TWI531671B - A cooling system with a plate cooling function - Google Patents

A cooling system with a plate cooling function Download PDF

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TWI531671B
TWI531671B TW103144060A TW103144060A TWI531671B TW I531671 B TWI531671 B TW I531671B TW 103144060 A TW103144060 A TW 103144060A TW 103144060 A TW103144060 A TW 103144060A TW I531671 B TWI531671 B TW I531671B
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Taiwan
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phase change
coating
cooling
tray
unit
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TW103144060A
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Chinese (zh)
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TW201623666A (en
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Cheng-Peng Ye
Hui-Jia Su
Chong-Yu Ye
Zong-Wei Zhang
Yi-Yuan Huang
Wan-Yu Huang
mu-sen Lu
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Linco Technology Co Ltd
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Publication of TW201623666A publication Critical patent/TW201623666A/en

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Description

具有載盤冷卻功能的鍍膜系統 Coating system with tray cooling function

本發明是有關於一種鍍膜系統,特別是指一種具有載盤冷卻功能的鍍膜系統。 The present invention relates to a coating system, and more particularly to a coating system having a tray cooling function.

目前真空鍍膜技術的應用日漸廣泛,舉凡在可攜式3C電子產品外殼上鍍覆防電磁波干擾(Electro-magnetic interference,EMI)鍍膜的3C產業,甚或是在透明鏡片上鍍覆有光學鍍膜(optical film)的光學鏡片產業等,皆須使用到真空濺鍍設備;其中,又以連續式多腔體(multi-chamber)的鍍膜系統因為擁有速度快、產量高、鍍覆品質優良,及能大幅地降低生產成本等優點,因此已廣泛地應用於大量鍍膜的製程中。一般連續式多腔體的鍍膜系統依序包含至少三個區域:一進料腔體區、一鍍膜腔體區,及一出料腔體區;其中,一待鍍物是被置於一傳送單元上的一承載盤上,以於上述腔體區內或跨腔體區之間傳輸,並由該出料腔體區輸出一在該待鍍物之一表面鍍覆有一鍍膜的成品。 At present, the application of vacuum coating technology is becoming more and more extensive. The 3C industry is coated with electro-magnetic interference (EMI) coating on the casing of portable 3C electronic products, or even optically coated on transparent lenses. The optical lens industry of film) must use vacuum sputtering equipment; among them, the continuous multi-chamber coating system has high speed, high output, excellent plating quality and large The advantages of reducing the production cost and the like have been widely applied to the process of a large number of coatings. The continuous continuous multi-cavity coating system sequentially comprises at least three regions: a feed cavity region, a coating cavity region, and a discharge cavity region; wherein a plate to be plated is placed in a transfer A carrier on the unit is transported between the cavity or the cavity, and a discharge finished product is printed on the surface of one of the objects to be plated.

參閱圖1,台灣第M258101核准公告號新型專利案公開一種自動化潛入式內部迴流裝置1,是應用於一連 續式多腔體鍍膜系統14,其包含一前升降裝置11、一後升降裝置12,及一設置於該連續式多腔體鍍膜系統14下的回傳機構模組13。該前升降裝置11與該後升降裝置12分別設於該連續式鍍膜系統14的一輸入端141與一輸出端142;其中,該前升降裝置11、該連續式多腔體鍍膜系統14、該後升降裝置12,與該回流機構模組13共同定義出一封閉迴路。 Referring to Figure 1, the new patent case of Taiwan M258101 Approved Announcement No. discloses an automated submersible internal recirculation device 1 that is applied to a company. The continuation multi-cavity coating system 14 includes a front lifting device 11 , a rear lifting device 12 , and a return mechanism module 13 disposed under the continuous multi-cavity coating system 14 . The front lifting device 11 and the rear lifting device 12 are respectively disposed at an input end 141 and an output end 142 of the continuous coating system 14; wherein the front lifting device 11 and the continuous multi-cavity coating system 14 The rear lifting device 12 defines a closed loop together with the reflow mechanism module 13.

當一承載有一待鍍物(圖未示)的承載盤10於該 連續式多腔體鍍膜系統14內執行完一鍍膜製程後,是自該連續式鍍膜系統14的輸出端142移至該後升降裝置12上,並在該待鍍物被移除後由該後升降裝置12透過一壓缸來帶動該承載盤10向下位移,經由該回傳機構模組13帶動該承載盤10朝該前升降裝置11移動,被定位於該前升降裝置11上的該承載盤10上重新放置有一新的待鍍物後,該前升降裝置11則透過一壓缸來使該承載盤10向上位移,使該承載盤10重新導入該連續式鍍膜系統14的輸入端141。 When a carrier disk 10 carrying a material to be plated (not shown) is After performing a coating process in the continuous multi-cavity coating system 14, it is moved from the output end 142 of the continuous coating system 14 to the rear lifting device 12, and after the object to be plated is removed, The lifting device 12 drives the carrier plate 10 downward through a pressure cylinder, and the carrier plate 10 is driven to move toward the front lifting device 11 via the return mechanism module 13 to be positioned on the front lifting device 11 After a new object to be plated is placed on the disk 10, the front lifting device 11 is displaced upward by a pressure cylinder to re-import the carrier plate 10 into the input end 141 of the continuous coating system 14.

然而,放置有該待鍍物的承載盤10於該連續式 多腔體鍍膜系統14內執行該鍍膜製程中,將因其內部的一電漿環境而累積大量的高溫熱能。因此,一旦該承載盤10反覆地行經此閉迴路,並於該高溫電將環境中重覆地累積大量的高溫熱能,則容易導致該承載盤10及其待鍍物的溫度過高,因而損壞鍍膜品質。 However, the carrier tray 10 on which the object to be plated is placed is in the continuous type When the coating process is performed in the multi-cavity coating system 14, a large amount of high-temperature heat energy is accumulated due to a plasma environment inside. Therefore, once the carrier tray 10 repeatedly passes through the closed loop, and the high temperature heat accumulates a large amount of high-temperature heat energy in the environment, the temperature of the carrier tray 10 and the object to be plated thereof is likely to be too high. Therefore, the quality of the coating is damaged.

經上述說明可知,改良鍍膜系統的結構以解決 鍍膜系統中的散熱問題,是此技術領域的相關技術人員所待突破的難題。 According to the above description, the structure of the coating system is improved to solve The problem of heat dissipation in the coating system is a problem to be solved by those skilled in the art.

因此,本發明之目的,即在提供一種具有載盤冷卻功能的鍍膜系統。 Accordingly, it is an object of the present invention to provide a coating system having a tray cooling function.

於是,本發明具有載盤冷卻功能的鍍膜系統,包含:一載盤、一鍍膜站、一迴流裝置,及一冷卻裝置。該載盤包括一盤本體與一相變化物質,該盤本體內部形成有一填置該相變化物質的密閉空間。該鍍膜站包括一入口端與一出口端,該載盤能自該入口端進入該鍍膜站中以進行一鍍膜製程,並由該出口端移出該鍍膜站。該迴流裝置包括一設置在該鍍膜站外的傳送單元,該傳送單元使該載盤沿一自該鍍膜站的出口端朝該鍍膜站的該入口端的傳送路徑移動。該冷卻裝置設置於傳送單元的該傳送路徑上。在本發明中,該相變化物質能自該盤本體吸收一在該鍍膜製程中所累積的熱能,以作為至少部分的該相變化物質自一固態熔融成一液態時所需的潛熱(latent heat),且該相變化物質的熔點為介於18℃至95℃間;該冷卻裝置能自該相變化物質吸收該熱能,以令至少部分的該相變化物質自該液態凝固成該固態。 Therefore, the coating system of the invention having a tray cooling function comprises: a carrier, a coating station, a reflow device, and a cooling device. The carrier includes a disk body and a phase change substance, and a sealed space for filling the phase change substance is formed inside the disk body. The coating station includes an inlet end and an outlet end. The carrier can enter the coating station from the inlet end to perform a coating process, and the outlet end moves out of the coating station. The reflow device includes a transfer unit disposed outside the coating station, the transfer unit moving the carrier along a transport path from the exit end of the coating station toward the inlet end of the coating station. The cooling device is disposed on the transport path of the transport unit. In the present invention, the phase change material is capable of absorbing a thermal energy accumulated in the coating process from the disk body as a latent heat required for at least a portion of the phase change material to be melted from a solid state into a liquid state. And the phase change substance has a melting point of between 18 ° C and 95 ° C; the cooling device is capable of absorbing the thermal energy from the phase change material such that at least a portion of the phase change material solidifies from the liquid state into the solid state.

本發明之功效在於,藉由該載盤的改良,利用該相變化物質本身所需的熔解潛熱,以自該盤本體吸收該熱能,能帶走於該鍍膜過程中累積在載盤上的高溫熱能以提升鍍膜品質,另外利用該冷卻裝置自該相變化物質吸收 該熱能,以將解決鍍膜系統中的散熱問題。 The effect of the present invention is that by utilizing the improvement of the carrier, the latent heat of fusion required by the phase change material itself is utilized to absorb the heat energy from the disk body, and the high heat accumulated on the carrier during the coating process can be carried away. Warm energy to improve the quality of the coating, and the use of the cooling device to absorb from the phase change substance This heat energy will solve the heat dissipation problem in the coating system.

2‧‧‧載盤 2‧‧‧Package

21‧‧‧盤本體 21‧‧‧ disk body

22‧‧‧相變化物質 22‧‧‧ phase change substances

3‧‧‧鍍膜站 3‧‧‧ coating station

301‧‧‧入口端 301‧‧‧ entrance end

302‧‧‧出口端 302‧‧‧export end

31‧‧‧載入腔體 31‧‧‧Loading cavity

32‧‧‧濺鍍腔體 32‧‧‧Sputter chamber

33‧‧‧卸載腔體 33‧‧‧Unloading the cavity

34‧‧‧傳送機構 34‧‧‧Transportation agency

341‧‧‧伺服馬達 341‧‧‧Servo motor

342‧‧‧滾輪 342‧‧‧Roller

4‧‧‧迴流裝置 4‧‧‧Reflow device

41‧‧‧傳送單元 41‧‧‧Transfer unit

411‧‧‧支架 411‧‧‧ bracket

412‧‧‧傳送組件 412‧‧‧Transfer components

413‧‧‧輸送模組 413‧‧‧Transport module

414‧‧‧伺服馬達 414‧‧‧Servo motor

42‧‧‧感測單元 42‧‧‧Sensor unit

43‧‧‧前升降單元 43‧‧‧Front lift unit

44‧‧‧後升降單元 44‧‧‧ rear lift unit

5‧‧‧冷卻裝置 5‧‧‧Cooling device

51‧‧‧散熱板 51‧‧‧heat plate

511‧‧‧入口 511‧‧‧ entrance

512‧‧‧出口 512‧‧‧Export

513‧‧‧冷卻通道 513‧‧‧Cooling channel

52‧‧‧驅動件 52‧‧‧ drive parts

53‧‧‧風扇 53‧‧‧fan

54‧‧‧冷卻液體 54‧‧‧Cooling liquid

X‧‧‧排列方向 X‧‧‧Orientation

本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一正視示意圖,說明台灣第M258101核准公告號所公開的一種自動化潛入式內部迴流裝置;圖2是一俯視示意圖,說明本發明具有載盤冷卻的鍍膜系統的一第一實施例;圖3是一沿圖2的一折線III-III所取得的正視剖視圖,說明該第一實施例的一鍍膜站、一迴流裝置、一冷卻裝置、一前升降單元,及一後升降單元;圖4是一剖視示意圖,說明該第一實施例的一載盤;圖5是一俯視示意圖,說明該第一實施例的一迴流裝置與一冷卻裝置;圖6是一正視示意圖,說明該第一實施例的該載盤與該冷卻裝置接觸時的一使用狀態;圖7是一溫度對時間的關係圖,說明該第一實施例的該載盤於該冷卻裝置進行一冷卻過程的溫度變化;圖8是一凝固比率對時間的關係圖,說明該第一實施例的該載盤於該冷卻裝置進行該冷卻過程的凝固比率變化;圖9是一立體組合圖,說明本發明具有載盤冷卻的鍍膜系統的一第二實施例的一迴流裝置與一冷卻裝置;圖10是一溫度對時間的關係圖,說明該第二實施例的該載盤於該冷卻裝置進行一冷卻過程的溫度變化; 圖11是一凝固比率對時間的關係圖,說明該第二實施例的該載盤於該冷卻裝置進行該冷卻過程的凝固比率變化。 Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a front elevational view showing an automated submersible internal reflow device disclosed in Taiwan No. M258101 Approved Publication No.; 2 is a top plan view showing a first embodiment of the coating system with tray cooling according to the present invention; and FIG. 3 is a front cross-sectional view taken along line III-III of FIG. 2, illustrating a first embodiment of the first embodiment. a coating station, a reflow device, a cooling device, a front lifting unit, and a rear lifting unit; FIG. 4 is a schematic cross-sectional view showing a carrier of the first embodiment; FIG. 5 is a top plan view illustrating the A reflow device and a cooling device of the first embodiment; FIG. 6 is a front elevational view showing a state of use of the carrier of the first embodiment in contact with the cooling device; FIG. 7 is a temperature versus time relationship; FIG. 8 is a graph showing the temperature change of the carrier in the first embodiment of the cooling device during a cooling process; FIG. 8 is a graph showing the solidification ratio versus time, illustrating the carrier of the first embodiment. The cooling device performs a change in the solidification ratio of the cooling process; FIG. 9 is a perspective assembled view illustrating a reflow device and a cooling device of a second embodiment of the coating system with tray cooling according to the present invention; FIG. 10 is a temperature a relationship diagram of time, illustrating a temperature change of the tray of the second embodiment in a cooling process performed by the cooling device; Figure 11 is a graph showing the solidification ratio versus time, illustrating the change in the solidification ratio of the carrier of the second embodiment to the cooling device during the cooling process.

在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。 Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

參閱圖2、圖3及圖4,本發明具有載盤冷卻功能的鍍膜系統的一第一實施例,包含一載盤2、一鍍膜站3、一迴流裝置4,及一冷卻裝置5。 Referring to Figures 2, 3 and 4, a first embodiment of a coating system having a tray cooling function comprises a carrier 2, a coating station 3, a reflow device 4, and a cooling device 5.

該載盤2包括一盤本體21與一相變化物質22,該盤本體21內部形成有一填置該相變化物質22的密閉空間20。在本發明該第一實施例中,該盤本體21是由鋁合金(Al alloy)所構成;該相變化物質22能自該盤本體21吸收一在該鍍膜站3內進行一鍍膜製程中所累積的熱能,以作為至少部分的該相變化物質22自一固態熔融成一液態時所需的潛熱,且該相變化物質22的熔點為介於18℃至95℃間;此外,該冷卻裝置5能自該相變化物質22吸收該熱能,以令至少部分的該相變化物質22自該液態凝固成該固態。 The carrier 2 includes a disk body 21 and a phase change substance 22, and a sealed space 20 in which the phase change substance 22 is filled is formed inside the disk body 21. In the first embodiment of the present invention, the disk body 21 is made of an aluminum alloy; the phase change material 22 can be absorbed from the disk body 21 in a coating process in the coating station 3. The accumulated thermal energy is used as at least a portion of the latent heat required to melt the phase change material 22 from a solid state into a liquid state, and the phase change substance 22 has a melting point of between 18 ° C and 95 ° C; in addition, the cooling device 5 The thermal energy can be absorbed from the phase change material 22 such that at least a portion of the phase change material 22 solidifies from the liquid to the solid state.

值得說明的是,為了避免該相變化物質22於熔化時體積膨脹造成該盤本體21變形。因此,該盤本體21的密閉空間20需大於或等於該相變化物質22於該液態時所佔有的體積。此處需補充說明的是,該相變化物質22於一吸熱過程中的一儲熱能力(heat storage capacity),是介於 134kJ/kg至250kJ/kg之間,且該吸熱過程包括一自該固態熔化為該液態的相變(phase transition)。該相變化物質22是選自一有機類材料(organic material)與一無機類材料(inorganic material)其中之一者。 It is worth noting that the disk body 21 is deformed in order to avoid volume expansion of the phase change material 22 upon melting. Therefore, the sealed space 20 of the disk body 21 needs to be greater than or equal to the volume occupied by the phase change material 22 in the liquid state. It should be added here that the heat storage capacity of the phase change substance 22 in an endothermic process is Between 134 kJ/kg and 250 kJ/kg, and the endothermic process includes a phase transition from the solid state to the liquid state. The phase change substance 22 is one selected from the group consisting of an organic material and an inorganic material.

更具體地說,該有機類材料是一烴類 (hydrocarbon),且該烴類是選自C16至C50的一烷類(alkane),例如C30至C50等烷類的石蠟(wax)。一般而言,該相變化物質22(即,前述C16至C50的烷類)22於該固態時是佔有該密閉空間20的80%至90%。 More specifically, the organic material is a hydrocarbon, and the hydrocarbon is an alkane selected from C 16 to C 50 , such as a wax of a C 30 to C 50 alkane (wax) ). In general, the phase change material 22 (i.e., the aforementioned C 16 to C 50 alkane) 22 occupies 80% to 90% of the sealed space 20 in the solid state.

此外,該無機類材料是選自一含有一結晶水合 鹽(salt hydrates,MnH2O)及一添加劑的組成物,或一熔解鹽。具體地來說,該結晶水合鹽可為十水合硫酸鈉(Na2SO4‧10H2O)、三水合醋酸鈉(C2H3NaO2‧3H2O),或十二水合硫酸鋁銨(NH4Al(SO4)2‧12H2O);該熔解鹽可為硝酸納(NaNO3)或硝酸鉀(KNO3)。此處需補充說明的是,該組成物內的添加劑是用以縮減該結晶水合鹽於熔解過程中所產生的體積變化量。 Further, the inorganic material is selected from a composition containing a crystalline hydrates (M n H 2 O) and an additive, or a molten salt. Specifically, the crystalline hydrated salt may be sodium sulfate decahydrate (Na 2 SO 4 ‧10H 2 O), sodium acetate trihydrate (C 2 H 3 NaO 2 ‧3H 2 O), or ammonium aluminum sulfate dodecahydrate (NH 4 Al(SO 4 ) 2 ‧12H 2 O); the molten salt may be sodium nitrate (NaNO 3 ) or potassium nitrate (KNO 3 ). It should be additionally noted here that the additive in the composition is used to reduce the amount of volume change generated by the crystalline hydrated salt during the melting process.

該鍍膜站3包括一入口端301與一出口端302 ,該載盤2承載一待鍍物(圖未示),且能自該入口端301進入該鍍膜站3中以進行該鍍膜製程,並由該出口端302移出該鍍膜站3。更具體地來說,該鍍膜站3沿一排列方向X依序具有一包括該入口端301的載入腔體31、一執行該鍍膜製程的濺鍍腔體32及一包括該出口端302的卸載腔體33。 The coating station 3 includes an inlet end 301 and an outlet end 302. The carrier 2 carries a material to be plated (not shown), and can enter the coating station 3 from the inlet end 301 to perform the coating process, and is removed from the coating station 3 by the outlet end 302. More specifically, the coating station 3 sequentially has a loading cavity 31 including the inlet end 301, a sputtering cavity 32 for performing the coating process, and a sputtering cavity 302 including the outlet end 302. The cavity 33 is unloaded.

此處需詳細說明的是,該載盤2於該濺鍍腔體 32內進行該鍍膜製程中所形成的高溫電漿,會在該待鍍物及該載盤2上累積大量的高溫熱能。此高溫熱能是經由該盤本體21傳遞給該相變化物質22直接被該相變化物質22所吸收,以作為該相變化物質22於該吸熱過程所需的熱量。由於該吸熱過程包括該自該固態熔化為該液態的相變,且該相變化物質22需額外吸取大量的潛熱以進行相變,導致該吸熱過程所吸收的熱量將遠大於該盤本體21所吸去的熱量。因此,本發明該第一實施例之載盤2自身已具有冷卻的功能;也就是說,該載盤2之盤本體21本身的高溫熱能,已先行由該相變化物質22所吸收,從而使該盤本體21本身及該待鍍物達到冷卻的效果。不過,該相變化物質22需要被冷卻,該載盤2才能循環再進入該鍍膜站3內進行下一次鍍膜製程,如下詳述。 It should be noted in detail that the carrier 2 is in the sputtering chamber. The high-temperature plasma formed in the coating process in 32 accumulates a large amount of high-temperature heat energy on the object to be plated and the carrier 2 . This high temperature thermal energy is directly transferred by the phase change substance 22 via the disk body 21 to the phase change material 22 as the heat required for the phase change material 22 in the endothermic process. Since the endothermic process includes the phase change from the solid state to the liquid state, and the phase change substance 22 needs to absorb a large amount of latent heat to perform a phase change, the heat absorbed by the endothermic process will be much larger than that of the disk body 21. The heat absorbed. Therefore, the carrier 2 of the first embodiment of the present invention itself has a function of cooling; that is, the high-temperature thermal energy of the disk body 21 of the carrier 2 has been absorbed by the phase change substance 22 first. Thereby, the disk body 21 itself and the object to be plated achieve the effect of cooling. However, the phase change material 22 needs to be cooled, and the carrier 2 can be recycled into the coating station 3 for the next coating process, as described in detail below.

再參閱圖3並配合參閱圖5與圖6,該迴流裝置 4包括一傳送單元41、一感測單元42、一前升降單元43與一後升降單元44。該傳送單元41設置在該鍍膜站3外,使該載盤2沿一自該鍍膜站3的出口端302朝該鍍膜站3的該入口端301的傳送路徑移動。該傳送單元41具有一支架411及一安裝於該支架411的傳送組件412。該傳送組件412具有一對間隔設置的輸送模組413,及一驅動該等輸送模組413的伺服馬達414。該傳送單元41利用該對輸送模組413承托並移動該載盤2,該冷卻裝置5位於該對輸送模組413間。該感測單元42設置於該傳送單元41的支架411 。在本發明該第一實施例中,該對輸送模組413分別為一循環式輸送帶;該感測單元42為一能偵測並定位的近接開關。 Referring again to FIG. 3 and referring to FIG. 5 and FIG. 6, the reflow device 4 includes a transfer unit 41, a sensing unit 42, a front lift unit 43, and a rear lift unit 44. The transfer unit 41 is disposed outside the coating station 3 to move the carrier 2 along a transport path from the exit end 302 of the coating station 3 toward the inlet end 301 of the coating station 3. The transport unit 41 has a bracket 411 and a transport assembly 412 mounted to the bracket 411. The transport assembly 412 has a pair of spaced apart transport modules 413 and a servo motor 414 that drives the transport modules 413. The transport unit 41 supports and moves the carrier 2 by the pair of transport modules 413, and the cooling device 5 is located between the pair of transport modules 413. The sensing unit 42 is disposed on the bracket 411 of the transmitting unit 41 . In the first embodiment of the present invention, the pair of transport modules 413 are respectively a circulating conveyor belt; the sensing unit 42 is a proximity switch capable of detecting and positioning.

在本發明該第一實施例中,該迴流裝置4與該 冷卻裝置5皆設置於該鍍膜站3下方(如圖3所示)。該迴流裝置4的該前升降單元43與該後升降單元44,分別鄰設於該傳送單元41之一前端與一後端。該前升降單元43鄰設於該鍍膜站3之該載入腔體31的入口端301,並將自該傳送單元41之前端移出的該載盤2導入該鍍膜站3的入口端301。該後升降單元44鄰設於該鍍膜站3之卸載腔體33的出口端302,並將自該鍍膜站3的出口端302移出的該載盤2導入該傳送單元41的後端。此處需說明的是,本發明該第一實施例是以該迴流裝置4與該冷卻裝置5皆設置於該鍍膜站3下方為例做說明;然而,熟悉此技術領域的相關技術人員應知,該迴流裝置4與該冷卻裝置5皆設置於該鍍膜站3外即可,並不限於裝置在該鍍膜站3下方。 In the first embodiment of the invention, the reflow device 4 and the Cooling devices 5 are disposed below the coating station 3 (as shown in Figure 3). The front lifting unit 43 and the rear lifting unit 44 of the reflow device 4 are respectively disposed adjacent to a front end and a rear end of the conveying unit 41. The front lifting unit 43 is adjacent to the inlet end 301 of the loading chamber 31 of the coating station 3, and the tray 2 removed from the front end of the conveying unit 41 is introduced into the inlet end 301 of the coating station 3. The rear lifting unit 44 is adjacent to the outlet end 302 of the unloading chamber 33 of the coating station 3, and the carrier 2 removed from the outlet end 302 of the coating station 3 is introduced into the rear end of the conveying unit 41. It should be noted that the first embodiment of the present invention is described by taking the reflow device 4 and the cooling device 5 both under the coating station 3; however, those skilled in the art should know The reflow device 4 and the cooling device 5 are all disposed outside the coating station 3, and are not limited to the device below the coating station 3.

再參閱圖5與圖6,該冷卻裝置5設置於該傳送 單元41的該傳送路徑上,且安裝於該支架411,並具有一散熱板51及一驅動該散熱板51上下位移的驅動件52。該散熱板51具有一入口511、一出口512,及一自該入口511向該出口512延伸並用以供一冷卻流體54流動的冷卻通道513。該冷卻流體54可由純水、氨水、甲醇、丙酮、庚烷,或其組合所構成。 Referring again to Figures 5 and 6, the cooling device 5 is disposed in the transfer The transmission path of the unit 41 is mounted on the bracket 411 and has a heat dissipation plate 51 and a driving member 52 for driving the heat dissipation plate 51 to be displaced up and down. The heat sink 51 has an inlet 511, an outlet 512, and a cooling passage 513 extending from the inlet 511 to the outlet 512 for supplying a cooling fluid 54. The cooling fluid 54 can be comprised of pure water, ammonia, methanol, acetone, heptane, or a combination thereof.

再參閱圖3、圖5與圖6,具體地說,承載有該 待鍍物(圖未示)的載盤2在該鍍膜站3的濺鍍腔體32進行該鍍膜製程時累積於該盤本體21與待鍍物上的高溫熱能,是直接先由該相變化物質22所吸收並使該相變化物質22熔融成該液體。在完成該鍍膜製程後,該載盤2是透過該鍍膜站3內部的一傳送機構34依序傳送至該卸載腔體33的出口端302與該後升降單元44上,以使該載盤2上的待鍍物被移除。表面經淨空後的該載盤2,後續是透過該後升降單元44自該迴流裝置4之傳送單元41的後端被導入該傳送單元41的傳送路徑,以接續經由該迴流裝置4的該傳送組件412傳送至該冷卻裝置5之上。當該載盤2被傳送至位於該冷卻裝置5的散熱板51上方並鄰近該感測單元42時,該感測單元42能產生一訊號控制該伺服馬達414停止轉動,且該冷卻裝置5的驅動件52驅動該散熱板51朝上位移以接觸該載盤2,並藉該冷卻裝置5對該載盤2內的相變化物質22進行一冷卻過程,以令至少部分的該相變化物質22自該液態凝固成該固態。於該冷卻過程完畢後,該驅動件52驅動該散熱板51朝下位移以遠離該載盤2,且該伺服馬達414重新轉動以驅動該對輸送模組413來帶動該載盤2遠離該冷卻裝置5,並使該載盤2沿該傳送路徑依序被傳送至該傳送單元41的前端與該前升降單元43上,以在該經淨空後的載盤2上放置一新的待鍍物(圖未示)後,被導入該鍍膜站3之該載入腔體31的該入口端301,透過該鍍膜站3的傳送機構34重新傳送至該濺鍍腔體32內進行該鍍膜製程。如圖2所示,該傳送機構34可採用伺服馬達341 驅動多數滾輪342,因該傳送機構34為習知技藝且非本案改良重點,故在此不加贅述。 Referring again to Figures 3, 5 and 6, specifically, carrying the The high temperature heat energy accumulated on the disk body 21 and the object to be plated by the carrier 2 of the object to be plated (not shown) when the sputtering chamber 32 of the coating station 3 performs the coating process is directly The phase change material 22 absorbs and melts the phase change material 22 into the liquid. After the coating process is completed, the carrier 2 is sequentially transferred to the outlet end 302 of the unloading cavity 33 and the rear lifting unit 44 through a conveying mechanism 34 inside the coating station 3, so that the carrier 2 is The object to be plated on is removed. The carrier 2 after the surface has been emptied is subsequently introduced into the transport path of the transport unit 41 from the rear end of the transport unit 41 of the reflow device 4 through the rear elevating unit 44 to continue the transport via the reflow device 4. Assembly 412 is delivered to the cooling device 5. When the carrier 2 is transferred to the heat dissipation plate 51 of the cooling device 5 and adjacent to the sensing unit 42, the sensing unit 42 can generate a signal to control the servo motor 414 to stop rotating, and the cooling device 5 The driving member 52 drives the heat dissipation plate 51 to be displaced upward to contact the carrier 2, and the cooling device 5 performs a cooling process on the phase change substance 22 in the carrier 2 to make at least a portion of the phase change substance 22 The liquid is solidified into the solid state. After the cooling process is completed, the driving member 52 drives the heat dissipation plate 51 to move downward to away from the carrier 2, and the servo motor 414 re-rotates to drive the pair of conveying modules 413 to drive the carrier 2 away from the cooling. The device 5 is configured to sequentially transport the carrier 2 along the transport path to the front end of the transport unit 41 and the front lift unit 43 to place a new object to be plated on the cleaned carrier 2 (not shown), the inlet end 301 of the loading chamber 31 introduced into the coating station 3 is re-transferred into the sputtering chamber 32 through the transfer mechanism 34 of the coating station 3 to perform the coating process. As shown in FIG. 2, the transport mechanism 34 can employ a servo motor 341. The majority of the scroll wheel 342 is driven. Since the transport mechanism 34 is a well-known technique and is not an improvement point of the present invention, it will not be described herein.

為了進一步證實本發明該第一實施例所採用的該冷卻裝置5的散熱板51能使至少部分的該相變化物質22自該液態凝固成該固態,此處以數值模擬出該載盤2的盤本體21與相變化物質22於該冷卻過程的溫度變化圖(見圖7)與凝固比率變化圖(見圖8)。本發明該第一實施例於模擬圖7與圖8時,該相變化物質22是以正18烷(C18H38)的條件來模擬,且初始溫度條件設定為該盤本體21自該出口端302移出時開始計算。由圖7的模擬結果可知,證實該散熱板51也確實自該盤本體21與該相變化物質22繼續吸收該熱能,使該盤本體21與該相變化物質22溫度逐漸下降。由圖8所顯示之模擬結果可知,該相變化物質22逐漸自該液態凝固成該固態,並於約莫13分鐘後完全凝固成該固態,故該散熱板51的確對該載盤2產生散熱效果。 In order to further confirm that the heat dissipating plate 51 of the cooling device 5 used in the first embodiment of the present invention enables at least a portion of the phase change material 22 to solidify from the liquid state into the solid state, the disk of the carrier plate 2 is numerically simulated here. The temperature change diagram (see FIG. 7) and the solidification ratio change diagram of the body 21 and the phase change substance 22 during the cooling process (see FIG. 8). In the first embodiment of the present invention, when simulating FIG. 7 and FIG. 8, the phase change substance 22 is simulated under the condition of n- 18 alkane (C 18 H 38 ), and the initial temperature condition is set as the disk body 21 from the outlet. The calculation begins when the end 302 is removed. As is apparent from the simulation results of Fig. 7, it is confirmed that the heat radiating plate 51 also continues to absorb the heat energy from the disk body 21 and the phase change material 22, so that the temperature of the disk body 21 and the phase change material 22 gradually decreases. It can be seen from the simulation results shown in FIG. 8 that the phase change substance 22 gradually solidifies from the liquid state into the solid state, and completely solidifies into the solid state after about 13 minutes, so that the heat dissipation plate 51 does have a heat dissipation effect on the carrier disk 2. .

參閱圖9,本發明具有載盤冷卻功能的鍍膜系統的一第二實施例大致上是相同於該第一實施例,其不同處是在於,該冷卻裝置5具有至少一設置於該支架411的風扇53,以取代該第一實施例的該散熱板51與該驅動件52。在本發明該第二實施例中,是以六個風扇53為例做說明。 Referring to FIG. 9, a second embodiment of a coating system having a tray cooling function of the present invention is substantially the same as the first embodiment, except that the cooling device 5 has at least one disposed on the bracket 411. A fan 53 is provided in place of the heat sink 51 and the driving member 52 of the first embodiment. In the second embodiment of the present invention, six fans 53 are taken as an example for illustration.

為了進一步證實本發明該第二實施例所採用的該冷卻裝置5的風扇53,能使至少部分的該相變化物質22自該液態凝固成該固態,此處亦以數值模擬出該載盤2的 盤本體21與相變化物質22於該冷卻過程的溫度變化圖(見圖10)與凝固比率變化圖(見圖11)。由圖10的模擬結果可知,證實該風扇53確實能自該盤本體21與該相變化物質22繼續吸收該熱能,使該盤本體21與該相變化物質22溫度逐漸下降。由圖11所顯示的模擬結果可知,除了前3~4分鐘由於較高溫(~31℃)的該盤本體21持續將熱能傳遞給該相變化物質22以使該相變化物質22持續熔融導致凝固比率下降外,本發明該第二實施例之相變化物質22於冷卻4分鐘後是逐漸自該液態凝固成該固態,並於約莫22分鐘後完全凝固成該固態,故該風扇53的確對該載盤2產生散熱效果。 In order to further confirm the fan 53 of the cooling device 5 used in the second embodiment of the present invention, at least a portion of the phase change substance 22 can be solidified from the liquid state into the solid state, and the carrier plate 2 is also numerically simulated here. of The temperature change diagram (see FIG. 10) and the solidification ratio change diagram (see FIG. 11) of the disk body 21 and the phase change substance 22 during the cooling process. As is apparent from the simulation results of Fig. 10, it was confirmed that the fan 53 can surely absorb the heat energy from the disk body 21 and the phase change substance 22, so that the temperature of the disk body 21 and the phase change substance 22 gradually decreases. From the simulation results shown in Fig. 11, it is known that the disk body 21 continues to transfer thermal energy to the phase change substance 22 in the first 3 to 4 minutes due to the higher temperature (~31 ° C) to continuously melt the phase change substance 22 to cause solidification. In addition to the decrease in ratio, the phase change material 22 of the second embodiment of the present invention gradually solidifies from the liquid state into the solid state after cooling for 4 minutes, and completely solidifies into the solid state after about 22 minutes, so the fan 53 does The carrier 2 produces a heat dissipation effect.

值得一提的是,本發明具有載盤冷卻功能的鍍 膜系統能為批次式(batch)、連續式(inline,index)、枚葉式(cluster),或捲鍍式(roll)。在各鍍膜系統中,該入口端301與該出口端302能為間隔設置或位於同一位置。在圖2與圖3中是以連續式鍍膜系統且該入口端301與該出口端302間隔設置為例作說明,但不以此為限。 It is worth mentioning that the invention has the plating function of the tray cooling function. The membrane system can be batch, inline, index, cluster, or roll. In each coating system, the inlet end 301 and the outlet end 302 can be spaced apart or at the same location. In FIG. 2 and FIG. 3 , a continuous coating system is provided, and the inlet end 301 and the outlet end 302 are spaced apart from each other for illustrative purposes, but not limited thereto.

綜上所述,本發明具有載盤冷卻功能的鍍膜系 統一方面藉由各實施例之載盤2的改良,利用該相變化物質22本身所需的熔解潛熱,以自該盤本體21吸收該熱能,能帶走於該鍍膜過程中累積在待鍍物與盤本體21上的高溫熱能以提升鍍膜品質;另一方面藉由該等實施例的冷卻裝置5對各實施例的該盤本體21及其盤本體21內的相變化物質22進行該冷卻過程,以解決鍍膜系統中的散熱問題 ,故確實能達成本發明之目的。 In summary, the present invention has a coating system for carrying a tray cooling function. By the improvement of the carrier 2 of each embodiment, the latent heat of fusion required by the phase change substance 22 itself is utilized to absorb the heat energy from the disk body 21, and can be carried away in the plating process to accumulate in the object to be plated. And the high temperature thermal energy on the disk body 21 to improve the coating quality; on the other hand, the disk body 21 of each embodiment and the phase change substance 22 in the disk body 21 of the embodiments are performed by the cooling device 5 of the embodiments. Cooling process to solve heat dissipation problems in the coating system Therefore, the object of the present invention can be achieved.

惟以上所述者,僅為本發明之實施例而已,當 不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above is only an embodiment of the present invention, when The scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the present invention in the scope of the invention and the patent specification are still within the scope of the invention.

2‧‧‧載盤 2‧‧‧Package

21‧‧‧盤本體 21‧‧‧ disk body

22‧‧‧相變化物質 22‧‧‧ phase change substances

411‧‧‧支架 411‧‧‧ bracket

413‧‧‧輸送模組 413‧‧‧Transport module

51‧‧‧散熱板 51‧‧‧heat plate

52‧‧‧驅動件 52‧‧‧ drive parts

Claims (10)

一種具有載盤冷卻功能的鍍膜系統,包含:一載盤,包括一盤本體與一相變化物質,該盤本體內部形成有一填置該相變化物質的密閉空間;一鍍膜站,包括一入口端與一出口端,該載盤能自該入口端進入該鍍膜站中以進行一鍍膜製程,並由該出口端移出該鍍膜站;一迴流裝置,包括一設置在該鍍膜站外的傳送單元,該傳送單元使該載盤沿一自該鍍膜站的出口端朝該鍍膜站的該入口端的傳送路徑移動;及一冷卻裝置,設置於該傳送單元的該傳送路徑上;其中,該相變化物質能自該盤本體吸收一在該鍍膜製程中所累積的熱能,以作為至少部分的該相變化物質自一固態熔融成一液態時所需的潛熱,且該相變化物質的熔點為介於18℃至95℃間;及其中,該冷卻裝置能自該相變化物質吸收該熱能,以令至少部分的該相變化物質自該液態凝固成該固態。 A coating system with a tray cooling function, comprising: a carrier tray comprising a disk body and a phase change substance, the disk body having a sealed space filled with the phase change substance; a coating station including an inlet And a discharge end, the tray can enter the coating station from the inlet end to perform a coating process, and the exit end is removed from the coating station; a reflow device includes a transfer unit disposed outside the coating station The transfer unit moves the carrier along a transport path from the exit end of the coating station toward the inlet end of the coating station; and a cooling device disposed on the transport path of the transfer unit; wherein the phase change The substance can absorb thermal energy accumulated in the coating process from the body of the disk as latent heat required for at least part of the phase change material to be melted into a liquid state from a solid state, and the melting point of the phase change substance is between 18 Between ° C and 95 ° C; and wherein the cooling device is capable of absorbing the thermal energy from the phase change material such that at least a portion of the phase change material solidifies from the liquid to the solid state. 如請求項1所述的具有載盤冷卻功能的鍍膜系統,其中,該相變化物質是選自一有機類材料與一無機類材料其中一者,該有機類材料是一烴類,且該烴類是選自C16至C50的一烷類。 The coating system with a tray cooling function according to claim 1, wherein the phase change substance is one selected from the group consisting of an organic material and an inorganic material, the organic material is a hydrocarbon, and the hydrocarbon The class is a monoalkane selected from C 16 to C 50 . 如請求項1所述的具有載盤冷卻功能的鍍膜系統,其中,該盤本體的密閉空間需大於或等於該相變化物質於該液態時所佔有的體積。 The coating system with a tray cooling function according to claim 1, wherein the sealed space of the disk body needs to be greater than or equal to the volume occupied by the phase change material in the liquid state. 如請求項1所述的具有載盤冷卻功能的鍍膜系統,其中,該傳送單元具有一支架及一安裝於該支架的傳送組件,該傳送組件具有一對間隔設置的輸送模組及一驅動該等輸送模組的伺服馬達,該傳送單元利用該對輸送模組承托並移動該載盤,該冷卻裝置位於該對輸送模組之間。 The coating system with a tray cooling function according to claim 1, wherein the conveying unit has a bracket and a conveying assembly mounted on the bracket, the conveying assembly has a pair of spaced conveying modules and a driving unit The servo motor of the transport module, the transport unit supports and moves the carrier by the pair of transport modules, and the cooling device is located between the pair of transport modules. 如請求項4所述的具有載盤冷卻功能的鍍膜系統,其中,該對輸送模組為循環式輸送帶。 The coating system with a tray cooling function according to claim 4, wherein the pair of conveying modules is a circulating conveyor belt. 如請求項4所述的具有載盤冷卻功能的鍍膜系統,其中,該迴流裝置還包括一感測單元,該感測單元設置於該傳送單元的支架,當該載盤被傳送至位於該冷卻裝置之上並鄰近該感測單元時,該感測單元能產生一訊號控制該伺服馬達停止轉動,並藉該冷卻裝置對該載盤內的相變化物質進行冷卻。 The coating system with a tray cooling function according to claim 4, wherein the reflow device further comprises a sensing unit, the sensing unit is disposed on the bracket of the transport unit, and the carrier is transferred to the cooling When the device is adjacent to the sensing unit, the sensing unit can generate a signal to control the servo motor to stop rotating, and the cooling device cools the phase change substance in the carrier. 如請求項6所述的具有載盤冷卻功能的鍍膜系統,其中,該冷卻裝置安裝於該支架,並具有一散熱板及一驅動該散熱板上下位移的驅動件,該散熱板具有一入口、一出口,及一自該入口向該出口延伸並用以供一冷卻流體流動的冷卻通道,當該載盤被傳送至位於該散熱板上方時,該驅動件驅動該散熱板朝上位移以接觸該載盤。 The coating system with a tray cooling function according to claim 6, wherein the cooling device is mounted on the bracket, and has a heat dissipation plate and a driving member for driving the displacement of the heat dissipation plate, the heat dissipation plate has an inlet, An outlet, and a cooling passage extending from the inlet to the outlet for supplying a cooling fluid, the driving member driving the heat sink to be displaced upward to contact the cooling tray when the carrier is transferred to the heat sink Carrier. 如請求項6所述的具有載盤冷卻功能的鍍膜系統,其中,該冷卻裝置安裝於該支架,並具有至少一風扇。 A coating system having a tray cooling function according to claim 6, wherein the cooling device is mounted to the bracket and has at least one fan. 如請求項1至8任一請求項所述的具有載盤冷卻功能的鍍膜系統,其中,該冷卻裝置設置於該鍍膜站下方。 A coating system having a tray cooling function according to any one of claims 1 to 8, wherein the cooling device is disposed below the coating station. 如請求項9所述的具有載盤冷卻功能的鍍膜系統,其中,該迴流裝置還包括分別鄰設於該傳送單元之一前端與一後端的一前升降單元與一後升降單元,該前升降單元鄰設於該鍍膜站的入口端,並將自該傳送單元移出的該載盤導入該鍍膜站的入口端,該後升降單元鄰設於該鍍膜站的出口端,並將自該鍍膜站的出口端移出的該載盤導入該傳送單元。 The coating system with a tray cooling function according to claim 9, wherein the reflow device further comprises a front lifting unit and a rear lifting unit respectively adjacent to a front end and a rear end of the conveying unit, the front lifting and lowering The unit is adjacent to the inlet end of the coating station, and the tray removed from the conveying unit is introduced into the inlet end of the coating station, and the rear lifting unit is adjacent to the outlet end of the coating station, and the coating station is from the coating station. The carrier that is removed from the outlet end is introduced into the transfer unit.
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