TWI506286B - - Google Patents

Info

Publication number
TWI506286B
TWI506286B TW103134598A TW103134598A TWI506286B TW I506286 B TWI506286 B TW I506286B TW 103134598 A TW103134598 A TW 103134598A TW 103134598 A TW103134598 A TW 103134598A TW I506286 B TWI506286 B TW I506286B
Authority
TW
Taiwan
Application number
TW103134598A
Other languages
Chinese (zh)
Other versions
TW201614246A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW103134598A priority Critical patent/TW201614246A/zh
Application granted granted Critical
Publication of TWI506286B publication Critical patent/TWI506286B/zh
Publication of TW201614246A publication Critical patent/TW201614246A/zh

Links

TW103134598A 2014-10-03 2014-10-03 Temperature control device of crimping device of test equipment and temperature control method thereof TW201614246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103134598A TW201614246A (en) 2014-10-03 2014-10-03 Temperature control device of crimping device of test equipment and temperature control method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103134598A TW201614246A (en) 2014-10-03 2014-10-03 Temperature control device of crimping device of test equipment and temperature control method thereof

Publications (2)

Publication Number Publication Date
TWI506286B true TWI506286B (de) 2015-11-01
TW201614246A TW201614246A (en) 2016-04-16

Family

ID=55220065

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103134598A TW201614246A (en) 2014-10-03 2014-10-03 Temperature control device of crimping device of test equipment and temperature control method thereof

Country Status (1)

Country Link
TW (1) TW201614246A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641842B (zh) * 2017-08-14 2018-11-21 鴻勁精密股份有限公司 Crimp of electronic component crimping mechanism and test classification device thereof
CN111583988A (zh) * 2019-02-15 2020-08-25 优匹益株式会社 用于测试集成电路器件的装置及其方法
TWI741491B (zh) * 2020-02-07 2021-10-01 孫偉志 安置在用於測試一處理器之燒機座上的具有三維散熱之處理器散熱模組與其使用方法
TWI769627B (zh) * 2020-12-18 2022-07-01 鴻勁精密股份有限公司 溫控單元及其應用之作業設備

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613448B (zh) * 2017-04-06 2018-02-01 致茂電子股份有限公司 具有差異下壓力之電子元件壓接裝置
TWI634336B (zh) * 2017-08-29 2018-09-01 京元電子股份有限公司 浮動溫度感應裝置及使用該裝置之半導體元件測試模組
TWI632843B (zh) * 2017-12-01 2018-08-11 微星科技股份有限公司 人臉及身分辨識機
TWI682270B (zh) * 2018-07-24 2020-01-11 致茂電子股份有限公司 高低溫測試設備及其測試方法
CN110749783B (zh) * 2018-07-24 2022-05-10 致茂电子股份有限公司 高低温测试设备及其测试方法
CN113447748B (zh) * 2021-06-29 2023-03-24 贵州航天电子科技有限公司 一种用于电子产品高低温试验的装置
TWI834475B (zh) * 2023-01-13 2024-03-01 鴻勁精密股份有限公司 壓接機構、測試裝置及作業機
TWI827473B (zh) * 2023-02-22 2023-12-21 鴻勁精密股份有限公司 電子元件作業機

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034978A (en) * 1999-05-12 2000-03-07 Cymer, Inc. Gas discharge laser with gas temperature control
TWI247399B (en) * 2004-06-01 2006-01-11 Via Tech Inc Package and temperature-control method of electronic device with active temperature control
CN201152650Y (zh) * 2007-12-18 2008-11-19 华南理工大学 固体多点阵冷热转换设备
TWM376907U (en) * 2009-09-29 2010-03-21 Shen-Quan Zheng LED lamp with ceramic thermoelectric heat-dissipation substrate
TWI368651B (en) * 2008-10-24 2012-07-21 Quanta Comp Inc Temperature variation apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034978A (en) * 1999-05-12 2000-03-07 Cymer, Inc. Gas discharge laser with gas temperature control
TWI247399B (en) * 2004-06-01 2006-01-11 Via Tech Inc Package and temperature-control method of electronic device with active temperature control
CN201152650Y (zh) * 2007-12-18 2008-11-19 华南理工大学 固体多点阵冷热转换设备
TWI368651B (en) * 2008-10-24 2012-07-21 Quanta Comp Inc Temperature variation apparatus
TWM376907U (en) * 2009-09-29 2010-03-21 Shen-Quan Zheng LED lamp with ceramic thermoelectric heat-dissipation substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641842B (zh) * 2017-08-14 2018-11-21 鴻勁精密股份有限公司 Crimp of electronic component crimping mechanism and test classification device thereof
CN111583988A (zh) * 2019-02-15 2020-08-25 优匹益株式会社 用于测试集成电路器件的装置及其方法
TWI741491B (zh) * 2020-02-07 2021-10-01 孫偉志 安置在用於測試一處理器之燒機座上的具有三維散熱之處理器散熱模組與其使用方法
TWI769627B (zh) * 2020-12-18 2022-07-01 鴻勁精密股份有限公司 溫控單元及其應用之作業設備

Also Published As

Publication number Publication date
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