TWI521035B - A hardening composition and an optical follower - Google Patents

A hardening composition and an optical follower Download PDF

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TWI521035B
TWI521035B TW101114704A TW101114704A TWI521035B TW I521035 B TWI521035 B TW I521035B TW 101114704 A TW101114704 A TW 101114704A TW 101114704 A TW101114704 A TW 101114704A TW I521035 B TWI521035 B TW I521035B
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polythiol
sulfur
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compound
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TW201311847A (en
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Junya Hayakawa
Hitoshi Okazaki
Motoharu Takeuchi
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Mitsubishi Gas Chemical Co
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/06Polythioethers from cyclic thioethers
    • C08G75/08Polythioethers from cyclic thioethers from thiiranes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/02Polythioethers; Polythioether-ethers

Description

硬化性組成物及光學用接著劑 Curing composition and optical adhesive

本發明係關於適合作為製作複合光學元件時使用之光學用接著劑之硬化性組成物者。 The present invention relates to a curable composition suitable as an optical adhesive used in the production of a composite optical element.

以丙烯酸酯化合物等作為主成分之光硬化性組成物已廣泛使用作為製作光學元件時之接著劑。就接著劑而言,基本性能為密著性、光硬化性、機械強度、耐久性及光學特性,但近年來隨著光學元件之高功能化,折射率成為重要性能。尤其接著劑之高折射率化使光學設計之自由度變寬廣,故有高期待。使用具有高折射率之接著劑之用途例,例如作為複合光學元件之例,列舉為以兩片透鏡貼合構成之消色差透鏡(achromatic lens)、以玻璃與樹脂之複合構成之複合型非球面透鏡、雙色稜鏡(dichroic prism)等之具有複雜形狀之稜鏡等。該等用途中使用之接著劑不只要求高折色率,當然也要求密著性、光硬化性、無色透明性、耐熱性、適於作業之黏度之性能。 A photocurable composition containing an acrylate compound or the like as a main component has been widely used as an adhesive when an optical element is produced. In terms of the adhesive, the basic properties are adhesion, photocurability, mechanical strength, durability, and optical properties. However, in recent years, as the optical element has been highly functionalized, the refractive index has become an important performance. In particular, the high refractive index of the adhesive makes the degree of freedom in optical design wider, and therefore has high expectations. An example of the use of an adhesive having a high refractive index is, for example, a composite optical element, which is an achromatic lens formed by laminating two lenses, and a composite aspherical surface composed of a composite of glass and resin. A lens, a dichroic prism, or the like having a complicated shape. The adhesive used in such applications requires not only a high color conversion ratio, but also adhesion, photocurability, colorless transparency, heat resistance, and workability to work.

作為具有高折射率之化合物,發現有多數之於分子構造中以高濃度含有硫原子之環硫化合物(專利文獻1~4)。例如,雙(2,3-環硫丙基)硫醚之硬化物的折射率為1.70。該環硫化合物由於黏度低,可容易地注入模具中,故適用於眼鏡鏡片等成形體之製作。然而,假設作為接著劑使用時,黏度過低時會使接著劑垂流,或於貼合時 與被黏著體錯位而有作業性之課題。且,一般環硫化合物隨著硬化而收縮較大,故作為接著劑使用時會成為密著性降低之原因。 As a compound having a high refractive index, an episulfide compound containing a sulfur atom in a high concentration in a molecular structure has been found (Patent Documents 1 to 4). For example, the cured product of bis(2,3-epoxypropyl) sulfide has a refractive index of 1.70. Since the episulfide compound can be easily injected into a mold because of its low viscosity, it is suitable for the production of a molded body such as an eyeglass lens. However, if it is used as an adhesive, when the viscosity is too low, the adhesive will sag, or when it is attached. It has the problem of being misplaced with the adhesive body. Further, since the episulfide compound generally shrinks with hardening, it is a cause of a decrease in adhesion when used as an adhesive.

又,作為具有高折射率之多官能(甲基)丙烯酸酯化合物,已知有9,9-雙(4-(2-丙烯醯氧基乙氧基)苯基)茀(以下稱為A-BPEF)(硬化物之折射率1.62),或4,4’-雙(甲基丙烯醯硫基)二苯基硫醚(以下稱為MPSMA)(硬化物之折射率1.69)等。然而,該等化合物在常溫下為固體,故難以單獨使用。 Further, as a polyfunctional (meth) acrylate compound having a high refractive index, 9,9-bis(4-(2-propenyloxyethoxy)phenyl) fluorene (hereinafter referred to as A-) is known. BPEF) (refractive index: 1.62), or 4,4'-bis(methacrylium sulfonyl)diphenyl sulfide (hereinafter referred to as MPSMA) (refractive index of 1.69) and the like. However, these compounds are solid at normal temperature and are therefore difficult to use alone.

又,一般之多官能(甲基)丙烯酸酯化合物隨著硬化而收縮較大,於作為接著劑使用時會成為密著性降低之原因。 Further, a general polyfunctional (meth) acrylate compound shrinks greatly as it hardens, and when used as an adhesive, it causes a decrease in adhesion.

另一方面,已知組合(甲基)丙烯酸酯化合物等乙烯性不飽和化合物與硫醇化合物之烯.硫醇組成物,由於硫醇化合物含有原子折射率高之硫原子,故會獲得折射率高之硬化物。然而,硫醇基與乙烯性不飽和鍵基之加成聚合相較於連鎖聚合,其交聯點較少,且生成之硫醚鍵有獲得軟質硬化物之傾向,故有所得硬化物在高溫下容易軟化之課題。為獲得足夠之耐熱性,有選擇多官能之乙烯性不飽和化合物及硫醇化合物之必要。 On the other hand, it is known to combine an ethylenically unsaturated compound such as a (meth) acrylate compound with an olefin of a thiol compound. In the thiol composition, since the thiol compound contains a sulfur atom having a high atomic refractive index, a cured product having a high refractive index is obtained. However, the addition polymerization of a thiol group and an ethylenically unsaturated bond group has less crosslinking points than the chain polymerization, and the resulting thioether bond has a tendency to obtain a soft cured product, so that the obtained cured product is at a high temperature. It is easy to soften the subject. In order to obtain sufficient heat resistance, it is necessary to select a polyfunctional ethylenically unsaturated compound and a thiol compound.

專利文獻5中記載由含有1,4-二硫雜環己烷環之二官能硫醇化合物,與異三聚氰酸三烯丙酯或三聚氰酸三烯丙酯構成之烯.硫醇組成物。然而,關於硬化物之折射率並未特別記載。且,由於使用二官能之硫醇化合物,故硬化 物在高溫下容易軟化(參考比較例)。 Patent Document 5 describes an olefin composed of a difunctional thiol compound containing a 1,4-dithiane ring and a triallyl cyanurate or a triallyl cyanurate. Mercaptan composition. However, the refractive index of the cured product is not specifically described. And, because of the use of difunctional thiol compounds, it hardens The material is easily softened at high temperatures (refer to Comparative Example).

專利文獻6中記載由A-BPEF、乙烯性不飽和化合物、及硫醇化合物構成之烯.硫醇組成物。以實施例說明時,硬化物之折射率高達1.58~1.61之範圍。 Patent Document 6 describes an ene thiol composition comprising A-BPEF, an ethylenically unsaturated compound, and a thiol compound. When demonstrated by the examples, the refractive index of the cured product is as high as 1.58 to 1.61.

專利文獻7中記載由MPSMA、乙烯系單體、及聚硫醇構成之烯.硫醇組成物。依據實施例,硬化物之折射率最高為1.649。然而,MPSMA容易變黃,且由於為固體故對組成物之溶解量有其界限。 Patent Document 7 describes an olefin composed of MPSMA, a vinyl monomer, and a polythiol. Mercaptan composition. According to an embodiment, the cured product has a refractive index of up to 1.649. However, MPSMA tends to yellow, and because of its solidity, there is a limit to the amount of dissolution of the composition.

又,專利文獻8中記載由具有茀環之樹脂成分、MPSMA等之具有二苯基硫醚骨架之含硫化合物構成之樹脂組成物,且例示具有折射率1.724之樹脂。然而,該發明中之樹脂組成物實質上為混練具有茀環之聚酯與含硫化合物而成之熱可塑性樹脂,並非硬化性樹脂組成物,當然無法賦予光硬化性。 Further, Patent Document 8 describes a resin composition comprising a resin component having an anthracene ring and a sulfur-containing compound having a diphenyl sulfide skeleton such as MPSMA, and a resin having a refractive index of 1.724 is exemplified. However, the resin composition in the invention is a thermoplastic resin obtained by kneading a polyester having an anthracene ring and a sulfur-containing compound, and is not a curable resin composition, and of course, it cannot provide photocurability.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開平9-71580號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 9-71580

[專利文獻2]日本特開平9-110979號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei 9-110979

[專利文獻3]日本特開平9-255781號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. Hei 9-255781

[專利文獻4]日本特開2001-163874號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2001-163874

[專利文獻5]日本特開2000-154251號公報 [Patent Document 5] Japanese Patent Laid-Open Publication No. 2000-154251

[專利文獻6]日本特開2010-254732號公報 [Patent Document 6] Japanese Patent Laid-Open Publication No. 2010-254732

[專利文獻7]日本特開平03-021638號公報 [Patent Document 7] Japanese Patent Laid-Open No. 03-021638

[專利文獻8]日本特開2005-187661號公報 [Patent Document 8] Japanese Patent Laid-Open Publication No. 2005-187661

據此,本發明之目的係提供一種具有高折射率,且亦兼具光硬化性、低收縮性、無色透明性、適於作業之黏度之作為光學用接著劑所要求之性能之硬化性組成物。 Accordingly, it is an object of the present invention to provide a hardenable composition which has a high refractive index and which also has photocurability, low shrinkage, colorless transparency, and viscosity suitable for operation as an optical adhesive. Things.

本發明人等為解決上述課題而積極檢討之結果,發現含有使聚硫醇與硫反應獲得之聚硫醇寡聚物(A成分)及多烯化合物(B成分)之硬化性組成物可進一步高折射率化,且兼具作為光學用接著劑之必要性能,因而完成本發明。 The present inventors have found that a curable composition containing a polythiol oligomer (component A) and a polyene compound (component B) obtained by reacting a polythiol with sulfur can be further developed as a result of a review of the above problems. The present invention has been completed by increasing the refractive index and having the necessary performance as an optical adhesive.

且,本發明人等發現含有使聚硫醇與硫反應獲得之聚硫醇寡聚物(A成分)、環硫化合物(C成分)及光鹼產生劑(D成分)之硬化性組成物具有適合作為接著劑之作業性之黏度,且隨著硬化之收縮小,因此可較好地作為光學用接著劑。另外,聚硫醇與硫反應時雖較好使用鹼性觸媒,但使用受阻胺作為該觸媒時,發現可獲得儲存安定性優異(環硫化物之反應相當慢)之硬化性組成物。基於以上見解,因而完成本發明。 Further, the present inventors have found that a curable composition containing a polythiol oligomer (component A) obtained by reacting a polythiol with sulfur, an episulfide compound (component C), and a photobase generator (component D) has It is suitable as an adhesive for workability and has a small shrinkage with hardening, so it can be suitably used as an optical adhesive. Further, in the case of reacting a polythiol with sulfur, an alkaline catalyst is preferably used. However, when a hindered amine is used as the catalyst, it is found that a curable composition excellent in storage stability (a reaction in which the episulfide is relatively slow) can be obtained. Based on the above findings, the present invention has thus been completed.

依據本發明,可提供一種具有高折射率,且亦兼具光硬化性、低收縮性、無色透明性、適於作業之黏度之作為光學用接著劑之性能之硬化性組成物。 According to the present invention, it is possible to provide a curable composition having high refractive index and also having photocurability, low shrinkage, colorless transparency, and workability as an adhesive for optical use.

本發明之第一硬化性組成物係以含有使聚硫醇與硫反應獲得之聚硫醇寡聚物(A成分)及多烯化合物(B成分)而成之構成。 The first curable composition of the present invention comprises a polythiol oligomer (component A) obtained by reacting a polythiol with sulfur and a polyene compound (component B).

首先,針對聚硫醇寡聚物(A成分)之製造方法加以說明。 First, a method for producing a polythiol oligomer (component A) will be described.

作為聚硫醇寡聚物之原料之聚硫醇為一分子中具有兩個以上硫醇基之化合物,可為直鏈狀、分支鏈狀、環狀之任一種。尤其,追求硬化性組成物之高折射率化與適於作業性之黏度時,較好為以下述通式(1)至(3)表示之化合物。 The polythiol which is a raw material of the polythiol oligomer is a compound having two or more thiol groups in one molecule, and may be any of a linear chain, a branched chain, and a cyclic group. In particular, when the high refractive index of the curable composition and the viscosity suitable for workability are desired, the compounds represented by the following general formulae (1) to (3) are preferred.

(式中,p1及p2各獨立表示0~1之整數,X1~X8各獨立表示氫原子或甲基硫醇基), (式中,q表示0~3之整數,R1表示僅為鍵或碳數1~3之 伸烷基), (式中,r表示0~3之整數,R2表示碳數1~3之伸烷基)。 (wherein, p1 and p2 each independently represent an integer of 0 to 1, and X 1 to X 8 each independently represent a hydrogen atom or a methylthiol group), (wherein, q represents an integer from 0 to 3, and R 1 represents only a bond or an alkyl group having 1 to 3 carbon atoms), (wherein, r represents an integer of 0 to 3, and R 2 represents an alkylene group having 1 to 3 carbon atoms).

以通式(1)表示之化合物之例列舉為1,5-二巰基-3-硫戊烷、2-巰基甲基-1,5-二巰基-3-硫戊烷、2,4-雙(巰基甲基)-1,5-二巰基-3-硫戊烷、4-巰基甲基-1,8-二巰基-3,6-二硫辛烷、4,8-雙(巰基甲基)-1,11-二巰基-3,6,9-三硫十一烷、4,7-雙(巰基甲基)-1,11-二巰基-3,6,9-三硫十一烷、5,7-雙(巰基甲基)-1,11-二巰基-3,6,9-三硫十一烷等,以通式(2)表示之化合物之例列舉為2,5-二巰基-1,4-二硫雜環己烷、2,5-二巰基甲基-1,4-二硫雜環己烷、2,5-二巰基乙基-1,4-二硫雜環己烷等,以通式(3)表示之化合物之例列舉為甲苯二硫醇等。以通式(1)至(3)表示之化合物以外之聚硫醇化合物列舉為乙二醇雙(3-巰基丙酸酯)、三羥甲基丙烷叁(3-巰基丙酸酯)、季戊四醇肆(3-巰基丙酸酯)、苯二硫醇、甲苯二硫醇等。 Examples of the compound represented by the formula (1) are 1,5-dimercapto-3-thiopentane, 2-mercaptomethyl-1,5-diindol-3-thiopentane, 2,4-double. (mercaptomethyl)-1,5-diamidino-3-thiopentane, 4-mercaptomethyl-1,8-dimercapto-3,6-dithiooctane, 4,8-bis(decylmethyl) )-1,11-dimercapto-3,6,9-trithioundecane, 4,7-bis(indolylmethyl)-1,11-dimercapto-3,6,9-trithioundecane 5,7-bis(decylmethyl)-1,11-dimercapto-3,6,9-trithioundecane, etc., and the compound represented by the formula (2) is exemplified as 2,5-di Mercapto-1,4-dithiane, 2,5-dimercaptomethyl-1,4-dithiane, 2,5-dimercaptoethyl-1,4-disulfide Examples of the compound represented by the formula (3) such as hexane are exemplified by toluene dithiol or the like. The polythiol compounds other than the compounds represented by the general formulae (1) to (3) are exemplified by ethylene glycol bis(3-mercaptopropionate), trimethylolpropane oxime (3-mercaptopropionate), pentaerythritol. Anthracene (3-mercaptopropionate), benzenedithiol, toluene dithiol, and the like.

關於聚硫醇寡聚物之原料之硫,硫雖形成多種同位素,但通常較好為廣為已知之環狀S8硫。硫可為任何形態,例如結晶狀、膠體狀、粉末或者硫華。 Regarding the sulfur of the raw material of the polythiol oligomer, although sulfur forms a plurality of isotopes, it is usually preferably a generally known cyclic S8 sulfur. Sulfur can be in any form, such as crystalline, colloidal, powder or sulphur.

依據有機化學期刊(Journal of Organic Chemistry),32卷,3833~3836頁(1967年),聚硫醇與硫之反應,於例如產物為二聚物時,主要係依循下述反應式(6)及 (7)進行, (式中,R表示有機基,n表示1以上之整數)。硫之使用量相對於硫醇基1莫耳,以硫原子0.2~0.95莫耳之範圍較佳,更好為0.2~0.5莫耳之範圍。未達0.2莫耳時聚硫醇之轉化率太低而不實用,超過0.95莫耳時會生成作為光學材料之原料較不佳之分子量過大之聚硫醇寡聚物,同時容易殘留未反應之硫故不適當。 According to the Journal of Organic Chemistry, Vol. 32, pp. 3833-3836 (1967), the reaction of polythiol with sulfur, for example, when the product is a dimer, mainly follows the following reaction formula (6) And (7) proceed, (wherein R represents an organic group, and n represents an integer of 1 or more). The amount of sulfur used is preferably in the range of 0.2 to 0.95 mol per mol of the sulfur atom relative to 1 mol of the thiol group, more preferably in the range of 0.2 to 0.5 mol. The conversion rate of polythiol is too low to be practical when it is less than 0.2 mol, and when it exceeds 0.95 mol, it will produce a polythiol oligomer having a too large molecular weight as a raw material of an optical material, and easily leave unreacted sulfur. It is not appropriate.

聚硫醇與硫之反應係在鹼性觸媒之存在下或不存在下藉由加熱進行,但以使用鹼性觸媒之方法較佳。作為鹼性觸媒之種類列舉為胺、銨鹽、膦、鏻鹽等。鹼性觸媒之使用量相對於原料之聚硫醇中所含硫醇基100莫耳,較好為0.005~5莫耳之範圍,更好為0.05~0.5莫耳之範圍。 The reaction of the polythiol with sulfur is carried out by heating in the presence or absence of a basic catalyst, but a method using an alkaline catalyst is preferred. The type of the basic catalyst is exemplified by an amine, an ammonium salt, a phosphine, a phosphonium salt or the like. The amount of the basic catalyst used is preferably in the range of 0.005 to 5 moles, more preferably 0.05 to 0.5 moles, per 100 moles of the thiol group contained in the polythiol of the raw material.

各原料之添加順序可將觸媒添加於聚硫醇與硫之混合溶液中,亦可將硫添加於聚硫醇與觸媒之混合溶液中,亦可將聚硫醇與觸媒之混合溶液添加於聚硫醇與硫之混合溶液中。為使反應穩定地進行,亦可將觸媒或硫分成數次添加。 The order of adding the raw materials may be added to the mixed solution of the polythiol and the sulfur, or the sulfur may be added to the mixed solution of the polythiol and the catalyst, or the mixed solution of the polythiol and the catalyst may be added. It is added to a mixed solution of polythiol and sulfur. In order to allow the reaction to proceed stably, the catalyst or sulfur may be added in several portions.

聚硫醇與硫之反應亦可在多烯化合物(B成分)存在下進行。聚硫醇與硫之反應由於伴隨產生硫化氫,故較好在排氣下或減壓下進行。亦可視需要使用溶劑。使用溶劑 時餾除溶劑之後續步驟為必要。反應溫度並無特別限制,較好為0~100℃之範圍,亦可邊觀察反應進行狀況邊緩慢提高溫度。由於反應時間係依據原料之種類、聚硫醇與硫之比例、反應溫度等各種條件而定,故無法一概規定,但需反應到未殘留未反應之硫為止。 The reaction of the polythiol with sulfur can also be carried out in the presence of a polyene compound (component B). The reaction of the polythiol with sulfur is accompanied by the generation of hydrogen sulfide, so it is preferably carried out under exhaust or under reduced pressure. Solvents can also be used as needed. Using solvent The subsequent step of distilling off the solvent is necessary. The reaction temperature is not particularly limited, but is preferably in the range of 0 to 100 ° C, and the temperature may be gradually increased while observing the progress of the reaction. Since the reaction time depends on various conditions such as the kind of the raw material, the ratio of the polythiol to sulfur, and the reaction temperature, it cannot be specified, but it is necessary to react until no unreacted sulfur remains.

接著,針對本發明之第一硬化性組成物加以說明。 Next, the first curable composition of the present invention will be described.

本發明之第一硬化性組成物係以含有前述聚硫醇寡聚物(A成分)與多烯化合物(B成分)而構成。 The first curable composition of the present invention comprises a polythiol oligomer (component A) and a polyene compound (component B).

所謂多烯化合物(B成分)為一分子中具有兩個以上之乙烯性不飽和鍵基之化合物,至於乙烯性不飽和鍵基列舉為丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基等。尤其,追求硬化性組成物之高折射率化時,較好為分子內具有芳香環或雜環之化合物,至於該種化合物之例列舉為異三聚氰酸三烯丙酯、三聚氰酸三烯丙酯、鄰苯二甲酸二烯丙酯、間苯二甲酸二烯丙酯、對苯二甲酸二烯丙酯、偏苯三酸三烯丙酯、均苯四酸四烯丙酯、以通式(4)表示之化合物、及以通式(5)表示之化合物等。 The polyene compound (component B) is a compound having two or more ethylenically unsaturated bond groups in one molecule, and the ethylenically unsaturated bond group is exemplified by an acryloyl group, a methacryloyl group, a vinyl group, an allylic group. Base. In particular, when the high refractive index of the curable composition is desired, it is preferably a compound having an aromatic ring or a hetero ring in the molecule, and examples of the compound are exemplified isocyanuric cyanurate and cyanuric acid. Triallyl ester, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, triallyl trimellitate, tetraallyl pyromelliate, A compound represented by the formula (4), a compound represented by the formula (5), and the like.

(式中,X表示硫原子或磺醯基,Z表示(甲基)丙烯醯基、乙烯基、或烯丙基), (式中,m及n表示m與n之合計滿足0~4之整數,R3表示碳數1~5之伸烷基,R4表示氫原子或甲基,R5表示氫原子或甲基)。至於以通式(4)表示之化合物之例列舉為4,4’-雙(甲基丙烯醯硫基)二苯基硫醚、4,4’-雙(甲基丙烯醯硫基)二苯基碸等,以通式(5)表示之化合物列舉為9,9-雙(4-(2-丙烯醯氧基乙氧基)苯基)茀等。 (wherein X represents a sulfur atom or a sulfonyl group, and Z represents a (meth)acryloyl group, a vinyl group, or an allyl group), (wherein m and n represent the total of m and n satisfy an integer of 0 to 4, R 3 represents an alkylene group having 1 to 5 carbon atoms, R 4 represents a hydrogen atom or a methyl group, and R 5 represents a hydrogen atom or a methyl group. ). Examples of the compound represented by the general formula (4) are 4,4'-bis(methacrylium sulfonyl)diphenyl sulfide and 4,4'-bis(methacrylium sulfonyl)diphenyl. The compound represented by the formula (5) is exemplified by 9,9-bis(4-(2-propenyloxyethoxy)phenyl)anthracene or the like.

關於第一硬化性組成物中之聚硫醇寡聚物之含量,相對於硬化性組成物100重量份,較好為10~80重量份之範圍,更好為20~70重量份之範圍。聚硫醇寡聚物之含量未達10重量份時,高黏度化或低收縮化之效果變小,超過80重量份時硬化物之韌性降低故較不佳。 The content of the polythiol oligomer in the first curable composition is preferably in the range of 10 to 80 parts by weight, more preferably 20 to 70 parts by weight, per 100 parts by weight of the curable composition. When the content of the polythiol oligomer is less than 10 parts by weight, the effect of high viscosity or low shrinkage is small, and when it exceeds 80 parts by weight, the toughness of the cured product is lowered, which is not preferable.

本發明之硬化性組成物可視需要添加聚合禁止劑、抗氧化劑、光安定劑(HALS)、紫外線吸收劑、矽烷偶合劑、脫模劑、顏料、染料等。 The curable composition of the present invention may optionally contain a polymerization inhibitor, an antioxidant, a light stabilizer (HALS), an ultraviolet absorber, a decane coupling agent, a release agent, a pigment, a dye, and the like.

本發明之硬化性組成物係藉由在自由基系光聚合起始劑存在下,照射紫外光或可見光等活性光線而硬化。所謂自由基系光聚合起始劑只要是藉由光分解而生成活性之游離自由基者即無特別限制。該種化合物之具體例列舉為 2,2-甲氧基-1,2-二苯基乙烷-1-酮、1-羥基-環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲胺基-1-(4-嗎啉基苯基)-1-丁酮、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基-二苯基-氧化膦等。自由基系光聚合起始劑可單獨使用亦可混合兩種以上使用均無妨。其含量並無特別限制,但相對於硬化性組成物100重量份,較好為0.1~10重量份之範圍,更好為0.5~5重量份之範圍。 The curable composition of the present invention is cured by irradiation with active light such as ultraviolet light or visible light in the presence of a radical photopolymerization initiator. The radical photopolymerization initiator is not particularly limited as long as it is free radical which generates activity by photolysis. Specific examples of such compounds are listed as 2,2-methoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylpropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholine Phenyl phenyl)-1-butanone, bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide, 2,4,6-trimethylbenzylidene-diphenyl- Phosphine oxide and the like. The radical photopolymerization initiator may be used singly or in combination of two or more. The content thereof is not particularly limited, but is preferably in the range of 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight, per 100 parts by weight of the curable composition.

關於硬化性組成物之黏度,於預定作為接著劑使用時,黏度太低時,接著劑會垂流,或貼合時會與被黏著體偏移,故較不佳。且,黏度太高時,接著劑難以噴出或塗佈,於貼合時會夾帶氣泡故不佳。第一硬化性組成物中,所謂適於作業性之黏度一隨塗佈方法或貼合方法之接著劑使用型態而定,故無法一概規定,但較好為500~20,000 mPa.s之範圍,更好為1,000~10,000 mPa.s之範圍。 When the viscosity of the curable composition is used as an adhesive, when the viscosity is too low, the adhesive will sag, or it may be offset from the adherend when it is bonded, which is not preferable. Further, when the viscosity is too high, it is difficult for the adhesive to be sprayed or applied, and it is not preferable to entrain air bubbles at the time of bonding. In the first curable composition, the viscosity suitable for workability depends on the type of adhesive used in the coating method or the bonding method, and therefore cannot be specified, but is preferably 500 to 20,000 mPa. The range of s, preferably from 1,000 to 10,000 mPa. The range of s.

本發明之第二硬化性組成物係以含有使聚硫醇與硫反應獲得之聚硫醇寡聚物(A成分)、環硫化合物(C成分)及光鹼產生劑(D成分)所構成。 The second curable composition of the present invention comprises a polythiol oligomer (component A) obtained by reacting a polythiol with sulfur, an episulfide compound (component C), and a photobase generator (component D). .

首先,針對第二硬化性組成物中之聚硫醇寡聚物(A成分)之製造方法,大致上如上述第一硬化性組成物之說明。以下,以與第一硬化性組成物中之聚硫醇寡聚物(A成分)之製造方法之差異點為中心,針對第二硬化性組成物中之聚硫醇寡聚物(A成分)之製造方法加以說明。 First, the method for producing the polythiol oligomer (component A) in the second curable composition is substantially as described for the first curable composition. In the following, the polythiol oligomer (component A) in the second curable composition is centered on the difference from the method for producing the polythiol oligomer (component A) in the first curable composition. The manufacturing method will be described.

第二硬化性組成物中,聚硫醇與硫之反應雖係在鹼性觸媒之存在下或不存在下藉由加熱進行,但以使用鹼性觸媒之方法較佳。至於鹼性觸媒最好為受阻胺。所謂受阻胺意指胺基之兩相鄰具有取代基之胺。受阻胺肇因於取代基之立體障礙,故作為環硫化合物之聚合觸媒活性較弱。其結果,結合聚硫醇寡聚物與環硫化合物之硬化性組成物足夠安定(環硫化合物之聚合相當慢),而可長期儲存。至於受阻胺以具有2,2,6,6-四甲基哌啶骨架之化合物較佳,具體而言,列舉為2,2,6,6-四甲基哌啶、1,2,2,6,6-五甲基哌啶、4-羥基-2,2,6,6-四甲基哌啶、4-羥基-1,2,2,6,6-五甲基哌啶、丙烯酸2,2,6,6-四甲基-4-哌啶酯、甲基丙烯酸2,2,6,6-四甲基-4-哌啶酯、丙烯酸1,2,2,6,6-五甲基-4-哌啶酯、甲基丙烯酸1,2,2,6,6-五甲基-4-哌啶酯、癸二酸雙(2,2,6,6-四甲基-4-哌啶酯)、癸二酸雙(1,2,2,6,6-五甲基-4-哌啶酯)等。鹼性觸媒之使用量相對於原料之聚硫醇中所含硫醇基100莫耳,較好為0.005~5莫耳之範圍,更好為0.05~0.5莫耳之範圍。 In the second curable composition, the reaction of the polythiol with sulfur is carried out by heating in the presence or absence of an alkaline catalyst, but a method using an alkaline catalyst is preferred. As the alkaline catalyst, it is preferably a hindered amine. By hindered amine is meant an amine having two substituents adjacent to the amine group. The hindered amine is less active as a polymerization catalyst for the episulfide compound due to the steric hindrance of the substituent. As a result, the curable composition combining the polythiol oligomer and the episulfide compound is sufficiently stable (the polymerization of the episulfide compound is relatively slow), and can be stored for a long period of time. As the hindered amine, a compound having a 2,2,6,6-tetramethylpiperidine skeleton is preferred, specifically, 2,2,6,6-tetramethylpiperidine, 1,2,2, 6,6-pentamethylpiperidine, 4-hydroxy-2,2,6,6-tetramethylpiperidine, 4-hydroxy-1,2,2,6,6-pentamethylpiperidine, acrylic acid 2 , 2,6,6-tetramethyl-4-piperidinyl ester, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, 1,2,2,6,6-five acrylic acid Methyl-4-piperidinyl ester, 1,2,2,6,6-pentamethyl-4-piperidinyl methacrylate, bis(2,2,6,6-tetramethyl-4) sebacate - piperidinyl ester), bis(1,2,2,6,6-pentamethyl-4-piperidinyl ester) and the like. The amount of the basic catalyst used is preferably in the range of 0.005 to 5 moles, more preferably 0.05 to 0.5 moles, per 100 moles of the thiol group contained in the polythiol of the raw material.

聚硫醇與硫之反應亦可在環硫化合物(C成分)之存在下進行。但,未選擇適當鹼性觸媒時,會有進行環硫化合物之聚合而引起凝膠化之情況。據此,使用鹼性觸媒時基於前述理由以受阻胺較佳。 The reaction of the polythiol with sulfur can also be carried out in the presence of an episulfide compound (component C). However, when an appropriate alkaline catalyst is not selected, polymerization of an episulfide compound may occur to cause gelation. Accordingly, it is preferred to use a hindered amine for the above reasons when using an alkaline catalyst.

接著,針對本發明之第二硬化性組成物加以說明。 Next, the second curable composition of the present invention will be described.

本發明之第二硬化性組成物為含有前述聚硫醇寡聚物(A成分)、環硫化合物(C成分)及光鹼產生劑(D成 分)之構成。 The second curable composition of the present invention contains the above-mentioned polythiol oligomer (component A), an episulfide compound (component C), and a photobase generator (D The composition of the sub-).

所謂環硫化合物(C成分)為一分子中具有一個以上環硫基之化合物。尤其,追求硬化性組成物之高折射率化時,較好為以下述通式(8)表示之化合物: (式中,m為0至6之整數,n為0至4之整數,R3及R4各獨立表示氫原子或碳數1~10之烷基,R5、R6各獨立表示碳數1~10之伸烷基)。以通式(8)表示之環硫化合物之例列舉為雙(2,3-環硫丙基)硫醚等。 The episulfide compound (component C) is a compound having one or more episulfide groups in one molecule. In particular, when the high refractive index of the curable composition is desired, the compound represented by the following formula (8) is preferred: (wherein m is an integer of 0 to 6, n is an integer of 0 to 4, and R 3 and R 4 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R 5 and R 6 each independently represent a carbon number. 1~10 alkyl group). Examples of the episulfide compound represented by the formula (8) are bis(2,3-epoxypropyl) sulfide and the like.

以通式(8)表示之環硫化合物隨著硬化而收縮較大,但可藉由與聚硫醇寡聚物共聚合而抑制伴隨硬化造成之收縮。且,以通式(8)表示之環硫化合物大致上黏度較低,但藉由與聚硫醇寡聚物混合,而調整成作業性優異之黏度。 The episulfide compound represented by the general formula (8) shrinks greatly as it hardens, but shrinkage due to hardening can be suppressed by copolymerization with a polythiol oligomer. Further, the episulfide compound represented by the formula (8) has a substantially low viscosity, but is mixed with a polythiol oligomer to adjust the viscosity to be excellent in workability.

針對第二硬化性組成物,於與硬化性組成物之黏度有關,於預定作為接著劑之用途時,亦是黏度太低時,接著劑會垂流,在貼合時會與基板偏移而不佳。且,黏度太高時,接著劑之噴出或塗佈變得困難,且貼合時會夾帶氣泡而不佳。第二硬化性組成物之適於作業性之黏度雖亦隨塗佈方法或貼合方法之接著劑使用形態而定,故無法一概規定,但較好為100~50,000 mPa.s之範圍,更好為500~10,000 mPa.s之範圍。 The second curable composition is related to the viscosity of the curable composition, and when it is intended to be used as an adhesive, when the viscosity is too low, the adhesive will sag and will be offset from the substrate during bonding. Not good. Further, when the viscosity is too high, the ejection or coating of the adhesive becomes difficult, and it is not preferable to entrain air bubbles at the time of bonding. The viscosity of the second curable composition suitable for workability depends on the application method of the coating method or the bonding method, and therefore cannot be specified, but is preferably 100 to 50,000 mPa. The range of s is preferably 500~10,000 mPa. The range of s.

針對第二硬化性組成物中之聚硫醇寡聚物之含量,相對於硬化性組成物100重量份,較好為10~70重量份之範圍,更好為20~50重量份之範圍。聚硫醇寡聚物之含量未達10重量份時,高黏度化或低收縮化之效果變小,超過70重量份時硬化物之韌性下降而不佳。 The content of the polythiol oligomer in the second curable composition is preferably in the range of 10 to 70 parts by weight, more preferably 20 to 50 parts by weight, per 100 parts by weight of the curable composition. When the content of the polythiol oligomer is less than 10 parts by weight, the effect of high viscosity or low shrinkage is small, and when 70 parts by weight or more, the toughness of the cured product is not preferable.

所謂光鹼產生劑(D成分)為利用活性光線進行光分解而產生鹼之化合物。尤其,環硫化合物之聚合由於係利用DBN(二氮雜雙環壬烯)或DBU(二氮雜雙環癸烯)等之脒而促進,故較好為產生該等鹼之光鹼產生劑。具體而言,列舉為特表2001-513765中所記載之形成四芳基硼酸鹽之脒鎓酮(下述式(9)之左邊),或日本特表2005-511536中所記載之以芳基烷基取代之1,3-二胺(下述式(10)之左邊)等。該等可單獨或混合兩種以上使用均無妨。光鹼產生劑之添加量相對於硬化性組成物100重量份,較好為0.01~10重量份之範圍,更好為0.1~5重量份之範圍。 The photobase generator (component D) is a compound which generates a base by photodecomposition using active light. In particular, since the polymerization of the episulfide compound is promoted by using DBN (diazabicyclononene) or DBU (diazabicyclononene) or the like, it is preferred to produce a photobase generator which produces such a base. Specifically, it is exemplified by the fluorenone forming a tetraaryl borate described in JP-A-2001-513765 (the left side of the following formula (9)), or the aryl group described in JP-A-2005-511536. An alkyl-substituted 1,3-diamine (to the left of the following formula (10)) or the like. These may be used singly or in combination of two or more. The amount of the photobase generator to be added is preferably from 0.01 to 10 parts by weight, more preferably from 0.1 to 5 parts by weight, per 100 parts by weight of the curable composition.

又,除光鹼產生劑以外亦可包含光增感劑。藉由添加 光增感劑,而加速光鹼產生劑之光分解,可縮短光硬化性組成物之硬化時間。光增感劑之具體例列舉為二苯甲酮類、噻噸酮類、蒽醌類、樟腦醌(camphorquinone)類、二苯乙二酮(benzil)類、米氏(Michael)酮類、蒽類。該等可單獨使用或混合兩種以上使用均無妨。光增感劑之添加量相對於硬化性組成物100重量份,較好為0.01~10重量份之範圍,更好為0.1~5重量份之範圍。 Further, a photosensitizer may be contained in addition to the photobase generator. By adding The light sensitizer accelerates the photolysis of the photobase generator, thereby shortening the hardening time of the photocurable composition. Specific examples of the photosensitizer are benzophenones, thioxanthones, anthraquinones, camphorquinones, benzils, Michael ketones, anthraquinones. class. These may be used singly or in combination of two or more. The amount of the photosensitizer added is preferably in the range of 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, per 100 parts by weight of the curable composition.

前述硬化性組成物可視需要添加聚合禁止劑、聚合抑制劑、抗氧化劑、紫外線吸收劑、矽烷偶合劑、脫模劑、顏料、染料等。另外,視需要進行過濾或脫泡等亦無妨。 A polymerization inhibitor, a polymerization inhibitor, an antioxidant, an ultraviolet absorber, a decane coupling agent, a mold release agent, a pigment, a dye, etc. may be added to the said hardening composition as needed. In addition, it is also possible to perform filtration or defoaming as needed.

[實施例] [Examples]

以下以實施例具體說明本發明,但本發明並不限於該等。又,實施例中之硬化收縮率係依據下述計算式,自硬化前後之折射率算出。 The invention will be specifically described below by way of examples, but the invention is not limited thereto. Further, the curing shrinkage ratio in the examples was calculated from the refractive index before and after curing according to the following calculation formula.

X=(1-d1/d2)×100[%] X=(1-d1/d2)×100[%]

R=(n2-1)/(n2+2)×M/d R=(n 2 -1)/(n 2 +2)×M/d

硬化前後之R/M為一定,故由以上二式,X=[1-{(n12-1)/(n12+2)}/{(n22-1)/(n22+2)}]×100[%](式中,X表示硬化收縮率,d表示比重,d1表示硬化前之比重,d2表示硬化後之比重,R表示分子折射,n表示折射率,n1表示硬化前之折射率,n2表示硬化後之折射率,M表示分子量)。 The R/M before and after hardening is constant, so from the above two formula, X=[1-{(n1 2 -1)/(n1 2 +2)}/{(n2 2 -1)/(n2 2 +2) }]×100[%] (wherein X represents the hardening shrinkage ratio, d represents the specific gravity, d1 represents the specific gravity before hardening, d2 represents the specific gravity after hardening, R represents molecular refraction, n represents refractive index, and n1 represents before hardening. The refractive index, n2 represents the refractive index after hardening, and M represents the molecular weight).

且,硬化性組成物之黏度係使用錐-板型黏度計 (cone/plate viscometer)DV-II+(Brookfield公司製造),在溫度25℃下測定。硬化性組成物及硬化物(硬化膜)之折射率係使用阿貝(Abbe)折射計NAR-3T(ATAGO公司製造)測定。硬化物之透過率係使用分光光度計U-3500(日立高科技公司製造),於硬化物之厚度0.25mm、以波長400nm測定。 Moreover, the viscosity of the hardenable composition is a cone-plate type viscometer (cone/plate viscometer) DV-II+ (manufactured by Brookfield Co., Ltd.), measured at a temperature of 25 °C. The refractive index of the curable composition and the cured product (cured film) was measured using an Abbe refractometer NAR-3T (manufactured by ATAGO Co., Ltd.). The transmittance of the cured product was measured using a spectrophotometer U-3500 (manufactured by Hitachi High-Technologies Corporation) at a thickness of 0.25 mm and a wavelength of 400 nm.

首先,針對第一硬化性組成物之實施例,說明於下。 First, an embodiment of the first hardenable composition will be described below.

實施例1 Example 1

於300ml燒瓶中饋入4-巰基甲基-1,8-二巰基-3,6-二硫辛烷65g、二環己基甲基胺0.05g,充分攪拌。在室溫下分成數次緩慢滴加硫粉4.7g。添加硫粉時溶液變成黃色,產生氣體。氣體之產生變緩和後,邊使氮氣流經液面邊使溫度上升至60℃且持續攪拌3小時。隨著反應之進行,氣體幾乎不再產生,且溶液成為無色透明。以上述順序製作聚硫醇寡聚物。 Into a 300 ml flask, 65 g of 4-mercaptomethyl-1,8-dimercapto-3,6-dithiooctane and 0.05 g of dicyclohexylmethylamine were fed, and the mixture was thoroughly stirred. 4.7 g of sulfur powder was slowly added dropwise several times at room temperature. When the sulfur powder is added, the solution turns yellow and a gas is generated. After the generation of the gas was moderated, the nitrogen gas was passed through the liquid surface to raise the temperature to 60 ° C and stirring was continued for 3 hours. As the reaction progresses, the gas is almost no longer produced and the solution becomes colorless and transparent. A polythiol oligomer was produced in the above order.

使聚硫醇寡聚物冷卻至室溫後,添加異三聚氰酸三烯丙酯35g,攪拌直至均勻。以上述順序製作第一硬化性組成物。 After the polythiol oligomer was cooled to room temperature, 35 g of triallyl cyanurate was added and stirred until uniform. The first curable composition was produced in the above procedure.

對於第一硬化性組成物100重量份,添加1-羥基-環己基苯基酮3重量份,且攪拌直至均勻,並經減壓脫泡。以兩片經脫模處理之玻璃板將其夾持,自30cm之距離照射金屬鹵素燈(120W/cm)之光3分鐘後,自玻璃板剝離硬化膜。以上述順序製作厚度0.25mm之硬化膜。硬化性 組成物及硬化膜(硬化物)之物性如表1所示。 To 100 parts by weight of the first curable composition, 3 parts by weight of 1-hydroxy-cyclohexyl phenyl ketone was added, and stirred until uniform, and defoamed under reduced pressure. The two sheets were subjected to mold release treatment, and the light was irradiated from a metal halide lamp (120 W/cm) for 3 minutes from a distance of 30 cm, and then the cured film was peeled off from the glass plate. A cured film having a thickness of 0.25 mm was produced in the above procedure. Sclerosing The physical properties of the composition and the cured film (cured material) are shown in Table 1.

實施例2~5 Example 2~5

除將聚硫醇、硫及多烯化合物之種類及饋入量變更為表1所示之內容以外,與實施例1同樣地進行第一硬化性組成物及硬化物之製作。第一硬化性組成物及硬化膜(硬化物)之物性如表1所示。 The first curable composition and the cured product were produced in the same manner as in Example 1 except that the types and feed amounts of the polythiol, sulfur, and polyene compound were changed to those shown in Table 1. The physical properties of the first curable composition and the cured film (cured material) are shown in Table 1.

比較例1 Comparative example 1

於300ml燒瓶中饋入2,5-二巰基甲基-1,4-二硫雜環己烷55g及異三聚氰酸三烯丙酯45g,且攪拌直至均勻。以上述順序製作硬化性組成物。 55 g of 2,5-dimercaptomethyl-1,4-dithiane and 45 g of triallyl cyanurate were fed into a 300 ml flask and stirred until uniform. A curable composition was produced in the above procedure.

硬化膜之製作係與實施例1同樣進行。硬化性組成物及硬化物之物性如表2所示。又,與實施例比較,性能較差之值加註底線。 The production of the cured film was carried out in the same manner as in Example 1. The physical properties of the curable composition and the cured product are shown in Table 2. Also, compared with the embodiment, the value of the poor performance is added to the bottom line.

比較例2~4 Comparative example 2~4

除將硫醇化合物、乙烯性不飽和化合物之種類及饋入量變更為表2所示之內容以外,餘與比較例1同樣進行硬化性組成物及硬化物之製作。硬化性組成物及硬化物之物性如表2所示。又,與實施例比較,性能較差之值加註底線。 The curable composition and the cured product were produced in the same manner as in Comparative Example 1, except that the type and amount of the thiol compound and the ethylenically unsaturated compound were changed to those shown in Table 2. The physical properties of the curable composition and the cured product are shown in Table 2. Also, compared with the embodiment, the value of the poor performance is added to the bottom line.

表中簡寫之說明 Abbreviated description in the table

(a-1)4-巰基甲基-1,8-二巰基-3,6-二硫辛烷 (a-1) 4-mercaptomethyl-1,8-dimercapto-3,6-dithiooctane

(a-2)2,5-二巰基甲基-1,4-二硫雜環己烷 (a-2) 2,5-dimercaptomethyl-1,4-dithiane

(a-3)間-二甲苯二硫醇 (a-3) m-xylene dithiol

(a-4)1,5-二巰基-3-硫戊烷 (a-4) 1,5-dimercapto-3-thiopentane

(b-1)異三聚氰酸三烯丙酯 (b-1) Triallyl isocyanurate

(b-2)4,4’-雙(甲基丙烯醯硫基)二苯基硫醚 (b-2) 4,4'-bis(methacryloylthio)diphenyl sulfide

(b-3)偏苯三酸三烯丙酯 (b-3) Triallyl trimellitate

(b-4)2,2-雙(4-(丙烯醯氧基二乙氧基)苯基)丙烷 (b-4) 2,2-bis(4-(propylene decyloxydiethoxy)phenyl)propane

接著,針對第二硬化性組成物之實施例說明於下。 Next, an example of the second curable composition will be described below.

實施例6 Example 6

於300ml燒瓶中饋入2,5-二巰基甲基-1,4-二硫雜環己烷40g、三丁基胺0.05g,充分攪拌。在室溫下分成數次緩慢滴加硫粉6.0g。添加硫粉時溶液變成黃色,且產生氣體。氣體之產生變緩和後,邊使氮氣流經液面邊使溫度上升至60℃且持續攪拌3小時。隨著反應之進行,氣體幾乎不再產生,且溶液成為無色透明。以上述順序製作聚硫醇寡聚物。 40 g of 2,5-dimercaptomethyl-1,4-dithiane and 0.05 g of tributylamine were fed into a 300 ml flask and stirred well. 6.0 g of sulfur powder was slowly added dropwise several times at room temperature. When the sulfur powder is added, the solution turns yellow and a gas is generated. After the generation of the gas was moderated, the nitrogen gas was passed through the liquid surface to raise the temperature to 60 ° C and stirring was continued for 3 hours. As the reaction progresses, the gas is almost no longer produced and the solution becomes colorless and transparent. A polythiol oligomer was produced in the above order.

於該聚硫醇寡聚物(A成分)中添加雙(2,3-環硫丙基)硫醚60g(C成分)、以下述構造式(11)表示之光鹼產生劑0.2g(D成分)、及作為增感劑之4-苯甲醯基-4’-甲基二苯基硫醚1g,並攪拌直至均勻。 To the polythiol oligomer (component A), 60 g (component C) of bis(2,3-epoxythiopropyl) sulfide and 0.2 g of a photobase generator represented by the following structural formula (11) were added. Ingredients) and 1 g of 4-benzylidene-4'-methyldiphenyl sulfide as a sensitizer, and stirred until uniform.

以上述順序製作第二硬化性組成物。硬化性組成物之黏度為900 mPa.s(20℃)。且,在5℃下儲存一週後,硬化性組成物膠凝化。 The second curable composition was produced in the above procedure. The viscosity of the hardening composition is 900 mPa. s (20 ° C). Further, after storage for one week at 5 ° C, the curable composition gelatinized.

以經脫模處理之兩片玻璃板夾持硬化性組成物,自30cm之距離照射金屬鹵素燈(120W/cm)之光3分鐘後,自玻璃板剝離硬化之膜。以上述順序製作厚度0.25mm之硬化膜。 The hardened composition was sandwiched between two glass plates subjected to mold release treatment, and the light of the metal halide lamp (120 W/cm) was irradiated from a distance of 30 cm for 3 minutes, and then the hardened film was peeled off from the glass plate. A cured film having a thickness of 0.25 mm was produced in the above procedure.

第二硬化性組成物及硬化膜之物性如表3所示。 The physical properties of the second curable composition and the cured film are shown in Table 3.

實施例7 Example 7

於300ml燒瓶中饋入2,5-二巰基甲基-1,4-二氧雜環己烷40g、雙(2,3-環硫丙基)硫醚60g、甲基丙烯酸1,2,2,6,6-五甲基-4-哌啶酯0.1g,充分攪拌。在室溫下分成數次緩慢滴加硫粉6.0g。添加硫粉時溶液變成黃色,且產生氣體。氣體之產生緩和後,邊使氮氣流經液面邊使溫度上升至60℃且持續攪拌3小時。隨著反應之進行,氣體幾乎不再產生,且溶液成為無色透明。冷卻至室溫後,添加前述以構造式(11)表示之光鹼產生劑0.2g(D成分)、及作為增感劑之4-苯甲醯基-4’-甲基二苯基硫醚1g,攪拌直至均勻。以上述順序製作硬化性組成物。硬化性組成物之黏度為1,000 mPa.s(20℃)。且,在5℃儲存一週後之黏度為1,100 mPa.s(20℃)。 Feeding 4,5-dimercaptomethyl-1,4-dioxane 40 g, bis(2,3-epoxypropyl) sulfide 60 g, methacrylic acid 1,2,2 in a 300 ml flask , 6,6-pentamethyl-4-piperidinyl ester 0.1 g, and stirred well. 6.0 g of sulfur powder was slowly added dropwise several times at room temperature. When the sulfur powder is added, the solution turns yellow and a gas is generated. After the generation of the gas was moderated, the nitrogen gas was passed through the liquid surface to raise the temperature to 60 ° C and stirring was continued for 3 hours. As the reaction progresses, the gas is almost no longer produced and the solution becomes colorless and transparent. After cooling to room temperature, 0.2 g of the photobase generator represented by the above formula (11) (component D) and 4-benzylidene-4'-methyldiphenyl sulfide as a sensitizer were added. 1g, stir until uniform. A curable composition was produced in the above procedure. The viscosity of the hardening composition is 1,000 mPa. s (20 ° C). Moreover, the viscosity after storage for one week at 5 ° C is 1,100 mPa. s (20 ° C).

與實施例6同樣進行硬化物之製作。第二硬化性組成物及硬化膜之物性如表3所示。 Production of a cured product was carried out in the same manner as in Example 6. The physical properties of the second curable composition and the cured film are shown in Table 3.

實施例8~14 Example 8~14

除將硫醇化合物、硫及環硫化合物之種類及饋入量變 更為表3及表4所示之內容以外,餘與實施例7同樣,製作第二硬化性組成物及硬化物。第二硬化性組成物及硬化物之物性如表3及表4所示。 In addition to changing the type and feed amount of thiol compounds, sulfur and episulfide compounds Further, in the same manner as in Example 7, except for the contents shown in Tables 3 and 4, a second curable composition and a cured product were produced. The physical properties of the second curable composition and the cured product are shown in Tables 3 and 4.

比較例5 Comparative Example 5

添加雙(2,3-環硫丙基)硫醚100g、以前述構造式(9)表示之光鹼產生劑0.2g(D成分)、及作為增感劑之4-苯甲醯基-4’-甲基二苯基硫醚1g,且攪拌直至均勻。以上述順序製作硬化性組成物。 100 g of bis(2,3-epoxythio) sulfide, 0.2 g of a photobase generator represented by the above structural formula (9) (component D), and 4-benzylidene-4 as a sensitizer 1 g of '-methyldiphenyl sulfide, and stirred until uniform. A curable composition was produced in the above procedure.

與實施例6同樣製作硬化物。硬化性組成物及硬化物之物性如表5所示。又,與實施例比較,較差的物性加註底線。 A cured product was produced in the same manner as in Example 6. The physical properties of the curable composition and the cured product are shown in Table 5. Further, compared with the embodiment, the poor physical property is filled with the bottom line.

比較例6 Comparative Example 6

添加2,5-二巰基甲基-1,4-二硫雜環己烷20g、雙(2,3-環硫丙基)硫醚80g、以前述構造式(9)表示之光鹼產生劑0.2g(D成分)、及作為增感劑之4-苯甲醯基-4’-甲基二苯基硫醚1g,攪拌直至均勻。以上述順序製作硬化性組成物。 20 g of 2,5-dimercaptomethyl-1,4-dithiane, 80 g of bis(2,3-epoxythio) sulfide, and a photobase generator represented by the above structural formula (9) 0.2 g (component D) and 1 g of 4-benzylidene-4'-methyldiphenyl sulfide as a sensitizer were stirred until uniform. A curable composition was produced in the above procedure.

與實施例6同樣製作硬化物。硬化性組成物及硬化物之物性如表5所示。又,與實施例比較,較差的物性加註底線。 A cured product was produced in the same manner as in Example 6. The physical properties of the curable composition and the cured product are shown in Table 5. Further, compared with the embodiment, the poor physical property is filled with the bottom line.

表中簡寫之說明 Abbreviated description in the table

(a’-1)2,5-二巰基甲基-1,4-二硫雜環己烷 (a'-1) 2,5-dimercaptomethyl-1,4-dithiane

(a’-2)間-二甲苯二硫醇 (a'-2) m-xylenedithiol

(a’-3)1,5-二巰基-3-硫戊烷 (a'-3) 1,5-dimercapto-3-thiopentane

(b’-1)三丁基胺 (b'-1) tributylamine

(b’-2)甲基丙烯酸1,2,2,6,6-五甲基-4-哌啶酯 (b'-2) 1,2,2,6,6-pentamethyl-4-piperidinyl methacrylate

(c-1)雙(2,3-環硫丙基)硫醚 (c-1) bis(2,3-epoxypropyl) sulfide

Claims (9)

一種硬化性組成物,其含有使聚硫醇與硫反應獲得之聚硫醇寡聚物(A成分)及多烯化合物(B成分),或者含有使聚硫醇與硫反應獲得之聚硫醇寡聚物(A成分)、環硫化合物(C成分)及光鹼產生劑(D成分)。 A curable composition comprising a polythiol oligomer (component A) obtained by reacting a polythiol with sulfur and a polyene compound (component B), or a polythiol obtained by reacting a polythiol with sulfur An oligomer (component A), an episulfide compound (component C), and a photobase generator (component D). 如申請專利範圍第1項之硬化性組成物,其中聚硫醇為由以下述通式(1)、下述通式(2)及下述通式(3)所組成群組選出之一種以上, (式中,p1及p2各獨立表示0~1之整數,X1~X8各獨立表示氫原子或甲基硫醇基), (式中,q表示0~3之整數,R1表示僅為鍵結或碳數1~3之伸烷基), (式中,r表示0~3之整數,R2表示碳數1~3之伸烷基)。 The sclerosing composition of the first aspect of the invention, wherein the polythiol is one or more selected from the group consisting of the following general formula (1), the following general formula (2), and the following general formula (3); , (wherein, p1 and p2 each independently represent an integer of 0 to 1, and X 1 to X 8 each independently represent a hydrogen atom or a methylthiol group), (wherein q represents an integer from 0 to 3, and R 1 represents only a bond or a C 1 to 3 alkyl group), (wherein, r represents an integer of 0 to 3, and R 2 represents an alkylene group having 1 to 3 carbon atoms). 如申請專利範圍第1或2項之硬化性組成物,其中使聚硫醇與硫反應時之聚硫醇與硫之比率,相對於硫醇基1莫耳,硫原子為0.2~0.95莫耳之範圍。 The sclerosing composition of claim 1 or 2, wherein the ratio of the polythiol to sulfur when reacting the polythiol with sulfur is 0.2 to 0.95 mol per mol of the thiol group. The scope. 如申請專利範圍第1或2項之硬化性組成物,其中多烯化合物(B成分)為由異三聚氰酸三烯丙酯、三聚氰酸三烯丙酯、鄰苯二甲酸二烯丙酯、間苯二甲酸二烯丙酯、對苯二甲酸二烯丙酯、偏苯三酸三烯丙酯、均苯四酸四烯丙酯、以通式(4)表示之化合物、以通式(5)表示之化合物所組成群組選出之一種以上, (式中,X表示硫原子或磺醯基,Z表示(甲基)丙烯醯基、乙烯基、或烯丙基), (式中,m及n表示m與n之合計滿足0~4之整數,R3表示碳數1~5之伸烷基,R4表示氫原子或甲基,R5表示氫原子或甲基)。 A sclerosing composition according to claim 1 or 2, wherein the polyene compound (component B) is a triallyl cyanurate, a triallyl cyanurate or a diene phthalate. Propyl ester, diallyl isophthalate, diallyl terephthalate, triallyl trimellitate, tetraallyl pyromelliate, a compound represented by the formula (4), One or more selected from the group consisting of compounds represented by the formula (5), (wherein X represents a sulfur atom or a sulfonyl group, and Z represents a (meth)acryloyl group, a vinyl group, or an allyl group), (wherein m and n represent the total of m and n satisfy an integer of 0 to 4, R 3 represents an alkylene group having 1 to 5 carbon atoms, R 4 represents a hydrogen atom or a methyl group, and R 5 represents a hydrogen atom or a methyl group. ). 如申請專利範圍第1或2項之硬化性組成物,其係使用受阻胺作為聚硫醇與硫反應時之反應觸媒。 A sclerosing composition according to claim 1 or 2, which uses a hindered amine as a reaction catalyst for the reaction of a polythiol with sulfur. 如申請專利範圍第5項之硬化性組成物,其中受阻胺為具有2,2,6,6-四甲基哌啶骨架之化合物。 A sclerosing composition according to claim 5, wherein the hindered amine is a compound having a 2,2,6,6-tetramethylpiperidine skeleton. 如申請專利範圍第1或2項之硬化性組成物,其中環硫化合物(C成分)為以下述通式(8)表示之化合物, (式中,m為0至6之整數,n為0至4之整數,R3及R4各獨立表示氫原子或碳數1~10之烷基,R5、R6各獨立表示碳數1~10之伸烷基)。 The sclerosing composition according to claim 1 or 2, wherein the episulfide compound (component C) is a compound represented by the following formula (8), (wherein m is an integer of 0 to 6, n is an integer of 0 to 4, and R 3 and R 4 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R 5 and R 6 each independently represent a carbon number. 1~10 alkyl group). 如申請專利範圍第7項之硬化性組成物,其中以通式(8)表示之化合物為雙(2,3-環硫丙基)硫醚。 The sclerosing composition of claim 7, wherein the compound represented by the formula (8) is bis(2,3-epoxypropyl) sulfide. 一種光學用接著劑,其含有如申請專利範圍第1至8項中任一項之硬化性組成物。 An optical adhesive comprising the curable composition according to any one of claims 1 to 8.
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