TWI512347B - Optical-electro circuit board, optical component and manufacturing method thereof - Google Patents

Description

Photoelectric circuit board, optical component and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an optoelectronic circuit board, and more particularly to an optical component for use in an optoelectronic circuit board and a method of fabricating the same.

In recent years, with the development of the technology industry, electronic products such as notebook computers (NBs), tablet computers, and smart phones have frequently appeared in daily life. The types and functions of electronic products are becoming more and more diverse, so circuit boards used in electronic products have also become an important role in related technologies. In addition, in order to increase the application of the circuit board, the circuit board can also be designed as a multi-layer circuit board according to requirements to increase the space for wiring layout inside, and many different kinds of electronic components, such as connectors, wafers or optoelectronic components. It can be configured on a multi-layer circuit board according to requirements to increase its use function.

For example, a multi-layer circuit board in which a photovoltaic element is disposed, please refer to FIG. 1, which is a schematic view of a conventional photovoltaic circuit board. The optoelectronic circuit board 10 of FIG. 1 includes many The layer wiring board 12, and the two wafers 14a and 14b, the optical waveguide element 16, and the two photovoltaic elements 18a and 18b are respectively disposed on the multilayer wiring board 12 or embedded in the multilayer wiring board 12. Specifically, the wafers 14a and 14b are disposed on the surface of the multilayer wiring board 12, and the photovoltaic elements 18a and 18b are buried in the multilayer wiring board 12, and are connected to the wafers 14a and 14b, respectively. Further, the optical waveguide element 16 is embedded in the multilayer wiring board 12, and the opposite ends of the core of the optical waveguide element 16 are cut into a 45-degree bevel in which the photovoltaic elements 18a and 18b are positioned above the optical waveguide element 16. And facing the two slopes of the core layer of the optical waveguide component 16, respectively. Thus, the wafer 14a can provide an electrical signal to the optoelectronic component 18a to drive the optoelectronic component 18a to convert the electrical signal into light, while the optoelectronic component 18a positioned above the optical waveguide component 16 provides light downwardly to the optical waveguide component 16. Thereafter, the light is converted into a horizontal transmission path by the slope of the optical waveguide element 16, and after being transmitted to the other slope of the optical waveguide element 16, the transmission path is again converted by the slope and transmitted upward to the optical waveguide element 16 The upper optoelectronic component 18b (as shown in Figure 1 arrow). Thus, the photovoltaic element 18b receives the light transmitted by the optical waveguide element 16 and converts the light into an electrical signal, so that the wafer 14b receives the electrical signal.

In order for the photovoltaic circuit board 10 to have the above-described photoelectric conversion effect, the wafers 14a and 14b, the optical waveguide element 16, and the photovoltaic elements 18a and 18b are disposed on the multilayer wiring board 12, so that the surface layout space of the photovoltaic circuit board 10 is required. Larger, the size of the optoelectronic circuit board 10 must be limited by the position of the above components. Further, in the photoelectric conversion action described above, the light transmission of the optical waveguide element 16 and the photovoltaic elements 18a and 18b depends on the slope of the optical waveguide element 16 to switch the transmission path, so that the energy of the light is easily generated in the process of transmitting and converting the path. Loss, and optical waveguide components The surface accuracy of the bevel used to convert the light path also affects the efficiency of light transmission, which in turn reduces the optical efficiency of the optoelectronic circuit board.

The present invention provides an optical component and a method of fabricating the same that can reduce optical energy loss and have good optical efficiency.

The present invention provides an optoelectronic circuit board which can reduce optical energy loss and has good optical efficiency and can reduce the space required for surface layout.

The manufacturing method of the optical component of the present invention comprises the steps of: providing a multi-layer substrate comprising at least one dielectric layer, at least two circuit layers, and two through holes penetrating through the dielectric layer, wherein the circuit layers are respectively disposed on the opposite sides of the dielectric layer Both surfaces. An optical waveguide element is formed on a surface of the multilayer substrate and located between the through holes. Two optoelectronic components are formed in the corresponding through holes and correspondingly located at opposite ends of the optical waveguide component.

The optical component of the present invention includes a multilayer substrate, an optical waveguide component, and two optoelectronic components. The multilayer substrate includes at least one dielectric layer, at least two circuit layers, and two through holes penetrating through the dielectric layer, wherein the circuit layers are respectively disposed on opposite surfaces of the dielectric layer. The optical waveguide component is disposed on a surface of the multilayer substrate and located between the through holes. The optoelectronic components are respectively inserted into the corresponding through holes and correspondingly located at opposite ends of the optical waveguide component. One of the optoelectronic components converts an electrical signal into a light and provides light to the optical waveguide component, while the other of the optoelectronic components receives the light transmitted by the optical waveguide component and converts the light into another electrical signal.

The optoelectronic circuit board of the invention comprises a multilayer circuit board and an optical component And two wafers. The multilayer wiring board includes a plurality of wiring layers and a plurality of dielectric layers positioned between the wiring layers, wherein the multilayer wiring boards have a recess extending from a surface of the multilayer wiring board into the multilayer wiring layer. The optical component is inverted and combined into a recess of the multilayer circuit board, wherein the optical component includes a multilayer substrate, an optical waveguide component, and two optoelectronic components. The multilayer substrate includes at least one dielectric layer, at least two circuit layers, and two through holes penetrating through the dielectric layer, wherein the circuit layers are respectively disposed on opposite surfaces of the dielectric layer. The optical waveguide component is disposed on a surface of the multilayer substrate and located between the through holes and facing a bottom of the recess. The photoelectric components are respectively inserted into the corresponding through holes and correspondingly located at opposite ends of the optical waveguide component, wherein one of the photoelectric components converts an electrical signal into a light and provides light to the optical waveguide component, and the photoelectric component The other of them receives the light transmitted by the optical waveguide component and converts the light into another electrical signal. The wafer is disposed outside the recess and electrically connected to the corresponding optoelectronic component, wherein one of the wafers provides an electrical signal to the corresponding optoelectronic component, and the other of the wafers receives the electrical signal transmitted by the corresponding optoelectronic component.

In an embodiment of the invention, the method for forming a photovoltaic component in a corresponding through hole includes: providing a substrate, and forming a light guiding hole penetrating the substrate on the substrate. The substrate is cut to form an insert, wherein the insert includes an insertion portion and a light guiding portion of the connection insertion portion, and the light guiding hole is located on the light guiding portion. A conductive layer is formed on the insert. A photoelectric element is disposed on the corresponding light guiding portion to connect the conductive layer and face the light guiding hole. Inserting the insertion portion into the corresponding through hole, and the light guiding portion and the light guiding hole correspond to one end of the optical waveguide element, so that each photoelectric element transmits light to the optical waveguide element through the light guiding hole, or by guiding The light holes receive light transmitted by the optical waveguide element.

In an embodiment of the invention, the method for fabricating the optical component further includes the steps of: arranging two condensing mirrors on opposite sides of the optical waveguide component, and each of the optoelectronic components facing the corresponding concentrating mirror.

In an embodiment of the invention, each of the photovoltaic modules includes an insert, a conductive layer, and a photovoltaic element. The insert includes an insertion portion, a light guiding portion connecting the insertion portions, and a light guiding hole penetrating the light guiding portion. The insertion portion is inserted into the corresponding through hole, and the light guiding portion and the light guiding hole correspond to one end of the optical waveguide element. The conductive layer is disposed on the insert. The photoelectric element is disposed at an end of the corresponding light guiding portion away from the optical waveguide component to connect the conductive layer and face the light guiding hole to transmit the light to the optical waveguide component through the light guiding hole or to receive the optical waveguide through the light guiding hole The light transmitted by the component.

In an embodiment of the invention, the width of each of the light guiding portions is greater than the width of the corresponding through hole, so that the insert is positioned through the light guiding portion after the insert is inserted into the corresponding through hole through the insertion portion.

In an embodiment of the invention, the optical component further includes two condensing mirrors disposed on opposite sides of the optical waveguide component, and each of the optoelectronic components respectively facing the corresponding condensing mirror.

In an embodiment of the invention, the wafer is disposed on a corresponding optoelectronic component.

In an embodiment of the invention, the wafer is disposed on a surface of the multilayer circuit board and connected to the corresponding optoelectronic component through a corresponding plurality of wires.

Based on the above, the optical component of the present invention and the manufacturing method thereof are inserted into two optoelectronic components on the two through holes of the multilayer substrate, so that the optoelectronic component is positioned in the phase of the optical waveguide component. On both sides. One of the optoelectronic components converts the electrical signal into light and directly transmits the light to the optical waveguide component, and the other of the optoelectronic components directly receives the light transmitted by the optical waveguide component and converts the light into another electrical signal. In turn, the optical energy loss is reduced. Accordingly, the optical member of the present invention and the method of fabricating the same have good optical efficiency. Further, the photovoltaic circuit board of the present invention inverts and combines the above-described optical members into the grooves of the multilayer wiring board so that light transmission between the photovoltaic modules and the optical waveguide elements is located in the grooves. Accordingly, the photovoltaic circuit board of the present invention has good optical efficiency and can reduce the space required for the surface layout.

The above described features and advantages of the invention will be apparent from the following description.

10, 50, 50a‧‧‧ photoelectric circuit board

12, 52‧‧‧Multilayer circuit board

14a, 14b, 54a, 54b‧‧‧ wafer

16, 120‧‧‧ Optical waveguide components

18a, 18b, 134a, 134b‧‧‧Optoelectronic components

56‧‧‧Line

100‧‧‧Optical components

110‧‧‧Multilayer substrate

112, 524a to 524c‧‧‧ dielectric layer

114, 522a to 522d‧‧‧ circuit layer

116a, 116b‧‧‧through holes

122‧‧‧ bottom cladding

124‧‧‧ core layer

126‧‧‧Top cladding

130a, 130b‧‧‧Optoelectronic components

131‧‧‧Substrate

132a, 132b‧‧‧ inserts

136‧‧‧ Conductive layer

138‧‧‧metal layer

140a, 140b‧‧ ‧ condenser

526‧‧‧ Groove

1322‧‧‧Insert Department

1324‧‧‧Light Guide

1326‧‧‧Light guide hole

S1‧‧‧ surface

1 is a schematic view of a conventional photovoltaic circuit board.

2 is a schematic view of an optical component in accordance with an embodiment of the present invention.

3 is a flow chart of a method of fabricating the optical component of FIG. 2.

4A to 4C are schematic views showing a manufacturing flow of the optical component of Fig. 2.

5A to 5C are schematic views showing the manufacturing process of the photovoltaic module used in the optical component of Fig. 2.

Figure 6 is a schematic view of the optical component of Figure 2 applied to an optoelectronic circuit board.

Figure 7 is a schematic view of a photovoltaic circuit board according to another embodiment of the present invention.

2 is a schematic view of an optical component in accordance with an embodiment of the present invention. Referring to FIG. 2, in the present embodiment, the optical component 100 includes a multilayer substrate 110, an optical waveguide component 120, and two optoelectronic components 130a and 130b. The multi-layer substrate 110 includes at least one dielectric layer 112, at least two circuit layers 114, and two through holes 116a and 116b extending through the dielectric layer 112. The multilayer substrate 110 of the optical component of FIG. 2 includes a dielectric layer 112 and two The layer wiring layer 114 is exemplified, but the invention is not limited thereto. In the present embodiment, the circuit layers 114 are respectively disposed on opposite surfaces of the dielectric layer 112. However, in other embodiments not shown, the multi-layer substrate may include two dielectric layers 112 and three wiring layers 114 stacked on each other, and each dielectric layer 112 may be electrically connected to each other through a conductive hole not shown. The layer 114, the present invention does not limit the number of dielectric layers 112 and circuit layers 114 of the multilayer substrate, which can be adjusted as needed.

Furthermore, in the present embodiment, the optical waveguide component 120 is disposed on the surface of the multilayer substrate 110 and located between the through holes 116a and 116b. The optical waveguide component 120 includes a bottom cladding layer 122, a core layer 124, and a top cladding layer 126 such that the core layer 124 is positioned between the bottom cladding layer 122 and the top cladding layer 126. Further, the bottom cladding layer 122, the core layer 124, and the top cladding layer 126 of the optical waveguide element 120 are sequentially stacked on the surface of the multilayer substrate 110 from bottom to top. The bottom cladding layer 122 of the present embodiment has the same refractive index as the top cladding layer 126 , and the refractive index of the bottom cladding layer 122 and the top cladding layer 126 is smaller than the refractive index of the core layer 124 . As such, when the optical waveguide component 120 is used to transmit light, the light can be totally reflected at the interface of the bottom cladding layer 122, the core layer 124, and the top cladding layer 126 of the optical waveguide component 120. Photovoltaic component 130a and 130b are respectively inserted into the corresponding through holes 116a and 116b, and are correspondingly located at opposite ends of the optical waveguide element 120. As such, the optoelectronic components 130a and 130b can transmit light through the optical waveguide component 120. Furthermore, in the present embodiment, one of the optoelectronic components 130a and 130b, such as the optoelectronic component 130a, converts the electrical signal into light and provides light to the optical waveguide component 120, while the optoelectronic components 130a and 130b The other of them, for example, the optoelectronic component 130b, can receive the light transmitted by the optical waveguide component 120 and convert the light into another electrical signal. Since the refractive index of the bottom cladding layer 122 and the top cladding layer 126 of the optical waveguide component 120 is smaller than the refractive index of the core layer 124, when the optoelectronic components 130a and 130b transmit light through the optical waveguide component 120, the optoelectronic components 130a and 130b Light rays may be totally reflected at the interface of the bottom cladding layer 122, the core layer 124, and the top cladding layer 126 of the optical waveguide component 120.

In addition, in the embodiment, the optical component 100 further includes two condensing mirrors 140a and 140b disposed on opposite sides of the optical waveguide component 120, and each of the optoelectronic components 130a and 130b respectively facing the corresponding condensing mirrors 140a and 140b to enhance the light. The delivery effect. Thus, the light emitted by the optoelectronic component 130a is transmitted to the optical waveguide component 120 through the corresponding condensing mirror 140a, and the light is transmitted to the optoelectronic component 130b through the optical waveguide component 120 and the corresponding condensing mirror 140b. However, the present invention does not limit the configuration of the condensing mirrors 140a and 140b, which can be adjusted as needed.

In the present embodiment, the optoelectronic component 130a includes an interposer 132a and a photocell 134a, and the optoelectronic component 130b includes an interposer 132b and a photocell 134b. In other words, the photovoltaic modules 130a and 130b of the present embodiment have inserts 132a and 132b of similar construction, the difference being the kind of the photovoltaic elements 134a and 134b. Each of the inserts 132a and 132b includes an insertion portion 1322, a light guiding portion 1324 that connects the insertion portion 1322, and a light guiding hole 1326 that penetrates the light guiding portion 1324. The insertion portion 1322 is inserted into the corresponding through hole 116a or 116b, and the light guiding portion 1324 and the light guiding hole 1326 correspond to one end of the optical waveguide element 120 and face the condensing mirror 140a or 140b. In addition, the width of each light guiding portion 1324 of the present embodiment is larger than the width of the corresponding through hole 116a or 116b, so that the insertion portions 132a and 132b are inserted into the corresponding through holes 116a or 116b through the insertion portion 1322. The light portion 1324 positions the inserts 132a and 132b, and the width of each of the insertion portions 1322 does not exceed the width of the corresponding through hole 116a or 116b so as to be inserted into the corresponding through hole 116a or 116b. Accordingly, the width of the light guiding portion 1324 of each of the inserts 132a and 132b is larger than the width of the insertion portion 1322, so that the inserts 132a and 132b assume a plug shape. Furthermore, each of the photovoltaic elements 134a and 134b is disposed at an end of the light guiding portion 1324 of the corresponding interposer 132a and 132b away from the optical waveguide element 120, and faces the light guiding hole 1326. Thus, the light provided by the optoelectronic component 134a of the optoelectronic component 130a can be transmitted to the optical waveguide component 120 through the light guiding aperture 1326 of the interposer 132a, and the optoelectronic component 134b of the optoelectronic component 130b can be guided by the optical aperture 1326 of the interposer 132b. The light transmitted by the optical waveguide element 120 is received.

Further, in the present embodiment, the photovoltaic element 134a of the optoelectronic component 130a is an electro-optical component, such as a vertical cavity surface emission laser (VCSEL) component, which can receive the received The electrical signal is converted into light to provide light to the optical waveguide component 120. In addition, the optoelectronic component 134b of the optoelectronic component 130b is a photo-electrical component, such as a photo detector (PD), which can receive light transmitted from the optical waveguide component 120 and The light is converted into another electrical signal. It can be seen that the optoelectronic components 130a and 130b of the optical component 100 are respectively used to provide/receive light, and the light is transmitted from the optoelectronic component 130a to the optoelectronic component 130b through the optical waveguide component 120, wherein the optoelectronic component 134a is aligned with the light guide of the interposer 132a. The aperture 1326, while the optoelectronic component 134b is aligned with the light guide aperture 1326 of the insert 132b, and the light guide apertures 1326 of the interposer 132a and 132b correspond to opposite ends of the optical waveguide component 120, respectively. More specifically, the light guiding apertures 1326 of the interposers 132a and 132b correspond to opposite sides of the core layer 124 of the optical waveguide component 120. Light rays transmitted through the optical waveguide element 120 may be totally reflected at the interface of the bottom cladding layer 122, the core layer 124, and the top cladding layer 126 of the optical waveguide component 120. As such, the light provided by the optoelectronic component 134a aligned with the core layer 124 can be transmitted directly through the optical waveguide component 120 along the core layer 124 to the optoelectronic component 134b that is also aligned with the core layer 124, thereby reducing optical energy loss. Accordingly, the optical component 100 of the present embodiment has good optical efficiency.

Moreover, in this embodiment, each of the optoelectronic components 130a and 130b further includes a conductive layer 136 and a metal layer 138. The conductive layer 136 is disposed on the corresponding interposers 132a and 132b, for example, on the surface of the insertion portion 1322 and the light guiding portion 1324, and the photovoltaic elements 134a and 134b are disposed away from the light guiding portion 1324 of the corresponding interposers 132a and 132b. One end of the optical waveguide element 120 is connected to the corresponding conductive layer 136. The material of the conductive layer 136 may be copper or other suitable conductive material, but the invention is not limited thereto. With the conductive layer 136 on the insertion portion 1322 and the light guiding portion 1324, the photovoltaic elements 134a and 134b can be electrically connected to the wiring of the multilayer substrate 110 after the inserts 132a and 132b are inserted into the corresponding through holes 116a and 116b. Layer 114. In addition, Metal layer 138 is disposed within light guide holes 1326 of inserts 132a and 132b. The material of the metal layer 138 may be silver or other suitable metal material, but the invention is not limited thereto. The light reflectance through the light guiding hole 1326 can be increased by the metal layer 138 located in the light guiding hole 1326. However, the present invention does not limit the configuration of the conductive layer 136 and the metal layer 138, which can be adjusted as needed.

3 is a flow chart of a method of fabricating the optical component of FIG. 2. 4A to 4C are schematic views showing a manufacturing flow of the optical component of Fig. 2. Referring to FIG. 3, in the embodiment, the manufacturing method of the optical component 100 includes the following steps: In step S110, a multi-layer substrate is provided, including at least one dielectric layer, at least two circuit layers, and two passes through the dielectric layer. a hole, wherein the circuit layers are respectively disposed on opposite surfaces of the dielectric layer. In step S120, an optical waveguide element is formed on the surface of the multilayer substrate and located between the through holes. In step S130, two optoelectronic components are formed in the corresponding through holes, and correspondingly located at opposite ends of the optical waveguide component. Hereinafter, a method of fabricating the optical component 100 of the present embodiment will be sequentially described with reference to FIG. 3 and FIGS. 4A to 4C.

First, referring to FIG. 3 and FIG. 4A, in step S110, a multi-layer substrate 100 is provided, including at least one dielectric layer 112, at least two circuit layers 114, and two through holes 116a and 116b penetrating through the dielectric layer 112, wherein the circuit layer 114 are disposed on opposite surfaces of the dielectric layer 112, respectively. In this embodiment, the material of the dielectric layer 112 is, for example, a resin, a glass fiber or other suitable dielectric material, and the dielectric layer 112 can be formed into a through hole by a drilling process or other suitable processes. 116a and 116b. The material of the circuit layer 114 is, for example, copper or other suitable conductive material, and the circuit layer 114 can be configured by a plating process or other suitable process. The opposite surfaces of the electrical layer 112 can be formed into a line pattern in accordance with a desired line layout by a lithography process or other suitable process. However, in other embodiments not shown, the number of dielectric layers and circuit layers of the multilayer substrate can be adjusted according to requirements, and the invention is not limited thereto.

Next, referring to FIG. 3 and FIG. 4B, in step S120, the optical waveguide component 120 is formed on the surface of the multilayer substrate 110 and located between the through holes 116a and 116b. In the present embodiment, the optical waveguide component 120 is disposed on the surface of the multilayer substrate 110, wherein the optical waveguide component 120 includes a bottom cladding layer 122, a core layer 124, and a top cladding layer 126, which are sequentially stacked on each other from bottom to top. On the surface of the substrate 110. The optical waveguide component 120 can be formed on the multilayer substrate 110 by a suitable process, and the optical waveguide component 120 can be used to transmit light. Since the refractive index of the bottom cladding layer 122 and the top cladding layer 126 of the optical waveguide component 120 is smaller than the refractive index of the core layer 124, when the optical waveguide component 120 is used to transmit light, the light can be in the bottom cladding layer 122, the core. Total reflection occurs at the interface of layer 124 and top cladding layer 126. For a description of the optical waveguide component 120, reference may be made to the foregoing, and no further details are provided herein.

Finally, referring to FIG. 3 and FIG. 4C, in step S130, two optoelectronic components 130a and 130b are formed in the corresponding through holes 116a and 116b, and correspondingly located at opposite ends of the optical waveguide component 120. As such, one of the optoelectronic components 130a and 130b, such as the optoelectronic component 130a, can convert electrical signals into light and provide light to the optical waveguide component 120, while the other of the optoelectronic components 130a and 130b, such as an optoelectronic component 130b, can receive the light transmitted by the optical waveguide component 120 and convert the light into another electrical signal.

In the present embodiment, the method of forming the photovoltaic modules 130a and 130b in the corresponding through holes 116a and 116b (step S130) is to complete the photovoltaic modules 130a and 130b in advance before the optical component 100 is fabricated. Thus, in step S130, only the completed optoelectronic components 130a and 130b need to be inserted into the corresponding through holes 116a and 116b. For the method of forming the photovoltaic modules 130a and 130b in the corresponding through holes 116a and 116b, please refer to FIGS. 5A to 5C and the subsequent description.

5A to 5C are schematic views showing the manufacturing process of the photovoltaic module used in the optical component of Fig. 2. In the present embodiment, the optoelectronic components 130a and 130b employed in the optical component 100 have been previously fabricated in the fabrication of the optical component 100. Therefore, the step of providing the optoelectronic component 130a in this embodiment will be sequentially described by using the optoelectronic component 130a as an example, and the text is matched with FIG. 5A to FIG. 5C.

First, referring to FIG. 5A, a substrate 131 is provided, and a light guiding hole 1326 penetrating through the substrate 131 is formed on the substrate 131. In this embodiment, the substrate 131 may be a printed circuit board (PCB), a copper foil substrate or a silicon substrate, or may be made of metal, acrylic or injection molding materials. Alternatively, the substrate composed of an organic or inorganic material does not limit the material and type of the substrate 131, and may be selected according to requirements. Thereafter, a light guiding hole 1326 penetrating the substrate 131 is formed on the substrate 131 by a drilling process or other suitable process. In addition, the metal layer 138 can be formed in the light guiding hole 1326 by an electroplating process or other suitable process. The material of the metal layer 138 may be silver or other suitable metal material. The light reflectance transmitted through the light guiding hole 1326 can be increased by the metal layer 138 located in the light guiding hole 1326. However, the present invention does not limit the arrangement of the metal layer 138.

Next, referring to FIG. 5B, the substrate 131 is cut to form an insert 132a, wherein the insert 132a includes an insertion portion 1322 and a light guiding portion 1324 of the connection insertion portion 1322, and the light guiding hole 1326 is located on the light guiding portion 1324 and penetrates. Light guiding portion 1324. In the present embodiment, in order to allow the insert 132 to be inserted into the corresponding through hole 116a (shown in FIG. 2) and to be positioned in position, the present embodiment designs the insert 132a into a pin shape. In other words, the width of the light guiding portion 1324 of the insert 132a is larger than the width of the insertion portion 1322, and is in the form of a plug. Thus, the width of the insertion portion 1322 of the insert 132a does not exceed the width of the corresponding through hole 116a so as to be inserted into the through hole 116a, and the width of the light guiding portion 1324 of the insert 132a is larger than the width of the through hole 116a to The insert 132a is inserted into the through hole 116a by the insertion portion 1322, and then the insert 132a is positioned through the light guiding portion 1324. Similarly, the insert 132b can be completed in the same manner.

Next, referring to FIG. 5C, a conductive layer 136 is formed on the interposer 132a, and the photo-element 134a is disposed on the corresponding light guiding portion 1324 to connect the conductive layer 136 and face the light guiding hole 1326 to form the photovoltaic device 130a. In the present embodiment, the step of providing the optoelectronic component 130a further includes forming the conductive layer 136 on the interposer 132a before the photocell 134a is disposed, and the photocell 134a is disposed on the light guiding portion 1324 and connecting the conductive layer 136. In other words, before the photovoltaic element 134a is disposed, the conductive layer 136 may be formed on the insertion portion 1322 and the light guiding portion 1324 of the interposer 132a by an electroplating process or other applicable process, wherein the conductive layer 136 may be made of copper or Other suitable conductive materials, but the invention is not limited thereto. Thereafter, the photo-electric element 134a is disposed on the light guiding portion 1324 of the interposer 132a and connected to the corresponding conductive layer 136, and the photo-element 134a faces the light guiding hole 1326. By being located at the insertion portion 1322 The conductive layer 136 on the light guiding portion 1324, the photovoltaic element 134a can be electrically connected to the wiring layer 114 of the multilayer substrate 110 after the insert 132a is inserted into the corresponding through hole 116a. Similarly, the photovoltaic element 134b can also be disposed in the interposer 132b in the same manner to form the optoelectronic component 130b. As such, the optoelectronic component 130a includes an interposer 132a, a conductive layer 136, and a photocell 134a. The optoelectronic component 130b includes an interposer 132b, a conductive layer 136, and a photocell 134b, and each optoelectronic component 134a and 134b is disposed in a corresponding interposer 132a and 132b. The light guiding portion 1324 faces the light guiding hole 1326. After the photovoltaic modules 130a and 130b are completed, they can be applied to the optical component 100 described above, for example, directly inserted into the corresponding through holes 116a and 116b during the fabrication of the optical component 100.

Referring again to FIG. 4C, in the present embodiment, in the step of forming the photovoltaic modules 130a and 130b in the corresponding through holes 116a and 116b (step S130), after the photovoltaic modules 130a and 130b are completed through the above steps, only Each of the photovoltaic modules 130a and 130b is inserted into the through holes 116a and 116b with the insertion portions 1322 of the inserts 132a and 132b. At this time, the light guiding portion 1324 and the light guiding hole 1326 of each of the inserts 132a and 132b correspond to one end of the core layer 124 in the optical waveguide element 120, so that the respective photoelectric elements 134a and 134b are located away from the corresponding light guiding portion 1324. One end of the core layer 124 in the optical waveguide component 120. Thus, the photo-element 134a transmits light to the core layer 124 of the optical waveguide component 120 through the corresponding light-guiding aperture 1326, and the photo-element 134b receives the core layer 124 of the optical waveguide component 120 through the corresponding light-guiding aperture 1326. Light.

In addition, in the embodiment, the manufacturing method of the optical component 100 further includes The following steps: before the steps of inserting the optoelectronic components 130a and 130b into the corresponding through holes 116a and 116b (step S130), the two condensing mirrors 140a and 140b are disposed on opposite sides of the optical waveguide component 120, and the photoelectric is After the components 130a and 130b are inserted into the corresponding through holes 116a and 116b (step S130), the respective photovoltaic modules 130a and 130b face the corresponding condensing mirrors 140a and 140b, respectively. Thus, the light emitted by the optoelectronic component 130a is transmitted to the core layer of the optical waveguide component 120 through the corresponding condensing mirror 140a, and the light is transmitted to the optoelectronic component 130b through the core layer and the corresponding condensing mirror 140b to enhance the light transmission effect. However, the present invention does not limit the configuration of the condensing mirrors 140a and 140b.

Figure 6 is a schematic view of the optical component of Figure 2 applied to an optoelectronic circuit board. Referring to FIG. 2 and FIG. 6, in the present embodiment, the photovoltaic circuit board 50 includes a multilayer wiring board 52, an optical component 100, and two wafers 54a and 54b. Specifically, the multilayer wiring board 52 includes a plurality of wiring layers 522a to 522d and a plurality of dielectric layers 524a to 524c positioned between the wiring layers 522a to 522d, wherein the multilayer wiring board 52 of FIG. 6 is a four-layer wiring layer 522a to 522d and the three dielectric layers 524a to 524c are exemplified, but the invention is not limited thereto. The wiring layers 522a to 522d of the multilayer wiring board 52 and the dielectric layers 524a to 524c are sequentially stacked. The material of the circuit layers 522a to 522d is, for example, copper or other suitable conductive material, and the circuit layers 522a to 522d are formed between the dielectric layers 524a to 524c by an electroplating process or other suitable processes, and may be lithographically Process or other suitable process to form a line pattern based on the desired line layout. In addition, the material of the dielectric layers 524a to 524c is, for example, a resin, a glass fiber or other suitable dielectric material, and the dielectric layers 524a to 524c may be processed by a drilling process or other suitable processes. A through hole or a blind hole (not shown) is formed so that the respective circuit layers 522a to 522d are electrically connected to each other through the through hole or the blind hole. Further, the multilayer wiring board 52 has a recess 526 that extends from the surface S1 of the multilayer wiring board 52 into the multilayer wiring layer 52.

Furthermore, in the present embodiment, the optical component 100 includes a multi-layer substrate 110, an optical waveguide component 120, and two optoelectronic components 130a and 130b. The specific structure thereof is as described above, and will not be further described herein. The optical component 100 is inverted and combined into a recess 526 of the multilayer wiring board 50, wherein the optical waveguide component 120 of the optical component 100 faces the bottom of the recess 526, while the optoelectronic components 130a and 130b are located at opposite ends of the optical waveguide component 120. Photoelectric elements 134a and 134b are also located at the bottom of recess 526. In addition, the wafers 54a and 54b are disposed outside the recess 526 and electrically connected to the optoelectronic components 130a and 130b of the optical component 100, respectively, to provide electrical signals to the optical component 100, or to receive electrical signals transmitted by the optical component 100.

Specifically, in the present embodiment, the wafers 54a and 54b are disposed on the corresponding optoelectronic components 130a and 130b to be electrically connected to the corresponding optoelectronic components 130a and 130b, respectively. More specifically, the wafers 54a and 54b are disposed on the conductive layers 136 of the corresponding optoelectronic components 130a and 130b to be connected to the corresponding optoelectronic components 134a and 134b through the conductive layer 136. One of the wafers 54a and 54b, such as the wafer 54a, is a drive wafer that can be used to provide electrical signals, and the other of the wafers 54a and 54b, such as the wafer 54b, is a receiving wafer that can be used to receive Telecommunications signal. As such, the wafer 54a provides an electrical signal to the optoelectronic component 130a to drive the optoelectronic component 134a of the optoelectronic component 130a to convert the electrical signal into light, and the optoelectronic component 130a to provide light to the optical waveguide component 120. After that, the light passes through the optical waveguide component 120 is passed to optoelectronic component 130b. The optoelectronic component 134b of the optoelectronic component 130b receives the light transmitted by the optical waveguide component 120 and converts the light into another electrical signal, and the wafer 54b receives the electrical signal transmitted by the corresponding optoelectronic component 130b.

Based on the above, since the optoelectronic wiring board 50 of the present embodiment inverts and combines the optical component 100 into the recess 526 of the multilayer wiring board 52, the optical waveguide component 120 and the optoelectronic components 134a and 134b of the optoelectronic components 130a and 130b are positioned. At the bottom of the recess 526, the above-described light transmission path of the optical component 100 of the present embodiment is located in the recess 526, and the optical energy loss can be reduced. Accordingly, the photovoltaic circuit board 50 of the present embodiment has good optical efficiency. Further, since the present embodiment integrates the optical waveguide element 120 for transmitting light and the optoelectronic components 130a and 130b into the optical component 100, the optical component 100 of the present embodiment can be directly applied to the multilayer wiring board 52. In other words, when the multilayer wiring board 52 is to be configured with a photovoltaic element (for example, the aforementioned electrorotating element or the optical converting element) to constitute the photovoltaic circuit board 50, the present embodiment directly inverts and assembles the optical component 100 which has been fabricated in advance to the multilayer wiring. Instead of having the respective components disposed on the multilayer wiring board 52, the recesses 526 of the board 52 are disposed. Therefore, the optoelectronic circuit board 50 of the present embodiment has a relatively simple assembly and alignment mode. Furthermore, since the optical component 100 of the present embodiment is embedded in the recess 526 of the multilayer wiring board 52, the multilayer wiring board 52 of the present embodiment does not require an additional surface space for providing the above-described photovoltaic element. Therefore, the optoelectronic circuit board 50 of the present embodiment can reduce the space required for the surface layout, that is, the optoelectronic circuit board 50 can be sized according to requirements, and other electronic components can be disposed in other parts without being limited by the optoelectronic components.

Figure 7 is a schematic view of a photovoltaic circuit board according to another embodiment of the present invention. Please refer to Referring to FIG. 2 and FIG. 7, in the present embodiment, the optoelectronic circuit board 50a has a similar structure to the optoelectronic circuit board 50 of FIG. 6, and the main difference is that in the optoelectronic circuit board 50a of the present embodiment, the recess is disposed in the recess. The wafers 54a and 54b outside the 526 are actually disposed on the surface S1 of the multilayer wiring board 52, and are connected to the corresponding optoelectronic components 130a and 130b through the corresponding plurality of wirings 56. Further, the wafers 54a and 54b are disposed on the wiring layer 522a of the multilayer wiring board 52 and are located on opposite sides of the recess 526, wherein the wiring layer 522a has been required by a lithography process or other applicable processes. The wiring layout forms a wiring pattern, and the wafers 54a and 54b are disposed on the wiring pattern of the wiring layer 522 to be electrically connected to the multilayer wiring board 52. In addition, the wafers 54a and 54b are connected to the conductive layers 136 of the corresponding photovoltaic modules 130a and 130b by corresponding wires 56 to be electrically connected to the corresponding photovoltaic elements 134a and 134b, respectively, by the conductive layer 136. As can be seen, the present invention does not limit the arrangement of the wafers 54a and 54b, which can be adjusted as needed.

In summary, the optical component of the present invention and its fabrication method insert two optoelectronic components on the two through holes of the multilayer substrate such that the optoelectronic components are positioned on opposite sides of the optical waveguide component. One of the two optoelectronic components converts the electrical signal into light and directly transmits the light to the optical waveguide component, and the other of the two optoelectronic components directly receives the light transmitted by the optical waveguide component and converts the light into another telecommunications No., thereby reducing the loss of light energy. Accordingly, the optical member of the present invention and the method of fabricating the same have good optical efficiency. Furthermore, the present invention integrates an optical waveguide component for transmitting light with an optoelectronic component into an optical component, and the optical component can be directly inverted and assembled into a recess of a multilayer wiring board of a photovoltaic circuit. In other words, the photovoltaic circuit board of the present invention will have the above optical The components are inverted and combined into the recesses of the multilayer circuit board such that light transmission between the optoelectronic component and the optical waveguide component is located within the recess. Accordingly, the optoelectronic circuit board of the present invention has good optical efficiency, and has a relatively simple assembly and alignment mode, and can reduce the space required for the surface layout.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Optical components

110‧‧‧Multilayer substrate

112‧‧‧ dielectric layer

114‧‧‧Line layer

116a, 116b‧‧‧through holes

120‧‧‧ Optical waveguide components

122‧‧‧ bottom cladding

124‧‧‧ core layer

126‧‧‧Top cladding

130a, 130b‧‧‧Optoelectronic components

132a, 132b‧‧‧ inserts

1322‧‧‧Insert Department

1324‧‧‧Light Guide

1326‧‧‧Light guide hole

134a, 134b‧‧‧Optoelectronic components

136‧‧‧ Conductive layer

138‧‧‧metal layer

140a, 140b‧‧ ‧ condenser

Claims (13)

A method of fabricating an optical component, comprising: providing a multi-layer substrate comprising at least one dielectric layer, at least two circuit layers, and two through holes penetrating the dielectric layer, wherein the circuit layers are respectively disposed on the dielectric layer Opposite two surfaces; forming an optical waveguide component on a surface of the multi-layer substrate and located between the through-holes; and forming two optoelectronic components in the corresponding through-holes and corresponding to the optical waveguide component Relative ends. The method of fabricating an optical component according to claim 1, wherein the method of forming the photovoltaic components in the corresponding through holes comprises: providing a substrate, and forming a guide penetrating the substrate on the substrate a light hole; the substrate is cut to form an insert, wherein the insert comprises an insertion portion and a light guiding portion connected to the insertion portion, and the light guiding hole is located on the light guiding portion; forming a conductive layer on And inserting a photoelectric element to the corresponding light guiding portion to connect the conductive layer and facing the light guiding hole; inserting the insertion portion into the corresponding through hole, and the light guiding portion And the light guiding hole corresponds to one end of the optical waveguide component, so that each of the photoelectric component transmits the light to the optical waveguide component through the light guiding hole, or receives the optical waveguide component through the light guiding hole The light. The method for manufacturing an optical component according to claim 1 of the patent application, further includes The two concentrating mirrors are disposed on opposite sides of the optical waveguide component, and each of the optoelectronic components respectively faces the corresponding condensing mirror. An optical component comprising: a multi-layer substrate comprising at least one dielectric layer, at least two circuit layers, and two through holes penetrating the dielectric layer, wherein the circuit layers are respectively disposed on opposite surfaces of the dielectric layer; An optical waveguide component disposed on a surface of the multilayer substrate and located between the through holes; and two optoelectronic components respectively inserted in the corresponding through holes and corresponding to the optical waveguide component The opposite ends, wherein one of the optoelectronic components converts an electrical signal into a light and provides the light to the optical waveguide component, and the other of the optoelectronic components receives the light transmitted by the optical waveguide component And convert the light into another electrical signal. The optical component of claim 4, wherein each of the optoelectronic components comprises: an insert, an insertion portion, a light guiding portion connecting the insertion portion, and a light guiding hole penetrating the light guiding portion, The insertion portion is inserted into the corresponding through hole, and the light guiding portion and the light guiding hole correspond to one end of the optical waveguide element; a conductive layer is disposed on the insert; and a photoelectric element is disposed on the Corresponding the light guiding portion is away from an end of the optical waveguide component to connect the conductive layer and face the light guiding hole, the light is blocked by the light guiding hole The light is transmitted to the optical waveguide element, or the light transmitted by the optical waveguide element is received by the light guiding hole. The optical component of claim 5, wherein a width of each of the light guiding portions is greater than a width of the corresponding through hole, so that the insert is inserted through the inserted portion into the corresponding through hole The light guiding portion positions the insert. The optical component of claim 4, further comprising two concentrating mirrors disposed on opposite sides of the optical waveguide component, and each of the optoelectronic components respectively facing the corresponding concentrating mirror. An optoelectronic circuit board comprising: a multilayer circuit board comprising a plurality of circuit layers and a plurality of dielectric layers positioned between the circuit layers, wherein the multilayer circuit board has a recess from the multi-layer circuit board a surface extending into the multilayer circuit layer; an optical component inverted and combined into the recess of the multilayer wiring board, wherein the optical component comprises: a multilayer substrate comprising at least one dielectric layer, at least two lines And a plurality of through holes penetrating the dielectric layer, wherein the circuit layers are respectively disposed on opposite surfaces of the dielectric layer; an optical waveguide component disposed on a surface of the multilayer substrate and located in the through holes And a bottom portion facing the groove; and two photoelectric components are respectively inserted into the corresponding through holes, and correspondingly located at opposite ends of the optical waveguide component, wherein the photoelectric components are Converting an electrical signal into a light and providing the light to the optical waveguide component, And the other of the optoelectronic components receives the light transmitted by the optical waveguide component and converts the light into another electrical signal; and the two wafers are disposed outside the recess and electrically connected to the corresponding ones The optoelectronic component, wherein one of the wafers provides the electrical signal to the corresponding optoelectronic component, and the other of the plurality of wafers receives the corresponding electrical signal transmitted by the optoelectronic component. The optoelectronic circuit board of claim 8, wherein each of the optoelectronic components comprises: an insert comprising an insertion portion, a light guiding portion connecting the insertion portion, and a light guiding hole penetrating the light guiding portion The insertion portion is inserted into the corresponding through hole, and the light guiding portion and the light guiding hole correspond to one end of the optical waveguide element; a conductive layer is disposed on the insert; and a photoelectric element is disposed The corresponding light guiding portion is away from an end of the optical waveguide component to connect the conductive layer and face the light guiding hole to transmit the light to the optical waveguide component through the light guiding hole, or by using the guiding The light hole receives the light transmitted by the optical waveguide element. The photoelectric circuit board of claim 9, wherein a width of each of the light guiding portions is greater than a width of the corresponding through hole, so that the insert is inserted into the corresponding through hole through the insertion portion. The insert is positioned through the light guiding portion. The optoelectronic circuit board of claim 8, wherein the optical component further comprises two condensing mirrors disposed on opposite sides of the optical waveguide component, and each of the optoelectronic components respectively faces the corresponding condensing mirror. The optoelectronic circuit board of claim 8, wherein the wafers are disposed on the corresponding optoelectronic components. The optoelectronic circuit board of claim 8, wherein the wafers are disposed on the surface of the multi-layer circuit board and connected to the corresponding optoelectronic components through corresponding plurality of wires.