TWI545617B - Exhaust apparatus and substrate processing apparatus having the same - Google Patents

Description

Exhaust device and substrate processing device with exhaust device

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an exhaust apparatus and a substrate processing apparatus having the same, and more particularly to an exhaust apparatus capable of easily discharging by-products to the outside of a chamber and having an exhaust apparatus. Substrate processing equipment.

In recent years, the use of excimer laser beams has been more widely handled for processing semiconductor materials because the stability and output of excimer laser beams have been improved.

In particular, in order to form a device such as a light emitting diode (LED), a process of separating a film from a wafer substrate is mainly performed by a laser processing apparatus that generates a laser beam. This process is called laser stripping. (Here, FIG. 1 is a view for describing a laser processing apparatus in the related art).

Referring to Fig. 1, a laser processing apparatus 1 includes a chamber 10 having a space for receiving a substrate S, and a gas inlet 12 and a gas outlet 14 are provided to the chamber 10, and a transmission window 30 is mounted on the upper end of the chamber 10. The laser beam radiating member 50 is mounted on the upper side of the transmission window 30, and the laser beam 55 radiated from the laser beam radiating member 50 Through the transmission window 30 and reaching the substrate in the chamber 10.

2(a) and 2(b) are views for describing a form of a laser beam 55 radiated from the radiation member 50, wherein Fig. 2(a) is a plan view of the substrate and Fig. 2(b) is a perspective view of the substrate Figure. As shown in FIGS. 2(a) and 2(b), the laser beam 55 is radiated on the substrate S in a line shape. The substrate S is moved in a direction (arrow direction) perpendicular to the line of the laser beam 55 to perform radiation of the laser beam 55 on the entire surface of the substrate S.

After this processing is completed, the exhaust apparatus shown in FIG. 3 can discharge the by-product P generated in the execution of the process through the gas outlets 14a and 14b of the side surface of the lower portion of the chamber 10. However, since the gas outlet is formed at a position lower than the place where the substrate is disposed, by-products positioned at the upper portion of the substrate are not easily discharged to the outside of the chamber 10. Therefore, by-products remain in the chamber. Moreover, since the by-product P is not easily moved to the outlet by the natural loop, the cleanliness of the interior of the chamber 10 is lowered.

As a result, the by-products produced contaminate and damage other configuration elements, resulting in a reduction in the durability of the laser processing apparatus.

Further, since the by-products present on the upper portion of the substrate are not easily discharged due to the position at which the outlet is provided, the quality of the finished product may eventually be lowered.

Therefore, the processing of the laser processing apparatus has been performed beforehand to remove particles in the chamber. However, there is a problem in that after the completion of the process, the amount of nitrogen for increasing the yield of the process and interrupting the vacuum is excessive due to the process performed in a vacuum state. Further, although the treatment is performed in a sealed nitrogen atmosphere to prevent the inflow of foreign particles, it is not easy to remove by-products generated in the chamber 10.

Related technical literature Patent literature

(Patent Document 1) KR2004-0096317 A1

The present invention provides an exhaust apparatus capable of easily discharging by-products generated during processing of a substrate to the outside of the chamber and a substrate processing apparatus having the exhaust apparatus.

The present disclosure also provides an exhaust apparatus capable of improving processing efficiency and productivity and a substrate processing apparatus having the exhaust apparatus.

The present disclosure also provides an exhaust device capable of improving the durability of the processing apparatus and a substrate processing apparatus having the exhaust device.

According to an exemplary embodiment, a substrate processing apparatus includes: a chamber that forms an internal space of a processing substrate; an exhaust device that discharges by-products generated during processing of the substrate to an outside of the chamber; and a substrate support member The substrate is supported in the inner space of the chamber; and a laser generating unit radiates a laser beam onto the substrate disposed on the substrate support, wherein the exhaust device includes an exhaust gas The exhaust gas enthalpy is formed at a side wall other than the upper and lower portions of the chamber, and is provided to the side wall in a single or a plurality.

The exhaust gas enthalpy may be formed at an entire sidewall of the chamber other than the upper portion or the lower portion of the chamber, or formed in the upper portion of the chamber except the chamber And the entire side of the lower portion and the side wall forming the inlet opening At the wall.

The above exhaust apparatus may further include a syringe having an injection nozzle disposed at an upper side of the exhaust port and injecting a gas toward the lower portion.

A plurality of injection holes may be formed at the injection nozzle, and the injection holes may be formed to inject a gas toward a side wall of the chamber.

A transmission window through which the laser beam generated by the laser generating unit passes may be formed on an upper side of the chamber, and the injection nozzle may be disposed around the transmission window.

The chamber may include: a lower block in which the substrate support is disposed on an upper portion thereof; and a cover covering an upper portion of the lower block to seal the lower block, wherein a substrate through which the substrate is loaded or unloaded The inlet port is formed in at least one of the side walls except the upper side wall of the cover.

An inhaler for inhaling by-products may be disposed to a lower portion of both sides of the substrate support, wherein the inhaler may include: a pressure adjustment unit that adjusts a pressure for drawing in the by-product; and a suction nozzle through which The suction hole of the by-product is sucked.

The substrate support may be a substrate transfer unit capable of transferring the substrate within the chamber.

The substrate transfer unit may include: a pair of guide rails disposed in parallel with each other in a direction crossing both ends of the suction nozzle, and spaced apart from each other in a first axial direction; the first shaft slider having a length of the second axial direction of the connection between the guide rails, and along the guide rail together with the suction nozzle in the first axial direction Sliding back and forth; a second shaft slider disposed on an upper portion of the first shaft slider and sliding back and forth along the first slider in the second axis direction; the rotary shaft guide is inserted into a central inner portion of the second shaft slider; and a substrate support plate disposed to an upper portion of the rotating shaft guide.

According to another embodiment, an exhaust apparatus for use in a substrate processing apparatus, the exhaust apparatus comprising: an exhaust port disposed to a side surface of the substrate; at least one injection nozzle; and a supply unit that supplies the gas to the The injection nozzle is described.

The exhaust gas enthalpy may be formed at an entire surface other than an upper portion and a lower portion of the substrate, or formed in the upper and lower portions of the substrate and the entry direction of the substrate of the substrate Outside the entire surface.

The injection nozzle may include: a plurality of first injection nozzles disposed in parallel with each other in one direction; and a plurality of second injection nozzles at an outer portion of the first injection nozzle that intersect with the one direction The one direction is disposed in parallel with each other, wherein the injection nozzle may be formed to inject a gas toward an outer direction of the substrate.

An inhaler may be disposed spaced apart from a lower portion of the substrate to absorb by-products present on the lower portion of the substrate.

10‧‧‧ chamber

12‧‧‧ gas inlet

14‧‧‧ gas export

14a‧‧‧ gas export

14b‧‧‧ gas export

30‧‧‧Transmission window

50‧‧‧radiation components

55‧‧‧Laser beam

100‧‧‧ chamber

110‧‧‧lower block

130‧‧‧ Cover

135‧‧‧substrate inlet

200‧‧‧Exhaust equipment

220‧‧‧Exhaust gas

240‧‧‧Syringe

245‧‧‧Injection nozzle

247‧‧‧ injection hole

260‧‧‧ inhaler

265‧‧‧Inhalation nozzle

267‧‧‧Inhalation hole

300‧‧‧Substrate support

310‧‧‧Linear motor guide

330‧‧‧First Axis Slider

350‧‧‧Second axis slider

355‧‧‧Rotary shaft guide

400‧‧‧Transmission window

500‧‧‧Laser generating unit

550‧‧‧Mirror

551‧‧‧Laser beam

1000‧‧‧Substrate processing equipment

P‧‧‧ by-product

S‧‧‧Substrate

The exemplary embodiments can be understood in more detail from the following description in conjunction with the drawings.

FIG. 1 is a view for describing a conventional laser processing apparatus.

2(a) and 2(b) are views for describing the shape of a laser beam.

Figure 3 is a schematic diagram illustrating a prior art exhaust apparatus and exhaust flow.

FIG. 4 is a view illustrating a substrate processing apparatus having an exhaust device, according to an exemplary embodiment.

FIG. 5 is a view illustrating a cover provided with an exhaust port and a syringe, according to an exemplary embodiment.

Fig. 6 is a view for explaining an inner upper surface of the cap of Fig. 5.

7(a) and 7(b) are views for explaining the injection direction of the gas injected from the injection nozzle.

8a, 8b, and 8c are views illustrating a substrate support and an inhaler, according to an exemplary embodiment.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings. However, the present disclosure may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will be apparent to those skilled in the art The concept of this disclosure is fully conveyed. Throughout the text, the same reference numerals indicate the same elements.

Hereinafter, a laser processing apparatus as a substrate processing apparatus including an exhaust device will be described as an example, but an application of the exhaust apparatus according to an exemplary embodiment is not limited thereto. That is, the exhaust device can be applied to various devices and laser processing devices that must effectively remove by-products generated when the substrate in the predetermined space is processed.

FIG. 4 is a view illustrating a laser processing apparatus according to an exemplary embodiment. FIG. 5 is a view illustrating a cover provided with an exhaust port and a syringe, according to an exemplary embodiment. Fig. 6 is a view for explaining an inner upper surface of the cap of Fig. 5. 7(a) and 7(b) are views for explaining the injection direction of the gas injected from the injection nozzle. 8a, 8b, and 8c are views illustrating a substrate support and an inhaler, according to an exemplary embodiment.

A laser processing apparatus is a device that separates a PI film from a boundary surface of a glass substrate using a laser beam. The laser processing apparatus includes: a chamber 100 forming an internal space for processing the substrate S; an exhaust device 200 discharging the by-products in the chamber 100 to the outside of the chamber 100; and a substrate support 300 inside the chamber 100 The support substrate S in the space; and the laser generating unit 500 are disposed on the substrate support 300 and radiate the laser beam 551 onto the substrate S disposed on the substrate support 300.

The laser processing apparatus further includes a transmission window 400 installed at one side surface of the chamber 100 facing the substrate S, and a mirror 550 disposed outside the transmission window 400 to face the transmission window 400 outside the chamber 100.

The chamber 100 includes a lower block 110 whose upper portion is open, and a cover 130 disposed on an upper portion of the lower block 110 to seal the lower block 110. In this regard, the chamber 100 is not limited to the configuration described above, and may be formed, for example, in an integral type. When the chamber 100 is integrally formed as described above, a door (not shown) may be provided to at least any one of the chambers 100.

The lower block 110 is provided with a substrate support 300 disposed on an upper portion thereof, the substrate support 300 having a flat upper surface and a predetermined thickness. At this time, although not illustrated in the drawings, a passage may be formed in which a supply line connectable to the substrate support 300 and the exhaust apparatus 200 is connected to the passage.

A cover 130 is used to cover an upper portion of the lower block 110 to seal the lower block 110. At this time, when the substrate is supplied to the loading lock chamber (not shown) in the chamber 100 to be connected to at least any one of the side walls except the upper surface of the cover 130, the substrate inlet port 135 is formed so that the substrate Loading or unloading through the substrate inlet port 135.

Hereinafter, the exhaust port 220, the syringe 240, and the inhaler 260 included in the exhaust apparatus 200 of the present invention will be described in detail.

The exhaust device 200 is a device in a system for processing the substrate S, and discharges by-products generated during the processing of the substrate S to the outside of the chamber 100. The exhaust apparatus 200 includes an exhaust port 220 formed at a side wall other than an upper portion and a lower portion of the chamber 100, a syringe 240 disposed to a bottom surface of the cover in the chamber 100, and an inhaler 260 equipped for transmission At both sides of the support member 300 of the substrate S, by-products are sucked in at the bottom of the chamber 100.

At least one exhaust port 220 is formed at the side walls other than the upper and lower portions of the chamber 100, thereby discharging by-products in the chamber 100 so that by-products in the chamber 100 can be quickly and easily discharged . The exhaust enthalpy 220 may be formed at the entire side wall other than the upper portion and the lower portion of the chamber 100, or formed in addition to the upper portion and the lower portion of the chamber 100 and the side wall forming the substrate inlet port 135. Outside the remaining side walls. When the exhaust enthalpy 220 is formed almost at all the side walls and a plurality of exhaust enthalces 220 are formed at each of the side walls, it is advantageous that the by-products in the chamber 100 can be quickly discharged to the outside.

At this time, a duct (not shown) or a hose (not shown) capable of discharging the by-product to the outside may be connected to the exhaust port 220 so that the duct or soft can also be passed through The tube discharges by-products to the outside of the chamber 100. However, in the present invention, when a plurality of exhaust ports 220 are to be provided to the chamber 100, the elements connected to the exhaust port 220 are not limited.

A syringe 240 is disposed above the exhaust port 220 and serves to push the byproduct in a downward direction (the lower side within the chamber 100). In more detail, a plurality of syringes 240 are provided to the inner upper surface of the chamber 100 (the inner upper surface of the cover 130). The injector 240 includes a gas supply unit (not shown) disposed outside the chamber 100 to supply a gas, and an injection nozzle 245 that injects a gas supplied from the gas supply unit into the interior of the chamber 100. At this time, the injection nozzle 245 is installed at the upper side of the inside of the chamber 100, and is formed with a plurality of injection holes 247 through which the gas is injected. In more detail, a plurality of injection nozzles 245 are mounted on the inner upper surface of the cover 130, and are connected in such a manner that gas can be supplied from the gas supply unit provided to the outside of the chamber 100 to inject the gas into the cavity. The interior of the chamber 100.

At the same time, a plurality of injection nozzles 245 can be spaced apart from each other on each side wall of the chamber 100 and mounted in a direction parallel to the side walls. Accordingly, as shown in FIG. 6, a plurality of injection nozzles 245 may be disposed in a predetermined number in a direction parallel to the side walls of the chamber 100, and may be respectively mounted to have directivity on the side walls of the chamber. In more detail, the injection nozzle 245 includes: a plurality of first injection nozzles disposed in parallel with each other in one direction; and a plurality of second nozzles crossing the one direction at the outside of the first injection nozzle The other direction is set in parallel with each other. Therefore, the first injection nozzle and the second nozzle are disposed around the transfer window.

Further, an injection hole 247 formed in each of the injection nozzles 245 It is formed in a direction facing each of the side walls of the chamber 100 such that the gas injected through the injection hole 247 has directivity. That is, the injection hole 247 is formed such that the gas injected from the injection hole 247 biased toward the side wall of the chamber also moves in the side wall direction. Therefore, when the gas is injected into the upper portion of the substrate (that is, in a direction orthogonal to the upper portion of the chamber 100), the by-product is suppressed from falling on the upper portion of the substrate, so that contamination of the substrate can be suppressed. Moreover, since the gas has a directivity toward the exhaust port 220, by-products in the chamber 100 can be quickly discharged to the outside of the chamber 100 through the exhaust port 220. Further, the injection hole 247 can push the by-product to the bottom of the chamber 100 so that the by-product is not absorbed into the transfer window 400 provided on the upper portion of the substrate S.

The exhaust apparatus 200 configured as above may include an inhaler 260 in which the inhaler 260 is capable of sucking in and removing by-products present on the bottom surface of the interior of the chamber 100 (ie, the upper surface of the lower block 110).

8a, 8b, and 8c are views illustrating a substrate support and a syringe, according to an exemplary embodiment. Figure 8a is a perspective view illustrating a lower block equipped with a substrate support and a syringe. Figure 8b is a plan view of Figure 8a and Figure 8c is a perspective view of the inhaler.

The inhaler 260 is a device provided to a lower portion of both side surfaces of the substrate support 300 to suck in by-products present on the upper surface of the lower block 110. That is, the inhaler 260 draws in byproducts that are pushed through the syringe 240 and moved down to the lower portion of the chamber 100 and held on the bottom within the chamber 100. Therefore, the inhaler 260 is provided with a pressure adjusting unit (not shown) provided to the outside of the chamber 100 and formed with The suction nozzle 265 of the suction port 267 in which the by-product is sucked through the suction hole 267 by the suction force of the pressure adjusting unit.

The pressure adjusting unit is a device that is connected to a suction nozzle 265 provided in the interior of the chamber 100 to adjust the pressure so that by-products are sucked into the suction nozzle 265 through the suction hole 267. The pressure adjustment unit draws in the gas in the chamber 100 so that by-products can move toward the suction hole 267.

The suction nozzle 265 is provided to at least one of the side surfaces of the substrate support 300, is movable according to the movement of the substrate support 300 as the substrate moves, and thus can absorb by-products within the range of movement of the substrate support 300. At this time, the suction nozzle 265 may be formed in a rod shape as shown in FIG. 8c and fixed to both side surfaces of the substrate support 300.

At this time, the substrate support 300 in the present invention may be a single support for supporting one substrate in the chamber, and thus is provided with suction holes at both side surfaces thereof. However, when a plurality of supports (for example, two supports) are used to increase the yield of the substrate, at least one suction nozzle may be provided for each support.

Meanwhile, the substrate support 300 supporting the substrate may be a substrate transfer unit capable of horizontally transferring the substrate S within the chamber 100. Therefore, the substrate slider 300 will be described with reference to the drawings shown in FIGS. 8a, 8b, and 8c.

First, the substrate S is horizontally moved in a direction (arrow direction) perpendicular to the line of the laser beam 551 so that the laser beam is radiated on the entire surface of the substrate S. The substrate transfer unit that transfers the substrate S is configured by a linear motor (LM) guide. That is, the substrate transfer unit has a structure that linearly moves along the guide rail.

As shown in FIGS. 8a, 8b, and 8c, the first shaft slider 330 moves along the LM guide 310, and the second shaft slider 350 serving as the substrate support plate moves together with the first shaft slider 330. Therefore, during the heat treatment, the substrate is placed at an appropriate position by the movement in the second axial direction and the leveling rotational motion and the movement in the first axial direction. Here, the first axis and the second axis are any axes forming a two-dimensional plane, and may be simply expressed as an X-axis and a Y-axis.

The guide rail 310 is implemented in a pair of rails, and the pair of rails are disposed in parallel with each other in the Y-axis direction (first axial direction) on the upper surface (the bottom surface of the chamber 100) of the lower block. That is, the guide rails 310 are disposed to intersect both ends of the suction nozzle 265 and are spaced apart from each other in the first axial direction.

The first shaft slider 330 has a length in the second axial direction connected between the pair of guide rails 310, and slides back and forth in the first axial direction together with the suction nozzle 265. Referring to Fig. 8b, the first shaft slider 330 has a length in which a U-shaped groove is formed, and allows the inside of the body of the first shaft slider 330 to have a hollow space formed in a line shape.

The second shaft slider 350 is disposed on an upper portion of the first shaft slider 330 and slides back and forth along the first shaft slider 330 in the second axial direction. The second shaft slider 350 is mounted to cover the upper portion of the first shaft slider 330 in a concave shape. Here, since the second shaft slider 350 is mounted to cover the first shaft slider 330 concavely, the total height of the substrate support 300 can be lowered.

Moreover, since the rotary shaft guide (not shown) is mounted in a shape inserted into the central interior of the second shaft slide 350, this shape also contributes to lowering the substrate support. The total height of the struts 300. The reason for selecting such a structure is to compensate for the increase in the total height of the substrate support when the second shaft slider 350 is stacked on the first shaft slider 330 and the rotary shaft guide is stacked on the second shaft slider 350, respectively. The problem of large and large occupied space, and also compensates for the problem of reduced stability in substrate transfer.

Since the substrate support 300 has the structure as described above, the first shaft slider 330 slides along the two rails 310 mounted in parallel with each other, and the second shaft slider 350 slides together with the first shaft slider 330 . A rotary shaft guide (not shown) is inserted into the central interior of the second shaft slide 350, and the substrate support plate 355 is mounted on the rotary shaft guide. The first shaft slider 330 and the second shaft slider 350 are moved by a linear motor, and the rotary shaft guide imparts a rotational operation to the substrate S. Thus, the substrate S is transferred through the substrate support 300.

Meanwhile, the substrate processing apparatus 1000 according to the modified exemplary embodiment can perform processing by using two transfer units. Here, after the processing of the substrate transferred through one transfer unit is completed, the processing of the next substrate can be processed immediately, thereby increasing the yield of the substrate.

In the substrate processing apparatus 1000 in which a plurality of transfer units are provided, since the suction nozzle is formed at one of the two surfaces of the plurality of transfer units, the pair of the chambers can be processed due to the movement of the two transfer units product.

Therefore, an element provided to the substrate processing apparatus according to the modified exemplary embodiment may have the same or similar function as the element provided to the substrate processing apparatus according to the exemplary embodiment, and the substrate processing apparatus according to the exemplary embodiment may be applied. A substrate processing apparatus according to a modified exemplary embodiment.

As described above, the exhaust apparatus and the substrate processing apparatus having the exhaust apparatus can easily discharge the by-products in the substrate S to the outside of the chamber. That is, the by-product does not float in the upper portion of the substrate processing apparatus, and is pushed down by the syringe provided to the upper surface inside the cover.

Since the injection nozzles provided to the syringe are formed at a predetermined angle in both side directions, the gas injected through the injection nozzle can have directionality and process by-products. Therefore, by-products can be quickly discharged through the vent holes formed at the side surfaces of the lid of the chamber.

Further, since the inhaler is provided at the lower portions of the both side surfaces of the slider of the transfer unit that transmits the substrate inside the chamber, the by-product can be sucked from the suction nozzle and the pair existing on the bottom surface of the chamber can be easily removed product. Here, since the suction nozzle can be moved according to the movement of the transfer unit, by-products in almost all areas of the bottom surface of the chamber can be removed according to the movement of the transfer unit.

According to an exemplary embodiment, by-products generated in the execution of the treatment under a pressurized atmosphere can be easily discharged. For example, a by-product such as a polymer which is generated when a film formed on a wafer substrate is separated by a laser lift-off process by a laser processing apparatus can be easily discharged. Therefore, by-products can be prevented from remaining in the processing apparatus and contaminating the apparatus.

Moreover, since at least one exhaust gas enthalpy is formed in all of the side walls except for loading or unloading the side walls of the substrate, the discharge speed of the by-products to the outside of the chamber can be increased, thereby improving the processing efficiency and productivity.

In addition, by-products that float on the substrate by injecting gas from the top The object is quickly discharged to the outside of the chamber. Therefore, the problem of not easily removing by-products according to the formation position of the existing exhaust apparatus can be solved. Therefore, the quality of the product can be improved after the completion of the treatment.

Furthermore, since the vacuum of the chamber is unnecessary, the substrate processing apparatus can reduce the amount of nitrogen consumed due to the treatment in the vacuum state.

Although the invention has been described with reference to specific embodiments, the invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as defined by the appended claims.

100‧‧‧ chamber

110‧‧‧lower block

130‧‧‧ Cover

200‧‧‧Exhaust equipment

220‧‧‧Exhaust gas

240‧‧‧Syringe

260‧‧‧ inhaler

300‧‧‧Substrate support

400‧‧‧Transmission window

500‧‧‧Laser generating unit

550‧‧‧Mirror

551‧‧‧Laser beam

1000‧‧‧Substrate processing equipment

S‧‧‧Substrate

Claims (13)

A substrate processing apparatus, comprising: a chamber forming an internal space of a processing substrate; an exhaust device discharging a by-product generated during processing of the substrate to an outside of the chamber; a substrate supporting member, Supporting the substrate in the inner space of the chamber; and a laser generating unit radiating a laser beam onto the substrate disposed on the substrate support, wherein the exhaust device comprises a row a gas cylinder and a syringe, wherein the exhaust gas enthalpy is formed at a side wall other than an upper portion and a lower portion of the chamber, and is provided to the side wall in a single or a plurality, and the injector is disposed at the exhaust gas The gas is injected at the upper side of the crucible and downward. The substrate processing apparatus of claim 1, wherein the exhaust gas enthalpy is formed at an entire sidewall of the chamber other than the upper portion and the lower portion of the chamber, or The entire side wall of the chamber other than the upper and lower portions of the chamber and the side wall forming the inlet opening. The substrate processing apparatus according to claim 1, wherein the injector has an injection nozzle disposed at an upper side of the exhaust port and injecting a gas toward the lower side. The substrate processing apparatus of claim 3, wherein a plurality of injection holes are formed at the injection nozzle, and The injection hole is formed to inject the gas toward a side wall of the chamber. The substrate processing apparatus of claim 4, wherein a transmission window through which the laser beam generated from the laser generating unit passes is formed on an upper side of the chamber, and the injection nozzle surrounds the Set the transfer window. The substrate processing apparatus of claim 1, wherein the chamber comprises: a lower block, the substrate support is disposed on an upper portion thereof; and a cover covering an upper portion of the lower block to seal the lower portion And a block in which a substrate inlet port through which the substrate is loaded or unloaded is formed in at least one of the side walls except the upper side wall of the cover. The substrate processing apparatus of claim 5, wherein an inhaler for inhaling by-products is provided to a lower portion of both sides of the substrate support, wherein the inhaler comprises: a pressure adjustment unit, adjusted for a pressure at which the by-product is sucked; and a suction nozzle having a suction hole through which the by-product is sucked. The substrate processing apparatus of claim 7, wherein the substrate support is a substrate transfer unit capable of transferring the substrate within the chamber. The substrate processing apparatus of claim 8, wherein the substrate transfer unit comprises: a pair of guide rails disposed in parallel with each other in a direction crossing the both ends of the suction nozzle, and in a first axial direction Separated from each other; a first axis slider having a length in a second axis direction connected between the rails Degree, and sliding back and forth along the guide rail together with the suction nozzle in the first axial direction; a second shaft slider disposed on an upper portion of the first shaft slider, along the a slider sliding back and forth in the second axial direction; a rotary shaft guide inserted into a central interior of the second shaft slider; and a substrate support plate disposed to an upper portion of the rotary shaft guide . An exhaust apparatus for use in a substrate processing apparatus, characterized in that the exhaust apparatus includes: an exhaust port disposed to a side surface of the substrate except the upper portion and the lower portion; at least one injection nozzle spaced apart from each other on the substrate a supply unit that supplies gas to the injection nozzle, and a syringe that injects gas downward from an upper side of the exhaust port, wherein the injection nozzle faces the exhaust port. The exhaust apparatus according to claim 10, wherein the exhaust gas is formed at an entire surface other than an upper portion and a lower portion of the substrate, or is formed on the substrate other than the substrate The upper portion and the lower portion and the entire surface other than the entry direction of the substrate are described. The exhaust apparatus of claim 10, wherein the injection nozzle comprises: a plurality of first injection nozzles disposed in parallel with each other in one direction; and a plurality of second injection nozzles at the first The outside of the injection nozzle is disposed in parallel with each other in the other direction crossing the one direction, Wherein the injection nozzle is formed to inject a gas toward an outer direction of the substrate. The exhaust apparatus according to claim 10, wherein the inhaler is disposed spaced apart from a lower portion of the substrate to suck in by-products present on the lower portion of the substrate.