TWI548327B - 與一單板電腦使用之楔形鎖及組裝一電腦系統之方法 - Google Patents

與一單板電腦使用之楔形鎖及組裝一電腦系統之方法 Download PDF

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Publication number
TWI548327B
TWI548327B TW100140400A TW100140400A TWI548327B TW I548327 B TWI548327 B TW I548327B TW 100140400 A TW100140400 A TW 100140400A TW 100140400 A TW100140400 A TW 100140400A TW I548327 B TWI548327 B TW I548327B
Authority
TW
Taiwan
Prior art keywords
force
board computer
single board
wedge
wedge lock
Prior art date
Application number
TW100140400A
Other languages
English (en)
Chinese (zh)
Other versions
TW201242495A (en
Inventor
伯納德 史波瑞爾
Original Assignee
阿巴可系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 阿巴可系統股份有限公司 filed Critical 阿巴可系統股份有限公司
Publication of TW201242495A publication Critical patent/TW201242495A/zh
Application granted granted Critical
Publication of TWI548327B publication Critical patent/TWI548327B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
TW100140400A 2010-11-04 2011-11-04 與一單板電腦使用之楔形鎖及組裝一電腦系統之方法 TWI548327B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/939,208 US8233279B2 (en) 2010-11-04 2010-11-04 Wedge lock for use with a single board computer and method of assembling a computer system

Publications (2)

Publication Number Publication Date
TW201242495A TW201242495A (en) 2012-10-16
TWI548327B true TWI548327B (zh) 2016-09-01

Family

ID=44862827

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100140400A TWI548327B (zh) 2010-11-04 2011-11-04 與一單板電腦使用之楔形鎖及組裝一電腦系統之方法

Country Status (9)

Country Link
US (1) US8233279B2 (enExample)
EP (1) EP2451261B1 (enExample)
JP (1) JP5926535B2 (enExample)
KR (1) KR101300422B1 (enExample)
CN (1) CN102609056B (enExample)
AU (1) AU2011244953B2 (enExample)
CA (1) CA2756902C (enExample)
MX (1) MX2011011761A (enExample)
TW (1) TWI548327B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8559178B2 (en) * 2010-10-11 2013-10-15 Lockheed Martin Corporation Cardlock clamp
US10928139B1 (en) 2013-08-16 2021-02-23 Advanced Cooling Technologies, Inc. Assembly and process for heat transfer with three surfaces
US10129996B2 (en) * 2016-03-02 2018-11-13 Creare Llc High-pressure card locks for maximizing heat transfer from electronics cards to card cages
US10433464B1 (en) * 2016-06-06 2019-10-01 ZT Group Int'l, Inc. Air duct for cooling a rear-mounted switch in a rack
JP6828903B2 (ja) 2018-04-23 2021-02-10 合同会社スイッチオン シングルボードコンピュータ用アダプタ
JP6906709B2 (ja) * 2018-09-14 2021-07-21 三菱電機株式会社 電力変換器
CN117412544B (zh) * 2023-12-15 2024-11-26 成都奇航系统集成有限公司 锁紧条

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
US6678159B1 (en) * 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
TWM390208U (en) * 2010-05-19 2010-10-11 Xiang-Dun Yu Manual engraving fixture

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US4819713A (en) * 1987-04-23 1989-04-11 Calmark Corporation Retainer for electronic modules
US4909752A (en) * 1989-03-31 1990-03-20 Honeywell, Inc. Circuit card retainer
US5162979A (en) * 1989-10-23 1992-11-10 International Business Machines Corp. Personal computer processor card interconnect system
JPH0379496U (enExample) * 1989-12-06 1991-08-13
US4994937A (en) 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
US5220485A (en) * 1990-04-18 1993-06-15 Harris Corporation Heat removing edge guide system and related method
US5141592A (en) * 1990-08-20 1992-08-25 Denco, Inc. Sterile entry/exit total containment process for closed systems using plastic tubes
DE4028003A1 (de) * 1990-09-04 1992-03-05 Messerschmitt Boelkow Blohm Klemmelement zur halterung von elektronik-karten
US5200882A (en) 1992-01-17 1993-04-06 International Electronic Research Corporation Circuit board retainer
JPH07221479A (ja) * 1994-02-08 1995-08-18 Mitsubishi Electric Corp 電子機器
US5892658A (en) * 1998-05-12 1999-04-06 Lockhead Martin Corporation VME eurocard triple printed wiring board single slot module assembly
US6246582B1 (en) 1998-12-30 2001-06-12 Honeywell Inc. Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
US6212075B1 (en) 1998-12-30 2001-04-03 Honeywell Inc. Adapter kit to allow extended width wedgelock for use in a circuit card module
IL130775A (en) * 1999-07-02 2007-03-08 Elta Systems Ltd Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling
US6873528B2 (en) * 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6721182B1 (en) * 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US7988033B2 (en) * 2007-09-25 2011-08-02 Silverbrook Research Pty Ltd Method of reducing wire bond profile height in integrated circuits mounted to circuit boards
EP2061296B1 (en) * 2007-11-16 2014-05-14 GE Aviation Systems LLC Conduction cooled circuit board assembly
JP4941914B2 (ja) 2007-11-28 2012-05-30 多摩川精機株式会社 カード検出装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
US6678159B1 (en) * 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
TWM390208U (en) * 2010-05-19 2010-10-11 Xiang-Dun Yu Manual engraving fixture

Also Published As

Publication number Publication date
US8233279B2 (en) 2012-07-31
CN102609056A (zh) 2012-07-25
TW201242495A (en) 2012-10-16
EP2451261B1 (en) 2016-07-06
CA2756902C (en) 2014-02-25
US20120113589A1 (en) 2012-05-10
EP2451261A2 (en) 2012-05-09
JP5926535B2 (ja) 2016-05-25
EP2451261A3 (en) 2014-04-02
AU2011244953B2 (en) 2013-06-27
MX2011011761A (es) 2012-05-22
KR20120047831A (ko) 2012-05-14
KR101300422B1 (ko) 2013-08-26
AU2011244953A1 (en) 2012-05-24
CN102609056B (zh) 2015-11-25
JP2012099817A (ja) 2012-05-24
CA2756902A1 (en) 2012-05-04

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MM4A Annulment or lapse of patent due to non-payment of fees