TWI544572B - Display device - Google Patents

Description

Display device

The present invention relates to a display device and a method of fabricating the same.

Various devices having different configurations or principles are attached to the display device. One of them is a display device using an organic electroluminescent element for a light source of a pixel.

The display device includes a support substrate and a plurality of organic electroluminescence elements provided on the support substrate. A partition wall that partitions the pixel region is provided on the support substrate, and the plurality of organic electroluminescent elements are arranged in a line that is partitioned by the partition walls.

Each of the organic electroluminescence elements is formed by laminating the first electrode, the organic layer, and the second electrode from the support substrate side in the above-described order.

The above organic layer can be formed by, for example, a coating method. A method of forming the organic layer 18 will be described with reference to FIGS. 16A, 16B, 16C, and 16D. 16A, 16B, 16C, and 16D are diagrams for explaining the manufacturing steps of the display device.

As shown in FIG. 16A, first, the first electrode 16 and the partition wall 13 are formed on the support substrate 12. Then, the ink 17 containing the material of the organic layer 18 is supplied from the nozzle located above in the region (concave portion) 15 surrounded by the partition wall 13.

As shown in Fig. 16B, the supplied ink 17 is housed in the region 15 surrounded by the partition wall 13.

As shown in Fig. 16C, the organic layer 18 is formed by vaporizing the solvent component of the ink 17 thereafter.

As shown in Fig. 16D, the second electrode 19 is formed next. The second electrode 19 is integrally extended, for example, over a plurality of organic electroluminescent elements, and is provided as an electrode common to a plurality of organic electroluminescent elements. For example, an extended conductive film is formed integrally on the partition 13 interposed between adjacent organic electroluminescent elements, and a plurality of organic electroluminescent elements are formed to form a connected second electrode. 19. The conductive film of the second electrode 19 is formed by, for example, a vacuum deposition method.

Further, in the aspect shown in Fig. 16B, when the liquid repellency is displayed on the ink 17 in the partition wall 13, the ink 17 supplied to the specific concave portion 15 passes over the partition wall 13 and flows out to the adjacent side along the surface thereof. The case of the recess 15. In order to prevent such an ink from flowing out, a partition wall 13 which exhibits a certain degree of liquid repellency is generally provided on the support substrate 12.

However, when the liquid repellency is displayed on the partition wall 13, the ink 17 supplied to the concave portion 15 is discharged by the partition wall 13 and vaporized to form a film (organic layer 18). Therefore, there is a case where the organic layer 18 having a non-uniform thickness is formed. For example, the thickness of the concave portion 15 may be such that the organic layer 18 is in contact with a predetermined portion of the partition wall 13 (that is, the peripheral portion of the organic layer 18), and the organic layer is located in the vicinity of the central portion of the concave portion 15. The thickness of the central portion of the 18 is formed to be thin. As a result, the electric resistance of the peripheral portion of the organic layer 18 is lower than that of the central portion, and when the organic electroluminescent device is driven, current concentrates and flows at the peripheral portion of the organic layer 18, and the central portion of the organic layer 18 becomes darker than the peripheral portion. The situation. Further, on the contrary, the peripheral portion of the organic layer 18 is not formed to have a desired thickness. Since the layer is formed, the peripheral portion of the organic layer 18 may also have a light that is not as good as the destination.

In order to solve such a problem, there is a display device having a partition wall of a so-called inverted tapered shape. The schematic diagrams are shown in Fig. 17A, Fig. 17B, and Fig. 17C. 17A, 17B, and 17C are diagrams for explaining the manufacturing steps of the display device.

As shown in FIGS. 17A, 17B, and 17C, the partition wall 13 of the inverted tapered shape is cut away from the support substrate 12 (first electrode 16) when cut in a direction orthogonal to the extending direction. The broadening is formed. Therefore, in the vicinity of the portion where the side surface of the partition wall 13 is in contact with the first electrode 16, a region having a tapered tip end is formed. When the ink is supplied to the region 15 surrounded by the partition wall 13 having the inverted tapered shape, the ink that is in contact with the side surface of the partition wall 13 is filled into a region where the tip end is tapered due to capillary action. When the solvent component of the ink is vaporized while maintaining this state, the organic layer 18 is also formed in the vicinity of the portion where the first electrode 16 and the partition wall 13 are in contact with each other.

As shown in FIG. 17B, by providing the partition wall 13 having a reverse tapered shape, even if the partition 13 for displaying liquid repellency is provided, the thickness of the peripheral portion of the organic layer 18 can be prevented from being thinned (for example, refer to the patent document) 1).

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2007-227289

Provided with inverted cones as shown in Figures 17A, 17B and 17C When the second electrode 19 shared by a plurality of organic electroluminescent elements is integrally formed by a vacuum vapor deposition method on a substrate of the partition wall 13 having a shape of the shape, as shown in FIG. 17C When the thickness of the second electrode 19 is thin, the second electrode 19 may be cut at the end of the partition wall. As a result, when the display device is driven, there is a case where an organic electroluminescence element that does not emit light can be formed as expected.

Accordingly, an object of the present invention is to provide a display device in which a plurality of organic electroluminescent elements can form a connected second electrode in a display device having a partition wall having an inverted tapered shape.

The present invention provides the following [1] to [5].

[1] A display device comprising: a support substrate; a plurality of organic electroluminescence elements provided on the support substrate; and each of the organic electroluminescence elements surrounding the support substrate when viewed from one of thickness directions a partition wall provided in a peripheral manner; the partition wall includes: a first partition wall provided to a part of the outer circumference; and a second partition wall provided to face a remaining portion of the outer circumference of the outer circumference; the first partition wall A partition wall having a tapered shape in which an angle formed by a side surface and a bottom surface of the outer circumference is an acute angle, and the second partition wall surrounds a partition wall of an inverted cone shape in which an angle formed by a side surface and a bottom surface of the outer circumference is an obtuse angle.

[2] The display device according to [1], wherein the first partition walls extend in a first direction orthogonal to a thickness direction of the support substrate, and a plurality of partition members that are disposed at a predetermined interval in a direction orthogonal to the thickness direction and the second direction of the first direction, and the second partition wall is a portion where the first partition wall and the second partition wall overlap each other The system is disposed between the support substrate and the first partition wall.

[3] The display device according to [1], wherein the organic electroluminescent device has a shape extending in a predetermined direction orthogonal to a thickness direction of the support substrate, and the first partition wall system The second partition wall is disposed to surround one of the short side directions of the organic electroluminescence element and the outer circumference of the other, and the second partition wall is disposed to surround one of the longitudinal direction of the organic electroluminescence element and the other outer circumference.

[4] The display device according to any one of [1] to [3] wherein the first partition wall and the second partition wall are each formed by patterning a layer of the photosensitive resin composition.

[5] A display device according to any one of [1] to [4] comprising: a step of forming a partition wall on a support substrate; and forming a plurality of on the support substrate In the step of forming the partition wall, the layer of the photosensitive resin composition is patterned by photolithography to form the first partition wall and the second partition wall.

According to the present invention, a partition wall having an inverted tapered shape can be realized A display device includes a display device having a second electrode connected to a plurality of organic electroluminescent elements.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Moreover, the drawings are merely illustrative of the shape, size, and arrangement of the constituent elements, to the extent that the invention can be understood. The present invention is not limited to the following description, and each constituent element can be appropriately changed without departing from the scope of the invention. In the drawings used in the following description, the same components are denoted by the same reference numerals, and the description of the repetition is omitted. Further, the configuration of the configuration diagram example of the embodiment of the present invention is not necessarily manufactured or used.

The display device of the present invention includes: a support substrate, a plurality of organic electroluminescence elements provided on the support substrate, and one of the thickness directions Z of the support substrate surrounding the organic electroluminescence element, respectively. a partition wall provided in a manner of "outside the plan"; the partition wall has a first partition wall provided to face a part of the outer circumference, and a second partition wall provided to face the remaining portion of the outer peripheral portion; A partition wall surrounds a partition wall of a tapered shape in which an angle formed by a side surface and an outer surface of the outer circumference is an acute angle, and the second partition wall surrounds a partition wall of an inverted cone shape in which an angle formed by a side surface of the outer circumference and the bottom surface is an obtuse angle.

The present invention is applied to a display device in which respective second electrodes of a plurality of organic electroluminescent devices are connected. In such a display device as described above, an active matrix drive type display device will be described as an example.

<Composition of display device>

First, the configuration of the display device will be described with reference to Figs. 1 to 6 . Fig. 1 is a cross-sectional view schematically showing a part of the display device 1 of the present embodiment. Fig. 2 is a cross-sectional view schematically showing a display device in which the position of the cut surface line A-A shown in Fig. 1 is enlarged. Fig. 3 is a cross-sectional view schematically showing a display device in which the position of the cut surface line B-B shown in Fig. 1 is cut. Fig. 4 is a cross-sectional view schematically showing a display device in which the position of the cut surface line C-C shown in Fig. 1 is cut. Fig. 5 is a cross-sectional view schematically showing a display device in which the position of the cut surface line D-D shown in Fig. 1 is cut. Fig. 6 is a cross-sectional view schematically showing a display device in which the position of the cut surface line E-E shown in Fig. 1 is cut.

As shown in FIG. 1 , the display device 1 mainly includes a support substrate 2 , a partition wall 3 on which the predetermined block is drawn on the support substrate 2 , and a plurality of blocks provided on the partition wall 3 . Electromechanical excitation of the optical element 4.

The partition 3 is provided so as to surround each of the outer circumferences of the plurality of organic electroluminescent elements 4 in plan view. The partition 3 may be provided so as to surround the outer periphery of the organic electroluminescent element 4 in plan view, for example, in a region in which the region in which each of the organic electroluminescent elements 4 are provided is removed in a plan view.

In the present embodiment, the plurality of organic electroluminescent elements 4 are arranged in a matrix (details will be described later). The partition 3 is provided in a region where the organic electroluminescent elements 4 arranged in a matrix are removed. Therefore, the partition 3 is formed in a lattice shape on the support substrate 2.

A plurality of recesses 5 defined by the partition wall 3 and the support substrate 2 are provided on the support substrate 2. This recess 5 corresponds to a block drawn by the partition wall 3.

Since the lattice-shaped partition walls 3 are provided on the support substrate 2, in the present embodiment, the plurality of recessed portions 5 are arranged in a matrix shape in plan view. That is, the plurality of concave portions 5 are arranged at a predetermined interval in the column direction X, and are arranged in the row direction Y at a predetermined interval. The shape in the plan view of each concave portion 5 is not particularly limited. For example, the recessed portion 5 may be formed in a substantially rectangular shape, a substantially elliptical shape or the like in plan view. In the present embodiment, the long axis extending in the longitudinal direction and the short axis extending in the direction orthogonal to the major axis, that is, the substantially elliptical concave portion 5 is provided in plan view. Further, in the present specification, the above-described column direction X and the row direction Y are orthogonal to the thickness direction Z of the support substrate 2, and are orthogonal to each other. Here, the "substantially elliptical shape" is not only elliptical, but also includes a shape in which a curve is combined between one end and the other end of two line segments arranged in parallel with each other.

The partition 3 includes a first partition 3a and a second partition 3b. The first partition wall 3a is provided so as to face a part of the outer circumference of the organic electroluminescence element 4 in a plan view, that is, to face the outer circumference of the organic electroluminescence element 4 in the short side direction. The second partition 3b faces the outer periphery of the outer periphery of the organic electroluminescent device 4, that is, the remaining portion of the outer periphery of the organic electroluminescent device 4.

In particular, as shown in FIG. 1, FIG. 2, FIG. 3, and FIG. 5, a part of the outer periphery of the organic electroluminescence element 4 is in contact with the first partition 3a, and the remaining part of the part is removed from the second partition. 3b. In this way, the outer periphery of the organic electroluminescence element 4 is surrounded by the first partition 3a and the second partition 3b.

In the present embodiment, the partition wall 3 is formed in a lattice shape. Therefore, the partition wall 3 includes a plurality of partition wall members extending linearly in the column direction X and a plurality of partition wall members extending linearly in the row direction Y. The partition wall 3 in the present embodiment is composed of a plurality of first partition wall members 3a extending in the row direction Y and a plurality of second partition walls 3b extending in the row direction X. The plurality of first partition walls 3a are provided between the organic electroluminescent elements 4 adjacent in the column direction X.

Further, as shown in Fig. 2, a plurality of second partition walls 3b are provided between the organic electroluminescent elements 4 adjacent to each other in the row direction Y. In this manner, by arranging the partition walls 3, the first partition walls 3a are provided in contact with one of the end faces X of the organic electroluminescence element 4 and the other end faces. The first partition wall 3a is a partition wall having a tapered shape in which the side surface of the outer surface of the organic electroluminescence element 4 and the bottom surface θ1 is an acute angle.

As shown in Figure 3. The second partition wall 3b is provided in contact with one of the other end faces of the organic electroluminescence element 4 in the row direction Y. The second partition wall 3b is a partition wall having a reverse tapered shape in which the side surface surrounding the outer surface of the organic electroluminescence element 4 and the bottom surface θ2 are obtuse angles.

Further, the bottom surface of the first partition wall 3a means the plane closest to the support substrate 2 among the outer peripheral surfaces of the first partition walls 3a. Further, the side surface of the first partition wall 3a means a surface on which the plane (upper surface) and the bottom surface of the outer peripheral surface of the first partition wall 3a farthest from the support substrate 2 are removed, that is, the position is surrounded by the organic electroluminescence light in a plan view. The outer circumference (contour) of the element 4. Then, the angle θ1 formed by the side surface of the first partition 3a and the bottom surface of the first partition 3a means that the first plane is cut in a direction orthogonal to the direction in which the first partition 3a extends (in the embodiment, the direction Y). The angle of the section when the partition 3a is used.

The bottom surface of the second partition wall 3b means the plane closest to the support substrate 2 among the outer peripheral surfaces of the second partition walls 3b. Further, the side surface of the second partition wall 3b means the surface of the outer peripheral surface of the second partition wall 3b which is farthest from the support substrate 2 (upper surface) and the bottom surface, that is, the position is surrounded by the organic electroluminescence light in a plan view. The outer circumference (contour) of the element 4. Then, the angle θ2 formed by the side surface of the second partition wall 3b and the bottom surface of the first partition wall 3a means that the first partition wall is cut in a plane orthogonal to the direction in which the first partition wall 3a extends (in the series direction X in the present embodiment). The angle of the section at 3b.

In the present embodiment, the plurality of first partition walls 3a extending in the row direction Y and the plurality of second partition walls 3b extending in the row direction X are superposed in plan view. One of the first partition wall 3a and the second partition wall 3b may be disposed close to the support substrate 2 at a portion where the first partition 3a and the second partition 3b overlap each other. In the portion where the first partition 3a and the second partition 3b overlap, the second partition 3b is preferably disposed closer to the support substrate 2 than the first partition 3a. In other words, in the portion where the first partition 3a and the second partition 3b overlap, the second partition 3b is preferably provided between the support substrate 2 and the first partition. When the first partition wall 3a and the second partition wall 3b are disposed as described above, since the conductive film 10a is provided on the first partition wall 3a, the conductive film 10a which is not formed is cut off on the partition wall 3 as will be described later. The second electrode 10 of the organic electroluminescence element 4 adjacent to the extending direction of the first partition 3a (in the direction Y of the present embodiment) is surely connected via the conductive thin film 10a on the first partition 3a. .

The angle of the angle θ1 is generally 10° to 85°, preferably 30° to 60°. Further, the angle of θ2 is generally from 95 to 170, preferably from 110 to 135.

The organic electroluminescence element 4 is provided in a block (that is, the recess 5) that is partitioned by the partition walls 3. When the lattice-shaped partition walls 3 are provided in the present embodiment, a plurality of organic electroluminescent elements 4 are provided in each of the concave portions 5. In other words, the plurality of organic electroluminescent elements 4 are arranged in a matrix in the same manner as the concave portion 5. The plurality of organic electroluminescent elements 4 are arranged on the support substrate 2 at predetermined intervals in the column direction X, and are arranged in the row direction Y at predetermined intervals.

In the present embodiment, three types of organic electroluminescent elements 4 are provided. That is, (1) a red light-emitting organic electroluminescence element 4R that emits red light, (2) a green light-emitting organic electroluminescence element 4G that emits green light, and (3) a blue light-emitting organic electroluminescence light that emits blue light Element 4B. As shown in Fig. 1, the three types of organic electroluminescent devices 4 (4R, 4G, and 4B) are arranged in the order of the following (I), (II), and (III) in the row direction Y. Come to form.

(I) A plurality of red light-emitting organic electroluminescent elements 4R are arranged in a row at predetermined intervals in the column direction X.

(II) A plurality of green light-emitting organic electroluminescent elements 4G are arranged in a row at predetermined intervals in the column direction X.

(III) A plurality of blue light-emitting organic electroluminescent elements 4B are arranged in a row at predetermined intervals in the column direction X.

Further, in another embodiment, in addition to the above-described three kinds of organic electroluminescence devices, for example, an organic electroluminescence device that emits white light may be further provided. Further, a monochrome display device can be realized by providing only one type of organic electroluminescence element.

The organic electroluminescence element 4 is configured by laminating the first electrode 6, the organic layer, and the second electrode 10 in this order from the support substrate side. The organic electroluminescent device 4 has at least one light-emitting layer for the organic layer. Further, the organic electroluminescent device 4 is further provided with a layer different from the light-emitting layer in addition to the one-layer light-emitting layer. For example, a hole injection layer, a hole transport layer, an electron blocking layer, an electron transport layer, an electron injection layer, and the like are provided between the first electrode 6 and the second electrode 10. Further, two or more light-emitting layers may be provided between the first electrode 6 and the second electrode 10. Further, an inorganic layer or a mixed layer containing an organic substance and an inorganic substance may be further provided between the first electrode 6 and the second electrode 10.

The organic electroluminescence element 4 includes a first electrode 6 and a second electrode 10 as a counter electrode composed of an anode and a cathode. One of the first electrode 6 and the second electrode 10 is an anode, and the other electrode is a cathode.

In the present embodiment, an organic electroluminescence device 4 is described as an example in which the first electrode 6 exhibiting an anode function and the first organic layer 7 functioning as a hole injection layer function as a function of the light-emitting layer. The organic layer 9 and the second electrode 10 functioning as a cathode are laminated on the support substrate in this order.

In the present embodiment, three types of organic electroluminescent elements 4 are provided. The three organic electroluminescent devices 4 are different in the configuration of the second organic layer (in the present embodiment, the light-emitting layer). The red light-emitting organic electroluminescence element 4R includes a red light-emitting layer 9R that emits red light, the green light-emitting organic light-emitting element 4G includes a green light-emitting layer 9G that emits green light, and the blue light-emitting organic light-emitting element 4B is provided with an emission. Blue light blue light emitting layer 9B.

In the present embodiment, the first electrode 6 is provided in each of the organic electroluminescent devices 4. That is, the same number of the first electrodes 6 as the organic electroluminescence element 4 are provided on the support substrate 2. The first electrode 6 is provided in accordance with the arrangement of the organic electroluminescence element 4, and is arranged in a matrix like the organic electroluminescence element 4. Further, as shown in FIG. 2, FIG. 3, and FIG. 5, the partition wall 3 of the present embodiment is formed in a lattice shape in a region other than the first electrode 6, and covers a peripheral portion of a portion of the first electrode 6. .

The first organic layer 7 that functions as a hole injection layer is provided on the first electrode 6 of the recess 5, respectively. The first organic layer 7 is provided in accordance with each type of the organic electroluminescent device 4 as needed, and the material or thickness thereof is different. Further, from the viewpoint of the simplicity of the step of forming the first organic layer 7, it is preferable to form all of the first organic layers 7 with the same phase material and the same thickness.

The second organic layer 9 that functions as a light-emitting layer is provided on the first organic layer 7 in the concave portion 5. As described above, the light-emitting layer is provided in accordance with the type of the organic electroluminescence element 4. Therefore, the red light-emitting layer 9R is provided in the concave portion 5 where the red light-emitting organic electroluminescent light element 4R is to be disposed, and the green light-emitting layer 9G is disposed in the concave portion 5 where the green light-emitting organic electroluminescent light element 4G is to be disposed, and the blue light-emitting layer 9B is It is provided in the recessed part 5 in which the blue light-emitting organic electroluminescent element 4B is to be provided.

In the present embodiment, the conductive film 10a is formed over the display region where a plurality of organic electroluminescent devices 4 are to be provided. In other words, the conductive film 10a is formed not only on the second organic layer 9, but also on the partition walls 3. Among the conductive thin films 10a, the second organic layer 9 is referred to as the second electrode 10 in the present specification.

Further, the second electrode 10 may be cut at the end of the second partition wall 3b having a reverse tapered shape. As shown in FIG. 3 and FIG. 5, for example, a state in which the second electrode 10 at the end of the second partition wall 3b in which the organic electroluminescent device 4 and the second partition 3b are in contact with each other is cut is shown. Further, as shown in FIGS. 2 and 5, the second electrode 10 is not cut at the end portion of the first partition wall 3a having a tapered shape. The conductive film 10a formed on the first partition 3a in this manner is connected to the second electrode 10 of the organic electroluminescent device 4 to be integrated. Therefore, the second electrodes 10 of the organic electroluminescence element 4 adjacent to each other in the column direction X are integrally connected via the conductive film 10a on the first partition 3a. Further, in the present embodiment, the first partition wall 3a is formed to extend in the row direction Y, so that the second electrode 10 of the organic electroluminescence element 4 adjacent to the row direction Y passes through the conductive film on the first partition 3a. 10a is connected to form one. Thereby, the second electrode 10 in which all of the organic electroluminescence elements are formed via the conductive thin film 10a on the first partition 3a is connected. Therefore, the second electrode 10 functions as an electrode common to all of the organic electroluminescent elements 4.

In the above embodiment, the partition wall 3 is provided by covering the peripheral edge portion of the first electrode 6 and connected to the support substrate 2. In another embodiment, an insulating film may be further provided between the partition 3 and the support substrate 2. The insulating film is formed in a lattice shape in the same manner as the partition 3, and is formed by covering the peripheral edge portion of the first electrode 6. Such an insulating film is preferably formed by a material which exhibits lyophilicity more than the partition walls 3.

Hereinafter, a method of manufacturing the display device will be described with reference to FIGS. 7A to 15C. Further, Fig. A is a plan view schematically showing an organic electroluminescence element in the middle of enlargement, and Fig. B is a cross section of an organic electroluminescence element which is formed in the middle of the cutting plane line AA of Fig. 1 Fig. C is a cross-sectional view showing an organic electroluminescence element in the middle of the cutting line line DD at the position shown in Fig. 1. Further, in the drawings A to C of the respective drawings, the scales of the corresponding members do not necessarily correspond to each other.

(Steps to prepare the support substrate)

As shown in FIGS. 7A, 7B, and 7C, in this step, the support substrate 2 on which the first electrode 6 is formed is prepared. Moreover, in this step, the step of supporting the substrate 2 can be prepared by obtaining the support substrate 2 on which the first electrode 6 is formed from the market. Moreover, this step may also include the step of forming the first electrode 6 on the support substrate 2.

When the display device is an active matrix type, a substrate on which a circuit for individually driving a plurality of organic electroluminescent elements is formed in advance can be used as the support substrate 2. For example, a substrate on which a TFT (Thin Film Transistor), a capacitor, or the like is formed in advance can be used as the support substrate.

First, a plurality of first electrodes 6 are formed in a matrix on the prepared support substrate 2. The first electrode 6 is formed, for example, on a surface of the support substrate 2 to form a conductive film by a step of forming a mask pattern by photolithography and a mask pattern formed by using the mask pattern as a mask. The patterning step pattern is formed in a matrix shape. For example, a mask having an opening formed at a predetermined portion may be disposed on the support substrate 2, and a conductive material may be selectively deposited on a predetermined portion of the support substrate 2 by masking, and the first electrode 6 may be patterned. The material of the first electrode 6 will be described later.

(Steps of forming the next wall)

In this step, the partition wall 3 is formed. In the present embodiment, for example, (1) the layer of the photosensitive resin composition is patterned by photolithography, and the second partition wall 3b having a reverse tapered shape and the first partition wall having a tapered shape are formed. 3a. Specifically, for example, the first partition 3a and the second partition 3b can be formed by patterning a layer of the photosensitive resin composition, and (2) the layer pattern of the photosensitive resin composition can be formed by photolithography. First, the second partition wall 3b having a reverse tapered shape is formed, and then the photosensitive resin composition is left over the second partition wall 3b formed in the inverted tapered shape as a partition wall, and the dry etching method is used. The inverted tapered shape is processed into a tapered shape to form a second partition wall 3b having a reverse tapered shape and a first partition wall 3a having a tapered shape.

As shown in Figs. 8A, 8B, and 8C, in the present embodiment, the second partition 3b is first formed. When the second partition 3b is formed by photolithography, the photosensitive resin composition is first applied onto the support substrate 2. The coating method of the photosensitive resin composition is, for example, a spin coating method or a slit coating method.

After the photosensitive resin composition is applied to the support substrate 2, a prebaking step is generally performed. The prebaking step is performed, for example, by heating the support substrate at a temperature of 80 ° C to 110 ° C for 60 seconds to 180 seconds. The solvent component in the photosensitive resin composition is removed by the prebaking step to form the second partition wall forming film 8b.

Then, a mask 21b of a predetermined pattern that is shielded from light is placed above the support substrate 2 on which the second barrier rib formation film 8b is formed, and the exposure step of exposing the second barrier rib formation film 8b to the mask 21b is performed. The photosensitive resin which the second partition forming film 8b can contain may be a positive photosensitive resin and a negative photosensitive resin. However, in this step, any of the resins may be used.

When a positive photosensitive resin is used as the photosensitive resin which can be contained in the second partition forming film 8b, the second partition forming film 8b is formed so as to mainly correspond to the portion other than the portion where the second partition 3b is formed. Irradiation light L. In addition, when the photosensitive resin of the negative type is used as the photosensitive resin, the light L is irradiated to the portion where the second partition 3b is formed in the second partition wall forming film 8b.

In the present step, a case where a photosensitive resin which is a negative type is used as the photosensitive resin which can be contained in the film for forming the second partition wall 8b will be described.

The photomask 21b is disposed above the support substrate 2, and the light L is irradiated through the photomask 21b. In the second partition wall forming film 8b, the light L is irradiated to the portion where the second partition wall 3b is to be formed. In the eighth and eighth aspects, the light L that is irradiated onto the second partition wall forming film 8b is schematically indicated by a blank arrow.

As shown in Fig. 9, the development step is followed. Thereby, the second partition 3b is formed in a pattern. After the development step, a post-baking step is performed. In the post-baking step, for example, the substrate is heated at a temperature of 200 ° C to 230 ° C for 15 minutes to 60 minutes to cure the second partition wall forming film 8 b to form the second partition 3b. By performing the post-baking step in this manner, the second partition wall 3b can be prevented from being etched in the developing step in forming the first partition 3a to be described later.

In the present embodiment, the second partition wall 3b of a so-called inverted tapered shape is formed. The angle θ 2 formed by the side surface of the second partition 3b and the bottom surface of the second partition 3b can be adjusted to an arbitrary angle by appropriately adjusting the elements described later.

As shown in Fig. 10, in the present embodiment, the first partition wall 3a is formed. When the first partition walls 3a are formed by photolithography, the photosensitive resin composition is first applied onto the support substrate 2. The coating method of the photosensitive resin composition is, for example, a spin coating method or a slit coating method.

After the photosensitive resin composition is applied to the support substrate 2, a prebaking step is generally performed. The prebaking step is carried out, for example, by heating the support substrate 2 at a temperature of 80 ° C to 110 ° C for 60 seconds to 180 seconds. By this prebaking step, the solvent component is removed, and the first partition wall forming film 8a is formed.

Then, the photomask 21a of the predetermined pattern of light shielding is disposed above the support substrate 2, and the first barrier rib forming film 8a is exposed by the mask 21a. The photosensitive resin is a positive photosensitive resin and a negative photosensitive resin. In this step, a photosensitive resin of any type may be used. When the positive-type photosensitive resin is used, the light L is irradiated to the other part of the first partition forming film 8a other than the portion where the first partition 3a is to be formed. In the first partition wall forming film 8a, the light L is irradiated mainly at a portion where the first partition wall 3a is to be formed. In this step, a case where a positive photosensitive resin is used will be described with reference to FIG.

As shown in FIGS. 10A, 10B, and 10C, the photomask 21a is disposed above the support substrate 2, and the light L is irradiated through the photomask 21a. The light L is mainly applied to the first partition wall forming film 8a, and is mainly irradiated to a residual portion other than the portion where the first partition wall 3a is to be formed. In the 10A and 10B drawings, the light L irradiated to the first partition wall forming film 8a is schematically indicated by a blank arrow.

As shown in Fig. 11A, Fig. 11B, and Fig. 11C, the development step is followed. Thereby, the first partition wall 3a is formed in a pattern. When the first partition wall forming film 8a is developed, the developing liquid comes into contact with the second partition wall 3b. However, as described above, since the second partition 3b is subjected to the post-baking step, the second partition 3b is not etched even if it is in contact with the developing liquid.

After the development step, a post-baking step is performed. In the post-baking step, for example, the support substrate 2 is heated at a temperature of 200 ° C to 230 ° C for 15 minutes to 60 minutes to cure the first partition wall forming film 8 a to form the first partition wall 3 a.

In the present embodiment, the first partition wall 3a having a tapered shape is formed. The angle of the angle θ1 formed by the side surface of the first partition 3a and the bottom surface of the first partition 3a can be adjusted to an arbitrary angle by appropriately adjusting the following elements.

The angle of the angle θ1 formed by the side surface of the first partition 3a and the bottom surface of the first partition 3a, and the angle θ2 formed by the side surface of the second partition 3b and the bottom surface of the second partition 3b are mainly depending on the type of photosensitive resin used. set. Therefore, for example, in the photosensitive resin which is available in the market, by performing the exposure step and the development step under predetermined conditions, the material capable of forming the partition 3 (the first partition 3a) having a tapered shape can be appropriately selected. Alternatively, the material for forming the partition wall 3 (second partition 3b) having a reverse tapered shape can be appropriately selected by performing the exposure step and the development step under predetermined conditions, and the partition wall may be formed by using the material.

Moreover, the angle formed by the side surface of the partition wall and the bottom surface of the partition wall can be adjusted by adjusting the development time. When a negative-type photosensitive resin is used to form the second partition wall 3b having a reverse tapered shape, generally, the development time is increased, and the angle θ2 formed by the side surface of the second partition 3b and the bottom surface of the second partition 3b becomes more and more different. Big tendency.

Further, by adjusting the exposure amount, the angle formed by the side surface of the partition wall and the bottom surface of the partition wall can be adjusted. When the second partition wall 3b having a reverse tapered shape is formed by using a negative photosensitive resin, generally, the exposure amount is decreased, and the angle θ2 between the side surface of the second partition 3b and the bottom surface of the second partition 3b is changed. Small tendency.

By adjusting the distance between the photomask 21b and the support substrate 2, the angle formed by the side surface of the partition wall and the bottom surface of the partition wall can be adjusted. When a negative-type photosensitive resin is used, the distance between the photomask 21b and the support substrate 2 is reduced, and when the first partition 3a of the tapered shape is formed, generally, the side surface of the first partition 3a and the bottom surface of the first partition 3a are formed. When the second partition 3b having the inverted tapered shape is formed, the angle θ2 formed by the side surface of the second partition 3b and the bottom surface of the second partition 3b tends to be smaller as the angle θ1 tends to become larger.

The photosensitive resin composition is generally used by blending a binder resin, a crosslinking agent, a photoreaction initiator, a solvent, and other additives.

The binder resin is a resin which is previously polymerized. Examples of the binder resin include a non-polymerizable binder resin which does not have polymerizability, and a polymerizable binder resin which introduces a polymerizable substituent. The binder resin is a polystyrene-based standard and has a weight average molecular weight of 5,000 to 400,000 as determined by gel permeation chromatography (GPC).

Examples of the binder resin include a phenol resin, a novolac resin, a melamine resin, an acrylic resin, an epoxy resin, and a polyester resin. The binder resin-based monomers may be used singly or in combination of two or more kinds of copolymers. The ratio of the binder resin is generally 5% to 90% with respect to the total solid content of the above-mentioned photosensitive resin composition.

The crosslinked material is a compound polymerizable by an active radical, an acid or the like generated from a photopolymerization initiator by irradiation with light. The crosslinking agent may, for example, be a compound having a polymerizable carbon-carbon unsaturated bond. The crosslinked material may be a monofunctional compound having one polymerizable carbon-carbon unsaturated bond in the molecule, or a polyfunctional compound having two or more functionalized carbon-carbon unsaturated bonds. In the above-mentioned photosensitive resin composition, when the total amount of the binder resin and the crosslinked material is 100 parts by mass, the crosslinked material is generally 0.1 parts by mass or more and 70 parts by mass or less. In addition, when the total amount of the binder resin and the crosslinked material is 100 parts by mass, the amount of the photoreactive initiator in the photosensitive resin composition is usually 1 part by mass or more and 30 parts by mass or less.

The positive photosensitive resin is a resin in which the irradiated portion of the light is dissolved with respect to the developing solution. The positive photosensitive resin is generally composed of a compound in which a resin is hydrophilized under a photoreaction.

As the positive photosensitive resin, a resin in which a resin having a chemical resistance and adhesion such as a novolak resin, a polyhydroxystyrene, an acrylic resin, a methacrylic resin, or a polyimide may be used in combination with a photodecomposable compound may be used.

The developing liquid to be used for development may, for example, be an aqueous solution of potassium chloride or an aqueous solution of tetramethylammonium hydroxide (TMAH).

As described above, the angle θ1 between the side surface of the first partition wall 3a and the bottom surface of the first partition wall 3a, and the angle θ2 formed by the side surface of the second partition wall 3b and the bottom surface of the second partition wall 3b mainly depend on the type of photosensitive resin to be used. Many of the plurality of photosensitive resins which can be obtained from the market can be used as a material for forming a partition wall (first partition 3a) having a tapered shape. In addition, examples of the material for forming the partition wall (second partition 3b) of the inverted tapered shape include materials (ZPN 2464, ZPN 1168) manufactured by Zeon Co., Ltd., and the like.

The shape and arrangement of the partition walls 3 are appropriately set in accordance with the specifications of the display device such as the number of pixels and the resolution, ease of manufacture, and the like. For example, the width of the partition wall 3 in the row direction X or the row direction Y is about 5 μm to 50 μm, the height of the partition wall 3 is about 0.5 μm to 5 μm, and the interval between the partition walls 3 adjacent to the column direction X or the row direction Y, that is, the recess portion. The width of the column X direction X or the row direction Y is about 10 μm to 200 μm. Further, the width of the first electrode 6 in the column direction X or the row direction Y is about 10 μm to 200 μm.

(step of forming an organic layer)

In this step, an organic layer is formed. In the present embodiment, at least one organic layer is formed by one coating method in one or more organic layers. In the present embodiment, the first organic layer 7 and the second organic layer 9 are formed by a coating method.

First, the first organic layer 7 functioning as a hole injection layer is formed. As shown in FIG. 12A, FIG. 12B, and FIG. 12C, the ink 22 containing the material of the first organic layer 7 is first supplied to the region (recess 5) surrounded by the partition walls 3. The ink 22 is appropriately supplied by an appropriate method in consideration of the shape of the partition 3, the ease of the film forming step, and the film forming property. The ink 22 can be supplied to the concave portion 5 by, for example, an inkjet printing method, a nozzle coating method, a relief printing method, a gravure printing method, or the like.

As shown in Fig. 13A, Fig. 13B, and Fig. 13C, the supplied ink 22 is then solidified to form the first organic layer 7.

The curing of the ink 22 can be carried out, for example, by natural drying, heat drying, and vacuum drying. Further, when the ink 22 contains a material polymerized by the addition of energy, after the ink 22 is supplied to the concave portion 5, the ink 22 is heated, or the ink 22 is irradiated with light, and the material constituting the organic layer contained in the ink 22 can be polymerized. The material constituting the organic layer is polymerized in this manner to form the first organic layer 7, and the ink used in further forming the second organic layer on the first organic layer 7 makes it difficult to dissolve the first organic layer 7.

As shown in Fig. 14A, Fig. 14B, and Fig. 14C, a second organic layer 9 functioning as a light-emitting layer is formed. The second organic layer 9 can be formed in the same manner as the first organic layer 7. In other words, three kinds of inks each containing a material that becomes the red light-emitting layer 9R, the green light-emitting layer 9G, and the blue light-emitting layer 9B are supplied to a predetermined region (recessed portion 5) surrounded by the partition walls 3, and further cured by curing Further, a red light-emitting layer 9R, a green light-emitting layer 9G, and a blue light-emitting layer 9B are formed.

(Step of forming the second electrode)

As shown in FIGS. 15A, 15B, and 15C, the second electrode 10 is formed. In the present embodiment, the conductive thin film 10a is formed on one surface (overall) in a display region in which at least a plurality of organic electroluminescent devices are provided. The conductive film 10a is formed on one surface by, for example, vapor deposition. As described above, among the conductive thin films 10a, the portion provided on the second organic layer 9 corresponds to the second electrode 10.

As shown in Fig. 15C, when the thickness of the second electrode 10 is thin, even if the conductive film 10a is formed on one surface, the conductive film 10a is cut off at the end portion of the second partition wall 3b having a reverse tapered shape. In this case, the second electrode 10 of the organic electroluminescence element 4 and the conductive film 10a on the second partition 3b are cut.

As shown in Fig. 15B, the conductive film 10a is formed on the first partition 3a of the tapered shape on the side surface (the surface constituting the angle θ1 with respect to the bottom surface of the first partition 3a), so that it is not the first The second electrode 10 is cut at the end of the partition 3a, and the second electrode 10 formed as the organic electroluminescent device 4 is connected to the conductive thin film 10a on the first partition 3a. Therefore, the second electrodes 10 formed as the organic electroluminescent elements 4 adjacent to the column direction X are connected to each other via the conductive thin film 10 on the first partition 3a.

When the first partition wall 3a having a tapered shape is provided in a part of the outer circumference of the organic electroluminescence element 4, the second electrode 10 and the first partition 3a of the organic electroluminescence element 4 are formed. The conductive film 10a is connected. Therefore, even if the second partition 3b having the inverted tapered shape is provided, the second electrode 10 of the organic electroluminescent device 4 can be prevented from being cut at the end of the partition 3, and a plurality of organic electroluminescent elements 4 can be formed. The second electrode 10 is connected to the upper side.

As described above, when the partition wall 3 (the second partition wall 3b) having the inverted tapered shape is provided, if the thickness of the second electrode 10 is thin, the second electrode 10 at the end of the partition wall 3 having the inverted tapered shape is In the case of cutting, the second electrode 10 of the plurality of organic electroluminescent elements 4 can be formed by providing the first partition 3a having a tapered shape instead of thickening the thickness of the second electrode 10 to more than necessary. Connected to each other.

Further, in the present embodiment, the first partition walls 3a extend in the first direction (the series direction X in the present embodiment) orthogonal to the thickness direction Z of the support substrate 2, and are orthogonal to the thickness directions Z and The second direction of the first direction (X) (the winding direction Y in the present embodiment) is formed by a plurality of partition walls having a predetermined tapered shape, and overlaps the first partition wall 3a and the second partition wall 3b in plan view. The second partition 3b is provided between the support substrate 2 and the first partition 3a. Therefore, the second partition wall 3b is covered by the first partition wall 3a in a portion where the first partition wall 3a and the second partition wall 3b overlap each other, that is, the first partition wall 3a is exposed. When the conductive film 10a is entirely formed on the support substrate 2 having the first partition 3a, the second partition 3b is covered by the first partition 3a in a portion in which the first partition 3a and the second partition 3b overlap each other. Therefore, the conductive film 10a is integrally formed on the first partition 3a along the extending direction of the first partition 3a. In the present embodiment, since the first partition walls 3a are formed to extend in the row direction Y, the second electrodes 10 of the organic electroluminescence element 4 adjacent to the row direction Y are electrically connected to each other via the first partition walls 3a. The film 10a is connected. Thereby, the second electrodes 10 formed as the entire organic electroluminescence element via the conductive thin film 10a on the first partition 3a are connected to each other. Therefore, the second electrode 10 functions as an electrode common to all of the organic electroluminescent elements 4 .

In the present embodiment, the second partition wall 3b having the inverted tapered shape faces the organic electroluminescent element 4 and is disposed so as to surround the organic electroluminescent element 4, so that the ink 22 is supplied to the region (recess 5) surrounded by the partition wall 3. By the capillary phenomenon, it is filled in a state where it is filled in a portion which is sucked into the vicinity of the portion where the first electrode 16 and the second partition wall 3b are connected. In this state, by evaporating the solvent of the ink, an organic layer is formed also in a portion of the front end of the portion where the first electrode 6 and the partition 3 are connected. Thereby, an organic layer of uniform thickness can be obtained.

The ink 22 supplied to the region (concave portion 5) surrounded by the partition wall 3 in the portion where the first electrode 6 and the first partition wall 3a having the tapered shape are connected to each other may be pulled away by the first partition wall 3a and dried. However, the second partition wall 3b having an inverted tapered shape is provided so as to surround the organic electroluminescence element 4 so as to surround a portion of the organic electroluminescence element 4, whereby at least the entire organic layer system can be obtained more than the tapered shape. The concave portion surrounded by the partition wall of the shape forms an organic layer having a flatter and uniform thickness in the organic layer.

Further, in the concave portion 5, the portion where the thickness of the organic layer is thinner is very dependent on the shape of the concave portion 5 in plan view. For example, when the concave portion surrounded by the partition wall of the tapered shape is formed into an organic electroluminescence element having a shape extending in a predetermined direction perpendicular to the thickness direction of the support substrate, that is, as in the present embodiment, the direction of the row is formed. When the Y-extended organic electroluminescent device is used, the ink supplied to the concave portion is concentrated in one of the one end and the other end in the longitudinal direction (row direction Y) or the central portion in the short-side direction (column direction X). The tendency. In this case, the organic layer is thinned in thickness in one of the one end side and the other end side in the longitudinal direction (row direction Y), or one end side and the other end side in the short side direction (column direction X). The tendency to change the thickness is thin.

In the present embodiment, the first partition wall 3a is preferably disposed so as to face the short side direction (column direction X) of the organic electroluminescence element 4 in a plan view as in the case of the organic electroluminescence element extending in the predetermined direction. And the other end surface, that is, the side surface of the straight outer periphery (facing the outer circumference) that is disposed so as to surround the short side direction of the organic electroluminescence element, linearly extends in a plan view in the longitudinal direction, and the second partition wall 3b is preferably disposed so as to face One of the longitudinal direction (row direction Y) of the electro-optical excitation element 4 and the other end surface, that is, the side surface of the arc-shaped periphery (facing the outer circumference) that is preferably arranged to surround the longitudinal direction of the organic electroluminescence element is It extends in an arc shape in a plan view in the short side direction. When the second partition wall 3b is disposed in this manner, the ink 22 supplied to the concave portion 5 is formed on one end side and the other end side of the side surface of the second partition wall 3b facing the inverted tapered shape in the longitudinal direction (row direction Y). The portion is closed by the capillary phenomenon, and is fixed to the side surface of the second partition wall 3b to form a film. Therefore, it is possible to obtain a flatter and uniform thickness organic layer than the organic layer formed by the concave portion surrounded by the partition wall having the tapered shape. Floor.

Further, the first partition walls 3a are arranged to face one of the short side directions (column direction X) of the organic electroluminescence element 4 and the other end surface, and the second partition walls 3b face the longitudinal direction of the organic electroluminescent element 4 ( When one side of the row direction Y) and the other end surface are arranged, the end side and the other end side (short side) in the longitudinal direction (row direction Y) in which the second electrode 10 is cut are viewed in plan view, and the second side is formed. The electrode 10 is connected to the conductive film 10a on the partition wall 3 at one end side and the other end side (long side) in the short-side direction (column direction X). When the second electrode 10 is cut in one of the end sides and the other end side in the short-side direction (column direction X), the second electrode 10 is cut between the conductive film 10a on the partition wall 3. The area of the organic electroluminescent device 4 of the present embodiment is small, and the area in which the electroconductive thin film 10a is integrally formed in the partition 3 is the number of the organic electroluminescent elements 4 of the present embodiment. Therefore, the wiring resistance can be reduced.

<Composition of Organic Electroluminescence Element>

Hereinafter, the configuration of the organic electroluminescence element will be described in more detail. The organic electroluminescent device has at least one light-emitting layer as an organic layer. As described above, the organic electroluminescence element further includes a predetermined layer such as a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer.

An example of a layer structure that can be adopted in the organic electroluminescence device of the present embodiment is shown below.

a) anode / luminescent layer / cathode

b) anode / hole injection layer / luminescent layer / cathode

c) anode / hole injection layer / luminescent layer / electron injection layer / cathode

d) anode / hole injection layer / luminescent layer / electron transport layer / cathode

e) anode/hole injection layer/light-emitting layer/electron transport layer/electron injection layer/cathode

f) anode / hole transport layer / luminescent layer / cathode

g) anode / hole transport layer / luminescent layer / electron injection layer / cathode

h) anode / hole transport layer / luminescent layer / electron transport layer / cathode

i) anode / hole transport layer / luminescent layer / electron transport layer / electron injection layer / cathode

j) anode/hole injection layer/hole transport layer/light-emitting layer/cathode

k) anode/hole injection layer/hole transport layer/light-emitting layer/electron injection layer/cathode

l) anode / hole injection layer / hole transport layer / luminescent layer / electron transport layer / cathode

m) anode/hole injection layer/hole transport layer/light-emitting layer/electron transport layer/electron injection layer/cathode

h) anode / luminescent layer / electron injection layer / cathode

o) anode / luminescent layer / electron transport layer / cathode

p) anode / luminescent layer / electron transport layer / electron injection layer / cathode

(Here, the symbol "/" means that each layer of the symbol "/" is adjacent to each other and is laminated). Same as below)

In the above embodiment, the organic electroluminescent device 4 in which the first electrode 6 functions as an anode and the second electrode 10 functions as a cathode is described. In this embodiment, for example, the respective constituent elements of the above a) to p) are sequentially laminated on the support substrate 2 from the anode shown on the leftmost side. Further, the first electrode 6 functions as a cathode, and the constituent elements of the organic electroluminescent device 4 having the anode function of the second electrode 10, for example, the layers a) to p) described above are the cathode sequential layer shown from the rightmost side. Cooperating on the support substrate 2.

<Support substrate>

In the step of manufacturing the organic electroluminescent device 4 on the support substrate 2, those having no chemical change can be suitably used. For example, glass, plastic, polymer film, and ruthenium substrate, and a substrate laminated thereon can be used.

<anode>

When the light emitted from the light-emitting layer is emitted through the anode and emitted to the external organic electroluminescence element, an electrode exhibiting light transmittance can be used for the anode. As the electrode which exhibits light transmittance, a film of a metal oxide, a metal sulfide, or a metal can be used, and a conductivity and a light transmittance can be suitably used. Specifically, it may be composed of indium oxide, zinc oxide, tin oxide, indium tin oxide (ITO), indium zinc oxide (Indium Zinc Oxide: IZO), gold, platinum, silver, and copper. For the film, a film composed of ITO, IZO, or tin oxide may be suitably used.

Examples of the method for producing the anode include a vacuum deposition method, a sputtering method, an ion plating method, and a plating method. Further, as the anode, an organic transparent conductive film of polyaniline or a derivative thereof, polythiophene or a derivative thereof, or the like can be used.

<cathode>

The material of the cathode is preferably a material having a small work function and easy to inject electrons into the light-emitting layer and having high conductivity. Further, in order to cause the light emitted from the light-emitting layer to be reflected from the cathode to the anode side, the material of the cathode is preferably a material having a high reflectance for visible light in order to reflect the light emitted from the light-emitting layer to the anode side. As the cathode system, for example, an alkali metal, an alkaline earth metal, a transition metal, a metal of Group 13 of the periodic table, or the like can be used. The material of the cathode may be a metal such as lithium, sodium, potassium, rubidium, cesium, cesium, magnesium, calcium, strontium, barium, aluminum, strontium, vanadium, zinc, bismuth, indium, antimony, bismuth, antimony, bismuth, antimony, etc. And an alloy of two or more of the above metals, one or more of the above metals, and one or more of gold, silver, platinum, copper, manganese, titanium, cobalt, nickel, tungsten, and tin, Or graphite or graphite intercalation compounds. Examples of the alloy include a magnesium-silver alloy, a magnesium-indium alloy, a magnesium-aluminum alloy, an indium-silver alloy, a lithium-aluminum alloy, a lithium-magnesium alloy, a lithium-indium alloy, a calcium-aluminum alloy, and the like. Further, as the cathode, a transparent conductive electrode made of a conductive metal oxide, a conductive organic substance or the like can be used. Specifically, examples of the conductive metal oxide include indium oxide, zinc oxide, tin oxide, ITO, and IZO. Examples of the conductive organic substance include polyaniline or a derivative thereof, polythiophene or a derivative thereof, and the like. Further, the cathode system may be formed by laminating two or more laminates. Further, the electron injecting layer is also used as a cathode.

Examples of the method for producing the cathode include a vacuum deposition method, an ion plating method, and the like.

The thickness of the anode or the cathode can be appropriately set in consideration of the required characteristics, the ease of the film formation step, and the like. The thickness of the anode or cathode is, for example, 10 nm to 10 μm, preferably 20 nm to 1 μm, more preferably 50 nm to 500 nm.

<hole injection layer>

Examples of the hole injecting material constituting the hole injecting layer include oxides such as vanadium oxide, molybdenum oxide, cerium oxide, and aluminum oxide, phenylamine compounds, starburst type amine compounds, phthalocyanine compounds, and non- Crystal carbon, polyaniline and polythiophene derivatives.

The film formation method of the hole injection layer is, for example, a film formation derived from a solution containing a hole injection material. The hole injection layer is formed by, for example, coating a film containing a hole injecting material by a predetermined coating method, and further formed by curing.

The thickness of the hole injection layer can be appropriately set in consideration of the required characteristics, the ease of the steps, and the like. The thickness of the hole injection layer is, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, more preferably 5 nm to 200 nm.

<hole transport layer>

Examples of the hole transporting material constituting the hole transporting layer include, for example, polyvinylcarbazole or a derivative thereof, polydecane or a derivative thereof, and a polyoxyalkylene derivative having an aromatic amine in a side chain or a main chain. a pyrazoline derivative, an arylamine derivative, a stilbene derivative, a triphenyldiamine derivative, a polyaniline or a derivative thereof, a polythiophene or a derivative thereof, a polyarylamine or a derivative thereof, Polypyrrole or a derivative thereof, poly(p-phenylene vinylene) or a derivative thereof, or poly(2,5-threthiophenylenevinylene) or a derivative thereof.

The thickness of the hole transport layer can be set in consideration of the required characteristics, the ease of the film formation step, and the like. The thickness of the hole transport layer is, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, more preferably 5 nm to 200 nm.

<Light Emitting Layer>

The luminescent layer is generally formed mainly by an organic substance that emits fluorescence and/or phosphorescence, or an organic substance and a dopant that is supplemented thereto. The dopant is added, for example, to increase the luminous efficiency and change the wavelength of the light. Further, the organic layer constituting the light-emitting layer may be a low molecular compound or a polymer compound, and when the light-emitting layer is formed by a coating method, the light-emitting layer preferably contains a polymer compound. The polystyrene-equivalent number average molecular weight of the polymer compound constituting the light-emitting layer is, for example, about 10 ³ to 10 ⁸ . Examples of the light-emitting material constituting the light-emitting layer include the following pigment materials, metal complex materials, polymer materials, and dopant materials.

(pigment material)

The pigment material may, for example, be a cyclopentadiene derivative, a tetraphenylbutadiene derivative compound, a triphenylamine derivative, an oxadiazole derivative, a pyrazoloquinoline derivative, or a distyrylbenzene derivative. , distyryl extended aryl derivative, pyrrole derivative, thiophene ring compound, pyridine ring compound, benzalkonone derivative, anthracene derivative, oligothiophene derivative, oxadiazole dimer, pyrazoline dimer , quinacridone derivatives, coumarin derivatives.

(metal complex material)

The metal complex material may, for example, have a rare earth metal such as Tb, Eu or Dy, or Al, Zn, Be, Ir, Pt or the like in the central metal, and have an oxadiazole, a thiadiazole or a phenyl group in the ligand. A metal complex of pyridine, phenylbenzimidazole, quinoline structure or the like. The metal complex material may, for example, be a metal complex having luminescence derived from a triplet excited state of a ruthenium complex, a platinum complex or the like, an aluminum quinolol complex, or a benzoquinolinol oxime. , benzoxazolyl zinc complex, benzothiazole zinc complex, azomethyl zinc complex, zinc porphyrin complex, phenanthrenequinone complex, and the like.

(Polymer Materials)

Examples of the polymer material may, for example, be a polyparaphenylene vinyl derivative, a polythiophene derivative, a polyparaphenylene derivative, a polydecane derivative, a polyacetylene derivative, a polyfluorene derivative, or a polyvinyl group. A carbazole derivative, the above-mentioned dye material, a material which polymerizes a metal complex luminescent material, and the like.

The thickness of the luminescent layer is generally from about 2 nm to 200 nm.

<Electronic transport layer>

As the electron transporting material constituting the electron transporting layer, a known material can be used. Examples of the electron transporting material include, for example, an oxadiazole derivative, onion dimethane or a derivative thereof, benzoquinone or a derivative thereof, naphthoquinone or a derivative thereof, onion or a derivative thereof, and cyanine onion Methane or a derivative thereof, an anthrone derivative, diphenyldicyanoethylene or a derivative thereof, a diphenolphthalein derivative, or a metal complex of 8-quinolinol or a derivative thereof, polyquinoline or a derivative thereof , polyquinoxaline or a derivative thereof, polyfluorene or a derivative thereof, and the like.

The thickness of the electron transport layer can be appropriately set in consideration of the required characteristics, the ease of the film formation step, and the like. The thickness of the electron transporting layer is, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, more preferably 5 nm to 200 nm.

<Electronic injection layer>

The material constituting the electron injecting layer can be appropriately selected depending on the kind of the light emitting layer. Examples of the material constituting the electron injecting layer include an alkali metal, an alkaline earth metal, an alloy containing one or more kinds of an alkali metal and an alkaline earth metal, an oxide of an alkali metal or an alkaline earth metal, a halide, and a carbonate. And mixtures of such substances, and the like.

Examples of the alkali metal, the alkali metal oxide, the halide, and the carbonate include lithium, sodium, potassium, rubidium, cesium, lithium oxide, lithium fluoride, sodium oxide, sodium fluoride, potassium oxide, and potassium fluoride. , cerium oxide, cerium fluoride, cerium oxide, cerium fluoride, lithium carbonate, and the like. Further, examples of the alkaline earth metal, the oxide of the alkaline earth metal, the halide, and the carbonate include, for example, magnesium, calcium, barium, strontium, magnesium oxide, magnesium fluoride, calcium oxide, calcium fluoride, barium oxide, and fluorine. Antimony, antimony oxide, antimony fluoride, magnesium carbonate, and the like. The electron injecting layer may be composed of a laminate of two or more layers, and examples thereof include a laminate of a LiF layer and a Ca layer.

The thickness of the electron injecting layer is preferably about 1 nm to 1 μm.

Each of the organic layers described above is formed by, for example, a coating method such as a nozzle printing method, an inkjet printing method, a relief printing method, or a gravure printing method, a vacuum deposition method, a sputtering method, or a CVD method.

Further, in the coating method, an ink containing an organic electroluminescent material which is an organic layer is applied to form a film, and further, an organic layer is formed by curing the ink applied to the film. The solvent of the ink to be used may, for example, be a chlorine solvent such as chloroform, dichloromethane or dichloroethane; an ether solvent such as tetrahydrofuran; an aromatic hydrocarbon solvent such as toluene or xylene; or a ketone such as acetone or methyl ethyl ketone. An ester solvent such as a solvent, ethyl acetate, butyl acetate or ethyl cellosolve acetate, or water.

Example

In order to explain the present invention in more detail, the examples are shown below. The present invention is not limited to the following examples.

(Example 1)

A support substrate (TFT substrate) on which an ITO thin film functioning as a first electrode is formed (see FIGS. 7A, 7B, and 7C). On the support substrate, a negative photosensitive resin solution 1 (ZPN 2464, manufactured by Zeon Co., Ltd., Japan) was applied by a spin coater, and heated at 110 ° C for 90 seconds on a hot plate to prepare a solvent by prebaking. The components are vaporized (see Figures 8A, 8B, and 8C). Then, exposure was performed at an exposure amount of 100 mJ/cm ² using a Proximity exposure machine. Further, the developing solution (manufactured by Tosoh Corporation SD-1 (TMAH 2.38% by weight) was used for image development for 80 seconds to form a second partition wall 3b having an inverted tapered shape. Then, it was heated at 230 ° C for 30 seconds, and then post-baked. The resin is cured to form a second partition 3b having a thickness of 0.8 μm. The angle of the angle θ2 between the side surface of the second partition 3b formed by the second partition 3b and the bottom surface of the second partition 3b is about 115°.

Then, a film-forming positive photosensitive resin solution (ZPN 6212, manufactured by Zeon Co., Ltd., Japan) was applied by a spin coater, and heated at 110 ° C for 90 seconds on a hot plate, and the solvent component was vaporized by performing prebaking (refer to 10A, 10B and 10C). Then, exposure was performed at an exposure amount of 100 mJ/cm ² using a Proximity exposure machine. Further, a developing solution (manufactured by Tosoh Corporation SD-1 (TMAH 2.38% by weight) was used for image development for 70 seconds to form a first partition wall 3a having a tapered shape. Then, it was heated at 230 ° C for 30 seconds, and then baked. The resin is cured to form a first partition 3a having a thickness of 1.0 μm (see FIGS. 11A, 11B, and 11C). The side surface of the first partition 3a and the bottom surface of the second partition 3a are formed as described above. The angle of the angle θ1 is about 30°.

The surface of the support substrate on which the partition walls were formed was treated with oxygen plasma, and then surface-treated with CF ₄ plasma to lyophilize the surface of the ITO to impart liquid repellency to the surface of the partition walls.

Then, an ink (Litex 142P manufactured by ULVAC Co., Ltd.) was used to coat an aqueous dispersion of poly(ethylene dioxythiophene) (PEDOT) and polystyrene sulfonic acid (PSS) having a solid concentration of 1.5% (Bayer Co., Ltd.). System A14083)) (Refer to Fig. 12A, Fig. 12B and Fig. 12C). The upper surface of the partition wall 3 is used to disperse the ink, so that the predetermined recessed portion surrounded by the partition wall 3 is filled with ink. Further, the second partition wall having the inverted tapered shape along the one end side and the other end side facing the direction X of the concave portion is attracted to the end portion by capillary action, that is, the front end near the lower end portion of the side surface is finely closed. The gap is uniformly spread in the pixels (recesses). The substrate was fired at 200 ° C to form a hole injection layer 7 having a uniform thickness (50 nm) (see FIGS. 13A, 13B, and 13C).

Then, the polymer light-emitting material that emits red light is mixed with an organic solvent so as to have a concentration of 0.8% by weight to prepare a red light-emitting ink. In the same manner, the green light-emitting material was prepared by mixing the polymer light-emitting material that emits green light in an organic solvent so as to have a concentration of 0.8% by weight. Further, a polymer light-emitting material that emits blue light is mixed with an organic solvent so as to have a concentration of 0.8% by weight to prepare a blue light-emitting ink. These red light-emitting inks, green light-emitting inks, and blue light-emitting inks were each applied to a specific concave portion using an inkjet device (Litrex 142P manufactured by ULVAC Co., Ltd.).

The ink is removed from the upper surface of the partition wall 3, so that the ink is filled in a predetermined recess surrounded by the partition wall 3. In addition, the ink is sucked to the end portion by the capillary phenomenon along the one end side facing the concave direction X and the second partition wall having the inverted tapered shape on the other end side, and is uniformly spread in the pixel. This substrate was fired at 130 ° C to form a light-emitting layer 9 having a uniform thickness (60 nm) (see FIGS. 14A, 14B, and 14C).

Next, a second electrode (cathode) 10 composed of a Ca layer having a thickness of 20 nm and an Al layer having a thickness of 150 nm was formed by a vacuum deposition method. In the end portion of the second partition wall 3b having an inverted tapered shape, the second electrode (cathode) 10 is also broken due to the step (see Fig. 15C), and the first partition wall 3a is formed in a tapered shape. In the end portion, since the second electrode (cathode) 10 is not divided, the second electrode 10 formed as all the organic electroluminescence elements 4 is connected. Therefore, the wiring resistance can be lowered, and a plurality of organic electroluminescent elements can be formed on the supporting substrate as intended, and further, the organic electroluminescent elements are formed in the respective organic electroluminescent elements in the panel. The light is emitted at the same brightness with each other, and each of the organic electroluminescent elements individually emits light uniformly in the pixels.

1. . . Display device

2. . . Support substrate

3. . . next door

3a. . . 1st next door

3b. . . Second next door

4. . . Organic electroluminescent element

5. . . Concave

6,16. . . First electrode

7. . . First organic layer (hole injection layer)

8. . . Membrane forming film

9. . . Second organic layer (light emitting layer)

10, 19. . . Second electrode

10a. . . Conductive film

12. . . Support substrate

13. . . next door

15. . . Area surrounded by next door

17, 22. . . Ink

18. . . Organic layer

twenty one. . . Mask

Θ1, θ2. . . angle

Fig. 1 is a cross-sectional view schematically showing a part of an enlarged display device.

Fig. 2 is a cross-sectional view schematically showing a display device in which the position of the cut surface line A-A shown in Fig. 1 is enlarged.

Fig. 3 is a cross-sectional view schematically showing a display device in which the position of the cut surface line B-B shown in Fig. 1 is cut.

Fig. 4 is a cross-sectional view schematically showing a display device in which the position of the cut surface line C-C shown in Fig. 1 is cut.

Fig. 5 is a cross-sectional view schematically showing a display device in which the position of the cut surface line D-D shown in Fig. 1 is cut.

Fig. 6 is a cross-sectional view schematically showing a display device in which the position of the cut surface line E-E shown in Fig. 1 is cut.

Fig. 7A is a view for explaining the manufacturing steps of the display device.

Fig. 7B is a view for explaining the manufacturing steps of the display device.

Fig. 7C is a view for explaining the manufacturing steps of the display device.

Fig. 8A is a view for explaining the manufacturing steps of the display device.

Fig. 8B is a view for explaining the manufacturing steps of the display device.

Fig. 8C is a view for explaining the manufacturing steps of the display device.

Fig. 9A is a view for explaining the manufacturing steps of the display device.

Fig. 9B is a view for explaining the manufacturing steps of the display device.

Fig. 9C is a view for explaining the manufacturing steps of the display device.

Fig. 10A is a view for explaining the manufacturing steps of the display device.

Fig. 10B is a view for explaining the manufacturing steps of the display device.

Fig. 10C is a view for explaining the manufacturing steps of the display device.

Fig. 11A is a view for explaining the manufacturing steps of the display device.

Fig. 11B is a view for explaining the manufacturing steps of the display device.

Fig. 11C is a view for explaining the manufacturing steps of the display device.

Fig. 12A is a view for explaining the manufacturing steps of the display device.

Fig. 12B is a view for explaining the manufacturing steps of the display device.

Fig. 12C is a view for explaining the manufacturing steps of the display device.

Fig. 13A is a view for explaining the manufacturing steps of the display device.

Fig. 13B is a view for explaining the manufacturing steps of the display device.

Fig. 13C is a view for explaining the manufacturing steps of the display device.

Fig. 14A is a view for explaining the manufacturing steps of the display device.

Fig. 14B is a view for explaining the manufacturing steps of the display device.

Fig. 14C is a view for explaining the manufacturing steps of the display device.

Fig. 15A is a view for explaining the manufacturing steps of the display device.

Fig. 15B is a view for explaining the manufacturing steps of the display device.

Fig. 15C is a view for explaining the manufacturing steps of the display device.

Fig. 16A is a view for explaining the manufacturing steps of the display device.

Fig. 16B is a view for explaining the manufacturing steps of the display device.

Fig. 16C is a view for explaining the manufacturing steps of the display device.

Fig. 16D is a diagram for explaining the manufacturing steps of the display device.

Fig. 17A is a view for explaining the manufacturing steps of the display device.

Fig. 17B is a view for explaining the manufacturing steps of the display device.

Fig. 17C is a view for explaining the manufacturing steps of the display device.

2. . . Support substrate

3. . . next door

3a. . . 1st next door

3b. . . Second next door

4. . . Organic electroluminescent element

5. . . Concave

6. . . First electrode

7. . . First organic layer (hole injection layer)

9. . . Second organic layer (light emitting layer)

10. . . Second electrode

10a. . . Conductive film

Θ1, θ2. . . angle

Claims (5)

A display device includes: a support substrate; a plurality of organic electroluminescence elements provided on the support substrate; and an outer periphery when viewed from one of thickness directions of the support substrate, respectively, surrounding the organic electroluminescence element a partition wall provided in a manner of: the first partition wall provided to a part of the outer circumference; and the second partition wall provided to face the remaining portion of the outer circumference of the outer circumference; the first partition wall surrounding the first partition wall The corner formed by the side surface of the outer circumference and the bottom surface is a partition wall of a sharp-shaped tapered shape, and the second partition wall surrounds the partition wall of the inverted tapered shape in which the angle formed by the side surface and the bottom surface of the outer circumference is an obtuse angle. The display device according to claim 1, wherein the first partition wall extends in a first direction orthogonal to a thickness direction of the support substrate, and is orthogonal to the thickness direction and the first The second direction of the direction is formed by a plurality of partition members arranged at predetermined intervals, and the second partition wall is provided on the support substrate and the first partition wall at a portion where the first partition wall overlaps the second partition wall between. The display device of claim 1, wherein the organic electroluminescent device has a thickness orthogonal to the support substrate The shape in which the direction extends in a predetermined direction is such that the first partition wall is disposed to surround one of the short sides of the organic electroluminescence element and the other outer circumference, and the second partition wall is disposed to surround the organic electroluminescence element. One of the long sides and the outer circumference of the other. The display device according to the first aspect of the invention, wherein the first partition wall and the second partition wall are each formed by patterning a layer of the photosensitive resin composition. A method of manufacturing a display device according to the first aspect of the invention, comprising: forming a partition wall on a support substrate; and forming a plurality of organic electroluminescent elements on the support substrate In the step of forming the partition wall, the layer of the photosensitive resin composition is patterned by photolithography to form the first partition wall and the second partition wall.