TWI531304B - Heat dissipation device - Google Patents

Description

Thermal module

The invention relates to a heat dissipation module, in particular to a heat dissipation module for dissipating heat from a heat-generating electronic component.

At present, in electronic products, for electronic components that generate a large amount of heat, a heat dissipation module is usually used to dissipate heat. Previous heat dissipation methods include passive heat dissipation and active heat dissipation. Passive heat dissipation uses a heat sink to contact the heat source. There is no heat dissipation fan, which uses natural convection to dissipate heat. However, the natural convection heat dissipation coefficient is extremely low, about 10~. 20W/m2K, the heat exchange efficiency is quite bad; active heat dissipation uses a fan to force the convection heat dissipation of the heat sink, but requires an additional power source to drive the fan, which is a waste of energy.

In view of this, it is necessary to provide a heat dissipation module with high heat dissipation efficiency and energy saving.

A heat dissipation module includes a substrate in thermal contact with a heat source and a plurality of spaced fins disposed on the substrate. The fins are surrounded to form a receiving cavity. The heat dissipation module further includes a bracket and a first impeller and a second impeller pivotally connected to the two sides of the bracket by a rotating shaft. The bracket is disposed on the heat sink, and the second impeller is disposed in the accommodating cavity, and the first impeller is located above the heat sink. After the substrate absorbs the heat of the heat source, the air is radiated by the heat sink, the air around the heat sink is heated, the hot air rises to drive the first impeller to rotate, and the first impeller drives the second impeller to rotate to accommodate the cavity. The heat inside is quickly dissipated.

The heat dissipation module uses the hot air flow to drive the first impeller disposed above the heat sink to rotate, and the first impeller rotates to drive the second impeller rotation disposed in the accommodating cavity surrounded by the heat sink, the second impeller The rotation can disturb the air in the accommodating cavity, thereby increasing the air convection, improving the heat dissipation efficiency, and the power of the impeller rotation is from the rising hot air flow, and no additional power input is required, thereby achieving energy saving.

100‧‧‧ Thermal Module

10‧‧‧Substrate

20‧‧‧ Heat sink set

30‧‧‧ bracket

40‧‧‧ shaft

50‧‧‧First impeller

60‧‧‧Second impeller

70‧‧‧heat source

11‧‧‧ top surface

12‧‧‧ bottom

21‧‧‧ Heat sink

22‧‧‧Solution channel

23‧‧‧容容

31‧‧‧Support

32‧‧‧ Bearing Department

33‧‧‧Connecting Department

FIG. 1 is a schematic perspective structural view of a heat dissipation module according to an embodiment of the present invention.

2 is a schematic exploded view of the heat dissipation module of FIG. 1.

3 is a schematic exploded view showing the other direction of the heat dissipation module of FIG. 1.

The invention will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 , FIG. 2 and FIG. 3 , a heat dissipation module 100 according to a preferred embodiment of the present invention is configured to dissipate heat from a heat source 70 . The heat dissipation module 100 includes a substrate 10, a heat sink group 20 disposed on the substrate 10, a bracket 30 disposed on the heat sink group 20, and a pivotal connection on the bracket 30 by the rotating shaft 40. An impeller 50 and a second impeller 60. The heat source 70 is attached to the substrate 10.

The substrate 10 has a circular shape including an opposite top surface 11 and a bottom surface 12. The heat source 70 is attached to the middle of the bottom surface 12. The heat sink group 20 is composed of a plurality of long plate-shaped heat sinks 21 having a trapezoidal plate-like structure with a narrow upper and a lower width. The plurality of heat sinks 21 are vertically disposed around the center of the top surface 11 of the substrate 10. The edge of the top surface 11 of the substrate 10 is such that the heat sink group 20 has a columnar structure with a narrow upper and a lower width. A plurality of fins 21 are spaced apart from each other along the circumferential direction of the substrate 10, and a heat dissipating passage 22 is formed between the adjacent fins 21. The number of scattered The innermost end of the heat sheet 21 and the top surface of the substrate are collectively formed with a receiving cavity 23.

In this embodiment, the heat source is a light emitting diode. It can be understood that the heat source can also be other heat generating electronic components in the electronic product.

The bracket 30 includes an annular support portion 31, a bearing portion 32 disposed at the center of the support portion 31, and a connecting portion 33 connecting the support portion 31 and the bearing portion 32. The bracket 30 is disposed at a top end of the heat sink group 20 away from the substrate 10, wherein the annular support portion 31 is correspondingly disposed at an edge of the top opening of the accommodating cavity 23 of the heat sink group 20.

The rotating shaft 40 is connected to the bearing portion 32 of the bracket 30, and its two ends respectively extend to both sides of the bracket 30. The hubs of the first impeller 50 and the second impeller 60 are fixedly coupled to the two ends of the rotating shaft 40, wherein the first impeller 50 is located on the top side of the bracket 30, and the second impeller 60 is located on the bottom side of the bracket 30. The blades of the first impeller 50 are centrifugal blades that are disposed obliquely with respect to the substrate 10, and the blades of the second impeller 60 are centrifugal blades of the vertical substrate 10. The first impeller 50 can drive the second impeller 60 to rotate relative to the bracket 30.

When assembling, the first impeller 50 and the second impeller 60 are respectively disposed at two ends of the rotating shaft 40, and then the second impeller 60 is disposed in the accommodating cavity 23 of the fin group 20, and the supporting portion 31 of the bracket 30 is assembled. The first impeller 50 is located outside the accommodating cavity 23 and above the fin set 20 at the edge of the top opening of the accommodating cavity 23 of the heat sink group 20.

When the heat source 70 generates heat, the substrate 10 absorbs the heat of the heat source 70 and conducts the heat to the heat sink 21 thereon, and the heat sink 21 dissipates heat outward. Therefore, the cold air around the fin group 20 is heated by the heat exchange with the fins 21 and then rises. Due to the rising principle of the hot air, the rising hot air current drives the first impeller 50 to rotate, and the first impeller 50 drives the second impeller 60 to rotate by the bearing portion 32 of the bracket 30. When the second impeller 60 rotates, the centrifugal blades thereon disturb the air in the accommodating chamber 23, thereby accelerating The heat dissipation channel 22 between the heat sinks 21 overflows, and at the same time, the heat on the heat sink 21 is taken away, thereby increasing the heat dissipation efficiency of the heat dissipation module 100, thereby ensuring the stability of the operation of the light emitting diode.

In this embodiment, due to the inclined arrangement of the blades of the first impeller 50, the rising hot air flow is facilitated to drive the first impeller 50 to rotate, and the vertical arrangement of the blades of the second impeller 60 increases the air disturbance effect of the second impeller 60.

In this embodiment, the heat sink 21 has a trapezoidal plate-like structure with a narrow upper and a lower width, and the plurality of fins 21 surround a columnar heat dissipation structure having a narrow upper and a lower width. The structure can reduce the obstruction and facilitate the hot air flow. rise. It can be understood that the heat sink 21 may also be a plate-like structure having the same width and the same width or a plate-like structure having an upper width and a lower width.

Compared with the prior art, the heat dissipation module of the present invention uses the hot air flow to drive the first impeller disposed above the heat sink to rotate, and the first impeller rotates to drive the first cavity disposed in the receiving cavity defined by the heat sink. When the impeller rotates, the rotation of the second impeller can disturb the air in the accommodating cavity, thereby increasing the air convection and improving the heat dissipation efficiency, and the power of the impeller rotation is from the rising hot air flow, and no additional power input is required. Energy saving.

In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.

100‧‧‧ Thermal Module

10‧‧‧Substrate

20‧‧‧ Heat sink set

30‧‧‧ bracket

40‧‧‧ shaft

50‧‧‧First impeller

60‧‧‧Second impeller

Claims (6)

A heat dissipation module includes a substrate in thermal contact with a heat source and a plurality of spaced heat sinks disposed on the substrate, wherein the heat sink is surrounded by a receiving cavity, and the heat dissipation module further includes a heat sink a bracket and a first impeller and a second impeller pivotally connected to the two sides of the bracket by a rotating shaft, the bracket is disposed on the heat sink, the second impeller is disposed in the receiving cavity, and the first impeller is located in the heat dissipation Above the sheet, after the substrate absorbs the heat of the heat source, the heat dissipation fins on the substrate are dissipated, so that the air around the heat sink is heated, the hot air rises to drive the first impeller to rotate, and the first impeller drives the second impeller to rotate to accommodate The heat in the cavity is quickly dissipated, the blades of the first impeller are centrifugal blades disposed obliquely with respect to the substrate, and the blades of the second impeller are centrifugal blades of the vertical substrate. The heat dissipation module of claim 1, wherein the substrate comprises an opposite top surface and a bottom surface, the plurality of heat dissipation fins are disposed on a top surface of the substrate, and the heat source is disposed on a bottom surface of the substrate. The heat dissipation module of claim 2, wherein: the heat sink has a trapezoidal plate-like structure with a narrow upper and a lower width, and a plurality of heat sinks are vertically disposed on a top surface of the substrate around a center of a top surface of the substrate. The edge forms a columnar heat dissipation structure with a narrow upper and a lower width. The heat dissipation module of claim 3, wherein the plurality of heat dissipation fins are spaced apart from each other, and a heat dissipation channel is formed between each other. The heat dissipation module of claim 1, wherein the bracket comprises an annular support portion, a bearing portion disposed at a center of the support portion, and a connection portion connecting the support portion and the bearing portion, the circle The annular support portion is disposed at an edge of the top opening of the accommodating cavity. The heat dissipation module of claim 5, wherein: the rotating shaft is coupled to the bearing portion of the bracket, and the two ends of the rotating shaft respectively extend to the two sides of the bracket, and the hub of the first impeller and the second impeller are divided. Do not attach to the ends of the shaft.