CN103403624B - Alignment device and the exposure device with this alignment device - Google Patents
Alignment device and the exposure device with this alignment device Download PDFInfo
- Publication number
- CN103403624B CN103403624B CN201280010916.4A CN201280010916A CN103403624B CN 103403624 B CN103403624 B CN 103403624B CN 201280010916 A CN201280010916 A CN 201280010916A CN 103403624 B CN103403624 B CN 103403624B
- Authority
- CN
- China
- Prior art keywords
- coordinate position
- alignment mark
- alignment
- alignment device
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Abstract
The invention provides a kind of alignment device, it can keep the aligning accuracy with lower floor in the multilayer printed board of electronic circuit, and can integrate the contraposition between the electronic unit that is arranged on surface.This alignment device has: storage part (82), and its storage alignment mark (AM) should be formed in the design coordinate position (MC) on substrate (PB); Determination part (70), it measures the coordinate position being transferred to the alignment mark of substrate; And calculating part (84), its coordinate position calculating the alignment mark determined by determination part moves the target coordinate position (TG) of preset distance to design coordinate position.
Description
Technical field
The present invention relates to alignment device and have the exposure device of this alignment device, this alignment device carries out contraposition on the printed base plate etc. of insulation course and the alternately laminated high-density multi-layered structure of conductor layer.
Background technology
In the manufacturing process of the printed base plate of the high-density multi-layered structure be laminated by insulation course and conductor layer, need accurately to aim at the position of connection between layer and circuitous pattern.Such as, when utilizing lamination legal system to make the printed base plate of sandwich construction, needing to aim at the circuitous pattern that formed the current layer of figure and forming the circuitous pattern of lower one deck.Generally speaking, when carrying out contraposition to the circuitous pattern of current layer and the circuitous pattern of lower one deck, there is the alignment mark photomask of circuitous pattern formed respectively for contraposition at printed base plate and drafting.Then, by the alignment mark of the alignment mark and photomask of accurately aiming at printed base plate, by circuitous pattern contraposition to printed base plate, and irradiate bag light with violet rays exposure transfer printing is carried out to circuitous pattern.
Such as patent documentation 1 discloses the alignment method and the exposure device that substrate and circuitous pattern are carried out to contraposition as described above.The exposure device of patent documentation 1 is provided with multiple alignment mark respectively on printed base plate and photomask, obtains the center of gravity of alignment mark and carries out contraposition, makes this center of gravity consistent.And the exposure device of patent documentation 1 repeats N above-mentioned contraposition, and the para postion of the minimum value of its deviation below setting is judged as best para postion.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2005-274687
Summary of the invention
The problem that invention will solve
But contraposition sets certain preset range to the alignment mark of current layer, just terminates contraposition as long as enter in this preset range.Therefore, when repeating stacking, there is time error to accumulate, thus make there is very large deviation between the alignment mark of the 1st layer and the alignment mark of the superiors, original position (the design coordinate position etc. of photomask) can be departed from gradually.
Patent documentation 1 also illustrates, due to the reason in temperature and humidity and other operation, cause the flexible and distortion of printed base plate and photomask sometimes, in contraposition between printed base plate as described above and the alignment mark of photomask, namely the contraposition carried out between the alignment mark of current layer is allowed to, the aligning accuracy between the alignment mark that also cannot ensure prior exposure with it.Therefore, when forming circuitous pattern when exposing multiple layer, the final circuitous pattern formed can depart from original position (the design coordinate position etc. of photomask), produces the problem cannot integrating the parts such as IC or LSI be arranged on the surface of printed base plate.
The present invention completes just in view of the above problems, a kind of alignment device and the exposure device with this alignment device are provided, suitably can revise exposure position and make it close to original position (the design coordinate position etc. of photomask) while expose circuitous pattern.
The means of dealing with problems
The alignment device of the 1st mode answers the photomask of the figure of transfer printing and mask mark to carry out contraposition with the substrate being transferred figure and alignment mark to drawing to have.Alignment device has: storage part, and its storage should form the design coordinate position of alignment mark on substrate; Determination part, it measures the coordinate position of the alignment mark be transferred on substrate; And calculating part, its coordinate position calculating the alignment mark determined by determination part moves the target coordinate position after preset distance to design coordinate position.Further, relatively contraposition is carried out to the mask mark of target coordinate position and photomask.
The calculating part of the alignment device of the 2nd mode using on the straight line of the coordinate position and design coordinate position that link alignment mark a bit as target coordinate position.
The straight line that the calculating part of the alignment device of the 3rd mode calculates the coordinate position linking design coordinate position and alignment mark with by the intersection point of the circumference of the intersection point and straight line and the 1st radius centered by the coordinate position of alignment mark that design the circumference of the predetermined radii centered by coordinate position, and using the center of these 2 intersection points as target coordinate position.
The calculating part of the alignment device of the 4th mode calculates 2 intersection points of the circumference to design the circumference of the predetermined radii centered by coordinate position and the 1st radius centered by the coordinate position of alignment mark, and the straight line linking these 2 intersection points is designed the intersection point of the straight line of the coordinate position of coordinate position and alignment mark as target coordinate position with link.
The alignment device of the 5th mode using in the preset range comprising target coordinate position as being transferred to the region of alignment mark of lower one deck to carry out contraposition.
The alignment device of the 6th mode by the 2nd radius centered by target coordinate position as preset range.
The calculating part of the alignment device of the 7th mode by the overlapping region of the permissible range in the predetermined radii designed centered by coordinate position and the permissible range in the 1st radius centered by the coordinate position of alignment mark as preset range.
In the alignment device of the 8th mode, predetermined radii and the 1st radius are that calculating part carries out calculating according to the distance between design coordinate position and the coordinate position of alignment mark and the residue number of plies to outermost layer.
The alignment device of the 9th mode has input block, and this input block inputs predetermined radii and the 1st radius for operator.
The exposure device of the 10th mode comprises the mask platform of mounting photomask and makes the Substrate table of substrate movement, and wherein, this exposure device has the 1st mode to the alignment device of any one in the 9th mode.
Invention effect
The advantage of alignment device of the present invention and exposure device is: suitably can revise exposure position and make it close to design coordinate position while expose circuitous pattern.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the configuration of each key element schematically showing projection aligner 100.
Fig. 2 is the concept map observing the platform 51 having loaded printed base plate PB from above.
Fig. 3 is the process flow diagram of alignment methods.
Fig. 4 is by a part of the printed base plate PB of the 1st layer of transfer printing and the overlapping figure described of the design coordinate position of mask MK.
Fig. 5 is the figure schematically describing the computing method 1 calculating target coordinate position TG.
Fig. 6 is the figure schematically describing the computing method 2 calculating target coordinate position TG.
Fig. 7 is the figure schematically describing the computing method 3 calculating target coordinate position TG.
Fig. 8 is the figure schematically describing the computing method 4 calculating target coordinate position TG.
Embodiment
(structure of projection aligner 100)
Fig. 1 is the schematic diagram of the configuration of each key element representing projection aligner 100.
As shown in Figure 1, projection aligner 100 comprises: the Substrate table portion 50 of light source portion 20, projection optical system 40 and maintenance printed base plate PB.Further, projection aligner 100 comprises: laser interferometer 60, alignment cameras 70 and control part 80.
Light source portion 20 comprises: mercury vapor lamp 21, and it irradiates the ultraviolet light comprising predetermined wavelength; Elliptical reflector 23, it is assembled light that this mercury vapor lamp 21 irradiates and reflects; And fly's-eye lens 25, it is for making the Illumination Distribution homogenising of the light irradiated from this elliptical reflector 23.The illumination of homogenising is mapped to and depicts on the mask MK of circuitous pattern by fly's-eye lens 25.On mask MK, the periphery of circuitous pattern has also drawn mask mark MM.Mask MK is positioned in mask platform portion 30.Light through mask MK enters projection optical system 40.
Projection optical system 40 is arranged between mask MK and printed base plate PB in the mode of each optical element symmetry.This projection optical system 40 has light incident side convex lens 41 above the reflecting body 42 being configured at central authorities, has exiting side convex lens 46 in below.Light incident side convex lens 41 and exiting side convex lens 46 are that central authorities configure on the same axis with reflecting body 42, and use biconvex lens respectively and be configured to single lens.At this, light incident side convex lens 41 and exiting side convex lens 46 are configured to have same refractive index.
Light incident side convex lens 41 make the projected light through mask MK be injected on the 1st reflecting surface 42a of reflecting body 42.Reflecting body 42 be change light path towards catoptron, it has: the 1st reflecting surface 42a, and it makes to be partial to through the projected light of light incident side convex lens 41; And the 2nd reflecting surface 42b, it makes to be emitted through from concave mirror 45 projected light come and is partial to.Light incident side convex lens 41 are set as, half part only having lens center in FIG to turn left is to the effective light path of projected light.Further, exiting side convex lens 46 make the projected light reflected from the 2nd reflecting surface 42b of reflecting body 42 assemble.These exiting side convex lens 46 are set as, the same with light incident side convex lens 41, and half part only having central authorities to turn left is to the effective light path of projected light.
Be equipped with the 1st convex lens 43 and the plano-convex lens 44 as revising optical system on the same axis, and be configured with concave mirror 45 in the position opposite with this plano-convex lens 44.Arranging concave mirror 45 is hearts far away in order to adjust projection optical system 40.
Substrate table portion 50 has drive division 55 and the chassis 57 such as platform 51, moving lens 53, motor.Platform 51 is moved along X-direction and Y direction on chassis 57 by drive division 55.Further, platform 51 is rotated to the θ direction centered by Z axis on chassis 57 by drive division 55, and moves up and down in Z-direction.
The platform 51 in Substrate table portion 50 loads printed base plate PB, and printed base plate PB is fixed on the upper surface of platform 51 by the mode of vacuum suction.Further, platform 51 is configured with reference mark FM and moving lens 53(53X, 53Y).Reference mark FM is configured in a place of platform 51 periphery not being configured with printed base plate PB.Moving lens 53 by X-axis moving lens 53X(see Fig. 2) and Y-axis moving lens 53Y(see Fig. 2) form, this X-axis moving lens 53X extends along Y direction to confirm the position of X-direction, and this Y-axis moving lens 53Y extends along X-direction to confirm the position of Y direction.
Laser interferometer 60 is to moving lens 53(53X, 53Y) irradiating laser, and the laser that moving lens 53 is reflected and the laser be radiated on not shown fixed mirror produce interference, measure the platform coordinate position of platform 51 with nanometer scale.In addition, projection aligner 100 does not need standing moving lens 53(53X, 53Y) and laser interferometer 60.As long as when the making regular check on of projection aligner 100 or shipment time load moving lens 53 and laser interferometer 60 temporarily, the platform coordinate position of platform 51 is measured, the relative position relation between the coordinate position that the determination part such as scrambler of storage platform coordinate position and drive division 57 obtains in storage part 82 simultaneously with nanometer scale.
Alignment cameras 70 has half-reflecting mirror and CCD, carries out light via half-reflecting mirror etc. by CCD to the alignment mark AM that the mask of mask MK marks MM and printed base plate PB.According to the coordinate position that the mask of CCD institute light marks the departure between MM and alignment mark AM and determined by laser interferometer 60, measure the coordinate position of alignment mark AM.In present embodiment, on mask MK, drafting has 4 masks mark MM, and on printed base plate PB when the circuitous pattern of exposed mask MK and mask mark MM, the surrounding of circuitous pattern CP can form 4 alignment mark AM.Therefore, 4 alignment cameras 70 are configured with in the present embodiment.
In addition, alignment cameras 70 also can mark MM by CCD to the reference mark FM be configured on platform 51 and mask via half-reflecting mirror etc. and carries out light.This alignment cameras 70 has mobile unit and carries out following movement: avoid light path when exposing, and is inserted into the optical axis direction of projection optical system 40 when taking alignment mark AM.
Control part 80 controls the action of the entirety of projection aligner 100, and the mask controlling mask MK marks MM and is transferred in the alignment actions between the alignment mark AM on printed base plate PB.Such as, control part 80 is via the position of drive division 55 parametric controller 51.Further, control part 80 has storage part 82, and this storage part 82 stores alignment mark AM should be formed in design coordinate position MC on printed base plate.This storage part 82 stores the coordinate position from alignment cameras 70, and the circuitous pattern storing mask MK is transferred to the position etc. on printed base plate PB.Control part 80 also has calculating part 84, and this calculating part 84 calculates the coordinate position being transferred to the alignment mark of lower one deck.
(being placed in the printed base plate PB on platform 51)
Fig. 2 is that (+Z-direction) observes the concept map having loaded the state of printed base plate PB at platform 51 from above.Further, the figure having and a part of printed base plate PB amplified is drawn in the downside of Fig. 2.
The surrounding of platform 51 is configured with X-axis moving lens 53X and Y-axis moving lens 53Y, and the circumferential arrangement of platform 51 has reference mark FM.And printed base plate PB is fixed on the central authorities of platform 51 by the mode of vacuum suction.Such as in fig. 2,4 circuit substrates are manufactured by 1 printed base plate PB.Because 1 circuitous pattern CP is transferred on 1 circuit substrate, so be transferred circuitous pattern CP1 ~ CP4.
Because drafting around circuitous pattern on mask MK has 4 mask mark MM, therefore the surrounding of 1 circuitous pattern CP is also formed with 4 alignment mark AM.In fig. 2, alignment mark AM is drawn into cross shape, but also can be toroidal etc.In this manual, the alignment mark AM being formed in m layer is called m alignment mark AMm.That is, the alignment mark AM being formed in the 1st layer is expressed as the 1st alignment mark AM1.In addition, in the printed base plate of the sandwich construction formed by lamination method, also there is the printed base plate more than 30 layers.
Projection aligner 100 is the exposure device of Step-and-repeat formula.Therefore, by primary transfer (1 flash of light), circuitous pattern CP4 and 4 the alignment mark AM1 be plotted on the downside of Fig. 2 is formed.When the circuitous pattern of formation the 2nd layer, transfer printing circuitous pattern after using 4 alignment mark AM1 of the 1st layer to aim at.Then, the aligning about projection aligner 100 is described.
(summary of alignment methods)
Fig. 3 is the process flow diagram using projection aligner 100 to carry out the alignment methods of aiming at.
Step S11 ~ S16 is the operation about mask registration.
In step s 11, the reference mark FM on platform 51 is made to move to the design attitude of mask mark MM.Now, interferometer 60 measures the platform coordinate position of platform 51, ensures that reference mark FM is positioned at design attitude.
In step s 12, alignment cameras 70 detection reference flag F M, and design Storage coordinate position MC.
In the present embodiment, there are 4 mask mark MM owing to drawing on mask MK, therefore as shown in step S13, the design attitude of remaining mask mark MM repeat step 11 ~ step 12.
In step S14, mask is marked MM and be registered to the design coordinate position MC stored in step s 12.Thus, mask MK is made to use interferometer 60 to determine position in the design in the Substrate table portion 50 of coordinate position to being positioned at.
In step S15, alignment cameras 70 detects the position of mask mark MM, and stores the position in camera fields of view.Thus, the mutual alignment relation between the design coordinate position MC as benchmark stored in step 12 and mask mark MM is all stored.
In step s 16, on platform 51, mounting defines the printed base plate PB of the 1st layer.That is, transfer printing the 1st alignment mark AM1 on printed base plate PB.In addition, the printed base plate from the 2nd layer to outermost front one deck is applicable to define too.
In step s 16, the side-play amount of the rotation angle θ in the XY plane of printed base plate PB, X-axis and Y direction is determined at.Printed base plate PB is sometimes to be placed on platform 51 from the state of X-direction predetermined oblique angle θ, or mounting is in X-direction or Y direction out of position.Therefore, make platform 51 move to such as X-direction in step s 16, alignment cameras 70 measures multiple 1st alignment mark AM1.Then, measure the rotation angle θ of printed base plate PB, and calculated example is as the XY coordinate position of the center of printed base plate PB.According to the XY coordinate position calculated, calculate the X-axis of printed base plate PB and the side-play amount of Y direction further, or the side-play amount of the X-axis of glistening for 1 time and Y direction.Side-play amount is stored in storage part 82.
Then, judge whether the rotation angle θ of the printed base plate PB be positioned on platform 51 enters preset range.This is that X-axis or Y direction in order to make the X-axis of platform 51 or Y direction and printed base plate PB is roughly consistent.If the rotation angle θ of printed base plate PB does not enter preset range, then platform 51 rotates θ and makes rotation angle θ enter preset range.If the rotation angle θ of printed base plate PB enters preset range, then carry out step S17.
Step 17 ~ step 18 is the operations of aiming at mask and substrate.In step S17, the alignment cameras 70 on printed base plate PB measures the 1st alignment mark AM1.At this, represent with reference to Fig. 4 the 1st alignment mark AM1 that alignment cameras 70 determines.
A part of the printed base plate PB of the 1st layer of transfer printing and the mask of mask MK are marked the overlapping figure drawn of MM by Fig. 4.MC in this figure represents, makes the reference mark FM on platform 51 move to the position of the design attitude of mask mark MM in a step 11.Be referred to as design coordinate position MC in the present embodiment.
Due to the error of transfer printing precision, etching or thermal treatment, be placed in the circuitous pattern of printed base plate PB on platform 51 and the position of alignment mark may not be consistent with the design coordinate position of mask MK.In the diagram, be that the 1st alignment mark AM1 significantly departs from the design coordinate position of mask MK and the example be transferred.In the past, when being transferred to by the mask MK of ensuing 2nd layer on such printed base plate PB of the 1st layer, the alignment mark AM2 that transfer printing is the 2nd layer makes it as far as possible consistent with the 1st alignment mark AM1.But after repeatedly stacking, the alignment mark of the 1st layer just significantly deviate from the alignment mark of the superiors.Therefore, the calculating part 84 of present embodiment not only considers the 1st alignment mark AM1, also considers design coordinate position MC, calculates the target coordinate position TG(of the alignment mark of transfer printing the 2nd layer see Fig. 5 ~ Fig. 8).
Come back to Fig. 3, in step S17, the 2nd alignment mark AM2 that calculating part 84 calculates the 2nd layer (lower one deck) answers the target coordinate position TG of transfer printing.Computing method as described later.
In step S18, platform 51 is moved by drive division 55, makes mask mark MM and aims at the target coordinate position TG calculated.Then, after platform 51 moves, light source portion 20 irradiates mask MK, and the light through mask MK is transferred on printed base plate PB via projection optical system 40.
(computing method of target coordinate position TG)
Fig. 5 to Fig. 8 schematically describes the figure that calculating part 84 calculates the computing method of target coordinate position TG.Fig. 5 to Fig. 8 is the figure amplified by the periphery (in the circle irised out with double dot dash line) of the 1st alignment mark AM1 of the lower-left figure shown in Fig. 4.
(computing method 1)
In Figure 5, the 1st alignment mark AM1 is the coordinate position measured by alignment cameras 70.On the straight line LN of coordinate position linking design coordinate position MC and the 1st alignment mark AM1 be stored in storage part 82, calculating part 84 calculates target coordinate position TG.Target coordinate position TG is with P(% by the length of straight line LN): Q(%) ratio carries out the position split.Such as, P is 20% ~ 60%.This is because when P is below 20%, target coordinate position TG keeps off design coordinate position MC, when P is more than 60%, the possibility that the circuitous pattern of the circuitous pattern of the 1st layer and the 2nd layer can not overlap increases.
Further, after calculating part 84 calculates target coordinate position TG, the preset range 90 centered by target coordinate position TG is set.When mobile platform 51 makes mask mark MM enter preset range 90, complete aligning.Preset range 90 is the scopes of the radius R A centered by target coordinate position TG.Also this radius R A can be inputted by the never illustrated input media of operator.Or, also can calculate radius R A by the dimensional accuracy of calculating part 84 required by printed base plate PB.
Further, also can be less the closer to outermost layer radius R A.Substantially, in internal layer operation, lamination process, lamination operation, welding resistance operation, projection operation and various operation, along with the accumulation of figure, stricter the closer to outermost layer precision regulation.Therefore, radius R A in the 1st layer etc. also can be made comparatively large, and in outermost layer, radius R A is less.
Mask is not marked MM and aims at the 1st alignment mark AM1 by the aligning of computing method 1 as in the past, but can aim to make its mode close to design coordinate position MC.Therefore, outermost circuitous pattern is able to close to design coordinate position MC.
(computing method 2)
The same with Fig. 5, in figure 6, be also measure the 1st alignment mark AM1 by alignment cameras 70 on the position of off-design coordinate position MC.Then, calculating part 84 sets the permissible range 91 of the 1st alignment mark AM1.Equally, permissible range 92 is also set to design coordinate position MC.
The permissible range 91 of the 1st alignment mark AM1 is set to, makes the scope being formed at the circuitous pattern of the 2nd layer and the circuitous pattern conducting of the 1st layer.Such as, permissible range 91 is in the circle of radius R B centered by the 1st alignment mark AM1.The permissible range 92 of design coordinate position MC is set to, with the scope of the electronic unit conducting such as IC on the outermost layer of printed base plate PB.Such as, permissible range 92 is in the circle designing the radius R C centered by coordinate position MC.Also radius R B and radius R C can be inputted by the never illustrated input media of operator.Or, also can be more make radius R B and radius R C less close to outermost layer calculating part 84.
The intersection point MF that the circumference of the intersection point MG that calculating part 84 calculated line LN is crossing with the circumference of permissible range 91 and straight line LN and permissible range 92 intersects, wherein, the coordinate position that straight line LN links design coordinate position MC and the 1st alignment mark AM1 obtains.Then, calculating part 84 calculates mid point between intersection point MG and intersection point MF as target coordinate position TG.
After calculating part 84 calculates target coordinate position TG, the intersecting ranges in the circle of permissible range 91 and in the circle of permissible range 92 is set as the preset range 93 of target coordinate position TG.When mobile platform 51 makes mask mark MM enter preset range 93, complete aligning.Mask is not marked MM and aims at the 1st alignment mark AM1 by the aligning of computing method 2 as in the past, but can aim to make its mode close to design coordinate position MC.Therefore, outermost circuitous pattern is close to design coordinate position MC.
(computing method 3)
Computing method 3 are the methods being combined with computing method 1 and computing method 2.In the computing method 3 illustrated utilizing Fig. 7, it is the same with computing method 2 that calculating part 84 calculates mid point between intersection point MG and intersection point MF as the computing method before target coordinate position TG.After calculating part 84 calculates target coordinate position TG, set the preset range 94 centered by target coordinate position TG.Preset range 94 is the scopes of the radius R A centered by target coordinate position TG.Also this radius R A can be inputted by the never illustrated input media of operator.When mobile platform 51 makes mask mark MM enter preset range 94, complete aligning.
(computing method 4)
In the computing method 4 shown in Fig. 8, calculating part 84 sets the permissible range 91 of the 1st alignment mark AM1, and the permissible range 92 of setting design coordinate position MC.The permissible range 91 of the 1st alignment mark AM1 is in the circle of the radius R B centered by the 1st alignment mark AM1.The permissible range 92 of design coordinate position MC is in the circle designing the radius R C centered by coordinate position MC.
Calculating part 84 calculates the circumference of the permissible range 91 intersection point MH crossing with the circumference of permissible range 92 and intersection point MI, and calculates the straight line LO linking intersection point MH and intersection point MI.Then, calculating part 84 obtains the intersection point of straight line LN and straight line LO, and wherein, the coordinate position that straight line LN links design coordinate position MC and the 1st alignment mark AM1 obtains.The intersection point of calculating part 84 calculated line LO and straight line LN is as target coordinate position TG.Then, the preset range 95 centered by target coordinate position TG is set.Preset range 94 is the scope of the radius R A centered by target coordinate position TG.Also this radius R A can be inputted by the never illustrated input media of operator.When mobile platform 51 makes mask mark MM enter preset range 95, complete aligning.
Above, describe preferred forms of the present invention in detail, but as those skilled in the art clear and definite, the present invention in its technical scope can to embodiment carry out various change, distortion after implement.Such as, in computing method 4, by the scope of the radius R A centered by target coordinate position TG as preset range, but also can be the same with computing method 2, the intersecting ranges in the circle of permissible range 91 and in the circle of permissible range 92 is set as the preset range 93 of target coordinate position TG.
Label declaration
20: light source portion; 40: projection optical system; 50: Substrate table portion; 51: platform; 60: laser interferometer; 70: alignment cameras; 80: control part; 82: storage part; 84: calculating part; 90,93,94: preset range; 91,92: permissible range; 100: projection aligner; AM: alignment mark (alignment mark that AM1 is the 1st layer); LN, LO: straight line; MC: design coordinate position; MF, MG, MH, MI: intersection point; MK: mask; MM: mask marks; PB: printed base plate; RA, RB, RC: radius; TG: target coordinate position.
Claims (12)
1. an alignment device, it answers the photomask of the figure of transfer printing and mask mark to carry out contraposition with the substrate being transferred described figure and alignment mark to drawing to have, and it is characterized in that, this alignment device has:
Storage part, its storage should form the design coordinate position of described alignment mark on the substrate;
Determination part, it measures the coordinate position of the alignment mark be transferred on described substrate; And
Calculating part, its coordinate position calculating the described alignment mark determined by described determination part moves the target coordinate position after preset distance to described design coordinate position, and wherein, described target coordinate position is the transfer position of the alignment mark of lower one deck,
The described mask mark of described alignment device to described target coordinate position and described photomask relatively carries out contraposition.
2. alignment device according to claim 1, wherein,
Described calculating part using link on the coordinate position of described alignment mark and the straight line of described design coordinate position a bit as described target coordinate position.
3. alignment device according to claim 1, wherein,
Described calculating part calculates the intersection point of the intersection point of the described design coordinate position of link and the straight line of coordinate position of described alignment mark and the circumference of the predetermined radii centered by described design coordinate position and the circumference of described straight line and the 1st radius centered by the coordinate position of described alignment mark, and using the center of these 2 intersection points as described target coordinate position
Described predetermined radii and described 1st radius are that described calculating part carries out calculating according to the distance between described design coordinate position and the coordinate position of described alignment mark and the residue number of plies to outermost layer.
4. alignment device according to claim 1, wherein,
The circumference of predetermined radii of described calculating part calculating centered by described design coordinate position and 2 intersection points of the circumference of the 1st radius centered by the coordinate position of described alignment mark, using the straight line linking these 2 intersection points with link the intersection point of straight line of coordinate position of described design coordinate position and described alignment mark as described target coordinate position
Described predetermined radii and described 1st radius are that described calculating part carries out calculating according to the distance between described design coordinate position and the coordinate position of described alignment mark and the residue number of plies to outermost layer.
5. alignment device according to claim 1, wherein,
Using in the preset range comprising described target coordinate position as being transferred to the region of alignment mark of lower one deck to carry out contraposition.
6. the alignment device according to claim 3 or 4, wherein,
Using in the preset range comprising described target coordinate position as being transferred to the region of alignment mark of lower one deck to carry out contraposition.
7. alignment device according to claim 5, wherein,
By in the 2nd radius centered by described target coordinate position as described preset range.
8. alignment device according to claim 5, wherein,
Described calculating part by the overlapping region of the permissible range in the predetermined radii centered by described design coordinate position and the permissible range in the 1st radius centered by the coordinate position of described alignment mark as described preset range,
Described predetermined radii and described 1st radius are that described calculating part carries out calculating according to the distance between described design coordinate position and the coordinate position of described alignment mark and the residue number of plies to outermost layer.
9. alignment device according to claim 6, wherein,
Described calculating part by the overlapping region of the permissible range in the predetermined radii centered by described design coordinate position and the permissible range in the 1st radius centered by the coordinate position of described alignment mark as described preset range.
10. alignment device according to claim 8, wherein,
This alignment device has input block, and this input block inputs described predetermined radii and described 1st radius for operator.
11. alignment device according to claim 9, wherein,
This alignment device has input block, and this input block inputs described predetermined radii and described 1st radius for operator.
12. 1 kinds of exposure devices, it has the alignment device described in claim 1 to any one in claim 5 and claim 7 to claim 11,
Described exposure device comprises the mask platform loading described photomask and the Substrate table making described substrate movement.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-056638 | 2011-03-15 | ||
| JP2011056638 | 2011-03-15 | ||
| PCT/JP2012/055544 WO2012124517A1 (en) | 2011-03-15 | 2012-03-05 | Alignment device and exposure device provided with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103403624A CN103403624A (en) | 2013-11-20 |
| CN103403624B true CN103403624B (en) | 2016-01-20 |
Family
ID=46830592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280010916.4A Active CN103403624B (en) | 2011-03-15 | 2012-03-05 | Alignment device and the exposure device with this alignment device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5903426B2 (en) |
| CN (1) | CN103403624B (en) |
| TW (1) | TWI539250B (en) |
| WO (1) | WO2012124517A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113115517B (en) * | 2021-04-09 | 2022-07-15 | 武汉先河激光技术有限公司 | Registration method based on machine vision |
| CN112804826B (en) * | 2021-04-09 | 2021-08-06 | 武汉先河激光技术有限公司 | Registration device based on machine vision |
| JP2023032759A (en) * | 2021-08-27 | 2023-03-09 | 株式会社Ｓｃｒｅｅｎホールディングス | Drawing system, drawing method and program |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5451479A (en) * | 1993-04-26 | 1995-09-19 | Mitsubishi Denki Kabushiki Kaisha | Method of forming a pattern of a multilayer type semiconductor device |
| CN101059661A (en) * | 2006-04-04 | 2007-10-24 | Asml荷兰有限公司 | Lithographic apparatus and device manufacturing method |
| CN101535898A (en) * | 2006-08-31 | 2009-09-16 | 先进微装置公司 | A method and a system for reducing overlay errors within exposure fields by APC control strategies |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2722563B2 (en) * | 1988-11-22 | 1998-03-04 | ソニー株式会社 | Pattern formation method |
| JPH0536583A (en) * | 1991-07-30 | 1993-02-12 | Hitachi Ltd | Alignment method and manufacture of semiconductor integrated circuit device |
| JP3402750B2 (en) * | 1994-05-25 | 2003-05-06 | キヤノン株式会社 | Alignment method and device manufacturing method using the same |
| US6269322B1 (en) * | 1999-03-11 | 2001-07-31 | Advanced Micro Devices, Inc. | System and method for wafer alignment which mitigates effects of reticle rotation and magnification on overlay |
| JP4022374B2 (en) * | 2001-01-26 | 2007-12-19 | 株式会社ルネサステクノロジ | Semiconductor device manufacturing method and system |
| US7616313B2 (en) * | 2006-03-31 | 2009-11-10 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| DE102007046850B4 (en) * | 2007-09-29 | 2014-05-22 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Method for determining an overlay accuracy |
| JP2010021293A (en) * | 2008-07-09 | 2010-01-28 | Nec Electronics Corp | Semiconductor device and method of manufacturing the same |
| JP2010103476A (en) * | 2008-09-25 | 2010-05-06 | Canon Inc | Alignment unit and exposure apparatus |
-
2012
- 2012-02-21 TW TW101105586A patent/TWI539250B/en active
- 2012-03-05 JP JP2013504657A patent/JP5903426B2/en active Active
- 2012-03-05 CN CN201280010916.4A patent/CN103403624B/en active Active
- 2012-03-05 WO PCT/JP2012/055544 patent/WO2012124517A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5451479A (en) * | 1993-04-26 | 1995-09-19 | Mitsubishi Denki Kabushiki Kaisha | Method of forming a pattern of a multilayer type semiconductor device |
| CN101059661A (en) * | 2006-04-04 | 2007-10-24 | Asml荷兰有限公司 | Lithographic apparatus and device manufacturing method |
| CN101535898A (en) * | 2006-08-31 | 2009-09-16 | 先进微装置公司 | A method and a system for reducing overlay errors within exposure fields by APC control strategies |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2012124517A1 (en) | 2014-07-17 |
| TWI539250B (en) | 2016-06-21 |
| TW201243522A (en) | 2012-11-01 |
| WO2012124517A1 (en) | 2012-09-20 |
| CN103403624A (en) | 2013-11-20 |
| JP5903426B2 (en) | 2016-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4754924B2 (en) | Exposure equipment | |
| KR100855910B1 (en) | Exposure operation evaluation method for exposure apparatus and manufacturing method for semiconductor device | |
| CN103403624B (en) | Alignment device and the exposure device with this alignment device | |
| CN102197340B (en) | Exposure apparatus and photomask | |
| CN102903658A (en) | Substrate processing apparatus, substrate holding apparatus and method of holding substrate | |
| CN101981512A (en) | Alignment device for planar element, manufacturing equipment for the same, alignment method for the same, and manufacturing method for the same | |
| KR101230150B1 (en) | Charged-particle beam writing apparatus and charged-particle beam writing method | |
| JP6053266B2 (en) | Imprint apparatus, article manufacturing method, and imprint method | |
| CN105573064B (en) | Exposure method, exposure device and article manufacturing method | |
| KR20100052404A (en) | Exposure apparatus | |
| JP2015170815A (en) | Imprint device, alignment method, and manufacturing method for article | |
| WO2016121635A1 (en) | Mask case, storage device and storage method, transfer device and transfer method, and exposure device | |
| JP6584567B1 (en) | Lithographic apparatus, pattern forming method, and article manufacturing method | |
| CN103246170A (en) | Exposure device and exposure method | |
| CN108885404A (en) | Exposure device and exposure method | |
| KR102377041B1 (en) | How to align and calibrate the exposure system | |
| JP6537407B2 (en) | Projection exposure system | |
| CN101826454B (en) | Manufacturing method for a semiconductor device | |
| TW202307590A (en) | Double-sided exposure device | |
| JP6828107B2 (en) | Lithography equipment, pattern formation method and article manufacturing method | |
| CN100454146C (en) | Exposure apparatus | |
| CN102566338B (en) | Method for correcting alignment positions in photoetching alignment system | |
| KR102406914B1 (en) | Projection exposure apparatus and projection exposure method thereof | |
| CN106255922B (en) | EUV lithography device and its exposure method | |
| US8587782B2 (en) | Optical-component fabricating method and optical-component fabricating apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |