CA2756902C - Wedge lock for use with a single board computer and method of assembling a computer system - Google Patents
Wedge lock for use with a single board computer and method of assembling a computer system Download PDFInfo
- Publication number
- CA2756902C CA2756902C CA2756902A CA2756902A CA2756902C CA 2756902 C CA2756902 C CA 2756902C CA 2756902 A CA2756902 A CA 2756902A CA 2756902 A CA2756902 A CA 2756902A CA 2756902 C CA2756902 C CA 2756902C
- Authority
- CA
- Canada
- Prior art keywords
- single board
- board computer
- move
- force
- accordance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Aviation & Aerospace Engineering (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/939,208 US8233279B2 (en) | 2010-11-04 | 2010-11-04 | Wedge lock for use with a single board computer and method of assembling a computer system |
| US12/939,208 | 2010-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2756902A1 CA2756902A1 (en) | 2012-05-04 |
| CA2756902C true CA2756902C (en) | 2014-02-25 |
Family
ID=44862827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2756902A Active CA2756902C (en) | 2010-11-04 | 2011-11-03 | Wedge lock for use with a single board computer and method of assembling a computer system |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US8233279B2 (enExample) |
| EP (1) | EP2451261B1 (enExample) |
| JP (1) | JP5926535B2 (enExample) |
| KR (1) | KR101300422B1 (enExample) |
| CN (1) | CN102609056B (enExample) |
| AU (1) | AU2011244953B2 (enExample) |
| CA (1) | CA2756902C (enExample) |
| MX (1) | MX2011011761A (enExample) |
| TW (1) | TWI548327B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8559178B2 (en) | 2010-10-11 | 2013-10-15 | Lockheed Martin Corporation | Cardlock clamp |
| US10928139B1 (en) | 2013-08-16 | 2021-02-23 | Advanced Cooling Technologies, Inc. | Assembly and process for heat transfer with three surfaces |
| US10129996B2 (en) * | 2016-03-02 | 2018-11-13 | Creare Llc | High-pressure card locks for maximizing heat transfer from electronics cards to card cages |
| US10433464B1 (en) * | 2016-06-06 | 2019-10-01 | ZT Group Int'l, Inc. | Air duct for cooling a rear-mounted switch in a rack |
| JP6828903B2 (ja) | 2018-04-23 | 2021-02-10 | 合同会社スイッチオン | シングルボードコンピュータ用アダプタ |
| WO2020054376A1 (ja) * | 2018-09-14 | 2020-03-19 | 三菱電機株式会社 | 電力変換器 |
| CN117412544B (zh) * | 2023-12-15 | 2024-11-26 | 成都奇航系统集成有限公司 | 锁紧条 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4819713A (en) * | 1987-04-23 | 1989-04-11 | Calmark Corporation | Retainer for electronic modules |
| US4909752A (en) * | 1989-03-31 | 1990-03-20 | Honeywell, Inc. | Circuit card retainer |
| US5162979A (en) * | 1989-10-23 | 1992-11-10 | International Business Machines Corp. | Personal computer processor card interconnect system |
| JPH0379496U (enExample) * | 1989-12-06 | 1991-08-13 | ||
| US4994937A (en) | 1989-12-22 | 1991-02-19 | Lockheed Corporation | Hydraulic thermal clamp for electronic modules |
| US5220485A (en) * | 1990-04-18 | 1993-06-15 | Harris Corporation | Heat removing edge guide system and related method |
| US5141592A (en) * | 1990-08-20 | 1992-08-25 | Denco, Inc. | Sterile entry/exit total containment process for closed systems using plastic tubes |
| DE4028003A1 (de) * | 1990-09-04 | 1992-03-05 | Messerschmitt Boelkow Blohm | Klemmelement zur halterung von elektronik-karten |
| US5200882A (en) | 1992-01-17 | 1993-04-06 | International Electronic Research Corporation | Circuit board retainer |
| JPH07221479A (ja) * | 1994-02-08 | 1995-08-18 | Mitsubishi Electric Corp | 電子機器 |
| US5859764A (en) * | 1997-02-27 | 1999-01-12 | Raytheon Company | Electronics package employing a high thermal performance wedgelock |
| US5892658A (en) * | 1998-05-12 | 1999-04-06 | Lockhead Martin Corporation | VME eurocard triple printed wiring board single slot module assembly |
| US6212075B1 (en) | 1998-12-30 | 2001-04-03 | Honeywell Inc. | Adapter kit to allow extended width wedgelock for use in a circuit card module |
| US6246582B1 (en) | 1998-12-30 | 2001-06-12 | Honeywell Inc. | Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module |
| IL130775A (en) * | 1999-07-02 | 2007-03-08 | Elta Systems Ltd | Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling |
| US6873528B2 (en) * | 2002-05-28 | 2005-03-29 | Dy 4 Systems Ltd. | Supplemental heat conduction path for card to chassis heat dissipation |
| US6721182B1 (en) * | 2002-10-10 | 2004-04-13 | Harris Corporation | Circuit card module including mezzanine card heat sink and related methods |
| US6678159B1 (en) | 2002-12-23 | 2004-01-13 | Eastman Kodak Company | Method of transporting heat from a heat dissipating electrical assemblage |
| US7988033B2 (en) * | 2007-09-25 | 2011-08-02 | Silverbrook Research Pty Ltd | Method of reducing wire bond profile height in integrated circuits mounted to circuit boards |
| EP2061296B1 (en) * | 2007-11-16 | 2014-05-14 | GE Aviation Systems LLC | Conduction cooled circuit board assembly |
| JP4941914B2 (ja) | 2007-11-28 | 2012-05-30 | 多摩川精機株式会社 | カード検出装置 |
| TWM390208U (en) * | 2010-05-19 | 2010-10-11 | Xiang-Dun Yu | Manual engraving fixture |
-
2010
- 2010-11-04 US US12/939,208 patent/US8233279B2/en active Active
-
2011
- 2011-10-31 EP EP11187316.2A patent/EP2451261B1/en active Active
- 2011-10-31 JP JP2011238094A patent/JP5926535B2/ja not_active Expired - Fee Related
- 2011-11-03 KR KR1020110114089A patent/KR101300422B1/ko not_active Expired - Fee Related
- 2011-11-03 CN CN201110366079.6A patent/CN102609056B/zh not_active Expired - Fee Related
- 2011-11-03 AU AU2011244953A patent/AU2011244953B2/en active Active
- 2011-11-03 CA CA2756902A patent/CA2756902C/en active Active
- 2011-11-04 TW TW100140400A patent/TWI548327B/zh not_active IP Right Cessation
- 2011-11-04 MX MX2011011761A patent/MX2011011761A/es active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| MX2011011761A (es) | 2012-05-22 |
| AU2011244953B2 (en) | 2013-06-27 |
| US20120113589A1 (en) | 2012-05-10 |
| JP2012099817A (ja) | 2012-05-24 |
| CN102609056B (zh) | 2015-11-25 |
| KR101300422B1 (ko) | 2013-08-26 |
| EP2451261B1 (en) | 2016-07-06 |
| TW201242495A (en) | 2012-10-16 |
| KR20120047831A (ko) | 2012-05-14 |
| JP5926535B2 (ja) | 2016-05-25 |
| EP2451261A2 (en) | 2012-05-09 |
| EP2451261A3 (en) | 2014-04-02 |
| AU2011244953A1 (en) | 2012-05-24 |
| US8233279B2 (en) | 2012-07-31 |
| CA2756902A1 (en) | 2012-05-04 |
| CN102609056A (zh) | 2012-07-25 |
| TWI548327B (zh) | 2016-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2756902C (en) | Wedge lock for use with a single board computer and method of assembling a computer system | |
| US6819562B2 (en) | Cooling apparatus for stacked components | |
| EP2561733B1 (en) | Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system | |
| US8238101B2 (en) | Heat transfer system for memory modules | |
| US7660114B2 (en) | Heat dissipating member, heat dissipating mechanism, and information processing apparatus | |
| US8550836B2 (en) | Mounting apparatus for memory card | |
| US5010444A (en) | Rack mounted circuit board | |
| US6603665B1 (en) | Heat dissipating assembly with thermal plates | |
| WO2013157117A1 (ja) | 冷却システムを備えた電子計算機 | |
| TW201220023A (en) | Server rack structure | |
| US9600039B2 (en) | Electronic device | |
| US9231357B1 (en) | Mid-plane assembly | |
| CN209767906U (zh) | 印刷电路板和电子设备 | |
| US7342794B1 (en) | Heat sink with integral card guide | |
| CN220023172U (zh) | 具散热结构的电路板 | |
| JP2000183255A (ja) | 電子機器におけるチップセット冷却構造 | |
| HK1111521A1 (zh) | 散热器安装装置及安装方法,以及使用其的服务器刀片 | |
| HK1111521B (en) | Heat sink mounting device and mounting method, and server blade using the same | |
| WO2018008091A1 (ja) | 情報処理装置、及び、ストレージキャリア | |
| JP2001352189A (ja) | 電子回路パッケージの放熱構造 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |