TWI545307B - 半導體溫度感測器 - Google Patents

半導體溫度感測器 Download PDF

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Publication number
TWI545307B
TWI545307B TW101103817A TW101103817A TWI545307B TW I545307 B TWI545307 B TW I545307B TW 101103817 A TW101103817 A TW 101103817A TW 101103817 A TW101103817 A TW 101103817A TW I545307 B TWI545307 B TW I545307B
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TW
Taiwan
Prior art keywords
temperature
oscillator
output
measurement
counter
Prior art date
Application number
TW101103817A
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English (en)
Chinese (zh)
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TW201237378A (en
Inventor
奧拉 布魯瑟
史丹艾瑞克 韋伯格
珮 卡斯登 史蔻蘭
維納 路吉
Original Assignee
北歐半導體公司
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Publication date
Application filed by 北歐半導體公司 filed Critical 北歐半導體公司
Publication of TW201237378A publication Critical patent/TW201237378A/zh
Application granted granted Critical
Publication of TWI545307B publication Critical patent/TWI545307B/zh

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Classifications

    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/32—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using change of resonant frequency of a crystal

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
TW101103817A 2011-02-07 2012-02-06 半導體溫度感測器 TWI545307B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1102070.8A GB201102070D0 (en) 2011-02-07 2011-02-07 Semiconductor temperature sensors

Publications (2)

Publication Number Publication Date
TW201237378A TW201237378A (en) 2012-09-16
TWI545307B true TWI545307B (zh) 2016-08-11

Family

ID=43836309

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101103817A TWI545307B (zh) 2011-02-07 2012-02-06 半導體溫度感測器

Country Status (10)

Country Link
US (1) US8967856B2 (e)
EP (1) EP2673608A1 (e)
JP (1) JP5952836B2 (e)
KR (1) KR20140056155A (e)
CN (1) CN103384816B (e)
BR (1) BR112013020017A2 (e)
GB (2) GB201102070D0 (e)
SG (1) SG192103A1 (e)
TW (1) TWI545307B (e)
WO (1) WO2012107749A1 (e)

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CN104596662B (zh) * 2014-12-08 2017-06-13 深圳市芯海科技有限公司 优化线性度的片上数字温度传感器
CN104568208B (zh) * 2015-01-13 2017-11-10 合肥工业大学 一种集成于射频识别标签的温度传感器
US9720033B2 (en) * 2015-09-29 2017-08-01 Apple Inc. On-chip parameter measurement
CN105784134A (zh) * 2016-03-24 2016-07-20 苏州路之遥科技股份有限公司 一种无线测温器的通信方法
JP6678094B2 (ja) * 2016-12-05 2020-04-08 ルネサスエレクトロニクス株式会社 温度計測回路、方法、及びマイクロコンピュータユニット
KR102786194B1 (ko) 2017-02-28 2025-03-26 삼성전자주식회사 온도 센서 및 온도 센싱 방법
CN107830940A (zh) * 2017-10-13 2018-03-23 京东方科技集团股份有限公司 一种温度传感器、阵列基板、显示装置
CN108132106A (zh) * 2018-01-22 2018-06-08 江苏星宇芯联电子科技有限公司 一种cmos温度传感器及其传感方法
GB201810547D0 (en) * 2018-06-27 2018-08-15 Nordic Semiconductor Asa OFDM channel estimation
CN114430803A (zh) * 2019-07-29 2022-05-03 普罗泰克斯公司 用于集成电路的管芯上热感测网络
US11609128B2 (en) * 2019-12-10 2023-03-21 Wiliot, LTD. Single layer LC oscillator
US11258447B2 (en) 2020-02-20 2022-02-22 Apple Inc. Integration of analog circuits inside digital blocks
CN112268634A (zh) * 2020-10-22 2021-01-26 北京小米移动软件有限公司 温度监控的方法、装置及存储介质
CN112729590A (zh) * 2020-12-25 2021-04-30 中国科学院微电子研究所 温度传感器的读出装置、温度读出方法和电子设备
WO2022209436A1 (ja) 2021-03-31 2022-10-06 古野電気株式会社 電子回路デバイス、電子回路デバイスの温度測定方法
KR102569399B1 (ko) * 2021-04-09 2023-08-24 광운대학교 산학협력단 시간 기반 온 칩 디지털 온도 센서를 이용한 칩의 온도를 감지하는 방법

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Also Published As

Publication number Publication date
US20140294042A1 (en) 2014-10-02
JP5952836B2 (ja) 2016-07-13
TW201237378A (en) 2012-09-16
CN103384816B (zh) 2015-09-16
GB201102070D0 (en) 2011-03-23
GB2484858B (en) 2013-03-13
GB201202040D0 (en) 2012-03-21
JP2014510268A (ja) 2014-04-24
CN103384816A (zh) 2013-11-06
GB2484858A (en) 2012-04-25
WO2012107749A1 (en) 2012-08-16
US8967856B2 (en) 2015-03-03
SG192103A1 (en) 2013-08-30
EP2673608A1 (en) 2013-12-18
BR112013020017A2 (pt) 2017-06-06
KR20140056155A (ko) 2014-05-09

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