CN102609056B - 用于与单板计算机一起使用的楔形锁和组装计算机系统的方法 - Google Patents

用于与单板计算机一起使用的楔形锁和组装计算机系统的方法 Download PDF

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Publication number
CN102609056B
CN102609056B CN201110366079.6A CN201110366079A CN102609056B CN 102609056 B CN102609056 B CN 102609056B CN 201110366079 A CN201110366079 A CN 201110366079A CN 102609056 B CN102609056 B CN 102609056B
Authority
CN
China
Prior art keywords
wedge
single board
axle
board computer
lock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110366079.6A
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English (en)
Chinese (zh)
Other versions
CN102609056A (zh
Inventor
B.施珀雷尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Abaco Systems
Original Assignee
GE Intelligent Platforms Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Intelligent Platforms Inc filed Critical GE Intelligent Platforms Inc
Publication of CN102609056A publication Critical patent/CN102609056A/zh
Application granted granted Critical
Publication of CN102609056B publication Critical patent/CN102609056B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
CN201110366079.6A 2010-11-04 2011-11-03 用于与单板计算机一起使用的楔形锁和组装计算机系统的方法 Expired - Fee Related CN102609056B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/939,208 2010-11-04
US12/939,208 US8233279B2 (en) 2010-11-04 2010-11-04 Wedge lock for use with a single board computer and method of assembling a computer system
US12/939208 2010-11-04

Publications (2)

Publication Number Publication Date
CN102609056A CN102609056A (zh) 2012-07-25
CN102609056B true CN102609056B (zh) 2015-11-25

Family

ID=44862827

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110366079.6A Expired - Fee Related CN102609056B (zh) 2010-11-04 2011-11-03 用于与单板计算机一起使用的楔形锁和组装计算机系统的方法

Country Status (9)

Country Link
US (1) US8233279B2 (enExample)
EP (1) EP2451261B1 (enExample)
JP (1) JP5926535B2 (enExample)
KR (1) KR101300422B1 (enExample)
CN (1) CN102609056B (enExample)
AU (1) AU2011244953B2 (enExample)
CA (1) CA2756902C (enExample)
MX (1) MX2011011761A (enExample)
TW (1) TWI548327B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8559178B2 (en) * 2010-10-11 2013-10-15 Lockheed Martin Corporation Cardlock clamp
US10928139B1 (en) 2013-08-16 2021-02-23 Advanced Cooling Technologies, Inc. Assembly and process for heat transfer with three surfaces
US10129996B2 (en) * 2016-03-02 2018-11-13 Creare Llc High-pressure card locks for maximizing heat transfer from electronics cards to card cages
US10433464B1 (en) * 2016-06-06 2019-10-01 ZT Group Int'l, Inc. Air duct for cooling a rear-mounted switch in a rack
JP6828903B2 (ja) 2018-04-23 2021-02-10 合同会社スイッチオン シングルボードコンピュータ用アダプタ
JP6906709B2 (ja) * 2018-09-14 2021-07-21 三菱電機株式会社 電力変換器
CN117412544B (zh) * 2023-12-15 2024-11-26 成都奇航系统集成有限公司 锁紧条

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5162979A (en) * 1989-10-23 1992-11-10 International Business Machines Corp. Personal computer processor card interconnect system
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
CN101803012A (zh) * 2007-09-25 2010-08-11 西尔弗布鲁克研究股份有限公司 在集成电路小片和印刷电路板之间形成低型面线结合部的方法

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Publication number Priority date Publication date Assignee Title
US4819713A (en) * 1987-04-23 1989-04-11 Calmark Corporation Retainer for electronic modules
US4909752A (en) * 1989-03-31 1990-03-20 Honeywell, Inc. Circuit card retainer
JPH0379496U (enExample) * 1989-12-06 1991-08-13
US4994937A (en) 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
US5220485A (en) * 1990-04-18 1993-06-15 Harris Corporation Heat removing edge guide system and related method
US5141592A (en) * 1990-08-20 1992-08-25 Denco, Inc. Sterile entry/exit total containment process for closed systems using plastic tubes
DE4028003A1 (de) * 1990-09-04 1992-03-05 Messerschmitt Boelkow Blohm Klemmelement zur halterung von elektronik-karten
US5200882A (en) 1992-01-17 1993-04-06 International Electronic Research Corporation Circuit board retainer
JPH07221479A (ja) * 1994-02-08 1995-08-18 Mitsubishi Electric Corp 電子機器
US5892658A (en) * 1998-05-12 1999-04-06 Lockhead Martin Corporation VME eurocard triple printed wiring board single slot module assembly
US6246582B1 (en) * 1998-12-30 2001-06-12 Honeywell Inc. Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
US6212075B1 (en) * 1998-12-30 2001-04-03 Honeywell Inc. Adapter kit to allow extended width wedgelock for use in a circuit card module
IL130775A (en) * 1999-07-02 2007-03-08 Elta Systems Ltd Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling
US6873528B2 (en) * 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6721182B1 (en) * 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US6678159B1 (en) 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
EP2061296B1 (en) * 2007-11-16 2014-05-14 GE Aviation Systems LLC Conduction cooled circuit board assembly
JP4941914B2 (ja) 2007-11-28 2012-05-30 多摩川精機株式会社 カード検出装置
TWM390208U (en) * 2010-05-19 2010-10-11 Xiang-Dun Yu Manual engraving fixture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5162979A (en) * 1989-10-23 1992-11-10 International Business Machines Corp. Personal computer processor card interconnect system
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
CN101803012A (zh) * 2007-09-25 2010-08-11 西尔弗布鲁克研究股份有限公司 在集成电路小片和印刷电路板之间形成低型面线结合部的方法

Also Published As

Publication number Publication date
CA2756902C (en) 2014-02-25
KR101300422B1 (ko) 2013-08-26
JP2012099817A (ja) 2012-05-24
US20120113589A1 (en) 2012-05-10
CA2756902A1 (en) 2012-05-04
TWI548327B (zh) 2016-09-01
EP2451261A2 (en) 2012-05-09
CN102609056A (zh) 2012-07-25
EP2451261A3 (en) 2014-04-02
MX2011011761A (es) 2012-05-22
AU2011244953A1 (en) 2012-05-24
AU2011244953B2 (en) 2013-06-27
JP5926535B2 (ja) 2016-05-25
EP2451261B1 (en) 2016-07-06
US8233279B2 (en) 2012-07-31
KR20120047831A (ko) 2012-05-14
TW201242495A (en) 2012-10-16

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160121

Address after: Virginia

Patentee after: GE INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, Inc.

Address before: Augsburg

Patentee before: GE Intelligent Platforms, Inc.

C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: alabama

Patentee after: Abaco Systems

Address before: Virginia

Patentee before: GE INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, Inc.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151125

Termination date: 20211103

CF01 Termination of patent right due to non-payment of annual fee