TWI526699B - Led lighting device and carrier thereof - Google Patents

Description

LED lighting device and its carrier

The present invention relates to a light-emitting device, and more particularly to an LED light-emitting device and a carrier thereof.

In recent years, the application of light-emitting diodes (LEDs) has gradually become widespread, and with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which are sufficient to replace the traditional illumination sources.

However, due to the structural design of the conventional LED light-emitting device, after the circuit layer is mounted on the LED chip and the electronic component, the LED chip and the electronic component can only be detected at the same time. When the detection result is missing, the defect cannot be reliably determined. LED wafer or electronic components.

Therefore, the present inventors have felt that the above-mentioned deficiencies can be improved, and they have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is reasonable in design and effective in improving the above-mentioned defects.

It is an object of the present invention to provide an LED lighting device and a carrier thereof that can individually detect an LED chip mounted on a circuit layer.

The invention provides an LED light-emitting device, comprising: a substrate; a circuit layer disposed on the substrate, the circuit layer comprising an LED solid crystal region and an electronic component solid crystal And the LED solid crystal region is electrically connected to the electronic component solid crystal region; an LED chip is mounted on the LED solid crystal region to be electrically connected to the circuit layer; an LED driving component is mounted The LED component is electrically connected to the circuit layer; the two LED test pads are electrically connected to the LED solid crystal region, and the two LED test pads can supply a detection current to the LED solid crystal. a region for separately detecting an LED chip on the LED solid crystal region; and two electrodes electrically connected to the electronic component die bonding region, and the two electrodes are capable of supplying another detection current to the LED solid crystal region and the An electronic component solid crystal region for simultaneously detecting an LED chip on the LED solid crystal region and an LED driving component on the solid crystal region of the electronic component, and the two electrodes can be electrically connected to an external driving power source to make the external portion The power provided by the driving power source causes the LED chip to emit light via the circuit layer and the LED driving element.

The present invention further provides a carrier for an LED lighting device, comprising: a substrate; a circuit layer disposed on the substrate, the circuit layer comprising an LED solid crystal region and an electronic component solid crystal region, and the LED solid crystal region And the electronic component solid crystal regions are electrically connected to each other; two LED test pads electrically connected to the LED solid crystal region, and the two LED test pads can supply a detection current only to flow the LED solid crystal region; and two electrodes The two electrodes are electrically connected to the die bonding region of the electronic component, and the two electrodes are capable of supplying another detecting current to the LED solid crystal region and the electronic component die bonding region.

In summary, the LED light-emitting device and the carrier thereof provided by the present invention are formed with an LED test pad for detecting current flowing through the LED solid crystal region, thereby separately detecting the LED chip on the LED solid crystal region. That is to say, after the circuit layer is mounted on the LED chip and the electronic component, it can be more clearly distinguished that the defect is caused by the LED chip or the electronic component.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings .

100‧‧‧LED lighting device

10‧‧‧Hosting

1‧‧‧Substrate

11‧‧‧ positive

12‧‧‧ Back

2‧‧‧ circuit layer

21‧‧‧LED solid crystal area

22‧‧‧Electrical component solid crystal region

3‧‧‧LED test pad

4‧‧‧Auxiliary test pad

5‧‧‧Electrode

6‧‧‧Auxiliary electrode

7‧‧‧Connecting mat

20‧‧‧LED chip

30‧‧‧Electronic components

301‧‧‧LED drive components

302‧‧‧Rectifying components

303‧‧‧Power components

40‧‧‧Barrier wall

50‧‧‧Package

200‧‧‧Testing equipment

300‧‧‧External drive power

400‧‧‧ functional heat sink

I‧‧‧Detection current

I’‧‧‧ another detection current

1 is a schematic perspective view of an LED lighting device of the present invention.

Figure 2 is an exploded perspective view of Figure 1.

3 is an exploded perspective view of another perspective of FIG. 1.

FIG. 4 is a schematic diagram of the present invention for passing the LED test pad so that the detection current flows only through the LED solid crystal region.

FIG. 5 is a schematic view showing another embodiment of detecting a current flowing through an LED solid crystal region through an electrode according to the present invention.

Fig. 6 is a schematic view showing the connection of an external driving power source to the electrodes of the LED lighting device of the present invention.

Fig. 7 is a schematic view showing the auxiliary electrode connection function heat dissipation plate of the LED light-emitting device of the present invention.

Please refer to FIG. 1 , which is an embodiment of the present invention. It should be noted that the related numbers and shapes mentioned in the embodiments are only used to specifically describe the embodiments of the present invention, so as to facilitate understanding. The content is not intended to limit the scope of the invention.

As shown in FIG. 2 and FIG. 3 , the LED lighting device 100 includes a carrier 10 , a plurality of LED chips 20 , a plurality of electronic components 30 , a barrier wall 40 , and a package 50 . The LED chip 20 and the electronic component 30 are all mounted on the carrier 10. The barrier wall 40 is disposed on the carrier 10 and partitions the LED chip 20 and the electronic component 30, and the package 50 is filled in the barrier wall 40. The space surrounded by the carrier 10 is used to embed the LED chip 20 and the electronic component 30 therein.

Hereinafter, the carrier 10 of the LED lighting device 100 will be described as a main axis of the description, and during the description of the configuration of the carrier 10, other components of the LED lighting device 100 will be described as appropriate.

The carrier 10 has a substrate 1, a circuit layer 2, two LED test pads 3, two auxiliary test pads 4, two electrodes 5, two auxiliary electrodes 6, and two connection pads 7. Wherein, the substrate 1 is substantially square (eg, rectangular or square) and has an opposite side a front surface 11 and a back surface 12, the circuit layer 2, the LED test pad 3, the electrode 5, and the connection pad 7 are substantially the same thickness and are located on the front surface 11 of the substrate 1, and the thickness of the auxiliary test pad 4 and the auxiliary electrode are also They are substantially identical and are located on the back side 12 of the substrate 1.

The circuit layer 2 includes an LED solid crystal region 21 and an electronic component solid crystal region 22, and the LED solid crystal region 21 and the electronic component solid crystal region 22 are electrically connected to each other. Wherein, the electronic component solid crystal region 22 can be divided into two blocks, and the two blocks of the electronic component solid crystal region 22 are located on opposite sides of the LED solid crystal region 21. Further, the two blocks of the electronic component solid crystal region 22 are respectively located at two corners on the diagonal of the substrate 1 (such as the left corner and the right corner of the substrate 1 in FIG. 2).

Furthermore, the LED chip 20 is mounted on the LED solid crystal region 21 to be electrically connected to the circuit layer 2 . The electronic components 30 are divided into two groups, and the two sets of electronic components 30 are respectively disposed in two blocks of the electronic component solid crystal region 22, thereby being electrically connected to the circuit layer 2. The manner in which the LED chip 20 and the electronic component 30 are mounted on the circuit layer 2 may be a flip chip, a reflow, an ultrasonic, a surface mount technology (SMT), or a wire bonding ( Wire bonding) and the like are not limited herein.

The electronic component 30 is exemplified in the embodiment by two sets of LED driving components 301, rectifying components 302 (eg, bridge rectifiers), and power components 303, but in practical applications, electronic components The types and quantities of components included in 30 can be adjusted according to the needs of the designer, and are not limited thereto. For example, in an unillustrated embodiment, the electronic component 30 can also include both linear components and nonlinear components.

In addition, the LED chip 20 can be an LED chip 20 of two different illumination modes, and the LED chips 20 of the two different illumination modes are electrically connected to the two sets of the LED driving component 301, the rectifying component 302, and Power component 303. Moreover, the aspect of the LED chip 20 may be a die structure or a packaged structure, which is not limited in this embodiment.

Thereby, the two sets of the LED driving component 301, the rectifying component 302, and the power component 303 can respectively be used to drive the LED chips 20 of the two different illumination modes, thereby adjusting the LED wafers 20 of the two different illumination modes. The proportion of light is emitted to achieve the effect of light mixing.

The two LED test pads 3 and the LED solid crystal region 21 of the circuit layer 2 are integrally extended, that is, the two LED test pads 3 are electrically connected to the LED solid crystal region 21, and the two LED test pads 3 are A detection current I that can be supplied by the detecting device 200 flows only through the LED solid crystal region 21 (see FIG. 4), thereby separately detecting the LED wafer 20 on the LED solid crystal region 21.

The two auxiliary test pads 4 are electrically connected to the two LED test pads 3 respectively. Further, the positions of the two auxiliary test pads 4 disposed on the substrate 1 are substantially on opposite sides of the two LED test pads 3, thereby correspondingly A through hole (not labeled) penetrating through the front surface 11 and the back surface 12 of the substrate 1 is formed between the LED test pad 3 and the auxiliary test pad 4, and a conductive material (not labeled) is filled in the through hole to enable the auxiliary test pad 4 to The conductive test material in the through hole is electrically connected to the LED test pad 3 corresponding thereto. Thereby, the two auxiliary test pads 4 can also supply the detection current I provided by the detecting device 200 to only the LED solid crystal region 21, thereby separately detecting the LED wafer 20 on the LED solid crystal region 21.

The two electrodes 5 are respectively electrically connected to the two blocks of the electronic component solid crystal region 22, so that the two electrodes 5 can be used for the other detection current I' provided by the detecting device 200 to circulate the LED solid crystal region 21 and the electronic component. The die bonding region 22 (as shown in FIG. 5), thereby simultaneously detecting the LED chip 20 on the LED solid crystal region 21 and the electronic component 30 on the electronic component solid crystal region 22 (eg, the LED driving component 301, the rectifying component 302, and the power) Element 303).

Furthermore, the two electrodes 5 of the carrier 10 can be electrically connected to an external driving power source 300 (such as a commercial power socket), so that the power (such as AC power) provided by the external driving power source 300 is transmitted through the circuit layer 2 And the electronic component 30 (such as the LED driving component 301, the rectifying component 302, and the power component 303), and the LED crystal on the circuit layer 2 The film 20 is illuminated and can be used.

The two connection pads 7 are electrically connected to the two auxiliary electrodes 6, respectively. Further, the two connection pads 7 are disposed on the opposite side of the two auxiliary electrodes 6 at the position of the substrate 1, so that the corresponding connection pads 7 are A through hole (not labeled) penetrating through the front surface 11 and the back surface 12 of the substrate 1 is formed between the auxiliary electrodes 6, and a conductive material (not labeled) is filled in the through hole so that the connection pad 7 can penetrate the conductive material in the through hole. The auxiliary electrode 6 corresponding thereto is electrically connected.

Furthermore, the two connection pads 7 are respectively adjacent to the two electrodes 5, and each connection pad 7 is spaced apart from the adjacent electrode 5, so that the two electrodes 5 can be selectively connected to the above two via wire bonding, respectively. The connection pads 7 are further electrically connected to the two auxiliary electrodes 6 through the two connection pads 7 respectively. That is to say, when it is necessary to use the auxiliary electrode 6, the adjacent electrode 5 and the connection pad 7 have to be connected via a wire.

Thereby, after the adjacent electrodes 5 and the connection pads 7 are connected to each other via the wire bonding, the two auxiliary electrodes 6 can also supply another detection current I′ provided by the detecting device 200 to the LED solid crystal region 21 and the electronic components. a die bonding region 22 (not shown), thereby simultaneously detecting the LED chip 20 on the LED solid crystal region 21 and the electronic component 30 on the electronic component die bonding region 22 (eg, the LED driving component 301, the rectifying component 302, and Power component 303).

Furthermore, the two auxiliary electrodes 6 of the carrier 10 can also be electrically connected to the external driving power source 300 (eg, a commercial power socket), so that the power provided by the external driving power source 300 (eg, AC power) is connected to the connection pad 7, The electrode 5, the circuit layer 2, and the electronic component 30 (for example, the LED driving element 301, the rectifying element 302, and the power element 303) further enable the LED chip 20 to emit light and can be used.

In addition, the LED light-emitting device 100 can also be electrically connected to other devices through the two auxiliary electrodes 6, thereby having more modes of operation. For example, please refer to FIG. 7 and please refer to FIG. 2 and FIG. 3 as appropriate. The LED lighting device 100 of the present embodiment can be fixed to a functional heat dissipation plate 400 and electrically connected to the functional heat dissipation plate 400 through the two auxiliary electrodes 6. .

The functional heat sink 400 has the function of dimming or other LED chips 20 that can use the LED lighting device 100, so that the LED lighting device 100 can be flexibly utilized according to different needs. In addition, the mounting manner between the LED lighting device 100 and its matching device (such as the functional heat dissipation plate 400) may be directly soldered or fixed, such as screw locking, snapping, bonding, etc., Limit it.

It should be noted that, after the LED chip 20 is mounted on the carrier 10, the LED chip 20 will be in the same plane as the electronic component 30 (eg, the front surface 11 of the substrate 1), and therefore, between the LED chip 20 and the electronic component 30. Interference problems must be carefully considered. In view of this, in the present embodiment, a barrier wall 40 is formed on the front surface 11 of the substrate 1 of the carrier 10 to isolate the LED chip 20 from the electronic component 30, thereby reducing thermal interference and electromagnetic interference between the two.

Incidentally, the substrate 1 of the carrier 10 of the present embodiment preferably uses a ceramic substrate instead of a metal plate because the use of the metal plate is not advantageous for the circuit layer 2, the LED test pad 3, the auxiliary test pad 4, and the electrode. 5. The auxiliary electrode 6 and the connection pad 7 are formed on the surface of the metal plate. However, the material of the substrate 1 is not limited to this in practical applications.

[Possible effects of embodiments of the present invention]

In summary, the LED lighting device provided by the embodiment of the present invention has an LED test pad formed through the carrier for detecting current to flow through the LED solid crystal region, thereby separately detecting the LED chip on the LED solid crystal region. That is to say, after the circuit layer is mounted on the LED chip and the electronic component, it can be more clearly distinguished that the defect is caused by the LED chip or the electronic component. Furthermore, the carrier of the LED lighting device is formed with an auxiliary test pad, so that the detecting device can individually detect the LED chip via the back surface of the carrier.

In addition, the carrier of the LED lighting device is formed with a connection pad and an auxiliary electrode, so that the designer can selectively connect the electrode adjacent to the wire by the wire as needed. The connection pad can further achieve the effect of electrically connecting the electrode and the corresponding auxiliary electrode to each other.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalent variations and modifications of the scope of the invention are intended to be within the scope of the invention.

10‧‧‧Hosting

1‧‧‧Substrate

11‧‧‧ positive

12‧‧‧ Back

2‧‧‧ circuit layer

21‧‧‧LED solid crystal area

22‧‧‧Electrical component solid crystal region

3‧‧‧LED test pad

5‧‧‧Electrode

7‧‧‧Connecting mat

20‧‧‧LED chip

30‧‧‧Electronic components

301‧‧‧LED drive components

302‧‧‧Rectifying components

303‧‧‧Power components

200‧‧‧Testing equipment

I‧‧‧Detection current

Claims (10)

An LED light-emitting device comprises: a substrate; a circuit layer disposed on the substrate, the circuit layer comprising an LED solid crystal region and an electronic component solid crystal region, and the LED solid crystal region and the electronic component solid crystal region Electrically connected to each other; an LED chip is mounted on the LED solid crystal region to be electrically connected to the circuit layer; an LED driving component is mounted on the electronic component solid crystal region to be electrically connected to the LED device a circuit layer; two LED test pads electrically connected to the LED solid crystal region, and the two LED test pads can supply a detection current only to circulate the LED solid crystal region to separately detect the LED on the LED solid crystal region a chip; and two electrodes electrically connected to the die bonding region of the electronic component, and the two electrodes can supply another detecting current to flow the LED solid crystal region and the electronic component solid crystal region to simultaneously detect the LED solid crystal region The LED chip and the LED driving component on the solid crystal region of the electronic component, and the two electrodes can be electrically connected to an external driving power source, so that the power provided by the external driving power source is driven by the LED layer and the LED The component causes the LED chip to emit light. The LED lighting device of claim 1, wherein the substrate has a front surface and a back surface, and the circuit layer, the two LED test pads, and the two electrodes are located on a front surface of the substrate, and the LED of the circuit layer is solid. The crystal region and the two LED test pads are integrally extended. The LED lighting device of claim 1, wherein the electronic component solid crystal region can be divided into two blocks, and two blocks of the electronic component solid crystal region are located on opposite sides of the LED solid crystal region. The LED lighting device of claim 3, wherein the substrate is substantially square, and the two blocks of the electronic component solid crystal region are respectively located substantially at the diagonal of the substrate On the two corners. The LED lighting device of any one of claims 2 to 4, further comprising two auxiliary test pads, the two auxiliary test pads being located on the back of the substrate and electrically connected to the two LED test pads, respectively. The LED lighting device of any of claims 2 to 4, further comprising two connection pads and two auxiliary electrodes, the two connection pads being located on the front side of the substrate, the two auxiliary electrodes being located on the back side of the substrate The two connection pads are respectively electrically connected to the two electrodes, and the two electrodes are respectively electrically connected to the two auxiliary electrodes by being connected to the two connection pads. A carrier for an LED lighting device comprises: a substrate; a circuit layer disposed on the substrate, the circuit layer comprising an LED solid crystal region and an electronic component solid crystal region, and the LED solid crystal region and the electronic component The solid crystal regions are electrically connected to each other; wherein the LED solid crystal region is used for mounting an LED chip thereon and electrically connected to each other; and two LED test pads electrically connected to the LED solid crystal region, and the two The LED test pad can supply a detection current only to flow through the LED solid crystal region to separately detect the LED chip used for carrying the LED solid crystal region; and two electrodes electrically connected to the electronic component solid crystal region, and The two electrodes are capable of supplying another detection current to the LED solid crystal region and the electronic component die bonding region. The carrier of the LED lighting device of claim 7, wherein the substrate has a front surface and a back surface, and the circuit layer, the two LED test pads, and the two electrodes are located on a front surface of the substrate, the circuit layer The LED solid crystal region is integrally formed with the two LED test pads. The carrier of the LED lighting device of claim 8, further comprising two auxiliary test pads, the two auxiliary test pads being located on the back of the substrate and electrically connected to the two LED test pads respectively. The carrier of the LED lighting device of claim 8, further comprising Two connection pads and two auxiliary electrodes are disposed on the front surface of the substrate, and the two auxiliary electrodes are located on the back surface of the substrate and electrically connected to the two connection pads respectively, and the two connection pads are respectively spaced apart from the two electrodes And the two electrodes can be electrically connected to the two auxiliary electrodes respectively by being connected to the two connection pads.