TWI539250B - A registration device and an exposure device having a registration device - Google Patents

Description

Registration device and exposure device with alignment device

The invention relates to a aligning device and an exposure device with a aligning device The alignment is performed to perform alignment of a printed substrate or the like of a high-density multilayer structure in which an insulating layer and a conductor layer are alternately laminated.

In the manufacturing process of a printed substrate having a high-density multilayer structure in which an insulating layer and a conductor layer are laminated, the connection between layers and the position of the circuit pattern must be accurately aligned. For example, in the case of manufacturing a printed circuit board having a multilayer structure by a build up, the circuit pattern of the current layer in which the pattern has been formed is aligned to form a circuit pattern of the next layer. In general, when the circuit pattern of the current layer and the circuit pattern of the next layer are aligned, alignment marks for alignment positions are respectively formed on the printed substrate and the photomask on which the circuit pattern is drawn. Then, the alignment mark of the printed substrate and the alignment mark of the reticle are precisely aligned, whereby the circuit pattern is placed on the printed substrate, and the light containing the ultraviolet ray is irradiated to expose the circuit pattern to the transfer.

For example, Patent Document 1 discloses a alignment method and an exposure apparatus for aligning a substrate and a circuit pattern as described above. In the exposure apparatus of Patent Document 1, a plurality of alignment marks are provided on the printed substrate and the photomask, and the center of gravity of the alignment marks is obtained and alignment is performed so that the center of gravity coincides. Further, the exposure apparatus of Patent Document 1 repeatedly performs the above-described registration for N times, and determines the alignment position having the smallest offset below the specific value as the most appropriate alignment position.

Prior technical literature Patent literature

[Patent Document 1] Special Opening 2005-274687

However, the alignment system sets a certain specific range for the alignment mark of the current layer, and the alignment is completed as long as the specific range is entered. Therefore, when the lamination is repeated, the error accumulates, and the alignment mark of the first layer and the alignment mark of the uppermost layer are largely shifted, and are gradually shifted from the position where they should be (the design coordinate position of the mask, etc.). .

As shown in Patent Document 1, the printed circuit board and the photomask are stretched or deformed due to temperature, humidity, and other engineering reasons. For example, in the alignment between the alignment marks of the printed circuit board and the photomask described above, even Completing the alignment between the alignment marks of the current layer also does not guarantee alignment accuracy with the previously exposed alignment marks. Therefore, when a plurality of layers are exposed to form a circuit pattern, the circuit pattern formed at the end is shifted from the position where it should be (the design coordinate position of the mask, etc.), and components such as ICs or LSIs that cannot be mounted on the surface of the printed substrate cannot be integrated. The problem.

The present invention has been made in view of the above problems, and provides a aligning apparatus and an exposure apparatus having a aligning apparatus capable of appropriately correcting an exposure position so as to be close to a position (a design coordinate position of a reticle, etc.) At the same time, the circuit pattern is exposed.

The alignment device of the first aspect is configured to perform alignment of a mask on which a pattern to be transferred and a mask mark are to be transferred, and a substrate on which the pattern and the alignment mark are transferred. The aligning device comprises: a storage portion for storing the alignment mark to be formed at a design coordinate position of the substrate; and a measuring portion for measuring the rotation a coordinate position of the alignment mark printed on the substrate; and a calculation unit that calculates a target coordinate position at which the coordinate position of the alignment mark measured by the measurement unit is moved to the design coordinate position by a specific distance. Moreover, the target coordinate position is aligned with the reticle mark of the reticle.

The calculation unit of the registration device of the second aspect is a point on a straight line connecting the coordinate position of the alignment mark and the design coordinate position as the target coordinate position.

The calculation unit of the third position alignment device calculates an intersection of a line connecting the design coordinate position and the coordinate position of the alignment mark with a circumference of a specific radius centered on the design coordinate position, and the line and The coordinate position of the alignment mark is the intersection of the circumference of the first radius of the center of the circle, and the center of the intersection is used as the target coordinate position.

The calculation unit of the alignment device of the fourth aspect calculates two intersections of a circumference having a specific radius of the design coordinate position and a circumference of the first radius of the center of the coordinate position of the alignment mark, and The intersection of the straight line connecting the two intersection points and the line connecting the coordinate position of the alignment mark and the design coordinate position is taken as the target coordinate position.

The fifth position alignment device will be in the specific range including the target coordinate position as the area of the alignment mark transferred to the next layer to be aligned.

In the sixth embodiment, the alignment device has the second radius within the center of the target coordinate position as the specific range.

The calculation unit of the seventh embodiment of the registration device is an overlapping region within a specific radius of the center of the design coordinate position and an allowable range within the first radius centered on the coordinate position of the alignment mark. As this special Set the range.

In the eighth alignment device, the calculation unit calculates the specific radius and the first one according to the distance between the design coordinate position and the coordinate position of the alignment mark and the number of layers remaining to the outermost layer. radius.

The ninth aspect of the aligning device has an input unit for the operator to input the specific radius and the first radius.

An exposure apparatus according to a tenth aspect, comprising: a mask stage on which the mask is placed; and a substrate stage on which the substrate is moved, and having the alignment device according to any one of the first to ninth aspects.

The alignment device and the exposure device of the present invention are advantageous in that the exposure position can be appropriately corrected so as to be close to the position (the design coordinate position of the photomask, etc.) where it should be, and at the same time, the circuit pattern is exposed.

(Configuration of Projection Exposure Apparatus 100)

FIG. 1 is a schematic view showing the arrangement of components of the projection exposure apparatus 100.

As shown in FIG. 1, the projection exposure apparatus 100 includes a light source unit 20, a projection optical system 40, and a substrate stage 50 that holds the printed substrate PB. Further, the projection exposure apparatus 100 includes a laser interferometer 60, an alignment camera 70, and a control unit 80.

The light source unit 20 includes a mercury lamp 21 that illuminates light including ultraviolet rays having a specific wavelength, an elliptical mirror 23 that condenses and reflects the light emitted from the mercury lamp 21, and a light for illuminating the light emitted from the elliptical mirror 23. The compound eye lens 25 is uniformly distributed. The fly-eye lens 25 illuminates the light that has been uniformized onto the mask MK on which the circuit pattern is drawn. On the reticle MK, a reticle mark MM is also drawn on the periphery of the circuit pattern. The mask MK is placed on the mask stage 30. Light passing through the reticle MK proceeds to the projection optical system 40.

The projection optical system 40 is disposed to be symmetrical with respect to each optical element between the photomask MK and the printed substrate PB. In the projection optical system 40, an incident side convex lens 41 is provided above the reflector 42 disposed at the center, and an exit side convex lens 46 is provided below. The incident side convex lens 41 and the exit side convex lens 46 are arranged coaxially with the reflector 42 as a center, and are respectively arranged as a single lens, which is a lenticular lens. The incident side convex lens 41 and the exit side convex lens 46 are configured to have the same refractive index.

The incident side convex lens 41 causes the projection light transmitted through the mask MK to enter the first reflection surface 42a of the reflector 42. The reflector 42 is a mirror that changes the direction of the optical path, and has a first reflection surface 42a that deflects the projection light that has passed through the incident side convex lens 41, and a second reflection that deflects the projection light that is emitted from the concave mirror 45. Face 42b. The incident side convex lens 41 is set such that, in the first drawing, only the left half of the center of the lens is an effective optical path for the projection light. Further, the exit side convex lens 46 concentrates the projection light reflected from the second reflection surface 42b of the reflector 42. Like the incident side convex lens 41, the exit side convex lens 46 is set so that only the left half of the center of the lens is an effective light path for the projection light.

The first convex lens 43 and the plano-convex lens 44 of the correction optical system are disposed coaxially, and a concave mirror 45 is provided at a position facing the plano-convex lens 44. The concave mirror 45 is provided to adjust the projection optical system 40 Far hearted.

The substrate stage 50 includes a stage 51, a moving mirror 53, a drive unit 55 such as a motor, and a fixed plate 57. The stage 51 is moved on the fixed plate 57 in the X-axis direction and the Y-axis direction by the drive unit 55. Further, the stage 51 is rotated in the θ direction around the Z axis by the drive unit 55 on the fixed plate 57, and moves up and down in the Z-axis direction.

The printed circuit board PB is placed on the stage 51 of the substrate stage 50, and the printed circuit board PB is fixed to the stage 51 by vacuum suction. Further, the reference mark FM and the moving mirror 53 (53X, 53Y) are placed on the stage 51. The reference mark FM is provided at a position on the periphery of the stage 51 where the printed circuit board PB is not disposed. The moving mirror 53 is composed of an X-axis moving mirror 53X (see FIG. 2) extending in the Y-axis direction for confirming the position in the X-axis direction, and extending in the X-axis direction for confirming the position in the Y-axis direction. Y-axis moving mirror 53Y (see Figure 2).

The laser interferometer 60 irradiates the moving mirrors 53 (53X, 53Y) with laser light, and interferes with the laser light that is reflected by the laser beam and the laser beam that is irradiated to the fixed mirror (not shown), and the platform of the nanometer level measuring platform 51 is used. Coordinate position. Furthermore, the moving mirrors 53 (53X, 53Y) and the laser interferometer 60 need not be conventionally provided in the projection exposure apparatus 100. As long as the moving mirror 53 and the laser interferometer 60 are temporarily placed at the time of periodic inspection or shipment of the projection exposure apparatus 100, the platform coordinate position of the stage 51 is measured in a nanometer level, and the storage section 82 records the sum of the driving section 57. The relative positional relationship of the coordinate positions acquired by the measuring unit such as the encoder.

The alignment camera 70 has a half mirror and a CCD, and the reticle mark MM of the CCD photosensitive mask MK and the alignment mark of the printed substrate PB are transmitted through a half mirror or the like. Remember AM. The coordinate position of the alignment mark AM is determined based on the offset of the CCD-sensing mask mark MM and the alignment mark AM and the coordinate position measured by the laser interferometer 60. In the present embodiment, four mask marks MM are drawn on the mask MK, and when the circuit pattern of the mask MK and the mask mark MM are exposed on the printed substrate PB, four patterns are formed around the circuit pattern CP. Align the mark AM. Therefore, in the present embodiment, four alignment cameras 70 are disposed.

Further, the alignment camera 70 can also align the reference mark FM and the mask mark MM disposed on the stage 51 with a CCD by a half mirror or the like. The alignment camera 70 is provided with a moving unit that moves so as to be retracted from the optical path at the time of exposure and inserted into the optical axis direction of the projection optical system 40 when the alignment mark AM is photographed.

The control unit 80 controls the overall operation of the projection exposure apparatus 100, and controls the alignment operation of the mask mark MM of the mask MK and the alignment mark AM transferred to the printed board PB. For example, the control unit 80 controls the position of the stage 51 through the drive unit 55. Furthermore, the control unit 80 has a storage portion 82 that stores the alignment mark AM to be formed at the design coordinate position MC of the printed substrate. The storage unit 82 stores the coordinate position provided by the alignment camera 70, the position at which the circuit pattern of the mask MK is transferred to the printed circuit board PB, and the like. The control unit 80 further includes a calculation unit 84 that calculates a coordinate position of the alignment mark transferred to the next layer.

(Printed substrate PB placed on the stage 51)

Fig. 2 is a conceptual view showing the stage 51 on which the printed circuit board PB is placed viewed from above (+Z-axis direction). Further, a part of the printed circuit board PB is enlarged on the lower side of Fig. 2 .

An X-axis moving mirror 53X and a Y-axis moving mirror are arranged around the platform 51. 53Y, and the reference mark FM is placed around the platform 51. Further, the printed substrate PB is fixed to the center of the stage 51 by vacuum suction. For example, in FIG. 2, four circuit boards are manufactured from one printed circuit board PB. One circuit pattern is transferred to one circuit board, so the circuit patterns CP1 to CP4 are transferred.

On the mask MK, four mask marks MM are drawn around the circuit pattern, so that four alignment marks AM are formed around one circuit pattern CP. In the second drawing, an alignment mark AM of a cross shape is drawn, but it may also be a circle or the like. In the present specification, the alignment mark AM formed on the mth layer is referred to as an mth alignment mark AMm. That is, the alignment mark AM formed on the first layer is referred to as a first alignment mark AM1. Further, in the printed circuit board having a multilayer structure formed by the construction method, there are also more than 30 printed circuit boards.

The projection exposure apparatus 100 is a step type exposure apparatus. Therefore, the circuit pattern CP4 and the four alignment marks AM1 shown on the lower side of Fig. 2 are formed by one shot (one shot). When the circuit pattern of the second layer is formed, the four alignment marks AM1 of the first layer are used, and the circuit pattern is transferred after the alignment. Next, the alignment of the projection exposure apparatus 100 will be described.

(summary of the alignment method)

FIG. 3 is a flow chart showing a method of aligning the alignment using the projection exposure apparatus 100.

Steps S11 to S16 are steps for alignment of the photomask.

In step S11, the fiducial mark FM on the stage 51 is moved to the design position to the reticle mark MM. At this time, the interferometer 60 measures the platform 51 The position of the platform coordinates to ensure that the fiducial mark FM is at the design position.

In step S12, the alignment camera 70 detects the reference mark FM and stores the design coordinate position MC.

In the present embodiment, since four mask marks MM are drawn on the mask MK, steps S11 to S12 are repeatedly executed at the design position of the remaining mask marks MM as shown in step S13.

In step S14, the reticle mark MM is aligned to the design coordinate position MC stored in step S12. Thereby, the position of the mask MK is aligned with the design position of the substrate stage 50, and the coordinate position of the substrate stage 50 is measured by the interferometer 60.

In step S15, the alignment camera 70 detects the position of the reticle mark MM and stores it at the position in the field of view of the camera. Thereby, the mutual positional relationship between the design coordinate position MC as the reference stored in step S12 and the reticle mark MM is also stored.

In step S16, the printed circuit board PB on which the first layer has been formed is placed on the stage 51. That is, the first alignment mark AM1 has been transferred onto the printed substrate PB. Further, the same can be applied to the printed circuit board on which the previous layer from the second layer to the outermost layer has been formed.

In step S16, the amount of compensation in the yaw angle θ, the X-axis, and the Y-axis direction on the XY plane of the printed board PB is measured. The printed circuit board PB is placed on the stage 51 in a state of being inclined by a specific angle θ from the X-axis direction, or placed on the X-axis direction or the Y-axis direction from a specific position. Therefore, in step S16, the stage 51 is moved in the X-axis direction, for example, and the alignment camera 70 measures a plurality of first alignment marks AM1. Then, the rotation of the printed substrate PB is measured. The angle θ simultaneously calculates the XY coordinate position of, for example, the center position of the printed substrate PB. Based on the calculated XY coordinate position, the compensation amount in the X-axis and Y-axis directions of the printed circuit board PB or the compensation amount in the X-axis and Y-axis directions of one flash is calculated. The compensation amount is stored in the storage unit 82.

Next, it is judged whether or not the rotation angle θ of the printed substrate PB placed on the stage 51 is within a specific range. This is to make the X-axis or Y-axis direction of the stage 51 substantially coincide with the X-axis or Y-axis direction of the printed circuit board PB. If the rotational angle θ of the printed substrate PB does not enter a specific range, the stage 51 is rotated by θ such that the rotational angle θ enters a specific range. If the rotation angle θ of the printed substrate PB is within a specific range, step S17 is performed.

Steps S17 to S18 are steps of aligning the photomask and the substrate.

In step S17, the alignment camera 70 on the printed substrate PB measures the first alignment mark AM1. Here, referring to Fig. 4, the first alignment mark AM1 measured by the alignment camera 70 is shown.

Fig. 4 is a view in which a part of the printed circuit board PB to which the first layer is transferred and the mask mark MM of the mask MK are superimposed and drawn. Further, in step S11, the position where the reference mark FM on the stage 51 is moved to the design position of the mask mark MM is drawn as the design coordinate position MC. In the present embodiment, this is referred to as a design coordinate position MC.

The position of the circuit pattern and the alignment mark of the printed substrate PB placed on the stage 51 does not necessarily coincide with the design coordinate position of the mask MK due to the error, etching or heat treatment caused by the transfer accuracy. In Fig. 4, the first alignment mark AM1 is largely displaced from the design coordinate position of the mask MK and transferred. Traditionally, the next layer 2 mask MK is transferred to the direction In the case of the first printed circuit board PB of the first layer, the alignment mark AM2 of the second layer is transferred so as to coincide with the first alignment mark AM1. However, after the reverse layering, the alignment mark of the first layer and the alignment mark of the uppermost layer are largely deviated. Therefore, the calculation unit 84 in the present embodiment calculates the target coordinate position TG of the second layer alignment mark transfer in consideration of the design of the coordinate position MC in consideration of the first alignment mark AM1 (see the fifth to the first 8 picture).

Returning to Fig. 3 again, in step S20, the calculation unit 84 calculates the target coordinate position TG at which the second alignment mark AM2 of the second layer (secondary layer) should be transferred. The calculation method is as follows.

In step S18, the stage 51 is moved by the driving portion 55 so that the reticle mark MM is aligned with the calculated target coordinate position TG. Then, after the stage 51 is moved, the light source unit 20 illuminates the mask MK, and the light transmitted through the mask MK is transferred to the printed board PB by the projection optical system 40.

(How to calculate the target coordinate position TG)

Fig. 5 to Fig. 8 are conceptual diagrams for calculating a calculation method of the target coordinate position TG. 5 to 8 are enlarged views of the periphery of the first alignment mark AM1 (in a circle surrounded by a two-dot chain line) in the lower left diagram shown in Fig. 4 .

<Calculation Method 1>

In Fig. 5, the first alignment mark AM1 is a coordinate position measured by the alignment camera 70. The calculation unit 84 calculates the target coordinate position TG on the straight line LN that connects the design coordinate position MC stored in the storage unit 82 and the coordinate position of the first alignment mark AM1. The target coordinate position TG is a position where the length of the straight line LN is divided by a ratio of P (%): Q (%). For example, P is 20% to 60%. This is because if P is 20% or less, the target coordinate position TG does not approach the design coordinate position MC. Further, if P is 60% or more, the circuit pattern of the first layer and the circuit pattern of the second layer are likely to be overlapped and aligned.

Further, after the calculation unit 84 calculates the target coordinate position TG, the specific range 90 centering on the target coordinate position TG is set. When the platform 51 is moved to bring the reticle mark MM into a certain range 90, the alignment is completed. The specific range 90 is a range of the radius RA centered on the target coordinate position TG. The operator can input this radius RA from an input device (not shown). Alternatively, the radius RA may be calculated by the calculation unit 84 in accordance with the dimensional accuracy required for the printed substrate PB.

In addition, the radius RA may be smaller as it is closer to the outermost layer. Basically, in the inner layer program, the layer stacking program, the building program, the solder resist program, the bump program, and various programs, as the graphics are stacked, the closer to the outer layer, the stricter the specification. Therefore, the radius RA in the first layer or the like can be relatively large, and the radius RA of the outermost layer can be made small.

According to the alignment of the calculation method 1, the reticle mark MM is not aligned with the first alignment mark AM1 as in the conventional case, but is aligned to be close to the design coordinate position MC. Therefore, the outermost circuit pattern is brought close to the design coordinate position MC.

<Calculation Method 2>

As in Fig. 5, in Fig. 6, the first alignment mark AM1 is measured by the alignment camera 70 at a position deviated from the design coordinate position MC. Next, the calculation unit 84 sets the allowable range 91 of the first alignment mark AM1. Similarly, The allowable range 92 is also set for the design coordinate position MC.

The allowable range 91 of the first alignment mark AM1 is set to a range in which the circuit pattern formed on the second layer and the circuit pattern of the first layer are turned on. For example, the allowable range 91 is within a circle having the radius RB centered on the first alignment mark AM1. The allowable range 92 of the design coordinate position MC is set to be a range in which the electronic components such as ICs on the outermost layer of the printed circuit board PB are electrically connected. For example, the allowable range 92 is within the circle of the radius RC at which the design coordinate position MC is centered. The operator can input the radius RB and the radius RC from an input device (not shown). Alternatively, the calculation unit 84 may set the radius RB and the radius RC so as to be smaller toward the outer layer.

The calculation unit 84 calculates an intersection MG between the straight line LN connecting the design coordinate position MC and the coordinate position of the first alignment mark AM1 and the circumference of the allowable range 91, and the intersection MF of the circumference of the straight line LN and the allowable range 92. Further, the calculation unit 84 calculates the midpoint of the intersection MG and the intersection MF, and uses it as the target coordinate position TG.

After the calculation unit 84 calculates the target coordinate position TG, the range in which the circle within the allowable range 91 and the circle of the allowable range 92 overlap is set as the specific range 93 of the target coordinate position TG. When the platform 51 is moved to bring the reticle mark MM into the specific range 93, the alignment is completed. According to the alignment of the calculation method 2, the reticle mark MM is not aligned with the first alignment mark AM1 as in the conventional one, but is aligned to be close to the design coordinate position MC. Therefore, the outermost circuit pattern is brought close to the design coordinate position MC.

<Calculation Method 3>

The calculation method 3 is a combination of the calculation method 1 and the calculation method 2 Methods. Using the calculation method 3 described in FIG. 7, the calculation unit 84 calculates the intersection point MG and the midpoint of the intersection point MF as the target coordinate position TG, and is the same as the calculation method 2. After the calculation unit 84 calculates the target coordinate position TG, the calculation unit 84 sets a specific range 94 centering on the target coordinate position TG. The specific range 94 is a range of the radius RA centered on the target coordinate position TG. The operator can input this radius RA from an input device (not shown). When the platform 51 is moved to bring the reticle mark MM into the specific range 94, the alignment is completed.

<Calculation Method 4>

In the calculation method 4 shown in FIG. 8, the calculation unit 84 sets the allowable range 91 of the first alignment mark AM1, and sets the allowable range 92 of the design coordinate position MC. The allowable range 91 of the first alignment mark AM1 is within the circle of the radius RB centering on the first alignment mark AM1. The allowable range 92 of the design coordinate position MC is within the circle of the radius RC centered on the design coordinate position MC.

The calculation unit 84 calculates an intersection MH and an intersection MI at which the circumference of the allowable range 91 and the circumference of the allowable range 92 intersect, and calculates a straight line LO connecting the intersection MH and the intersection MI. Next, the calculation unit 84 obtains the intersection of the straight line LO and the straight line LN connecting the design coordinate position MC and the coordinate position of the first alignment mark AM1. The calculation unit 84 calculates the intersection of the straight line LO and the straight line LN as the target coordinate position TG. Then, a specific range 95 centering on the target coordinate position TG is set. The specific range 95 is a range of the radius RA centered on the target coordinate position TG. The operator can input this radius RA from an input device (not shown). When the platform 51 is moved to bring the reticle mark MM into a certain range 95, the alignment is completed.

The present invention has been described in detail with reference to the preferred embodiments of the present invention. For example, in the calculation method 4, although the range of the radius RA centered on the target coordinate position TG is a specific range, as in the calculation method 2, the range in which the circle within the allowable range 91 and the circle of the allowable range 92 are overlapped may be set. It is a specific range 93 of the target coordinate position TG.

20‧‧‧Light source department

21‧‧‧ Mercury lamp

23‧‧‧Oval mirror

25‧‧‧Future eye lens

30‧‧‧Mask table

40‧‧‧Projection optical system

41‧‧‧Injection side convex lens

42‧‧‧ reflector

42a‧‧‧1st reflecting surface

42b‧‧‧2nd reflecting surface

43‧‧‧1st convex lens

44‧‧‧ Plano-convex lens

45‧‧‧ concave mirror

46‧‧‧Extending convex lens

50‧‧‧Substrate table

51‧‧‧ platform

53‧‧‧Mobile mirror

55‧‧‧ Drive Department

57‧‧ ‧ fixing

60‧‧‧Laser Interferometer

70‧‧‧Aligning camera

80‧‧‧Control Department

82‧‧‧ Storage Department

84‧‧‧ Calculation Department

90, 93, 94‧‧ ‧ specific range

91, 92‧‧‧ Permissible range

100‧‧‧Projection exposure device

AM‧‧ Alignment mark (alignment mark AM1 of the first layer)

FM‧‧‧ benchmark mark

LN, LO‧‧‧ Straight line

MC‧‧‧Design coordinates location

MF, MG, MH, MI‧‧‧ intersection

MK‧‧‧Photo Mask

MM‧‧‧mask mark

PB‧‧‧Printing substrate

Radius of RA, RB, RC‧‧

TG‧‧‧target coordinate position

FIG. 1 is a schematic view showing the arrangement of components of the projection exposure apparatus 100.

Fig. 2 is a conceptual view showing the stage 51 on which the printed substrate PB is placed as viewed from above.

Figure 3 is a flow chart of the alignment method.

Fig. 4 is a view in which a part of the printed circuit board PB transferred to the first layer and the design coordinate position of the mask MK are overlapped and drawn.

Fig. 5 is a conceptual diagram of a calculation method 1 for calculating a target coordinate position TG.

Fig. 6 is a conceptual diagram of a calculation method 2 for calculating a target coordinate position TG.

Fig. 7 is a conceptual diagram of a calculation method 3 for calculating a target coordinate position TG.

Fig. 8 is a conceptual diagram of a calculation method 4 for calculating a target coordinate position TG.

20‧‧‧Light source department

21‧‧‧ Mercury lamp

23‧‧‧Oval mirror

25‧‧‧Future eye lens

30‧‧‧Mask table

40‧‧‧Projection optical system

41‧‧‧Injection side convex lens

42‧‧‧ reflector

42a‧‧‧1st reflecting surface

42b‧‧‧2nd reflecting surface

43‧‧‧1st convex lens

44‧‧‧ Plano-convex lens

45‧‧‧ concave mirror

46‧‧‧Extending convex lens

50‧‧‧Substrate table

51‧‧‧ platform

53‧‧‧Mobile mirror

55‧‧‧ Drive Department

57‧‧ ‧ fixing

60‧‧‧Laser Interferometer

70‧‧‧Aligning camera

80‧‧‧Control Department

82‧‧‧ Storage Department

84‧‧‧ Calculation Department

FM‧‧‧ benchmark mark

MK‧‧‧Photo Mask

MM‧‧‧mask mark

PB‧‧‧Printing substrate

Claims (10)

A aligning device for performing alignment of a reticle with a pattern and a reticle mark intended to be transferred and a substrate to which the pattern and the alignment mark are transferred, the aligning device comprising: a storage portion The storage is based on a coordinate position of the reticle mark and is a design coordinate position at which the alignment mark should be formed at a coordinate position of the substrate; and a measuring portion that measures a coordinate position of the alignment mark transferred to the substrate; And a calculation unit that calculates a target coordinate position of the coordinate position of the alignment mark measured by the measuring unit to the design coordinate position by a specific distance; wherein the target coordinate position is opposite to the reticle mark of the reticle Counterpoint. The registration device according to claim 1, wherein the calculation unit uses a point on a straight line connecting the coordinate position of the alignment mark and the design coordinate position as the target coordinate position. The registration device according to claim 1, wherein the calculation unit calculates an intersection of a line connecting the coordinate position of the alignment mark and the design coordinate position with a circumference of a specific radius centered on the design coordinate position, and The line is at the intersection of the circumference of the first radius of the center of the circle with the coordinate position of the alignment mark, and the center of the intersection is used as the target coordinate position. The registration device according to claim 1, wherein the calculation unit calculates a circumference of a specific radius centered on the design coordinate position and the pair The coordinate position of the quasi-mark is two intersections of the circumference of the first radius of the center, and the intersection of the line connecting the two intersection points and the line connecting the coordinate position of the alignment mark and the line of the design coordinate position is used as the target coordinate position. . The alignment device according to any one of claims 1 to 4, wherein the alignment device is included in the specific range including the target coordinate position, and is aligned in the field of the alignment mark transferred to the next layer. The alignment device according to claim 5, wherein the target radius is within the second radius of the center of the circle as the specific range. The registration device according to claim 5, wherein the calculation unit has an allowable range within a specific radius centered on the design coordinate position and a first radius within a center of the coordinate position of the alignment mark The overlapping area of the allowable range is taken as the specific range. The aligning device according to any one of claims 3, 4, and 7, wherein the calculating portion is based on the distance between the design coordinate position and the coordinate position of the alignment mark and remaining to the outermost layer. The number of layers, the specific radius and the first radius are calculated. The alignment device according to any one of claims 3, 4, and 7, has an input unit that allows an operator to input the specific radius and the first radius. An exposure apparatus comprising a mask stage on which the mask is placed and a substrate stage on which the substrate is moved; and the alignment apparatus according to any one of claims 1 to 9.