的遮蔽層，且該感應電路層還延伸至該非視區，在該非視區中，該遮蔽層位於該基板與該感應電路層之間。 In some implementations, the method further includes a shielding layer formed on the lower surface of the substrate and located in the non-viewing area, and the sensing circuit layer further extends to the non-viewing area, where the shielding layer is located in the non-viewing area Between the substrate and the sensing circuit layer.
在一些實施態樣中，還包含一訊號傳送層，該訊號傳送層的位置對應於該基板之非視區，且與該基板分別位於該遮蔽層之兩相反側，並與該感應電路層電連接。 In some implementations, the method further includes a signal transmission layer, wherein the signal transmission layer is located at a position corresponding to the non-view area of the substrate, and the substrate is located on opposite sides of the shielding layer, and is electrically connected to the sensing circuit layer. connection.
本發明之功效在於：透過該緩衝層維持基板強度，並消除感應電路層的蝕刻痕。 The effect of the present invention is to maintain the strength of the substrate through the buffer layer and eliminate the etching marks of the sensing circuit layer.
1‧‧‧基板 1‧‧‧Substrate
111‧‧‧上表面 111‧‧‧Upper surface
112‧‧‧下表面 112‧‧‧ lower surface
2‧‧‧感應電路層 2‧‧‧Sensor circuit layer
3‧‧‧緩衝層 3‧‧‧buffer layer
4‧‧‧視區 4‧‧ ‧Sight Zone
5‧‧‧非視區 5‧‧‧Non-view zone
6‧‧‧遮蔽層 6‧‧‧shading layer
7‧‧‧訊號傳送層 7‧‧‧Signal transmission layer
8‧‧‧連接導線 8‧‧‧Connecting wires
本發明之其他的特徵及功效，將於參照圖式的實施例詳細說明中清楚地呈現，其中：圖1是一剖面圖，說明本發明觸控螢幕的第一實施例；圖2是一剖面圖，說明本發明觸控螢幕的第二實施例；圖3是一剖面圖，說明本發明觸控螢幕的第三實施例；圖4是一剖面圖，說明本發明觸控螢幕的第四實施例；圖5是一剖面圖，說明本發明觸控螢幕的第五實施例；及圖6是一剖面圖，說明本發明觸控螢幕的第六實施例。 The other features and advantages of the present invention will be apparent from the detailed description of the embodiments illustrated in the accompanying drawings in which: FIG. 1 is a cross-sectional view illustrating a first embodiment of the touch screen of the present invention; FIG. 3 is a cross-sectional view showing a third embodiment of the touch screen of the present invention; and FIG. 4 is a cross-sectional view showing the fourth embodiment of the touch screen of the present invention. 5 is a cross-sectional view showing a fifth embodiment of the touch screen of the present invention; and FIG. 6 is a cross-sectional view showing a sixth embodiment of the touch screen of the present invention.
在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。 Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.
參閱圖1，本發明觸控螢幕之第一實施例包含一基板1、一感應電路層2及一緩衝層3。 Referring to FIG. 1, a first embodiment of the touch screen of the present invention comprises a substrate 1, a sensing circuit layer 2 and a buffer layer 3.
基板1包含一上表面111及一下表面112，上表面111為供使用者觀看畫面、進行觸控操作的外表面，下表面112則為位於相反側的內表面。在本實施例中，基板1採用強化玻璃基板，其上表面111、下表面112處經強化處理，因此具有較佳的結構強度及耐用程度。此外，在不同的實施態樣中，基板1也可以採用在所有表面都經過強化 處理的強化玻璃基板，或者是硬質、軟質的各類型基板，而不以特定的類型為限。 The substrate 1 includes an upper surface 111 which is an outer surface for the user to view the screen and a touch operation, and a lower surface 112 which is an inner surface on the opposite side. In the embodiment, the substrate 1 is made of a tempered glass substrate, and the upper surface 111 and the lower surface 112 are reinforced, so that the substrate has better structural strength and durability. In addition, in different implementations, the substrate 1 can also be reinforced on all surfaces. The treated tempered glass substrate is either a hard or soft type of substrate, and is not limited to a specific type.
感應電路層2設置在基板1的下方，並用以產生觸控訊號。感應電路層2主要是由透明導電材料所製成，較常見的材質為氧化銦錫(Indium Tin Oxide,ITO)、氧化銦鋅(Indium Zinc Oxide,IZO)、氧化鋁鋅(Aluminum Zinc Oxide,AZO)、氧化鋅(Zinc Oxide)、氧化銦鎵鋅(Indium Gallium Zinc Oxide,IGZO)、奈米碳管(Carbon Nano Tube,CNT)、奈米銀、奈米銅，或是其他透明導電材質與金屬或非金屬的合成物。 The sensing circuit layer 2 is disposed under the substrate 1 and is used to generate a touch signal. The sensing circuit layer 2 is mainly made of a transparent conductive material. The more common materials are Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), and Aluminium Zinc Oxide (AZO). ), Zinc Oxide, Indium Gallium Zinc Oxide (IGZO), Carbon Nano Tube (CNT), Nano Silver, Nano Copper, or other transparent conductive materials and metals Or a non-metallic composite.
緩衝層3設置在基板1與感應電路層2之間，具有電絕緣性，且主要是由一具有金屬粒子的有機化合物材料所製成。有機化合物材料為一透明材料，而本實施例中，此有機化合物材料是採用聚甲基丙烯酸甲酯，但其材質不以此為限。有機化合物中的金屬粒子可用於調整緩衝層3的折射率，本實施例其材質係為選自於由鈦、鋯或鈦與鋯之混合所組成的群體，但在不同的實施態樣中也可以選用其他材質的金屬粒子，而不以此處揭露的內容為限。 The buffer layer 3 is disposed between the substrate 1 and the sensing circuit layer 2, is electrically insulating, and is mainly made of an organic compound material having metal particles. The organic compound material is a transparent material, and in the embodiment, the organic compound material is polymethyl methacrylate, but the material is not limited thereto. The metal particles in the organic compound can be used to adjust the refractive index of the buffer layer 3. In this embodiment, the material is selected from the group consisting of titanium, zirconium or a mixture of titanium and zirconium, but in different embodiments. Metal particles of other materials may be used, and are not limited to what is disclosed herein.
在本實施例中，基板1與感應電路層2間的緩衝層3可避免感應電路層2直接接觸基板1，且緩衝層3的楊氏係數(Young's Modulus)小於基板1與感應電路層2的楊氏係數。一般而言，楊氏係數代表物質材料在其彈性限度內的抗拉或抗壓的物理量。在彈性限度內，應力與應力所造成的形變量成正比，而應力與形變量的比值即被稱為 材料的楊氏係數。楊氏係數的大小代表材料的剛性，並與材料的形變量成負相關，也就是說楊氏係數越小，代表材料可產生的形變量越大。因此，由於本實施例的緩衝層3相較於基板1與感應電路層2具有較小的楊氏係數，因此擁有較大的形變空間來消除基板1與感應電路層2間的應力，進而維持基板1的強度，同時也避免感應電路層2由基板1上剝落(Peeling)。值得一提的是，緩衝層3的較佳楊氏係數範圍介於1×109帕斯卡至7×109帕斯卡之間，楊氏係數在此範圍內的緩衝層3，其拉伸性與延展性較大，因此可消除基板1與感應電路層2之間的應力。此外，本實施例還可以進一步將感應電路層2的楊氏係數配置為小於基板1的楊氏係數，如此可使得感應電路層2相較於基板1有較佳的拉伸性與延展性，因此，若使用者因一時疏忽或操作不當而導致基板1碎裂時，由於感應電路層2具有較大的形變空間，使得感應電路層2較不易因基板1碎裂而斷裂，進而確保了感應電路層2在基板1碎裂的狀況下依然能正常的運作。 In this embodiment, the buffer layer 3 between the substrate 1 and the sensing circuit layer 2 can prevent the sensing circuit layer 2 from directly contacting the substrate 1, and the Young's Modulus of the buffer layer 3 is smaller than that of the substrate 1 and the sensing circuit layer 2. Young's coefficient. In general, the Young's modulus represents the physical quantity of tensile or compressive resistance of a material material within its elastic limits. Within the elastic limit, the stress is proportional to the shape variable caused by the stress, and the ratio of the stress to the shape variable is called the Young's modulus of the material. The size of the Young's coefficient represents the rigidity of the material and is inversely related to the shape variable of the material. That is to say, the smaller the Young's coefficient, the larger the shape variable that the representative material can produce. Therefore, since the buffer layer 3 of the present embodiment has a smaller Young's modulus than the substrate 1 and the sensing circuit layer 2, it has a large deformation space to eliminate stress between the substrate 1 and the sensing circuit layer 2, thereby maintaining The strength of the substrate 1 also prevents the sensing circuit layer 2 from peeling off from the substrate 1. It is worth mentioning that the preferred Young's modulus of the buffer layer 3 ranges from 1×10 9 Pascal to 7×10 9 Pascal, and the buffer layer 3 with a Young's modulus in this range is stretched and stretched. The property is large, so that the stress between the substrate 1 and the sensing circuit layer 2 can be eliminated. In addition, in this embodiment, the Young's modulus of the sensing circuit layer 2 can be further configured to be smaller than the Young's modulus of the substrate 1, so that the sensing circuit layer 2 has better stretchability and ductility than the substrate 1. Therefore, if the substrate 1 is broken due to a momentary negligence or improper operation, the sensing circuit layer 2 has a large deformation space, so that the sensing circuit layer 2 is less likely to be broken due to the chipping of the substrate 1, thereby ensuring the sensing. The circuit layer 2 can still operate normally in the case where the substrate 1 is broken.
另一方面，在本實施例中，緩衝層3的折射率是介於基板1的折射率與感應電路層2的折射率之間，且較佳的緩衝層3折射率範圍是介於1.5至1.8之間、緩衝層3厚度範圍是介於50奈米至150奈米之間，而基板1的折射率小於感應電路層2的折射率。透過緩衝層3、感應電路層2與基板1三者折射率與厚度的指數匹配，使得感應電路層2上具有蝕刻痕的部份(圖中未示)所反射的光波 (Wave)在進入使用者的眼睛前已先藉由破壞性干涉(Destructive Interference)而相互抵銷，進而讓使用者不會看到感應電路層2的蝕刻痕而達到消除蝕刻痕的效果，且也同時取代了現有觸控螢幕結構中指數匹配層(Index Matching Layer)的功能。此外，改變緩衝層3的折射率則可藉由變更組成緩衝層3的金屬粒子的材質、數量等方式來達成，因此，組成緩衝層3的金屬粒子需視緩衝層3折射率的需求進行變更，並搭配對緩衝層3厚度的調整，以達到與感應電路層2及基板1指數匹配的效果。 On the other hand, in the present embodiment, the refractive index of the buffer layer 3 is between the refractive index of the substrate 1 and the refractive index of the sensing circuit layer 2, and the preferred buffer layer 3 has a refractive index ranging from 1.5 to Between 1.8, the thickness of the buffer layer 3 ranges from 50 nm to 150 nm, and the refractive index of the substrate 1 is smaller than that of the sensing circuit layer 2. Through the index matching of the refractive index and the thickness of the buffer layer 3, the sensing circuit layer 2 and the substrate 1, the light waves reflected by the portion of the sensing circuit layer 2 having an etching mark (not shown) are reflected. (Wave) is offset by the Destructive Interference before entering the user's eyes, so that the user does not see the etching trace of the sensing circuit layer 2 to eliminate the etching marks, and It also replaces the function of the Index Matching Layer in the existing touch screen structure. Further, changing the refractive index of the buffer layer 3 can be achieved by changing the material and the number of the metal particles constituting the buffer layer 3, and therefore, the metal particles constituting the buffer layer 3 are required to be changed depending on the refractive index of the buffer layer 3. And adjusting the thickness of the buffer layer 3 to achieve an index matching effect with the sensing circuit layer 2 and the substrate 1.
綜合上述，在本實施例中，緩衝層3可藉由較小的楊氏係數來消除基板1與感應電路層2間的應力。此外，透過與基板1的折射率及感應電路層2的折射率匹配，來消除感應電路層2的蝕刻痕。也就是說，本實施例藉由單一緩衝層3的設置，即能提供應力緩衝層與指數匹配層兩者的功能，進而達成簡化製程、降低成本之目的。 In summary, in the present embodiment, the buffer layer 3 can eliminate the stress between the substrate 1 and the sensing circuit layer 2 by a small Young's modulus. Further, the etching trace of the sensing circuit layer 2 is removed by matching with the refractive index of the substrate 1 and the refractive index of the sensing circuit layer 2. That is to say, in the present embodiment, by providing the single buffer layer 3, the functions of both the stress buffer layer and the index matching layer can be provided, thereby achieving the purpose of simplifying the process and reducing the cost.
參閱圖2，為本發明觸控螢幕的第二實施例。本實施例與第一實施例的差別在於緩衝層3的實施態樣不同，且觸控螢還包含一訊號傳送層7。若在基板1之下表面112定義出一視區4及環繞視區4的非視區5，位在視區4中的緩衝層3的材質與第一實施例相同，即主要是由具有金屬粒子的有機化合物材料所製成；而位在非視區5的緩衝層3則不同於第一實施例，其主要材質為具有碳粉或染料的有機化合物材料，藉由碳粉或染料的添加使得位於非視區5的緩衝層3形成不透光的結構，因此能作為遮蔽訊 號傳送層7的遮蔽層(black mask)。且在本實施例中，位在視區4的有機化合物材料與位在非視區5的有機化合物材料兩者為同一材料。訊號傳送層7主要藉由金屬材質製作，其位置對應於基板1的非視區5，並與基板1分別位於緩衝層3之兩相反側，且與感應電路層2電連接用以傳送觸控訊號。由於訊號傳送層7通常是由金屬材質所製作，當使用者由上表面111朝下表面112方向觀看時，訊號傳送層7會被位於非視區5的不透光的緩衝層3遮蔽，因此能保持產品的整體美觀。而本實施例其餘各部件之特徵及材料特性與上述之第一實施例相同，故不再贅述。 Referring to FIG. 2, a second embodiment of the touch screen of the present invention is shown. The difference between this embodiment and the first embodiment is that the implementation of the buffer layer 3 is different, and the touch strobe also includes a signal transmission layer 7. If a viewing zone 4 and a non-viewing zone 5 surrounding the viewing zone 4 are defined on the lower surface 112 of the substrate 1, the material of the buffer layer 3 located in the viewing zone 4 is the same as that of the first embodiment, that is, mainly composed of metal. The organic compound material of the particles is made; and the buffer layer 3 located in the non-viewing zone 5 is different from the first embodiment, and the main material is an organic compound material having carbon powder or dye, which is added by carbon powder or dye. The buffer layer 3 located in the non-view area 5 is formed into an opaque structure, and thus can serve as a masking signal. The black mask of the transport layer 7. And in the present embodiment, the organic compound material located in the viewing zone 4 and the organic compound material located in the non-viewing zone 5 are the same material. The signal transmission layer 7 is mainly made of a metal material, and its position corresponds to the non-view area 5 of the substrate 1 and is opposite to the substrate 1 on the opposite side of the buffer layer 3, and is electrically connected to the sensing circuit layer 2 for transmitting touch. Signal. Since the signal transmission layer 7 is usually made of a metal material, when the user is viewed from the upper surface 111 toward the lower surface 112, the signal transmission layer 7 is shielded by the opaque buffer layer 3 located in the non-view area 5, Can maintain the overall beauty of the product. The features and material characteristics of the remaining components of the embodiment are the same as those of the first embodiment described above, and therefore will not be described again.
參閱圖3，為本發明觸控螢幕的第三實施例。相較於第一實施例，本實施例的觸控螢幕還包含一遮蔽層6、一訊號傳送層7及多個連接導線8。在基板1之下表面112定義出一視區4及環繞視區4的非視區5，遮蔽層6的位置對應於基板1之下表面112並位在非視區5，且與緩衝層3分別位於感應電路層2之兩相反側。訊號傳送層7的位置亦對應於該基板1之非視區5，且與該感應電路層2分別位於該遮蔽層6之兩相反側，並透過連接導線8與感應電路層2電連接，用以傳送觸控訊號。本實施例中，雖然位於非視區5的緩衝層3並沒有如第二實施例般加入碳粉或是染料，因此位於非視區5的緩衝層3無法遮蔽訊號傳送層7，但藉由有色油墨或有色光組材質的遮蔽層6的設置，可構成螢幕外框部分的黑矩陣，藉以遮蔽訊號傳送層7，使得使用者無法觀看到訊號傳送層7。而本實施例其餘 各部件之特徵及材料特性，與上述之第二實施例相同，故不再贅述。 Referring to FIG. 3, a third embodiment of the touch screen of the present invention is shown. Compared with the first embodiment, the touch screen of the embodiment further includes a shielding layer 6, a signal transmission layer 7, and a plurality of connecting wires 8. A viewing zone 4 and a non-viewing zone 5 surrounding the viewing zone 4 are defined on the lower surface 112 of the substrate 1. The position of the shielding layer 6 corresponds to the lower surface 112 of the substrate 1 and is located in the non-viewing zone 5, and the buffer layer 3 They are located on opposite sides of the sensing circuit layer 2, respectively. The position of the signal transmission layer 7 also corresponds to the non-view area 5 of the substrate 1, and the sensing circuit layer 2 is located on opposite sides of the shielding layer 6, and is electrically connected to the sensing circuit layer 2 through the connecting wire 8. To transmit touch signals. In this embodiment, although the buffer layer 3 located in the non-view area 5 is not filled with toner or dye as in the second embodiment, the buffer layer 3 located in the non-view area 5 cannot shield the signal transmission layer 7, but by The arrangement of the shielding layer 6 of the colored ink or the colored light group material can constitute a black matrix of the outer frame portion of the screen, thereby shielding the signal transmission layer 7 so that the user cannot view the signal transmission layer 7. And the rest of this embodiment The features and material characteristics of the respective components are the same as those of the second embodiment described above, and therefore will not be described again.
參閱圖4，為本發明觸控螢幕的第四實施例，本實施例與第三實施例的差別在於在非視區5中，感應電路層2、緩衝層3與遮蔽層6的層疊關係不同。本實施例中，非視區5中的遮蔽層6是直接形成於基板1的下表面112，且遮蔽層6與感應電路層2分別位於緩衝層3的兩相反側，訊號傳送層7與遮蔽層6分別位於該緩衝層3的兩相反側。由於感應電路層2與訊號傳送層7是位於緩衝層3的同一側，因此訊號傳送層7可直接與感應電路層2電連接，使得本實施例的結構能較為簡化，進而讓製造成本能進一步地下降。而本實施例其餘各部件之特徵與材料特性與上述之第三實施例相同，故不再贅述。 Referring to FIG. 4, a fourth embodiment of the touch screen of the present invention is different from the third embodiment. In the non-view area 5, the stacking relationship between the sensing circuit layer 2, the buffer layer 3 and the shielding layer 6 is different. . In this embodiment, the shielding layer 6 in the non-viewing area 5 is directly formed on the lower surface 112 of the substrate 1, and the shielding layer 6 and the sensing circuit layer 2 are respectively located on opposite sides of the buffer layer 3, and the signal transmission layer 7 and the shielding layer Layers 6 are located on opposite sides of the buffer layer 3, respectively. Since the sensing circuit layer 2 and the signal transmission layer 7 are located on the same side of the buffer layer 3, the signal transmission layer 7 can be directly electrically connected to the sensing circuit layer 2, so that the structure of the embodiment can be simplified, and the manufacturing cost can be further improved. The ground is falling. The features and material characteristics of the remaining components of the embodiment are the same as those of the third embodiment described above, and therefore will not be described again.
參閱圖5，為本發明觸控螢幕的第五實施例，本實施例與第四實施例的差別在於在非視區5中，感應電路層2、緩衝層3與遮蔽層6三者的相對位置有所差異。在本實施例中，緩衝層3直接形成於基板1的下表面112，而遮蔽層6是位於緩衝層3與該感應電路層2之間，且訊號傳送層7與緩衝層3分別位於遮蔽層6之兩相反側。所以，本實施例的緩衝層3除了提供基板1與感應電路層2之間的應力緩衝效果外，也可以提供基板1與遮蔽層6之間的應力緩衝功效。值得一提的是，在其他的實施態樣中，亦可在位於非視區5的緩衝層3內加入碳粉或是染料，使得位於非視區5中的緩衝層3藉由碳粉或染料的加入而具有 如同遮蔽層6的遮蔽效果。也因為位於非視區5中的緩衝層3已具有遮蔽的功能，因此在本實施例態樣中，遮蔽層6的厚度也可隨之調整下降，如此不僅可降低生產遮蔽層6的製造成本，亦可改善感應電路層2由視區4延伸至非視區5時因高低落差過大而容易在視區4與非視區5交界處斷裂的問題。而本實施例其餘各部件之特徵與材料特性與上述之第四實施例相同，故不再贅述。 Referring to FIG. 5, a fifth embodiment of the touch screen of the present invention is different from the fourth embodiment. In the non-view area 5, the sensing circuit layer 2, the buffer layer 3 and the shielding layer 6 are opposite. The location is different. In this embodiment, the buffer layer 3 is directly formed on the lower surface 112 of the substrate 1, and the shielding layer 6 is located between the buffer layer 3 and the sensing circuit layer 2, and the signal transmission layer 7 and the buffer layer 3 are respectively located in the shielding layer. 6 on the opposite side. Therefore, in addition to providing a stress buffering effect between the substrate 1 and the sensing circuit layer 2, the buffer layer 3 of the present embodiment can also provide a stress buffering effect between the substrate 1 and the shielding layer 6. It is worth mentioning that, in other embodiments, carbon powder or dye may be added to the buffer layer 3 located in the non-view area 5, so that the buffer layer 3 located in the non-view area 5 is made of toner or Adding dye It is like the shielding effect of the shielding layer 6. Also, since the buffer layer 3 located in the non-view area 5 already has the function of shielding, in the embodiment, the thickness of the shielding layer 6 can be adjusted and lowered accordingly, so that the manufacturing cost of the production of the shielding layer 6 can be reduced. It is also possible to improve the problem that the sensing circuit layer 2 is easily broken at the boundary between the viewing zone 4 and the non-viewing zone 5 because the height difference is too large when the sensing circuit layer 2 extends from the viewing zone 4 to the non-viewing zone 5. The features and material characteristics of the remaining components of the embodiment are the same as those of the fourth embodiment described above, and therefore will not be described again.
參閱圖6，為本發明觸控螢幕的第六實施例，本實施例與第五實施例的差別在於緩衝層3僅位於基板1下表面112的視區4，並無延伸至非視區5，而遮蔽層6是直接形成於基板1的下表面112。因此，在非視區5中，遮蔽層6是位於基板1與感應電路層2間，而訊號傳送層7與基板1分別位於遮蔽層6的兩相反側。儘管緩衝層3可維持基板1強度並消除感應電路層2的蝕刻痕，然而，在非視區5中，由於遮蔽層6的存在，因此蝕刻痕無法被使用者所看到。此外，由於組成遮蔽層6的有色光阻或有色油墨也是有機化合物，使遮蔽層6也具有消除部分應力的能力，因此對基板1的強度也不至於有太大的影響。因此，在本實施例中，緩衝層3僅位於基板1下表面112的視區4而無延伸至非視區5，並不影響基板1的強度與產品的美觀。此外，當感應電路層2由視區4的緩衝層3橫跨至遮蔽層6上時，若遮蔽層6與感應電路層2的高低落差過大，則可能導致感應電路層2在緩衝層3與遮蔽層6的交界處斷裂，致使觸控功能異常與良率下降。而在本實施例中 ，緩衝層3僅位在視區4而無延伸至非視區5，如此也一定程度地降低遮蔽層6與感應電路層2之間的高低落差，避免了感應電路層2在緩衝層3與遮蔽層6的交界處斷裂，進一步地提升了製程的良率。而本實施例其餘各部件之特徵與材料特性與上述之第五實施例相同，故不再贅述。 Referring to FIG. 6 , a sixth embodiment of the touch screen of the present invention is different from the fifth embodiment in that the buffer layer 3 is located only in the view area 4 of the lower surface 112 of the substrate 1 and does not extend to the non-view area 5 . The shielding layer 6 is formed directly on the lower surface 112 of the substrate 1. Therefore, in the non-view area 5, the shielding layer 6 is located between the substrate 1 and the sensing circuit layer 2, and the signal transmission layer 7 and the substrate 1 are respectively located on opposite sides of the shielding layer 6. Although the buffer layer 3 can maintain the strength of the substrate 1 and eliminate the etching marks of the sensing circuit layer 2, in the non-viewing area 5, the etching marks cannot be seen by the user due to the presence of the shielding layer 6. Further, since the colored photoresist or colored ink constituting the shielding layer 6 is also an organic compound, the shielding layer 6 also has the ability to eliminate partial stress, and thus does not have much influence on the strength of the substrate 1. Therefore, in the present embodiment, the buffer layer 3 is only located in the viewing zone 4 of the lower surface 112 of the substrate 1 without extending to the non-viewing zone 5, and does not affect the strength of the substrate 1 and the aesthetics of the product. In addition, when the sensing circuit layer 2 is spanned from the buffer layer 3 of the viewing zone 4 to the shielding layer 6, if the height difference between the shielding layer 6 and the sensing circuit layer 2 is too large, the sensing circuit layer 2 may be caused in the buffer layer 3 The boundary of the shielding layer 6 is broken, resulting in an abnormal touch function and a decrease in yield. In this embodiment The buffer layer 3 is only located in the viewing zone 4 and does not extend to the non-viewing zone 5, so that the height difference between the shielding layer 6 and the sensing circuit layer 2 is also reduced to some extent, and the sensing circuit layer 2 is avoided in the buffer layer 3 and The junction of the shielding layer 6 is broken, which further improves the yield of the process. The features and material characteristics of the remaining components of the embodiment are the same as those of the fifth embodiment described above, and therefore will not be described again.
綜上前述六個實施例，本發明觸控螢幕可透過緩衝層3維持基板1強度，並消除感應電路層2所造成的蝕刻痕，故確實能達成本發明之目的。 In summary, in the foregoing six embodiments, the touch screen of the present invention can maintain the strength of the substrate 1 through the buffer layer 3 and eliminate the etching marks caused by the sensing circuit layer 2, so that the object of the present invention can be achieved.
惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.
1‧‧‧基板 1‧‧‧Substrate
112‧‧‧下表面 112‧‧‧ lower surface
2‧‧‧感應電路層 2‧‧‧Sensor circuit layer
3‧‧‧緩衝層 3‧‧‧buffer layer
4‧‧‧視區 4‧‧ ‧Sight Zone
5‧‧‧非視區 5‧‧‧Non-view zone
6‧‧‧遮蔽層 6‧‧‧shading layer
7‧‧‧訊號傳送層 7‧‧‧Signal transmission layer
Claims (20)
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410639458.1A CN105892731B (en) | 2014-10-29 | 2014-10-29 | Touch Screen |
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| TW201616307A TW201616307A (en) | 2016-05-01 |
| TWI550469B true TWI550469B (en) | 2016-09-21 |
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| TW104108810A TWI550469B (en) | 2014-10-29 | 2015-03-19 | Touch screen |
| TW104204133U TWM509380U (en) | 2014-10-29 | 2015-03-19 | Touch screen |
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| CN105892731B (en) * | 2014-10-29 | 2019-05-28 | 祥达光学（厦门）有限公司 | Touch Screen |
| CN105677097A (en) | 2016-01-04 | 2016-06-15 | 京东方科技集团股份有限公司 | Touch screen and manufacturing method thereof |
| CN107358996B (en) * | 2017-07-21 | 2019-06-18 | 河南理工大学 | Using ZrTi based alloy as electrically conducting transparent laminated film of buffer layer and its preparation method and application |
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| JP2007253512A (en) * | 2006-03-24 | 2007-10-04 | Toray Ind Inc | Optical laminated biaxially stretched polyester film and hard coat film using it |
| CN101052516A (en) * | 2004-09-07 | 2007-10-10 | 帝人株式会社 | Transparent conductive laminate and transparent touch panel |
| CN101834014A (en) * | 2009-03-13 | 2010-09-15 | 迎辉科技股份有限公司 | Transparent conducting film |
| CN203502934U (en) * | 2013-09-29 | 2014-03-26 | 宸鸿科技(厦门)有限公司 | Touch panel |
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| TWM509380U (en) * | 2014-10-29 | 2015-09-21 | Tpk Glass Solutions Xiamen Inc | Touch screen |
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| CN101429640A (en) * | 2008-10-21 | 2009-05-13 | 北京东方新材科技有限公司 | Transparent conductive film production method |
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| JP2013109219A (en) * | 2011-11-22 | 2013-06-06 | Keiwa Inc | Optical sheet, transparent conductive laminate, and touch panel |
| CN204256711U (en) * | 2014-10-29 | 2015-04-08 | 祥达光学（厦门）有限公司 | Touch screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101052516A (en) * | 2004-09-07 | 2007-10-10 | 帝人株式会社 | Transparent conductive laminate and transparent touch panel |
| JP2007253512A (en) * | 2006-03-24 | 2007-10-04 | Toray Ind Inc | Optical laminated biaxially stretched polyester film and hard coat film using it |
| CN101834014A (en) * | 2009-03-13 | 2010-09-15 | 迎辉科技股份有限公司 | Transparent conducting film |
| TWM488679U (en) * | 2013-06-04 | 2014-10-21 | Tpk Touch Solutions Xiamen Inc | Touch panel |
| CN203502934U (en) * | 2013-09-29 | 2014-03-26 | 宸鸿科技(厦门)有限公司 | Touch panel |
| TWM509380U (en) * | 2014-10-29 | 2015-09-21 | Tpk Glass Solutions Xiamen Inc | Touch screen |
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| Publication number | Publication date |
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| CN105892731A (en) | 2016-08-24 |
| CN105892731B (en) | 2019-05-28 |
| TWM509380U (en) | 2015-09-21 |
| TW201616307A (en) | 2016-05-01 |
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