TWI504885B - Pattern inspection apparatus and pattern inspection method - Google Patents

Description

Pattern inspection device and pattern inspection method

The present invention relates to a pattern inspection device and a pattern inspection method for inspecting a pattern on a transparent substrate.

In the manufacture of a touch panel used in a smart phone or the like, a metal wiring pattern is formed on a transparent film such as a PET (polyethylene terephthalate) film. The metal wiring pattern as the lead is formed on the outer edge portion of the touch panel, and is connected to the transparent electrode pattern formed at the central portion, wherein the central portion is the screen of the touch panel. In recent years, in order to increase the screen of the touch panel, a method of making the pattern elements of the metal wiring pattern at the outer edge portion thinner is performed. In this case, in order to flow a current of the same magnitude to the metal wiring pattern under the same conditions as before, the thickness of the metal wiring pattern is made larger than the conventional configuration (increasing the aspect ratio) to maintain the cross-sectional area of the pattern element.

Further, a method is disclosed in Japanese Patent Laid-Open Publication No. SHO-62-119444 (Document 1), JP-A-2006-72147 (Document 2), and JP-A-2006-105816 (Document 3). A reflection image of the reflected light of the light illuminating the main surface on one side of the transparent substrate, and a penetration image of the transmitted light according to the light illuminating the main surface on the other side of the substrate The pattern on the substrate.

However, the metal wiring pattern is formed, for example, by locally etching the metal thin film. At this time, depending on the etching conditions, the upper surface of the pattern element may become rough. State, or pattern elements are not etched clearly and accurately. Therefore, the demand for inspection of both the upper surface of the pattern element and the end (lower portion) of the pattern element is increased. Further, in the case where the metal wiring pattern is formed by the printed electronic technique, since the end of the pattern element is easily spread, the necessity of inspecting the end of the metal wiring pattern is further increased.

In this case, it is conceivable to apply the methods of Documents 1 to 3 to obtain a reflection image of the upper surface of the display pattern element and a penetration image of the end of the display pattern element. However, in the apparatuses of Documents 1 to 3, it is necessary to have two imaging units that respectively acquire a reflection image and a penetration image. As a result, the number of parts of the pattern inspection device is increased, and the manufacturing cost of the device is increased.

The present invention is a pattern inspection apparatus suitable for inspecting a pattern on a transparent substrate, and an object thereof is to reduce the number of parts of a pattern inspection apparatus that can obtain a reflection image and penetrate an image.

A pattern inspection device according to the present invention includes: a first light source unit that illuminates a main surface on a side of a pattern formed on a plate-shaped or film-shaped transparent substrate; and a second light source unit that is transparent to the surface The main surface of the other side of the substrate is irradiated with light; a light receiving portion that receives the reflected light from the pattern from the first light source portion and the light from the second light source portion from the transparent substrate a light-transmitting mechanism that moves the transparent substrate relative to the first light source portion, the second light source portion, and the light-receiving portion in a moving direction along a main surface of the one side; a portion of the transparent substrate that is relatively moved in a continuous or intermittent manner by the moving mechanism, wherein the first light source portion and the second light source portion are alternately lit, thereby using the above The light receiving unit obtains a reflection image according to the reflected light and a penetration image according to the transmitted light; and an inspection unit according to the reflection image and the upper The penetrating image is obtained, and the inspection result of the above pattern is obtained. According to the present invention, it is possible to obtain a reflection image and a penetration image by one light receiving unit, and it is possible to reduce the number of parts of the pattern inspection device.

In a preferred aspect of the present invention, the light receiving unit is a line sensor that obtains an image of a linear region that intersects the moving direction on the transparent substrate, and the line sensor is alternated by the line sensor. The method obtains a line image of the reflected image and a line image of the through image. Thereby, the reflected image and the transmitted image can be efficiently obtained.

In another preferred embodiment of the present invention, the pattern inspection device further includes another light receiving portion, and the other light receiving portion receives the light from the second light source portion from the main surface of the one side. The reflected light below the pattern is taken to obtain another reflected image. Thereby, it is possible to easily check the thickness or the size of the end of the pattern element.

It is preferable that the above pattern is formed of a metal.

The present invention is also suitable for a pattern inspection method for inspecting a pattern on a transparent substrate using a pattern inspection device.

The above and other objects, features, aspects and advantages of the invention are apparent from the accompanying drawings.

1‧‧‧ pattern inspection device

2‧‧‧Mobile agencies

3, 3a‧‧‧ image acquisition unit

9‧‧‧Transparent substrate

11‧‧‧Control Department

12‧‧‧ Inspection Department

21‧‧‧ Roll

22‧‧‧Supply Department

23‧‧‧Winding Department

31‧‧‧First optical system

32‧‧‧Second optical system

81‧‧‧ pattern

91‧‧‧ first major surface

92‧‧‧Second major surface

311‧‧‧ Collimating lens

312‧‧‧ half mirror

313‧‧‧object lens

314‧‧‧ imaging lens

320‧‧‧ lens

321‧‧‧ collimating lens

322‧‧‧half mirror

323‧‧‧object lens

324‧‧‧ imaging lens

331‧‧‧First Light Source Department

332‧‧‧Second light source department

341‧‧‧Receiving Department

342‧‧‧Receiving Department

811‧‧‧pattern elements

812‧‧‧ dish-shaped depression area

W1‧‧‧Small amount

W2‧‧‧

Fig. 1 is a view showing the configuration of a pattern inspection device.

Fig. 2 is a view showing the internal configuration of an image acquisition unit.

Fig. 3 is a view showing an operation flow for inspecting a pattern on a transparent substrate.

Figure 4 is a cross-sectional view showing a pattern on a transparent substrate.

Fig. 5 is a graph showing changes in luminance values in the above-mentioned reflected image and transmitted image.

Fig. 6 is a plan view showing a pattern element.

Fig. 7 is a view showing a penetration image.

Figure 8 is a diagram showing the above reflected image.

Figure 9 is a cross-sectional view showing a pattern on a transparent substrate.

Fig. 10 is a view showing the configuration of an image acquisition unit of the pattern inspection device according to another embodiment.

Fig. 11 is a view showing changes in luminance values in the upper reflection image and the lower reflection image.

Fig. 1 is a view showing the configuration of a pattern inspection device 1 according to an embodiment of the present invention. The pattern inspection device 1 is a device for inspecting a pattern formed of a metal on a resin-made transparent substrate 9 (for example, a PET film). The pattern inspection device 1 includes a moving mechanism 2 that continuously moves a continuous portion of the transparent substrate 9 in the Y direction (hereinafter referred to as a "moving direction" in FIG. 1; the image acquisition unit 3; The image of the transparent substrate 9 in the middle of the movement is obtained, and the control unit 11 is responsible for the overall control of the pattern inspection device 1. The control unit 11 has an inspection unit 12 that performs inspection of a pattern based on the acquired image. Further, the inspection unit 12 may be provided separately from the control unit 11.

The moving mechanism 2 has two rollers 21 that are long in the X direction (the direction perpendicular to the moving direction) in FIG. 1, and the two rollers 21 are arranged in the moving direction via the image acquiring unit 3. On the (-Y) side of the two rolls 21, a supply portion 22 that holds the rolls of the transparent substrate 9 before inspection and simultaneously feeds the respective portions of the transparent substrate 9 from the rolls is provided. A winding portion 23 that winds a portion where the inspection of the transparent substrate 9 is performed in a roll shape and holds it is provided on the (+Y) side of the two rolls 21. In the following description, the case where only the transparent substrate 9 is referred to means a portion of the transparent substrate 9 in the middle of the movement in the moving direction (that is, a portion of the transparent substrate 9 between the two rolls 21). As shown in FIG. 1, in the image obtaining unit 3 disposed between the two rollers 21, the transparent substrate 9 is stretched perpendicularly to the Z direction in FIG. 1 (that is, toward the X direction and the Y direction). exhibition.

FIG. 2 is a view showing the internal configuration of the image acquisition unit 3. The image acquisition unit 3 includes a first light source unit 331 disposed on the (+Z) side of the transparent substrate 9 , a first optical system 31 and a light receiving unit 341 , and is disposed on the (-Z) side of the transparent substrate 9 . The second light source unit 332 and the second optical system 32. Specifically, the first light source unit 331 is an array of LEDs in which a plurality of light emitting diodes (LEDs) are arranged in a row, and each of the LEDs emits light of, for example, a blue wavelength band. The light from the first light source portion 331 is taken straight (parallel) by the collimator lens 311 of the first optical system 31, and is reflected by the half mirror 312 to be incident on the objective lens 313. The light passing through the object lens 313 is irradiated onto the main surface (the (+Z) side) which is one of the transparent substrates 9 on the first main surface 91. The region on the transparent substrate 9 on which the light from the first light source portion 331 is irradiated is a linear region which is intersected with the moving direction (preferably, orthogonal to the moving direction). A pattern is formed on the first main surface 91 of the transparent substrate 9 with a metal such as copper, and the light from the light incident on the lens 313 is reflected by the pattern, and the light is irradiated to other regions. The transparent substrate 9 is penetrated (refer to FIG. 4 described later).

The light reflected by the surface of the pattern (mainly reflected by the surface in the (+Z) direction of the pattern) is incident on the objective lens 313, and the light passing through the objective lens 313 passes through the half mirror 312 and the imaging lens. 314 is guided to the light receiving unit 341. The light receiving unit 341 is a line sensor in which a plurality of light receiving elements are arranged in a line, and an image of blue light in a linear region on the transparent substrate 9 is formed on a light receiving surface of a plurality of light receiving elements, that is, a linear light receiving region. . Thereby, when the first light source unit 331 is in the lighting state and the second light source unit 332 is in the light-off state, the light receiving unit 341 acquires the surface from the upper side of the pattern (that is, the surface in the (+Z) direction of the pattern). A line of reflected light (pixels arranged in a row). The line images are sequentially output to the control unit 11.

The second light source unit 332 is also the same LED array as the first light source unit 331 Columns, each LED emits light in a red wavelength band. The light from the second light source portion 332 is irradiated onto the other main surface (of the (-Z) side) of the transparent substrate 9 via the lens 320 of the second optical system 32, that is, the second main surface 92. The region on the transparent substrate 9 irradiated with the light from the second light source portion 332 is a linear region (which is preferably orthogonal to the moving direction) that intersects the moving direction, and is in the Z direction from the first The linear regions irradiated by the light of the light source portion 331 substantially overlap each other. Light rays from the light of the second optical system 32 that are irradiated to the region other than the lower surface of the pattern of the first main surface 91 are transmitted through the transparent substrate 9 (see FIG. 4 described later).

The red light that has penetrated the transparent substrate 9 is guided to the light receiving portion 314 via the objective lens 313, the half mirror 312, and the imaging lens 314, similarly to the blue light reflected by the transparent substrate 9. Thereby, when the second light source unit 332 is in the lighting state and the first light source unit 331 is in the light-off state, the light receiving unit 341 acquires the line image of the transmitted light according to the red light. The line images are sequentially output to the control unit 11.

As described above, in the light receiving portion 341, the reflected light from the pattern of the light from the first light source portion 331 and the transmitted light from the transparent substrate 9 of the light from the second light source portion 332 can be received. Further, the upper and lower sides of the pattern may not be the upper and lower directions of the gravity direction, but may be arranged such that the upper surface of the pattern faces downward or in the horizontal direction according to the arrangement of the image obtaining unit 3 in the pattern inspection device 1. .

FIG. 3 is a view showing an operation flow of the pattern inspection device 1 for inspecting the pattern on the transparent substrate 9. In the inspection of the pattern, first, the moving substrate 2 starts to continuously move the transparent substrate 9 in the moving direction (step S11). Next, the first light source unit 331 and the second light source unit 332 are alternately turned on by the control of the control unit 11. In other words, the lighting of the first light source unit 331 and the turning off of the second light source unit 332, the turning off of the first light source unit 331, and the lighting of the second light source unit 332 are repeated at high speed. Thereby, with the transparent substrate 9 In the continuous movement synchronization, the line image of the reflected light according to the self-pattern of the light from the first light source unit 331 is alternately obtained in the light receiving unit 341, and the light is transmitted from the transparent substrate 9 according to the light from the second light source unit 332. Light line image. That is, a two-dimensional image based on the reflected light from the upper surface of the pattern (hereinafter referred to as "upper reflected image") and a two-dimensional image based on the transmitted light penetrating from the transparent substrate 9 are obtained ( Hereinafter, it is referred to as "penetrating image" (step S12).

As described above, in the pattern inspection apparatus 1, the transparent substrate 9 is continuously moved while the line image of the above-described reflected image and the line image of the transmitted image are alternately obtained. Therefore, if a region on the transparent substrate 9 corresponding to one line image is referred to as a line image region, each of the above-described reflected image and the penetrating image becomes an image showing a line image region of each interval. (ie, cross-sectional image).

For example, when the light receiving unit 341 as the line sensor has 16000 light receiving elements and the clock frequency of the line sensor is 640 megahertz (MHz), in order to obtain one line image in the light receiving unit 341, Since it takes 25 microseconds (μs), the lighting of the first light source unit 331 and the second light source unit 332 is alternately performed at intervals of 25 μs. In this case, for example, when the line image is obtained with the width of the line image area in the scanning direction being 2 micrometers (μm), the moving speed of the transparent substrate 9 in the moving direction is set to 80 mm per second (80 mm). /s). Further, when the moving speed of the transparent substrate 9 is 40 mm/s, the width of the line image region is 1 μm, and the upper reflection image and the penetration image of the intersection can be obtained in the same manner.

4 is a cross-sectional view showing an example of a pattern 81 on the transparent substrate 9. The pattern 81 in the present embodiment is a wiring pattern formed of a metal. In the transparent substrate 9 used for the touch panel, the pattern 81 is formed in a region corresponding to the outer edge portion of the touch panel, and is connected to a transparent electrode pattern formed in a region corresponding to the central portion by ITO or the like. That is, the pattern 81 is an opaque pattern that is connected to the transparent electrode pattern. Pattern 81 has a plurality Pattern elements 811. The width of each of the pattern elements 811 is, for example, 10 to 30 μm. In the upper part of FIG. 4 and FIG. 5 which will be described later, the ideal pattern element 811 is formed by a two-dot chain line (the same applies to the upper part of FIG. 9 and FIG. 11 which will be described later). In the pattern element 811 of Fig. 4, the end is thicker (the bottom end is wider).

Fig. 5 is a graph showing changes in luminance values in the above-mentioned reflected image and transmitted image. The upper part of FIG. 5 shows the pattern element 811 of one part of FIG. 4 , and the middle part shows the change of the brightness value of the pixel arranged in the X direction (corresponding to the direction) in the upper reflection image of the pattern element 811, and the lower part is displayed in the lower part. The change in the luminance value of the pixels arranged in the X direction in the through image of the pattern element 811 is displayed.

The inspection unit 12 acquires the inspection result of the pattern based on the above-described reflected image and the transmitted image (step S13). In detail, as a check process, the above-mentioned reflected image and the penetrated image are compared. In the example of the upper stage of FIG. 5 where the end of the pattern element 811 is thicker, the upper reflection image shown in the middle section corresponds to the upper surface of the pattern element 811 (that is, the surface opposite to the side opposite to the transparent substrate 9). The brightness value of the included pixels is increased. On the other hand, in the penetration image shown in the lower stage, the luminance value of the pixel included in the range corresponding to the lower surface of the pattern element 811 (that is, the surface in contact with the transparent substrate 9) becomes lower. Therefore, in the inspection unit 12, the pattern element can be obtained by obtaining the difference between the edge position of the upper surface of the pattern element 811 indicated by the upper reflection image and the edge position of the lower surface of the pattern element 811 indicated by the penetration image. A large amount of W2 in the end of 811.

When the rough amount W2 is compared with the predetermined critical value, when the threshold value is equal to or greater than the critical value, the end of the pattern element 811 has a coarseness exceeding the allowable range, and is displayed on the display portion as a result of the inspection of the pattern. (The illustration is omitted). Actually, the above-described reflected image is also displayed on the display portion, and the operator can confirm the state of the upper surface of the pattern element 811 (the roughness of the upper surface, etc.) by referring to the above-described reflected image.

In the other inspection processing in the inspection unit 12, the presence or absence of the depression on the upper surface of the pattern element 811 is detected based on the penetration image. Here, the depression on the upper side of the pattern element 811 is also referred to as a dish-shaped depression, and the thickness of the pattern element 811 becomes small at the portion where the depression is generated. In the pattern element 811 having a thickness of several hundred nanometers (nm), the thickness of the pattern element 811 in the portion where the recess is generated is, for example, 70 nm or less, and the red light from the second light source portion 332 is relative to several hundreds of nm. The penetration rate of the metal film of the thickness is approximately 0, and the transmittance of the metal film having a thickness of 70 nm or less is higher.

For example, in the pattern element 811 shown in FIG. 6, in the case where a region 812 surrounded by a thin line (hereinafter referred to as "dish-shaped depressed region 812") is formed with a depression, as shown in FIG. In most of the area of the area where the pattern element 811 is displayed in the penetrating image, the luminance value is lowered (darkened), but in the area where the dish-shaped depressed area 812 is displayed, the luminance value is increased (brightened) than the surrounding area. In Fig. 7, by changing the interval of the parallel oblique lines to show the difference in luminance values, the narrower the interval between the parallel oblique lines, the lower the luminance value.

Further, among the blue light from the first light source unit 331, the transmittance of a metal film (for example, Cu, Ag, etc.) having a thickness of several hundred nm and a metal film having a thickness of 70 nm or less are substantially 0, but due to reflection The direction of the light changes due to dishing, so the dished area is slightly darkened. As shown in FIG. 8, in the above-described reflected image, the luminance value of substantially the entire area of the upper surface of the display pattern element 811 is increased (brightened), but the dish-shaped depressed area is slightly darkened. Therefore, in the inspection unit 12, by detecting the penetration image and the above-described reflection image by a predetermined method to obtain an image showing the dish-shaped depressed region 812, it is possible to easily detect the dish-shaped depressed region 812. . When the dish-shaped depressed region 812 having a predetermined area or more is detected, a depression is formed on the upper surface of the pattern element 811, and the result of inspection as a pattern is displayed on the display portion. Further, an image of the dish-shaped depressed region 812 may be displayed on the display portion.

As described above, the inspection result of the pattern is obtained based on the above-described reflected image and the transmitted image. The processing of steps S12 and S13 is repeatedly performed each time the transparent substrate 9 is moved by a certain distance. When the inspection of the entire transparent substrate 9 is completed, the light source of the first light source unit 331 and the second light source unit 332 is stopped, and the movement of the transparent substrate 9 is stopped, and the inspection is terminated (step S14). Further, in the inspection unit 12, the area of the thick amount W2 or the dish-shaped depressed area 812 may be used as a result of inspection of the pattern. In other words, the pattern inspection device 1 can also be used as a measuring device for measuring a large number of patterns, an area of the dish-shaped depressed region 812, and the like.

As described above, in the pattern inspection apparatus 1, the first light source unit 331 that irradiates light onto the first main surface 91 on the transparent substrate 9 on which the pattern 81 is formed on the first main surface 91 is provided. The second light source portion 332 that illuminates the second main surface 92, and the reflected light from the pattern 81 that can receive the light from the first light source portion 331 and the light from the second light source portion 332 are worn from the transparent substrate 9. One light receiving portion 341 that transmits light. Further, by alternately moving the first light source unit 331 and the second light source unit 332 while continuously moving the transparent substrate 9, it is possible to obtain a reflection image according to the reflected light using one light receiving unit 341 and to wear it. Penetrating image of light transmission. Thereby, the number of parts of the pattern inspection apparatus 1 can be reduced, and the manufacturing cost of the pattern inspection apparatus 1 can be reduced.

Further, in the pattern inspection apparatus 1, the light of the red wavelength band is emitted by the second light source unit 332, thereby detecting the depression of the pattern element 811 from the penetration image. Further, the light receiving unit 341 is a line sensor that obtains an image of a linear region on the transparent substrate 9 that intersects the moving direction, and the line sensor alternately obtains a line image and penetration of the above-mentioned reflected image. Line image of the image. Thereby, the above-described reflected image and transmitted image can be efficiently obtained.

However, as shown in FIG. 9, the end of the pattern element 811 is fine (bottom end) In the case of the narrowed image, the transmitted image obtained by the light receiving unit 341 cannot be the end of the display pattern element 811 due to the influence of the upper portion of the pattern element 811, and the end portion cannot be obtained in a small amount. Hereinafter, a small amount of the pattern inspection device 1 that can obtain the end of the pattern element 811 will be described.

Fig. 10 is a view showing the configuration of an image acquisition unit 3a of the pattern inspection device 1 according to another embodiment of the present invention. In the image acquisition unit 3a of FIG. 10, the second optical system 32 is different in composition from the image acquisition unit 3 of FIG. 2, and further another light is added to the (-Z) side of the transparent substrate 9. Part 342. The other configurations are the same as those of the image acquisition unit 3 of Fig. 2, and the same components are denoted by the same reference numerals.

In the image acquisition unit 3a of FIG. 10, the light from the second light source unit 332 is taken straight (parallel) by the collimator lens 321 of the second optical system 32, and then incident on the objective lens 323 via the half mirror 322. The light passing through the object lens 323 is irradiated onto the second main surface 92 of the transparent substrate 9. The region on the transparent substrate 9 on which the light is irradiated is a linear region that intersects the moving direction. Light rays from the light rays of the object lens 323 which are irradiated on the lower surface of the pattern 81 in contact with the first main surface 91 are reflected under the light, and light rays irradiated to other regions penetrate the transparent substrate 9. Light reflected from under the pattern 81 is incident on the objective lens 323. The light passing through the objective lens 323 is reflected by the half mirror 322, and then guided to the light receiving portion 342 via the imaging lens 324. The light receiving unit 342 is a line sensor similar to the light receiving unit 341, and the red light from the linear region on the transparent substrate 9 is received by the linear light receiving region.

Further, the light transmitted from the transparent substrate 9 in the light irradiated onto the first main surface 91 by the first light source portion 331 is guided to the light receiving portion 342 via the objective lens 323, the half mirror 322, and the imaging lens 324. . In this manner, in the light receiving portion 342, the reflected light from the pattern 81 and the light from the first light source portion 331 from the transparent substrate 9 can be received by the light from the second light source portion 332. Therefore, the second light source unit 332 is lit. When the first light source unit 331 is in the light-off state, the line image based on the reflected light from the lower surface of the pattern 81 is obtained, and the first light source unit 331 is turned on and the second light source unit 332 is turned off. Next, a line image based on the transmitted light from the transparent substrate 9 is obtained.

In the pattern inspection device 1 having the image acquisition unit 3a, the first substrate is alternately moved by the control unit 11 (see FIG. 1) while the transparent substrate 9 is continuously moved in the moving direction by the moving mechanism 2. The portion 331 and the second light source unit 332 are turned on. Thereby, in the light receiving portion 341, a line image based on the upper surface of the reflected light from the upper surface of the pattern 81 and a first through image based on the transmitted light from the transparent substrate 9 are alternately obtained. Line image. Further, in the light receiving portion 342, a line image based on the downward reflection image of the reflected light from the lower surface of the pattern 81 and a line of the second penetration image according to the transmitted light from the transparent substrate 9 are alternately obtained. image. Further, in the light receiving unit 342, it is not necessary to obtain the second through image.

Fig. 11 is a view showing changes in luminance values in the upper reflection image and the lower reflection image. The upper part of FIG. 11 shows the pattern element 811 of one part of FIG. 9 , and the middle part shows the change of the brightness value of the pixel arranged in the X direction (corresponding to the direction) in the upper reflection image of the pattern element 811, and the lower part is displayed in the lower part. The change in the luminance value of the pixels arranged in the X direction in the reflected image below the pattern element 811 is displayed.

In addition to the above-described inspection processing, the inspection unit 12 performs inspection processing based on the above-described reflected image and the under-reflected image. In detail, in the example of the upper stage of FIG. 11 in which the end of the pattern element 811 is thin, the luminance value of the pixel included in the range corresponding to the upper surface of the pattern element 811 in the upper reflection image shown in the middle section is increased. The luminance value of the pixel included in the range corresponding to the lower surface of the pattern element 811 in the lower reflection image shown in the lower stage is increased. Therefore, in the inspection unit 12, the edge position of the upper surface of the pattern element 811 shown by the upper reflection image and the pattern shown by the reflection image below are obtained. A small amount W1 of the end of the pattern element 811 can be obtained by the difference between the edge positions of the elements 811 below. In the present embodiment, a small amount W1 is obtained by obtaining a difference image between the upper reflection image and the lower reflection image. When the small amount W1 is compared with the predetermined critical value, when the threshold value is equal to or greater than the critical value, the end of the pattern element 811 has a fineness exceeding the allowable range, and is displayed on the display portion as a result of the inspection of the pattern. . Further, a large amount W2 of the end of the pattern element 811 may be obtained from the above-described reflected image and the downward reflected image.

As described above, in the pattern inspection device 1 having the image acquisition unit 3a, another light receiving portion 342 is provided which receives the light from the second light source portion 332 which is irradiated onto the light of the second main surface 92 by the lower surface of the pattern 81. The reflected light is reflected to obtain the reflected image below. Further, in the inspection unit 12, an inspection result of the output pattern 81 is output using an image reflected from the upper surface of the reflected light from the upper surface of the pattern 81 and a reflection image from the lower surface of the reflected light from the lower surface of the pattern 81. Thereby, the size (and coarseness) of the end of the pattern element 811 can be easily checked. Further, similarly to the image acquisition unit 3, since the upper reflection image and the penetration image are obtained by using one light receiving unit 341, the number of parts of the pattern inspection apparatus 1 can be reduced.

The pattern inspection device 1 described above can be variously modified. In the above embodiment, the second light source unit 332 emits light of a red wavelength band, but may emit light of an arbitrary wavelength band (for example, a near-infrared wavelength band) included in a wavelength range from red to infrared. Thereby, the depression on the pattern element 811 can be easily detected. Further, in the pattern inspection device 1 of FIG. 10, the first light source unit 331 emits light of an arbitrary wavelength band included in the wavelength range, and the dish can be detected based on the second penetration image obtained by the light receiving unit 342. Shaped depression area. The first light source unit 331 and the second light source unit 332 can emit light of other wavelength bands in accordance with the pattern type of the inspection target in the pattern inspection device 1. First light source part 331 The second light source unit 332 may have a light-emitting element other than the LED and a lamp as a light source.

The light receiving units 341 and 342 may be area sensors in which the light receiving elements are two-dimensionally arranged. Further, in the pattern inspection apparatus 1, the first light source unit 331 and the second light source unit 332 may be alternately turned on at the respective stop positions of the transparent substrate 9 while the transparent substrate 9 is intermittently moved relative to each other. The above-mentioned reflected image and the transmitted image are obtained with high precision.

The arrangement of the first light source unit 331 and the second light source unit 332 and the arrangement of the light receiving units 341 and 342 may be appropriately changed in accordance with the configuration of the first optical system 31 and the second optical system 32.

The inspection unit 12 may obtain a small amount or a large amount of the end of the pattern element 811 by comparing, for example, the reflected image below with a predetermined reference image.

In the pattern inspection device 1, a moving mechanism that moves the image acquisition units 3 and 3a in the moving direction with respect to the transparent substrate 9 may be provided. In other words, by providing a moving mechanism for relatively moving the transparent substrate 9 relative to the first light source portion 331, the second light source portion 332, and the light receiving portion 341 in the moving direction of the first main surface 91, it is possible to A wide range of reflected images and penetrating images on the transparent substrate 9 are provided. Further, the transparent substrate 9 may be placed on the transparent table, and the table may be relatively moved in the moving direction with respect to the image capturing unit to obtain the above-mentioned reflected image and the transmitted image.

The object to be inspected in the pattern inspection device 1 may be a pattern formed on a plate-shaped transparent substrate such as glass, in addition to the pattern formed on the film-form transparent substrate 9. Transparent substrates can also be used for applications other than touch panels. Further, the pattern on the transparent substrate may be, for example, a pattern formed of a photoresist if it is opaque.

The configurations of the above-described embodiments and modifications may be used in combination as appropriate without any contradiction.

The invention has been described and illustrated in detail hereinabove. Therefore, various modifications and aspects can be made without departing from the scope of the invention.

3‧‧‧Image acquisition unit

9‧‧‧Transparent substrate

31‧‧‧First optical system

32‧‧‧Second optical system

91‧‧‧ first major surface

92‧‧‧Second major surface

311‧‧‧ Collimating lens

312‧‧‧ half mirror

313‧‧‧object lens

314‧‧‧ imaging lens

320‧‧‧ lens

331‧‧‧First Light Source Department

332‧‧‧Second light source department

341‧‧‧Receiving Department

Claims (10)

A pattern inspection device for inspecting a pattern formed on a transparent substrate, comprising: a first light source portion that illuminates a main surface on one side of a pattern formed on a plate-shaped or film-shaped transparent substrate a second light source portion that illuminates the main surface of the other side of the transparent substrate; a light receiving portion that receives the reflected light from the upper surface of the light from the first light source portion, and a light that is transmitted from the transparent substrate by the light of the second light source portion; and a moving mechanism that moves the transparent substrate along the first light source portion, the second light source portion, and the light receiving portion The moving direction of the main surface moves in a relative manner; the control unit, wherein the transparent substrate is relatively moved in a continuous or intermittent manner by the moving mechanism, on the one hand, the first light source portion and the second light source are The light is turned on in an alternating manner, whereby the light-receiving portion is used to obtain a reflection image of the reflected light reflected by the upper surface of the pattern and a penetration according to the transmitted light Like; and inspection unit, by which the reflecting image and the comparison image penetration, obtains the check result of the pattern. The pattern inspection device according to the first aspect of the invention, wherein the light receiving unit is a line sensor that obtains an image of a linear region that intersects the moving direction on the transparent substrate, and the line sense is The detector obtains the line image of the reflected image and the line image of the through image in an alternating manner. The pattern inspection device of claim 1, further comprising: another light receiving portion, wherein the other light receiving portion receives the light from the second light source portion from the main surface of the one side The reflected light below the pattern is taken to obtain another reflected image. The pattern inspection device of claim 2, further comprising: another light receiving portion, wherein the other light receiving portion receives the light from the second light source portion and contacts the main surface of the one side The reflected light below the pattern is taken to obtain another reflected image. The pattern inspection device according to any one of claims 1 to 4, wherein the pattern is formed of a metal. A pattern inspection method for pattern inspection of a pattern formed on a transparent substrate using a pattern inspection device, wherein the pattern inspection device includes a first light source portion that is transparent in a plate shape or a film shape The main surface of the substrate on which one side of the pattern is formed is irradiated with light; the second light source portion irradiates light to the main surface of the other side of the transparent substrate; and a light receiving portion that is acceptable from the first light source portion a light that is reflected from the upper surface of the pattern, and a light that is transmitted from the second light source portion from the transparent substrate; and a moving mechanism that causes the transparent substrate to be opposite to the first light source portion The second light source unit and the light receiving unit move in a relative direction along a moving direction of the main surface on the one side; the pattern inspection method includes: a) continuously or intermittently opening the transparent substrate by the moving mechanism Relative movement Step b) simultaneously with the step a), wherein the first light source unit and the second light source unit are alternately lit, and the light receiving unit is used to obtain the reflection from the upper surface of the pattern a step of reflecting the reflected image of the reflected light and the penetrating image according to the transmitted light; and c) obtaining a result of the inspection of the pattern by comparing the reflected image with the through image. The pattern inspection method according to the sixth aspect of the invention, wherein the light receiving unit is a line sensor that obtains an image of a linear region that intersects the moving direction on the transparent substrate, and the line sense is The detector obtains the line image of the reflected image and the line image of the through image in an alternating manner. The pattern inspection method of claim 6, wherein the light receiving unit further receives the reflected light from the light from the second light source portion from the lower surface of the pattern contacting the main surface of the one side, and The step of taking another reflected image. The pattern inspection method of claim 7, further comprising: reflecting light reflected from the lower surface of the pattern of the main surface contacting the one side of the light from the second light source portion by another light receiving portion And take another step of reflecting the image. The pattern inspection method according to any one of claims 6 to 9, wherein the pattern is formed of a metal.