TWI498155B - Circuit type semiconductor chemical tank mechanism - Google Patents

Description

Loop type semiconductor chemical bath mechanism

The present invention relates to a semiconductor device, and more particularly to a circuit type semiconductor chemical bath mechanism for immersing a chemical solution in a semiconductor device.

Referring to FIG. 1, in the production process of today's semiconductor components, particularly the integrated circuit wafer 100, processes such as development, photoresist removal, metal etching, etc. are generally performed by an operator or an aircraft arm. The whole basket of wafer 100 is immersed in a chemical solution holding tank 1 containing a predetermined chemical solution and maintained at a predetermined temperature, and after a predetermined time is over, the operator or the machine passes the entire basket of wafers 100. It is taken out and changed to another chemical solution holding tank 1 to perform, for example, washing with deionized water, drying, and the like, to complete the processes.

In order to maximize the throughput per unit time, the operator will densely arrange the wafers 100 in the wafer cassette or the wafer basket, and then bubble into the chemical solution holding tank 1 for reaction, but such an action may cause the following problems: 1. The sudden immersion of the basket wafer 100 in a constant temperature chemical solution causes a sudden drop in the temperature of the chemical solution, which increases the uncertainty of the reaction process. 2. The dense arrangement of the wafer 100 causes each wafer 100 to be chemically dissolved. The conditions for the chemical reaction in the liquid are inconsistent; 3. The chemicals or photoresists on the wafer 100 may dissolve or dissociate, and the chemical solution may cause cross-contamination, and because the number of the entire basket of wafers 100 is increased, The severity of cross-contamination is further aggravated; 4. After the immersion is finished, the wafer 100 densely arranged in the whole basket is not easy to be completely cleaned to remove residual chemical solution, and is not easy to blow dry; 5. Based on the maximum capacity, the volume of the chemical solution containing tank 1 They are extremely large to accommodate a sufficient amount of chemical solution, and a process often requires more than one chemical solution to hold the tank 1, which results in a large machine and increased equipment costs; 6. The operator directly faces the chemical solution extraction, Placing the wafer 100 increases the possibility of occurrence of work safety, and the health of the operator is seriously affected by the volatilization of the chemical solution.

Therefore, the production process of the existing integrated circuit wafer 100, particularly the process in which the wafer 100 needs to be immersed in a chemical solution, such as development, photoresist removal, metal etching, etc., needs to be improved to solve the above problems.

Accordingly, it is an object of the present invention to provide a loop-type semiconductor chemical bath mechanism that provides a wafer for optimal chemical liquid thermostatic reaction and that avoids operator exposure to volatile chemical solutions.

Thus, a loop type semiconductor chemical bath mechanism of the present invention comprises a chemical tank and a running carrier.

The chemical tank includes a bottom wall and an upward extending from the bottom wall An inner wall, and an outer wall extending upward from the bottom wall and spaced apart from the inner wall, the bottom wall, the inner wall and the outer wall collectively defining an open and annular storage space.

The operation carrying device includes at least one load bearing assembly for receiving a semiconductor component, and a running assembly for moving the load bearing assembly around the inner wall in the storage space.

The effect of the present invention is that the running assembly drives the load bearing assembly to move around the inner wall in the storage space, and the semiconductor components contained in the load bearing assembly are operated one by one in the annular storage space, and/or The process of cleaning, drying, etc., and the optimization of the process conditions can be optimized under the optimal chemical liquid constant temperature reaction.

100‧‧‧ wafer

27‧‧‧ flow path

1‧‧‧chemical solution storage tank

28‧‧‧ openings

2‧‧‧chemical tank

3‧‧‧Running carrier

21‧‧‧ bottom wall

31‧‧‧Loading components

22‧‧‧ inner wall

311‧‧‧ cantilever

23‧‧‧ outer wall

312‧‧‧ hanging basket

24‧‧ ‧ partition

32‧‧‧Operating components

25‧‧‧Top cover

321‧‧‧ Turntable

26‧‧‧Storage space

322‧‧‧First power piece

261‧‧‧First Capacity Room

323‧‧‧second power piece

262‧‧‧Second capacity room

4‧‧‧temperature control device

263‧‧‧ Third Capacity Room

5‧‧‧cleaning device

264‧‧‧fourth discharge room

6‧‧‧Air knife device

265‧‧‧The fifth capacity room

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a schematic cross-sectional view showing the prior art, immersing the entire basket of wafers with a predetermined chemical solution. And a process for performing a reaction in a chemical solution holding tank at a predetermined temperature; FIG. 2 is a perspective view showing a preferred embodiment of a loop type semiconductor chemical tank mechanism of the present invention; and FIG. 3 is a cross-sectional view showing a kind of the present invention. In a preferred embodiment of the loop type semiconductor chemical bath mechanism, a wafer is placed in a bearing assembly driven by a running assembly from an opening in the outer wall of a chemical bath; FIG. 4 is a cross-sectional view showing a circuit of the present invention. Semiconductorization In a preferred embodiment of the slot mechanism, a running carrier device for holding a wafer passes through a partition in a storage space; FIG. 5 is a cross-sectional view showing a comparison of a loop type semiconductor chemical tank mechanism of the present invention. In a preferred embodiment, a running carrier carrying a wafer drives the wafer to travel in a chemical solution in a second receiving chamber; FIG. 6 is a cross-sectional view showing a loop type semiconductor chemical bath mechanism of the present invention. In a preferred embodiment, a running carrier device for holding a wafer drives the wafer to be cleaned by a cleaning device in a third receiving chamber; and FIG. 7 is a cross-sectional view showing a circuit of the present invention. In a preferred embodiment of the semiconductor chemical bath mechanism, a running carrier for holding a wafer drives the wafer to be dried by a wind knife device in a fourth chamber.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 2, a preferred embodiment of a loop type semiconductor chemical tank mechanism of the present invention comprises a chemical tank 2, a running carrier device 3, a temperature control device 4, a cleaning device 5, and an air knife device 6, which are applicable. In the manufacturing process of the semiconductor device, particularly the integrated circuit wafer 100, the wafer 100 is immersed in a specific chemical solution to perform processes such as development, photoresist removal, metal etching, and the like.

The chemical tank 2 includes a bottom wall 21, an inner wall 22 extending upward from the bottom wall 21, and an upward wall from the bottom wall 21 and spaced apart from the inner wall 22. An outer wall 23, a plurality of partitions 24, and a top cover 25, wherein the bottom wall 21, the inner wall 22, and the outer wall 23 collectively define an annular storage space 26 that is substantially similar to a sports field and open above; The partitions 24 are spaced apart from each other in the storage space 26 and divide the storage space 26 into a plurality of independent receiving chambers. In this example, the storage spaces 26 are divided into five by five partitions 24. The accommodating chambers of different sizes are named as the first accommodating chamber 261, the second accommodating chamber 262, the third accommodating chamber 263, and the fourth accommodating chamber 264 in the counterclockwise direction from the upper right. The fifth receiving chamber 265 is illustrated; the top cover 25 closes the storage space 26, and in this example, the top cover 26 is formed into a horseshoe shape while the second receiving chamber 262 and the third receiving chamber 263 are closed. The fourth receiving chamber 264 is illustrated. Preferably, the top cover 26 may also have a multi-segment design, and respectively correspondingly close different receiving chambers.

Further, the chemical tank 2 further includes a plurality of flow passages 27 and openings 28, which are respectively associated with the first receiving chamber 261, the second receiving chamber 262, the third receiving chamber 263, and the fourth receiving chamber 264, and the fifth receiving chamber 265 is in communication and can be closed to open, for injecting or discharging, for example, a chemical solution or fresh water in the receiving chambers; the openings 28 are formed in the outer wall 23 and the storage space 26 For the operator to take out and place the wafer 100, in this example, only the first opening 261 and the fifth receiving chamber 265 of the outer wall 23 are formed as two openings 28.

2, 3, and 4, the running carrier device 3 includes at least one carrier assembly 31 for receiving a wafer 100, and a carrier assembly 31 is moved around the inner wall 22 in the storage space 26. Running component 32. In this example, a majority of the load bearing assembly 31 is illustrated. In more detail, the carrier assembly 31 includes a cantilever 311 of a general zigzag shape, and a hanging basket 312 for holding the wafer 100. One end of the cantilever 311 is connected to the running assembly 32, and the opposite end is opposite. The hoisting basket 312 is connected; the running assembly 32 includes a dial 321 disposed around the inner wall 22 and connected to the cantilever 311, a first power member 322 for driving the turntable 321 to rotate, and a displacement of the cantilever 311 up and down. The cantilever 311 drives the basket 312 away from or adjacent to the second driving member 323 of the bottom wall 21, wherein the first power member 322 and the second power member 323 are power units such as a motor, a stepping motor, or a pneumatic cylinder.

Referring to FIG. 2 and FIG. 5, the temperature control device 4 is correspondingly disposed in the second receiving chamber 262, and the chemical solution predetermined to be placed in the second receiving chamber 262 can be heated.

Referring to FIG. 2 and FIG. 6, the cleaning device 5 is correspondingly disposed in the third receiving chamber 263, and can spray, for example, fresh water or deionized water into the third receiving chamber 263.

Referring to FIG. 2 and FIG. 7 , the air knife device 6 is correspondingly disposed in the fourth receiving chamber 264 , and can spray, for example, nitrogen gas and dry warm air to the fourth receiving chamber 264 .

The preferred embodiment of the above-described loop-type semiconductor chemical tank mechanism of the present invention is such that the first power member 322 drives the turntable 321 to rotate and the load bearing members 31 continuously move around the inner wall 22, thereby sequentially Circulating operation in the first receiving chamber 261 to the fifth receiving chamber 265; and when the turntable 321 is rotated to interlock the load bearing assembly 31 from, for example, the first capacity When the discharge chamber 261 enters the second receiving chamber 262 and passes through the partition 24, the second power member 323 moves the load bearing assembly 31 upwardly through the partition plate 24, and then moves to move the load bearing assembly 31 downward to The original height continues to be moved by the dial 321 .

While the first power member 322 drives the turntable 321 to rotate to move the load bearing assemblies 31, the operator stores the predetermined chemical solution in the second receiving chamber 262, and corresponds to the temperature control device 4 Heating maintains the chemical solution at a predetermined temperature, and simultaneously starts the cleaning device 5 and the air knife device 6; thereafter, the operator continuously places the wafers 100 one by one from the openings 28 corresponding to the first receiving chambers 261 one by one. In the basket 312 of the load bearing assembly 31, the wafer 100 is sequentially driven by the turntable 321 of the running assembly 32 through the second receiving chamber 262, the third receiving chamber 263, and the fourth receiving chamber 264, and to the fifth The chamber 100 is immersed in a chemical solution for chemical reaction when the carrier assembly 31 containing the wafer 100 is moved in the second receiving chamber 262; when the wafer 100 is loaded When the assembly 31 moves into the third receiving chamber 263, the wafer 100 placed on the hanging basket 312 is rinsed with the clean water or deionized water sprayed by the cleaning device 5 to the third receiving chamber 263, thereby removing the residual chemical solution. When the carrier component 31 holding the wafer 100 enters the fourth receiving chamber 2 When moving in 64, the wafer 100 placed on the gondola 312 is blown dry by the air blown by the air knife device 6 to the fourth receiving chamber 264, or a stream of air such as warm air; finally, when the wafer 100 is held. When the load bearing assembly 31 moves into the fifth receiving chamber 265, the operator can take out the wafer 100 that has completed the chemical reaction and has been cleaned and dried; the vacant bearing When the carrier assembly 31 re-enters the first receiving chamber 261, the operator reinserts a wafer to perform the above process.

It can be seen from the above description that the preferred embodiment of the loop type semiconductor chemical bath mechanism of the present invention has the following advantages in practical use: 1. The wafer 100 is carried into the chemical solution one by one by the carrier assembly 31, The stability of the optimal chemical solution can be obtained, and the optimum processing conditions for the process stability can be obtained, and the best effect can be obtained in the subsequent cleaning and drying; 2. The wafer 100 is driven in the chemical solution. It can effectively disturb the photoresist and the chemical liquid solution and still remain on the surface of the wafer, preventing the photoresist and the chemical liquid from continuing to react; 3. The chemical solution stored in the chamber only needs to drown the wafer 100 in progress. The overall dosage can be greatly reduced compared with the existing chemical solution storage tank 1 and can be replaced during the process; 4. The chemical tank 2 is sealed by the top cover 25, leaving only the opening 28 for taking and placing the wafer. Not only can the chemical liquid maintain a constant temperature, but also reduce the risk of direct and indirect exposure of the chemical liquid to the operator, effectively reducing the possibility of accidents in the work safety; 5. The overall equipment volume can be compared with the existing ones, including Apparatus containing a plurality of chemical solution tank 1 effectively reduced.

In addition, it is to be noted that when the number of the partitions 24 is large and the second accommodation chamber 263 of the preferred embodiment is further divided into a plurality of independent receiving chambers, the process can be continued. Partial discharge room The chemical solution of the storage is replaced, and the production capacity is effectively maintained.

In addition, in this embodiment, the second power member 322 drives the load bearing assembly 31 to move up and down. In fact, for example, the turntable 321 has a high and low undulation design to change the height position of the wafer 100 during movement, due to the power. There are many ways to implement the organization, and we will not give examples here.

In summary, the circuit type semiconductor chemical tank mechanism of the present invention uses a chemical tank 2 formed with an annular storage space 26, and the operation carrier 3 drives the semiconductor component, particularly the wafer 100, in the chemical tank 2 in order. By performing a separate operation in a cycle operation mode by individually having a predetermined function or a storage chamber for storing a predetermined chemical solution, the overall process is completed, and the defects of the existing processes and equipment are indeed improved, and a semiconductor process industry is provided. With the new choice, it is indeed possible to achieve the object of the present invention.

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.

100‧‧‧ wafer

2‧‧‧chemical tank

21‧‧‧ bottom wall

22‧‧‧ inner wall

23‧‧‧ outer wall

24‧‧ ‧ partition

25‧‧‧Top cover

26‧‧‧Storage space

261‧‧‧First Capacity Room

262‧‧‧Second capacity room

263‧‧‧ Third Capacity Room

264‧‧‧fourth discharge room

265‧‧‧The fifth capacity room

27‧‧‧ flow path

28‧‧‧ openings

3‧‧‧Running carrier

31‧‧‧Loading components

311‧‧‧ cantilever

312‧‧‧ hanging basket

32‧‧‧Operating components

321‧‧‧ Turntable

322‧‧‧First power piece

323‧‧‧second power piece

Claims (11)

A loop type semiconductor chemical tank mechanism comprising: a chemical tank comprising a bottom wall, an inner wall extending upward from the bottom wall, and an outer wall extending upward from the bottom wall and spaced apart from the inner wall, The bottom wall, the inner wall and the outer wall together define an open and annular storage space; and a running carrier device comprising at least one load bearing assembly for receiving a semiconductor component, and a load bearing component in the storage space An operating assembly that moves around the inner wall. The circuit type semiconductor chemical tank mechanism of claim 1, wherein the operating assembly comprises a turntable disposed around the inner wall and connecting the load bearing assembly, and a first power member driving the turntable to rotate when the turntable rotates The carrier assembly is moved in the storage space around the inner wall. The circuit type semiconductor chemical tank mechanism of claim 1, wherein the operating assembly further comprises a second power member that drives the load bearing assembly to be displaced up and down. The circuit type semiconductor chemical tank mechanism of claim 1, wherein the load bearing assembly comprises a cantilever, and a gondola carrying the semiconductor component, one end of the cantilever is connected to the running component, and the opposite end is Extending into the storage space and connecting with the gondola. The loop type semiconductor chemical tank mechanism of claim 1, wherein the chemical tank further comprises a top cover that closes the storage space. The loop type semiconductor chemical tank mechanism of claim 1, wherein the chemical tank further comprises a majority of the storage space divided into a plurality of independent discharges. The partition of the room. The loop type semiconductor chemical tank mechanism of claim 1, wherein the chemical tank further comprises a plurality of flow passages that are in communication with the storage space and are closably openable. The circuit type semiconductor chemical tank mechanism of claim 1, wherein the chemical tank further comprises an opening formed in the outer wall and communicating with the storage space. The loop type semiconductor chemical tank mechanism of claim 1, further comprising an air knife device for injecting air into the storage space. The circuit type semiconductor chemical tank mechanism of claim 1, further comprising a cleaning device that ejects liquid into the storage space. The loop type semiconductor chemical tank mechanism of claim 1, further comprising a temperature control device that can controllably heat the liquid contained in the storage space.