TWI524111B - Manufacture of liquid crystal panels - Google Patents

Description

Liquid crystal panel manufacturing method [related application]

This application is based on Japanese Patent Application No. 2013-142624 (Application Date: July 8, 2013) and has priority from the application. This application contains the entire contents of this application by reference to the application.

The present invention relates to a method of manufacturing a liquid crystal panel.

A TFT (Thin Film Transistor) including a pixel electrode is formed in a matrix on the array substrate of the liquid crystal panel, and a protection circuit or a short-circuit ring is formed to prevent short-circuiting. Therefore, with such a configuration, it is possible to perform static elimination when the array substrate is subjected to friction or peeling electrification due to rubbing treatment.

For example, Patent Document 1 proposes a method in which a mother substrate (hereinafter referred to as a "mother array substrate") for forming a plurality of individual array substrates is separated from a stage used in a manufacturing step, The contact terminals are in contact with the dummy wirings disposed on the mother substrate, and the charged static electricity is removed from the mother array substrate.

However, the static elimination method shown in Patent Document 1 corresponds to the mother array substrate, and the static electricity that is charged on the opposite substrate is not removed. Further, in the IPS (In Plane Switching) method using a lateral electric field of liquid crystal molecules, the mother substrate (hereinafter referred to as "mother opposite substrate") for forming a plurality of individual wafers of opposite substrates There is no conductive structure such as a pixel electrode. Therefore, the charge generated when the parent opposing substrate is rubbed or stripped by the rubbing treatment is attached to the mother substrate and then separated into liquid crystals. After the panel, the electric charge also continues to remain, hindering the behavior of the liquid crystal molecules caused by the voltage application, and has a problem of poor printing.

Accordingly, the present invention has been made in view of the above problems, and an object of the invention is to provide a method for manufacturing a liquid crystal panel in which the opposite direction of non-conductivity is caused by friction or peeling electrification during rubbing treatment. When the substrate generates an electric charge, there is no occurrence of poor printing or the like.

The present invention relates to a method for fabricating a liquid crystal panel, in which a liquid crystal layer is bonded to an array substrate and a counter substrate, and includes a conductive layer forming step, which is performed along a front side of the liquid crystal panel. a conductive layer is formed on at least an outer peripheral region of the substrate; and a step of removing electricity, wherein the contact terminal is in contact with the conductive layer to perform static elimination.

According to the present invention, by forming a conductive layer along at least the outer peripheral region of the mother opposing substrate, the friction generated during the rubbing treatment or the electric charge generated by the stripping electrification from the stage can be neutralized.

10‧‧‧LCD panel

12‧‧‧Array substrate

14‧‧‧ Alignment substrate

16‧‧‧peripheral area

18‧‧‧peripheral area

20‧‧‧Array side formation

22‧‧‧ opposite side formation

24‧‧‧ Conductive layer

26‧‧‧ Sealing members

28‧‧‧Gap area

30‧‧‧ test pattern

100‧‧‧ glass substrate

110‧‧‧ glass substrate

120‧‧‧ mother array substrate

140‧‧‧Female counter substrate

Fig. 1 is a longitudinal sectional view showing a liquid crystal panel according to a first embodiment of the present invention.

Fig. 2 is a plan view showing a mother opposing substrate of the first embodiment.

Fig. 3 is a plan view showing a mother opposing substrate of the second embodiment.

Fig. 4 is a longitudinal sectional view showing a liquid crystal panel of a third embodiment.

Hereinafter, a method of manufacturing the liquid crystal panel 10 according to an embodiment of the present invention will be described based on the drawings.

[Embodiment 1]

A method of manufacturing the liquid crystal panel 10 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2.

The liquid crystal panel 10 is, for example, an IPS method, and the IPS method is not like TN (Twisted). In the Nematic: TW (Vertical Alignment) mode or the VA (Vertical Alignment) method, an electric field is applied in the thickness direction of the liquid crystal sandwiched between the glass substrates, and an electric field is applied in the direction of the surface of the array substrate 12 to make the liquid crystal molecules in the array. A transverse electric field mode in which the substrate 12 rotates in parallel.

The liquid crystal panel 10 is bonded to the array substrate 12 and the counter substrate 14 via a liquid crystal layer. A gate wiring and a signal wiring are formed on the array substrate 12 so as to be orthogonal to each other, and a pixel electrode is formed via the TFT at the intersection portion thereof. Since the pixel electrode is in the IPS mode, it is formed in a comb shape. A conductive layer such as an electrode is not formed on the counter substrate 14. A RGB color filter layer and a black matrix are formed on the upper surface of the glass substrate, and a protective film and an alignment film are formed thereon.

1 is a longitudinal cross-sectional view showing a state in which a mother array substrate 120 for forming a plurality of monolithic array substrates 12 and a mother opposing substrate 140 for forming a plurality of individual counter substrates 14 are attached. It is the outer peripheral regions 16, 18 of the mother array substrate 120 and the mother opposing substrate 140. Reference numeral 20 in Fig. 1 denotes an array side forming layer including a gate wiring, a signal line wiring, a TFT, a pixel electrode, a protective film, an alignment film, and the like formed on the array substrate 12, and reference numeral 22 denotes that it is formed on the opposite substrate 14. The color filter layer, the black matrix, the protective film, and the opposite side of the alignment film form a layer. In the present embodiment, the linear conductive layer 24 is formed as a frame on the opposite side forming layer 22 by a transparent electrode (ITO; Indium Tin Oxide) along the outer peripheral region 18 of the mother opposing substrate 140. shape. The line width of the conductive layer 24 is preferably as thick as possible in order to facilitate the process of removing the electricity from the outer peripheral region of the mother substrate, that is, the region where the opposite substrate is not formed, for example, a terminal that contacts the ground. The winding can be, for example, several hundred μm to several mm. The formation of the conductive layer 24 is relatively simple, and the condition of the step of forming the pixel electrode of the array substrate is used as it is, and the film thickness is, for example, about 50 nm.

The method of manufacturing the liquid crystal panel 10 will be described in order.

First, the mother array substrate 120 is fabricated. To this end, the process proceeds to become the mother array substrate 120. Film formation on the surface of the glass substrate 100. In this case, the metal film is formed by a sputtering method, and the insulating film is formed by a CVD (Chemical Vapor Deposition Chemical Vapor Deposition) method. Both of them introduce a gas into the vacuum chamber to cause a physical or chemical reaction, thereby attaching the metal film or the insulating film to the glass substrate.

Next, a resist is applied onto the glass substrate on which the metal film or the insulating film is formed to form a resist layer.

Next, the glass substrate coated with the resist layer was exposed using an exposure apparatus to perform development. That is, the pattern is burned on the resist layer using a mask in which a pattern is drawn.

Next, the mask is covered with the patterned resist layer, and wet etching or dry etching is performed to remove unnecessary resist layers, metal films or insulating films other than the pattern.

Next, an unnecessary resist layer remaining on the metal film or the insulating film on which the pattern is formed is peeled off from the glass substrate 100, leaving only the necessary film.

Then, in each of the above steps, since one metal film or an insulating film is formed by one mask, the steps are repeated a plurality of times on the respective stages to form the array side forming layer 20. Moreover, at this time, the test pattern 30 for step management is formed in advance in the outer peripheral region 16 of the mother array substrate 120. In addition, the stage refers to a stage on which the mother array substrate 120 is placed in advance for each manufacturing step, and the mother array substrate 120 is placed on the stage before the work, and is peeled off after the work.

Next, on the opposite substrate 14 and also on the glass substrate 110 which becomes the mother opposing substrate 140, the opposite side forming layer 22 including the black matrix and the RGB color filter layer is formed in the same manner as the array substrate 12 The pattern is formed on each stage. Further, in this manufacturing step, as shown in FIG. 2, a step of forming the conductive layer 24 by ITO along the outer peripheral region of the mother opposing substrate 140 is performed.

Next, an alignment film of the alignment film of the mother array substrate 120 and the mother opposing substrate 140 is applied by roll transfer. The alignment film is used to make the orientation of the liquid crystal molecules uniform.

Next, the alignment film of the alignment film of the mother array substrate 120 and the mother opposing substrate 140 is divided into Do not rub. For example, the cloth is wound on a cylinder, and the surface of the alignment film is mechanically rubbed so that the liquid crystal molecules face the direction of the rubbing. Moreover, it can also be performed by the optical alignment process.

Next, the sealing members 26 are respectively formed in a frame shape along the outer peripheral region of the counter substrate 14 of the single-piece liquid crystal panel 10 in the mother opposing substrate 140.

Next, the contact terminal of the static eliminating device is brought into contact with the conductive layer 24 formed in the outer peripheral region of the mother opposing substrate 140 to be neutralized. The contact terminal is grounded, and by the contact of the contact terminal, the charge generated by the rubbing treatment or the stripping from the stage can be removed from the mother opposing substrate 140.

Next, the mother array substrate 120 and the mother opposing substrate 140 are bonded.

Next, a liquid crystal layer is formed by injecting liquid crystal between the mother substrate 120 and the mother opposing substrate 140 to be bonded by, for example, liquid crystal dropping.

Next, the sealing member 26 to which the mother array substrate 120 and the mother opposing substrate 140 are bonded is irradiated with UV light to be cured.

Next, after the sealing member 26 is cured, the scribe line is broken, and the liquid crystal panel 10 for each single piece is divided to form a liquid crystal panel 10 of one piece. Moreover, the unnecessary portion of the glass substrate after being separated is discarded. Since the unnecessary portion also includes the outer peripheral region of the mother opposing substrate 140 on which the conductive layer 24 is formed, the conductive layer 24 does not remain after the article.

Next, a polarizing plate is attached to both surfaces of each liquid crystal panel 10, a backlight is mounted, a driver IC is mounted, and a frame is mounted to complete the module.

According to the present embodiment, when the conductive layer 24 is formed in the outer peripheral region of the mother opposing substrate 140, electric charges are generated in the conductive layer 24 at the time of rubbing treatment or when charging occurs due to peeling from the stage or the like. On the other hand, the electric charge of each liquid crystal panel 10 can be removed without affecting the electrical characteristics of the liquid crystal panel 10, resulting in poor printing.

[Embodiment 2]

Next, a method of manufacturing the liquid crystal panel 10 of the second embodiment will be described based on FIG. Bright.

In the first embodiment, the conductive layer 24 formed on the mother opposing substrate 140 is provided only in the outer peripheral region of the mother opposing substrate 140. However, in the present embodiment, as shown in FIG. The gap region 28 between the liquid crystal panels 10 of the sheet also forms a conductive layer 24.

Thereby, the charged electric charge in the liquid crystal panel 10 flows more reliably on the conductive layer 24, and the static elimination can be performed.

[Embodiment 3]

Next, a method of manufacturing the liquid crystal panel 10 of the third embodiment will be described based on Fig. 4 .

In the first embodiment, the conductive layer 24 is formed on the color filter layer or the black matrix of the mother opposing substrate 140, but a conductive layer is directly formed on the surface of the glass substrate of the mother opposing substrate 140. twenty four.

As a result, since the conductive layer 24 is in contact with the color filter layer or the black matrix layer in the first embodiment, and is also in contact with the glass substrate, the charging on the glass surface side can be more effectively performed. Further, even in the case where the outer peripheral region 18 is narrow, since the conductive layer 24 can be formed to be wider, the static eliminating effect can be improved.

[Modification]

The manufacturing method of the liquid crystal panel 10 of the present embodiment is not limited to the IPS method as long as it is a lateral electric field type liquid crystal panel 10 having no electrodes on the counter substrate 14, and can be applied to the liquid crystal panel 10 of another mode.

The present invention is not limited to the above-described embodiments, and the constituent elements may be changed and embodied in the implementation stage without departing from the spirit and scope of the invention. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, several constituent elements may be eliminated from all of the constituent elements shown in the embodiment. Furthermore, the constituent elements across different embodiments may also be combined as appropriate.

10‧‧‧LCD panel

12‧‧‧Array substrate

14‧‧‧ Alignment substrate

16‧‧‧peripheral area

18‧‧‧peripheral area

20‧‧‧Array side formation

22‧‧‧ opposite side formation

24‧‧‧ Conductive layer

26‧‧‧ Sealing members

30‧‧‧ test pattern

100‧‧‧ glass substrate

110‧‧‧ glass substrate

120‧‧‧ mother array substrate

140‧‧‧Female counter substrate

Claims (5)

A method for manufacturing a liquid crystal panel, wherein the liquid crystal panel is bonded to the array substrate and the opposite substrate, and the method comprises the following steps: a conductive layer forming step, which is performed along the liquid crystal panel Forming a conductive layer on at least the outer peripheral region of the mother substrate before the break; and removing the electricity, wherein the contact terminal is in contact with the conductive layer to perform static elimination. The method of manufacturing a liquid crystal panel according to claim 1, wherein in the conductive layer forming step, the conductive layer is formed in a peripheral region of the outer peripheral region of the mother opposing substrate, and the gap region adjacent to the liquid crystal panel before the breaking is formed. Conductive layer. The method of manufacturing a liquid crystal panel according to claim 1, wherein after the step of forming the conductive layer, the method comprises the steps of: a panel bonding step of bonding the mother substrate before forming the liquid crystal panel, and bonding the mother substrate a counter substrate; and a breaking step of dividing the bonded mother opposing substrate and the mother array substrate into a plurality of the liquid crystal panels and unnecessary portions on which the conductive layer is formed. The method of manufacturing a liquid crystal panel according to claim 1, wherein the conductive layer is formed on a color filter layer of the mother opposing substrate, a black matrix layer, or a glass substrate constituting the mother opposing substrate. . The method of manufacturing a liquid crystal panel according to claim 1, wherein the conductive layer is formed of the same material as the transparent electrode.