TWI533713B - Sound generator, sound generating device and electronic machine - Google Patents

Description

Sound generator, sound generator, and electronic machine

The present invention relates to a sound generator, a sound generating device, and an electronic device.

A sound generator using an actuator is known. For example, Patent Document 1 listed below discloses a sound generator that applies a voltage to a piezoelectric element attached to a diaphragm to vibrate, thereby vibrating the diaphragm to output sound.

In the technique described in Patent Document 1, a lead wire is welded to a piezoelectric element, and a voltage is applied to the piezoelectric element via the lead.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-23436

However, in the technique described in Patent Document 1, the lead wire vibrates due to the vibration of the vibrating plate, and the vibration of the lead wire makes it easy to generate a peak in the frequency characteristic of the sound pressure (the sound pressure is higher than the surrounding sound). Part) and valley (dip) (the sound pressure is lower than the surrounding part), and it is difficult to obtain good quality The problem of sound quality.

An aspect of the embodiment of the present invention has been made in view of the above problems, and an object thereof is to provide a sound generator, a sound generating device, and an electronic device that can obtain good sound pressure frequency characteristics.

An acoustic generator according to an embodiment of the present invention includes at least an actuator, a vibrating body, a resin layer, and a wiring member. The exciter vibrates by an electrical signal. The flat vibration system is equipped with an exciter that vibrates with the exciter by the vibration of the exciter. The resin layer is disposed so as to cover the surface of the exciter and the vibrating body to which the exciter is attached, and is integrally formed with the vibrating body and the exciter. The wiring member is connected to the trigger and outputs an electrical signal to the trigger. Further, the wiring member has a bent portion or a bent portion, and at least a part of the wiring member is located inside the resin layer.

According to an aspect of the embodiment of the present invention, good sound pressure frequency characteristics can be obtained.

1‧‧‧Sound generator

2, 2'‧‧‧ frame

3‧‧‧vibration board

3a‧‧‧ vibrating body

5‧‧‧Piezoelectric components

5a~5d‧‧‧piezoelectric layer

5e‧‧‧Internal electrode layer

5f, 5g‧‧‧ surface electrode layer

5h, 5j‧‧‧ external electrodes

6a, 6b‧‧‧ lead

6c‧‧‧Flexible wiring

7‧‧‧ resin layer

20‧‧‧Sound generator

21‧‧‧ recess

30, 40‧‧‧ cabinet

31, 33‧‧‧1st area

32, 34‧‧‧2nd area

50‧‧‧Electronic machines

50a‧‧‧ controller

50b‧‧‧Signal Delivery Department

50c‧‧‧Key input section

50d‧‧‧Microphone input

50e‧‧‧Display Department

50f‧‧‧Antenna

60‧‧‧Electronic circuits

61‧‧‧Connecting Department

62‧‧‧ Fixed Department

63‧‧‧Bend

L1~L4‧‧‧ imaginary line

Fig. 1A is a schematic plan view showing the configuration of a sound generator of an embodiment.

Fig. 1B is a cross-sectional view taken along line A-A' of Fig. 1A.

Fig. 2 is a cross-sectional view taken along line B-B' of Fig. 1B.

Fig. 3A is a schematic cross-sectional view (one) showing a variation of the lead.

Fig. 3B is a schematic cross-sectional view showing the variation of the lead wire (Part 2).

Fig. 3C is a schematic cross-sectional view showing the variation of the lead (Part 3).

Fig. 4 is a plan view (1) showing a variation of the lead.

Fig. 5 is a plan view (2) showing a variation of the lead.

Fig. 6 is a plan view showing a variation of the lead (3).

Fig. 7A is a plan view showing a variation of the frame and the lead.

Fig. 7B is a cross-sectional view taken along line C-C' of Fig. 7A.

Fig. 8A is a view showing the configuration of a sound generating device of the embodiment.

Fig. 8B is a view showing the configuration of an electronic apparatus of the embodiment.

Fig. 9A is a plan view showing a modification in which a flexible wiring is used as a wiring member.

Fig. 9B is a cross-sectional view taken along line D-D' of Fig. 9A.

[Formation of the Invention]

Hereinafter, embodiments of the sound generator, the sound generating device, and the electronic device of the present invention will be described in detail with reference to the accompanying drawings. Further, the present invention is not limited to the following embodiments.

First, the configuration of the sound generator 1 according to the embodiment will be described using FIG. 1A and FIG. 1B. Fig. 1A is a plan view showing the configuration of the sound generator 1 of the embodiment, and Fig. 1B is a cross-sectional view taken along line A-A' of Fig. 1A.

In addition, for ease of understanding, a three-dimensional Cartesian coordinate system including a Z-axis having a vertical direction in the vertical direction and a negative direction in the vertical direction is indicated in FIGS. 1A and 1B. Some of the other patterns used in the description below will also indicate the three-dimensional Cartesian coordinate system. In addition, in the first The designation of the resin layer 7 is omitted in Fig. 1A.

Further, in the same manner, for the sake of easy understanding of the explanation, FIG. 1B is an enlarged display of the sound generator 1 in the thickness direction (Z-axis direction).

As shown in FIG. 1A, the sound generator 1 includes a housing 2, a diaphragm 3, a piezoelectric element 5, and leads 6a and 6b. Further, as shown in FIG. 1A, in the following description, the case where the piezoelectric element 5 is one is exemplified, but the number of the piezoelectric elements 5 is not limited.

The casing 2 is composed of two rectangular frame-shaped frame members having the same shape, and the peripheral portion of the vibrating plate 3 is clamped to support the vibrating plate 3. The diaphragm 3 has a flat shape such as a plate shape or a film shape, and its peripheral portion is tightly clamped and fixed by the frame 2. In other words, the diaphragm 3 is supported by the frame 2 in a state of being stretched in the frame of the casing 2.

In addition, a portion of the vibrating plate 3 that is located further inside than the inner circumference of the casing 2, that is, a portion of the vibrating plate 3 that is not clamped by the casing 2 and is free to vibrate, is the vibrating body 3a. Therefore, the vibrating body 3a is formed in a frame having a substantially rectangular shape in the frame of the casing 2.

Further, the diaphragm 3 can be formed using various materials such as resin and metal. For example, the diaphragm 3 can be formed of a resin film such as polyethylene or polyimide having a thickness of 10 μm (micrometer) to 200 μm.

The thickness, material, and the like of the frame 2 are not particularly limited. The frame 2 can be formed using various materials such as metal and resin. For example, a stainless steel (stainless) frame or the like having a thickness of 100 μm to 1000 μm can be selected as the frame 2 for the reason of excellent mechanical strength and corrosion resistance.

Further, in FIG. 1A, although the frame 2 having a rectangular shape in the inner region is shown, it may be a polygon having a parallelogram, a trapezoid, and a regular n-gon. In the present embodiment, as shown in Fig. 1A, an example of a slightly rectangular shape is displayed.

The piezoelectric element 5 is an actuator that is attached to the surface of the vibrating body 3a or the like, and is vibrated by the application of a voltage, thereby exciting the vibrating body 3a to vibrate.

As shown in FIG. 1B, the piezoelectric element 5 has, for example, a laminate in which four layers of piezoelectric layers 5a, 5b, 5c, and 5d made of ceramics and three internal electrode layers 5e are alternately laminated. The surface electrode layers 5f and 5g formed on the upper surface and the lower surface of the laminated body, and the external electrodes 5h and 5j formed on the side surface on which the internal electrode layer 5e is exposed are formed.

Further, the piezoelectric element 5 has a plate shape, and the principal surfaces on the upper surface side and the lower surface side are formed in a rectangular or square polygonal shape. Further, the piezoelectric layers 5a, 5b, 5c, and 5d are polarized in a manner as indicated by an arrow in FIG. 1B. In other words, the polarization direction is polarized in such a manner that one direction of the thickness direction (Z-axis direction in the drawing) and the other side are reversed in the direction of the electric field applied at a certain moment.

An example of the lead members 6a and 6b is a wiring member, and is connected to the external electrodes 5h and 5j, respectively. When a voltage is applied to the piezoelectric element 5 via the leads 6a and 6b, for example, at a certain moment, the piezoelectric layers 5c and 5d adhering to the vibrating body 3a side are contracted and deformed, and the upper surface side of the piezoelectric element 5 is pressed. The electric body layers 5a, 5b are stretched and deformed. Therefore, by supplying an alternating current signal to the piezoelectric element 5, the piezoelectric element 5 is bent and vibrated, and the vibrating body 3a can be flexibly vibrated.

Further, the main surface of the piezoelectric element 5 is bonded to the main surface of the vibrating body 3a by an adhesive such as an epoxy resin.

Further, as the material constituting the piezoelectric layers 5a, 5b, 5c, and 5d, lead zirconate titanate (PZT), Bi-layered compound, or tungsten bronze type structure can be used ( A piezoelectric ceramic such as a non-lead piezoelectric material such as a compound such as a tungsten bronze-type structure.

Further, as the material of the internal electrode layer 5e, various metal materials can be used. For example, when a metal component composed of silver and palladium and a ceramic component constituting the piezoelectric layers 5a, 5b, 5c, and 5d are contained, heat due to the piezoelectric layers 5a, 5b, 5c, and 5d and the internal electrode layer 5e can be alleviated. The stress caused by the difference in expansion is able to obtain the piezoelectric element 5 having no lamination failure.

Further, as shown in FIG. 1B, the sound generator 1 further includes a resin layer 7 which is disposed so as to cover the surfaces of the piezoelectric element 5 and the vibrating plate 3 in the frame of the casing 2, and the vibrating plate 3 and the piezoelectric plate. The element 5 is formed in one piece.

The resin layer 7 is preferably formed, for example, by using an acrylic resin such that the Young's modulus is in the range of 1 MPa (Pa) to 1 GPa. By embedding the piezoelectric element 5 in the resin layer 7, an appropriate damping action can be induced. Therefore, the resonance phenomenon can be suppressed, and the peaks and valleys in the sound pressure frequency characteristics can be reduced.

In addition, in the first embodiment, the resin layer 7 is formed to have the same height as the casing 2, but the piezoelectric element 5 may be embedded. For example, the resin layer may be formed to be higher than the height of the casing 2. 7.

Further, in FIG. 1B, the piezoelectric element 5 is doubled. A bimorph type piezoelectric element is exemplified, but is not limited thereto. For example, a unimorph type in which a piezoelectric element that expands and contracts is adhered to the vibrating body 3a may be used.

Further, in the conventional sound generator, the lead wire vibrates due to the vibration of the vibration plate, and the vibration of the lead wire makes it easy to generate a peak in the frequency characteristic of the sound pressure (the portion where the sound pressure is higher than the surrounding portion) and Valley (the sound pressure is lower than the surrounding), and there is a problem that it is difficult to obtain good quality sound.

Therefore, in the present embodiment, at least a part of the leads 6a and 6b are buried in the resin layer 7, whereby the vibration of the leads 6a and 6b is suppressed. Thereby, the level of the peaks and valleys in the sound pressure frequency characteristics due to the vibration of the leads 6a and 6b can be reduced.

For example, by covering the connection portion of the lead wires 6a, 6b to the piezoelectric element 5 with the resin layer 7, the vibration of the leads 6a, 6b becomes difficult to be transmitted to the piezoelectric element 5, thereby further reducing the sound pressure frequency characteristics. The level of peaks and valleys in the middle.

In the case of the leads 6a and 6b, a stranded wire obtained by twisting a plurality of wires can be used. Compared with a single core wire, the twisted wire has high flexibility. Therefore, by using a twisted wire as the lead wires 6a and 6b, it is possible to make the wire breakage due to vibration less likely to occur than the use of the single core wire. In addition, the leads 6a, 6b do not have to be stranded.

Further, in the present embodiment, the lead wires 6a and 6b are provided with a margin. Thereby, the vibration of the lead wires 6a and 6b is absorbed by the margin portion, and thus the vibration of the lead wires 6a and 6b can be further suppressed. Further, it is only necessary to provide a margin or a bent portion in the lead wires 6a and 6b in order to provide a margin to the leads 6a and 6b.

Further, a recess may be provided in the casing 2, and the lead wires 6a and 6b may be taken out to the outside via the recess. In addition, the wiring member that inputs the electric signal to the piezoelectric element 5 is not limited to the lead wires 6a and 6b. For example, a flexible wiring in which a metal foil such as copper or aluminum is wrapped with a resin film may be used as the wiring member.

Hereinafter, the above description will be specifically described with reference to FIG. 2 . Fig. 2 is a cross-sectional view taken along line B-B' of Fig. 1B. Here, the lead 6b will be described here, and the lead 6a is the same lead as the lead 6b.

As shown in Fig. 2, at least a part of the lead 6b is located inside the resin layer 7. By providing at least a part of the lead 6b in the inside of the resin layer 7 as described above, it is possible to suppress the vibration of the lead 6b which is generated by the vibration of the vibrating body 3a as compared with the case where the lead 6b is not positioned inside the resin layer 7. Therefore, it is possible to suppress peaks and valleys in the sound pressure frequency characteristics due to the vibration of the lead wires 6b.

Further, the connection portion 61 of the lead 6b connected to the piezoelectric element 5 is covered by the resin layer 7. By covering the connection portion 61 of the lead 6b to the piezoelectric element 5 with the resin layer 7 as described above, the vibration of the lead 6b is less likely to be transmitted to the case where the portion other than the connection portion 61 is buried in the resin layer 7. With the piezoelectric element 5, it is possible to further reduce the level of peaks and valleys in the sound pressure frequency characteristics.

Further, by covering the connecting portion 61 with the resin layer 7, the lead 6b becomes less likely to be displaced from the piezoelectric element 5, and thus it is possible to prevent the lead 6b from being displaced from the piezoelectric element 5 due to the vibration of the vibrating body 3a, so that the sound cannot be output. The situation.

Further, as shown in FIG. 2, the lead 6b is fixed to the frame 2 The upper portion has a bent portion 63 between the fixing portion 62 of the lead 6b fixed to the frame 2 and the connecting portion 61 connected to the piezoelectric element 5.

As described above, by providing the bent portion 63 between the fixing portion 62 of the lead 6b fixed to the frame 2 and the connecting portion 61 connected to the piezoelectric element 5, the vibration of the lead 6b is bent by the curved portion 63 (i.e., the margin) The portion is absorbed, and therefore, the vibration of the lead 6b can be further suppressed as compared with the lead having no bent portion 63 (i.e., linearly disposed).

Further, since the bent portion 63 is provided on the lead 6b, the length of the lead 6b is made to be sufficient. Therefore, even if the lead 6b is pulled by the vibration of the vibrating body 3a, the load does not easily act on the lead 6b. Therefore, damage of the lead 6b can be prevented.

Further, as shown in Fig. 2, when the vibrating body 3a is viewed from the side parallel to the main surface of the vibrating body 3a (i.e., the Y-axis direction in the drawing), the curved portion 63 is curved. In other words, the curved portion 63 is curved in the vibration direction of the vibrating body 3a (that is, the Z-axis direction in the drawing), so that the vibration of the lead 6b generated by the vibration of the vibrating body 3a can be effectively absorbed.

Further, as shown in FIG. 2, the curved portion 63 is provided outside the resin layer 7. Thereby, it is possible to suppress vibration by the resin layer 7 with respect to the lead 6b inside the resin layer 7, and to absorb vibration by the bent portion 63 with respect to the lead 6b outside the resin layer 7. Therefore, the levels of peaks and valleys in the sound pressure frequency characteristics can be further reduced.

As described above, the lead wires 6a and 6b of the sound generator 1 include the bent portion 63, and at least a part of the lead wires 6a and 6b are buried in the resin layer 7. Therefore, it is possible to suppress the vibration of the leads 6a and 6b, and it is possible to reduce the level of peaks and valleys in the sound pressure frequency characteristics due to the vibration of the leads 6a and 6b. Therefore, according to the sound generator 1, good sound pressure frequency characteristics can be obtained.

Next, a description will be given with reference to FIGS. 3A to 6 with respect to a variation of the arrangement of the lead wires 6b and the position of the curved portion 63. 3A, 3B, and 3C are schematic cross-sectional views showing variations of the leads 6a and 6b, and Figs. 4 to 6 are plan views showing variations of the lead 6b. Further, the 3A, 3B, and 3C are cross-sectional views showing the sound generator 1 cut at the same position as the B-B' line of Fig. 1B.

In the example shown in Fig. 2, the bent portion 63 of the lead 6b is provided outside the resin layer 7, but the position of the bent portion 63 is not limited thereto.

For example, as shown in FIG. 3A, the bent portion 63 of the lead 6b may be provided inside the resin layer 7. By providing the curved portion 63 inside the resin layer 7 as described above, it is possible to absorb the vibration that cannot be completely suppressed by the resin layer 7 by the curved portion 63.

Further, as shown in FIG. 3B, the bent portions 63 of the lead wires 6b may be provided inside and outside the resin layer 7, respectively. Thereby, the vibration of the lead wire 6b can be absorbed in both the inside and the outside of the resin layer 7.

Further, as shown in FIG. 3C, the sagging of the curved portion 63 shown in FIG. 3B may be minimized, and the curved portion 63 may be formed in the inside and outside of the resin layer 7, respectively. Further, in the configuration shown in FIG. 3C, the curved portion 63 is the height of the portion where the lead 6b extends horizontally from the outside of the housing 2, and the height of the connecting portion 61 of the lead 6b to the piezoelectric element 5 is connected. The area between.

Further, in the example shown in Fig. 2, it is viewed from the side parallel to the main surface of the vibrating body 3a (i.e., the Y-axis direction in the drawing). When the vibrating body 3a is vibrated, the curved portion 63 is curved, but the bending direction of the curved portion 63 is not limited thereto.

For example, as shown in Fig. 4, when the vibrating body 3a is viewed in a plane perpendicular to the main surface of the vibrating body 3a (i.e., the Z-axis direction in the drawing), the curved portion 63 is curved. Thereby, the arrangement area of the leads 6a and 6b is thinned in the vibration direction of the vibrating body 3a, so that the height of the sound generator 1 can be reduced.

Further, the curved portion 63 may be disposed in a region where the amplitude of the vibrating surface of the vibrating body 3a is relatively large.

For example, as shown in FIG. 5, it is assumed that the first region 31 having a small amplitude and the second region 32 having a larger amplitude than the first region 31 are present on the vibration surface of the vibrating body 3a.

At this time, by arranging the bent portions 63 of the leads 6a and 6b in the second region 32, that is, by providing the bent portions 63 at the portions where the leads 6a and 6b vibrate greatly, the leads 6a and 6b can be effectively absorbed. vibration. Thereby, damage of the lead wires 6a and 6b can be suitably prevented.

Further, in Fig. 5, the vibration of the leads 6a, 6b is suppressed by providing the curved portion 63 in a relatively large amplitude region, but the leads 6a, 6b themselves may be disposed in the vibration surface of the vibrating body 3a. A region of relatively small amplitude.

For example, as shown in FIG. 6, it is assumed that the first region 33 having a small amplitude and the second region 34 having a larger amplitude than the first region 33 are present on the vibration surface of the vibrating body 3a. At this time, by arranging the leads 6a and 6b in the first region 33, the vibration of the leads 6a and 6b can be reduced.

In addition, in FIG. 5, it is shown that the first area 31 is divided and In the imaginary lines L1 and L2 of the second region 32, the imaginary lines L3 and L4 dividing the first region 33 and the second region 34 are displayed in Fig. 6, but the positions, shapes, and number of the imaginary lines L1 to L4 are obtained. After all, it is only an example, and is not limited to the imaginary line shown in Figures 5 and 6.

Further, in Fig. 6, the lead wires 6a and 6b are disposed in the first region 33 having a relatively small amplitude, but the lead wires 6a and 6b may be disposed in the second region 34 having a relatively large amplitude. Thereby, since the vibration of the vibrating body 3a in the region where the amplitude is relatively large is hindered by the weight of the lead wires 6a and 6b, the level of the peak and the valley in the sound pressure frequency characteristic can be reduced.

Further, when the piezoelectric element 5 has a longitudinal direction and a short-side direction when viewed in plan, the leads 6a and 6b are disposed in the short-side direction of the piezoelectric element 5, and an effect can be produced at a short distance.

Further, in each of the above-described examples, the lead wires 6a and 6b are fixed to the upper portion of the casing 2, but the casing 2 may be provided with a recessed portion through which the lead wires 6a and 6b are taken out. This point is described with reference to FIGS. 7A and 7B. Fig. 7A is a plan view showing a modification of the casing 2 and the leads 6a and 6b. Further, Fig. 7B is a cross-sectional view taken along line C-C' of Fig. 7A.

As shown in Figs. 7A and 7B, the casing 2' has a recess 21 through which the lead wires 6a and 6b are taken out to the outside. Thereby, since the lead wires 6a and 6b do not protrude upward from the casing 2', the height of the sound generator 1 can be reduced. Further, when the sound generator 1 is incorporated in a device such as a sound generating device or an electronic device, even if a member is provided above the sound generator 1, the leads 6a, 6b do not come into contact with the member, so the lead 6a, 6b is not easy to break.

Next, the sound generating device and the electronic device in which the sound generator 1 of the embodiment described above is mounted will be described with reference to FIGS. 8A and 8B. Fig. 8A is a view showing the configuration of the sound generator device 20 of the embodiment, and Fig. 8B is a view showing the configuration of the electronic device 50 of the embodiment. In addition, in the both drawings, only the constituent elements required for the description are shown, and the description of the general constituent elements is omitted.

The sound generating device 20 is a sounding device such as a so-called speaker. As shown in FIG. 8A, the sound generating device 20 includes, for example, a sound generator 1 and a casing 30 that houses the sound generator 1. The casing 30 resonates the sound emitted from the sound generator 1 and radiates the sound from the unillustrated opening formed in the casing 30 to the outside. By having such a case 30, it is possible to increase the sound pressure of, for example, a low frequency band.

Further, the sound generator 1 can be mounted on various electronic devices 50. For example, in the 8B shown in the next figure, the electronic device 50 is a portable terminal device such as a mobile phone or a tablet terminal.

As shown in FIG. 8B, the electronic device 50 includes an electronic circuit 60. The electronic circuit 60 is composed of, for example, a controller 50a, a signal receiving unit 50b, a key input unit 50c, and a mic input unit 50d. The electronic circuit 60 is connected to the sound generator 1 and has a function of outputting a sound signal to the sound generator 1. The sound generator 1 causes sound to be generated based on a sound signal input from the electronic circuit 60.

Further, the electronic device 50 further includes a display unit 50e, an antenna 50f, and a sound generator 1. Further, the electronic device 50 further includes a case 40 that houses the respective components.

In addition, in FIG. 8B, although the controller 50a or the like is displayed Each of the components is housed in a single casing 40, but the storage form of each component is not limited. In the present embodiment, at least the electronic circuit 60 and the sound generator 1 may be housed in one case 40.

The controller 50a is a control unit of the electronic device 50. The signal receiving unit 50b performs data transfer or the like through the antenna 50f under the control of the controller 50a.

The key input unit 50c is an input element of the electronic device 50 and accepts an operator's key input operation. The microphone input unit 50d is also an input element of the electronic device 50, and receives an operator's voice input operation and the like.

The display unit 50e is a display output element of the electronic device 50, and outputs display information according to the control of the controller 50a.

The sound generator 1 operates as a sound output element in the electronic device 50. Further, the sound generator 1 is connected to the controller 50a of the electronic circuit 60, and receives a voltage controlled by the controller 50a to emit sound.

Further, in the eighth drawing, the electronic device 50 is described as a portable terminal device. However, the electronic device 50 is applicable to various types of live-life devices having a function of emitting sound regardless of the type. For example, it can be used for thin-type televisions and car audio machines. It can also be used for products that have the function of sounding "speaking" and the function of playing music, for example, such as a vacuum cleaner, a washing machine, and a refrigerator. , microwave ovens and other products.

In addition, in the above-described embodiment, the main example is that the piezoelectric element 5 is provided on one main surface of the vibrating body 3a. Although the description is not limited thereto, the piezoelectric element 5 may be provided on both surfaces of the vibrating body 3a.

Further, in the above-described embodiment, the case where the shape of the inner region of the frame bodies 2 and 2' is slightly rectangular is taken as an example, and the shape is not limited thereto. It is round and oval.

Further, in the above-described embodiment, the display frames 2, 2' are configured by two frame members, but the frames 2, 2' may be formed as a single member.

Further, in the above-described embodiment, the lead wires 6a and 6b are taken out from the inside of the frame bodies 2 and 2' to the outside. For example, terminal blocks (connection points) may be provided in the frames 2 and 2'. The terminal pads and the piezoelectric element 5 are connected by leads 6a and 6b. At this time, by connecting the external terminals to the terminal pads provided in the housings 2, 2', it is possible to apply a voltage to the piezoelectric elements 5 via the external terminals, the terminal pads, and the leads 6a, 6b.

According to the above configuration, the vibration waves transmitted to the frames 2, 2' can be disturbed around the terminal block. In particular, when an electric signal is input, since the temperature around the terminal disk rises, thermal expansion is caused, and the vibration wave is easily disturbed. Thereby, the reflected waves reflected from the frames 2, 2' back to the vibrating plate 3 can be disturbed. As a result, the resonance frequency portions can be made inconsistent, and the peak of the sound pressure of the resonance point can be made uneven, and the frequency characteristic of the sound pressure can be flattened. That is, a better sound pressure frequency characteristic can be obtained.

Further, in the above-described embodiment, the lead wires 6a and 6b are connected to the upper surface of the piezoelectric element 5, but the lead wires 6a and 6b may be connected to the side surface of the piezoelectric element 5. Thereby, it is possible to seek sound generation The device 1 is further reduced in height.

Further, in the above-described embodiment, the example in which the lead wires 6a and 6b are used as the wiring member is shown, but the wiring member is not limited to the lead wires 6a and 6b. For example, a flexible wiring can also be used as the wiring member.

Here, an example in which a flexible wiring is used as a wiring member will be described with reference to FIGS. 9A and 9B. Fig. 9A is a plan view showing a modification in which a flexible wiring is used as a wiring member. Further, Fig. 9B is a cross-sectional view taken along line D-D' of Fig. 9A.

As shown in Fig. 9A, the sound generator 1 may be provided with a flexible wiring 6c instead of the leads 6a and 6b. The flexible wiring 6c is formed by covering a metal foil such as copper or aluminum with an insulator such as a resin film.

Since the metal foil of the flexible wiring has a small thickness in the vibration direction of the vibrating body 3a, it is easy to absorb the vibration of the piezoelectric element 5 and the vibrating body 3a. Further, it is also possible to reduce the height of the sound generator 1. Further, since the metal foil of the flexible wiring is covered with an insulator, there is no short circuit between the frame and the casing 2.

Similarly to the leads 6a and 6b, the flexible wiring 6c is partially embedded in the insulator (resin layer 7) (here, the connection layer 61 connected to the piezoelectric element 5) (see FIG. 9B). Further, the flexible wiring 6c is fixed to the upper portion of the casing 2 like the lead wires 6a and 6b, and is fixed to the fixing portion 62 of the flexible wiring 6c fixed to the casing 2 and the connecting portion 61 connected to the piezoelectric element 5. There is a curved portion 63 between them.

As described above, when the flexible wiring 6c is used as the wiring member, a part of the flexible wiring 6c is embedded in the resin layer 7, and the curved portion 63 is provided, whereby the vibration of the flexible wiring 6c can be suppressed. The level of the peaks and valleys in the sound pressure frequency characteristics due to the vibration of the flexible wiring 6c can be reduced. Therefore, good sound pressure frequency characteristics can be obtained.

In addition, although the example in which the curved portion 63 is provided outside the resin layer 7 is shown here, the curved portion 63 of the flexible wiring 6c can be embedded in the resin layer 7 similarly to the curved portion 63 of the leads 6a and 6b. It can be provided both inside and outside of the resin layer 7.

In addition, although a flexible wiring in which a metal foil is covered with an insulator is used as a wiring member, a metal foil which is not covered with an insulator may be used as the wiring member.

Further, in the above-described embodiment, the case where the actuator is the piezoelectric element 5 is described as an example. However, the actuator is not limited to the piezoelectric element, and has a function of receiving an electric signal to generate vibration. Yes. For example, it may be an electrokinetic type exciter, an electrostatic type exciter or an electromagnetic type exciter which is known as an exciter for vibrating a speaker. The electrokinetic type exciter is an exciter in which a coil is placed on a coil disposed between the magnetic poles of the permanent magnet to cause vibration of the coil, and the electrostatic type exciter is connected to the opposite two metal plates. An exciter that biases an electric signal to cause vibration of the metal plate, and the electromagnetic type exciter is an exciter that vibrates the thin iron plate by applying a power-on signal to the coil.

Further effects and variations can be readily derived from the field to which the present invention pertains. Therefore, the broader aspects of the invention are not limited to the specific details and representative embodiments shown and described. Therefore, various modifications may be made without departing from the spirit and scope of the invention.

1‧‧‧Sound generator

2‧‧‧ frame

3‧‧‧vibration board

3a‧‧‧ vibrating body

5‧‧‧Piezoelectric components

6b‧‧‧Leader

7‧‧‧ resin layer

61‧‧‧Connecting Department

62‧‧‧ Fixed Department

63‧‧‧Bend

Claims (7)

A sound generator characterized by having at least: an exciter vibrating by an electrical signal; and a flat vibrating body mounted with the exciter, vibrating with the exciter by vibration of the exciter; The body is disposed at an outer peripheral portion of the vibrating body and has a height higher than a height of the vibrating body; and the resin layer is disposed to cover the surface of the exciter and the vibrating body to which the exciter is attached, and the vibration And the wiring member is integrally formed with the exciter; and the wiring member is connected to the exciter and fixed to the frame body, and inputs an electric signal to the exciter; the wiring member is at the same height or ratio as the fixing portion of the frame body The fixing portion of the frame body has a low height position, and has a bent portion or a bent portion at each position inside and outside the resin layer. The sound generator of claim 1, wherein the wiring member comprises a stranded wire obtained by twisting a plurality of wires. The sound generator of claim 1, wherein the wiring member contains a metal foil having a small thickness in a vibration direction of the vibrating body. A sound generator according to claim 3, wherein a part of said metal foil of said wiring member is covered with an insulator. The sound generator according to any one of claims 1 to 4, wherein the frame system has a recess through which the wiring member is taken out to the outside. A sound generating device having: A sound generator according to any one of claims 1 to 5; and a case for housing the sound generator. An electronic device comprising: a sound generator according to any one of claims 1 to 5; an electronic circuit connected to the sound generator; and a case accommodating the electronic circuit and the sound generator; The function that sounds from the aforementioned sound generator.