201236106 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種顯示裝置及其製造方法。 【先前技術】 於顯示裝置中係有其構成或原理相異之各種裝置。其 中之一，為於像素之光源利用有機電激發光元件卬rganic electroluminescent element)之顯示裝置已被實用化。 上述顯示裝置係具備：支撐基板、及設於此支撐基板 上之多數個有機電激發光元件。於支撐基板上係設有區隔 像素區域之隔壁，上述多數個有機電激發光元件係在被隔 壁所區隔之區域分別整齊排列而配置。 各有機電激發光元件係藉由使第1電極、有機層、第 2電極從支撐基板側依上述順序層疊來形成。 上述有機層係可藉由例如塗佈法來形成。參照第16 a 圖、第16B圖、第16C圖及第16D圖而說明有關有機層18 之形成方法。第16A圖、第16B圖、第16c圖及第16D圖 係用以說明顯示裝置之製造步驟圖。 如第16A圖所示，首先於支撐基板12上形成第丨電 極16及隔壁13。繼之’對被隔壁13包圍之區域（凹部）15, 將3有成為有機層18之材料的油墨17從位於上方之喷嘴 供給。 如第16B圖所示，所供給之油墨π係收容於被隔壁 W包圍之區域15。 如第16C圖所示，之後，藉由使油墨17之溶劑成分 323774 4 201236106 氣化，而形成有機層18。 如第16A圖所示，繼之，形成第2電極19。此第2電 極19係例如遍及複數個有機電激發光元件而一體延伸， 1 且設置成為複數個有機電激發光元件所共有的電極。例如 藉由介設於相鄰之有機電激發光元件之間的隔壁13上亦 以一體性地跨越的方式形成延伸之導電性薄膜，而遍及複 數個有機電激發光元件而形成相連之第2電極19。如此之 第2電極19亦即導電性薄膜係藉由例如真空蒸鍍法而形 成。 又，在第16B圖所示之態樣中，於隔壁13對油墨17 顯示親液性時，會有供給至特定之凹部15之油墨17越過 隔壁13，而沿著其表面流出至相鄰的凹部15之情形。為 防止如此之油墨17的流出，一般於支撐基板12上設有某 種程度顯示撥液性之隔壁13。 但，於隔壁13顯示撥液性時，供給至凹部15之油墨 17係被隔壁13排開同時並氣化，成為薄膜（有機層18)。 因此，會有形成厚度不均一之有機層18之情形。例如會有 因凹部15之形狀而使有機層18之相接於隔壁13的預定部 位（亦即有機層18之周緣部）之厚度，相較於位在凹部15 之中央部的附近之有機層18之中央部的厚度形成較薄之 情形。如此一來，有機層18之周緣部的電阻較中央部變 低，驅動有機電激發光元件時於有機層18之周緣部電流集 中而流動，有機層18之中央部較周緣部會有變暗之情形。 又，反之，因於有機層18之周緣部未形成所希望的厚度之 5 323774 201236106 層，故有機層18之周緣部亦會有未如目的地發光之情形。 為解決如此之問題，有設有所謂倒錐形形狀之隔壁的 顯示裝置。將其示意圖表示於第17A圖、第17B圖及第17C 圖。第17A圖、第17B圖及第17C圖係用以說明顯示裝置 之製造步驟的圖。 如第17A圖、第17B圖及第17C圖所示，倒錐形形狀 之隔壁13係以在正交於延伸方向之方向切斷時之截面形 狀隨遠離支撐基板12(第1電極16)而變寬廣之方式形 成。因此，在隔壁13之側面與第1隔壁16相接之部位的 附近，形成前端尖細狀之區域。若將油墨供給至被如此之 倒錐形形狀的隔壁13包圍之區域15，則接觸於隔壁13之 側面的油墨係被填充成因毛細管現象而被吸入於上述前端 尖細狀之區域。若在維持此狀態下油墨的溶劑成分氣化， 則於第1電極16與隔壁13相接之部位的附近亦會形成有 機層18。 如第17B圖所示，藉由設置所謂倒錐形形狀之隔壁 13，即使設置有顯示撥液性之隔壁13，亦可防止有機層18 之周緣部的厚度變薄之問題（例如參照專利文獻1)。 (先前技術文獻） (專利文獻） 專利文獻1 :日本特開2007-227289號公報 【發明内容】 (發明欲解決之課題） 於設有如第17A圖、第17B圖及第17C圖所示之倒錐 6 323774 201236106 形形狀的隔壁13之基板上，藉真空蒸鍍法形成遍及複數個 有機電激發光元件而一體延伸，且為複數個有機電激發光 元件所共有的第2電極19時，如第17C圖所示於第2電極 19的厚度較薄時，會有於隔壁之端部切斷第2電極19之 情形。結果，於驅動顯示裝置時，會有無法如同預期供給 電力而形成未發光之有機電激發光元件之情形。 因此，本發明之目的在於提供一種在具備倒錐狀形狀 之隔壁的顯示裝置中，遍及複數個有機電激發光元件可形 成相連之第2電極的顯示裝置。 (用以解決課題之手段） 本發明係提供下述之【1】至【5】。 [1] 一種顯示裝置，係具備：支撐基板、設於前述支撐基板 上之複數個有機電激發光元件、及以分別包圍從前述有機 電激發光元件之前述支撐基板的厚度方向之一方觀看時之 外周的方式所設之隔壁； 前述隔壁係具有：面向前述外周中的一部分所設之第 1隔壁、與面向去除前述外周中的前述一部分之其餘部分 所設之第2隔壁； 前述第1隔壁係包圍前述外周之側面與底面構成之角 為銳角的順錐形形狀之隔壁， 前述第2隔壁係包圍前述外周之側面與底面構成之角 為鈍角的倒錐形形狀之隔壁。 [2] 如[1]項所述之顯示裝置，其中，前述第1隔壁係由分 別朝正交於前述支撐基板的厚度方向之第1方向延伸，且 7 323774 201236106 朝正交於前述厚度方向及前述第丨方向之第2方 定之間隔而配置的複數條之隔壁構件所構成，Q隔開預 於前述第i隔壁與前述第2隔壁重叠之部 2隔壁係設於前述支撐基板與前述第丨隔壁之門j迷第 [3]如[1]項f2]所述之顯示裝置，其中，前述^有機電激發 先疋件係具有朝正交於前述支撑基板的厚度 向延伸之形狀， m疋万 前述第1隔壁係配置成包圍前述有機電激發光 短邊方向的一方及另一方之前述外周， 前述第2隔壁係配置成包圍前述有機電激發光 長邊方向的一方及另一方之前述外周。 ⑷如[1]至[3]項中卜項所述之顯示裝置，其中 1隔壁及第2隔壁分別藉由對感光性樹缝成物之 圖案化來形成。 θ 丁 [5]-種顯示裝置之製造方法，係如⑴至[4]項中任一 述之顯示裝置，包含： 斤 於支樓基板上形成隔壁之步驟；以及 驟於前述支撐基板上形成複數個有機電激發光元件的步 於前述形成隔壁之步驟中，係藉光微韻刻法 性樹脂組成物之聽予圖案化，而分卿成第i隔壁 2隔壁。 、禾 (發明之效果） 若依本發明，可實現一種在具備倒錐狀形狀之隔壁的 323774 8 201236106 、顯不裝置中’具有遍及複數個有機電激發光元件而相連之 第2電極的顯示裝置。 【實施方式】 、以下，參照圖式說明有關本發明之實施形態。又，各 圖式係不過疋於可理解發明之程度，概略地表示構成要素 之1狀A J、及配置。本發明係不受下述之記述所限定， 各構成要素係在不超出本發明之旨意的範圍中可適當變更。 在以下說明所使用之圖式中，有關同樣之構成要素係賦予 同-符號而表示’對於重複之說明有省略之情形。又，有 關本發明之實施形態的構成係圖示例之配置，而未必被製 造或被使用。 本發明之顯示裝置，係具備：支撑基板、設於支稽基 板上之複數個有機電激發光元件、及以分別包圍從有機電 激發光元件之支撐基板的厚度方向z之一方觀看時（有稱 為「俯視」之情形）之外周的方式所設之隔壁；隔壁係具有： 面向外周中的一部分所設之第1隔壁、與面向除去外周中 的-部分之其餘部分所設之第2隔壁；第1隔壁係包圍外 周之侧面與底面構成之角度為銳角的順錐形形狀之隔壁， 第2隔壁係包圍外周之側面與底面構成之角度為純角的倒 錐形形狀之隔壁。 本發明係適用於複數個有機電激發光元件的各第2電 極相連而形成之顯示裝置。如此之顯示裝置在本實施形態 中係說明有關主動矩陣驅㈣的顯示裝置作為—例。 〈顯示裝置之構成〉 323774 9 201236106 1圖至第6圖而首先說明有關顯示裝置之構 成。$ 1圖係7^性地顯示放大本實施形態之顯示裝置1 的一部分之截面圖。第2圖係示意性地顯示放大在第1圖 所不之切斷面線A-A的位置經切斷之顯示裝置的截面圖。 第3圖係示意性地顯示放大在第1圖所示之切斷面線B-B 的位置經切斷之顯示裝置的截面圖。第4圖係示意性地顯 示放大在第1圖所示之切斷面線C-C的位置經切斷之顯示 裝置的截面圖。第5圖係示意性地顯示放大在第1圖所示 之切斷面線D-D的位置經切斷之顯示裝置的截面圖。第6 圖係示意性地顯示放大在第1圖所示之切斷面線E-E的位 置經切斷之顯示裝置的截面圖。 如第1圖所示，顯示裝置1主要係包含：支撐基板2、 在此支撐基板2上晝分預先設定之區塊的隔壁3、設於藉 隔壁3所晝分之區塊的複數個有機電激發光元件4。 隔壁3係設成以俯視包圍複數個有機電激發光元件4 的各外周。只要隔壁3係設成以俯視分別包圍有機電激發 光元件4的外周即可，例如，以俯視設在除去設有各有機 電激發光元件4之區域的區域。 在本實施形態中複數個有機電激發光元件4係分別呈 矩陣狀配置（詳細係後述）。隔壁3係設於除去呈矩陣狀配 置之有機電激發光元件4的區域。因此，隔壁3係在支揮 基板2上形成為格子狀。 於支撐基板2上係設定有藉隔壁3與支撐基板2所規 定之複數個凹部5。此凹部5相當於被隔壁3所晝分之區 10 323774 201236106 塊。 «/ 於支標基板2上係設有格子狀之隔壁3，故在本實施 形態中複數個凹部5係俯視配置成矩陣狀。亦即複數個凹 4 5係於列方向X隔開預定之間隔，並且於行方向γ隔開 預定之間隔而排列設置。各凹部5之俯視圖中的形狀係無 特別限定。例如凹部5係就俯視可形成為大致矩形、大致 橢圓形等。在本實施形態_係具有朝長邊方向延伸之長軸、 與朝正交於長軸的短邊方向延伸的短軸，即就俯視設有大 致橢圓形之凹部5。又，在本說明書中上述之列方向X及 行方向Y係正交於支揮基板2之厚度方向z，且互相正交。 此處大致橢圓形」係不僅橢圓形，亦包含互相平行配置 之2條線段的一端間及另一端間以曲線結合的形狀。 隔壁3係包含第1隔壁3a與第2隔壁3b。第1隔壁 3a係就俯視面向有機電激發光元件4之外周中的一部分， 亦即面向位於有機電激發光元件4之短邊方向的外周而設 置。第2隔壁3b係面向除去前述有機電激發光元件4之外 周中的前述一部分之其餘部分，亦即面向位於有機電激發 光元件4之長邊方向的外周而設。 尤其如第1圖、第2圖、第3圖及第5圖所示，有機 電激發光元件4之外周係一部分相接於第1隔壁3a，除去 前述一部分的其餘部分相接於第2隔壁3b。如此地有機電 激發光元件4之外周係被第1隔壁3a與第2隔壁3b包圍。 在本實施形態中隔壁3形成為格子狀，故隔壁3係包 含：朝列方向X直線延伸之複數條隔壁構件、與朝行方向 11 323774 201236106 Y直線延伸之複數條隔壁構件。本實施形態中之隔壁3係 由朝行方向Υ延伸之複數條第1隔壁構件3a、與朝列方向 X延伸之複數條的第2隔壁3b所構成。複數條第1隔壁3a 係分別設於列方向X相鄰之有機電激發光元件4之間。 又如第2圖所示，複數條第2隔壁3b係分別設於行 方向Y相鄰之有機電激發光元件4彼此之間。如此地，藉 由配置隔壁3，而於有機電激發光元件4之列方向χ的一 方及另一方之端面相接地設置有第i隔壁3a。第】隔壁％ 係就俯視包圍有機電激發光元件4之外側的侧面、與底面 構成之角（9 1為銳角之順錐形形狀的隔壁。 如第3圖所示。於有機電激發光元件4之行方向γ的 一方及另一方之端面係相接地設置有第2隔壁第2隔 壁3b係就俯視包圍有機電激發光元件4之外側的側面、與 底面構成之角02為鈍角之倒錐形形狀的隔壁。 又，第1隔壁3a之底面係意指第】隔壁如之外周面 :最靠近支#基板2之平面。又，第！隔壁3a之側面係意 指除去第1隔壁3a之外周面中最遠離支樓基板2之平面 (上表面）與底面之面，亦即，就俯視而言位置成包圍有機 電激發光元件4之外周（輪廓）的面。繼而，第i隔壁如 之側面與第1隔壁3a之底面構成的角Θ1係意指在正交於 第1隔壁3a延伸之方向（在本實施形態中係行方向γ)之 面切斷第1隔壁3a時之截面的角度。 土第2隔壁3b之底面係意指第2隔壁兆之外周面中最 靠近支樓基板2之平面。又，第2隔壁扑之侧面係意指除 323774 12 201236106 二去第2隔壁3b之外周面中最遠離支縣板2之平面（上表 面)一與底面之面，亦即，就俯視而言位置成包圍有機電激發 光疋件4之外周（輪廊）的面。繼而，第2隔壁扑之侧㈣ 第1隔壁如之底面構成的角Θ2係意指在正交於第1隔壁 如延伸之方向（在本實施形態中係列方向χ) 1隔壁3b時之截面的角度。 斲第 在本實施形態中朝行方向Y延伸之複數條第1隔壁3a 2朝列f向x延伸之複數條第2隔壁3b係就俯視而言重 疊。在第1隔壁3a與第2隔壁3b重疊之部位係第i隔壁 3a與第2隔壁3b之中的任一者亦可配置成靠近支樓基板 2在第1隔壁3a與第2隔壁此重疊之部位係以第2隔壁 3b宜配置成較第i隔壁3a更靠近支撑基板之。亦即，在第 1隔壁3a與第2隔壁3b重疊之部位係以前述第2隔壁北 宜設於前述支樓基板2與前述第1隔壁之間。如此地若配 置第1隔壁3a及第2隔壁3b，則如後述，因於第i隔壁 3a上設有導電性薄膜此，故無所形成之導電性薄膜此 在隔壁3上被切斷之虞，相鄰於第i隔壁如之延伸方向（在 本實施形態係行方向Y)之有機電激發光元件4的第2電極 10介由第1隔壁3a上的導電性薄膜1〇a而確實地相接。 角Θ1之角度一般為1〇。至85。，宜為3〇β至6〇。。又， Θ2之角度一般為95。至17〇。，宜為11〇。至135。。 有機電激發光元件4係設於藉由隔壁3而被隔成之區 塊（亦即凹部5)。如本實施形態設有格子狀之隔壁3時， 複數個有機電激發光元件4分別設於每-凹部5。亦即， 323774 13 201236106 複數個有機電激發光元件4係與凹部5同樣地配置成矩陣 狀。複數個有機電激發光元件4係在支撐基板2上，朝列 方向X隔開預定之間隔，並且朝行方向Y亦隔開預定之間 隔而排列設置。 在本實施形態中係設有3種有機電激發光元件4。亦 即，（1)射出紅色光之紅色發光有機電激發光元件4R、（2) 射出綠色光之綠色發光有機電激發光元件4G、及（3)射出 藍色光之藍色發光有機電激發光元件4B。此等3種有機電 激發光元件4(4R、4G、4B)係如第1圖所示，例如將以下 之（I)、（II)、（III)的列朝行方向Y依序反複配置來構成。 (I) 複數個紅色發光有機電激發光元件4R朝列方向X 分別隔開預定之間隔而配置之列。 (II) 複數個綠色發光有機電激發光元件4G朝列方向X 分別隔開預定之間隔而配置之列。 (III) 複數個藍色發光有機電激發光元件4B朝列方向 X分別隔開預定之間隔而配置之列。 又，另一實施形態，除了上述3種有機電激發光元件 外，亦可例如進一步設有射出白色光之有機電激發光元 件。又，藉由設有僅1種有機電激發光元件，亦可實現單 色顯示裝置。 有機電激發光元件4係第1電極6、有機層、第2電 極10從支撐基板側依此順序層合而構成。有機電激發光元 件4係就有機層而言至少具備1層發光層。又，有機電激 發光元件4係除了 1層發光層之外，有時尚依需要進一步 14 323774 201236106 、 具備與發光層相異之層。例如在第1電極6與第2電極ι〇 之間係設有電洞注入層、電洞輸送層、電子阻隔層、電子 •輸送層、及電子注入層等。又，於第】電極6與第2電極 L 10之間係亦有時設有2層以上之發光層。進一步於第i電 極6與第2電極10之間亦有時設有無機層、或含有有機物 與無機物之混合層。 有機電激發光元件4係就由陽極及陰極所構成之一對 電極而§，具備第1電極6與第2電極1〇。第1電極6與 第2電極10中的一方之電極係設為陽極，另一方的電極係 設為陰極。 在本實施形態中就一例而言，說明有關一種有機電激 發光元件4,係將發揮陽極功能之第1電極6、發揮電洞注 入層功旎之第1有機層7、發揮發光層功能之第2有機層 9發揮陰極功能之第2電極1〇依此順序層合於支樓基板 上而構成。 在本實施形態中係設有3種有機電激發光元件4。此 等3種有機電激發光元件4係第2有機層（在本實施形態 中為發光層）9之構成分別相異。紅色發光有機電激發光元 件4R係具備射出紅色光之紅色發光層⑽，綠色發光有機 電激發光元件4G係具備射出綠色光之綠色發光層gG，藍 色發光有機電激發光元件4B係具備射出藍色光之藍色發 光層9B。 在本實施形態中第1電極6係設於每一有機電激發光 元件4。亦即，與有機電激發光元件4同數目之第丨電極6 323774 15 201236106 設於支撐基板2上。第1電極6係對應於有機電激發光元 件4之配置而設，與有機電激發光元件4同樣地配置成矩 陣狀。又，如第2圖、第3圖及第5圖所示，本實施形態 之隔壁3係主要於第1電極6外之區域形成為呈格子狀、 且被覆第1電極6之一部分的周緣部。 發揮電洞注入層功能之第1有機層7係分別設於凹部 5之第1電極6上。此第1有機層7係依需要而按照有機 電激發光元件4之每一種類使其材料或厚度相異而設。 又，從第1有機層7之形成步驟的簡易性觀點，宜以相同 相料、相同厚度形成全部之第1有機層7。 發揮發光層功能之第2有機層9係在凹部5中設於第 1有機層7上。如上所述，發光層係依有機電激發光元件4 之種類而設。因此，紅色發光層9R係設於要設置紅色發光 有機電激發光元件4R之凹部5，綠色發光層9G係設於要 設置綠色發光有機電激發光元件4G之凹部5，藍色發光層 9B係設於要設置藍色發光有機電激發光元件4B之凹部5。 在本實施形態中係遍及要設有複數個有機電激發光元 件4的顯示區域而形成導電性薄膜1 Oa。亦即，導電性薄 膜10a係不僅形成於第2有機層9上，於亦形成為遍及隔 壁3上。此導電性薄膜10a之中，設於第2有機層9上者 於本說明書中稱為第2電極10。 又，第2電極10會有於倒錐形形狀之第2隔壁3b的 端部被切斷之情形。如第3圖及第5圖所示，顯示例如有 就俯視有機電激發光元件4與第2隔壁3b相接之第2隔壁 16 323774 201236106 二 3b的端部第2電極10被切斷之狀態。另外， • 第5圖所示，於順錐形形狀之第1隔壁3a的端部，第2 久電極10未被切斷。如此地形成於第i隔壁如上之導電 1 薄膜10a、與有機電激發光元件4之第2電極1〇係相 形成一體。因此，於列方向X相鄰之有機電激發光元件7 的第2電極10係介由第i隔壁3a上的導電性薄膜他而 相連形成-體。進一步’在本實施形態中第i隔壁％朝行 方向Y延伸而形成，故於行方向γ相鄰之有機電激發光元 件4的第2電極10係介由第i隔壁％上的導電性薄獏“a 而相連形成一體。藉此，介由第！隔壁3a上之導電性薄= l〇a而形成全部之有機電激發光元件的第2電極丨〇相連: 因此，第2電極10發揮於全部之有機電激發光元件4為共 通之電極。 _ ^ 以上之實施形態中隔壁3係被覆第！電極6的周緣部 而連接於支撐基板2而設。另一實施形態而言，於隔壁3 與支樓基板2之間亦可進-步設有絕緣膜。絕緣膜係例如 與隔壁3同樣地形成格子狀，被覆第i電極6的周緣部而 形成。如此之絕緣膜較佳係藉由較隔壁3更顯示親液性之 材料而形成。 以下，一邊參照第7A圖至第15C圖，一邊說明有關 顯示裝置之製造方法。又，A圖係示意地表示放大形成中 途之一個有機電激發光元件之平面圖，B圖係於第1圖之 切斷面線A-A的位置經切斷形成中途之一個有機電激發光 7G件之截面圖，C圖係於第1圖之切斷面線D_D的位置經 323774 17 201236106 切斷形成中途之一個有機電激發光元件之截面圖。又，在 各圖之A圖至C圖中，對應之構件的縮尺係未必互相對應。 (準備支撐基板之步驟） 如第7A圖、第7B圖及第7C圖所示，在本步驟中係 準備形成有第1電極6之支撐基板2。又，本步驟中亦可 藉由從市場取得形成有第1電極6之支撐基板2而準備支 撐基板2之步驟。又’本步驟係亦可包含於支撐基板2上 形成第1電極6之步驟。 將顯示裝置設為主動矩陣型時，可使用預先形成用以 個別驅動複數個有機電激發光元件的電路之基板作為支標 基板2。例如，可使用預先形成有TFT(Thin Film Transistor)及電容器等之基板作為支撐基板。 首先，於已準備之支撐基板2上呈矩陣狀形成複數個 第1電極6。第1電極6係例如於支撐基板2上之一表面 形成導電性薄膜，其係藉由以光微影蝕刻法之遮罩圖型的 形成步驟及使用所形成之遮罩圖型作為遮罩的圖案化步驟 圖案成矩陣狀而形成。例如，亦可將於預定部位形成有開 口之遮罩配置於支撐基板2上，介由此遮罩而於支撐基板 2上之預定部位選擇性堆積導電性材料，而圖案形成第丄 電極6。後述有關第1電極6之材料。 (形成隔壁之步驟） 在本步驟中係形成隔壁3。在本實施形態中隔壁3係 例如（1)藉光微影蝕刻法而使感光性樹脂組成物之層圖案 化，俾形成倒錐形形狀之第2隔壁3b及順錐形形狀之第i 18 323774 201236106 . ㈣3a。具體上係例如可使第1隔壁3a及第2隔心八 別使感光性樹脂組成物之層圖案化來形成，又， …刀 - 雜刻法而使感光性樹脂組成物之層圖案化， L倒錐形形狀之第2隔壁3b ’ ^後，於所形成之倒錐升 的第2搞壁3b中，以感光性樹脂組成物被覆殘料為隔壁 之部分’藉乾式姓刻法而使倒錐形形狀加工成順 而可形成倒錐形形狀之第2隔壁3b及順錐形形狀之第狀i 隔壁3a ^ 、如第8A圖、第8B圖及第3C圖所示，在本實施形態 中首先形成第2隔壁3b。藉由光微影蝕刻法而形成第2隔 壁3b時，首先使感光性樹脂組成物塗佈成膜於支撐基板2 上。感光性樹脂組成物之塗佈方法係可舉例如旋塗法、狹 縫塗佈法等。 使感光性樹脂組成物塗佈成膜於前述支撐基板2之 後，一般進行預烘烤步驟。預烘烤步驟係例如以80。(：至U0 C之溫度加熱支#基板60秒至180秒來進行。藉由此預烘 烤步驟而去除感光性樹脂組成物中之溶劑成分，形成第2 隔壁形成用膜8b。 繼而，於形成有第2隔壁形成用膜8b之支撐基板2 的上方，配置遮光之預定圖案的光罩21b’介由此光罩21b， 進行使第2隔壁形成用膜8b曝光之曝光步驟。第2隔壁形 成用膜8b可含有之感光性樹脂係有正型的感光性樹脂及 負型之感光性樹脂，但在本步驟中係亦可使用任一者的型 之樹脂。 19 323774 201236106 使用正型之感光性樹脂作為第2隔壁形成用膜此可 含有之感光性樹脂時，係在所形成之第2隔壁形成用膜牝 中’主要對應形成第2隔壁3b的部位以外之其餘部位照射 光L又使用負型之感光性樹脂作為感光性樹脂時，係 在第2隔壁形成用膜8b中，對應形成第2隔壁3b的部位 照射光L。 在本步驟中係說明有關使用負型之感光性樹脂作為 第2隔壁形成用膜8b可含有之感光性樹脂之情形。 於支撐基板2之上方配置光罩21b，介由此光罩2沁 而照射光L。藉此，於第2隔壁形成用膜此中，於應形成 第2隔壁3b的部位照射光L。在第8B圖及帛％圖中，被 照射於第2隔壁形成用膜8b之光L係示意性地以^白箭頭 表示。 如第9圖所示，繼而進行顯像步驟。藉此而圖型形成 第2隔壁3b °顯像步驟後，進行後烘烤步驟。後供烤步驟 係例如以20(TC至23(rc之溫度，加熱基板15分至6〇分鐘 而使第2隔壁形成用膜8b硬化以形成第2隔壁3b。如此 地進订後烘烤步驟，以在形成後述之第丨隔壁％時的顯像 步驟中，可防止第2隔壁3b被蝕刻。 在本實施形態中係形成所謂倒錐形形狀之第2隔壁3 b。 第2隔壁3b之侧面與第2隔壁北的底面構成之角02之 角度係藉由適當調整後狀要素，而可難成任意之角度。 如第10圖所示，繼而在本實施形態中係形成第丨隔 壁3a。藉由光微影蝕刻法而形成第1隔壁3a時，首先將 323774 20 201236106 ·. 感光性樹脂組成物塗佈成膜於支撐基板2上。感光性樹脂 組成物之塗佈方法係可舉例如旋塗法、狹縫塗佈法等。 將感光性樹脂組成物塗佈成膜於支撐基板2之後，一 般進行預烘烤步驟。預烘烤步驟係例如以至11〇。〇之 溫度，加熱支撐基板2 60秒至180秒而實施。藉此預烘 烤步驟而去除溶劑成分，形成第1隔壁形成用膜8a。 繼而，於支撐基板2的上方配置遮光預定圖案的光罩 21a，介由此光罩21a，使第i隔壁形成用膜％曝光。於 感光性樹脂係有正型的感光性樹脂及負型之感光性樹脂。 在本步驟中係亦可使用任一者的型之感光性樹脂。使用正 型之感光性樹脂時，係在第i隔壁形成用膜8a中，主要於 應形成第1隔壁3a的部位以外之其餘部位照射光L。又， 使用負型之感光性樹脂時，係於第j隔壁形成用膜化中， 主要於應形成第1隔壁3a的部位照射光L。在本步驟中係 參汲第10圖而說明有關使用正型之感光性樹脂之情形。 如第10A圖、第10B圖及第1〇c圖所示，於支撐基板 2之上方配置光罩21a，介由此光罩21a而照射光l。光[ 係於第1隔壁形成用膜8a中，主要照射於應形成第^隔壁 3a立的部位以外之殘餘部位。在第應圖及第⑽圖中係 不忍性地以空白箭頭表示被照射於第1隔壁形成用膜8a 之光L。 、 像步圖、第11B圖及第_所示，繼而進行顯 像步驟。错此而圖型形成第i隔壁3a。使第“ 膜8a顯像時顯像液會接觸於第2隔壁3b。但，如前所述， 323774 21 201236106 第2隔壁3b係實施有後烘烤步驟，故第2隔壁3b係即使 接觸顯像液亦未被蝕刻。 顯像步驟後，進行後烘烤步驟。後烘烤步驟係例如以 200°C至230°C之溫度，加熱支撐基板2 15分鐘至60分 鐘而使第1隔壁形成用膜8a硬化，形成第1隔壁3a。 在本實施形態中係形成順錐形形狀之第1隔壁3a。第 1隔壁3a之側面與第1隔壁3a的底面構成之角01的角度 係藉由適當調整以下之要素，而可調整成任意之角度。 第1隔壁3a之側面與第1隔壁3a的底面構成之角0 1的角度、第2隔壁3b之側面與第2隔壁3b的底面構成 之角Θ2的角度係主要依使用之感光性樹脂的種類而定。 因此，例如從市場可取得之複數種的感光性樹脂中，藉由 以預定之條件進行曝光步驟及顯像步驟，可適當選擇能形 成順錐形形狀之隔壁3(第1隔壁3a)之材料、或藉由以預 定之條件進行曝光步驟及顯像步驟，而可適當選擇能形成 倒錐形形狀之隔壁3(第2隔壁3b)之材料，只要使用此材 料而形成隔壁即可。 又，藉由調整顯像時間亦可調整隔壁之側面與隔壁之 底面構成的角度。使用負型之感光性樹脂而形成倒錐形形 狀之第2隔壁3b時，一般，愈增長顯像時間，第2隔壁 3b的側面與第2隔壁3b之底面構成的角Θ 2之角度有愈變 大的傾向。 又，藉由調整曝光量亦可調整隔壁之側面與隔壁之底 面構成的角度。使用負型之感光性樹脂而形成倒錐形形狀 22 323774 201236106 : 之第2隔壁3b時，一般，愈減小曝光量，第2隔壁3b的 側面與第2隔壁3b之底面構成的角02之角度有愈變小的 傾向。 藉由調整光罩21b與支樓基板2之距離，亦可調整隔 壁之侧面與隔壁之底面構成的角度。使用負型之感光性樹 脂時’光罩21b與支撐基板2之距離愈減少，形成順錐形 形狀之第1隔壁3a時，一般，第1隔壁3a的侧面與第j 隔壁3a之底面構成的角0 1有愈變大的傾向，而於形成倒 錐形形狀之第2隔壁3b時，一般，第2隔壁3b的側面與 第2隔壁3b之底面構成的角02有愈變小的傾向。 感光性樹脂組成物係一般調配黏結劑樹脂、交聯劑、 光反應起始劑、溶劑、及其他之添加劑而使用。 黏結劑樹脂係預先被聚合之樹脂。黏結劑樹脂之例係 可舉例如自己不具有聚合性之非聚合性黏結劑樹脂、導入 具有聚合性之取代基的聚合性黏結劑樹脂。黏結劑樹脂係 以聚苯乙稀為標準而以凝膠滲透色層分析（GPC)所求取之 重量平均分子量在於5000至400000之範圍。 — 黏結劑樹脂係可舉例如酚樹脂、酚醛清漆樹脂、三聚 氛胺樹脂、丙烯酸樹脂、環氧樹脂、聚酯樹脂等。黏結劑 樹月曰係可單體分別單獨使用或組合2種以上之共聚物來使 用。黏結劑樹脂之比率係相對於上述感光性樹脂組成物之 王固形物，就質量分率一般為5%至90%。 交聯材係藉由照射光而從光聚合起始劑所產生之活 土、酸等而可聚合之化合物。交聯劑係可舉例如具 23 323774 201236106 有聚合性碳-碳不飽和鍵之化合物。交聯材係可於分子内具 有1個聚合性碳-碳不飽和鍵之單官能的化合物亦可具有 2個以上聚合性碳'碳不飽和鍵之2官能以上的多官能化合 物。在上述感光性樹脂組成物中，《聯材係若將黏結劑樹 脂與交聯材之合計量設為謂質量份，則-般為質量 份以上70質量份以下。又，在上述感光性樹脂組成物中光 反應起始劑係若將黏結劑樹脂與交聯材之合計量設為1〇〇 質量份，則一般為1質量份以上3〇質量份以下。 正型感光性樹脂係光之照射部分相對於顯像液而溶 解之樹脂。正型感光性樹脂一般係將樹脂與於光反應下親 水化之化合物複合化來構成。 正型感光性樹脂係可使用酚醛清漆樹脂、聚羥基笨乙 稀、丙稀酸樹脂、甲基丙稀酸樹脂、聚醯亞胺等之具耐藥 品性及密著性的樹脂與光分解性化合物組合之樹脂。 可使用於顯像之顯像液係可舉例如氣化钟水溶液、氫 氧化四曱基銨（TMAH)水溶液等。 如上所述，第1隔壁3a的侧面與第1隔壁3a之底面 構成的角0卜第2隔壁3b的側面與第2隔壁3b之底面構 成的角Θ2主要係由使用之感光性樹脂的種類而定，但可 從市場取得之複數種之感光性樹脂中的許多，係可使用來 作為形成順錐形形狀的隔壁（第1隔壁3a)之材料。又，用 以形成倒錐形形狀之隔壁（第2隔壁3b)的材料之例係可舉 例如日本Zeon股份公司製之材料（ZPN 2464、ZPN 1168) 等。 24 323774 201236106 : 隔壁3之形狀及其配置係依照像素數及解析度等之顯 不裝置的規格、製造容易性等而適當設定。例如隔壁3之 列方向X或行方向γ之寬為至50/zm左右，隔壁3 ’之咼度係0.5#m至左右，相鄰於列方向X或行方向 Y之隔壁3間的間隔，亦即凹部5之列方向X或行方向γ 之寬為10/zm至200 ym左右。又，第！電極6之列方向χ 或行方向Υ之寬分別為lOym至200 // m左右。 (形成有機層之步驟） 在本步驟十係形成有機層。在本實施形態中係在i層 以上的有機層中，藉塗佈法而形成至少1層的有機層。^ 本實施形態中係藉由塗佈法而形成第丨有機層7及第2 機層9。 首先，形成發揮電洞注入層功能之第丨有機層7。如 第12A圖、第12B圖及第12C圖所示，首先將含有成為第 1有機層7之材料的油墨22供給至被隔壁3包圍之區域（凹 部5)。油墨22係考量隔壁3之形狀、成膜步驟之簡易性、 及成膜性等而適宜地藉適當的方法來供給。油墨22係可藉 由例如噴墨印刷法、喷嘴塗佈法、凸版印刷法、凹版印刷 法荨而供給至凹部5。 如第13A圖、第13B圖及第13C圖所示，繼而，固化 所供給之油墨22，形成第1有機層7。 油墨22之固化係可藉由例如自然乾燥、加熱乾燥、 真空乾燥而進行。又，油墨22為含有藉加入能量而聚合之 材料時，於將油墨22供給至凹部5之後，加熱油墨22， 323774 25 201236106 或對油墨22照射光，可使構成油墨22所含有之有機層的 材料聚合。如此地構成有機層之材料聚合，而形成第1有 機層7，對於此第1有機層7上進一步形成第2有機層時 使用的油墨，可使第1有機層7難溶化。 如第14A圖、第14B圖、及第14C圖所示，繼而，形 成發揮發光層功能之第2有機層9。第2有機層9係可與 第1有機層7同樣地形成。亦即，使分別含有成為紅色發 光層9R、綠色發光層9G、藍色發光層9B的材料之3種油 墨，分別供給至被隔壁3包圍的預定區域（凹部5)，進一 步藉由將其固化而形成紅色發光層9R、綠色發光層9G、藍 色發光層9B。 (形成第2電極之步驟） 如第15A圖、第15B圖、及第15C圖所示，繼而，形 成第2電極10。在本實施形態中係在至少設有複數個有機 電激發光元件的顯示區域中，於一面（全面）形成導電性薄 膜1 Oa。例如藉由蒸鍍法於一面形成導電性薄膜1 Oa。如上 所述，此導電性薄膜10a之中，設於第2有機層9上之部 分相當於第2電極10。 如第15C圖所示，第2電極10之厚度薄時，即使於 一面形成導電性薄膜10a，也會在倒錐形形狀的第2隔壁 3b上於其端部有導電性薄膜10a被切斷之情形，因此，會 有有機電激發光元件4之第2電極10與第2隔壁3b上的 導電性薄膜1 Oa被切斷之情形。 如第15B圖所示，在順錐形形狀之第1隔壁3a上係 26 323774 201236106 - 於其侧面（相對於第1隔壁3a之底面構成角之面）上亦 形成導電性薄膜l〇a，故並非於第i隔壁3a之端部切斷第 2電極10,形成為有機電激發光元件4之第2電極1〇與第 1隔壁3a上之導電性_ 10M目連。因此，形成為相鄰於 列方向X之有機電激發光元件4的第2電極丨〇彼此間介 由第1隔壁3a上之導電性薄膜相連。 如此地，若面向有機電激發光元件4之外周中的一部 分而設有順錐形形狀之第丨隔壁3a，則形成為有機電激發 光元件4之第2電極10與第i隔壁如上之導電性薄膜l〇a 相連。因此，即使設有倒錐形形狀之第2隔壁3b，亦可防 止有機電激發光元件4之第2電極1〇在隔壁3的端部被切 斷，可形成遍及複數個有機電激發光元件4上而相連的第 2電極1〇。 如上所述，設有倒錐形形狀之隔壁3(第2隔壁3b)時， 若第2電極10之厚度較薄，則會有在倒錐形形狀之隔壁3 的端部第2電極10被切斷之情形，但藉由設有順錐形形狀 之第1隔壁3a，而非增厚第2電極1〇之厚度至必要以上， 可开> 成將複數個有機電激發光元件4的第2電極1〇彼此予 以相連。 又’在本實施形態中係第1隔壁3a分別朝正交於支 撐基板2之厚度方向Z的第1方向（在本實施形態中係列方 向X)延伸’朝分別正交於厚度方向Z及第1方向（X)之第2 方向（在本實施形態中係行方向γ)隔開預定之間隔配置之 複數條順錐形形狀的隔壁所構成，就俯視第1隔壁如與第 323774 27 201236106 2隔壁3b重疊之部分係第2隔壁3b設於支撐基板2與第工 隔土 3a之間。因此，就俯視第1隔壁如與第2隔壁％ 重疊之部分係第2隔壁3b被第1隔壁3a所覆，亦即第工 隔壁3a露出。若於設有如此之第1隔壁3a的支撐基板2 上之全面形成導電性薄膜l〇a，就俯視第1隔壁3a與第2 隔f 3b重疊之部分係第2隔壁3b被第1隔壁3a所覆，故 著第1隔壁3a的延伸方向，於該第！隔壁仏上形成導 電性薄臈10a相連-體。在本實施形態中係形成為第i隔 壁3a朝行方向γ延伸，故形成為相鄰於行方向γ之有機電 激發光元件4的第2電極1〇彼此間介由第j隔壁％上的 導電性薄膜l〇a相連。藉此，介由第i隔壁3a上之導電性 薄臈10a而形成為全部之有機電激發光元件的第2電極 彼此間相連。因此，第2電極丨〇發揮作為於全部的有機電 激發光元件4為共通之電極的功能。 在本實施形態中係倒錐形形狀之第2隔壁3b面向有 機電激發光元件4而配置成包圍有機電激發光元件4，故 被供給至被隔壁3包圍之區域（凹部5)之油墨22係藉由毛 細管現象，而成為被填充成被吸入於第丨電極16與第2 隔壁3b連接的部分附近n細狀的部位之狀態。在維持 於此狀L 了藉由使油墨之溶劑蒸發，而於第1電極6與 隔壁3連接的部分附近之前端細狀的部位亦形成有機層。 藉由此而可得到均一厚度的有機層。 在連接順錐形形狀之第！電極6與第i隔壁加的部 位中被供給至被隔壁3包圍之區域（凹部5)之油墨22會有 323774 28 201236106 被第1隔壁3a撥開並乾燥之情形。但，面向有機電激發光 元件4而以包圍有機電激發光元件4之一部分的方式設有 倒錐形形狀的第2隔壁3b，藉此至少有機層全體係可得到 較於只被順錐形形狀之隔壁包圍的凹部形成有機層時更平 坦且均一的厚度之有機層。 又，在凹部5中，有機層之厚度更薄的部位係非常依 存於俯視之凹部5的形狀。例如，於只被順錐形形狀之隔 壁包圍的凹部形成具有朝垂直於支撐基板之厚度方向的預 定方向延伸之形狀的有機電激發光元件時，亦即，如本實 施形態，形成朝行方向Y延伸之有機電激發光元件時，被 供給至凹部之油墨係有集中於長邊方向（行方向Y)之一端 及另一端之任一者，或短邊方向（列方向X)的中央部之傾 向。此情形時，有機層係於長邊方向（行方向Y)之一端側 及另一端側中的任一者之厚度變更薄，或於短邊方向（列方 向X)之一端側及另一端側之厚度變更薄之傾向。 如此地，於朝預定方向延伸之有機電激發光元件時， 如本實施形態，第1隔壁3a係宜配置成：就俯視面向有機 電激發光元件4之短邊方向（列方向X)的一方及另一方的 端面，亦即，配置成包圍有機電激發光元件之短邊方向的 直線外圍（面向外周）之側面就俯視朝長邊方向直線延伸， 第2隔壁3b係宜配置成：面向有機電激發光元件4之長邊 方向（行方向Y)的一方及另一方的端面，亦即，宜配置成 包圍有機電激發光元件之長邊方向的圓5瓜狀外圍（面向外 周）之侧面就俯視朝短邊方向圓弧狀地延伸。若如此地配置 29 323774 201236106 第2隔壁3b，供給至凹部5之油墨22係於面向倒錐形形 狀之第2隔壁3b的側面之長邊方向（行方向Y)的一端側及 另一端側之前端細狀部位藉毛細管現象拉近，在第2隔壁 3b之侧面被固定而成為薄膜，故可得到較於只被順錐形形 狀之隔壁包圍的凹部所形成之有機層時更平坦且均一的厚 度之有機層。 又若第1隔壁3a係面向有機電激發光元件4之短邊 方向（列方向X)的一方及另一方的端面而配置，第2隔壁 3b係面向有機電激發光元件4之長邊方向（行方向Y)的一方 及另一方的端面而配置，則就俯視有第2電極10被切斷之 虞係長邊方向（行方向Y)之一端側與另一端側（短邊），而第 2電極10係在短邊方向（列方向X)之一端側與另一端側（長 邊）與隔壁3上之導電性薄膜10a連接。若比較如此之本實 施形態、與第2電極10在短邊方向（列方向X)之一端側與 另一端側被切斷之形態，則在與隔壁3上之導電性薄膜10a 間被切斷的區域係本實施形態之有機電激發光元件4者少， 在隔壁3上導電性薄膜10a —體構成的區域係本實施形態 之有機電激發光元件4者變多，故可減少配線電阻。 〈有機電激發光元件之構成〉 在以下，更詳細說明有關有機電激發光元件之構成。 有機電激發光元件係至少具有一層之發光層作為有機層。 有機電激發光元件係如上述，進一步具備例如電洞注入 層、電洞輸送層、電子阻隔層、電洞阻隔層、電子輸送層、 及電子注入層等預定之層。 30 323774 201236106 • 本實施形態之有機電激發光元件的可採取之層構成 之一例表示於以下。 a) 陽極/發光層/陰極 b) 陽極/電洞注入層/發光層/陰極 c) 陽極/電洞注入層/發光層/電子注入層/陰極 d) 陽極/電洞注入層/發光層/電子輪送層/陰極 e) 陽極/電洞注入層/發光層/電子輸送層/電子注入層/陰 極 f) 陽極/電洞輸送層/發光層/陰極 g) 陽極/電洞輸送層/發光層/電子注入層/陰極 h) 陽極/電洞輸送層/發光層/電子輸送層/陰極 i) 陽極/電洞輸送層/發光層/電子輸送層/電子注入層/陰 極 j) 陽極/電洞注入層/電洞輸送層/發光層/陰極 k) 陽極/電洞注入層/電洞輸送層/發光層/電子注入層/陰 極 l) 1¼極/電洞注入層/電洞輸送層/發光層/電子輸送層/险 極 m) 陽極/電洞注入層/電洞輸送層/發光層/電子輸送層/電 子注入層/陰極 h)陽極/發光層/電子注入層/陰極 〇)陽極/發光層/電子輸送層/陰極 P)陽極/發光層/電子輸送層/電子注入層/陰極 (此處，記號「/」係表示挾住記號Γ/」之各層鄰接而層合）。 323774 31 201236106 以下相同） &在上述實施形態中係說明有關第1電極6發揮陽極功 能’第2電極10發揮陰極功能之有機電激發光元件4。在 此形，中係例如上述a)至p)之各構成要素係從最左侧所 示之陽極依序層合於支樓基板2上。又，第1電極6發揮 陰極功能，第2電極1〇發揮陽極功能之有機電激發光元件 4中例如上述a)至P)之層構成的各構成要素係從最右側所 示之陰極依序層合於支撐基板2上。 〈支撐基板〉 於支撐基板2上係在製造有機電激發光元件4之步驟 中適且使用無化學性變化者，例如可使用玻璃、塑膠、 高分子薄膜、切基板、以及層合此等之基板。 〈陽極〉 從發光層所放射之光經過陽極而射出至外界之構成的 有機電激七光元件時，於陽極係可使用顯示光穿透性之電 極。顯不光穿透性之電極係可使用金屬氧化物、金屬硫化 物及金屬等之薄膜，可適宜使用導電度及光穿透率高者。 八體上係、可使用由氧化銦、氧化辞、氧化錫、姻锡氧化 物（Indium Tin 〇Υι·Ηω · ττη、… . xide . ITO)、銦鋅氧化物（indium Zinc201236106 VI. Description of the Invention: TECHNICAL FIELD The present invention relates to a display device and a method of fabricating the same. [Prior Art] Various devices having different configurations or principles are provided in the display device. One of them is a display device using an organic electroluminescence element ( 卬rganic electroluminescent element) for a light source of a pixel. The display device includes a support substrate and a plurality of organic electroluminescence elements provided on the support substrate. A partition wall that partitions the pixel region is provided on the support substrate, and the plurality of organic electroluminescent elements are arranged in a line that is partitioned by the partition walls. Each of the organic electroluminescence elements is formed by laminating the first electrode, the organic layer, and the second electrode from the support substrate side in the above-described order. The above organic layer can be formed by, for example, a coating method. A method of forming the organic layer 18 will be described with reference to FIGS. 16a, 16B, 16C, and 16D. 16A, 16B, 16c and 16D are diagrams for explaining the manufacturing steps of the display device. As shown in Fig. 16A, first, the second electrode 16 and the partition wall 13 are formed on the support substrate 12. Then, in the region (concave portion) 15 surrounded by the partition wall 13, the ink 17 having the material of the organic layer 18 is supplied from the nozzle located above. As shown in Fig. 16B, the supplied ink π is accommodated in the region 15 surrounded by the partition wall W. As shown in Fig. 16C, the organic layer 18 is formed by vaporizing the solvent component 323774 4 201236106 of the ink 17 thereafter. As shown in Fig. 16A, the second electrode 19 is formed next. The second electrode 19 is integrally extended, for example, over a plurality of organic electroluminescent elements, and is provided as an electrode common to a plurality of organic electroluminescent elements. For example, an extended conductive film is formed integrally on the partition 13 interposed between adjacent organic electroluminescent elements, and a plurality of organic electroluminescent elements are formed to form a connected second electrode. 19. The second electrode 19, that is, the conductive film is formed by, for example, a vacuum deposition method. Further, in the aspect shown in Fig. 16B, when the liquid repellency is displayed on the ink 17 in the partition wall 13, the ink 17 supplied to the specific concave portion 15 passes over the partition wall 13 and flows out to the adjacent side along the surface thereof. The case of the recess 15. In order to prevent such an ink from flowing out, a partition wall 13 which exhibits liquid repellency to some extent is generally provided on the support substrate 12. However, when the liquid repellency is displayed on the partition wall 13, the ink 17 supplied to the concave portion 15 is discharged by the partition wall 13 and vaporized to form a film (organic layer 18). Therefore, there is a case where the organic layer 18 having a non-uniform thickness is formed. For example, the thickness of the concave portion 15 may be such that the organic layer 18 is in contact with a predetermined portion of the partition wall 13 (that is, the peripheral portion of the organic layer 18), and the organic layer is located in the vicinity of the central portion of the concave portion 15. The thickness of the central portion of the 18 is formed to be thin. As a result, the electric resistance of the peripheral portion of the organic layer 18 is lower than that of the central portion, and when the organic electroluminescent device is driven, current concentrates and flows at the peripheral portion of the organic layer 18, and the central portion of the organic layer 18 becomes darker than the peripheral portion. The situation. On the other hand, since the peripheral portion of the organic layer 18 does not have a desired thickness of 5,323,774,2012,36,106 layers, the peripheral portion of the organic layer 18 may not be illuminated as intended. In order to solve such a problem, there is a display device having a partition wall of a so-called inverted tapered shape. The schematic diagrams are shown in Figs. 17A, 17B, and 17C. 17A, 17B and 17C are diagrams for explaining the manufacturing steps of the display device. As shown in FIGS. 17A, 17B, and 17C, the partition wall 13 of the inverted tapered shape is cut away from the support substrate 12 (first electrode 16) when cut in a direction orthogonal to the extending direction. The broadening is formed. Therefore, in the vicinity of the portion where the side surface of the partition wall 13 and the first partition wall 16 are in contact with each other, a region having a tapered tip end is formed. When the ink is supplied to the region 15 surrounded by the partition wall 13 having the inverted tapered shape, the ink contacting the side surface of the partition wall 13 is filled into a region which is tapered by the tip end due to the capillary phenomenon. When the solvent component of the ink is vaporized while maintaining this state, the organic layer 18 is formed in the vicinity of the portion where the first electrode 16 and the partition wall 13 are in contact with each other. As shown in FIG. 17B, by providing the partition wall 13 having a reverse tapered shape, even if the partition 13 for displaying liquid repellency is provided, the thickness of the peripheral portion of the organic layer 18 can be prevented from being thinned (for example, refer to the patent document) 1). (Prior Art Document) (Patent Document) Patent Document 1: JP-A-2007-227289 SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) The present invention is provided as shown in Figs. 17A, 17B, and 17C. Cone 6 323774 201236106 On the substrate of the partition 13 of the shape of the shape, when the second electrode 19 shared by a plurality of organic electroluminescent elements is integrally formed by vacuum evaporation, and the second electrode 19 is shared by a plurality of organic electroluminescent elements, When the thickness of the second electrode 19 is thin as shown in Fig. 17C, the second electrode 19 may be cut at the end of the partition wall. As a result, when the display device is driven, there is a case where the organic electroluminescent element which is not illuminated can be formed as expected to supply electric power. Accordingly, it is an object of the present invention to provide a display device in which a plurality of organic electroluminescent elements can be connected to a second electrode in a display device having a partition wall having an inverted tapered shape. (Means for Solving the Problem) The present invention provides the following [1] to [5]. [1] A display device comprising: a support substrate, a plurality of organic electroluminescence elements provided on the support substrate, and each of the thickness directions of the support substrate surrounding the organic electroluminescence element; a partition wall provided in a peripheral manner; the partition wall having: a first partition wall provided to a part of the outer circumference; and a second partition wall provided to face a remaining portion of the outer circumference of the outer circumference; the first partition wall A partition wall having a tapered shape in which an angle formed by a side surface and a bottom surface of the outer circumference is an acute angle, and the second partition wall surrounds a partition wall of an inverted cone shape in which an angle formed by a side surface and a bottom surface of the outer circumference is an obtuse angle. [2] The display device according to [1], wherein the first partition wall extends in a first direction orthogonal to a thickness direction of the support substrate, and 7 323774 201236106 is orthogonal to the thickness direction. And a plurality of partition members that are disposed at intervals of the second direction of the second direction, wherein Q is spaced apart from the support substrate and the first portion of the partition wall 2 that is overlapped with the second partition wall and the second partition wall [3] The display device according to [1], wherein the organic electro-active excitation ram has a shape extending toward a thickness orthogonal to the support substrate, m The first partition wall is disposed so as to surround one of the short sides of the organic electroluminescence light and the other outer circumference, and the second partition wall is disposed to surround one of the long sides of the organic electroluminescence light and the other one Outer week. (4) The display device according to the item [1], wherein the partition wall and the second partition wall are each formed by patterning the photosensitive tree-slit material. The display device according to any one of (1) to [4], comprising: a step of forming a partition wall on the support substrate; and forming a step on the support substrate The plurality of organic electroluminescent elements are stepped in the step of forming the partition walls, and are patterned by the illuminating resin composition, and are divided into the partition walls of the i-th partition wall. According to the present invention, it is possible to realize a display having a second electrode connected to a plurality of organic electroluminescent elements in a 323774 8 201236106 or display device having a partition wall having an inverted tapered shape. Device. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Further, the drawings are not intended to limit the scope of the invention, and schematically show the configuration of the first element A J and the arrangement. The present invention is not limited to the following description, and each constituent element can be appropriately changed without departing from the scope of the invention. In the drawings used in the following description, the same constituent elements are denoted by the same reference numerals, and the description of the repetition is omitted. Further, the configuration of the configuration diagram example of the embodiment of the present invention is not necessarily manufactured or used. The display device of the present invention includes: a support substrate, a plurality of organic electroluminescence elements provided on the support substrate, and each of the thickness directions z of the support substrate surrounding the organic electroluminescence element; a partition wall provided in a manner of "outside view"), and a partition wall having: a first partition wall provided to a part of the outer circumference; and a second partition wall provided to face the remaining portion of the outer portion The first partition wall is a partition wall of a tapered shape in which an angle formed by a side surface and an outer surface of the outer circumference is an acute angle, and the second partition wall surrounds a partition wall of a reverse tapered shape in which the angle formed by the side surface of the outer circumference and the bottom surface is a pure angle. The present invention is applied to a display device in which respective second electrodes of a plurality of organic electroluminescent devices are connected. In the present embodiment, such a display device describes a display device relating to the active matrix drive (4) as an example. <Configuration of Display Device> 323774 9 201236106 1 to 6 are the first to explain the configuration of the display device. The $1 diagram shows a cross-sectional view of a part of the display device 1 of the present embodiment. Fig. 2 is a cross-sectional view schematically showing a display device which cuts off the position of the cut surface line A-A which is not shown in Fig. 1. Fig. 3 is a cross-sectional view schematically showing a display device in which the position of the cut surface line B-B shown in Fig. 1 is cut. Fig. 4 is a cross-sectional view schematically showing a display device for amplifying the position of the cut surface line C-C shown in Fig. 1. Fig. 5 is a cross-sectional view schematically showing a display device in which the position of the cut surface line D-D shown in Fig. 1 is cut. Fig. 6 is a cross-sectional view schematically showing a display device in which the position of the cut surface line E-E shown in Fig. 1 is cut. As shown in FIG. 1 , the display device 1 mainly includes a support substrate 2 , a partition wall 3 on which the predetermined block is divided on the support substrate 2 , and a plurality of blocks disposed on the partition wall 3 . Electromechanical excitation of the optical element 4. The partition 3 is provided so as to surround each of the outer circumferences of the plurality of organic electroluminescent elements 4 in plan view. The partition walls 3 may be provided so as to surround the outer periphery of the organic electroluminescent element 4 in plan view, and for example, in a region in which the regions in which the respective organic electroluminescent elements 4 are provided are removed in plan view. In the present embodiment, the plurality of organic electroluminescent elements 4 are arranged in a matrix (details will be described later). The partition 3 is provided in a region where the organic electroluminescent element 4 arranged in a matrix is removed. Therefore, the partition walls 3 are formed in a lattice shape on the support substrate 2. A plurality of recesses 5 defined by the partition walls 3 and the support substrate 2 are provided on the support substrate 2. This recess 5 corresponds to a block that is divided by the partition 3 10 323774 201236106. «/ The grid-shaped partition wall 3 is provided on the support substrate 2. Therefore, in the present embodiment, the plurality of recesses 5 are arranged in a matrix shape in plan view. That is, a plurality of recesses 45 are arranged at a predetermined interval in the column direction X, and are arranged in a row at a predetermined interval in the row direction γ. The shape in the plan view of each recess 5 is not particularly limited. For example, the recessed portion 5 may be formed in a substantially rectangular shape, a substantially elliptical shape or the like in plan view. In the present embodiment, the long axis extending in the longitudinal direction and the short axis extending in the direction orthogonal to the long axis, that is, the concave portion 5 having a substantially elliptical shape is provided in plan view. Further, in the present specification, the above-described column direction X and the row direction Y are orthogonal to the thickness direction z of the support substrate 2, and are orthogonal to each other. Here, the substantially elliptical shape is not only elliptical, but also includes a shape in which one end of the two line segments arranged in parallel with each other and the other end are curved. The partition 3 includes a first partition 3a and a second partition 3b. The first partition wall 3a is provided so as to face a part of the outer circumference of the organic electroluminescence element 4 in a plan view, that is, to face the outer circumference of the organic electroluminescence element 4 in the short-side direction. The second partition wall 3b faces the remaining portion of the outer periphery of the organic electroluminescent device 4, that is, the outer periphery of the organic electroluminescent device 4 in the longitudinal direction. In particular, as shown in FIG. 1, FIG. 2, FIG. 3, and FIG. 5, a part of the outer periphery of the organic electroluminescence element 4 is in contact with the first partition 3a, and the remaining part of the part is removed from the second partition. 3b. In this way, the outer periphery of the organic electroluminescence element 4 is surrounded by the first partition 3a and the second partition 3b. In the present embodiment, the partition wall 3 is formed in a lattice shape. Therefore, the partition wall 3 includes a plurality of partition wall members extending linearly in the row direction X and a plurality of partition members extending linearly in the row direction 11 323774 201236106 Y. The partition wall 3 in the present embodiment is composed of a plurality of first partition wall members 3a extending in the row direction and a plurality of second partition walls 3b extending in the row direction X. The plurality of first partition walls 3a are provided between the organic electroluminescent elements 4 adjacent in the column direction X. Further, as shown in Fig. 2, a plurality of second partition walls 3b are provided between the organic electroluminescent elements 4 adjacent to each other in the row direction Y. In this manner, by arranging the partition walls 3, the i-th partition walls 3a are provided in contact with one end and the other end faces of the organic electroluminescence element 4 in the row direction. The partition wall % is a plan view of the side surface which surrounds the outer side of the organic electroluminescence element 4 and the bottom surface of the organic electroluminescence element 4 (9 1 is an acute-angled partition wall of a tapered shape. As shown in Fig. 3, the organic electroluminescence element is used. The second partition wall 3b is provided with the second partition wall and the other end surface of the fourth partition wall γ. The second partition wall 3b is a side surface that surrounds the outer surface of the organic electroluminescence element 4 in a plan view, and the corner 02 formed on the bottom surface is an obtuse angle. Further, the bottom surface of the first partition wall 3a means the first partition wall such as the outer peripheral surface: the plane closest to the support substrate 2. Further, the side surface of the third partition wall 3a means that the first partition wall 3a is removed. The surface of the outer peripheral surface that is farthest from the plane (upper surface) and the bottom surface of the support substrate 2, that is, the surface that surrounds the outer circumference (contour) of the organic electroluminescent element 4 in plan view. Then, the i-th partition The corner 1 formed by the side surface and the bottom surface of the first partition 3a means a section when the first partition 3a is cut in a direction orthogonal to the direction in which the first partition 3a extends (the direction γ in the present embodiment). The angle of the bottom of the second partition 3b means the second partition The plane of the circumference is closest to the plane of the support substrate 2. Further, the side of the second partition wall means the plane (upper surface) farthest from the branch plate 2 except the 323774 12 201236106 2 to the second partition 3b. The surface of the bottom surface, that is, the surface that surrounds the outer circumference (the corridor) of the organic electroluminescence excitation element 4 in plan view. Then, the side of the second partition wall (four) the corner of the first partition wall such as the bottom surface 2 It means the angle of the cross section orthogonal to the direction in which the first partition wall extends (in the series direction in the present embodiment) 1 partition wall 3b. 斲 In the present embodiment, the plurality of strips extending in the row direction Y are the first The plurality of second partition walls 3b extending toward the row f to the row f are overlapped in a plan view. The portion where the first partition wall 3a and the second partition wall 3b overlap each other is the i-th partition 3a and the second partition 3b. Alternatively, the second partition wall 3b may be disposed closer to the support substrate than the i-th partition 3a in the portion where the first partition 3a and the second partition overlap the branch wall 2, that is, in the first stage. The portion where the partition 3a overlaps the second partition 3b is such that the second partition wall north is preferably provided on the branch substrate 2 and the first When the first partition wall 3a and the second partition wall 3b are disposed in this manner, as will be described later, since the conductive film is provided on the i-th partition 3a, the conductive film which is not formed is on the partition wall 3. After being cut, the second electrode 10 of the organic electroluminescent device 4 adjacent to the i-th wall in the extending direction (in the direction Y of the present embodiment) is passed through the conductive film 1 on the first partition 3a. 〇a and surely meet. The angle of the corner Θ 1 is generally 1 〇 to 85., preferably 3 〇 β to 6 〇. Also, the angle of Θ 2 is generally 95. to 17 〇., preferably 11 〇. The organic electroluminescence element 4 is provided in a block (i.e., the recess 5) partitioned by the partition wall 3. When the lattice-shaped partition walls 3 are provided in the present embodiment, a plurality of organic electroluminescent elements 4 are provided in each of the concave portions 5. That is, 323774 13 201236106 The plurality of organic electroluminescent elements 4 are arranged in a matrix like the concave portion 5. The plurality of organic electroluminescent elements 4 are arranged on the support substrate 2 at a predetermined interval in the column direction X, and are arranged in the row direction Y with a predetermined interval therebetween. In the present embodiment, three types of organic electroluminescent elements 4 are provided. That is, (1) a red light-emitting organic electroluminescence element 4R that emits red light, (2) a green light-emitting organic electroluminescence element 4G that emits green light, and (3) a blue light-emitting organic electric excitation light that emits blue light. Element 4B. As shown in Fig. 1, the three types of organic electroluminescent devices 4 (4R, 4G, and 4B) are arranged in the order of the following (I), (II), and (III) in the row direction Y. Come to form. (I) A plurality of red light-emitting organic electroluminescent elements 4R are arranged in a row at predetermined intervals in the column direction X. (II) A plurality of green light-emitting organic electroluminescent elements 4G are arranged in a row at predetermined intervals in the column direction X. (III) A plurality of blue light-emitting organic electroluminescent elements 4B are arranged in a row at predetermined intervals in the column direction X. Further, in another embodiment, in addition to the above-described three kinds of organic electroluminescence elements, for example, an organic electroluminescence element that emits white light may be further provided. Further, a single color display device can be realized by providing only one type of organic electroluminescent device. The organic electroluminescence element 4 is composed of a first electrode 6, an organic layer, and a second electrode 10 which are laminated in this order from the support substrate side. The organic electroluminescence element 4 has at least one light-emitting layer for the organic layer. Further, in addition to the one-layer light-emitting layer, the organic electroluminescent element 4 has a layer which is different from the light-emitting layer in accordance with the need of further 341774774 201236106. For example, a hole injection layer, a hole transport layer, an electron blocking layer, an electron transport layer, an electron injection layer, and the like are provided between the first electrode 6 and the second electrode ι. Further, two or more light-emitting layers may be provided between the first electrode 6 and the second electrode L10. Further, an inorganic layer or a mixed layer of an organic substance and an inorganic substance may be provided between the i-th electrode 6 and the second electrode 10. The organic electroluminescence element 4 is composed of an anode and a cathode, and includes a first electrode 6 and a second electrode 1''. One of the first electrode 6 and the second electrode 10 is an anode, and the other electrode is a cathode. In the present embodiment, an organic electroluminescence device 4 is described as an example in which the first electrode 6 that functions as an anode and the first organic layer 7 that functions as a hole injection layer are used to function as a light-emitting layer. The second electrode 1 having the cathode function of the second organic layer 9 is laminated on the branch substrate in this order. In the present embodiment, three types of organic electroluminescent elements 4 are provided. The three organic electroluminescent devices 4 are different in the configuration of the second organic layer (in the present embodiment, the luminescent layer). The red light-emitting organic electroluminescence element 4R includes a red light-emitting layer (10) that emits red light, the green light-emitting organic light-emitting element 4G includes a green light-emitting layer gG that emits green light, and the blue light-emitting organic light-emitting element 4B is provided with an emission. Blue light blue light emitting layer 9B. In the present embodiment, the first electrode 6 is provided for each of the organic electroluminescent elements 4. That is, the same number of the second electrodes 6 323774 15 201236106 as the organic electroluminescent element 4 are provided on the support substrate 2. The first electrode 6 is provided in accordance with the arrangement of the organic electroluminescence element 4, and is arranged in a matrix shape in the same manner as the organic electroluminescence element 4. Further, as shown in FIG. 2, FIG. 3, and FIG. 5, the partition wall 3 of the present embodiment is formed in a lattice shape in a region other than the first electrode 6, and covers a peripheral portion of a portion of the first electrode 6. . The first organic layer 7 which functions as a hole injection layer is provided on the first electrode 6 of the concave portion 5, respectively. The first organic layer 7 is provided in accordance with each material of the organic electroluminescent device 4 as needed. Further, from the viewpoint of the simplicity of the step of forming the first organic layer 7, it is preferable to form all of the first organic layers 7 in the same phase and in the same thickness. The second organic layer 9 which functions as a light-emitting layer is provided on the first organic layer 7 in the concave portion 5. As described above, the light-emitting layer is provided in accordance with the type of the organic electroluminescent element 4. Therefore, the red light-emitting layer 9R is provided in the concave portion 5 where the red light-emitting organic electroluminescent light element 4R is to be disposed, and the green light-emitting layer 9G is disposed in the concave portion 5 where the green light-emitting organic electroluminescent light element 4G is to be disposed, and the blue light-emitting layer 9B is It is provided in the recessed part 5 in which the blue light-emitting organic electroluminescent element 4B is to be provided. In the present embodiment, the conductive film 10a is formed over the display region where a plurality of organic electroluminescent elements 4 are to be provided. That is, the conductive thin film 10a is formed not only on the second organic layer 9, but also over the partition 3. Among the conductive thin films 10a, the second organic layer 9 is referred to as the second electrode 10 in the present specification. Further, the second electrode 10 may be cut at the end of the second partition wall 3b having a reverse tapered shape. As shown in FIG. 3 and FIG. 5, for example, the second electrode 10 of the end portion of the second partition wall 16 323774 201236106 2b that is in contact with the second partition wall 3b in plan view is cut off. . Further, in Fig. 5, the second permanent electrode 10 is not cut at the end portion of the first partition wall 3a having a tapered shape. The conductive film 1a formed on the ith spacer as described above is integrally formed with the second electrode 1 of the organic electroluminescent device 4. Therefore, the second electrode 10 of the organic electroluminescence element 7 adjacent to the column direction X is connected to form a body via the conductive film on the i-th partition 3a. Further, in the present embodiment, the i-th partition wall % is formed to extend in the row direction Y, so that the second electrode 10 of the organic electroluminescence element 4 adjacent in the row direction γ is thinly conductive via the i-th partition wall %貘"a is connected to form an integral body. Thereby, the second electrode 形成 which forms all of the organic electroluminescent elements via the thin conductive layer of the first partition 3a is connected to each other: Therefore, the second electrode 10 is used. The organic electroluminescence element 4 is a common electrode. In the above embodiment, the partition 3 is provided to cover the peripheral portion of the electrode electrode 6 and is connected to the support substrate 2. In another embodiment, the partition wall is provided. 3, an insulating film may be further provided between the branch substrate 2 and the insulating substrate. The insulating film is formed in a lattice shape in the same manner as the partition 3, and is formed by covering the peripheral edge portion of the i-th electrode 6. Such an insulating film is preferably used. It is formed of a material which exhibits lyophilicity more than the partition wall 3. Hereinafter, a method of manufacturing the display device will be described with reference to Figs. 7A to 15C. Further, Fig. A schematically shows an organic battery in the middle of enlargement. Plan view of the excitation element, B-picture A cross-sectional view of a piece of organic electroluminescence light 7G in the middle of the cut surface line AA of Fig. 1 is cut, and the C picture is cut at the position of the cut surface line D_D of Fig. 1 by 323774 17 201236106 A cross-sectional view of one of the organic electroluminescent elements in the middle. Further, in the drawings A to C of the respective figures, the scales of the corresponding members do not necessarily correspond to each other. (Steps of preparing the supporting substrate) As shown in Figs. 7A and 7B As shown in Fig. 7C, in this step, the support substrate 2 on which the first electrode 6 is formed is prepared. Further, in this step, the support substrate can be prepared by obtaining the support substrate 2 on which the first electrode 6 is formed from the market. Step 2: This step may also include the step of forming the first electrode 6 on the support substrate 2. When the display device is set to the active matrix type, a plurality of organic electroluminescent elements may be formed in advance to individually drive the plurality of organic electroluminescent elements. A substrate of the circuit is used as the support substrate 2. For example, a substrate on which a TFT (Thin Film Transistor), a capacitor, or the like is formed in advance may be used as the support substrate. First, a plurality of first ones are formed in a matrix on the prepared support substrate 2. Electrode 6 The first electrode 6 is formed, for example, on a surface of the support substrate 2 to form a conductive film by a step of forming a mask pattern by photolithography and a mask pattern formed by using the mask pattern as a mask. The patterning step is formed in a matrix. For example, a mask having an opening formed at a predetermined portion may be disposed on the support substrate 2, and the conductive layer may be selectively deposited on a predetermined portion of the support substrate 2 by the mask. The material is patterned to form the second electrode 6. The material of the first electrode 6 will be described later. (Step of forming the partition wall) In this step, the partition wall 3 is formed. In the present embodiment, the partition 3 is, for example, (1) light lithography. The layer of the photosensitive resin composition is patterned by an etching method, and the second partition 3b having a reverse tapered shape and the i- 18 323774 201236106 having a tapered shape are formed. (4) 3a. Specifically, for example, the first partition wall 3a and the second partition can be formed by patterning a layer of the photosensitive resin composition, and the layer of the photosensitive resin composition can be patterned by a knife-to-aliasing method. After the second partition wall 3b' of the inverted tapered shape, the portion of the second wall 3b that is formed by the inverted cone is covered with the photosensitive resin composition as the partition wall. The inverted tapered shape is processed into a second partition 3b which is formed into an inverted tapered shape, and a first i-shaped partition 3a of the tapered shape, as shown in FIGS. 8A, 8B and 3C, in this embodiment In the form, the second partition 3b is first formed. When the second partition 3b is formed by photolithography, the photosensitive resin composition is first applied onto the support substrate 2. The coating method of the photosensitive resin composition may, for example, be a spin coating method or a slit coating method. After the photosensitive resin composition is applied to the support substrate 2, a prebaking step is generally performed. The prebaking step is, for example, 80. (The temperature is heated to the temperature of the U0 C for 60 seconds to 180 seconds. The solvent component in the photosensitive resin composition is removed by the prebaking step to form the second partition forming film 8b. An exposure step of exposing the second partition wall forming film 8b to the upper surface of the support substrate 2 on which the second partition wall forming film 8b is formed is disposed, and the photomask 21b is placed in the mask 21b. The second partition wall is exposed. The photosensitive resin which can be contained in the film for formation 8b is a positive photosensitive resin and a negative photosensitive resin. However, in this step, any type of resin may be used. 19 323774 201236106 Using a positive type When the photosensitive resin is used as the film for forming the second partition wall, the second partition wall forming film ' is formed to illuminate the light other than the portion where the second partition 3b is formed. When a negative-type photosensitive resin is used as the photosensitive resin, the second partition wall forming film 8b is irradiated with light L corresponding to the portion where the second partition 3b is formed. In this step, a negative-type photosensitive resin is used. As the second In the case where the film forming film 8b can contain the photosensitive resin, the photomask 21b is placed above the support substrate 2, and the light L is irradiated by the mask 2, whereby the film for forming the second partition wall is used. The light L is irradiated to the portion where the second partition 3b is to be formed. In the eighth and fourth views, the light L that is irradiated onto the second partition forming film 8b is schematically indicated by a white arrow. As shown, the development step is carried out. The patterning step is followed by the formation of the second partition 3b development step, followed by the post-baking step. The post-bake step is, for example, 20 (TC to 23 (rc temperature, heating the substrate). The second partition wall forming film 8b is cured to form the second partition wall 3b in 15 minutes to 6 minutes. The post-binding baking step is prevented in the developing step in forming the second partition wall to be described later. The second partition wall 3b is etched. In the present embodiment, the second partition wall 3b having a reverse tapered shape is formed. The angle of the corner 02 formed by the side surface of the second partition wall 3b and the bottom surface of the second partition wall is appropriately adjusted. The rear element can be difficult to form an arbitrary angle. As shown in Fig. 10, it is then in the embodiment. The first partition wall. 3A Shu. By photolithography etching to form a first partition wall 3a, first 32377420 201 236 106 ·. The photosensitive resin composition is applied onto the support substrate 2 by coating. The coating method of the photosensitive resin composition may, for example, be a spin coating method or a slit coating method. After the photosensitive resin composition is applied to the support substrate 2, a prebaking step is generally performed. The prebaking step is, for example, up to 11 Torr. The temperature of the crucible is heated and the support substrate 2 is heated for 60 seconds to 180 seconds. By this pre-baking step, the solvent component is removed to form the first partition wall forming film 8a. Then, the photomask 21a having a predetermined pattern of light shielding is disposed above the support substrate 2, and the mask for forming the i-th partition wall is exposed to the mask 21a. The photosensitive resin is a positive photosensitive resin and a negative photosensitive resin. In this step, a photosensitive resin of any type may be used. When the positive photosensitive resin is used, the light L is irradiated to the other portion of the i-th partition forming film 8a other than the portion where the first partition 3a is to be formed. In the case of using the photosensitive resin of the negative type, the light L is irradiated mainly at the portion where the first partition 3a is to be formed. In this step, reference is made to Fig. 10 to explain the case of using a positive photosensitive resin. As shown in Figs. 10A, 10B, and 1c, the photomask 21a is placed above the support substrate 2, and the light 1 is irradiated by the mask 21a. The light is applied to the first partition wall forming film 8a, and is mainly irradiated to a residual portion other than the portion where the partition wall 3a is to be formed. In the first and fourth figures, the light L that is irradiated onto the first partition wall forming film 8a is indicated by a blank arrow. , like the step chart, the 11th picture and the _th, and then the imaging step. In this case, the pattern forms the i-th partition 3a. When the first film 8a is developed, the developing liquid contacts the second partition 3b. However, as described above, the second partition 3b of the 323774 21 201236106 is subjected to the post-baking step, so that the second partition 3b is in contact with each other. The image liquid is also not etched. After the development step, a post-baking step is performed. The post-baking step is, for example, heating the support substrate 2 at a temperature of 200 ° C to 230 ° C for 15 minutes to 60 minutes to form the first partition wall. In the present embodiment, the first partition wall 3a having a tapered shape is formed by curing the film 8a. The angle of the corner 01 formed by the side surface of the first partition wall 3a and the bottom surface of the first partition wall 3a is The following elements can be appropriately adjusted to an arbitrary angle. The angle between the side surface of the first partition 3a and the bottom surface of the first partition 3a, the angle of the angle 0 1 , the side surface of the second partition 3b, and the bottom surface of the second partition 3b can be adjusted. The angle of the corners 2 is mainly determined by the type of the photosensitive resin to be used. Therefore, for example, a plurality of types of photosensitive resins which are commercially available can be appropriately selected by performing an exposure step and a developing step under predetermined conditions. The partition 3 (the first partition 3a) capable of forming a tapered shape The material or the exposure step and the development step are carried out under predetermined conditions, and the material of the partition wall 3 (second partition 3b) which can form the inverted tapered shape can be appropriately selected, and the partition wall can be formed by using the material. By adjusting the development time, the angle between the side surface of the partition wall and the bottom surface of the partition wall can be adjusted. When the second partition wall 3b having a reverse tapered shape is formed by using the negative photosensitive resin, generally, the development time is increased. The angle of the corner 构成 2 formed by the side surface of the partition wall 3b and the bottom surface of the second partition wall 3b tends to become larger. Further, by adjusting the exposure amount, the angle between the side surface of the partition wall and the bottom surface of the partition wall can be adjusted. When the photosensitive resin is used to form the second partition 3b of the inverted tapered shape 22 323774 201236106: generally, the exposure amount is reduced, and the angle of the corner 02 formed by the side surface of the second partition 3b and the bottom surface of the second partition 3b is increased. By adjusting the distance between the photomask 21b and the support substrate 2, the angle between the side surface of the partition wall and the bottom surface of the partition wall can be adjusted. When the negative photosensitive resin is used, the photomask 21b and the support substrate 2 are used. distance When the first partition wall 3a having a tapered shape is formed, generally, the angle 0 1 formed by the side surface of the first partition wall 3a and the bottom surface of the j-th partition wall 3a tends to become larger, and the reverse tapered shape is formed. In the case of the partition 3b, generally, the angle 02 formed by the side surface of the second partition 3b and the bottom surface of the second partition 3b tends to become smaller. The photosensitive resin composition is generally formulated with a binder resin, a crosslinking agent, and a photoreaction. The binder resin is a resin which is polymerized in advance. Examples of the binder resin include, for example, a non-polymerizable binder resin which does not have polymerizability, and a polymerizable substitution. Base of a polymeric binder resin. The binder resin has a weight average molecular weight of from 5,000 to 400,000 as determined by gel permeation chromatography (GPC) based on polystyrene. — The binder resin may, for example, be a phenol resin, a novolak resin, a trimeric amine resin, an acrylic resin, an epoxy resin or a polyester resin. The binder can be used alone or in combination of two or more kinds of copolymers. The ratio of the binder resin is generally from 5% to 90% with respect to the mass of the above-mentioned photosensitive resin composition. The crosslinked material is a compound polymerizable by living earth, acid or the like generated from a photopolymerization initiator by irradiation with light. The crosslinking agent may, for example, be a compound having a polymerizable carbon-carbon unsaturated bond of 23 323774 201236106. The crosslinked material may be a monofunctional compound having one polymerizable carbon-carbon unsaturated bond in the molecule, or a polyfunctional compound having two or more functionalized carbon 'carbon unsaturated bonds. In the above-mentioned photosensitive resin composition, when the total amount of the binder resin and the crosslinked material is a mass part, the total amount is preferably 70 parts by mass or less. In the photosensitive resin composition, the total amount of the binder resin and the crosslinked material is 1 part by mass or less, and usually 1 part by mass or more and 3 parts by mass or less. The positive photosensitive resin is a resin in which the irradiated portion of the light is dissolved with respect to the developing liquid. The positive photosensitive resin is generally composed of a compound in which a resin is hydrolyzed under a photoreaction. For the positive photosensitive resin, a resin having a chemical resistance and adhesion such as a novolac resin, a polyhydroxy succinimide, an acrylic resin, a methyl acrylate resin, or a polyamidimide, and a photodegradability can be used. A resin combination of compounds. The developing liquid to be used for development may, for example, be an aqueous solution of a gasification clock or an aqueous solution of tetrakis ammonium hydroxide (TMAH). As described above, the angle formed by the side surface of the first partition wall 3a and the bottom surface of the first partition wall 3a, and the corner 2 formed by the side surface of the second partition 3b and the bottom surface of the second partition 3b mainly depend on the type of photosensitive resin to be used. Many of the plurality of photosensitive resins which can be obtained from the market can be used as a material for forming a partition wall (first partition 3a) having a tapered shape. Further, examples of the material for forming the partition wall (second partition 3b) of the inverted tapered shape include materials (ZPN 2464, ZPN 1168) manufactured by Zeon Co., Ltd., and the like. 24 323774 201236106 : The shape and arrangement of the partition 3 are appropriately set in accordance with the specifications of the display device such as the number of pixels and the resolution, ease of manufacture, and the like. For example, the direction X of the partition 3 or the width of the row direction γ is about 50/zm, and the twist of the partition 3' is 0. 5#m to the left and right, the interval between the partition walls 3 adjacent to the column direction X or the row direction Y, that is, the width X of the row of the recesses 5 or the width of the row direction γ is about 10/zm to 200 ym. Again, the first! The width of the column 6 of the electrode 6 or the width of the row direction is about 10 μm to 200 // m, respectively. (Step of Forming Organic Layer) In this step, an organic layer is formed. In the present embodiment, at least one organic layer is formed by an application method in the organic layer of the i layer or more. In the present embodiment, the second organic layer 7 and the second organic layer 9 are formed by a coating method. First, the second organic layer 7 functioning as a hole injection layer is formed. As shown in Fig. 12A, Fig. 12B, and Fig. 12C, the ink 22 containing the material of the first organic layer 7 is first supplied to the region (concave portion 5) surrounded by the partition walls 3. The ink 22 is appropriately supplied by an appropriate method in consideration of the shape of the partition 3, the ease of the film formation step, and the film forming property. The ink 22 can be supplied to the concave portion 5 by, for example, an inkjet printing method, a nozzle coating method, a relief printing method, or a gravure printing method. As shown in Fig. 13A, Fig. 13B and Fig. 13C, the supplied ink 22 is then solidified to form the first organic layer 7. The curing of the ink 22 can be carried out, for example, by natural drying, heat drying, and vacuum drying. Further, when the ink 22 is a material which is polymerized by the addition of energy, after the ink 22 is supplied to the concave portion 5, the ink 22 is heated, 323774 25 201236106 or the ink 22 is irradiated with light, and the organic layer contained in the ink 22 can be formed. Material polymerization. When the material constituting the organic layer is polymerized as described above, the first organic layer 7 is formed, and the ink used when the second organic layer is further formed on the first organic layer 7 makes it difficult to dissolve the first organic layer 7. As shown in Fig. 14A, Fig. 14B, and Fig. 14C, a second organic layer 9 functioning as a light-emitting layer is formed. The second organic layer 9 can be formed in the same manner as the first organic layer 7. In other words, three kinds of inks each containing a material that becomes the red light-emitting layer 9R, the green light-emitting layer 9G, and the blue light-emitting layer 9B are supplied to a predetermined region (recessed portion 5) surrounded by the partition walls 3, and further cured by curing Further, a red light-emitting layer 9R, a green light-emitting layer 9G, and a blue light-emitting layer 9B are formed. (Step of Forming Second Electrode) As shown in Figs. 15A, 15B, and 15C, the second electrode 10 is formed. In the present embodiment, the conductive film 10a is formed on one surface (overall) in a display region in which at least a plurality of organic electroluminescent devices are provided. For example, the conductive film 1 Oa is formed on one surface by a vapor deposition method. As described above, among the conductive thin films 10a, the portion provided on the second organic layer 9 corresponds to the second electrode 10. As shown in Fig. 15C, when the thickness of the second electrode 10 is thin, even if the conductive film 10a is formed on one surface, the conductive film 10a is cut off at the end portion of the second partition wall 3b having a reverse tapered shape. In this case, the second electrode 10 of the organic electroluminescence element 4 and the conductive film 10a on the second partition 3b are cut. As shown in Fig. 15B, a conductive film 10a is also formed on the first partition 3a of the tapered shape, 26 323774 201236106 - on the side surface (the surface forming the corner with respect to the bottom surface of the first partition 3a). Therefore, the second electrode 10 is not cut at the end of the i-th partition 3a, and the second electrode 1A of the organic electroluminescent device 4 is connected to the conductive _10M of the first partition 3a. Therefore, the second electrode turns formed in the organic electroluminescent element 4 adjacent to the column direction X are connected to each other via the conductive film on the first partition 3a. When the second partition wall 3a having a tapered shape is provided to a part of the outer circumference of the organic electroluminescence element 4, the second electrode 10 and the i-th partition wall of the organic electroluminescence element 4 are electrically conductive as described above. The film l〇a is connected. Therefore, even if the second partition 3b having the inverted tapered shape is provided, the second electrode 1 of the organic electroluminescent device 4 can be prevented from being cut at the end of the partition 3, and a plurality of organic electroluminescent elements can be formed. 4 connected to the second electrode 1〇. As described above, when the partition wall 3 (second partition 3b) having a reverse tapered shape is provided, if the thickness of the second electrode 10 is thin, the second electrode 10 at the end of the partition wall 3 having the inverted tapered shape is In the case of cutting, by providing the first partition 3a having a tapered shape instead of thickening the thickness of the second electrode 1 to be necessary, the plurality of organic electroluminescent elements 4 can be opened. The second electrodes 1〇 are connected to each other. In the present embodiment, the first partition walls 3a extend in the first direction (the series direction X in the present embodiment) orthogonal to the thickness direction Z of the support substrate 2, respectively, to be orthogonal to the thickness direction Z and In the second direction of the first direction (X) (in the present embodiment, the directional direction γ) is formed by a plurality of partition walls having a predetermined tapered shape, and the first partition wall is viewed as viewed from the 323774 27 201236106 2 The portion where the partition 3b overlaps is the second partition 3b provided between the support substrate 2 and the spacer 3a. Therefore, in the portion where the first partition wall overlaps the second partition wall, the second partition wall 3b is covered by the first partition wall 3a, that is, the partition wall 3a is exposed. When the conductive film 10a is formed on the support substrate 2 having the first partition 3a, the second partition 3b is covered by the first partition 3a in a portion in which the first partition 3a and the second partition f3b overlap each other. Covered, the extension direction of the first partition 3a is the same! A conductive thin crucible 10a is formed on the partition wall. In the present embodiment, the i-th partition wall 3a is formed to extend in the row direction γ, so that the second electrode 1〇 of the organic electroluminescence element 4 adjacent to the row direction γ is formed on the j-th partition wall. The conductive film l〇a is connected. Thereby, the second electrodes formed as the entire organic electroluminescence element via the conductive thin layer 10a on the i-th partition 3a are connected to each other. Therefore, the second electrode 丨〇 functions as an electrode common to all of the organic electroluminescent elements 4 . In the present embodiment, the second partition wall 3b having the inverted tapered shape faces the organic electroluminescent element 4 and is disposed so as to surround the organic electroluminescent element 4, so that the ink 22 is supplied to the region (recess 5) surrounded by the partition wall 3. By the capillary phenomenon, it is filled in a state in which it is sucked into a portion which is n-shaped near the portion where the second electrode 16 and the second partition 3b are connected. In the case where L is maintained in this state, an organic layer is formed also in a portion of the vicinity of the portion adjacent to the portion where the first electrode 6 and the partition 3 are connected, by evaporating the solvent of the ink. Thereby, an organic layer of uniform thickness can be obtained. In the first step of connecting the shape of the tapered shape! The ink 22 supplied to the region (concave portion 5) surrounded by the partition wall 3 in the portion where the electrode 6 and the i-th partition are applied may be 323774 28 201236106 which is detached by the first partition 3a and dried. However, the second partition wall 3b having an inverted tapered shape is provided so as to surround the organic electroluminescence element 4 so as to surround a portion of the organic electroluminescence element 4, whereby at least the entire organic layer system can be obtained more than the tapered shape. The concave portion surrounded by the partition wall of the shape forms an organic layer having a flatter and uniform thickness in the organic layer. Further, in the concave portion 5, the portion where the thickness of the organic layer is thinner is very dependent on the shape of the concave portion 5 in plan view. For example, when the concave portion surrounded by the partition wall of the tapered shape is formed into an organic electroluminescence element having a shape extending in a predetermined direction perpendicular to the thickness direction of the support substrate, that is, as in the present embodiment, the direction of the row is formed. When the Y-extended organic electroluminescent device is used, the ink supplied to the concave portion is concentrated in one of the one end and the other end in the longitudinal direction (row direction Y) or the central portion in the short-side direction (column direction X). The tendency. In this case, the organic layer is thinned in thickness in one of the one end side and the other end side in the longitudinal direction (row direction Y), or one end side and the other end side in the short side direction (column direction X). The tendency to change the thickness is thin. In the case of the organic electroluminescence element extending in the predetermined direction, the first partition wall 3a is preferably disposed so as to face the short side direction (column direction X) of the organic electroluminescence element 4 in a plan view. And the other end surface, that is, the side surface of the straight outer periphery (facing the outer circumference) that is disposed so as to surround the short side direction of the organic electroluminescence element, linearly extends in a plan view in the longitudinal direction, and the second partition wall 3b is preferably arranged such that One of the longitudinal direction (row direction Y) of the electromechanical excitation element 4 and the other end surface, that is, the side of the circumference 5 (outward facing) of the circle 5 which is preferably arranged to surround the longitudinal direction of the organic electroluminescence element It extends in an arc shape in a plan view toward the short side. When the second partition 3b of 29 323774 201236106 is disposed in this way, the ink 22 supplied to the concave portion 5 is one end side and the other end side in the longitudinal direction (row direction Y) of the side surface of the second partition wall 3b facing the inverted tapered shape. The fine portion at the distal end is pulled by the capillary phenomenon, and is fixed to the side surface of the second partition wall 3b to form a film. Therefore, it is possible to obtain a flatter and uniform outer layer than the organic layer formed by the concave portion surrounded by the partition wall having the tapered shape. Organic layer of thickness. Further, the first partition walls 3a are arranged to face one of the short side directions (column direction X) of the organic electroluminescence element 4 and the other end surface, and the second partition walls 3b face the longitudinal direction of the organic electroluminescent element 4 ( When one side of the row direction Y) and the other end surface are arranged, the end side and the other end side (short side) in the longitudinal direction (row direction Y) in which the second electrode 10 is cut are viewed in plan view, and the second side is formed. The electrode 10 is connected to the conductive film 10a on the partition wall 3 at one end side and the other end side (long side) in the short-side direction (column direction X). In the present embodiment, the second electrode 10 is cut between one end side and the other end side in the short-side direction (column direction X), and is cut between the conductive film 10a on the partition wall 3. The area of the organic electroluminescent device 4 of the present embodiment is small, and the area of the conductive film 10a on the partition 3 is a large number of the organic electroluminescent elements 4 of the present embodiment, so that the wiring resistance can be reduced. <Configuration of Organic Electroluminescence Element> Hereinafter, the configuration of the organic electroluminescence element will be described in more detail. The organic electroluminescent device has at least one light-emitting layer as an organic layer. As described above, the organic electroluminescent device further includes a predetermined layer such as a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injecting layer. 30 323774 201236106 • An example of a layer structure that can be adopted for the organic electroluminescent device of the present embodiment is shown below. a) anode/light-emitting layer/cathode b) anode/hole injection layer/light-emitting layer/cathode c) anode/hole injection layer/light-emitting layer/electron injection layer/cathode d) anode/hole injection layer/light-emitting layer/ Electron transfer layer/cathode e) Anode/hole injection layer/light-emitting layer/electron transport layer/electron injection layer/cathode f) anode/hole transport layer/light-emitting layer/cathode g) anode/hole transport layer/lighting Layer/electron injection layer/cathode h) anode/hole transport layer/light-emitting layer/electron transport layer/cathode i) anode/hole transport layer/light-emitting layer/electron transport layer/electron injection layer/cathode j) anode/electric Hole injection layer/hole transport layer/light-emitting layer/cathode k) anode/hole injection layer/hole transport layer/light-emitting layer/electron injection layer/cathode l) 11⁄4 pole/hole injection layer/hole transport layer/ Light-emitting layer/electron transport layer/risk m) Anode/hole injection layer/hole transport layer/light-emitting layer/electron transport layer/electron injection layer/cathode h) anode/light-emitting layer/electron injection layer/cathode 〇) anode / luminescent layer / electron transport layer / cathode P) anode / luminescent layer / electron transport layer / electron injection layer / cathode (here, the mark "/" means 挟 记 Γ /" Adjacent to the respective layers laminated). 323774 31 201236106 The same applies to the above-mentioned embodiment. In the above embodiment, the organic electroluminescent device 4 in which the first electrode 6 exhibits an anode function and the second electrode 10 functions as a cathode is described. In this form, for example, the constituent elements of the above a) to p) are sequentially laminated on the branch substrate 2 from the anode shown on the leftmost side. Further, the first electrode 6 functions as a cathode, and each of the constituent elements of the organic electroluminescent optical element 4 in which the second electrode 1 〇 functions as an anode functions, for example, the layers a) to P) are sequentially arranged from the cathode shown on the rightmost side. Laminated on the support substrate 2. <Support Substrate> In the step of manufacturing the organic electroluminescent device 4 on the support substrate 2, it is suitable to use a chemical-free change. For example, glass, plastic, polymer film, cut substrate, and laminate can be used. Substrate. <Anode> When the light emitted from the light-emitting layer is emitted through the anode and emitted to the outside of the organic electro-optic seven-light element, an electrode exhibiting light transmittance can be used for the anode. As the electrode which is not transparent, a film of a metal oxide, a metal sulfide or a metal can be used, and a conductivity and a light transmittance can be suitably used. For the eight-body system, indium tin oxide, oxidation, tin oxide, and tin oxide (Indium Tin 〇Υι·Ηω · ττη, ... can be used. Xide . ITO), indium zinc oxide (indium Zinc)
Oxide : IZO)、仝私 ^ Λ . ^ 金、鉑、銀及銅等所構成之薄膜，此等之 中亦可適宜使用由IT〇、IZ〇、或氧化錫所構成之薄膜。 、於陽極之製作方法之例係可舉例如真空蒸鑛法 、濺鍍 法、離子鍍覆法、 ^ 、, 電錢法專。又’就陽極而言，可使用聚 苯胺或其彳4·生物、聚嗔吩或其衍生物等之有機透明導電膜。 323774 32 201236106 〈陰極〉 陰極之材料係宜為工作函數小，且電子容易注入發光 層，導電度高之材料。又，在從陽極側取出光之構成的有 機電激發光元件為了使從發光層所放射之光在陰極反射至 陽極侧’就陰極之材料而言宜為對於可見光之反射率高的 材料。陰極係可使用例如驗金屬、驗土族金屬、過渡金屬 及周期表第13族金屬等。陰極之材料可使用例如鋰、鈉、 鉀、#α、絶、鈹、鎂、鈣、锶、鋇、鋁、钪、釩、鋅、釔、 銦、鈽、釤、銪、铽、镱等之金屬、前述金屬之中的2種 以上之合金、前述金屬之中的丨種以上、與金、銀、鉑、 銅、錳、鈦、銘、錄、鶴、錫之中的i種以上之合金、或 石墨或石墨層間化合物。合金之例係可舉例如鎂-銀合金 鎂-銦合金、鎂-紹合金、銦—銀合金、鐘_紹合金、鐘-鎮告 :二銦合金、妈，合金等。又，陰極係可使用由導電 金屬虱化物及導電性有機物等所構Oxide: IZO), the same private ^ Λ . ^ film made of gold, platinum, silver and copper, etc., of which may also be suitable for the use of IT 〇, IZ 〇, or tin oxide film. Examples of the method for producing the anode include vacuum distillation, sputtering, ion plating, ^, and electric money. Further, as the anode, an organic transparent conductive film of polyaniline or its quinone, bio-polyphenol or a derivative thereof can be used. 323774 32 201236106 <Cathode> The material of the cathode is preferably a material with a small work function and easy electron injection into the luminescent layer and high conductivity. Further, in the electromechanical excitation optical element having the light-removing light from the anode side, the material of the cathode is preferably a material having a high reflectance to visible light in order to reflect the light emitted from the light-emitting layer to the anode side. As the cathode system, for example, a metal test, a soil test group metal, a transition metal, a metal of Group 13 of the periodic table, or the like can be used. As the material of the cathode, for example, lithium, sodium, potassium, #α, ruthenium, osmium, magnesium, calcium, strontium, barium, aluminum, strontium, vanadium, zinc, bismuth, indium, antimony, bismuth, antimony, bismuth, antimony, etc. may be used. Two or more alloys of the metal and the above-mentioned metals, and more than one of the above metals, and an alloy of one or more of gold, silver, platinum, copper, manganese, titanium, yum, yam, crane, and tin Or graphite or graphite intercalation compounds. Examples of the alloy include, for example, a magnesium-silver alloy, a magnesium-indium alloy, a magnesium-salt alloy, an indium-silver alloy, a bell-salt alloy, a bell-town, a two-indium alloy, a mother, an alloy, and the like. Further, the cathode system can be constructed using a conductive metal halide and a conductive organic substance.
==衍生物、聚_其衍生物等。:例 ^層〇2層以上之層合體構成。 T 陰極使用之情形。 ，電子注入層亦有作為 、離子鍍覆 法等陰極之製作方法的财_如真空蒸鑛法 極或陰極之厚度係可考 陽 π 之簡易性等而適當設定。陽極或：：求的特性、成膜步驟 a 5之厚度係例如為l〇nm 323774 33 201236106 至 lOy m，宜為 20nm 至 1 " m ^ 〈電洞注入層〉 ^更宜㈣― ^成電洞注人層之電洞“材料的例可舉例飢、 :”、氧一氧化紹等氧化物、苯基 爆（starburst)型胺化合物、μ社 及聚噻吩衍生物等。 料化合物、非晶碳、聚苯胺 電洞注入層之成膜方法 材料之溶㈣颜。電·A a州域自3有電洞/主入 而塗佈成膜含有制注崎2_域由駭之塗佈法 而形成。 #枓之溶液，進-步藉由固化此 易性;=:層之厚度係可考量所要求的特性、步驟之簡 2 Λ 洞〜層之厚度係例如為1⑽至1 且為2ηπι至500nm，更a班c 〈電洞輸送層〉 更且為5nm至20〇nm。 =電洞輸送層之電洞輪送材料之例係可舉例如聚乙 ^ 或其Μ物、聚錢或其衍生物、於侧鏈或主鏈 =!之_街生物，嫩生物、芳基胺 豆犷峰铷一t乙烯何生物、三苯基二胺衍生物、聚笨胺或 聚嘆吩或其何生物、聚芳基胺或其衍生物、聚 :略或其衍生物、聚(對位笨基乙烯)或其衍生物、或聚 (2, 5-伸噻吩基伸乙烯基）或其 電洞輸送厚度係可考量所要求的特性、成膜步驟 爲易&等U。電洞輸送層之厚度係例如為1咖至i 宜為―至500,更宜為5rm至200nm。 323774 34 201236106 . 〈發光層〉 發光層係一般主要由發出螢光及/或磷光之有機物、 二=有機物與補助此之摻雜物所形成。摻雜物係例如用以 右效率、改變發光波長所加入。又，構成發光層之 佈、去^、1為低分子化合物亦可為高分子化合物，藉由塗 係發光層宜為含有高分子化合物。 mil之向分子化合物的聚苯乙稀換算的數目平均分 子置例如為1 〇3至】士士 例如以下之色夸心丄 籌成發光層之發光材料係可舉 雜物材料。金屬錯合物材料、高分子材料、摻 (色素材料） 二 係::::環噴達明衍生物、四苯基丁二烯 喹琳衍生物、二笨二何生物、°惡二唾衍生物、0比嗤並 生物、鱗衍I物=苯街生物、二笨乙埽基伸芳基衍 ::生:物，，吩—二二： ‘物材Γ广衍生物、香豆素衍生物。 金屬錯合物材料係可舉例 :等稀土族金屬、或A1、zn、Be、Ir、t^^ 具有噁二唑、嘍二咭τ寻於配位基 造等之金屬錯合物。金 錯合物、鉑錯合物笼+一i 如具有源自銥 物、㈣淋醇錯人物::態激發狀態之發光的金屬錯合 ° 、本並羥基喹啉鈹錯合物、苯並噁唑 323774 35 201236106 基辞錯口物、苯並。塞唾鋅錯合物、偶氮甲基鋅錯合物、口卜 啉鋅錯合物、菲銪錯合物等。 (高分子材料） 高分子材料之例係可舉例如聚對伸苯基伸乙烯基衍生 物、聚嗔吩衍生物、聚對伸苯基衍生物、聚石夕烧衍生物、 聚乙炔何生物、聚努衍生物、聚乙稀基味唾衍生物、上述 色素材料、將金屬錯合物發光材料高分子化之材料等。 發光層之厚度—般為約2nm i 200nm。 〈電子輸送層〉 構成電子輸送層之電子輸送材料係可使用公知之材料。 電子輸送材料之例係可舉例如噪二唾衍生物、細二甲烧 或其衍生物、苯醌或其衍生物、萘酿或其衍生物、葱親或 其衍生4勿四氰蔥酉昆一曱燒或其衍生物、努酮衍生物、二 苯基二氰乙稀或其衍生物、二賴衍生物、或8_啥琳醇或 其何生物之金屬錯合物、聚噎琳或其衍生物、聚啥喔琳或 其衍生物、聚芴或其衍生物等。 々電子輸送層之厚度係可考量所要求的特性、成膜步驟 之簡易性等而適當設定。電子輸送層之厚度係例如為lmn 至1 y m，宜為2nm至500nm，更宜為5nm至200nm。 〈電子注入層〉 構成電子注入層之材料係可依發光層之種類而適當選 擇最適的材料。構成電子注入層之材料之例係可舉例如驗 金屬、驗土族金屬、含有驗金屬及驗土族金屬之中的（種 類以上之合金、驗金屬或驗土族金属之氧化物、函化物、 323774 36 201236106 • 石厌酸鹽、及此等之物質的混合物等。 驗金屬驗金屬之氧化物、鹵化物及碳酸鹽之例係可 舉例如链:鈉、H絶、氧化M、氣化Μ、氧化納、 氟化納山、氧化卸、氟化卸、氧化麵、氟化物、氧化絶、氟 化鉋&酸鐘等。又，鹼土族金屬、驗土族金屬之氧化物、 函化物及碳酸鹽之儀可舉例如鎂m、氧化錢、 乱化鎂、氧化鈣、氟简、氧化鎖、氣 ，碳酸鎂等。電子注入層係可以層合2層=二 體所構成，可舉例如LiF層及Ca層之層合體等。θ 電子注入層之厚度宜為1⑽至左右。 上述之各有機層係藉㈣如喷 凸版㈣法、/赁墨印刷法 法、或CVD法等而形成。 ，、空蒸鍵法、舰 又’塗佈㈣、使含有成為各有機層 料的油墨塗佈成膜隹$機電激毛光材 而形成有機層。所使用之^藉由固化被塗佈成膜之油墨 二氣⑽二氣乙^之f的溶劑係可使用例如氯仿、 甲苯、二，笨等之:香=劑’·四氧物之越系溶劑' 系溶劑、错劑，、甲乙明等之酮 系溶劑及水等。B夂酉曰乙基溶纖劑乙酸醋等之酯 實施例 表示實施例於以下。本發明係 為更詳細說明本發明 不限定於下述實施例。 (實施例1) 323774 37 201236106 準備形成有作為第1電極功能的IT〇薄膜之支撐基板 (TFT基板）（參照第7Α圖、第7Β圖及第7C圖）。於此支撐 基板上，使用旋塗器塗佈成膜負型感光性樹脂溶液丨（日本 Zeon股份公司製ZPN 2464)，在加熱板上以ii〇°c加熱9〇 秒，藉實施預烘烤而使溶劑成分氣化（參照第8A圖、第8B 圖及第8C圖）。繼而，使用進接式曝光機而以 曝光量lOOmJ/cm2曝光。進一步使用顯像液（股份公司德山 製SD-1CTMAH 2. 38重量％)而顯像8〇秒鐘，形成倒錐形形 狀之第2隔壁3b。繼而以230¾加熱30秒，藉實施後烘烤 而使樹脂硬化，形成厚為〇· 8am之第2隔壁3b。如此做 法所形成之第2隔壁3b的側面與第2隔壁3b之底面構成 的角0 2之角度為約115°。 繼而，使用旋塗器塗佈成膜正型感光性樹脂溶液（日 本Zeon股份公司製ZPN 6212)，在加熱板上以u(rc加熱 90秒’藉實施預烘烤而使溶劑成分氣化（參照第l〇A圖、 第10B圖及第10C圖）。繼而，使用進接式（pr〇ximity)曝 光機而以曝光量曝光。進—步使用顯像液（股份 公司德山製SD-UTMAH 2. 38重量％)而顯像7〇秒鐘，妒成 順錐形形狀之第1隔壁3a。繼而以23〇ΐ加熱3〇秒，藉 施後烘烤而使樹脂硬化，形成厚為1〇//m之第丨^ 3a(參照f 11A圖111B圖及Suc圖）。如此做 成之第1隔壁3a的側面與第2隔壁3a之底面構成 / 之角度為約30。。 ㈠1 於形成有隔壁之支樓基板上以氧電浆進行表面處硬， 323774 38 201236106 • 繼而’以CF4電漿進行表面處理，使ΙΤ0表面親液化，於 隔壁之表面賦予撥液性。 繼而’使用噴墨裝置（ULVAC公司製Litex 142Ρ)而塗 佈油墨（HI形分濃度1· 5%之聚（乙稀二氧嗟吩）（pED〇T)及聚 苯乙烯續酸（pss)之水分散⑽ayer公司製A14G83))(參 照第12A圖、第12B圖及第12C圖）。隔壁3之上表面係撥 開油墨用’故於被㈣3包圍之就的凹部内填充油墨。 此外，沿著面向凹部之列方向X的-端侧及另-端側的倒 錐形形狀的第2隔壁藉毛細管現象而吸近其端部、亦即吸 近至側面之下端部附近的前端細之間隙，而於像素（凹部） 内均-地展開。以2(Krc燒成此基板，形成均一厚度（5〇⑽） 之電洞主入層7(參照第13八圖、第13B圖及第13c圖）。 、繼而二將放射紅色之光的高分子發光材料以其濃度成 為0.8重篁％之方式混合於有機溶劑而調製紅色發 ㈣，將放射綠色之光的高分子發光材料以其濃度‘ 0.8重之方式混合在有機溶肺調製綠色發光油墨。逸 步，放射藍色之光的高分子發光材料以其濃度成為 〇. 8重1 %之方式混合在有機溶劑而調製藍色發光油墨 此等紅色發光油墨、綠色發錢墨、藍色發光油墨 用喷墨裝置（ULVAC公司製Litrex 142P)而塗佈於特定 部内。 、、的凹 隔壁3之上表面係撥開油墨，故於被隔壁3包固之 定的凹部内填充油墨。尚且’油墨係沿著面向凹部之列方 向X的一端側及另一端侧的倒錐形形狀的第2隔壁而藉毛 323774 39 201236106 、、’田笞現象而被及引至其端部，於像素内均一地展開。以1 °c燒成此基板’形成均—厚度（6Gnm)之發光| 9(參照第 14A圖、第14B圖及第Uc圖）。 接著藉真空蒸錢法形成由厚度為2〇nm之Ca層、厚 度為150nm之A1層所構成的第2電極（陰極）1〇<>在倒錐形 形狀之® 2隔壁3b的端部中雖因其段差而亦有第2電極 (陰極）ιο被刀斷（參照第15C圖）之情形，在順雜形形狀之 第1隔壁3a的端部中係無第2電極（陰極）1〇分斷，故形 成為王4之有機電激發光元件4的帛2電極才目連。可藉 由此而使配線電阻降低，如所意圖地可於支撐基板上製作 發光之複數個有機電激發光元件，進一步，所製作之有機 電激發光元件係在面板内各有機電激發光元件相互地以同 樣之儿度發光，並且各有機電激發光元件個別地在像 均一地發光。 【圖式簡單說明】 第囷係示思性地顯示放大顯示裝置之一部分的截面 第2圖係示意性地顯示放大在第1圖所示之切斷面線 A-A的位置經切斷之顯示裝置的戴面圖。 第3圖係不意性地顯示放大在第1圖所示之切斷面線 B-B的位置經切斷之顯示裝置喊面圖。 、’ 第4圖係示意性地顯示放大在第1圖所示之切斷面線 C-C的位置經切斷之顯示裝置的截面圖。 第5圖係不意性地顯示放大在第1圖所示之切斷面線 323774 40 201236106 .D-D的位置經辑之顯示裝置的截面圖。 第6圖係示意性地顯示放大在第1圖所示之切斷面線 E-E的位置經切斷之顯示裝置的截面圖。 第7A圖係用以說明顯示裝置之製造步驟的圖。 第7B圖仙以說軸示裝置之製造步驟的圖。 第7C圖係用以說明顯示裝置之製造步驟的圖。 第8A圖係用以說明顯示裝置之製造步驟的圖。 第8B圖係用以說明顯示裝置之製造步驟的圖。 第8C圖係用以說明顯示裝置之製造步驟的圖。 第9A圖係用以說明顯示裝置之製造步驟的圖。 第9B圖係用以說明顯示裝置之製造步驟的圖。 第9C圖係用以說明顯示裝置之製造步驟的圖。 第10A圖係用以說明顯示裝置之製造步驟的圖。 第10B圖係用以說明顯示裝置之製造步驟的圖。 第10C圖係用以說明顯示裝置之製造步驟的圖。 第11A圖係用以說明顯示裝置之製造步驟的圖。 第11B圖係用以說明顯示裝置之製造步驟的圖。 第11C圖係用以說明顯示裝置之製造步驟的圖。 第12A圖係用以說明顯示裝置之製造步驟的圖。 第12B圖係用以說明顯示裝置之製造步驟的圖。 第12C圖係用以說明顯示裝置之製造步驟的圖。 第13A圖係用以說明顯示裝置之製造步驟的圖。 第13B圖係用以說明顯示裝置之製造步驟的圖。 » 13C圖係用以說明顯示裝置之製造步驟的圖。 323774 201236106 第14A圖係用以說明顯示裝置之製造步驟的圖。 第14B圖係用以說明顯示裝置之製造步驟的圖。 第14C圖係用以說明顯示裝置之製造步驟的圖。 第15A圖係用以說明顯示裝置之製造步驟的圖。 第15B圖係用以說明顯示裝置之製造步驟的圖。 第15C圖係用以說明顯示裝置之製造步驟的圖。 第16A圖係用以說明顯示裝置之製造步驟的圖。 第16B圖係用以說明顯示裝置之製造步驟的圖。 第16C圖係用以說明顯示裝置之製造步驟的圖。 第16D圖係用以說明顯示裝置之製造步驟的圖。 第17A圖係用以說明顯示裝置之製造步驟的圖。 第17B圖係用以說明顯示裝置之製造步驟的圖。 第17C圖係用以說明顯示裝置之製造步驟的圖。 【主要元件符號說明】 1 顯示裝置 2 支樓基板 3 隔壁 3a 第1隔壁 3b 第2隔壁 4 有機電激發光元件 5 凹部 6 ' 16 第1電極 7 第1有機層（電洞注入層） 8 隔壁形成用膜 9 第2有機層（發光層） 10、 19 第2電極 10a 導電性薄膜 12 支撐基板 13 隔壁 15 被隔壁包圍的區域 17、22 油墨 18 有機層 21 光罩 Θ 1 、02角 42 323774== Derivatives, poly-_ derivatives thereof, and the like. : Example ^ Layer consisting of two or more layers. T Cathode use case. The electron injecting layer is also used as a method for producing a cathode such as an ion plating method, such as a vacuum distillation method, or a thickness of a cathode, which can be appropriately set, such as the simplicity of the π. The thickness of the anode or:: film formation step a 5 is, for example, l〇nm 323774 33 201236106 to lOy m, preferably 20 nm to 1 " m ^ <hole injection layer> ^more suitable (four) - ^ The hole in the hole injection layer can be exemplified by an example of a material such as hunger, :, an oxide such as oxygen oxide, a starburst type amine compound, a thiophene derivative, and a polythiophene derivative. Film-forming method, amorphous carbon, polyaniline film formation method of hole injection layer (4) color. The electric AA state is formed by a coating method in which a film is formed by a coating method including a hole and a main hole. #枓的溶液, step-by-step curing by the ease; =: the thickness of the layer can take into account the required characteristics, the steps of the simple 2 Λ hole ~ layer thickness is, for example, 1 (10) to 1 and 2ηπι to 500nm, More a class c <hole transport layer> is more than 5nm to 20〇nm. = Examples of the hole-carrying material of the hole transport layer may be, for example, polyethylene or its sputum, poly-money or its derivative, in the side chain or main chain = _ street creature, tender organism, aryl Amine, a triphenyldiamine derivative, a polystyrene or polyseptene or a stimuli, a polyarylamine or a derivative thereof, a poly(slightly or a derivative thereof, a poly( The p-styl ethylene or a derivative thereof, or the poly(2,5-thiophene-extended vinyl group) or the hole transporting thickness thereof can take into consideration the desired characteristics, and the film forming step is easy & The thickness of the hole transport layer is, for example, 1 to 500, more preferably 5 to 200 nm. 323774 34 201236106 . <Light Emitting Layer> The light emitting layer is generally formed mainly of organic matter emitting fluorescing and/or phosphorescence, bis-organic matter and dopants which are supplemented. The dopant is added, for example, to the right efficiency and to change the wavelength of the light. Further, the cloth constituting the light-emitting layer, and the low-molecular compound may be a polymer compound, and the coating-emitting layer preferably contains a polymer compound. The number average molecular weight of the polystyrene converted to the molecular compound of mil is, for example, 1 〇 3 to 士士士. For example, the following color 夸 丄 发光 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹 筹Metal complex material, polymer material, doped (pigment material) Second series:::: cyclopentadiene derivative, tetraphenylbutadiene quinoline derivative, diphtheria dihydrogen, dioxin derivative 0, 嗤 嗤 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The metal complex material may be exemplified by a rare earth metal such as a rare earth metal or A1, zn, Be, Ir, or a metal complex having a oxadiazole or a ruthenium oxime found in a coordination group. Gold complex, platinum complex cage + one i, such as a metal-incorporated fluorophore derived from a sputum, (4) smear: luminescent state of the state excited state, the hydroxyquinoline quinone complex, benzo Oxazole 323774 35 201236106 The base is wrong, benzo. A sulphate complex, an azomethyl zinc complex, a zinc porphyrin complex, a phenanthrenequinone complex, and the like. (Polymer Material) Examples of the polymer material include, for example, a polyparaphenylene vinyl derivative, a polyphenanthene derivative, a polyparaphenylene derivative, a polyoxan derivative, a polyacetylene derivative, a poly-n-derivative, a polyethylene-based saliva derivative, the above-mentioned pigment material, a material which polymerizes a metal complex luminescent material, and the like. The thickness of the luminescent layer is generally about 2 nm i 200 nm. <Electron Transport Layer> As the electron transport material constituting the electron transport layer, a known material can be used. Examples of the electron transporting material may, for example, be a stilbene derivative, a dimethyl ketone or a derivative thereof, a benzoquinone or a derivative thereof, a naphthol or a derivative thereof, an onion or a derivative thereof; a smoldering or its derivative, a ketone derivative, diphenyl dicyanide or its derivatives, a secondary derivative, or a metal complex of 8 啥 醇 醇 or its organism, Its derivatives, polyfluorene or its derivatives, polyfluorene or its derivatives. The thickness of the ruthenium electron transport layer can be appropriately set in consideration of the required characteristics, the ease of the film formation step, and the like. The thickness of the electron transport layer is, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, more preferably 5 nm to 200 nm. <Electron Injection Layer> The material constituting the electron injection layer can be appropriately selected depending on the type of the light-emitting layer. Examples of the material constituting the electron injecting layer include, for example, a metal test, a soil tester metal, a metal containing a metal tester, and a test group metal (an alloy of a type or more, an oxide of a metal or a test group metal, a compound, 323774, 36 201236106 • Stone analate, and mixtures of such substances, etc. Examples of metal oxides, halides and carbonates for metal tests include, for example, chains: sodium, H, oxidation M, gasification, oxidation Nano, fluorinated sodium, oxidative unloading, fluorination, oxidizing surface, fluoride, oxidizing, fluorinating planing & acid clock, etc. Also, alkaline earth metals, soil oxides, complexes and carbonates of soils The apparatus may, for example, be magnesium m, oxidized money, chaotic magnesium, calcium oxide, fluorine, oxidized lock, gas, magnesium carbonate, etc. The electron injecting layer may be composed of two layers = two bodies, and for example, a LiF layer may be mentioned. And a layer of the Ca layer, etc. The thickness of the θ electron injection layer is preferably from about 1 (10) to about 0.25. Each of the organic layers described above is formed by a fourth method, a printing method, a CVD method, or the like. The empty steaming method, the ship's 'coating (four), making the inclusion become The ink of the organic layer is coated to form an organic layer, and the solvent used for curing the ink which is applied to form the film is used, for example, chloroform, Toluene, second, stupid, etc.: scent = agent '· tetraoxate's more solvent' solvent, wrong agent, ketone solvent such as methyl ethane, water, etc. B 夂酉曰 ethyl cellosolve acetate vinegar The examples of the esters are shown in the following examples. The present invention is described in more detail. The present invention is not limited to the following examples. (Example 1) 323774 37 201236106 Preparation of a support for forming an IT〇 film as a first electrode function Substrate (TFT substrate) (see Fig. 7, Fig. 7 and Fig. 7C). On the support substrate, a negative photosensitive resin solution (ZPN 2464, manufactured by Zeon Co., Ltd.) was applied by spin coating. Heating on a hot plate at ii 〇 °c for 9 sec seconds, and pre-baking to vaporize the solvent component (refer to Figures 8A, 8B, and 8C). Then, using an in-line exposure machine Exposure with exposure amount of lOOmJ/cm2. Further use of developing solution (manufactured by Tokuyama Corporation) SD-1CTMAH 2.38% by weight) was developed for 8 seconds, and the second partition wall 3b having an inverted tapered shape was formed. Then, it was heated at 2303⁄4 for 30 seconds, and the resin was hardened by post-baking to form a thick layer. The second partition 3b of 8am. The angle of the angle 0 2 formed by the side surface of the second partition 3b formed by the second partition 3b and the bottom surface of the second partition 3b is about 115°. Then, the film is coated with a spin coater to form a positive photosensitive film. The resin solution (ZPN 6212, manufactured by Zeon Co., Ltd.) was vaporized on the hot plate by u (rc heating for 90 seconds) by pre-baking (see Fig. 1A, Fig. 10B and 10C). Figure). Then, an exposure amount is used to expose the exposure amount using a pr〇ximity exposure machine. Further, the image was developed using a developing solution (SD-UTMAH 2.38% by weight, manufactured by Tosoh Corporation) for 7 seconds, and the first partition 3a was formed into a tapered shape. Then, it was heated at 23 Torr for 3 sec seconds, and the resin was hardened by post-baking to form a third 3^3a having a thickness of 1 〇//m (refer to Fig. 11B, Fig. 111B and Suc). The angle between the side surface of the first partition 3a and the bottom surface of the second partition 3a is approximately 30. . (1) 1 Surface is hardened with oxygen plasma on the base plate on which the partition wall is formed, 323774 38 201236106 • The surface treatment is then carried out with CF4 plasma to lyophilize the surface of the crucible, and to impart liquid repellency to the surface of the partition wall. Then, 'inkjet device (Litex 142® manufactured by ULVAC Co., Ltd.) was used to apply the ink (poly(ethylene dioxy porphin) (pED〇T) and polystyrene acid (pss) having a HI concentration of 5%. Water dispersion (10) A14G83) manufactured by Ayer Co., Ltd.) (Refer to Fig. 12A, Fig. 12B, and Fig. 12C). The surface of the partition 3 is separated from the ink so that the ink is filled in the concave portion surrounded by the (four) 3 . Further, the second partition wall of the inverted tapered shape along the end side facing the direction X of the concave portion and the other end side absorbs the end portion by capillary action, that is, the front end near the lower end portion of the side surface. The gap is fine and spreads uniformly in the pixel (concave portion). The substrate is fired at 2 (Krc to form a hole-into-layer 7 having a uniform thickness (5 〇 (10)) (see FIGS. 13A, 13B, and 13c). Then, the height of the red light is emitted. The molecular luminescent material is mixed with an organic solvent so as to have a concentration of 0.8% by weight to prepare a red hair (4), and the polymer luminescent material emitting green light is mixed at a concentration of 0.8 angstroms in an organic dissolved lung modulating green luminescent ink. The blue light-emitting polymer light-emitting material is mixed with an organic solvent to prepare a blue light-emitting ink, such as a red light-emitting ink, a green money ink, or a blue light. The ink is applied to the specific portion by the inkjet device (Litrex 142P manufactured by ULVAC Co., Ltd.). The ink is removed from the upper surface of the concave partition wall 3, so that the ink is filled in the predetermined recessed portion surrounded by the partition wall 3. The ink is guided to the end portion of the inverted partitioned second partition wall facing the one end side in the direction X of the concave portion and the other end side by the hair 323774 39 201236106, and the end of the ink is introduced into the pixel. Uniformly unfolded at 1 ° c firing the substrate 'forms a uniform-thickness (6Gnm) luminescence| 9 (refer to Fig. 14A, Fig. 14B, and Uc). Next, a vacuum layer is used to form a Ca layer having a thickness of 2 〇 nm and a thickness. The second electrode (cathode) 1 〇 亦 在 在 在 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第In the case of the break (see Fig. 15C), the second electrode (cathode) is not broken in the end portion of the first partition 3a having a uniform shape, so that the organic electroluminescent element 4 of the king 4 is formed. The 帛2 electrode is only connected to the eye. The wiring resistance can be lowered by this, and a plurality of organic electroluminescent elements can be formed on the support substrate as intended, and further, the fabricated organic electroluminescent device is attached to the panel. Each of the organic electroluminescent elements emits light at the same level with each other, and each of the organic electroluminescent elements individually emits light uniformly in the image. [Simple description of the drawing] The third part is an illustrative display of a part of the enlarged display device. Fig. 2 is a schematic view showing the enlargement shown in Fig. 1 The front view of the display device of the cut line AA is cut. Fig. 3 is an unintentional display of the display device that is cut at the position of the cut surface line BB shown in Fig. 1 . Fig. 4 is a cross-sectional view schematically showing a display device in which the position of the cut surface line CC shown in Fig. 1 is cut. Fig. 5 is an unintentional display showing the enlargement shown in Fig. 1. Sectional view of the display device of the cut-off line 323774 40 201236106 .DD is shown in Fig. 6. Fig. 6 is a view schematically showing the display device which is cut at the position of the cut surface line EE shown in Fig. 1 Fig. 7A is a view for explaining the manufacturing steps of the display device. Fig. 7B is a diagram showing the manufacturing steps of the axis display device. Fig. 7C is a view for explaining the manufacturing steps of the display device. Fig. 8A is a view for explaining the manufacturing steps of the display device. Fig. 8B is a view for explaining the manufacturing steps of the display device. Fig. 8C is a view for explaining the manufacturing steps of the display device. Fig. 9A is a view for explaining the manufacturing steps of the display device. Fig. 9B is a view for explaining the manufacturing steps of the display device. Fig. 9C is a view for explaining the manufacturing steps of the display device. Fig. 10A is a view for explaining the manufacturing steps of the display device. Fig. 10B is a view for explaining the manufacturing steps of the display device. Fig. 10C is a view for explaining the manufacturing steps of the display device. Fig. 11A is a view for explaining the manufacturing steps of the display device. Fig. 11B is a view for explaining the manufacturing steps of the display device. Fig. 11C is a view for explaining the manufacturing steps of the display device. Fig. 12A is a view for explaining the manufacturing steps of the display device. Fig. 12B is a view for explaining the manufacturing steps of the display device. Fig. 12C is a view for explaining the manufacturing steps of the display device. Fig. 13A is a view for explaining the manufacturing steps of the display device. Fig. 13B is a view for explaining the manufacturing steps of the display device. » 13C is a diagram for explaining the manufacturing steps of the display device. 323774 201236106 Figure 14A is a diagram for explaining the manufacturing steps of the display device. Fig. 14B is a view for explaining the manufacturing steps of the display device. Fig. 14C is a view for explaining the manufacturing steps of the display device. Fig. 15A is a view for explaining the manufacturing steps of the display device. Fig. 15B is a view for explaining the manufacturing steps of the display device. Fig. 15C is a view for explaining the manufacturing steps of the display device. Fig. 16A is a view for explaining the manufacturing steps of the display device. Fig. 16B is a view for explaining the manufacturing steps of the display device. Fig. 16C is a view for explaining the manufacturing steps of the display device. Fig. 16D is a diagram for explaining the manufacturing steps of the display device. Fig. 17A is a view for explaining the manufacturing steps of the display device. Fig. 17B is a view for explaining the manufacturing steps of the display device. Fig. 17C is a view for explaining the manufacturing steps of the display device. [Description of main components] 1 Display device 2 Substrate substrate 3 Partition wall 3a First partition 3b Second partition 4 Organic electroluminescent element 5 Concave portion 6' 16 First electrode 7 First organic layer (hole injection layer) 8 Next wall Film for formation 9 Second organic layer (light-emitting layer) 10, 19 Second electrode 10a Conductive film 12 Support substrate 13 Partition wall 15 surrounded by partition walls 17, 22 Ink 18 Organic layer 21 Photomask Θ 1 , 02 corner 42 323774