JP2011135233A - Speaker apparatus and wiring structure thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a speaker apparatus which is adapted to improve the quality and reliability and can be thinned, and to provide a wiring structure thereof. <P>SOLUTION: In the wiring structure of a speaker apparatus 1 having a planar diaphragm 10, a driving coil 16 attached to the diaphragm 10, and a magnetic circuit 14 including the driving coil 16 and driving the diaphragm 10, a lead wire 17 for input to the driving coil 16 is arranged in a space formed between the diaphragm 10 and the magnetic circuit 14, and the tip of the lead wire 17 is connected electrically with the tip of the driving coil 16 at the driving coil holding part 15 which holds the driving coil 16. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a speaker device and a wiring structure thereof.

  2. Description of the Related Art Conventionally, there is a speaker device that emits sound from the front of a diaphragm by arranging a voice coil in the center of a planar diaphragm held by a casing and transmitting a signal to the voice coil. As such a type of speaker device, one disclosed in Patent Document 1 is known.

  In recent years, speaker devices have been made thinner, and thin panels such as organic electroluminescence panels (hereinafter referred to as OEL panels) and inorganic electroluminescence panels (hereinafter referred to as IEL panels) are used as diaphragms. Panel-type speaker devices adopted as the above are also widespread. As a speaker device that employs an OEL panel as a diaphragm, one disclosed in Patent Document 2 is known.

  Here, in the speaker devices disclosed in Patent Documents 1 and 2, a conventional wiring structure is employed, and the wiring structure of the speaker device has a configuration as shown in FIGS. Yes. That is, a flange 203 made of an insulating material is attached to the outer periphery on one end side of the bobbin 202 having the voice coil 201, and the input terminal lugs 204 and 205 on the anode side and the cathode side are attached to the flange 203. The anode-side lead wire 206 and the anode-side lead wire 207 of the voice coil 201 are connected to one end and the other end of the anode-side input terminal lug 204, respectively. Also, a cathode-side lead wire 208 and a cathode-side lead wire 209 of the voice coil 201 are respectively connected to one end and the other end of the cathode-side input terminal lug 205.

JP 2008-205809 A (Detailed Description of the Invention) Japanese Patent Laying-Open No. 2009-100300 (Detailed Description of the Invention)

  However, in the wiring structure of the speaker device disclosed in Patent Documents 1 and 2, since one ends of the lead wires 207 and 209 are connected to the input terminal lugs 204 and 205, the lead wires 207 and 209 It is necessary to give moderate slack to one end. For this reason, when the vibration plate vibrates with a large amplitude, the input lead wires 207 and 209 come into contact with the back surface 211 of the vibration plate 210 and abnormal noise is generated. Further, if the speaker device is continuously used for a long time, the lead wires 207 and 209 are fatigued.

  In the conventional speaker device wiring structure, the lead wires 206 and 208 of the voice coil 201 are connected to the lead wires 207 and 209 through input terminal lugs 204 and 205, wiring fittings, and the like. Yes. For this reason, a space for arranging the input terminal lugs 204 and 205, the metal fittings for wiring, and the like is required, and it becomes difficult to reduce the thickness of the speaker device. In addition, the lead wires 206 and 208 and the lead wires 207 and 209 can be connected by soldering instead of the wiring metal fittings or the like. Therefore, it is difficult to reduce the thickness of the speaker device 200.

  Furthermore, in the wiring structure of the conventional speaker device, as the speaker device 200 becomes thinner, the space for arranging the wiring members such as the lead wires 206 and 208 and the lead wires 207 and 209 becomes narrower. As a result, it becomes difficult to carry out the wiring work, and further, the wiring connection itself cannot be performed. On the other hand, the wiring material is required to have a strength for maintaining a certain posture and a followability sufficient to cope with the amplitude of the diaphragm. However, it is difficult to make the wiring thicker to give strength, because of the relationship with the space, and if the wiring length is made longer to give followability, the strength is lacking and a constant posture can be maintained. Disappear.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a speaker device that can improve quality and reliability, and that can be reduced in thickness, and a wiring structure thereof. It is something to try.

  In order to solve the above problems, one aspect of the present invention provides a speaker having a planar diaphragm, a driving coil mounted on the diaphragm, and a magnetic circuit that includes the driving coil and drives the diaphragm. In the wiring structure of the device, in the space formed between the diaphragm and the magnetic circuit, the lead wire for input to the driving coil is arranged, and at the outer periphery of the driving coil holding portion that holds the driving coil, The leading end of the input lead wire and the leading end of the driving coil are electrically connected.

  Further, it is preferable to relay the input lead wire to the diaphragm or the magnetic circuit.

  Moreover, it is preferable to fix the input lead wire on the back surface which is the surface facing the magnetic circuit in the diaphragm.

  The input lead wire is preferably made of a tinsel wire.

  The input lead wire is preferably subjected to forming so that the input lead wire is along a direction orthogonal to the vibration direction of the diaphragm.

  Further, it is preferable that a flange is attached to the outer peripheral end of the drive coil holding portion that holds the drive coil, and the input lead wire is disposed along the flange.

  Further, the flange has a substantially ring shape, and it is preferable that a groove is provided on the flat surface of the flange from the inner periphery to the outer periphery, and the input lead wire is disposed along the groove.

  Moreover, it is preferable to attach a copper foil to a desired position on the outer peripheral surface of the drive coil holding portion, and to connect the tip of the input lead wire disposed in the groove to the copper foil.

  Further, it is preferable that a thin film-like conductor is mounted on the back surface of the diaphragm, and the input lead wire is connected to the driving coil through the conductor.

  Further, it is preferable that a conductor is plated or deposited on the back surface of the diaphragm in a thin film shape, and the input lead wire is connected to the driving coil through the conductor.

  In addition, the magnetic circuit is held in the housing, and it is preferable that the input lead wire or the wiring material connected to the input lead wire is arranged over the surface of the housing.

  Further, it is preferable that a groove is provided at a desired position of the housing, and an input lead wire or a wiring material connected to the input lead wire is disposed in the groove.

  The housing includes an outer frame portion having a frame shape, a magnetic circuit mounting portion to which a magnetic circuit is mounted, and a crosspiece that connects the magnetic circuit mounting portion and the outer frame portion. Part, outer frame, and part of or all of the crosspieces are integrally formed and connected to the input lead wires or the input lead wires at desired positions of the magnetic circuit mounting part, the outer frame and the crosspieces. It is preferable to arrange the materials together.

  In one aspect of the present invention, a speaker device has the wiring structure of the speaker device described above.

  Moreover, it is preferable to arrange a sound absorbing material or a cushion material at a position facing the top plate constituting the magnetic circuit in the space.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to aim at the improvement of quality and reliability, the speaker apparatus which can respond also to thickness reduction, and its wiring structure can be provided.

It is the disassembled perspective view which looked at a part of speaker apparatus which concerns on the 1st Embodiment of this invention from the diagonal back side. It is the figure which looked at a part of speaker apparatus concerning a 1st embodiment of the present invention from the back side. It is the figure of the state which looked at a part of speaker apparatus which concerns on the 1st Embodiment of this invention. 1 is a side sectional view of a part of a speaker device according to a first embodiment of the present invention. It is the figure of the state which looked at a part of speaker apparatus which concerns on the 2nd Embodiment of this invention. It is the disassembled perspective view which looked at a part of speaker apparatus which concerns on the 3rd Embodiment of this invention from the diagonal front side. It is the figure of the state which looked at a part of speaker apparatus which concerns on the 3rd Embodiment of this invention. It is the figure of the state which looked at a part of speaker apparatus which concerns on the 4th Embodiment of this invention. It is the perspective view which looked at a part of speaker device concerning a 5th embodiment of the present invention from the slanting back side. FIG. 10 is an enlarged view of a portion surrounded by an alternate long and short dash line A in FIG. 9. It is the figure which looked at a part of speaker apparatus concerning a 6th embodiment of the present invention from the back side. It is the figure of the state which looked at a part of speaker apparatus which concerns on the 6th Embodiment of this invention. It is the disassembled perspective view which looked at the speaker apparatus based on the 7th Embodiment of this invention from the diagonal back side. It is the perspective view which looked at the speaker apparatus which concerns on the 7th Embodiment of this invention from the diagonal front side. It is the sectional side view which cut | disconnected the speaker apparatus in FIG. 14 by the BB line. FIG. 14 is an enlarged view of a portion surrounded by an alternate long and short dash line C in FIG. 13. It is an enlarged view of the part enclosed with the dashed-dotted line D in FIG. FIG. 16 is an enlarged view of a portion surrounded by an alternate long and short dash line E in FIG. 15. It is a figure which shows the graph of the reproduction frequency characteristic of the speaker apparatus which concerns on the 7th Embodiment of this invention. It is the disassembled perspective view which looked at the speaker apparatus based on the 8th Embodiment of this invention from the diagonal back side. It is an enlarged view of the part enclosed with the dashed-dotted line F in FIG. It is an enlarged view of the part enclosed with the dashed-dotted line G in FIG. It is a figure which shows the graph of the reproduction frequency characteristic of the speaker apparatus which concerns on the 8th Embodiment of this invention. It is the disassembled perspective view which looked at a part of conventional speaker apparatus from the diagonal back side. It is a partial sectional side view of the conventional speaker apparatus.

(First embodiment)
Hereinafter, a speaker device 1 and a wiring structure thereof according to a first embodiment of the present invention will be described with reference to the drawings. In the following description (common to each embodiment), FIGS. 1-9, FIGS. 11 to 15, 17, the arrow _{X 1} direction shown in FIGS. 18 and 20 tables arrow _{X 2} direction the back, the arrow Y ₁ direction left, arrow Y ₂ direction to the right, respectively define a lower and upper and arrow Z ₂ direction arrow Z ₁ direction.

FIG. 1 is an exploded perspective view of a part of the speaker device 1 according to the first embodiment of the present invention as viewed obliquely from the back side. FIG. 2 is a view of a part of the speaker device 1 according to the first embodiment of the present invention as seen from the back side. FIG. 3 is a side view of a part of the speaker device 1 according to the first embodiment of the present invention. FIG. 4 is a side sectional view of a part of the speaker device 1 according to the first embodiment of the present invention.
FIG.

  In the speaker device 1 according to the first embodiment of the present invention, a thin panel 10 as an example of a diaphragm is supported by a casing (only the magnet flange 21 is illustrated), and the panel 10 and the casing are interposed between the panel 10 and the casing. It is configured by arranging a driving body 12 for vibrating the panel 10 in the space 11 (see FIG. 3) to be formed. Further, the wiring structure of the speaker device 1 according to the first embodiment of the present invention is applied to a driving portion of the speaker device 1 having a thin shape.

As shown in FIGS. 1 and 4, the driving body 12 includes a voice coil body 13 and a magnetic circuit 14. The voice coil body 13 includes a voice coil bobbin 15 as an example of a drive coil holding portion having a cylindrical shape, and a voice as an example of a drive coil wound around the outer peripheral surface of the voice coil bobbin 15 and bonded and fixed. And a coil 16. In the present embodiment, is attached by an adhesive to the voice coil body 13 on the rear surface 10a of the panel 10, radially outward from the approximate center of the front and back direction of the outer peripheral surface of the voice coil bobbin 15 (X ₁ -X ₂ direction) The lead wires 17 and 17 are pulled out, and the lead wires 17 and 17 are arranged in a substantially central portion in the front and back direction in the space 11. The panel 10 vibrates in the front and back direction as the voice coil body 13 moves in the front and back direction.

The voice coil 16, as shown in FIG. 1, is wound around a region of the back side (X ₂ side) than the substantially central portion of the front and back direction in the voice coil bobbin 15. Copper foils 18 and 18 are provided at two positions on the outer peripheral surface of the voice coil bobbin 15. The copper foils 18 and 18 are provided at substantially the center of the voice coil bobbin 15 in the front and back direction (X ₁ -X ₂ direction). One of the copper foils 18 and 18 is connected to a lead wire 16a corresponding to the winding start portion of the voice coil 16, and the other is connected to a lead wire 16a corresponding to the winding end portion of the voice coil 16. . The lead wires 17 and 17 are provided separately from the voice coil 16, and one end thereof is connected to the copper foil 18. That is, the winding start portion and winding end portion of the voice coil 16 and the lead wires 17 and 17 are connected via the copper foils 18 and 18. As shown in FIG. 3 and the like, the two lead wires 17 and 17 extend in parallel along the vertical direction from the copper foils 18 and 18. Further, the lead wires 17 and 17 are respectively arranged (a total of a pair) at positions that are symmetrical with respect to the central axis along the vertical direction of the voice coil body 13.

  In the present embodiment, a conductive round wire covered with an insulating film such as enamel is employed as the voice coil 16. On the other hand, as the lead wire 17, a wire material generally called a tinsel wire, which is a braided wire or a wire knitted in a braided shape or a twisted wire shape, is used. Since the tinsel wire is subjected to forming processing, it can maintain a constant posture, and therefore has excellent amplitude resistance, and is generally used as an input wire for a speaker.

  In the present embodiment, the tinsel wire is used as the lead wire 17, but the thin speaker device 1 has a smaller amplitude of the diaphragm 10 than a normal general loudspeaker, and therefore, a wire is selected according to the purpose of use. Is possible. For example, after drawing out the lead lines to be the winding start part and the winding end part of the voice coil 16 on the outer peripheral surface of the voice coil bobbin 15, the voice coil bobbin 15 is drawn out from the vicinity of the center part in the front and back direction. You may make it arrange | position in the center part vicinity. Further, as the lead wire 17, for example, a copper wire covered with an insulating film such as a vinyl chloride resin may be adopted, and the tip of the copper wire may be connected to the copper foil 18.

  As shown in FIG. 4, the magnetic circuit 14 is disposed on the back side of the voice coil body 13 so that the voice coil 16 is fitted in the magnetic gap 25 of the magnetic circuit 14. The magnetic circuit 14 is fixed to a magnet flange 21 that is a part of the housing via a magnetic circuit fixing ring 20. Specifically, the magnetic circuit 14 positioned in the magnet flange 21 is fastened with a screw to a magnetic circuit fixing ring 20 disposed on the back side of the magnetic circuit 14 so that the magnetic circuit 14 is positioned in the front-back direction. Has been made. In addition, the board | plate material not shown which comprises a housing | casing is arrange | positioned at the side of the magnet flange 21, for example.

  As shown in FIG. 4, the magnetic circuit 14 includes a yoke 22, a magnet 26, and a top plate 24. The yoke 22 is a base member of the magnetic circuit 14 and has a substantially bottomed cylindrical shape. Specifically, the yoke 22 includes a center guide portion 22a having a substantially cylindrical shape, and a mounting portion that extends over the entire circumference toward the outer side in the circumferential direction at an end on the back side of the center guide portion 22a. 22b. A donut-shaped magnet 26 is placed on the placement portion 22b. The magnet 26 is placed on the placement portion 22b so as to be positioned on the outer peripheral side of the center guide portion 22a. A donut-shaped top plate 24 made of a magnetic material is disposed on the front side of the magnet 26. The top plate 24 is disposed at a position facing the magnet 26 so that the magnet 26 can be sandwiched by the mounting portion 22b in the front-back direction. A magnetic gap 25 having a predetermined interval is formed between the outer peripheral portion of the center guide portion 22 a and the inner peripheral portion of the top plate 24, and the voice coil 16 is disposed in the magnetic gap 25.

  In the wiring structure of the speaker device 1 as described above, the lead wire 17 is arranged in a form extending from the copper foil 18 outward in the lateral direction. That is, the lead wire 17 extends in the up-down direction, which is a direction orthogonal to the vibration direction of the panel 10, at a substantially central portion in the front and back direction in the space 11. Thus, by arranging the lead wires 17 along the vertical direction, the speaker device 1 can be made thinner. Further, when resonance occurs in the vibration of the panel 10, a tensile force resulting from the resonance acts on the lead wire 17. By arranging the lead wire 17 in the vertical direction, the tensile force is reduced. It becomes possible to reduce. As a result, disconnection of the lead wire 17 can be prevented.

  In addition, since the speaker device 1 is often used in a state where the panel 10 is upright, the lead wire 17 can easily maintain a wiring posture at a substantially central portion in the front and back direction in the space 11. For this reason, it is possible to prevent the lead wire 17 from being inclined toward the magnetic circuit 14 due to its own weight, as in the case where the panel 10 is laid down in the horizontal direction. Therefore, the lead wire 17 does not maintain an inclined posture with respect to the YZ plane. As a result, it is possible to prevent the lead wire 17 from coming into contact with other members such as the magnetic circuit 14 and the panel 10 to generate abnormal noise.

  Further, in the speaker device 1 as described above, the voice coil body 13 is directly mounted on the back surface 10 a of the panel 10, and a support member such as a suspension is not disposed in the space 11. For this reason, it is possible to easily arrange the lead wires 17 in the space 11 while having practicality. Therefore, it is possible to easily cope with the thinning of the speaker device 1.

  Further, in the speaker device 1 as described above, the tinsel wire is used for the lead wire 17. For this reason, it becomes easy to maintain the attitude | position along the up-down direction, and the lead wire 17 becomes the thing excellent in amplitude-proof performance. Therefore, disconnection of the lead wire 17 can be prevented, and as a result, the quality and reliability of the speaker device 1 can be improved.

(Second Embodiment)
Hereinafter, a speaker device 30 and a wiring structure thereof according to a second embodiment of the present invention will be described with reference to the drawings. In the present embodiment, only the wiring structure is different from that of the first embodiment, and thus the different portions will be mainly described. Note that, in the speaker device 1 and the wiring structure thereof according to the second embodiment, portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted or simplified.

  FIG. 5 is a side view of a part of the speaker device 30 according to the second embodiment of the present invention.

  The speaker device 30 includes a panel 10, a driving body 12 attached to the back surface 10 a of the panel 10, and a magnet flange 21 that constitutes a housing. Further, copper foils 18 and 18 are provided on the outer peripheral surface of the voice coil bobbin 15. The lead wires 31 are provided separately from the voice coil 16, and one end thereof is connected to the copper foil 18.

  In the present embodiment, as shown in FIG. 5, the lead wires 31, 31 arranged in such a form as to be drawn from the copper foil 18 have a jumping portion 32 that is bent toward the front side in the middle portion thereof. That is, the lead wire 31 is arranged at the approximate center in the front and back direction of the space 11 until it is drawn from the copper foil 18 and the jumping portion 32 is formed, and is directed to the front side at the position where the jumping portion 32 is formed. It bends and comes into contact with the back surface 10a of the panel 10. Similarly to the case of the first embodiment, the two lead wires 31, 31 extend in parallel from the copper foils 18, 18 along the vertical direction. Furthermore, the lead wires 31 are arranged in pairs at positions that are symmetrical with respect to the central axis along the vertical direction of the voice coil body 13.

  In the jumping part 32, the part which contacts the back surface 10a of the panel 10 is adhere | attached on this back surface 10a. The position where the jumping portion 32 is provided can be appropriately set so that the lead wire 31 can maintain a predetermined posture in consideration of the length of the lead wire 31. Since the lead wire 31 is formed of a formed tinsel wire, the lead wire 31 maintains a predetermined posture as compared with a copper wire covered with an insulating film such as a vinyl chloride resin. It is easy to do. Further, the outer side of the jumping portion 32 is covered with an insulating material in order to prevent a short circuit with the panel 10. In addition, when the panel 10 is formed from the material which does not have electroconductivity, you may make it not cover the jumping part 32 with an insulating material.

  In the speaker device 30 as described above, the lead wire 31 is fixed to the back surface 10 a of the panel 10 by the jumping unit 32. For this reason, the lead wire 31 can be maintained in a more stable state, and the reliability and quality of the speaker device 30 can be improved.

  In the speaker device 30 as described above, the lead wire 31 is fixed by bonding the jumping portion 32 to the back surface 10 a of the panel 10. For this reason, the lead wire 31 can be arrange | positioned with respect to the panel 10 in the stable state, and it can prevent that the abnormal contact sound between the lead wire 31 and the panel 10 generate | occur | produces.

(Third embodiment)
Hereinafter, a speaker device 40 and a wiring structure thereof according to a third embodiment of the present invention will be described with reference to the drawings. In the present embodiment, since only the wiring structure is different from the first and second embodiments, the different portions will be mainly described. Note that, in the speaker device 40 and the wiring structure thereof according to the third embodiment, portions common to the first and second embodiments are denoted by the same reference numerals and description thereof is omitted or simplified.

  FIG. 6 is an exploded perspective view of a part of the speaker device 40 according to the third embodiment of the present invention as viewed obliquely from the front side. FIG. 7 is a side view of a part of the speaker device 40 according to the third embodiment of the present invention.

  As shown in FIG. 6, the speaker device 40 includes a panel 10, a driving body 12 attached to the back surface 10 a of the panel 10, and a magnet flange 21 that constitutes a casing. Further, copper foils 18 and 18 are provided on the outer peripheral surface of the voice coil bobbin 15. Lead wires 41 and 41 are provided separately from the voice coil 16, and one end thereof is connected to the copper foil 18.

  In the present embodiment, as shown in FIGS. 6 and 7, the lead wires 41, 41 arranged so as to be drawn from the copper foil 18 are jumping portions 42 that are bent toward the back side in the middle portion thereof. Have That is, the lead wire 41 is located at a substantially central portion in the front and back direction of the space 11 until it is pulled out from the copper foil 18 and the jumping portion 42 is formed, and on the front side at the position where the jumping portion 42 is formed. It bends toward the surface and comes into contact with the surface 21 a of the magnet flange 21. Similarly to the case of the first embodiment, the two lead wires 41 and 41 extend from the copper foils 18 and 18 in parallel along the vertical direction. Furthermore, the lead wires 41 are arranged in a pair at positions that are symmetrical with respect to the central axis along the vertical direction of the voice coil body 13.

  In the jumping part 42, the part which contacts the surface 21a of the magnet flange 21 is bonded to the surface 21a. The position where the jumping portion 42 is provided can be appropriately set so that the lead wire 41 can maintain a predetermined posture in consideration of the length of the lead wire 41. Since the lead wire 41 is formed by a formed tinsel wire, the lead wire 41 maintains a predetermined posture as compared with a copper wire covered with an insulating film such as a vinyl chloride resin. It is easy to do. Further, the outside of the jumping portion 42 is covered with an insulating material in order to prevent a short circuit with the magnet flange 21. Note that when the magnet flange 21 is formed of a material having no conductivity, the jumping portion 42 may not be covered with an insulating material.

  In the speaker device 40 as described above, the lead wire 41 has a jumping portion 42 bonded to the surface 21 a of the magnet flange 21. For this reason, the lead wire 41 can be maintained in a more stable state, and the reliability and quality of the speaker device 40 can be improved.

  In the speaker device 40 as described above, the lead wire 41 is fixed by adhering the jumping portion 42 to the surface 21 a of the magnet flange 21. For this reason, the lead wire 41 can be arrange | positioned in the space 11 in the stable state, and it can prevent that the abnormal contact sound between the lead wire 41 and the panel 10 generate | occur | produces.

(Fourth embodiment)
Hereinafter, a speaker device 50 and a wiring structure thereof according to a fourth embodiment of the present invention will be described with reference to the drawings. In the present embodiment, since only the wiring structure is different from the first to third embodiments, the different portions will be mainly described. Note that in the speaker device 50 and the wiring structure thereof according to the fourth embodiment, portions that are the same as those in the first to third embodiments are denoted by the same reference numerals, and description thereof is omitted or simplified.

  FIG. 8 is a side view of a part of the speaker device 50 according to the fourth embodiment of the present invention.

  As shown in FIG. 8, the speaker device 50 includes a panel 10, a driving body 12 attached to the back surface 10 a of the panel 10, a magnet flange 21 constituting the housing, and a voice disposed on the outer periphery of the voice coil bobbin 15. And a coil flange 51. Further, copper foils 18 and 18 are provided on the outer peripheral surface of the voice coil bobbin 15. Further, one end of each of the lead wires 31 is connected to the copper foil 18.

  In the present embodiment, as shown in FIG. 8, an example of a flange having a ring-like shape that covers the entire outer periphery of the voice coil bobbin 15 in the vicinity of the front end of the voice coil bobbin 15 is provided. A voice coil flange 51 is provided. The lead wires 31 are arranged so as to crawl on the back surface 51 a of the voice coil flange 51. The front side surface of the voice coil flange 51 is fixed to the back surface 10a of the panel 10 by adhesion or the like. Further, the lead wire 31 is bonded to the back surface 10 a of the panel 10 at the jumping portion 32. Further, a portion of the lead wire 31 that crawls on the back surface 51a of the voice coil flange 51 is bonded to the back surface 51a. That is, the lead wire 31 and the panel 10 are integrated via the voice coil flange 51. Note that the shape of the voice coil flange 51 is not limited to the ring shape, and may be other shapes.

  In the speaker device 50 as described above, by fixing the voice coil flange 51 to the back surface 50a of the panel 50, the voice coil 16 can be fixed to the panel 10 with great strength. The panel 10 can be reduced from being locally shaken. Further, the arrangement of the voice coil flange 51 can reinforce the strength of the panel 10, and the occurrence of resonance at the contact portion between the voice coil flange 51 and the panel 10 can be reduced.

  Further, in the speaker device 50 as described above, the lead wire 31 is disposed on the back surface 51a of the voice coil flange 51, and the lead wire 31 is bonded to the back surface 51a. It is possible to hold the lead wire 31 in a disconnected state and to prevent the lead wire 31 from being disconnected. In addition, since the lead wire 31 is arranged on the back surface 51a in a lateral orientation, the arrangement of a part of the lead wire 31 is determined, which is effective in reducing the thickness of the speaker device 50.

  In the speaker device 50 as described above, the lead wire 31 and the panel 10 are integrated via the voice coil flange 51. For this reason, it is possible to make the speaker device 50 thinner by effectively utilizing the space 11.

(Fifth embodiment)
Hereinafter, a speaker device 60 and a wiring structure thereof according to a fifth embodiment of the present invention will be described with reference to the drawings. In the present embodiment, since only the wiring structure is different from the first to fourth embodiments, the different portions will be mainly described. Note that, in the speaker device 60 and the wiring structure thereof according to the fifth embodiment, portions common to the first to fourth embodiments are denoted by the same reference numerals and description thereof is omitted or simplified.

  FIG. 9 is a perspective view of a part of the speaker device 60 according to the fifth embodiment of the present invention as viewed obliquely from the back side. FIG. 10 is an enlarged view of a portion surrounded by an alternate long and short dash line A in FIG.

  As shown in FIG. 9, the speaker device 60 includes a panel 10, a driving body for driving the panel 10, and a voice coil flange 61 as an example of a flange disposed on the outer periphery of the voice coil bobbin 15. Copper foils 18 and 18 are provided at two desired positions on the outer peripheral surface of the voice coil bobbin 15. Furthermore, one end of each of the lead wires 62 and 62 is connected to the copper foil 18 by means such as soldering.

  As shown in FIG. 9, a voice coil flange 61 having a ring shape that covers the entire outer periphery of the voice coil bobbin 15 is disposed near the front end of the voice coil bobbin 15. . In the present embodiment, the voice coil flange 61 is formed with grooves 63 and 63 for arranging the lead wires 62 and 62. The grooves 63, 63 are formed from the inner periphery to the outer periphery of the voice coil flange 61. Further, the grooves 63, 63 are formed on the back surface 61a of the voice coil flange 61 in such a manner that the distance between the two grooves 63, 63 increases toward the outer side in the circumferential direction. Further, a tapered surface 64 having a tapered shape is formed on the inner peripheral edge of the voice coil flange 61 so as to increase in diameter toward the back side. For this reason, when the voice coil bobbin 15 is mounted on the voice coil flange 61, a substantially V-shaped groove is formed by the outer peripheral surface of the voice coil bobbin 15 and the tapered surface 64. Further, as described above, the lead wire 62 and the copper foil 18 are connected using solder or the like, and the connection portion is made of an adhesive used when the voice coil bobbin 15 and the voice coil flange 61 are bonded to each other. Covered. At this time, the connecting portion of the lead wire 62 is configured to fit in a substantially V-shaped groove formed by the outer peripheral surface of the voice coil bobbin 15 and the tapered surface 64. Note that the shape of the voice coil flange 61 is not limited to the ring shape, and may be another shape.

  As shown in FIG. 10, the lead wires 62 and 62 are drawn outward while being fitted in the grooves 63 and 63. That is, the lead wires 62 and 62 are disposed in the space 11 in a state of being fitted in the grooves 63 and 63. Further, the portions of the lead wires 62 and 62 that protrude outward from the voice coil flange 61 maintain a posture in which the lead wires 62 and 62 are bent in a substantially arc shape toward the outer side in the left-right direction.

  In the speaker device 60 as described above, the groove 63 is provided on the back surface 61 a of the voice coil flange 61, and the lead wire 62 is inserted and disposed in the groove 63. For this reason, only the dimension in which the lead wire 62 is fitted in the groove 63 is advantageous in the space in the front and back directions, and it is easy to reduce the thickness. Further, the structure in which the lead wire 62 is inserted and disposed in the groove 63 makes it possible to easily locate the connecting portion between the lead wire 62 and the copper foil 18, and to greatly reduce the wiring man-hours. Become.

  In the wiring structure of the speaker device 60 as described above, the connection portion where the copper foil 18 and the lead wire 62 are soldered is covered with an adhesive for bonding the voice coil bobbin 15 and the voice coil flange 61. For this reason, when it has the structure which seals this connection part with an adhesive agent and uses what has heat resistance as an adhesive agent, reliability improves.

  In the speaker device 60 as described above, when the voice coil bobbin 15 is mounted on the voice coil flange 61, a substantially V-shaped groove is formed by the outer peripheral surface of the voice coil bobbin 15 and the tapered surface 64. For this reason, the connection part with the copper foil 18 of the lead wire 62 will be stored in the said groove | channel. Therefore, in addition to the solder, the connection portion is completely sealed with an adhesive for bonding the voice coil bobbin 15 and the voice coil flange 61. For this reason, the strength of the connection portion is improved, and the reliability of the speaker device 60 is improved.

(Sixth embodiment)
Hereinafter, a speaker device 70 and a wiring structure thereof according to a sixth embodiment of the present invention will be described with reference to the drawings. In the present embodiment, since only the wiring structure is different from the first to fifth embodiments, the different portions will be mainly described. Note that in the speaker device 70 and the wiring structure thereof according to the sixth embodiment, portions that are the same as those in the first to fifth embodiments are denoted by the same reference numerals, and descriptions thereof are omitted or simplified.

  FIG. 11 is a view of a part of the speaker device 70 according to the sixth embodiment of the present invention as seen from the back side. FIG. 12 is a side view of a part of the speaker device 70 according to the sixth embodiment of the present invention.

  As shown in FIGS. 11 and 12, the speaker device 70 includes a panel 10, a driving body 12, a magnet flange 21, and a voice coil flange 61. Copper foils 18 and 18 are provided at two desired positions on the outer peripheral surface of the voice coil bobbin 15. One end of each of the lead wires 62 and 62 is connected to the copper foil 18 by means such as soldering. Similarly to the case of the fifth embodiment, the voice coil flange 61 is formed with a groove 63, and the lead wires 62 and 62 are drawn outwardly while being fitted in the grooves 63 and 63. Yes.

  In the present embodiment, the lead wires 62 and 62 drawn from the copper foils 18 and 18 are drawn to the outside of the magnet flange 21 by the input lead wires 72 connected via the relay terminals 71. Specifically, the lead wire 62 is held by the magnet flange 21 by being connected to the relay terminal 71, and pulled out to the outside by the input lead wire 72 connected to the relay terminal 71.

  The relay terminal 71 includes a relay terminal board 73, a relay terminal lug 74, a washer 75, and a relay terminal set screw 76. As shown in FIG. 11, the relay terminal board 73 is a plate-like member having a substantially rectangular shape, and is formed of a heat resistant resin or the like. Further, the relay terminal board 73 is arranged so that the left-right direction is the longitudinal direction. The relay terminal lugs 74 and 74 are metal plates having a substantially rectangular shape, and a total of two relay terminals lugs 74 are arranged side by side so that the vertical direction is the longitudinal direction. The relay terminal lugs 74 and 74 have an inclined portion 74a that is bent so as to be inclined toward the front side when viewed from the lateral side, and a flat portion 74b having a flat surface (see FIG. 12). . The tip end of the lead wire 62 is connected to the inclined portion 74a by soldering, and the flat portion 74b is provided with a faston terminal 77 subjected to caulking.

  The relay terminal lugs 74, 74 are fixed to the surface 21 a of the magnet flange 21 using screws 76 while being fixed to the relay terminal substrate 73. At this time, a washer 75 is interposed between the relay terminal board 73 and the surface 21 a of the magnet flange 21. That is, a screw 76 is inserted into a hole (not shown) provided in a substantially central portion of the relay terminal board 73 in the left-right direction and the washer 75, and the screw 76 is screwed into a screw hole (not shown) provided in the magnet flange 21. Thus, the relay terminal lugs 74 and 74 are fixed to the magnet flange 21.

  The portions of the lead wires 62 and 62 that protrude outward from the voice coil flange 61 maintain a posture in which the lead wires 62 and 62 are bent in an arc shape toward the outer side in the left-right direction. For this reason, in the state where the tip of the lead wire 62 is connected to the inclined portion 74a, the lead wire 62 is guided to the inclined portion 74a while being bent in an arc from the outer periphery of the voice coil flange 61 to the upper left. Become. In addition, as the lead wire 62, for example, a tinsel wire having a forming process with a diameter of about 1 mm is used. The tip of the input lead wire 72 is connected to the faston terminal 77 of the flat portion 74b. As an input lead wire, a commonly used parallel wire in which a metal wire is covered with a vinyl chloride resin is used. The input lead wire 72 is branched into two lines in the vicinity of the portion connected to the relay terminal lugs 74 and 74.

  In the speaker device 70 as described above, the lead wire 62 is fixed to the surface 21 a of the magnet flange 21 via the relay terminal 71. That is, the lead wire 62 is relayed by the relay terminal 71 and drawn out by the input lead wire 72. For this reason, the lead wire 62 can be arrange | positioned in the space 11 in the stable state, and it can prevent that the abnormal contact sound between the lead wire 62 and the panel 10 generate | occur | produces.

(Seventh embodiment)
Hereinafter, a speaker device 80 and a wiring structure thereof according to a seventh embodiment of the present invention will be described with reference to the drawings.

  FIG. 13 is an exploded perspective view of the speaker device 80 according to the seventh embodiment of the present invention when viewed obliquely from the back side. FIG. 14 is a perspective view of the speaker device 80 according to the seventh embodiment of the present invention viewed from an oblique front side. 15 is a side cross-sectional view of the speaker device 80 in FIG. 14 cut along line BB. FIG. 16 is an enlarged view of a portion surrounded by an alternate long and short dash line C in FIG. FIG. 17 is an enlarged view of a portion surrounded by an alternate long and short dash line D in FIG. 18 is an enlarged view of a portion surrounded by a one-dot chain line E in FIG.

  As shown in FIGS. 13 to 15, the speaker device 80 mainly includes a panel 81 as an example of a diaphragm, a casing 109 for supporting the panel 81, and a driving body 84 that vibrates the panel 81. It is configured. The housing 109 has a front frame 82 that protects the periphery of the panel 81 and a back frame 83 that supports the panel 81 and the front frame 82 from the back side. In this embodiment, an OEL panel is adopted as the panel 81. For this reason, the speaker device 80 according to the present embodiment is thinner than the speaker devices 1, 30, 40, 50, 60, and 70 according to the first to sixth embodiments described above. It is set as the speaker apparatus which has. As a dimension example of the speaker device 80, for example, the dimension of each side can be 158 mm, and the thickness dimension can be 8.4 mm. A panel other than the OEL panel may be adopted as the material of the panel 81.

  As shown in FIGS. 15 and 17, the panel 81 is a white light-emitting panel having a length of 137.5 mm on each side, and a glass substrate that is disposed on the panel substrate 85 and the back side of the panel substrate 85. And a heat radiating plate 87 made of an aluminum plate disposed on the back side of the glass sealing plate 86. The length dimension of each side of the heat sink 87 is, for example, about 130 mm, and the thickness dimension is, for example, 0.9 mm. Further, a ring-shaped sound absorbing material 99 is interposed between the heat radiating plate 87 and a top plate 100 described later (see FIG. 18). Further, as shown in FIG. 14, for example, an image of a guidance guide mark is displayed on the surface of the panel 81.

  As shown in FIG. 13 and the like, the front frame 82 has a square frame shape. The length of each side of the front frame 82 is, for example, 137.5 mm so as to match the outer dimension of the panel 81. As described above, the front frame 82 holds the periphery of the panel 81. A back frame 83 is disposed on the back side of the front frame 82. An opening recess 88 that is recessed toward the back side is provided on the front side of the back frame 83, and the front frame 82 is fitted into the opening recess 88 (see FIG. 15). The outer dimensions of the back frame 83 are the same as the outer dimensions of the speaker device 80. For example, the dimensions of each side can be 158 mm and the thickness can be 8.4 mm. A space 89 is formed between the back frame 83 and the panel 81 (see FIG. 18). Further, aluminum is adopted as a material for the front frame 82 and the back frame 83.

  In addition, a driver 84 is disposed at the approximate center of the speaker device 80. As shown in FIG. 13 and FIG. 15, the drive body 84 includes a voice coil body 90 and a magnetic circuit 91. The voice coil body 90 includes a voice coil bobbin 92 having a cylindrical shape, and a voice coil 93 that is an example of a driving coil that is wound around the outer peripheral surface of the voice coil bobbin 92 and fixedly bonded thereto. In the present embodiment, the voice coil body 90 is attached to the back surface 81a of the panel 81 by bonding in a state where the voice coil body 90 is attached to the inside of the voice coil flange 94 as an example of a flange having a ring shape. Specifically, the voice coil flange 94 is arranged in the form of covering the entire outer periphery of the voice coil bobbin 92 in the vicinity of the front end portion of the voice coil bobbin 92.

  The inner diameter and height dimension of the voice coil bobbin 92 are, for example, 25.9 mm and 3.2 mm, respectively. The bobbin thickness of the voice coil bobbin 92 is, for example, 0.05 mm, and titanium is used as the material. The outer peripheral surface of the voice coil bobbin 92 around which the voice coil 93 is wound is coated with a heat resistant resin that is an insulating material. On the voice coil bobbin 92, for example, a wire rod having a diameter of 0.14 mm, which forms the voice coil 93, is wound over four layers, for example, with a winding width of about 1.96 mm. With such a configuration, for example, the voice coil 93 having a DC resistance of about 3.4 to 3.9Ω can be obtained.

  The voice coil flange 94 is a plate-like member having a ring shape, and aluminum is used as a material. The voice coil flange 94 has an inner diameter of, for example, 26.12 mm, an outer dimension of, for example, 46.12 mm, and a thickness of, for example, 0.5 mm. As shown in FIGS. 13 and 16, on the back surface 94a of the voice coil flange 94, two linear grooves 95, 95 are formed from the inner peripheral side to the outer peripheral side of the voice coil flange. The grooves 95 and 95 are provided in parallel to each other, for example, at a position 16 mm away from the central axis along the vertical direction of the voice coil flange 94. These grooves 95, 95 have a width dimension of 0.4 mm, for example, and a depth dimension of 0.25 mm, for example. The surface of the voice coil flange 94 is subjected to black alumite treatment. Note that the shape of the voice coil flange 94 is not limited to the ring shape, but may be other shapes.

  With the voice coil body 90 attached to the inside of the voice coil flange 94, the two lead wires 96, 96 corresponding to the winding start portion and winding end portion of the voice coil 93 are passed from the voice coil bobbin 92 to the inside of the grooves 95, 95. The lead wires 96 and 96 are fixed in the grooves 95 and 95 with an adhesive. Thereafter, the voice coil flange 94 to which the voice coil body 90 is attached is attached to the approximate center of the back surface 81a of the panel 81 using an adhesive. As an adhesive for adhering the lead wires 96, 96 to the grooves 95, 95 and an adhesive for adhering the voice coil flange 94 to the panel 81, a two-component mixed adhesive is used.

  As shown in FIGS. 15 and 18, the magnetic circuit 91 includes a yoke 97, a magnet 98, and a top plate 100. The yoke 97 is a base member of the magnetic circuit 91 and has a substantially bottomed cylindrical shape. Specifically, the yoke 97 includes a center guide portion 97a having a substantially columnar shape, and a mounting portion that extends over the entire circumference toward the outer side in the circumferential direction at the end on the back side of the center guide portion 97a. 97b. A donut-shaped magnet 98 is placed on the placement portion 97b. The magnet 98 is placed on the placement portion 97b so as to be positioned on the outer peripheral side of the center guide portion 97a. A donut-shaped top plate 100 made of a magnetic material is disposed on the front side of the magnet 98. A magnetic gap 101 having a predetermined interval is formed between the outer peripheral portion of the center guide portion 97a and the inner peripheral portion of the top plate 100, and a voice coil 93 is disposed in the magnetic gap 101.

  The magnetic circuit 91 is disposed on the back side of the voice coil body 90 so that the voice coil 93 is fitted in the magnetic gap 101. The magnetic circuit 91 is fixed to a back frame 83 that is a part of the housing via a magnetic circuit fixing ring 103. Specifically, the magnetic circuit 91 is positioned in the front-back direction by screwing the magnetic circuit fixing ring 103 to the back side of the magnetic circuit 91 held in the back frame 83.

  As shown in FIGS. 13 and 16, the front frame 82 is provided with a connector 104 for supplying an external voltage. As a result, a voltage for causing the panel 81 to emit light and sound is supplied to the speaker device 80 via the connector 104. The connector pin 105 of the connector 104 and a light emitting electrode (not shown) are connected using panel light emitting lead wires 106 and 106, and the connector pin 105 and the voice coil 93 are connected by sound generating lead wires 107 and 107. As a result of the connection, the connector 104 can be connected to the panel 81 for light emission and sound generation.

  Here, the lead wire 96 drawn out from the voice coil bobbin 92 passes through the groove 95 of the voice coil flange 94 and is drawn out from the voice coil flange 94. The lead wire 96 drawn out from the voice coil flange 94 is connected to a tinsel wire 108 having a diameter of about 0.6 mm, for example. The tinsel wire 108 is also wound on the back surface 81 a of the panel 81, and its end is connected to the connector pin 105 of the connector 104. That is, the sounding lead wire 107 is composed of the lead wire 96 and the tinsel wire 108.

  In the present embodiment, an adhesive is applied so as to cover all of the lead wires 96 in the portion of the lead wire 96, and in the portion of the tinsel wire 108, the contact portion between the tinsel wire 108 and the back surface 81a of the panel 81, That is, an adhesive was applied to the area on the back half of the tinsel wire 108 and the sounding lead wire 107 was attached to the back surface 81 a of the panel 81. It is also possible to apply an ultraviolet curable adhesive so as to cover the portion where the tinsel wire 108 is twisted, and fix the tinsel wire 108 to the back surface 81 a of the panel 81. By such a mounting method, it is possible to prevent a rattling sound that occurs when the panel 81 has an amplitude.

  Further, the ends of the tinsel wire 108 are connected to the connector pins 105 and the lead wires 96 by soldering. In addition, although the heat sink 87 attached to the panel 81 is a good conductor formed of aluminum, in this embodiment, since the surface of the heat sink 87 is insulated, each lead Even if the exposed portion of the wire 96 that is not covered with the insulating film portion and the tinsel wire 108 are brought into close contact with the surface of the heat radiating plate 87, there is no short circuit.

  FIG. 19 shows a graph of the reproduction frequency characteristics of the speaker device 80 configured as described above.

  As shown in FIG. 19, the reproduction frequency characteristic from about 1000 Hz to about 10000 Hz becomes stable, and the speaker device 80 can output a stable sound with a sound generation amount sufficient for practical use from an audio point of view. Is possible.

  In the speaker device 80 as described above, the voice coil body 90 is directly attached to the back surface 81 a of the panel 81. Therefore, it is possible to easily arrange the sounding lead wire 107 in the space 89 with a simple configuration and practicality. Therefore, it is possible to easily cope with the thinning of the speaker device 80.

  In the speaker device 80 as described above, by fixing the voice coil flange 94 to the back surface 81a of the panel 81, the voice coil 93 can be fixed to the panel 81 with high strength, and the panel 81 is driven. In this case, it can be reduced that the panel 81 is locally vibrated. Further, the arrangement of the voice coil flange 94 can reinforce the strength of the panel 81, and the occurrence of resonance at the contact portion between the voice coil flange 94 and the panel 81 can be reduced.

  In the speaker device 80 as described above, the groove 95 is provided on the back surface 94 a of the voice coil flange 94, and the lead wire 96 is inserted and disposed in the groove 95. For this reason, it becomes advantageous in the space by the diameter dimension of the lead wire 96, and it becomes easy to achieve thickness reduction.

  In the speaker device 80 as described above, the sounding lead wire 107 and the panel 81 are integrated via the voice coil flange 94. For this reason, the speaker device 80 can be thinned by effectively utilizing the space 89.

  In the speaker device 80 as described above, the sound absorbing material 99 is disposed between the top plate 100 and the voice coil flange 94. For this reason, the amplitude in the thinned space 89 can be made uniform, and abnormal noise can be effectively prevented. In particular, since the sound absorbing material 99 has a ring shape, vibrations can be prevented from becoming non-uniform, and sound quality can be improved.

(Eighth embodiment)
Hereinafter, a speaker device 110 and a wiring structure thereof according to an eighth embodiment of the present invention will be described with reference to the drawings. Note that in the speaker device 110 and the wiring structure thereof according to the eighth embodiment, portions that are the same as those in the seventh embodiment are denoted by the same reference numerals, and descriptions thereof are omitted or simplified.

  FIG. 20 is an exploded perspective view of the speaker device 110 according to the eighth embodiment of the present invention when viewed obliquely from the back side. FIG. 21 is an enlarged view of a portion surrounded by an alternate long and short dash line F in FIG. FIG. 22 is an enlarged view of a portion surrounded by a one-dot chain line G in FIG.

  As shown in FIG. 20, the speaker device 110 mainly includes a panel 111 that is an example of a diaphragm, a housing 112 that supports the panel 111, and a driver 84 that vibrates the panel 111. The housing 112 includes a front frame 114 that supports the panel 111 and a back plate 115 that supports the panel 111 and the front frame 114 from the back side. In this embodiment, an IEL panel is adopted as the panel 111. As an example of dimensions of the speaker device 110, for example, the width dimension in the left-right direction can be 225 mm, the length dimension in the vertical direction can be 312 mm, and the thickness dimension can be 7.4 mm. Note that a panel other than the IEL panel may be adopted as the material of the panel 111.

  For example, the panel 111 is formed on an anodized aluminum plate having a length dimension of 307.6 mm and a thickness dimension of 0.4 mm, for example, a length dimension of 307.6 mm and a thickness dimension of 0.9 mm. It is comprised by sticking and mounting | wearing the IEL panel which has NO with an adhesive.

  As shown in FIG. 20, the front frame 114 has a substantially rectangular frame-shaped outer frame portion 116 provided on the outer periphery of the front frame 114, and a magnetic circuit mounting that holds the driver 84 at a substantially center of the front frame 114. A magnetic circuit flange portion 117 serving as an example of a portion, and a total of eight crosspieces 118 spanned between the outer frame portion 116 and the magnetic circuit flange portion 117. For this reason, the front frame 114 has, for example, a total of eight substantially rectangular openings 120 on the top, bottom, left, right, left diagonal sides, and right diagonal sides of the magnetic circuit flange portion 117. That is, the front frame 114 has a substantially cross-girder shape in plan view. The front frame 114 is formed, for example, by cutting an aluminum plate having a thickness of 8 mm with a milling cutter. The outer dimensions of the front frame 114 are the same as the outer dimensions of the speaker device 110, for example, the width dimension in the left-right direction, for example, 225 mm, the length dimension in the vertical direction, for example, 312 mm, and the thickness dimension, for example, 7.4 mm. Can be formed.

  Further, on the front side of the front frame 114, the outer edge of the outer frame portion 116 is given a width of, for example, 2 mm, and a counterbore process having a depth of, for example, 0.8 mm is applied to an inner region thereof. On the other hand, the rear surface of the front frame 114 is provided with a width of, for example, 2 mm at the outer edge of the outer frame portion 116, as in the case of the front side. Has been. For this reason, the step part 121 (only the step part 121 on the back side is shown) along the rectangular frame shape is formed on the front side and the back side of the outer frame part 116. In addition, the part inside the step part 121 in the outer frame part 116, the magnetic circuit flange part 117, and the crosspiece part 118 are formed in the state where the counterbore process was performed, and the surface of those front sides and back side is flush. It has become.

  Further, the front side of the front frame 114 is subjected to, for example, counterbore processing with a depth of 2.9 mm, for example, at a position separated by 14 mm from the outer edge of the outer frame portion 116 toward the inner peripheral side. By this counterboring process, the step portion 121 on the front side of the front frame 114 has, for example, a substantially square frame-shaped contact surface with a width of 12 mm. That is, a step is further formed at a position 12 mm apart from the outer periphery of the step portion 121 on the front side, for example. The panel 111 is mounted on the front side of the front frame 114 so that the stepped portion 121 on the front side is fitted. For this reason, in a state in which the panel 111 is mounted on the front side of the front frame 114, the panel 111 is not in contact with the front frame 114 in a region inside the contact portion.

  In the present embodiment, all of the outer frame portion 116, the magnetic circuit flange portion 117, and the crosspiece portion 118 are integrally provided. However, the front frame 114 is not limited to this configuration. For example, the production process, Alternatively, in consideration of maintenance or the like, a part or all of the outer frame portion 116, the magnetic circuit flange portion 117, and the crosspiece portion 118 may be formed as separate parts. For example, the magnetic circuit flange portion 117 and the crosspiece portion 118 may be integrally formed, and the outer frame portion 116 may be formed as separate parts, or the outer frame portion 116 and the crosspiece portion 118 may be formed integrally, and the magnetic circuit flange portion 117 may be It may be a separate part.

  Further, on the back side of the magnetic circuit flange portion 117, a hole portion 122 for arranging the driving body 84 is formed. The hole 122 is provided at the center of the magnetic circuit flange 117, that is, at the center when the front frame 114 is viewed in plan. The hole portion 122 includes, for example, a through hole 122a having a diameter of 56.02 mm, and a ring step portion 122b formed in a ring shape in plan view on the outer periphery of the through hole 122a on the back side of the magnetic circuit flange portion 117. Have The ring stepped portion 122b is formed on the outside of the through hole 122a by, for example, counterboring with a diameter of 74.1 mm and a depth of 1.5 mm. For example, a total of eight tap holes 123 are provided at intervals of 45 degrees along the circumferential direction, for example, at a position of 33 mm from the center of the through hole 122a in the ring stepped portion 122b. The diameter of the tap hole 123 is 2 mm, for example.

  Further, at the position on the left side of the center line along the vertical direction of the front frame 114, the two crosspieces 118 and the magnetic circuit flange portion 117 provided along the vertical direction are formed with long grooves 124 along the vertical direction. Has been. The long groove 124 includes an upper long groove 125 formed upward from the hole 122, a lower long groove 126 formed downward from the hole 122, and a hole between the upper long groove 125 and the lower long groove 126. And an arc-shaped long groove 127 formed in an arc shape on the outer periphery of the portion 122. The long groove 124 is formed as a groove having a width of 2.6 mm and a depth of 1.6 mm, for example. A substantially U-shaped long groove 128 is also formed on the outer peripheral portion of the opening 120 provided below the magnetic circuit flange portion 117 so as to be connected to the lower long groove 126.

  The driving body 84 includes a voice coil body 90 and a magnetic circuit 91. The voice coil body 90 includes a voice coil bobbin 92 and a voice coil 93 that is wound around the outer peripheral surface of the voice coil bobbin 92 and bonded and fixed. In the present embodiment, the voice coil body 90 is attached to the back surface 111 a of the panel 111 by adhesion while being attached to the inside of the voice coil flange 94. Note that the voice coil bobbin 92 used in the present embodiment has a height dimension, for example, 1 mm larger than that of the voice coil bobbin 92 used in the seventh embodiment.

  With the voice coil body 90 attached to the inside of the voice coil flange 94, the two lead wires 96, 96 corresponding to the winding start portion and winding end portion of the voice coil 93 are passed from the voice coil bobbin 92 to the inside of the grooves 95, 95. The lead wires 96 and 96 are fixed in the grooves 95 and 95 with an adhesive. Thereafter, the voice coil flange 94 to which the voice coil body 90 is attached is attached to the approximate center of the back surface of the panel 81 using an adhesive. The magnetic circuit 91 includes a yoke 97, a magnet, and a top plate, as in the case of the seventh embodiment.

  As in the case of the seventh embodiment, the magnetic circuit 91 is arranged on the back side of the voice coil body 90 so that the voice coil 93 is fitted in the magnetic gap. The magnetic circuit 91 is fixed to a back plate 115 that is a part of the housing via a magnetic circuit fixing ring 103. Specifically, the magnetic circuit 91 is disposed in the hole 122 with the back plate 115 mounted on the back side of the front frame 114. Thereafter, the magnetic circuit fixing ring 103 is arranged on the back side of the ring stepped portion 122b, and a screw is inserted into a through hole provided in the magnetic circuit fixing ring 103 and screwed into the tap hole 123, whereby the magnetic circuit 91 is turned in the front and back direction. Is positioned.

  On the other hand, as shown in FIG. 20, in the long groove 124 and the U-shaped long groove 128 in the front frame 114, a cyclic lead wire 130 as an example of two wiring members for driving the voice coil is disposed. It is. The cyclic lead wire 130 is a wire rod having a diameter of about 1 mm, for example, in which a conductive metal wire is covered with a vinyl chloride resin, which is commonly used.

  A connector terminal 131 is disposed on the lower side of the front frame 114, and one end portion of the cyclic lead wire 130 is connected to the connector pin 132 of the connector terminal 131. In the case of the present embodiment, the central portion of the back surface 111a of the panel 111 is driven by the driving body 84, and the other portions are arranged on the center line along the vertical direction, for example, a total of four piezoelectric vibrations arranged. It is driven by the body 140. That is, the panel 111 is driven by a 2WAY driving method.

  The piezoelectric vibrating body 140 is configured as a so-called bimorph type piezo element having a metal substrate 141 (shim) made of stainless steel and two piezo elements 142 arranged with the metal substrate 141 interposed therebetween. The piezo element 142 is, for example, a rectangular thin plate having a longitudinal length of 13.5 mm, a lateral length of 31 mm, and a thickness of 0.8 mm. The piezoelectric vibrating body 140 is attached to the back surface 111 a of the panel 111 via the attachment 143.

  The fixture 143 includes a pair of support members 144 and 144. The support member 144 includes a prismatic part 145 that has a prismatic shape as a whole and square prism parts 146 provided at both ends thereof. For example, the prismatic part 145 and the rectangular prism part 146 are integrally formed of an acrylic resin material. Is formed. The piezoelectric vibrating body 140 is sandwiched between the front and back surfaces of the central portion by the support member 144 (square column portion 145), and is fixed by means such as adhesion in the sandwiched state. Further, the support member 144 holding the piezoelectric vibrating body 140 is attached to the back surface 111a of the panel 111 with an acrylic adhesive. Therefore, the vibration of the piezoelectric vibrator 140 is transmitted to the back surface 111a of the panel 111 via the support member 144 (mounting tool 143).

  In order to vibrate the piezoelectric vibrating body 140, it is necessary to input an electric signal. As shown in FIGS. 20 and 21, electrical signals are input to the piezoelectric vibrating body 140 by connecting the piezoelectric elements 142 arranged on the front and back to each other, and connecting the input lead wires 149 to the surface of the piezoelectric elements 142 and the metal substrate 141. By connecting to the surface of each. In the present embodiment, as shown in FIG. 21, one end of an input lead wire 149 made of a tinsel wire is connected to the surface of the piezo element 142 or the surface of the metal substrate 141 by soldering, and the input lead The other end of the wire 149 is connected by soldering to the end of the cyclic lead 130 that extends over the long groove 124 described above.

  Further, in the present embodiment, since the para-wiring is used for the wiring of the four piezoelectric vibrators 140 arranged on the front frame 114, each cyclic lead wire 130 is covered as shown in FIG. The vinyl chloride resin is peeled off at a desired location, and one end of a jumper wire 147 having a predetermined length is connected to the surface of the metal wire exposed from the peeled portion by soldering. On the other hand, as shown in FIG. 21, the other end of the jumper wire 147 extends inside the opening 120, and the other end of the jumper wire 147 is connected to the piezo element 142 and the metal substrate 141. And connected to the end of the input lead wire 149 by soldering. It should be noted that the connection portion between the jumper wire 147 and the cyclic lead wire 130 is made effective by irradiating ultraviolet rays by applying an ultraviolet curable adhesive to the connection portion after both are connected by wiring. Therefore, the connection portion between the jumper wire 147 and the cyclic lead wire 130 has a structure sealed in the long groove 124. Further, a desired portion of the cyclic lead wire 130 and a peripheral portion of the connector terminal 131 are also sealed as described above. In the present embodiment, the jumper wire 147, the cyclic lead wire 130, etc. are locally sealed in the long groove 124. However, all of the jumper wire 147, the cyclic lead wire 130, etc. in the long grooves 124, 128 are used. May be sealed.

  The front frame 114 is made of aluminum and is a good conductive material, but in this embodiment, the surface thereof is anodized. For this reason, alumite serves as an insulating material, and the above-described jumper wire 147 or a soldered portion to the exposed portion of the metal wire in the cyclic lead wire 130 is prevented from coming into contact with the outside and short-circuiting.

  Further, in the present embodiment, as shown in FIG. 20, the lead wire 96 drawn out from the voice coil 93 has, for example, a rectangular shape having a width of about 4 mm, for example, a length of about 30 mm, and a thickness of 50 μm, for example. A copper foil 150 as an example of a conductor exhibiting a thin plate is connected. The lead wire 96 is connected to one end side of the copper foil 150. Further, as shown in FIG. 22, the other end of the copper foil 150 is connected by soldering to a circulating lead wire 130 disposed in a U-shaped long groove 128 via a tinsel wire 151. That is, the lead wire 96 is connected to the cyclic lead wire 130 via the copper foil 150. The copper foil 150 is attached to the back surface 111a of the panel 111 with an adhesive. As a result, even when the panel 111 having a large area vibrates with a large amplitude, it is possible to prevent the lead wire 96 from coming into contact with the metal front frame 114 and to generate abnormal noise. Further, the lead wire 96 is made of metal. It is possible to prevent a short circuit due to contact with the manufactured front frame 114.

  FIG. 23 shows a graph of the reproduction frequency characteristics of the speaker device 110 configured as described above. In FIG. 23, the frequency characteristic of the speaker device 110 of the present embodiment is indicated by a solid line, and the frequency characteristic of the conventional speaker device is indicated by a broken line.

  As shown in FIG. 23, the speaker device 110 according to the present embodiment has no reproduction at about 2000 Hz and stable reproduction frequency characteristics from about 2000 Hz to about 10,000 Hz as compared with the conventional speaker device. It has become. For this reason, the speaker device 110 can output a stable sound with a sound generation amount sufficient for practical use from an audio point of view.

  In the speaker device 110 configured as described above, a thin film conductor such as a copper foil 150 is attached to the back surface 111 a of the panel 111. As described above, by using the copper foil 150 as a relay or an input conductor for the voice coil 93, the space between the panel 111 and the housing 112 can be effectively used. As a result, the speaker device 110 is used. This is advantageous in reducing the thickness.

  Further, in the speaker device 110 configured as described above, the long grooves 124 and 128 are provided in the front frame 114, and wiring members such as the cyclic lead wires 130 are arranged and mounted in the long grooves 124 and 128. With such a configuration, it is possible to reduce the number of man-hours for wiring work. In addition, various wiring materials such as the cyclic lead wire 130 do not come into contact with the back surface 111a of the panel 111, and the various wire materials can be reliably fixed in the housing 112.

  Further, in the speaker device 110 configured as described above, by providing the front frame 114 with the long grooves 124, 128 and the like, various wiring materials such as the cyclic lead wire 130 are surely arranged in the housing 112. It is said that. For this reason, various lead wires can be prevented from being randomly arranged in the space between the panel 111 and the housing 112. Therefore, when the panel 111 vibrates, wiring such as the lead wires 96 and 130 contacts the back surface 111a of the panel 111, so that abnormal noise can be prevented and the speaker device 110 can be thinned.

  Further, in the speaker device 110 configured as described above, the front frame 114 has a configuration in which the outer frame portion 116, the magnetic circuit flange portion 117, and the crosspiece portion 118 are integrally provided. For this reason, the number of steps for manufacturing the housing 112 can be significantly reduced. In addition, with such a configuration, it is possible to improve the strength of the speaker device 110, and it is possible to improve the sound quality and reduce the weight.

  Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and can be implemented in various modifications.

  In each of the first to sixth embodiments described above, lead wires 17, 31, 41, 62 made of tinsel wires are connected to the copper foil 18, but the lead wires 17 connected to the copper foil 18 are connected. , 31, 41, 62 are not limited to adopting the tinsel wire, but, for example, a general wire in which the lead wires 17, 31, 41, 62 are coated with a metal wire with a vinyl chloride resin. And so on.

  Further, in each of the first to sixth embodiments described above, the lead wires 17, 31, 41, 62 are bent in a gentle arc shape toward the outside, but the lead wires 17, 31, 41, 62 are For example, the lead wires 17, 31, 41, and 62 may be bent in other shapes, or may not be bent.

  In the seventh and eighth embodiments described above, the voice coil flange 94 is disposed. However, the voice coil flange 94 is not disposed, and the lead wire 96 is attached to the back surfaces 81a and 111a of the panels 81 and 111. You may make it adhere | attach directly.

  Further, in the above-described eighth embodiment, the lead wire 96 is connected to the cyclic lead wire 130 using the copper foil 150, but instead of the copper foil 150, plating with a conductor depending on the purpose. Alternatively, means such as vapor deposition may be employed, and pattern printing in consideration of vibration resistance of the part may be employed. If such a technique is applied, a desired wiring pattern is drawn on a printed circuit board or a flexible printed circuit board, and an actuator such as a voice coil 93 and a piezo element 142 is mounted on the surface of the wiring pattern. Can be directly pronounced, and the wiring man-hours of the speaker device 110 can be greatly reduced.

  Further, in the above-described eighth embodiment, the panel 111 having the IEL panel mounted on the aluminum plate is sounded, but the material of the panel 111 is not limited to this, and a suitable panel material is selected according to the purpose. You may make it do.

  In the seventh and eighth embodiments described above, aluminum is used as the material of the housing, but the material of the housing is not limited to aluminum, and other metals, resins, or metals A composite material of resin and resin may be used depending on the purpose. It is possible to improve sound quality by using different materials for the housing and making the resonance points different.

  In the seventh embodiment, the sound absorbing material 99 is disposed between the top plate 100 and the voice coil flange 94. However, the sound absorbing material 99 may not be disposed. Instead of 99, another member such as a cushion material may be arranged. Also in the above-described eighth embodiment, a sound absorbing material may be disposed between the top plate 100 and the voice coil flange 94.

  DESCRIPTION OF SYMBOLS 1,30,40,50,60,70,80,110 ... Speaker apparatus 10, 81, 111 ... Panel (diaphragm) 10a, 81a, 111a ... Back surface 11, 89 ... Space 14, 91, ... Magnetic circuit 15, 94 ... Voice coil bobbin (driving coil holding part) 16, 93 ... Voice coil (driving coil) 17, 31, 41, 62, 72, 96 ... Lead wire (input lead wire) 18 ... Copper foil 21 ... Magnet flange (Part of the casing) 24, 100 ... top plate 51, 61, 94 ... voice coil flange (flange) 63, 96 ... groove 82 ... front frame (part of casing) 83 ... back frame (one part of casing) 99) Sound absorbing material 109, 112 ... Housing 116 ... Outer frame portion 117 ... Magnetic circuit flange portion (magnetic circuit mounting portion) 118 ... Crosspiece 125 ... Upper long groove (groove) 126 ... Lower long groove (groove) 128 ... U long groove (groove) 130 ... Cyclic lead wire (wiring material) 150 ... Copper foil (conductor)

Claims (15)

A planar diaphragm;
A driving coil mounted on the diaphragm;
A magnetic circuit including the driving coil and driving the diaphragm;
In the wiring structure of the speaker device having
An input lead wire to the driving coil is arranged in a space formed between the diaphragm and the magnetic circuit, and the input is provided on the outer periphery of the driving coil holding portion that holds the driving coil. A wiring structure of a speaker device, wherein the tip of a lead wire for electrical connection and the tip of the driving coil are electrically connected. The wiring structure of the speaker device according to claim 1,
A wiring structure of a speaker device, wherein the input lead wire is relayed to the diaphragm or the magnetic circuit. In the wiring structure of the speaker device according to claim 1 or 2,
A wiring structure of a speaker device, wherein the input lead wire is fixed on a back surface that is a surface facing the magnetic circuit in the diaphragm. In the wiring structure of the speaker device according to any one of claims 1 to 3,
The speaker device wiring structure, wherein the input lead wire is a tinsel wire. In the wiring structure of the speaker device according to any one of claims 1 to 4,
The wiring structure of the speaker device, wherein the input lead wire is subjected to a forming process so that the input lead wire is along a direction orthogonal to a vibration direction of the diaphragm. In the wiring structure of the speaker device according to any one of claims 1 to 5,
A wiring structure of a speaker device, wherein a flange is attached to an outer peripheral end of the driving coil holding portion for holding the driving coil, and an input lead wire is disposed along the flange. The wiring structure of the speaker device according to claim 6,
The flange has a substantially ring shape, and a groove is provided on the plane of the flange from the inner periphery to the outer periphery, and an input lead wire is disposed along the groove. The wiring structure of the speaker device. The wiring structure of the speaker device according to claim 7,
A wiring structure for a speaker device, wherein a copper foil is mounted at a desired position on the outer peripheral surface of the driving coil holding portion, and the tip of the input lead wire disposed in the groove is connected to the copper foil. . In the wiring structure of the speaker device according to any one of claims 1 to 8,
A wiring structure of a speaker device, wherein a thin film-like conductor is attached to the rear surface of the diaphragm, and the input lead wire is connected to the driving coil through the conductor. In the wiring structure of the speaker device according to any one of claims 1 to 8,
A wiring for a speaker device, characterized in that a conductor is plated or vapor deposited on the back surface of the diaphragm, and the input lead wire is connected to the driving coil via the conductor. Construction. In the wiring structure of the speaker device according to any one of claims 1 to 8,
The magnetic circuit is held in a housing;
A wiring structure of a speaker device, characterized in that the input lead wire or a wiring material connected to the input lead wire is arranged over a surface of the housing. The wiring structure of the speaker device according to claim 11,
A wiring structure of a speaker device, wherein a groove is provided at a desired location of the housing, and the input lead wire or a wiring material connected to the input lead wire is disposed in the groove. The wiring structure of the speaker device according to claim 11 or 12,
The housing includes an outer frame portion having a frame shape, a magnetic circuit mounting portion to which the magnetic circuit is mounted, and a crosspiece that connects the magnetic circuit mounting portion and the outer frame portion,
Part or all of the magnetic circuit mounting portion, the outer frame portion, and the crosspiece portion are integrally formed, and the input lead wires are disposed at desired positions of the magnetic circuit mounting portion, the outer frame portion, and the crosspiece portion. Or the wiring structure of the speaker device, wherein wiring members connected to the input lead wires are arranged in a line.   A speaker device having the wiring structure of the speaker device according to claim 1. The speaker device according to claim 14, wherein
A speaker device, wherein a sound absorbing material or a cushioning material is disposed in a position facing the top plate constituting the magnetic circuit in the space.

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