TWI509683B - Surface processing method by using peelable film - Google Patents

Description

Surface processing method using peelable film

The present invention relates to a surface processing method, and more particularly to a surface processing method using a peelable film.

Conventional IC processing processes are all carried out using photoresist. The process examples generally include: coating a photosensitive polymer solution on a plastic copper foil substrate, drying, exposing and developing, so that the copper foil substrate remains on the substrate. In addition to the pattern, the copper foil is etched by "etching solution", and finally the residual photoresist is stripped by "stripping solution" to leave the desired copper wire electronic circuit on the plastic substrate.

However, the above processes all require the formation of photoresist, exposure, and development steps, and require a developing solution and a stripping solution, so that the process is complicated, and the stripping liquid pollutes the environment, so that the production cost increases and the environmental protection effect cannot be achieved.

Therefore, how to provide a surface processing method, which can simplify the process to reduce the cost and achieve environmental protection, is one of the current important issues.

In view of the above problems, an object of the present invention is to provide a surface processing method using a peelable film which can simplify the process to reduce cost and achieve environmental protection.

To achieve the above object, a surface processing method using a peelable film according to the present invention comprises: forming a functional film on a substrate; forming a patterned peelable film on the functional film; and etching is not patterned by an etching solution The functional film portion covered by the peelable film; and the functional film becomes a patterned functional film by removing the patterned peelable film by water or a mechanical force.

To achieve the above object, a surface processing method using a peelable film according to the present invention comprises: forming a patterned peelable film on a substrate; forming a functional film on the patterned peelable film and the substrate; and by water or A mechanical force removes the patterned peelable film to make the functional film a picture Case functional film.

To achieve the above object, a surface processing method using a peelable film according to the present invention comprises: forming a patterned peelable film on a substrate; forming a patterned functional film on a region other than the patterned peelable film on the substrate; The patterned film is removed by water or a mechanical force to leave a patterned functional film.

In one embodiment, the substrate is a circuit board and the patterned functional film is a circuit layer.

In one embodiment, the material of the substrate comprises glass, metal, plastic, ceramic, wood, fiber, or paper.

In one embodiment, the patterned strippable film is formed by dip coating, spray coating, shower coating, screen printing, knife coating, or spin coating.

In one embodiment, the patterned strippable film is cured by natural drying, heat drying, or illuminating.

In an embodiment, the patterned strippable film comprises an acrylic material, an epoxy material, a polyamide material, a silicone material, a rubber material, or a combination thereof.

In one embodiment, the patterned functional film is a reinforced film, a dyed film, or a protective film.

In one embodiment, the functional film or patterned functional film is formed by dip coating, electroplating, or plating.

In one embodiment, the temperature of the water is between 10 and 100 degrees Celsius. The water is, for example, a spray water.

In an embodiment, the mechanical force is provided by a brush, jet or hand.

As described above, the surface processing method of the present invention is carried out by using a peelable film which has an easily peelable property and can be stripped by water or a mechanical force so that organic use can be avoided. Strip the solution to achieve environmental benefits. Further, the present invention utilizes a peelable film, so that it is not necessary to form a photoresist and steps of exposure, development, etc., thereby greatly simplifying the process and reducing the cost. Due to the above advantages, the surface processing method using the strippable film of the present invention has considerable development potential and can replace the conventional photoresist process.

Steps of S11~S14, S21~S23, S31~S33‧‧‧ Surface processing methods

101, 201, 301‧‧‧ substrates

102, 202‧‧‧ functional film

103, 203, 303‧‧‧ patterned peelable film

104, 204, 304‧‧‧ patterned functional film

1 is a flow chart of a surface processing method using a peelable film according to a preferred embodiment of the present invention.

2A to 2D are schematic views of the surface processing method using the peelable film of Fig. 1.

3 is a flow chart of another surface processing method using a peelable film according to a preferred embodiment of the present invention.

4A to 4C are schematic views of the surface processing method using the peelable film of Fig. 3.

Figure 5 is a flow chart showing another method of surface processing using a peelable film in accordance with a preferred embodiment of the present invention.

6A to 6C are schematic views of the surface processing method using the peelable film of Fig. 5.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a surface processing method using a peelable film according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

1 is a flow chart of a surface processing method using a peelable film according to a preferred embodiment of the present invention, which includes steps S11 to S14, and FIGS. 2A to 2D are schematic views of a surface processing method using the peelable film of FIG.

As shown in FIG. 2A, step S11 forms a functional film 102 on a substrate 101. The material of the substrate 101 includes, for example, glass, metal, plastic, ceramic, wood, fiber, or paper, but the invention is not limited thereto. The substrate 101 is, for example, a circuit board, a lens, a metal member, a plastic member, a ceramic member, a wood member or a glass. The present invention also does not limit the material of the functional film 102, which is, for example, a metal or an organic material. The functional film 102 can be formed, for example, by dip coating, electroplating, or plating. The functional film 102 can be formed, for example, by a surface hardness strength solution, a color coating, or other surface functionalization solution.

As shown in FIG. 2B, step S12 forms a patterned peelable film 103 on the functional film 102. The patterned strippable film 103 can be formed, for example, by dip coating, spray coating, shower coating, screen printing, knife coating, or spin coating. This embodiment does not limit the pattern of the patterned peelable film 103, which may vary depending on the actual application. The patterned peelable film 103 is, for example, a pattern of a line. The patterned strippable film comprises an acrylic material, an epoxy material, a polyamide material, a silicone material, a rubber material, or a combination thereof. In addition, in the process, the patterned strippable film can be dried by natural drying, heated, or illuminated. Dry and harden.

As shown in FIG. 2C, step S13 etches a portion of the functional film that is not covered by the patterned strippable film 103 by an etchant. In this step, the patterned peelable film 103 is used as a protective film, so that after the etching liquid is etched, the functional film substantially leaves the same portion as the pattern of the patternable peelable film 103. The selection of the etching liquid is related to the material of the patterned peelable film 103 and the functional film 102, and can be adjusted according to actual conditions.

Thereafter, as shown in FIG. 2D, step S14 removes the patterned peelable film 103 by water or a mechanical force to make the functional film 102 a patterned functional film 104. In the embodiment, the patterned peelable film 103 is a high-molecular material. After drying and hardening, the substrate can be protected at room temperature. When the substrate is no longer protected, cold water and hot water can be used for stripping. It can also be stripped with a mechanical force. The temperature of the water is, for example, between 10 and 100 degrees Celsius, and the mechanical force is provided, for example, by a brush, jet or hand. The above water may also be a spray water. If the substrate 101 is a circuit board, the patterned functional film 104 can be a circuit layer. In addition, the patterned functional film 104 is, for example, a reinforced film, a dyed film, or a protective film. The reinforced film is, for example, a hardness-enhancing film, and the dye film is added with a color, and the protective film is, for example, an etch-resistant film, an anti-light film, an antibacterial film, a diamagnetic film, an anti-friction film, a refractory film, a heat-resistant film, a water-repellent film, or the like.

3 is a flow chart of another surface processing method using a peelable film according to a preferred embodiment of the present invention, which includes steps S21 to S23, and FIGS. 4A to 4C are schematic views of the surface processing method using the peelable film of FIG. .

As shown in FIG. 4A, step S21 forms a patterned strippable film 203 on a substrate 201. For the technical features of the substrate 201 and the patterned strippable film 203, reference may be made to the substrate 101 and the patterned strippable film 103 described above, and thus no further description is provided herein.

As shown in FIG. 4B, step S22 forms a functional film 202 on the patterned strippable film 203 and the substrate 201. The technical features of the functional film 202 can be referred to the functional film 102 described above, and thus will not be described herein. In this aspect, the material properties of the functional film 202 allow it to adhere to the patterned strippable film 203 and the substrate 201.

As shown in FIG. 4C, step S23 removes the patterned strippable film 203 by water or a mechanical force to make the functional film 202 a patterned functional film 204. Here, when the patterned peelable film 203 is removed, portions of the functional film 202 thereon are also removed together, so that the functional film 202 becomes a patterned functional film 204. The technical features of the patterned functional film 204 can be referred to the above-described patterned functional film 104, and thus will not be described herein. In this aspect, the material property of the functional film 202 is such that it can be attached to the patterned peelable film 203, and the functional film 202 can be made into a patterned functional film by removing the patterned peelable film 203 by water or mechanical force. 204.

5 is a flow chart of another surface processing method using a peelable film according to a preferred embodiment of the present invention, which includes steps S31 to S33, and FIGS. 6A to 6C are schematic views of the surface processing method using the peelable film of FIG. .

As shown in FIG. 6A, step S31 forms a patterned strippable film 303 on a substrate 301. The technical features of the substrate 301 and the patterned strippable film 303 can be referred to the substrate 101 and the patterned strippable film 103 described above, and thus will not be described herein.

As shown in FIG. 6B, step S32 forms a patterned functional film 304 on a region other than the patterned strippable film 303 on the substrate 301. In this aspect, the material property of the patterned functional film 304 is such that it cannot adhere to the patterned peelable film 303, but can be attached to the substrate 301.

As shown in FIG. 6C, step S33 removes the patterned strippable film 303 by water or a mechanical force to leave the patterned functional film 304. In this aspect, the functional film does not adhere to the patterned peelable film due to the material properties of the functional film, and becomes a patterned functional film, and the water or mechanical force is removed to remove the patterned peelable film 303. The functional film 304 is patterned. The technical features of the patterned functional film 304 can be referred to the above-described patterned functional film 104, and thus will not be described herein.

The surface processing method using the peelable film of the present invention will be exemplified below by some practical applications.

Example 1. The application of patterned strippable film in the integrated circuit process in the electronics industry.

The patterned peelable film is coated on a copper foil base plate by screen printing, and then the patterned peelable film is dried and hardened, and then the base plate is immersed in a copper foil etching solution to protect the unetched film. The copper foil of the area is washed out, and after washing, the base plate is immersed in hot water of 90 degrees Celsius for 15 minutes, and the patterned and peelable film of the screen printing is removed, and the circuit board can be obtained after washing and drying. Compared with the conventional photoresist process, it can simplify the process, reduce the cost, reduce the environmental pollution, and has the substantial effect improvement.

Example 2: Patterned peelable film is applied in the lens protective film coating process of the glasses industry.

Apply a patterned peelable film to a plastic or glass lens using spray coating to pattern After the peelable film is dried and hardened, the lens is immersed in a surface hardness-strengthening solution to process the lens which is not subjected to the patterned peelable film protection region. After washing, the coated patterned peelable film is hand-peeled to obtain a partially lens-enhanced lens. Repeating the above steps can perform various functionalization (for example, strengthening, dyeing, etching, sputtering, plating, etc.) on two or more regions of the lens.

Example 3: Application of partial processing of aluminum.

Applying "patterned peelable film" to aluminum molding material by dip coating or spray coating, immersing aluminum molding material in surface hardness strengthening solution, color coating, or other after drying and hardening of "patternable peelable film" The surface functionalizes the solution to process the aluminum material that is not subjected to the patterned peelable film protection area. After the processing is completed, the aluminum material is immersed in hot water of 90 degrees Celsius for 20 minutes, and the applied "patterned peelable film" is removed. After washing and drying, partial aluminum reinforcement or other surface functions can be obtained. Aluminum products. Repeating the above steps can perform various functions (for example, strengthening, dyeing, etching, sputtering, plating, etc.) on two or more regions of the aluminum molding material.

Example 4, metal surface partial coating, or electroplating processing applications.

Applying a "patterned peelable film" to a metal forming material by dip coating or spray coating, immersing the metal forming material in a surface hardness-strengthening solution, a color coating, or after drying and hardening the "patterned peelable film" Other surface functionalizing solutions process the metal material that is not protected by the "patterned peelable film". After the processing is completed, the metal material is immersed in hot water of 90 degrees Celsius for 15 minutes, and the applied "patterned peelable film" is removed. After washing and drying, some metal reinforcement or other surface functions can be obtained. Metal products. Repeating the above steps can perform various functionalization (for example, strengthening, dyeing, etching, sputtering, etc.) on two or more regions of the metal molding material.

Example 5, partial coating of plastic surface, or electroplating processing application.

Apply "patterned peelable film" to the plastic molding material by dip coating or spray coating. After drying and hardening the patterned peelable film, immerse the plastic molding material in surface hardness strengthening solution, color coating, or other surface. The solution is functionalized to coat the plastic material that is not protected by the "patterned peelable film". After processing, the plastic material is immersed in hot water of 80 degrees Celsius for 15 minutes, and the applied "patterned peelable film" is removed. After washing and drying, some plastic materials can be obtained, or other surface functions can be obtained. Plastic products. Repeat the above steps to plastic molding Two or more areas are subjected to various functionalizations (eg, strengthening, dyeing, etching, sputtering, etc.).

Example 6, ceramic surface coating, or electroplating processing applications.

Applying "patterned peelable film" to the ceramic molding material by dip coating or spray coating, immersing the ceramic molding material in a surface hardness-strengthening solution, color coating, or after drying and hardening the patterned peelable film Other surface functionalizing solutions are used to process ceramic coatings that are not protected by the "patterned peelable film". After drying and hardening, the ceramic material is immersed in hot water of 90 degrees Celsius for 25 minutes, and the applied "patterned peelable film" is removed. After washing and drying, some ceramic materials can be obtained, or other surfaces can be obtained. Functional ceramic products. Repeating the above steps can perform various functionalization (for example, strengthening, dyeing, etching, sputtering, etc.) on two or more regions of the ceramic molding material.

Example 7, partial coating of wood surface, or electroplating processing applications.

Applying "patterned peelable film" to wood molding material by dip coating or spray coating, immersing the wood molding material in surface hardness strengthening solution, color coating, or after drying and hardening of "patternable peelable film" Other surface functionalizing solutions are used to process wood that is not protected by the "patterned peelable film". After drying and hardening, the wood is immersed in hot water of 70 degrees Celsius for 15 minutes, and the applied "patterned peelable film" is removed. After washing and drying, partial wood strengthening or other surface functioning can be obtained. Wood products. Repeating the above steps can perform various functionalization (for example, strengthening, dyeing, etching, sputtering, etc.) on two or more regions of the wood molding material.

Example 8, glass surface partial coating, or electroplating processing applications.

Applying "patterned peelable film" to the glass molding material by dip coating or spray coating, dipping the glass molding material into the surface hardness strengthening solution, color coating, or after drying and hardening the "patterned peelable film" Other surface functionalizing solutions are used to process the glass that is not protected by the "patterned peelable film". After drying and hardening, the glass product is immersed in hot water of 70 degrees Celsius for 15 minutes, and the applied "patterned peelable film" is removed. After washing and drying, partial area strengthening or other surface functions can be obtained. Glass processed products. Repeating the above steps can perform various functionalization (for example, strengthening, dyeing, etching, sputtering, etc.) on two or more regions of the glass molding material.

The peelable film has the characteristics of being easily peelable, and can be stripped by using water or a mechanical force, so that the use of the organic stripping solution can be avoided to achieve environmental protection. Further, the present invention utilizes a peelable film, so that it is not necessary to form a photoresist and steps of exposure, development, etc., thereby greatly simplifying the process and reducing the cost. Due to the above advantages, the surface processing method using the strippable film of the present invention has considerable development potential and can replace the conventional photoresist process.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

S11~S14‧‧‧Steps of surface processing method

Claims (13)

A surface processing method using a peelable film, comprising: forming a functional film on a substrate; forming a patterned peelable film on the functional film; and etching by an etching solution is not covered by the patterned peelable film The functional film portion; and the patterned film is removed by water or a mechanical force to make the functional film a patterned functional film. A surface processing method using a peelable film, comprising: forming a patterned peelable film on a substrate; forming a functional film on the patterned peelable film and the substrate; and using water or a mechanical force The patterned strippable film is removed to make the functional film a patterned functional film. A surface processing method using a peelable film, comprising: forming a patterned peelable film on a substrate; forming a patterned functional film on the substrate other than the patterned strippable film; and using water or a Mechanically removing the patterned peelable film leaves the patterned functional film. The surface processing method according to any one of claims 1 to 3, wherein the substrate is a circuit board, and the patterned functional film is a circuit layer. The surface processing method according to any one of claims 1 to 3, wherein the material of the substrate comprises glass, metal, plastic, ceramic, wood, fiber, or paper. The surface processing method according to any one of claims 1 to 3, wherein the patterned peelable film is by dip coating, spray coating, shower coating, screen printing, blade coating, or spin coating. And formed. The surface processing method according to any one of claims 1 to 3, wherein the patterned peelable film is hardened by natural drying, heat drying, or light drying. The surface processing method according to any one of claims 1 to 3, wherein the patterned peelable film comprises an acrylic material, an epoxy material, a polyamide material, a silicone material, a rubber material, Or a combination thereof. The surface processing method according to any one of claims 1 to 3, wherein The patterned functional film is a reinforced film, a dyed film, or a protective film. The surface processing method according to any one of claims 1 to 3, wherein the functional film or the patterned functional film is formed by dip coating, electroplating, or plating. The surface processing method according to any one of claims 1 to 3, wherein the temperature of the water is between 10 and 100 degrees Celsius. The surface processing method according to any one of claims 1 to 3, wherein the mechanical force is provided by a brush, a jet or a hand. The surface processing method according to any one of claims 1 to 3, wherein the water system is a spray water.