CN104425317B - Exhaust equipment and the substrate-treating apparatus with exhaust equipment - Google Patents
Exhaust equipment and the substrate-treating apparatus with exhaust equipment Download PDFInfo
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- CN104425317B CN104425317B CN201410427830.2A CN201410427830A CN104425317B CN 104425317 B CN104425317 B CN 104425317B CN 201410427830 A CN201410427830 A CN 201410427830A CN 104425317 B CN104425317 B CN 104425317B
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- 239000000758 substrate Substances 0.000 claims abstract description 133
- 239000000126 substance Substances 0.000 claims abstract description 50
- 238000012545 processing Methods 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000047 product Substances 0.000 claims abstract description 5
- 239000006227 byproduct Substances 0.000 claims abstract description 4
- 238000002347 injection Methods 0.000 claims description 52
- 239000007924 injection Substances 0.000 claims description 52
- 230000005540 biological transmission Effects 0.000 claims description 15
- 238000012546 transfer Methods 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000002689 soil Substances 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 3
- 208000034809 Product contamination Diseases 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 29
- 230000033001 locomotion Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000011282 treatment Methods 0.000 description 3
- QDZOEBFLNHCSSF-PFFBOGFISA-N (2S)-2-[[(2R)-2-[[(2S)-1-[(2S)-6-amino-2-[[(2S)-1-[(2R)-2-amino-5-carbamimidamidopentanoyl]pyrrolidine-2-carbonyl]amino]hexanoyl]pyrrolidine-2-carbonyl]amino]-3-(1H-indol-3-yl)propanoyl]amino]-N-[(2R)-1-[[(2S)-1-[[(2R)-1-[[(2S)-1-[[(2S)-1-amino-4-methyl-1-oxopentan-2-yl]amino]-4-methyl-1-oxopentan-2-yl]amino]-3-(1H-indol-3-yl)-1-oxopropan-2-yl]amino]-1-oxo-3-phenylpropan-2-yl]amino]-3-(1H-indol-3-yl)-1-oxopropan-2-yl]pentanediamide Chemical compound C([C@@H](C(=O)N[C@H](CC=1C2=CC=CC=C2NC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CC(C)C)C(N)=O)NC(=O)[C@@H](CC=1C2=CC=CC=C2NC=1)NC(=O)[C@H](CCC(N)=O)NC(=O)[C@@H](CC=1C2=CC=CC=C2NC=1)NC(=O)[C@H]1N(CCC1)C(=O)[C@H](CCCCN)NC(=O)[C@H]1N(CCC1)C(=O)[C@H](N)CCCNC(N)=N)C1=CC=CC=C1 QDZOEBFLNHCSSF-PFFBOGFISA-N 0.000 description 2
- 102100024304 Protachykinin-1 Human genes 0.000 description 2
- 101800003906 Substance P Proteins 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Substrate-treating apparatus and for the exhaust equipment in substrate-treating apparatus.The substrate-treating apparatus includes：Exhaust apparatus, by the processing procedure of substrate caused accessory substance be discharged to the outside of chamber；And laser generating unit, by bombardment with laser beams to being arranged on the substrate on substrate support, wherein described exhaust apparatus side wall includes exhaust port, and the exhaust port is formed at the side-walls in addition to the upper and lower part of the chamber, and arrives the side wall with single or multiple settings.The caused accessory substance in the implementation procedure of processing can easily be discharged.And the equipment can prevent equipment described in by-product contamination, and the final quality for improving manufactured product after the processing is completed.In addition, because the vacuum of the chamber is unnecessary, substrate-treating apparatus can reduce the amount of the nitrogen caused by the processing consumed in vacuum state in the prior art.
Description
Technical field
The present invention relates to exhaust equipment and the substrate-treating apparatus with exhaust equipment, and more particularly, relate to
Accessory substance is easily discharged to the exhaust equipment of the outside of chamber and the substrate-treating apparatus with exhaust equipment.
Background technology
In recent years, because having improved stability and the output of excimer laser beam, excimer laser beam uses model
The processing enclosed to handling semi-conducting material is more extensive.
Especially for the device such as light emitting diode (LED) is formed, mainly by producing the laser treatment of laser beam
Equipment performs the processing for separating film with wafer substrates.This processing is referred to as laser lift-off (LLO).(herein, Fig. 1 is to use
In the view for describing the laser processing apparatus in correlation technique).
Referring to Fig. 1, laser processing apparatus 1 is included with the chamber 10 for being used for the space for receiving substrate S, and gas access 12
Set with gas vent 14 and arrive chamber 10, and transmission window 30 is arranged on the upper end of chamber 10.Laser emission component 50 is installed
By transmission window 30 and chamber is reached on the upside of transmission window 30, and from the laser beam 55 that laser emission component 50 radiates
Substrate in 10.
Fig. 2 (a), Fig. 2 (b) are the view from the form of the laser beam 55 of the radiation of radiation 50, wherein Fig. 2 for description
(a) be the top view of substrate and Fig. 2 (b) be substrate perspective view.As shown in Fig. 2 (a), Fig. 2 (b), laser beam 55 is with wire spoke
Penetrate in substrate S.Substrate S moves in the direction of the line perpendicular to laser beam 55 (direction of arrow), right to perform laser beam 55
The radiation of the whole surface of substrate S.
After this processing is completed, the exhaust equipment shown in Fig. 3 can be gone out by the gas of the side surface of the bottom of chamber 10
Mouthful 14a and 14b discharges the caused accessory substance P in the execution of processing.However, because gas vent is formed than setting substrate
The low opening position in place, so the accessory substance being positioned at the top of substrate is not easy to be discharged to the outside of chamber 10.Therefore,
Accessory substance is maintained in chamber.And because accessory substance P is not easy to by Natural Circulation to be moved to outlet, reduce
The cleannes of the inside of chamber 10.
Therefore, caused by-product contamination and other configurations element is damaged, so as to cause the resistance to of laser processing apparatus
With the reduction in terms of property.
In addition, because of the accessory substance being present on the top of substrate due to setting the position of outlet without being easily drained, institute
May finally it be reduced with completing the quality of the product of processing.
Therefore, handling to remove the particle in chamber for laser processing apparatus has been performed in a vacuum before this.However,
Have a problem that, wherein after processing is completed, for improve the amount of the yield of processing and the nitrogen of break vacuum due to
The processing that is performed under vacuum state and it is excessive.Although in addition, perform process to prevent foreign particle in the nitrogen atmosphere of sealing
Inflow, but be not easy remove chamber 10 in caused accessory substance.
Relevant technical literature
Patent document
(patent document 1) KR2004-0096317A1
The content of the invention
The present invention provide can easily by the processing procedure of substrate caused accessory substance be discharged to the outside of chamber
Exhaust equipment and with exhaust equipment substrate-treating apparatus.
The present invention, which also provides, can improve at the exhaust equipment for the treatment of effeciency and productivity ratio and the substrate with exhaust equipment
Manage equipment.
The present invention is also provided at the exhaust equipment for the durability that can improve processing equipment and the substrate with exhaust equipment
Manage equipment.
According to one exemplary embodiment, a kind of substrate-treating apparatus includes：Chamber, form the inner space of processing substrate；Row
Device of air, by the processing procedure of substrate caused accessory substance be discharged to the outside of chamber；Substrate support, in the chamber
The inner space in support the substrate；And laser generating unit, by bombardment with laser beams to being arranged on the substrate branch
On the substrate in support member, wherein the exhaust apparatus includes exhaust port, the exhaust port is formed at except the chamber
Side-walls outside the upper and lower part of room, and arrive the side wall with single or multiple settings.
The exhaust port can be formed at the chamber in addition to the top or the bottom of the chamber
Whole side-walls, or be formed at the chamber except the top of the chamber and the bottom and form inlet port
Whole side-walls outside side wall.
Above exhaust equipment can also include syringe, the syringe have be arranged at the upside of the exhaust port and
Towards the injection nozzle of bottom injected gas.
Multiple injection orifices can be formed at the injection nozzle, and the injection orifice is formed as the side wall side towards chamber
To injected gas.
The upside of the chamber can be formed at from the transmission window that laser beam passed through caused by the laser generating unit
On, and the injection nozzle can surround the transmission window and set.
The chamber can include：Bottom piece, wherein the substrate support is disposed thereon in portion；And lid, covering institute
The top of bottom piece is stated to seal the bottom piece, is formed at wherein loading or unloading the substrate access port that the substrate passes through
In at least one side wall in addition to the upper portion side wall of the lid in side wall.
The bottom of the both sides of substrate support can be set in inhalator for sucking accessory substance, wherein the inhalator can
Comprising：Pressure adjustment unit, adjust the pressure for sucking the accessory substance；And inlet nozzle, have and institute is sucked by it
State the inlet hole of accessory substance.
The substrate support can be the substrate transfer unit that the substrate can be transmitted in the chamber.
The substrate transfer unit can include：A pair of guide rails, on the direction intersected at the both ends with the inlet nozzle that
This is abreast set, and is spaced apart from each other on the first direction of principal axis；First axle sliding block, there is the connected between the guide rail
The length of two direction of principal axis, and slided along the guide rail together with the inlet nozzle after first direction of principal axis is gone forward；The
Two axle sliding blocks, it is arranged on the top of the first axle sliding block, and along the first axle sliding block on second direction of principal axis
Slide back and forth；Rotary shaft guide member, it is inserted into the central interior of the second axle sliding block；And substrate support plate, setting are arrived
The top of the rotary shaft guide member.
According to another embodiment, a kind of exhaust equipment being used in substrate-treating apparatus, the exhaust equipment includes：Exhaust
Port, the side surface to substrate is set；At least one injection nozzle；And feeding unit, supply gas to the injection spray
Mouth.
The exhaust port can be formed at the whole surface in addition to the upper and lower part of the substrate, or is formed at
The whole table in addition to the top of the substrate and the approach axis of the bottom and the substrate of the substrate
At face.
The injection nozzle can include：Multiple first injection nozzles, are located in parallel to one another in one direction；It is and more
Individual second injection nozzle, it is in the outside of first injection nozzle on the other direction intersected with one direction each other
Abreast set, wherein the injection nozzle is formed as the outside direction injected gas towards the substrate.
Inhalator can with the bottom compartment of terrain of substrate and set, to suck the pair being present on the bottom of the substrate
Product.
Brief description of the drawings
One exemplary embodiment can be understood in more detail from following description with reference to accompanying drawing.
Fig. 1 is the view for describing existing laser processing apparatus.
Fig. 2 (a), Fig. 2 (b) are the views for describing the shape of laser beam.
Fig. 3 is the schematic diagram for illustrating existing exhaust equipment and exhaust stream.
Fig. 4 is the view for illustrating the substrate-treating apparatus with exhaust equipment according to one exemplary embodiment.
Fig. 5 is the view for illustrating the lid for being provided with exhaust port and syringe according to one exemplary embodiment.
Fig. 6 is the view of the inside upper surface for the lid for illustrating Fig. 5.
Fig. 7 (a), Fig. 7 (b) are the views for the injection direction for illustrating the gas from injection nozzle injection.
Fig. 8 a, Fig. 8 b, Fig. 8 c are the views for illustrating substrate support and inhalator according to one exemplary embodiment.
【Main element label declaration】
10：Chamber
12：Gas access
14：Gas vent
14a：Gas vent
14b：Gas vent
30：Transmission window
50：Radiation
55：Laser beam
100：Chamber
110：Bottom piece
130：Lid
135：Substrate access port
200：Exhaust equipment
220：Exhaust port
240：Syringe
245：Injection nozzle
247：Injection orifice
260：Inhalator
265：Inlet nozzle
267：Inlet hole
300：Substrate support
310：Linear motor guide rail
330：First axle sliding block
350：Second axle sliding block
355：Rotary shaft guide member
400：Transmission window
500：Laser generating unit
550：Speculum
551：Laser beam
1000：Substrate-treating apparatus
P：Accessory substance
S：Substrate
Embodiment
Hereinafter, one exemplary embodiment will be described in detail with reference to the accompanying drawings.However, the present invention can be according to many not similar shapes
Formula embodies, and should not be construed as limited to embodiments set forth herein；And these embodiments are to provide to cause the present invention
Will be thoroughly and complete, and will fully pass on idea of the invention to those skilled in the art.In full text, identical reference
Numeral represents identical element.
Hereinafter, the laser processing apparatus as the substrate-treating apparatus comprising exhaust equipment is described as example, but root
According to the application not limited to this of the exhaust equipment of one exemplary embodiment.That is, can by exhaust equipment be applied to must be effectively
Remove the various equipment and laser processing apparatus of accessory substance caused by the substrate in processing predetermined space.
Fig. 4 is the view for illustrating the laser processing apparatus according to one exemplary embodiment.Fig. 5 is illustrated according to exemplary implementation
The view of the lid for being provided with exhaust port and syringe of example.Fig. 6 is the view of the inside upper surface for the lid for illustrating Fig. 5.Fig. 7 (a),
Fig. 7 (b) is the view for the injection direction for illustrating the gas from injection nozzle injection.Fig. 8 a, Fig. 8 b, Fig. 8 c are illustrated according to demonstration
The property substrate support of embodiment and the view of inhalator.
Laser processing apparatus is the equipment for being separated PI films with the border surface of glass substrate using laser beam.At laser
Reason equipment includes：Chamber 100, form the inner space of processing substrate S；Exhaust equipment 200, the accessory substance in chamber 100 is arranged
Go out the outside to chamber 100；Substrate support 300, the support substrate S in the inner space of chamber 100；And laser produces list
Member 500, is arranged on substrate support 300 and laser beam 551 is radiated in the substrate S being arranged on substrate support 300.
Laser processing apparatus also includes the transmission window at a side surface towards substrate S for chamber 100
400, and be arranged in the outside of chamber 100 above transmission window 400 with towards the speculum 550 of transmission window 400.
Chamber 100 includes：Bottom piece 110, its top are open；And lid 130, it is arranged on the top of bottom piece 110
On with sealed lower portion block 110.For this, chamber 100 is not limited to configuration as described above, and can be for example with integral type shape
Into.When chamber 100 is integrally formed as described above, door (not shown) can be set chamber 100 at least any one
Place.
Bottom piece 110 is disposed thereon the substrate support 300 in portion, and substrate support 300 has flat upper table
Face and predetermined thickness.Now, it is although not shown in the drawings, passage can be formed, wherein, it is connectable to substrate support
300 and the supply line of exhaust equipment 200 be connected to the passage.
The top that lid 130 is used to cover bottom piece 110 is with sealed lower portion block 110.Now, when substrate is fed into chamber
Loadlock chamber (not shown) in 100 is connected at least any one side wall in addition to the upper surface of lid 130 of side wall
When, substrate access port 135 is formed, to cause substrate to pass through substrate access port 135 to load or unload.
Hereinafter, exhaust port 220, the and of syringe 240 being contained in the exhaust equipment 200 of the present invention be will be described in
Inhalator 260.
Exhaust equipment 200 is for handling the equipment in the system of substrate S, and will be produced in the processing procedure of substrate S
Accessory substance be discharged to the outside of chamber 100.Exhaust equipment 200 includes：Exhaust port 220, it is formed at upper except chamber 100
Side-walls outside portion and bottom；Syringe 240, the basal surface to the lid in chamber 100 is set；And inhalator 260, it is equipped with
At the both sides of support member 300 for transmitting substrate S, to suck accessory substance on the bottom of chamber 100.
At least one exhaust port 220 is formed at the side-walls in addition to the upper and lower part of chamber 100, so as to
The accessory substance in chamber 100 is discharged, make it that the accessory substance in chamber 100 can be discharged rapidly and easily.Exhaust port 220
The whole side-walls in addition to the top and the bottom of chamber 100 can be formed at, or are formed at except chamber 100
Remaining side-walls outside the side wall of the top and the bottom and formation substrate access port 135.When exhaust port more than 220
It is formed at all side-walls and when multiple exhaust ports 220 are formed at each side-walls, it is advantageous to can be by chamber 100
Accessory substance be quickly discharged to outside.
Now, the conduit (not shown) or flexible pipe (not shown) that accessory substance is discharged to the outside can be may be connected to exhaust end
Mouth 220, to cause accessory substance can be also discharged to the outside of chamber 100 by the conduit or flexible pipe.However, in the present invention
In, when multiple exhaust ports 220 should be set chamber 100 by satisfaction, the element for being connected to exhaust port 220 is unrestricted.
Syringe 240 is arranged on the top of exhaust port 220 and promoted for (downside in chamber 100) in a downward direction
Accessory substance.In more detail, multiple syringes 240 set the inside upper surface (inside upper surface of lid 130) to chamber 100.
Syringe 240 includes：Gas supply unit (not shown), the outside of chamber 100 is arranged on to supply gas；And injection nozzle
245, in from the gas injection that gas supply unit is supplied to the inside of chamber 100.Now, injection nozzle 245 is arranged on chamber
At the upside of the inside of room 100, and formed with multiple injection orifices 247, wherein by injection orifice 247 come injected gas.In more detail
For, multiple injection nozzles 245 are arranged in the inside upper surface of lid 130, and are connected in one way, so that cause can be from setting
Gas supply unit to the outside of chamber 100 supplies gas, to direct injection of the gas into the inside of chamber 100.
Meanwhile multiple injection nozzles 245 can be spaced apart from each other and parallel to side wall in each side wall of chamber 100
Installed on direction.Therefore, as shown in fig. 6, multiple injection nozzles 245 can be respectively on the direction of the side wall parallel to chamber 100
Set with predetermined number, and can be respectively installed to that there is directionality in the side wall of chamber.In more detail, injection nozzle 245
Comprising：Multiple first injection nozzles, are located in parallel to one another in one direction；And multiple second nozzles, described first
The outside of injection nozzle, which is on the other direction intersected with one direction, to be located in parallel to one another.Therefore, the first injection
Nozzle and second nozzle are set around transmission window.
In addition, the injection orifice 247 being formed in each of injection nozzle 245 is in the side wall towards chamber 100
The side of each is upwardly formed, to have directionality by the gas that injection orifice 247 is injected.That is, injection orifice 247
It is formed so that the gas injected from the injection orifice 247 of the side wall biasing towards chamber also moves in sidewall direction.Therefore, when
When directing injection of the gas into the top of substrate (that is, on being orthogonal to the direction on top of chamber 100), suppress accessory substance and drop
On the top of substrate, make it that the pollution to substrate can be suppressed.And because gas has the directionality towards exhaust port 220,
Accessory substance in chamber 100 can be quickly discharged to the outside of chamber 100 by exhaust port 220.In addition, injection orifice 247
Accessory substance can be pushed to the bottom of chamber 100, to cause biography that accessory substance will not be absorbed on the top for being arranged on substrate S
Defeated window 400.
The exhaust equipment 200 being configured as above can include inhalator 260, wherein, inhalator 260 can suck and remove presence
Accessory substance on the basal surface (that is, the upper surface of bottom piece 110) of the inside of chamber 100.
Fig. 8 a, Fig. 8 b, Fig. 8 c are the views for illustrating substrate support and syringe according to one exemplary embodiment.Fig. 8 a are
Illustrate the perspective view of the bottom piece equipped with substrate support and syringe.Fig. 8 b are Fig. 8 a plans, and Fig. 8 c are suctions
The perspective view of device.
Inhalator 260 is to set to the bottom of two side surfaces of substrate support 300 to be present in bottom piece 110 to suck
Upper surface on accessory substance device.Promote and be moved down into that is, inhalator 260 is aspirated through syringe 240
Accessory substance on the bottom of chamber 100 and the bottom being maintained in chamber 100.Therefore, inhalator 260, which is provided with to set, arrives chamber
The pressure adjustment unit (not shown) of 100 outside and the inlet nozzle 265 formed with inlet hole 267, wherein, accessory substance passes through
The suction of pressure adjustment unit is sucked by inlet hole 267.
Pressure adjustment unit is a kind of device, and it is connected to the inlet nozzle 265 being arranged in the inside of chamber 100 with tune
Seamless power, to cause accessory substance to pass through inlet hole 267 to be drawn into inlet nozzle 265.Pressure adjustment unit intake chamber 100
Interior gas, to cause accessory substance to be moved towards inlet hole 267.
Inlet nozzle 265 sets at least one of side surface to substrate support 300, can when substrate moves root
Moved according to the movement of substrate support 300, and therefore may be inhaled the accessory substance in the moving range of substrate support 300.
Now, inlet nozzle 265 can be as shown in Figure 8 c with shaft-like formation, and is fixed to two side surfaces of substrate support 300.
Now, the substrate support 300 in the present invention can be for the single support member in one substrate of chamber inner support,
And inlet hole is therefore provided with two side surface.Improved however, working as using multiple support members (for example, two support members)
Can be that each support member sets at least one inlet nozzle during the yield of substrate.
Meanwhile the substrate support 300 of support substrate can be the substrate that substrate S can be flatly transmitted in chamber 100
Transfer unit.Therefore, substrate sliding block 300 will be described with reference to the schema shown in figure 8a, Fig. 8 b, Fig. 8 c.
First, substrate S moves horizontally in the direction of the line perpendicular to laser beam 551 (direction of arrow), described to cause
Bombardment with laser beams is in the whole surface of substrate S.Transmit substrate S substrate transfer unit by linear motor (LM) guide member come
Configuration.That is, substrate transfer unit has the structure moved along guide rail linear.
As shown in Fig. 8 a, Fig. 8 b, Fig. 8 c, first axle sliding block 330 moves along LM guide rails 310, and serves as substrate support plate
The second axle sliding block 350 moved together with first axle sliding block 330.Therefore, during heating treatment, substrate passes through on the second direction of principal axis
Movement and horizontal revolving motion and movement on the first direction of principal axis and lay in position.Herein, first axle and
Second axle is any axle to form two dimensional surface, and can simply be expressed as X-axis and Y-axis.
Guide rail 310 is implemented in a pair of tracks, and the pair of track is in the upper surface of bottom piece (the bottom table of chamber 100
Face) on be spaced to turn up the soil in Y direction (the first direction of principal axis) and be located in parallel to one another.That is, guide rail 310 is arranged to
Intersect with the both ends of inlet nozzle 265, and setting of turning up the soil is spaced on the first direction of principal axis.
First axle sliding block 330 has the length on the second direction of principal axis for being connected between the pair of guide rail 310, and with suction
Enter nozzle 265 to slide after first direction of principal axis is gone forward together.Referring to Fig. 8 b, first axle sliding block 330 has formed with U-shaped line
The length of groove, and allow the inside of the main body of first axle sliding block 330 to have with linear manufactured hollow space.
Second axle sliding block 350 is arranged on the top of first axle sliding block 330, and along first axle sliding block 330 in the second axle
Slid back and forth on direction.Second axle sliding block 350 is mounted to the top of interior lowland covering first axle sliding block 330.Herein, because second
Axle sliding block 350 is mounted to interior lowland covering first axle sliding block 330, so the total height of substrate support 300 can be reduced.
And because rotary shaft guide member (not shown) is come with the shape being inserted into the central interior of the second axle sliding block 350
Installation, so this shape also contributes to reduce the total height of substrate support 300.The reason for selecting this class formation is compensation difference
When the second axle sliding block 350 is stacked on first axle sliding block 330 and rotary shaft guide member is stacked on the second axle sliding block 350 due to
The increase of the total height of substrate support and the problem of the excessive space taken, and also compensate for subtracting in terms of the stability of substrate transmission
The problem of small.
Because substrate support 300 has a structure as described above, first axle sliding block 330 is along parallel to each other
Two guide rails 310 of ground installation and slide, and the second axle sliding block 350 slides together with first axle sliding block 330.Rotary shaft guide member
(not shown) is inserted into the central interior of the second axle sliding block 350, and substrate support plate 355 is arranged on rotary shaft guide member.
The axle sliding block 350 of first axle sliding block 330 and second is moved by linear motor, and rotation process is assigned and served as a contrast by rotary shaft guide member
Bottom S.So, substrate S is transmitted by substrate support 300.
Meanwhile according to the substrate-treating apparatus 1000 of the one exemplary embodiment of modification can by using two transfer units come
Perform processing.Herein, after being completed by the processing of the substrate of a transfer unit transmission, next substrate can be immediately treated
Processing, and then improve the yield of substrate.
In the substrate-treating apparatus 1000 there is provided multiple transfer units, because inlet nozzle is formed at the multiple biography
One of two surfaces of unit place is passed, so the accessory substance of processing chamber housing can be carried out due to the movement of two transfer units.
Therefore set the element for the substrate-treating apparatus for arriving the one exemplary embodiment according to modification to have and arrive root with setting
According to the same or analogous function of the element of the substrate-treating apparatus of one exemplary embodiment, and at the substrate according to one exemplary embodiment
Reason equipment can be applied to the substrate-treating apparatus of the one exemplary embodiment according to modification.
As described above, exhaust equipment and can be easily by substrate S with the substrate-treating apparatus of exhaust equipment
Accessory substance is discharged to the outside of chamber.That is, the accessory substance does not float in the top of substrate-treating apparatus, and pass through
The syringe of upper surface in lid is set and is pushed to bottom.
Because setting the injection nozzle to syringe to be formed at a predetermined angle in two side directions, pass through note
Directionality and processing accessory substance can be had by penetrating the gas of nozzle injection.Therefore, accessory substance can pass through the side for the lid for being formed at chamber
Steam vent at surface is rapidly discharged.
In addition, suction is set because being transmitted in chamber at the bottom of two side surfaces of the sliding block of the transfer unit of substrate
Device, so accessory substance can be sucked from inlet nozzle and the accessory substance being present on the basal surface of chamber can be easily removed.Herein,
Because inlet nozzle can move according to the movement of transfer unit, the bottom of chamber can be removed according to the movement of transfer unit
Accessory substance in nearly all region on surface.
According to one exemplary embodiment, caused accessory substance in the execution of the processing under atmosphere of pressurizeing can be easily discharged.
For example, can easily discharge be formed at by the separation of the laser lift-off process of laser processing apparatus it is thin in wafer substrates
The accessory substance such as caused polymer during film.It is therefore possible to prevent byproduct residue is in processing equipment and contaminated equipment.
And because at least one exhaust port is formed at all side walls in addition to loading or unloading the side wall of substrate
In, so accessory substance can be improved to the velocity of discharge of the outside of chamber, and then improve treatment effeciency and productivity ratio.
In addition, can be by being quickly discharged to the outer of chamber from top injected gas by the accessory substance to float on substrate
Portion.Accordingly, it is possible to resolve the problem of being not easy to remove accessory substance according to the forming position of existing exhaust equipment.Therefore, complete
Into after processing, the quality of product can be improved.
In addition, because the vacuum of chamber is unnecessary, substrate-treating apparatus can be reduced due in vacuum state
The amount for the nitrogen for handling and consuming.
Although describing the present invention with reference to specific embodiment, the invention is not restricted to this.Therefore, the technology of art
Personnel should be readily appreciated that can be to it in the case where not departing from the spirit and scope of the present invention being defined by the appended claims
Carry out various modifications and changes.
Claims (11)
- A kind of 1. substrate-treating apparatus, it is characterised in that including：Chamber, form the inner space of processing substrate；Exhaust apparatus, by the processing procedure of the substrate caused accessory substance be discharged to the outside of the chamber,Wherein exhaust apparatus side wall includes exhaust port, the exhaust port be formed at except the chamber upper and lower part it Outer side-walls, and arrive the side wall with single or multiple settings；Substrate support, the substrate is supported in the inner space of the chamber；Laser generating unit, by bombardment with laser beams to being arranged on the substrate on the substrate support；Syringe, the syringe, which has, to be arranged at the upside of the exhaust port and is noted towards the sidewall direction of the chamber Emanate the injection nozzle of body；AndInhalator, the bottom of setting to the both sides of the substrate support are maintained at the pair of the bottom of the chamber for suction Product.
- 2. substrate-treating apparatus according to claim 1, wherein the exhaust port be formed at the chamber except institute State chamber the top and the bottom outside whole side-walls, or be formed at the chamber except the institute of the chamber State the whole side-walls outside the side wall of top and the bottom and formation inlet port.
- 3. substrate-treating apparatus according to claim 1, plurality of injection orifice is formed at the injection nozzle.
- 4. substrate-treating apparatus according to claim 3, wherein leading to from laser beam caused by the laser generating unit The transmission window crossed is formed on the upside of the chamber, and the injection nozzle is set around the transmission window.
- 5. substrate-treating apparatus according to claim 1, wherein the chamber includes：Bottom piece, the substrate support are disposed thereon in portion；AndLid, covers the top of the bottom piece to seal the bottom piece,Wherein load or unload the substrate access port that the substrate passes through be formed at it is upper except the lid in the side wall In at least one side wall outside portion's side wall.
- 6. substrate-treating apparatus according to claim 1,Wherein described inhalator includes：Pressure adjustment unit, adjust the pressure for sucking the accessory substance；AndInlet nozzle, there is the suction inlet hole that the accessory substance passed through.
- 7. substrate-treating apparatus according to claim 6, wherein the substrate support is can be passed in the chamber Pass the substrate transfer unit of the substrate.
- 8. substrate-treating apparatus according to claim 7, wherein the substrate transfer unit includes：A pair of guide rails, it is located in parallel to one another on the direction intersected at the both ends with the inlet nozzle, and in the first direction of principal axis On be spaced apart from each other；First axle sliding block, has the length of the second direction of principal axis connected between the guide rail, and along the guide rail with it is described Inlet nozzle slides after first direction of principal axis is gone forward together；Second axle sliding block, it is arranged on the top of the first axle sliding block, and along the first axle sliding block in second axle Slid back and forth on direction；Rotary shaft guide member, it is inserted into the central interior of the second axle sliding block；AndSubstrate support plate, the top to the rotary shaft guide member is set.
- 9. a kind of exhaust equipment being used in substrate-treating apparatus, it is characterised in that the exhaust equipment includes：Exhaust port, the side surface to substrate is set；At least one injection nozzle, be spaced over the substrate turn up the soil set and towards the substrate outside direction inject Gas；Feeding unit, supply gas to the injection nozzle；AndInhalator, it is positioned apart from the bottom of the substrate, to suck the by-product being present on the bottom of the substrate Thing.
- 10. exhaust equipment according to claim 9, wherein the exhaust port be formed at except the substrate top and At whole surface outside bottom, or be formed at the substrate except the top of the substrate and the bottom and institute State at the whole surface outside the approach axis of substrate.
- 11. exhaust equipment according to claim 9, wherein the injection nozzle includes：Multiple first injection nozzles, are located in parallel to one another in one direction；AndMultiple second injection nozzles, the other direction intersected with one direction is in the outside of first injection nozzle On be located in parallel to one another.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0102481 | 2013-08-28 | ||
| KR1020130102481A KR101796627B1 (en) | 2013-08-28 | 2013-08-28 | Exhaust system and substrate processing apparatus having the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104425317A CN104425317A (en) | 2015-03-18 |
| CN104425317B true CN104425317B (en) | 2017-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410427830.2A Active CN104425317B (en) | 2013-08-28 | 2014-08-27 | Exhaust equipment and the substrate-treating apparatus with exhaust equipment |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101796627B1 (en) |
| CN (1) | CN104425317B (en) |
| TW (1) | TWI545617B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102007907B1 (en) * | 2016-07-26 | 2019-08-06 | 에이피시스템 주식회사 | Stage unit and substrate treatment apparatus including the same and processing method using the same |
| KR101983327B1 (en) | 2016-07-26 | 2019-05-29 | 에이피시스템 주식회사 | Laser processing apparatus |
| NL2020850A (en) * | 2017-05-29 | 2018-12-04 | Asml Netherlands Bv | Lithographic apparatus |
| KR102037918B1 (en) * | 2017-11-28 | 2019-10-29 | 세메스 주식회사 | substrate processing method and substrate processing apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101840848A (en) * | 2009-03-19 | 2010-09-22 | 芝浦机械电子株式会社 | Substrate board treatment |
| CN102446791A (en) * | 2010-10-01 | 2012-05-09 | 圆益Ips股份有限公司 | Cleaning method for substrate processing apparatus |
| CN102683248A (en) * | 2011-03-14 | 2012-09-19 | 优志旺电机株式会社 | Laser lift-off device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011133724A (en) * | 2009-12-25 | 2011-07-07 | Nikon Corp | Fluid hydrostatic bearing, moving object device, exposure apparatus, method for manufacturing device, and cleaning device |
-
2013
- 2013-08-28 KR KR1020130102481A patent/KR101796627B1/en active IP Right Grant
-
2014
- 2014-08-27 CN CN201410427830.2A patent/CN104425317B/en active Active
- 2014-08-28 TW TW103129624A patent/TWI545617B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101840848A (en) * | 2009-03-19 | 2010-09-22 | 芝浦机械电子株式会社 | Substrate board treatment |
| CN102446791A (en) * | 2010-10-01 | 2012-05-09 | 圆益Ips股份有限公司 | Cleaning method for substrate processing apparatus |
| CN102683248A (en) * | 2011-03-14 | 2012-09-19 | 优志旺电机株式会社 | Laser lift-off device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150025173A (en) | 2015-03-10 |
| CN104425317A (en) | 2015-03-18 |
| TW201508813A (en) | 2015-03-01 |
| KR101796627B1 (en) | 2017-11-10 |
| TWI545617B (en) | 2016-08-11 |
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