KR20090080676A - Method for making perforation patterns on a metal plate and the metal plate having patterns - Google Patents

Method for making perforation patterns on a metal plate and the metal plate having patterns Download PDF

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KR20090080676A
KR20090080676A KR1020080006570A KR20080006570A KR20090080676A KR 20090080676 A KR20090080676 A KR 20090080676A KR 1020080006570 A KR1020080006570 A KR 1020080006570A KR 20080006570 A KR20080006570 A KR 20080006570A KR 20090080676 A KR20090080676 A KR 20090080676A
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South Korea
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metal plate
pattern
coating
film
photosensitive material
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KR1020080006570A
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Korean (ko)
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KR101012854B1 (en
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김수학
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김수학
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22Removing surface-material, e.g. by engraving, by etching
    • B44C1/227Removing surface-material, e.g. by engraving, by etching by etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00Processes for producing special ornamental bodies
    • B44C5/04Ornamental plaques, e.g. decorative panels, decorative veneers
    • B44C5/0415Ornamental plaques, e.g. decorative panels, decorative veneers containing metallic elements

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Provided are a manufacturing method of a pattern-formed metal plate, which reduces and facilitates the manufacturing process, prevents transfer of pieces due to heat, and can reinforce strength of the metal plate even if the metal plate is a thin metal plate, and the pattern-formed metal plate manufactured by the same. A manufacturing method of a pattern-formed metal plate comprises: a step(T1) of cleanly washing a metal plate to remove dirt from the metal plate; a step(T2) of applying a transparent synthetic resin coating onto the bottom of the metal plate and drying the coating to form a coating layer with a desired thickness; a step(T3) of applying or adhering photosensitive material onto the top of the metal plate; a step(T4) of closely adhering a pattern-printed film onto the top of the photosensitive material; a step(T5) of irradiating natural light or ultraviolet light onto the top of the film; a step(T6) of separating the film from the metal plate and dipping the film-separated metal plate into a developing solution; a step(T7) of removing foreign materials stained on the surface of the metal plate with a diluted etchant; a step(T8) of dipping the metal plate into an etchant with a high concentration such that the etchant penetrates into patterns; and a step(T9) of removing the photosensitive material adhered onto the metal plate.

Description

패턴이 형성된 금속평판의 제조방법 및 패턴이 형성된 금속평판{Method for making perforation patterns on a metal plate and the metal plate having patterns}Method for making perforation patterns on a metal plate and the metal plate having patterns}

본 발명은 패턴이 형성된 금속평판의 제조방법 및 패턴이 형성된 금속평판에 관한 것으로서, 더욱 상세히는 공정이 단축되고 용이하며, 열에 의해서 피스가 이송되지 않고. 금속평판이 박판일 경우에 강도 보강이 가능한, 패턴이 형성된 금속평판의 제조방법 및 패턴이 형성된 금속평판에 관한 것이다.The present invention relates to a method for producing a patterned metal plate and a metal plate with a pattern, in more detail, the process is shortened and easy, and the piece is not transferred by heat. The present invention relates to a method of manufacturing a patterned metal flat plate and a patterned metal flat plate capable of reinforcing strength when the metal flat plate is a thin plate.

이하 첨부되는 도면과 관련하여 종래 기술을 살펴보면 다음과 같다.Looking at the prior art with reference to the accompanying drawings as follows.

도 1은 종래의 기술이 적용된 패턴이 형성된 금속평판의 제조방법을 도시한 블럭도, 도 2는 종래의 기술이 적용된 패턴이 형성된 금속평판의 제조방법을 도시한 공정도로서 함께 설명한다.1 is a block diagram illustrating a method of manufacturing a metal plate with a pattern applied with a conventional technique, and FIG. 2 is a process diagram illustrating a method of manufacturing a metal plate with a pattern applied with a conventional technique.

일반적으로 금속평판(10)에 빛이 투과되도록 문양이나 문자로 디자인된 관통형 패턴(11)을 형성하게 될 경우, 상기 관통형 패턴(11)은 상하로 관통하는 통공(12)만으로 형성되거나, 상기 통공(12)과 통공(12)의 내부에 형성되는 피스(13)로 구성되는 데, 일례로 도 2에서처럼, 영문자 C,E의 경우에는 통공(12)이 문자의 형상대로 성형되지만, A, B, D의 경우에는 통공(12)과 상기 통공(12)의 내부에 위치하는 피스(13)에 의해 형성된다. 그런데, 상기 피스(13)가 통공(12) 내부에 위치하기 위해서는 피스(13)와 통공(12)에 이어지는 연결부(미도시)를 필요로 함으로써, 본래의 패턴 형상과는 상이하게 된다.In general, when the through-shaped pattern 11 designed as a pattern or a letter to transmit light to the metal plate 10 is formed, the through-type pattern 11 is formed of only the through-hole 12 penetrating up and down, or It consists of the through hole 12 and the piece 13 formed inside the through hole 12. For example, as shown in Figure 2, in the case of the English letters C, E, the through hole 12 is formed in the shape of a letter, but A , B, D is formed by the through hole 12 and the piece 13 located inside the through hole 12. By the way, in order for the piece 13 to be located inside the through hole 12, the piece 13 and the connection part (not shown) connected to the through hole 12 are required, which is different from the original pattern shape.

이러한 문제점을 해결하기 위한 기술로서, 본 출원인은 "연결부가 생략된 패턴을 형성시키는 방법 및 연결부가 생략된 패턴이 형성된 금속평판"으로 특허등록(10-0714377호) 받은 바 있다.As a technology for solving this problem, the applicant has been granted a patent (10-0714377) as "Method for forming a pattern in which the connection is omitted, and a metal plate on which the pattern is omitted."

상기 특허 등록된 종래 기술에 의한 패턴이 형성된 금속평판의 제조방법을 살펴보면 다음과 같다.Looking at the method of manufacturing a metal flat plate with a pattern according to the prior art registered as follows.

금속평판(10)을 깨끗하게 세정하여 오물을 제거하는 금속평판 준비공정(S1)과, 상기 금속평판 준비공정(S1)을 거친 금속평판(10)의 하면에 테이프(20)를 부착하는 공정(S2)과, 상기 금속평판(10) 위에 감광성물질(50, 감광성 수성막, 감광성수지필름)을 도포 또는 부착하는 공정(S3)과, 상기 감광성물질(50) 상부에 패턴이 인쇄된 필름(40)이 밀착되는 필름밀착공정(S4)과, 상기 필름(40) 상부에 자연광 또는 자외선을 조사하여 필름(40)이 투명한 부분에 접한 감광성물질(50)은 견고하게 변화시키고, 필름(40)의 검은 부분에 접한 감광성물질(50)은 변화하지 않도록 하는 노광촬영공정(S5)과, 상기 노광촬영공정(S5) 후, 금속평판(10)에서 필름(40)을 이탈시켜 현상액에 침수시켜 노광촬영에 의해 변화하지 않은 감광성물질(50)을 용해하는 현상공정(S6)과, 상기 현상공정(S6)을 거친 후, 묽은 에칭액으로 금속평판(10)의 표면에 묻은 이물질을 제거하는 쇼트에칭공정(S7)과, 상기 쇼트에칭공 정(S7)을 거친 금속평판(10)을 진한 농도의 에칭액에 침수시켜 패턴이 관통되도록 하는 메인에칭공정(S8)과 상기 메인에칭공정(S8)을 거친 금속평판(10)에 부착된 감광성물질(50)을 제거하는 수세박리공정(S9)과 상기 수세박리공정(S9) 후에 금속평판(10)의 상면에 테이프(30)를 부착하는 상면 테이프부착공정(S10)과 상기 금속평판(10)의 하면의 테이프(20)를 이탈시키는 하면 테이프이탈공정(S11)과 상기 하면 테이프이탈공정(S11) 후, 금속평판(10)의 하면에 투명시트지(15)를 부착하는 투명시트지 부착공정(S12)과 상기 투명시트지(15)를 이탈시킨 후, 금속평판(10)의 상면의 테이프(30)를 이탈시키는 상면 테이프 이탈공정(S13)으로 이루어진다.The metal plate preparation step (S1) of cleaning the metal plate 10 to remove dirt, and the step of attaching the tape 20 to the lower surface of the metal plate 10 passed through the metal plate preparation step (S1) (S2) ), The step (S3) of applying or attaching a photosensitive material (50, a photosensitive aqueous film, a photosensitive resin film) on the metal flat plate (10), and a pattern printed on the photosensitive material (50) film 40 The film-adhering step (S4) in close contact with the film 40 and the photosensitive material 50 in contact with the transparent portion of the film 40 by irradiating natural light or ultraviolet rays to the upper portion of the film 40 is firmly changed, the black of the film 40 After the exposure photographing step (S5) and the exposure photographing step (S5) to prevent the photosensitive material 50 in contact with the portion, the film 40 is separated from the metal flat plate 10 and immersed in a developer solution for exposure photographing. The developing step (S6) of dissolving the photosensitive material (50) which is not changed by the step, and the developing step (S6). After hitting, a short etching process (S7) for removing foreign matter on the surface of the metal plate 10 with a thin etching solution, and the metal plate 10 subjected to the short etching process (S7) is immersed in a concentrated concentration of the etching solution Washing and peeling process (S9) and the washing and peeling process (S9) for removing the photosensitive material 50 attached to the metal plate 10 through the main etching process (S8) and the main etching process (S8) to allow the pattern to pass through The tape attaching step S10 for attaching the tape 30 to the upper surface of the metal flat plate 10 and the lower surface tape detachment step S11 for detaching the tape 20 of the lower surface of the metal flat plate 10. After the tape stripping step S11, the transparent sheet paper attaching step S12 for attaching the transparent sheet paper 15 to the bottom surface of the metal flat plate 10 and the transparent sheet paper 15 are separated, and then the metal sheet 10 is removed. It consists of an upper surface tape detachment process (S13) which isolate | separates the upper surface tape 30. FIG.

상기 제조방법에 의한 패턴이 형성된 금속평판(1)은, 금속평판(10)과 상기 금속평판(10)에 형성된 관통형 패턴(11)과 상기 금속평판(10)의 하면에 부착된 투명시트지(15)로 구성되고, 상기 관통형 패턴(11)은 통공(12) 또는 통공(12)과 통공 (12) 내부에 위치하는 피스(13)로 구성된다.The metal flat plate 1 having the pattern formed by the manufacturing method may be formed of a transparent sheet paper attached to the metal flat plate 10, the through-shaped pattern 11 formed on the metal flat plate 10, and the bottom surface of the metal flat plate 10. 15), and the through pattern 11 is formed of a through hole 12 or a piece 13 positioned inside the through hole 12 and the through hole 12.

상기 종래 기술에 의하면, 테이프를 여러 번 부착 후, 이탈시켜야 함으로써, 공정이 복잡해져서 작업이 번거롭게 되는 문제점이 있었다.According to the above prior art, when the tape is attached several times and then detached, there is a problem that the process becomes complicated and the work is cumbersome.

또한, 쇼트에칭공정과 메인에칭공정 시, 발생하는 발열에 의해 금속평판 하면에 부착된 테이프가 열에 의해 신장되고, 상기 쇼트에칭공정과 메인에칭공정 후, 상온(常溫)에서 다시 수축되기도 하고, 완성되고 나서는 투명시트지가 대기 내지는 실내 온도에 의해 신축됨으로써, 관통형 패턴의 피스가 통공 내부에서 유동하게 되어 재위치를 상실하게 되기 때문에, 관통형 패턴의 형상이 본래의 형상과는 상이해지는 문제점이 있었다.In addition, during the short etching process and the main etching process, the tape attached to the lower surface of the metal plate is elongated by heat due to the generated heat, and after the short etching process and the main etching process, the tape is shrunk again at room temperature and completed. Since the transparent sheet is stretched by air or room temperature, the piece of the through pattern flows inside the through hole and loses its position. Therefore, the shape of the through pattern differs from the original shape. .

그리고 상기 금속평판이 두께 0.25mm 이하의 박판일 경우에는 하면에 투명시트지가 부착되지만, 단지, 통공 내부에 피스가 재위치에 있도록 하는 역할만 함으로써, 박판인 금속평판의 강도를 보강할 수는 없었다. 따라서, 잘 구겨지는 등 손상되기 쉬웠으며, 강도를 보강하기 위해, 두꺼운 금속평판을 사용함으로써, 단가가 상승되는 문제점이 있었다.In the case where the metal plate is a thin plate having a thickness of 0.25 mm or less, transparent sheet paper is attached to the lower surface, but only by allowing the piece to be repositioned inside the through hole, the strength of the thin plate may not be reinforced. Therefore, it is easy to be wrinkled and damaged, and there is a problem that the unit price is increased by using a thick metal flat plate to reinforce the strength.

이에 본 발명에서는 상기 문제점을 해결할 수 있는 패턴이 형성된 금속평판의 제조방법 및 패턴이 형성된 금속평판을 제공하는 것을 목적으로 한다.Accordingly, an object of the present invention is to provide a method of manufacturing a metal plate with a pattern and a metal plate with a pattern, which can solve the above problems.

본 발명에 의한 패턴이 형성된 금속평판의 제조방법은 금속평판의 하면에 합성수지재로써 투명한 코팅제를 도포하여 건조하는 공정을 다수회 반복하여 코팅층 이 형성되도록 한 후, 관통형 패턴이 형성되도록 하고, 상기 코팅층이 염료에 의해 인쇄도 가능하도록 하고, 상기 제조방법에 의한 패턴이 형성된 금속평판은 금속평판과, 상기 금속평판에 형성된 관통형 패턴과, 상기 금속평판의 하면에 합성수지재로써 투명한 코팅제가 도포되어 고착된 코팅층으로 구성되도록 한다.In the method of manufacturing a patterned metal flat plate according to the present invention, the coating layer is formed by repeating a process of applying a transparent coating agent as a synthetic resin material to the bottom surface of the metal flat plate and drying it many times. The coating layer may be printed by dye, and the metal plate having the pattern formed by the manufacturing method may include a metal plate, a through-type pattern formed on the metal plate, and a transparent coating agent coated on the bottom surface of the metal plate as a synthetic resin material. It is intended to consist of a fixed coating layer.

본 발명에 의한 패턴이 형성된 금속평판의 제조방법 및 패턴이 형성된 금속평판은, 금속평판의 상면 내지는 하면에 테이프를 부착했다가 떼내는 등의 번거러운 작업이 생략됨으로써, 공정이 줄어들어 작업이 용이하며, 쇼트에칭 및 메인에칭 시, 발생하는 발열에 의해 고착된 코팅제가 신장되거나 쇼트에칭 및 메인에칭 후, 수축되지 않음으로써, 피스가 유동하여 제위치를 이탈하는 현상이 발생하지 않으며, 대기나 실내의 온도에도 신축되지 않고, 또한, 금속평판의 두께를 0.25mm 이하의 박판으로 구비하더라도 코팅층이 하면에 형성됨으로써, 강도의 보강이 가능하여 구겨지는 등의 손상 현상이 발생하지 않게 되고, 이로 인해서, 제조 코스트가 적게 소요되고, 코팅층이 염료로 인쇄된 경우, 이면에서 빛을 조사하게 되면 다양한 색상의 빛을 연출할 수 있는 효과가 있다.The manufacturing method of the patterned metal flat plate and the patterned metal flat plate according to the present invention eliminate the cumbersome work of attaching and detaching a tape to the upper surface or the lower surface of the metal plate, thereby reducing the process and making the work easier. In the short etching and the main etching, the coating fixed by the generated heat is not extended or contracted after the short etching and the main etching, so that the piece flows out of position and does not occur. Even if it is not stretched and is provided with a thin plate of 0.25 mm or less in thickness, the coating layer is formed on the lower surface, thereby preventing the occurrence of damage such as wrinkles due to reinforcement of strength and thus, manufacturing cost. Is less, and the coating is printed with a dye, the light from the back can produce a variety of colors It has an effect.

이하 첨부되는 도면과 관련하여 상기 목적을 달성하기 위한 본 발명을 살펴보면 다음과 같다.Hereinafter, with reference to the accompanying drawings, look at the present invention for achieving the above object.

도 3은 본 발명의 기술이 적용된 패턴이 형성된 금속평판의 제조방법을 도시한 블럭도, 도 4는 본 발명의 기술이 적용된 패턴이 형성된 금속평판의 제조방법을 도시한 공정도로서 함께 설명한다.FIG. 3 is a block diagram showing a method of manufacturing a metal plate on which a pattern is applied to which the technique of the present invention is applied, and FIG. 4 is a process diagram showing a method of manufacturing a metal plate on which a pattern to which the technique of the present invention is applied is formed.

일반적으로 금속평판(110)에 빛이 투과되도록 문양이나 문자로 디자인된 관통형 패턴(130)을 형성하게 될 경우, 상기 관통형 패턴(130)은 상하로 관통하는 통공(133)만으로 형성되거나, 상기 통공(133)과 통공(133)의 내부에 형성되는 피스(137)로 구성되는 데, 본 발명에서는 상기 금속평판(110)의 하면에 합성수지재로써, 투명하며 내약품성과 내용제성을 구비한 코팅제가 도포되어 고착된 코팅층(120)이 형성된 것을 특징으로 한다.In general, when forming the through-pattern 130 is designed in a pattern or a letter so that light is transmitted to the metal plate 110, the through-pattern 130 is formed of only the through-hole 133 penetrating up and down, or Consists of the through hole 133 and the piece 137 formed inside the through hole 133, in the present invention, the lower surface of the metal plate 110 as a synthetic resin material, transparent, having chemical resistance and solvent resistance The coating is applied, characterized in that the coating layer 120 is formed to be fixed.

이를 위한 본 발명의 패턴이 형성된 금속평판의 제조방법은 다음과 같이 이루어진다.Method for producing a metal plate with a pattern of the present invention for this purpose is made as follows.

금속평판(110)을 깨끗하게 세정하여 오물을 제거하는 금속평판 준비공정(T1)과, 상기 금속평판(110) 하면에 합성수지재로써 투명하며 내약품성과 내용제성을 구비한 코팅제를 도포한 후, 건조하여 고착시키는 작업을 다수회 반복하여 원하는 두께의 코팅층(120)이 형성되도록 하는 코팅제도포공정(T2)과, 상기 코팅제도포공정(T2)을 거친 금속평판(110)의 상면에 감광성물질(210, 감광성 수성막, 감광성수지필름)을 도포 또는 부착하는 감광성물질형성공정(T3)과, 상기 감광성물질(210) 상부에 패턴이 인쇄된 필름(220)이 밀착되는 필름밀착공정(T4)과, 상기 필름(220) 상부에 자연광 또는 자외선을 조사하여 필름(220)이 투명한 부분에 접한 감광성물질(210)은 견고하게 변화시키고, 필름(220)의 검은 부분에 접한 감광성물질(210)은 변화하지 않도록 하는 노광촬영공정(T5)과, 상기 노광촬영공정(T5) 후, 금속평판(110)의 필름(220)을 이탈시켜 현상액에 침수시켜 노광촬영에 의해 변화하지 않 은 감광성물질(210)을 용해하는 현상공정(T6)과, 상기 현상공정(T6)을 거친 후, 묽은 에칭액으로 금속평판(110)의 표면에 묻은 이물질을 제거하는 쇼트에칭공정(T7)과, 상기 쇼트에칭공정(T7)을 거친 금속평판(110)을 진한 농도의 에칭액에 침수시켜 패턴이 관통되도록 하는 메인에칭공정(T8)과 상기 메인에칭공정(T8)을 거친 금속평판(110)에 부착된 감광성물질(210)을 제거하는 수세박리공정(T9)으로 이루어진다. 그리고 상기 수세박리공정(T9) 후 상기 고착된 코팅층(120)에 염료가 인쇄되도록 하여 관통형 패턴(130)을 통해 다양한 칼라의 연출이 가능하도록 하는 코팅층 인쇄공정(T10)을 더 부가할 수도 있다.The metal plate preparation process (T1) to clean the metal plate 110 to remove dirt, and the coating on the lower surface of the metal plate 110 as a synthetic resin material with a chemical resistance and solvent resistance, and then dried A coating coating process (T2) to form a coating layer 120 having a desired thickness by repeating the fixing process a plurality of times, and the photosensitive material 210 on the upper surface of the metal flat plate 110 subjected to the coating coating process (T2). A photosensitive material forming step (T3) of applying or attaching a photosensitive aqueous film and a photosensitive resin film, a film adhesion step (T4) of adhering a film 220 having a pattern printed thereon to the photosensitive material 210, and the The photosensitive material 210 in contact with the transparent portion of the film 220 is firmly changed by irradiating natural light or ultraviolet rays to the upper portion of the film 220, and the photosensitive material 210 in contact with the black portion of the film 220 does not change. Exposure photography process (T5) After the exposure photographing step T5, the film 220 of the metal plate 110 is separated and immersed in a developing solution to dissolve the photosensitive material 210 which is not changed by exposure photographing. After the developing step (T6), the short etching step (T7) to remove the foreign matter on the surface of the metal plate 110 with a thin etching solution, and the metal plate 110 through the short etching step (T7) The main etching process (T8) to immerse in the etching solution of the concentration to penetrate the pattern and the flushing process (T9) to remove the photosensitive material 210 attached to the metal plate 110 through the main etching process (T8). Is done. In addition, a coating layer printing process (T10) may be further added to allow dyes to be printed on the fixed coating layer 120 after the flushing and peeling process (T9) to allow various colors to be produced through the through pattern 130. .

상기에서 코팅제는 아크릴 변성 폴리올 수지와 이소시아네이트를 주성분으로 하는 2액형 아크릴 우레탄 도료를 사용하는 것이 바람직한 데, 그 이유는 광택이 우수하고, 내약품성, 내용제성이 우수함으로써, 쇼트에칭공정(T7)과 메인에칭공정(T8)을 견딜 수 있으며, 특히, 금속 소재에 잘 부착되며, 고착되고 나서는 고체로서 우수한 강도성을 구비하기 때문이다.In the above coating agent, it is preferable to use a two-component acrylic urethane paint mainly composed of an acryl-modified polyol resin and an isocyanate, because of excellent gloss, excellent chemical resistance and solvent resistance, and thus, a short etching process (T7) and This is because it can withstand the main etching process (T8), and in particular, adheres well to the metal material and has excellent strength as a solid after being fixed.

상기에서 코팅층(120)에 염료가 인쇄되도록 하기 위해서는 실크스크린에 의한 인쇄 방법이 바람직한 데, 분사식도 가능하다.In order to allow the dye to be printed on the coating layer 120 in the above, a printing method using a silk screen is preferable, but spraying is also possible.

상기 제조방법에 의한 패턴이 형성된 금속평판(100)의 구성을 살펴보면 다음과 같다.Looking at the configuration of the metal plate 100 is a pattern formed by the manufacturing method as follows.

금속평판(110)과 상기 금속평판(110)에 형성된 관통형 패턴(130)과 상기 금속평판(110)의 하면에 합성수지재로써 투명한 코팅제가 도포되어 고착된 코팅층(120)이 구성된다. 상기 관통형 패턴(130)은 통공(133) 또는 통공(133)과 통 공(133) 내부에 위치하는 피스(137)로 구성되고, 상기 코팅층(120)은 염료가 인쇄되어 형성된 것일 수도 있다. 또한, 상기 코팅제는 아크릴 변성 폴리올 수지와 이소시아네이트를 주성분으로 하는 2액형 아크릴 우레탄 도료로 구성되는 것이 바람직하다.The metal plate 110, the through-pattern 130 formed on the metal plate 110, and a coating layer 120 formed by applying a transparent coating agent as a synthetic resin material on the bottom surface of the metal plate 110 are fixed. The through pattern 130 may include a through hole 133 or a piece 137 located inside the through hole 133 and the through hole 133, and the coating layer 120 may be formed by printing a dye. In addition, the coating agent is preferably composed of a two-component acrylic urethane paint mainly composed of an acrylic modified polyol resin and an isocyanate.

상기 본 발명에 의하면, 금속평판(110)의 상면 내지는 하면에 테이프를 부착했다가 떼내는 등의 번거러운 작업이 생략됨으로써, 공정이 줄어들어 작업이 용이하며, 쇼트에칭 및 메인에칭 시, 발생하는 발열에 의해 고착된 코팅제가 신장되거나 쇼트에칭 및 메인에칭 후, 수축되지 않음으로써, 피스(137)가 유동하여 제위치를 이탈하는 현상이 발생하지 않는다. 물론, 대기 내지는 실내의 온도에 의해서도 신축되지 않음은 물론이다. 상기 합성수지제인 코팅제가 원하는 두께로 고착되고나면, 견고한 고체로 응고됨으로써, 유연한 투명시트지에 비해 온도에 의한 신축현상이 발생하지 않게 됨은 물론이다. 또한, 금속평판(110)의 두께를 0.25mm 이하의 박판으로 구비하더라도 코팅층(120)이 하면에 형성됨으로써, 강도의 보강이 가능하여 구겨지는 등의 손상 현상이 발생하지 않게 되고, 이로 인해서, 제조 코스트가 적게 소요되는 이점이 있다. 그리고, 코팅층(120)이 염료로 인쇄된 경우, 이면에서 빛을 조사하게 되면 다양한 색상의 빛을 연출할 수 있다.According to the present invention, the cumbersome operation such as attaching and detaching the tape to the upper surface or the lower surface of the metal flat plate 110 is omitted, thereby reducing the process and easy operation, and the heat generated during short etching and main etching. The stretched coating is not contracted after being stretched or short etched and main etched, so that the piece 137 flows out of position. Of course, it is not stretched even by the temperature of the atmosphere or the room. After the coating agent, which is made of synthetic resin, is fixed to a desired thickness, it solidifies into a solid solid, and thus, it does not occur that stretching due to temperature occurs as compared with flexible transparent sheet paper. In addition, even when the thickness of the metal plate 110 is provided with a thin plate of 0.25 mm or less, since the coating layer 120 is formed on the lower surface, it is possible to reinforce the strength so that a phenomenon such as wrinkling does not occur, thereby producing There is an advantage of low cost. In addition, when the coating layer 120 is printed with a dye, it is possible to produce a variety of colors of light when irradiated with light from the back.

도 1은 종래의 기술이 적용된 패턴이 형성된 금속평판의 제조방법을 도시한 블럭도.1 is a block diagram showing a method of manufacturing a metal flat plate with a pattern applied with the prior art.

도 2는 종래의 기술이 적용된 패턴이 형성된 금속평판의 제조방법을 도시한 공정도.Figure 2 is a process diagram showing a method of manufacturing a metal plate with a pattern applied with the prior art.

도 3은 본 발명의 기술이 적용된 패턴이 형성된 금속평판의 제조방법을 도시한 블럭도.Figure 3 is a block diagram showing a method of manufacturing a metal plate formed with a pattern to which the technique of the present invention is applied.

도 4는 본 발명의 기술이 적용된 패턴이 형성된 금속평판의 제조방법을 도시한 공정도.Figure 4 is a process chart showing a method of manufacturing a metal plate plate with a pattern to which the technique of the present invention is applied.

*도면의 주요 부분에 사용된 부호의 설명** Description of the symbols used in the main parts of the drawings *

110: 금속평판110: metal plate

120: 코팅층120: coating layer

130: 관통형 패턴130: through pattern

133: 통공133: through

137: 피스137: piece

210: 감광성물질210: photosensitive material

220: 필름220: film

Claims (4)

패턴이 형성된 금속평판의 제조방법에 있어서,In the method of manufacturing a metal flat plate formed with a pattern, 금속평판(110)을 깨끗하게 세정하여 오물을 제거하는 금속평판 준비공정(T1)과, Metal plate preparation process (T1) to clean the metal plate 110 to remove dirt, and 상기 금속평판(110) 하면에 합성수지재로써 투명한 코팅제를 도포한 후, 건조하여 고착시키는 작업을 다수회 반복하여 원하는 두께의 코팅층(120)이 형성되도록 하는 코팅제도포공정(T2)과, After coating the transparent coating agent as a synthetic resin material on the lower surface of the metal plate 110, the coating and coating process (T2) to form a coating layer 120 of a desired thickness by repeating the operation of drying and fixing a plurality of times, and 상기 코팅제도포공정(T2)을 거친 금속평판(110)의 상면에 감광성물질(210)을 도포 또는 부착하는 감광성물질형성공정(T3)과, A photosensitive material forming step (T3) of applying or attaching the photosensitive material 210 to the upper surface of the metal flat plate 110 which has undergone the coating coating process (T2); 상기 감광성물질(210) 상부에 패턴이 인쇄된 필름(220)이 밀착되는 필름밀착공정(T4)과, A film adhesion process (T4) in which the film 220 having the pattern printed on the photosensitive material 210 is in close contact with the photosensitive material 210; 상기 필름(220) 상부에 자연광 또는 자외선을 조사하는 노광촬영공정(T5)과, An exposure photographing step (T5) of irradiating natural light or ultraviolet light on the film 220; 상기 노광촬영공정(T5) 후, 금속평판(110)에서 필름(220)을 이탈시켜 현상액에 침수시키는 현상공정(T6)과, After the exposure photographing step (T5), the developing step (T6) of leaving the film 220 in the metal plate 110 and immersed in the developing solution, 상기 현상공정(T6)을 거친 후, 묽은 에칭액으로 금속평판(110)의 표면에 묻은 이물질을 제거하는 쇼트에칭공정(T7)과, After the developing step (T6), a short etching step (T7) to remove the foreign matter on the surface of the metal plate 110 with a thin etching solution, 상기 쇼트에칭공정(T7)을 거친 금속평판(110)을 진한 농도의 에칭액에 침수시켜 패턴이 관통되도록 하는 메인에칭공정(T8)과,The main etching step (T8) to immerse the metal plate 110 passed through the short etching step (T7) in the etching solution of a thick concentration to penetrate the pattern, 상기 메인에칭공정(T8)을 거친 금속평판(110)에 부착된 감광성물질(210)을 제거하는 수세박리공정(T9)으로 이루어지는 것을 특징으로 하는 패턴이 형성된 금속평판의 제조방법.Method for producing a metal plate with a pattern, characterized in that consisting of a water-washing peeling process (T9) for removing the photosensitive material 210 attached to the metal plate 110 through the main etching process (T8). 제 1 항에 있어서,The method of claim 1, 상기 수세박리공정(T9)을 거친 금속평판(110)의 코팅층(120)에 염료가 인쇄되도록 하는 코팅층 인쇄공정(T10)이 더 부가되는 것을 특징으로 하는 패턴이 형성된 금속평판의 제조방법.The method of manufacturing a metal plate with a pattern, characterized in that the coating layer printing step (T10) is further added so that the dye is printed on the coating layer (120) of the metal plate (110) that went through the flushing process (T9). 패턴이 형성된 금속평판(100)을 구성함에 있어서,In constructing the metal flat plate formed pattern, 금속평판(110)과,Metal plate 110, 상기 금속평판(110)에 형성된 관통형 패턴(130)과,The through pattern 130 formed on the metal plate 110 and, 상기 금속평판(110)의 하면에 합성수지재로써 투명한 코팅제가 도포되어 고착된 코팅층(120)으로 구성되고, The lower surface of the metal plate 110 is composed of a coating layer 120 is fixed by applying a transparent coating agent as a synthetic resin material, 상기 관통형 패턴(130)은 통공(133) 또는 통공(133)과 통공(133) 내부에 위치하는 피스(137)로 구성되는 것을 특징으로 하는 패턴이 형성된 금속평판.The through-type pattern 130 is a metal flat plate formed with a pattern, characterized in that consisting of a through hole (133) or a hole (133) and a piece (137) located inside the through hole (133). 제 3 항에 있어서,The method of claim 3, wherein 상기 코팅층(120)은 염료가 인쇄된 것을 특징으로 하는 패턴이 형성된 금속평판.The coating layer 120 is a metal plate formed with a pattern, characterized in that the dye is printed.
KR1020080006570A 2008-01-22 2008-01-22 Method for making perforation patterns on a metal plate and the metal plate having patterns KR101012854B1 (en)

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