TWI515233B - A hardening composition and an optical follower - Google Patents

A hardening composition and an optical follower Download PDF

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TWI515233B
TWI515233B TW101114702A TW101114702A TWI515233B TW I515233 B TWI515233 B TW I515233B TW 101114702 A TW101114702 A TW 101114702A TW 101114702 A TW101114702 A TW 101114702A TW I515233 B TWI515233 B TW I515233B
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TW201305251A (en
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Hitoshi Okazaki
Motoharu Takeuchi
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Mitsubishi Gas Chemical Co
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

Description

硬化性組成物及光學用接著劑 Curing composition and optical adhesive

本發明係關於可較好地作為製作複合光學元件時使用之光學用接著劑之硬化性組成物者。 The present invention relates to a curable composition which can be preferably used as an optical adhesive for use in producing a composite optical element.

以丙烯酸酯化合物等作為主成分之光硬化性組成物已廣泛使用作為製作光學元件時之接著劑。就接著劑而言,基本性能為接著性、硬化性、機械強度、耐久性、及光學特性,但近年來隨著光學元件之高功能化,折射率成為重要性能。尤其接著劑之高折射率化使光學設計之自由度變寬廣故有高期待。使用具有高折射率之接著劑之用途例,列舉為以兩片透鏡貼合構成之消色差透鏡(achromatic lens)、以玻璃與樹脂之複合構成之複合型非球面透鏡、雙色稜鏡(dichroic prism)等之具有複雜形狀之稜鏡等。該等用途中使用之接著劑不只要求高折色率,當然也要求密著性、光硬化性、無色透明性、適於作業之黏度之性能。 A photocurable composition containing an acrylate compound or the like as a main component has been widely used as an adhesive when an optical element is produced. In the case of the adhesive, the basic properties are adhesion, hardenability, mechanical strength, durability, and optical properties, but in recent years, as the optical element has been highly functionalized, the refractive index has become an important performance. In particular, the high refractive index of the adhesive agent has a high degree of freedom in optical design and is expected to be high. Examples of the use of an adhesive having a high refractive index include an achromatic lens formed by bonding two lenses, a composite aspheric lens composed of a composite of glass and resin, and a dichroic prism. ), etc. with complex shapes. The adhesive used in such applications requires not only a high color conversion ratio, but also adhesion, photocurability, colorless transparency, and workability to work.

至於具有高折射率之多官能(甲基)丙烯酸酯化合物,已知有9,9-雙(4-(2-丙烯醯氧基乙氧基)苯基)茀(以下稱為A-BPEF)(硬化物之折射率1.62),或4,4’-雙(甲基丙烯醯硫基)二苯基硫化物(以下稱為MPSMA)(硬化物之折射率1.69)等。然而,該等化合物在常溫下為固體,故難以單獨使用。 As the polyfunctional (meth) acrylate compound having a high refractive index, 9,9-bis(4-(2-propenyl methoxyethoxy)phenyl) fluorene (hereinafter referred to as A-BPEF) is known. (refractive index: 1.62), or 4,4'-bis(methacrylium sulfenyl)diphenyl sulfide (hereinafter referred to as MPSMA) (refractive index: 1.69). However, these compounds are solid at normal temperature and are therefore difficult to use alone.

又,一般之多官能(甲基)丙烯酸酯化合物隨著硬化 而收縮較大,於作為接著劑使用時會成為密著性降低之原因。另一方面,已知組合(甲基)丙烯酸酯化合物等乙烯性不飽和化合物與硫醇化合物之烯.硫醇組成物,隨著硬化之收縮小。 Also, the general polyfunctional (meth) acrylate compound hardens with The shrinkage is large, and when used as an adhesive, it causes a decrease in adhesion. On the other hand, it is known that a combination of an ethylenically unsaturated compound such as a (meth) acrylate compound and a thiol composition of a thiol compound is small in shrinkage with hardening.

專利文獻1中記載由A-BPEF、乙烯性不飽和化合物、及硫醇化合物構成之烯.硫醇組成物。以實施例說明時,硬化物之折射率高達1.58~1.61之範圍。 Patent Document 1 describes an ene thiol composition comprising A-BPEF, an ethylenically unsaturated compound, and a thiol compound. When demonstrated by the examples, the refractive index of the cured product is as high as 1.58 to 1.61.

專利文獻2中記載由MPSMA、乙烯系單體、及聚硫醇構成之烯.硫醇組成物。以實施例說明時,硬化物之折射率最高為1.649。然而,MPSMA容易變黃,且由於為固體故對組成物之溶解量有其界限。 Patent Document 2 describes an olefin composed of MPSMA, a vinyl monomer, and a polythiol. Mercaptan composition. When demonstrated by way of example, the cured product has a refractive index of up to 1.649. However, MPSMA tends to yellow, and because of its solidity, there is a limit to the amount of dissolution of the composition.

又,專利文獻3中記載由具有茀環之樹脂成分、MPSMA等之具有二苯基硫化物骨架之含硫化合物構成之樹脂組成物,且例示具有折射率1.724之樹脂。然而,該發明中之樹脂組成物實質上為混練具有茀環之聚酯與含硫化合物而成之熱可塑性樹脂,並非硬化性組成物,當然無法賦予光硬化性。 Further, Patent Document 3 describes a resin composition comprising a resin component having an anthracene ring and a sulfur-containing compound having a diphenyl sulfide skeleton such as MPSMA, and a resin having a refractive index of 1.724 is exemplified. However, the resin composition in the invention is a thermoplastic resin obtained by kneading a polyester having an anthracene ring and a sulfur-containing compound, and is not a curable composition, and of course, it cannot provide photocurability.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]特開2010-254732號公報 [Patent Document 1] JP-A-2010-254732

[專利文獻2]特開平03-021638號公報 [Patent Document 2] Japanese Patent Publication No. 03-021638

[專利文獻3]特開2005-187661號公報 [Patent Document 3] JP-A-2005-187661

據此,本發明之目的係提供一種具有高折射率,且亦兼具適於作業之黏度、低收縮性、無色透明性之作為光學用接著劑所要求之性能之硬化性組成物。 Accordingly, an object of the present invention is to provide a curable composition having a high refractive index and having properties required for an optical adhesive, which is suitable for work viscosity, low shrinkage, and colorless transparency.

本發明人等為解決上述課題而積極檢討之結果,發現含有使環硫化合物與硫醇化合物反應獲得之聚硫醇寡聚物(A成分)及乙烯性不飽和化合物(B成分)之硬化性組成物具有適合作為接著劑之作業性之黏度,且由於隨著硬化之收縮小,故適合作為光學用接著劑。基於以上見解,因而完成本發明。 The inventors of the present invention have found that the curable property of the polythiol oligomer (component A) and the ethylenically unsaturated compound (component B) obtained by reacting the episulfide compound with the thiol compound is found to be a result of a review. The composition has a workability which is suitable as an adhesive, and is suitable as an optical adhesive because it has a small shrinkage with hardening. Based on the above findings, the present invention has thus been completed.

依據本發明,可提供一種具有高折射率,且亦兼具適於作業之黏度、低收縮性、無色透明性之作為光學用接著劑之性能之硬化性組成物。 According to the present invention, it is possible to provide a curable composition having high refractive index and also having properties suitable for optical adhesives, such as viscosity, low shrinkage, and colorless transparency.

本發明之硬化性組成物係以含有使環硫化合物與硫醇化合物反應獲得之聚硫醇寡聚物(A成分)及乙烯性不飽和化合物(B成分)而成之構成。 The curable composition of the present invention comprises a polythiol oligomer (component A) obtained by reacting an episulfide compound with a thiol compound, and an ethylenically unsaturated compound (component B).

首先,針對聚硫醇寡聚物(A成分)之製造方法加以 說明。 First, the method for producing a polythiol oligomer (component A) is Description.

作為聚硫醇寡聚物之原料之環硫化合物為一分子中具有一個以上環硫基之化合物。尤其,追求硬化性組成物之高折射率化及交聯性時,較好以下述通式(1)表示之化合物。 The episulfide compound which is a raw material of the polythiol oligomer is a compound having one or more episulfide groups in one molecule. In particular, when the high refractive index and crosslinkability of the curable composition are desired, the compound represented by the following formula (1) is preferred.

(式中,m為0至6之整數,n為0至4之整數,R1及R2各獨立為氫原子或碳數1~10之烷基,R3及R4各獨立為碳數1~10之伸烷基)。以通式(1)表示之化合物之例列舉為雙(2,3-環硫丙基)硫化物等。 (wherein m is an integer of 0 to 6, n is an integer of 0 to 4, and R 1 and R 2 are each independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R 3 and R 4 are each independently a carbon number. 1~10 alkyl group). Examples of the compound represented by the formula (1) are bis(2,3-epoxythio) sulfides and the like.

作為聚硫醇寡聚物之原料之硫醇化合物為一分子中具有一個以上硫醇基之化合物,可為直鏈狀、分支鏈狀、環狀之任一種,較好為一分子中具有兩個以上之硫醇基之聚硫醇化合物。 The thiol compound as a raw material of the polythiol oligomer is a compound having one or more thiol groups in one molecule, and may be any of a linear chain, a branched chain, and a cyclic group, and preferably has two molecules in one molecule. More than one thiol group polythiol compound.

尤其,追求硬化性組成物之高折射率化與適於作業性之黏度時,較好為以下述通式(2)至(4)表示之聚硫醇化合物。 In particular, when the high refractive index of the curable composition and the viscosity suitable for workability are desired, the polythiol compound represented by the following general formulae (2) to (4) is preferred.

(式中,p1及p2各獨立表示0~1之整數,X1~X8各獨立表示氫原子或甲基硫醇基), (式中,q表示0~3之整數,R5表示僅為鍵或碳數1~3之伸烷基), (式中,r表示0~3之整數,R6表示碳數1~3之伸烷基)。 (wherein, p1 and p2 each independently represent an integer of 0 to 1, and X 1 to X 8 each independently represent a hydrogen atom or a methylthiol group), (wherein q represents an integer from 0 to 3, and R 5 represents only a bond or an alkyl group having 1 to 3 carbon atoms), (wherein, r represents an integer of 0 to 3, and R 6 represents an alkylene group having 1 to 3 carbon atoms).

以通式(2)表示之化合物之例列舉為1,5-二巰基-3-硫戊烷、2-巰基甲基-1,5-二巰基-3-硫戊烷、2,4-雙(巰基甲基)-1,5-二巰基-3-硫戊烷、4-巰基甲基-1,8-二巰基-3,6-二硫辛烷、4,8-雙(巰基甲基)-1,11-二巰基-3,6,9-三硫十一烷、4,7-雙(巰基甲基)-1,11-二巰基-3,6,9-三硫十一烷、5,7-雙(巰基甲基)-1,11-二巰基-3,6,9-三硫十一烷等,以通式(3)表示之化合物之例列舉為2,5-二巰基-1,4-二硫雜環己烷、2,5-二巰基甲基-1,4-二硫雜環己烷、2,5-二巰基乙基-1,4-二硫雜環己烷等,以通式(4)表示之化合物之例列舉為二甲苯二硫醇等。以通式(2)至(4 )表示之化合物以外之聚硫醇化合物列舉為乙二醇雙(3-巰基丙酸酯)、三羥甲基丙烷參(3-巰基丙酸酯)、季戊四醇肆(3-巰基丙酸酯)、苯二硫醇、甲苯二硫醇等。 Examples of the compound represented by the formula (2) are 1,5-dimercapto-3-thiopentane, 2-mercaptomethyl-1,5-dimercapto-3-thiopentane, 2,4-double. (mercaptomethyl)-1,5-diamidino-3-thiopentane, 4-mercaptomethyl-1,8-dimercapto-3,6-dithiooctane, 4,8-bis(decylmethyl) )-1,11-dimercapto-3,6,9-trithioundecane, 4,7-bis(indolylmethyl)-1,11-dimercapto-3,6,9-trithioundecane 5,7-bis(decylmethyl)-1,11-dimercapto-3,6,9-trithioundecane, etc., and the compound represented by the formula (3) is exemplified as 2,5-di Mercapto-1,4-dithiane, 2,5-dimercaptomethyl-1,4-dithiane, 2,5-dimercaptoethyl-1,4-disulfide Examples of the compound represented by the formula (4) such as hexane are exemplified by xylene dithiol or the like. By the general formula (2) to (4 The polythiol compound other than the compound represented by the formula is exemplified by ethylene glycol bis(3-mercaptopropionate), trimethylolpropane ginseng (3-mercaptopropionate), pentaerythritol bismuth (3-mercaptopropionate) , phenyldithiol, toluene dithiol, and the like.

環硫化合物與硫醇化合物之反應,於例如產物為二聚物時,主要係依循下述反應式進行, (式中,R及R’表示有機基,a及b表示0以上之整數)。 The reaction of the episulfide compound with the thiol compound, for example, when the product is a dimer, is mainly carried out according to the following reaction formula. (wherein R and R' represent an organic group, and a and b represent an integer of 0 or more).

環硫基與硫醇基反應生成二級硫醇基。環硫化合物與硫醇化合物之混合比相對於環硫基1莫耳,硫醇基較好為1.0~2.0莫耳之範圍。未達1.0莫耳會殘留未反應之環硫基而不佳,超過2.0莫耳時所得聚硫醇寡聚物之黏度降低而不佳。 The thiol group reacts with a thiol group to form a secondary thiol group. The mixing ratio of the episulfide compound to the thiol compound is preferably in the range of 1.0 to 2.0 mol per mol of the thiol group. It is not preferable that the unreacted episulfide group remains after less than 1.0 mol, and the viscosity of the obtained polythiol oligomer exceeds 2.0 mol.

環硫化合物與硫醇化合物之反應係在觸媒之存在下或不存在下藉由加熱進行,但以使用觸媒之方法較佳。觸媒較好為鹼性化合物,胺、銨鹽、膦、鏻鹽等。觸媒之使用量相對於環硫化合物與硫醇化合物之合計量100重量份,較好為0.005~5重量份之範圍,更好為0.05~0.5重量份之範圍。 The reaction of the episulfide compound with the thiol compound is carried out by heating in the presence or absence of a catalyst, but a method using a catalyst is preferred. The catalyst is preferably a basic compound, an amine, an ammonium salt, a phosphine or a phosphonium salt. The amount of the catalyst used is preferably from 0.005 to 5 parts by weight, more preferably from 0.05 to 0.5 parts by weight, per 100 parts by weight of the total of the episulfide compound and the thiol compound.

環硫化合物與硫醇化合物之反應在乙烯性不飽和化合物(B成分)之存在下進行亦無妨。另外,亦可視需要使用溶劑。使用溶劑時餾除溶劑之後續步驟為必要。反應溫 度並無特別限制,較好為0~100℃之範圍,亦可邊觀察反應進行狀況邊緩慢提高溫度。由於反應時間係依據原料之種類、環硫化合物與硫醇化合物之混合比、反應溫度等各種條件而定,故無法一概規定,但較好為30分鐘~24小時之範圍。 The reaction of the episulfide compound with the thiol compound may be carried out in the presence of an ethylenically unsaturated compound (component B). In addition, solvents may also be used as needed. The subsequent step of distilling off the solvent when using a solvent is necessary. Reaction temperature The degree is not particularly limited, and is preferably in the range of 0 to 100 ° C, and the temperature can be slowly increased while observing the progress of the reaction. Since the reaction time is determined depending on the kind of the raw material, the mixing ratio of the episulfide compound and the thiol compound, and the reaction temperature, it cannot be specified, but it is preferably in the range of 30 minutes to 24 hours.

接著,針對本發明之硬化性組成物加以說明。 Next, the curable composition of the present invention will be described.

本發明之硬化性組成物係以含有前述聚硫醇寡聚物(A成分)及乙烯性不飽和化合物(B成分)而成之構成。 The curable composition of the present invention comprises a polythiol oligomer (component A) and an ethylenically unsaturated compound (component B).

所謂乙烯性不飽和化合物(B成分)為一分子中具有兩個以上乙烯性不飽和鍵之化合物,至於乙烯性不飽和鍵基列舉為丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基等。尤其,追求硬化性組成物之高折射率化時,較好為分子內具有芳香環或雜環之化合物,至於該種化合物之例列舉為異氰脲酸三烯丙酯、氰脲酸三烯丙酯、鄰苯二甲酸二烯丙酯、間苯二甲酸二烯丙酯、對苯二甲酸二烯丙酯、偏苯三酸三烯丙酯、均苯四酸四烯丙酯、以通式(5)表示之化合物、以通式(6)表示之化合物等。 The ethylenically unsaturated compound (component B) is a compound having two or more ethylenically unsaturated bonds in one molecule, and the ethylenically unsaturated bond group is exemplified by an acryloyl group, a methacryloyl group, a vinyl group, an allylic group. Base. In particular, when purifying the high refractive index of the curable composition, it is preferably a compound having an aromatic ring or a hetero ring in the molecule, and examples of the compound are triallyl isocyanurate and cyanuric acid triene. Propyl ester, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, triallyl trimellitate, tetraallyl pyromelliate, A compound represented by the formula (5), a compound represented by the formula (6), and the like.

(式中,X表示硫原子或磺醯基,Z表示(甲基)丙烯醯基、乙烯基或烯丙基)。 (wherein X represents a sulfur atom or a sulfonyl group, and Z represents a (meth)acryloyl group, a vinyl group or an allyl group).

(式中,s及t表示s與t之合計滿足0~4之整數,R7表示碳數1~5之伸烷基,R8表示氫原子或甲基,R9表示氫原子或甲基)。 (wherein s and t represent the total of s and t satisfy an integer of 0 to 4, R 7 represents an alkylene group having 1 to 5 carbon atoms, R 8 represents a hydrogen atom or a methyl group, and R 9 represents a hydrogen atom or a methyl group. ).

以通式(5)表示之化合物之例列舉為4,4’-雙(甲基丙烯醯硫基)二苯基硫化物、4,4’-雙(甲基丙烯醯硫基)二苯基碸等。以通式(6)表示之化合物列舉為9,9-(4-(2-丙烯醯氧基乙氧基)苯基)茀等。 Examples of the compound represented by the formula (5) are 4,4'-bis(methacrylium sulfenyl)diphenyl sulfide and 4,4'-bis(methacrylium sulfenyl)diphenyl. Hey. The compound represented by the formula (6) is exemplified by 9,9-(4-(2-propenyloxyethoxy)phenyl)anthracene or the like.

A成分與B成分之調配比,相對於B成分中所含之乙烯性不飽和鍵基1莫耳,A成分中之硫醇基較好為0.5~1.5莫耳之範圍,更好為0.8~1.2莫耳之範圍。未達0.5莫耳時A成分之效果少而不實用,超過1.5莫耳時硬化時容易殘留未反應之硫醇基故不佳。又,由前述環硫化合物與硫醇化合物之反應式可了解,A成分中之硫醇基之總量係與聚硫醇寡聚物之作為原料使用之硫醇化合物中所含硫醇基之總量相同。 The blending ratio of the component A to the component B is 1 molar with respect to the ethylenically unsaturated bond group contained in the component B, and the thiol group in the component A is preferably in the range of 0.5 to 1.5 mol, more preferably 0.8. 1.2 The scope of Moh. When the amount of the component A is less than 0.5 mol, the effect of the component A is small and it is not practical, and when it exceeds 1.5 mol, the unreacted thiol group tends to remain, which is not preferable. Further, it is understood from the reaction formula of the above-mentioned episulfide compound and the thiol compound that the total amount of the thiol group in the component A is the thiol group contained in the thiol compound used as the raw material of the polythiol oligomer. The total amount is the same.

本發明之硬化性組成物係在硬化觸媒之存在下或不存在下,以加熱聚合硬化。較佳之方法列舉為使用硬化觸媒之方法,至於硬化觸媒為產生有機過氧化物或偶氮化合物等游離自由基之化合物,或胺或膦等之鹼性化合物。硬化 觸媒之添加量,相對於硬化性組成物100重量份,較好為0.001~5重量份之範圍,更好為0.01~1重量份之範圍。聚合溫度較好為0~150℃之範圍,更好為20~120℃之範圍,緩慢提高溫度亦可。聚合時間係隨聚硫醇化合物與烯化合物之調配比、硬化觸媒之種類及添加量、硬化性組成物之重量、聚合溫度等各種條件而定而無法一概而論,但較好為10分鐘~50小時之範圍,更好為30分鐘~24小時之範圍。 The curable composition of the present invention is cured by heating under the presence or absence of a curing catalyst. The preferred method is exemplified by a method of using a curing catalyst, and the curing catalyst is a compound which generates a free radical such as an organic peroxide or an azo compound, or a basic compound such as an amine or a phosphine. hardening The amount of the catalyst added is preferably in the range of 0.001 to 5 parts by weight, more preferably 0.01 to 1 part by weight, based on 100 parts by weight of the curable composition. The polymerization temperature is preferably in the range of 0 to 150 ° C, more preferably in the range of 20 to 120 ° C, and the temperature may be slowly increased. The polymerization time is not related to various conditions such as the blending ratio of the polythiol compound and the olefinic compound, the type and amount of the curing catalyst, the weight of the curable composition, and the polymerization temperature, but it is preferably from 10 minutes to 50 minutes. The range of hours is preferably in the range of 30 minutes to 24 hours.

本發明之硬化性組成物係藉由在自由基系光聚合起始劑存在下,照射紫外光或可見光等活性光線而硬化。所謂自由基系光聚合起始劑只要是藉由光分解而生成活性之游離自由基者即無特別限制。該種化合物之具體例列舉為2,2-甲氧基-1,2-二苯基乙烷-1-酮、1-羥基-環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲胺基-1-(4-嗎啉基苯基)-1-丁酮、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基-二苯基-氧化膦等。自由基系光聚合起始劑可單獨使用亦可混合兩種以上使用均無妨。其含量並無特別限制,但相對於硬化性組成物100重量份,較好為0.1~10重量份之範圍,更好為0.5~5重量份之範圍。 The curable composition of the present invention is cured by irradiation with active light such as ultraviolet light or visible light in the presence of a radical photopolymerization initiator. The radical photopolymerization initiator is not particularly limited as long as it is free radical which generates activity by photolysis. Specific examples of such a compound are exemplified by 2,2-methoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl phenyl ketone, and 2-hydroxy-2-methyl-1. -Phenylpropan-1-one, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylpropan-1-one, 2-benzyl-2-dimethylamino 1-(4-morpholinylphenyl)-1-butanone, bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide, 2,4,6-trimethylbenzene Mercapto-diphenyl-phosphine oxide and the like. The radical photopolymerization initiator may be used singly or in combination of two or more. The content thereof is not particularly limited, but is preferably in the range of 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight, per 100 parts by weight of the curable composition.

本發明之硬化性組成物可視需要添加聚合禁止劑、抗氧化劑、光安定劑(HALS)、紫外線吸收劑、矽烷偶合劑、脫模劑、顏料、染料等。 The curable composition of the present invention may optionally contain a polymerization inhibitor, an antioxidant, a light stabilizer (HALS), an ultraviolet absorber, a decane coupling agent, a release agent, a pigment, a dye, and the like.

關於硬化性組成物之黏度,於預定作為接著劑使用時,黏度太低時,接著劑會垂流,貼合時會與被黏著體偏移故較不佳。且,黏度太高時,接著劑難以噴出或塗佈,於貼合時會夾帶氣泡故不佳。本發明中所謂適於作業性之黏度亦隨塗佈方法或貼合方法之接著劑使用形態而定,故無法一概規定,但較好為500~10,000mPa.s之範圍。 Regarding the viscosity of the curable composition, when it is intended to be used as an adhesive, when the viscosity is too low, the adhesive will sag, and it will be inferior to the adherend when it is bonded. Further, when the viscosity is too high, it is difficult for the adhesive to be sprayed or applied, and it is not preferable to entrain air bubbles at the time of bonding. The viscosity suitable for workability in the present invention is also determined depending on the form of use of the adhesive method of the coating method or the bonding method, and therefore cannot be specified, but is preferably 500 to 10,000 mPa. The range of s.

[實施例] [Examples]

以下以實施例具體說明本發明,但本發明並不限於該等。又,實施例中之硬化收縮率係依據下述計算式,自硬化前後之折射率算出。 The invention will be specifically described below by way of examples, but the invention is not limited thereto. Further, the curing shrinkage ratio in the examples was calculated from the refractive index before and after curing according to the following calculation formula.

X=(1-d1/d2)×100[%] X=(1-d1/d2)×100[%]

R=(n2-1)/(n2+2)×M/d R=(n 2 -1)/(n 2 +2)×M/d

硬化前後之R/M為一定,故由以上二式,X=[1-{(n12-1)/(n12+2)}/{(n22-1)/(n22+2)}]×100[%](式中,X表示硬化收縮率,d表示比重,d1表示硬化前之比重,d2表示硬化後之比重,R表示分子折射,n表示折射率,n1表示硬化前之折射率,n2表示硬化後之折射率,M表示分子量)。 The R/M before and after hardening is constant, so from the above two formula, X=[1-{(n1 2 -1)/(n1 2 +2)}/{(n2 2 -1)/(n2 2 +2) }]×100[%] (wherein X represents the hardening shrinkage ratio, d represents the specific gravity, d1 represents the specific gravity before hardening, d2 represents the specific gravity after hardening, R represents molecular refraction, n represents refractive index, and n1 represents before hardening. The refractive index, n2 represents the refractive index after hardening, and M represents the molecular weight).

且,硬化性組成物之黏度係使用錐/板型黏度計(cone/plate viscometer)DV-II+(Brookfield公司製造),在溫度25℃下測定。硬化性組成物及硬化膜之折射率係使用阿貝(Abbe)折射計NAR-3T(ATAGO公司製造)測定。硬化膜之透過率係使用分光光度計U-3500(日立高科技公司 製造),於硬化物之厚度0.25mm、以波長400nm測定。 Further, the viscosity of the curable composition was measured at a temperature of 25 ° C using a cone/plate viscometer DV-II+ (manufactured by Brookfield). The refractive index of the curable composition and the cured film was measured using an Abbe refractometer NAR-3T (manufactured by ATAGO Co., Ltd.). The transmittance of the cured film is based on the spectrophotometer U-3500 (Hitachi High-Tech Co., Ltd. Manufactured), measured at a wavelength of 400 nm at a thickness of 0.25 mm of the cured product.

實施例1 Example 1

於300ml燒瓶中,饋入雙(2,3-環硫丙基)硫化物28g、1,5-二巰基-3-硫戊烷35g、及二環己基甲胺0.5g,在60℃持續攪拌24小時。以上述順序製作聚硫醇寡聚物。 In a 300 ml flask, 28 g of bis(2,3-epoxypropyl) sulfide, 35 g of 1,5-diamidino-3-thiopentane, and 0.5 g of dicyclohexylmethylamine were fed, and stirring was continued at 60 ° C. 24 hours. A polythiol oligomer was produced in the above order.

於該等中添加異氰脲酸三烯丙酯37g,攪拌至均勻。以上述順序製作硬化性組成物。 37 g of triallyl isocyanurate was added to the mixture, and the mixture was stirred until homogeneous. A curable composition was produced in the above procedure.

對於硬化性組成物100重量份,添加1-羥基-環己基苯基酮3重量份,且攪拌直至均勻,並經減壓脫泡。以兩片經脫模處理之玻璃板將其夾持,自30cm之距離照射金屬鹵素燈(120W/cm)之光3分鐘後,自玻璃板剝離硬化膜。以上述順序製作厚度0.25mm之硬化膜。硬化性組成物及硬化膜之物性如表1所示。 To 100 parts by weight of the curable composition, 3 parts by weight of 1-hydroxy-cyclohexyl phenyl ketone was added, and stirred until uniform, and defoamed under reduced pressure. The two sheets were subjected to mold release treatment, and the light was irradiated from a metal halide lamp (120 W/cm) for 3 minutes from a distance of 30 cm, and then the cured film was peeled off from the glass plate. A cured film having a thickness of 0.25 mm was produced in the above procedure. The physical properties of the curable composition and the cured film are shown in Table 1.

實施例2 Example 2

於300ml燒瓶中,饋入雙(2,3-環硫丙基)硫化物33g、1,5-二巰基-3-硫戊烷33g、異氰脲酸三烯丙酯34g、及二環己基甲胺0.5g,在60℃持續攪拌24小時。以上述順序製作硬化性組成物。 In a 300 ml flask, 33 g of bis(2,3-epoxypropyl) sulfide, 33 g of 1,5-dimercapto-3-thiopentane, 34 g of triallyl isocyanurate, and dicyclohexyl group were fed. Methylamine 0.5 g was continuously stirred at 60 ° C for 24 hours. A curable composition was produced in the above procedure.

硬化膜之製作係與實施例1同樣進行。硬化性組成物及硬化膜之物性如表1所示。 The production of the cured film was carried out in the same manner as in Example 1. The physical properties of the curable composition and the cured film are shown in Table 1.

實施例3~8 Example 3~8

除將環硫化合物、聚硫醇化合物及乙烯性不飽和化合物之種類及饋入量變更為表1所示之內容以外,與實施例2同樣地進行硬化性組成物及硬化膜之製作。硬化性組成物及硬化膜之物性如表1所示。 The curable composition and the cured film were produced in the same manner as in Example 2 except that the types and feed amounts of the episulfide compound, the polythiol compound, and the ethylenically unsaturated compound were changed to those shown in Table 1. The physical properties of the curable composition and the cured film are shown in Table 1.

比較例1 Comparative example 1

於300ml燒瓶中饋入2,5-二巰基甲基-1,4-二硫雜環己烷55g及異氰脲酸三烯丙酯45g,且攪拌直至均勻。以上述順序製作硬化性組成物。 55 g of 2,5-dimercaptomethyl-1,4-dithiane and 45 g of triallyl isocyanurate were fed into a 300 ml flask and stirred until uniform. A curable composition was produced in the above procedure.

與實施例1同樣製作硬化膜。硬化性組成物及硬化膜之物性如表2所示。又,與實施例比較,性能較差之值加註底線。 A cured film was produced in the same manner as in Example 1. The physical properties of the curable composition and the cured film are shown in Table 2. Also, compared with the embodiment, the value of the poor performance is added to the bottom line.

比較例2~4 Comparative example 2~4

除將硫醇化合物、乙烯性不飽和化合物之種類及饋入量變更為表2所示之內容以外,餘與比較例1同樣進行硬化性組成物及硬化膜之製作。硬化性組成物及硬化膜之物性如表2所示。又,與實施例比較,性能較差之值加註底線。 The curable composition and the cured film were produced in the same manner as in Comparative Example 1, except that the type and the amount of the thiol compound and the ethylenically unsaturated compound were changed to those shown in Table 2. The physical properties of the curable composition and the cured film are shown in Table 2. Also, compared with the embodiment, the value of the poor performance is added to the bottom line.

表中簡寫之說明 Abbreviated description in the table

(a-1) 雙(2,3-環硫丙基)硫化物 (a-1) bis(2,3-epoxypropyl) sulfide

(b-1) 1,5-二巰基-3-硫戊烷 (b-1) 1,5-dimercapto-3-thiopentane

(b-2) 2,5-二巰基甲基-1,4-二硫雜環己烷 (b-2) 2,5-Dimercaptomethyl-1,4-dithiane

(b-3) 間-二甲苯二硫醇 (b-3) m-xylene dithiol

(c-1) 異氰脲酸三烯丙酯 (c-1) triallyl isocyanurate

(c-2) 偏苯三酸三烯丙酯 (c-2) Triallyl trimellitate

(c-3) 苯二甲酸二烯丙酯 (c-3) diallyl phthalate

(c-4) 4,4’-雙(甲基丙烯醯硫基)二苯基硫化物 (c-4) 4,4'-bis(methacryloylthio)diphenyl sulfide

(c-5) 2,2-雙(4-(丙烯醯氧基二乙氧基)苯基)丙烷 (c-5) 2,2-bis(4-(propylene decyloxydiethoxy)phenyl)propane

Claims (6)

一種硬化性組成物,其含有使環硫化合物與硫醇化合物反應獲得之聚硫醇寡聚物(A成分)、及乙烯性不飽和化合物(B成分),前述乙烯性不飽和化合物(B成分)為由異氰脲酸三烯丙酯、氰脲酸三烯丙酯、鄰苯二甲酸二烯丙酯、間苯二甲酸二烯丙酯、對苯二甲酸二烯丙酯、偏苯三酸三烯丙酯、均苯四酸四烯丙酯、以通式(5)表示之化合物及以通式(6)表示之化合物所組成群組選出之一種以上, (式中,X表示硫原子或磺醯基,Z表示(甲基)丙烯醯基、乙烯基、或烯丙基), (式中,s及t係表示s與t之合計滿足0~4之整數,R7表示碳數1~5之伸烷基,R8表示氫原子或甲基,R9表示氫原子或甲基)。 A curable composition comprising a polythiol oligomer (component A) obtained by reacting an episulfide compound with a thiol compound, and an ethylenically unsaturated compound (component B), and the ethylenically unsaturated compound (component B) ) is a triallyl isocyanurate, triallyl cyanurate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, trimellitate One or more selected from the group consisting of a triallyl allyl ester, a tetraallyl pyromelliate, a compound represented by the formula (5), and a compound represented by the formula (6), (wherein X represents a sulfur atom or a sulfonyl group, and Z represents a (meth)acryloyl group, a vinyl group, or an allyl group), (wherein s and t represent that the sum of s and t satisfies an integer of 0 to 4, R 7 represents an alkylene group having 1 to 5 carbon atoms, R 8 represents a hydrogen atom or a methyl group, and R 9 represents a hydrogen atom or a group. base). 如申請專利範圍第1項之硬化性組成物,其中環硫化合物為以下述通式(1)表示之化合物, (式中,m為0至6之整數,n為0至4之整數,R1及R2各獨立表示氫原子或碳數1~10之烷基,R3及R4各獨立表示碳數1~10之伸烷基)。 The sclerosing composition of claim 1, wherein the episulfide compound is a compound represented by the following formula (1), (wherein m is an integer of 0 to 6, n is an integer of 0 to 4, and R 1 and R 2 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R 3 and R 4 each independently represent a carbon number. 1~10 alkyl group). 如申請專利範圍第2項之硬化性組成物,其中以通式(1)表示之化合物為雙(2,3-環硫丙基)硫化物。 A sclerosing composition according to claim 2, wherein the compound represented by the formula (1) is bis(2,3-epoxypropyl) sulfide. 如申請專利範圍第1至3項中任一項之硬化性組成物,其中硫醇化合物為由下述通式(2)、通式(3)、通式(4)表示之化合物所組成群組選出, (式中,p1及p2各獨立表示0~1之整數,X1~X8各獨立表示氫原子或甲基硫醇基), (式中,q表示0~3之整數,R5表示僅為鍵或碳數1~3之伸烷基), (式中,r表示0~3之整數,R6表示碳數1~3之伸烷基)。 The sclerosing composition according to any one of claims 1 to 3, wherein the thiol compound is a group consisting of a compound represented by the following formula (2), formula (3), and formula (4) Group selected, (wherein, p1 and p2 each independently represent an integer of 0 to 1, and X 1 to X 8 each independently represent a hydrogen atom or a methylthiol group), (wherein q represents an integer from 0 to 3, and R 5 represents only a bond or an alkyl group having 1 to 3 carbon atoms), (wherein, r represents an integer of 0 to 3, and R 6 represents an alkylene group having 1 to 3 carbon atoms). 如申請專利範圍第1至3項中任一項之硬化性組成物,其中聚硫醇寡聚物(A成分)與乙烯性不飽和化合物(B成分)之調配比,相對於B成分中之乙烯性不飽和鍵結基1莫耳,A成分中之硫醇基為0.5~1.5莫耳之範圍。 The curable composition according to any one of claims 1 to 3, wherein a blend ratio of the polythiol oligomer (component A) to the ethylenically unsaturated compound (component B) is relative to the component B The ethylenically unsaturated bonding group is 1 mol, and the thiol group in the component A is in the range of 0.5 to 1.5 mol. 一種光學用接著劑,其含有如申請專利範圍第1至3項中任一項之硬化性組成物。 An optical adhesive comprising the curable composition according to any one of claims 1 to 3.
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