TWI532577B - 模具用鋼材之硏磨性評估方法以及模具之硏磨性的評估方法 - Google Patents

模具用鋼材之硏磨性評估方法以及模具之硏磨性的評估方法 Download PDF

Info

Publication number
TWI532577B
TWI532577B TW102110941A TW102110941A TWI532577B TW I532577 B TWI532577 B TW I532577B TW 102110941 A TW102110941 A TW 102110941A TW 102110941 A TW102110941 A TW 102110941A TW I532577 B TWI532577 B TW I532577B
Authority
TW
Taiwan
Prior art keywords
mold
waviness
value
steel
evaluating
Prior art date
Application number
TW102110941A
Other languages
English (en)
Chinese (zh)
Other versions
TW201350299A (zh
Inventor
菅野隆一朗
長澤政幸
岸川円
Original Assignee
日立金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立金屬股份有限公司 filed Critical 日立金屬股份有限公司
Publication of TW201350299A publication Critical patent/TW201350299A/zh
Application granted granted Critical
Publication of TWI532577B publication Critical patent/TWI532577B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Investigating And Analyzing Materials By Characteristic Methods (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Metal Extraction Processes (AREA)
TW102110941A 2012-03-28 2013-03-27 模具用鋼材之硏磨性評估方法以及模具之硏磨性的評估方法 TWI532577B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012073094 2012-03-28

Publications (2)

Publication Number Publication Date
TW201350299A TW201350299A (zh) 2013-12-16
TWI532577B true TWI532577B (zh) 2016-05-11

Family

ID=49366141

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102110941A TWI532577B (zh) 2012-03-28 2013-03-27 模具用鋼材之硏磨性評估方法以及模具之硏磨性的評估方法

Country Status (4)

Country Link
JP (1) JP6086311B2 (ja)
KR (1) KR101397291B1 (ja)
CN (1) CN103364295B (ja)
TW (1) TWI532577B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6235877B2 (ja) * 2013-11-21 2017-11-22 矢崎総業株式会社 金属調加飾部品
DE102018110909A1 (de) 2017-12-22 2018-06-21 Schott Ag Abdeckplatte mit farbneutraler Beschichtung
DE202018102534U1 (de) 2017-12-22 2018-05-15 Schott Ag Transparente, eingefärbte Lithiumaluminiumsilikat-Glaskeramik
DE102018110897A1 (de) 2017-12-22 2018-06-21 Schott Ag Einrichtungs- und Ausstattungsgegenstände für Küchen oder Labore mit Anzeigeeinrichtung
DE102018110910A1 (de) 2017-12-22 2018-06-21 Schott Ag Einrichtungs- und Ausstattungsgegenstände für Küchen oder Labore mit Leuchtelement
DE102018110855A1 (de) 2017-12-22 2018-06-28 Schott Ag Glaskeramik mit reduziertem Lithium-Gehalt
TWI744991B (zh) * 2020-07-20 2021-11-01 中國鋼鐵股份有限公司 成形後鋼材表面之粗化巨觀缺陷的評估方法
CN114034592A (zh) * 2021-10-28 2022-02-11 青岛雨荣研磨材料有限公司 一种磨料磨耗及破碎性能检测分析方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08159751A (ja) * 1994-12-08 1996-06-21 Nippon Sheet Glass Co Ltd ガラス板表面評価方法
JPH10103948A (ja) * 1996-09-30 1998-04-24 Tokyo Seimitsu Co Ltd 表面粗さ形状測定機の測定条件設定方法及びその装置
JP3241615B2 (ja) * 1996-11-01 2001-12-25 株式会社東京精密 表面粗さ形状測定機の測定条件自動設定方法及びその装置
JP3525432B2 (ja) * 2000-09-29 2004-05-10 株式会社東京精密 粗さ測定方法及び粗さ測定装置
CN100537669C (zh) * 2003-08-26 2009-09-09 三菱丽阳株式会社 光反射体用热塑性树脂组合物、光反射体用成形品、光发射体及光反射体用成形品的制造方法
JP5095141B2 (ja) * 2006-07-05 2012-12-12 日本ミクロコーティング株式会社 テープ状金属基材の表面研磨システム及び研磨方法
CN101352818A (zh) * 2007-07-23 2009-01-28 江苏海迅实业集团股份有限公司 一种金属工件表面抛光降低粗糙度方法
JP2010214547A (ja) 2009-03-17 2010-09-30 Nihon Micro Coating Co Ltd 研磨シート及びその製造方法
JP2010214576A (ja) 2009-03-19 2010-09-30 Konica Minolta Opto Inc 研磨方法、光学素子の製造方法および金型の再加工方法
JP5385653B2 (ja) 2009-03-25 2014-01-08 株式会社アドマテックス 研磨用パッド及び研磨方法
CN105070657B (zh) * 2009-08-19 2018-03-30 日立化成株式会社 Cmp研磨液及其应用、研磨方法
JP5717593B2 (ja) * 2011-08-31 2015-05-13 住友ゴム工業株式会社 プレフィルドシリンジ用ガスケットの成型金型

Also Published As

Publication number Publication date
CN103364295B (zh) 2015-07-15
CN103364295A (zh) 2013-10-23
KR20130110095A (ko) 2013-10-08
KR101397291B1 (ko) 2014-05-20
TW201350299A (zh) 2013-12-16
JP2013228369A (ja) 2013-11-07
JP6086311B2 (ja) 2017-03-01

Similar Documents

Publication Publication Date Title
TWI532577B (zh) 模具用鋼材之硏磨性評估方法以及模具之硏磨性的評估方法
Denkena et al. Influence of the cutting edge preparation method on characteristics and performance of PVD coated carbide inserts in hard turning
Nadolny et al. Analysis of flatness deviations for austenitic stainless steel workpieces after efficient surface machining
Li et al. Wear mechanisms and performance of abrasively ground polycrystalline diamond tools of different diamond grains in machining titanium alloy
Denkena et al. Impact of hard machining on zirconia based ceramics for dental applications
Grzesik et al. Comparison of surface textures produced by finish cutting, abrasive and burnishing operations in terms of their functional properties
KR20170098262A (ko) 면도날
CN110573351B (zh) 装饰部件
CN109015125B (zh) 一种基于脆性去除比例系数及面粗糙度的硬脆材料延性域磨削判定方法
Denkena et al. New profiling approach with geometrically defined cutting edges for sintered metal bonded CBN grinding layers
Denkena et al. Grinding of PCBN cutting inserts
Żak et al. Metrological aspects of surface topographies produced by different machining operations regarding their potential functionality
Shafrir et al. A magnetorheological polishing-based approach for studying precision microground surfaces of tungsten carbides
JP2018095898A (ja) 微細遊離炭素分散型の超硬合金と被覆超硬合金の製造方法
TW201446428A (zh) 研磨工具及其形成方法
Novák et al. Influence of grinding wheel dressing on the roughness of final surface and cutting force during GGG60 grinding
Rebeggiani et al. Quantitative evaluation of the surface finish of high gloss polished tool steels
WO2018105706A1 (ja) 微細遊離炭素分散型の超硬合金の製造方法ならびに同合金から形成される刃先交換切削チップと加工品およびその製造方法
Zak Areal field and fractal based characterization of hard surfaces produced by different machining operations
Sabaa et al. Glass and porcelain waste as abrasives investigated at different conditions
Tournier et al. Grinding of medical implants in cobalt-chromium alloy
Rebeggiani et al. A step-by-step analysis of manual polishing sequences
Ha et al. Machining characteristics of mold material in high-speed grinding
Gochev et al. Determination of performance indicators and quality of TCT knives when sharpened with PCD grinding wheels
CN105473284B (zh) 研磨工具及其形成方法