M408788 五、新型說明： 【新型所屬之技術領域】 本創作為一種有關晶圓旋轉檢測之技術領域，尤其指一種應 用於超音波振盪清洗槽内，在不影響原有清洗條件及規格下，測 得晶圓旋轉狀態的相關數據。 【先前技術】M408788 V. New Description: [New Technology Field] This creation is a technical field related to wafer rotation detection, especially one that is applied to the ultrasonic oscillation cleaning tank without affecting the original cleaning conditions and specifications. The data related to the wafer rotation state. [Prior Art]
在製造積體電路（integrated circuit; 1C)的過程中，化學 機械研磨常被使用在清除任何不需要的物質。為了清除晶圓表面 上的微粒，使得產生缺陷的可能性降到最低，後化學機械研磨 (P〇st-CMP)之清洗製程是必需的。在化學機械研磨之後，晶圓必 須在清洗前簡测，因為—旦研漿在晶圓變乾後，其將會變的 難以清除。在化學研磨清洗程中，树會將晶圓置人—超音波振 =洗槽’-方面利用動力裝置持續帶動晶圓轉動，—方面利用 超曰波振财式’使泡於清洗液内之晶圓表面的雜質微粒剝 離’以確保晶圓的清洗品質。 習用超音波缝清洗_並無任何檢職制叫貞測晶圓是 =常運旋’僅以人"·方式目視浸泡於清洗液⑽晶圓是否轉 晶 發現^日果4因放置位置有誤而有日軸、有時慢時，就難以 圓的轉速並非與主動輪同步轉動，諸如此類非正常的 =備亦辟到晶圓清洗品f。紅果於直接於清洗槽内裝檢 版備’仏測設備在運作時可能會污染清洗槽内之清洗液對 3In the process of manufacturing integrated circuits (1C), chemical mechanical polishing is often used to remove any unwanted materials. In order to remove particles on the surface of the wafer to minimize the possibility of defects, a post-chemical mechanical polishing (P〇st-CMP) cleaning process is necessary. After chemical mechanical polishing, the wafer must be briefly tested before cleaning, because the slurry will become difficult to remove after the wafer has dried. In the chemical polishing process, the tree will place the wafer on the person - ultrasonic vibration = washing tank - in the use of the power device to continuously drive the wafer to rotate, - in the use of ultra-wave vibration type 'to make the bubble in the cleaning liquid The impurity particles on the surface of the wafer are stripped 'to ensure the cleaning quality of the wafer. Conventional Ultrasonic Slot Cleaning _ There is no inspection system called 贞 晶圆 是 常 常 常 常 常 常 常 常 常 常 常 常 常 常 常 常 ' ' ' ' ' ' ' ' 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 浸泡 ( ( ( ( ( When there is a sun shaft, sometimes it is slow, it is difficult to rotate the rotation speed not synchronously with the driving wheel, and the like is also abnormal. The red fruit is directly in the cleaning tank. The testing equipment may contaminate the cleaning liquid in the cleaning tank during operation.
m^t\j〇 g OO i a胃有喊響。但如果於清洗槽外部安裝制設備來檢測 …轉l#n槽壁的厚度、清洗液的關係使設備設計上更 2難。因此本創作人憑藉β年的經驗，思相計此-晶圓旋 轉檢測裝置。 【新型内容】m^t\j〇 g OO i a stomach screams. However, if the equipment is installed outside the cleaning tank to detect the thickness of the wall of the l#n tank and the relationship of the cleaning liquid, the design of the equipment is more difficult. Therefore, the creator relies on the experience of β years to think about this - wafer rotation detection device. [New content]
本創作之主要目的是提供—種晶圓旋轉制裝置在不大幅 改變化學機械研磨清洗設備的相_械結構，及在清洗過程中不 Ρ響或污染超音波振黯洗細之清洗㈣相關敍或成分的 提供—種檢測裝置，以得知在清洗過程中，超音波振盪 /月洗槽内之晶®是^處於正销運轉模式。 本創作之麵目的提供—顯單、故障率低，但能射得 知晶圓在清洗過財的旋轉狀態之晶圓旋轉檢測裝置。The main purpose of this creation is to provide a wafer rotation system that does not significantly change the phase structure of the chemical mechanical polishing equipment, and does not squeak or pollute the ultrasonic vibration during the cleaning process. Or the provision of a detection device to know that during the cleaning process, the crystal in the ultrasonic oscillation/month wash tank is in the positive pin operation mode. The purpose of this creation is to provide a wafer rotation detecting device that displays a rotating state in which the wafer is cleaned and has a low failure rate.
為達上述之目的，本創作主要是在化學機械研磨清洗設備之 超音波振盪清洗槽内，負責帶動及切晶_構件中包括有 由動力裝置所帶動細個主域，及設置於前述兩主動輪之中心 線下方位置的-楕輪，該楕輪隱藏於機座内之細處結合著 應磁鐵，而機座内部另設有一感應器對應著該感應磁鐵，由該感 應益將測制該楕輪的旋轉㈣之數據並傳㈣備之控制主播 内，以研射絲針，雜暇私轉在料轉奴處於正 確位置 為使審查委員清楚了解本創作之詳細流程及技術内容，本創 4 M408788 作人將配合以下之圖式及詳細之解說，以求審查委員清楚了解本 創作之精神所在： 【實施方式】 如第-圖师，為糊作之化學賊研料洗設備之超音波 振盧清洗槽的結構示意圖。該清洗設備（為美國應用材料股份有 限公司（APPLIED MATERIALS，INC )所製造，型號為 AMAT/MirrMsa，本創作僅就内部的部份結構作—改良。該設備 包括有-超音波織清洗槽U，槽崎有—兩主動輪12⑴又及一 ^主動輪12、13是由該設備1内部所設的—組動力裳 =:動。職位於兩主動輪12、13中心線之下當晶圓放 該主動輪12、13及獅承接及維 力^位置4曰曰圓的重量主要由該槽輪14所負擔，故能動 力^5能以較小的動力以主動輪12、13帶動晶圓轉動。 帅連是透過數導輪16及—皮帶17與主動輪12及 ^ ^ ^ Π ^ ^ 16 動且其中二個導輪是與兩主 主動輪12及13能同步轉動。…13於同—轴心’故能使兩 示，本創作主要是改良該槽輪14的結構，如圖所 :二=;141’該轴，是插置於-脚， 本創作是^==^：22__2· '‘σ σ著—感應磁鐵3，而該機座座2 5 M408788 内另具有-感絲4 ’該感應器4所處位置是對應著該感應磁鐵 L藉此當職U旋轉時，喊應磁鐵3亦會同步旋轉，而感應 器4感應該感應磁鐵3的轉動情形，並將楕輪14的轉動速率提供 給該設備i。另外除輪141外，除了構件皆被隱藏於機座2 内4 ’並糊-側盘23加以封閉。如此即能敎清洗過程中，污 染清洗液的情形。 θ如第三圖所示，當晶圓5放置於超音波振盤清洗槽u内時， 是由主動輪12、13及概14分佈於晶圓5下半部圓周處，使晶 圓5的位置得以固定。清洗液（圖中未晝出）將注滿槽内並利用 超音波振m使浸泡於清洗㈣之晶圓表面齡質微粒剝 離Ά過程中該晶圓5持續旋動，由於該晶圓5的大部份重量 是由楕輪14所承受，故槽輪14會與晶圓5同步轉動，當主動輪 12、13帶動晶圓轉動時，依理推論該槽輪14也會產生相同的轉 速，如果該設備1由感應器4所獲得的訊息發現該槽輪14的轉速 與主動輪12、13不同’則可能是晶圓5並非處於正確的位置，或 是主動輪12、12可能有故障的情形，此時讓使用者能根據可能的 原因，情中間清洗程序，並作調整，以維持晶圓良好的清洗品 質。 綜合以上所述，本創作主要是在楕輪原本位於機座内的軸心 處，增加感應磁鐵及感應器，藉此偵測超音波振盪清洗槽之楕輪 的方疋轉狀態，以同步得知晶圓的旋轉狀態，作為判定清洗過程中， 各項清洗條件是否皆處於正確狀態，以維護良好的清洗品質。 6 M408788 以上所述者，僅為本創作之較佳實施例而已，並非用來限定 本創作實施例之範圍。即凡依本創作申請專利範圍所作的均等變 化及修飾，皆為本創作之專利範圍所涵蓋。 【圖式簡單說明】 第一圖為本創作之化學機械研磨清洗設備之超音波振盪清洗槽的 結構示意圖； 第二圖為本創作之楕輪與其固定機座的分解示意圖； 第二圖為本創作之超音波振盪清洗槽之清洗模式之示意圖。 【主要元件符號說明】 1 清洗設備 11超音波振盛清洗槽 12主動輪 13主動輪 14精輪 141軸心 15動力裝置 16導輪 17皮帶 2 機座 21滾珠 M408788 22固定件 23侧蓋 3 感應磁鐵In order to achieve the above purposes, the creation is mainly in the ultrasonic wave oscillation cleaning tank of the chemical mechanical polishing equipment, responsible for driving and cutting the crystal _ components include a fine main domain driven by the power device, and set in the above two active The wheel of the wheel below the center line of the wheel, the wheel is hidden in the detail of the frame and the magnet is attached, and another sensor is arranged inside the frame corresponding to the induction magnet, and the sensor will measure the The rotation of the wheel (4) and the data transmission (4) in the control of the anchor, to research the needle, the hodgepodge is in the correct position in order to make the review committee clearly understand the detailed process and technical content of the creation, this creation 4 M408788 The author will cooperate with the following drawings and detailed explanations, in order to ask the reviewing committee to clearly understand the spirit of this creation: [Implementation] As the first-grapher, the ultrasonic wave of the chemical thieves washing equipment for the paste Schematic diagram of the Zhenlu cleaning tank. The cleaning equipment (made by APPLIED MATERIALS, INC, model AMAT/MirrMsa, this work is only for the internal part of the structure - improved. The equipment includes - ultrasonic woven cleaning tank U , slotted - two drive wheels 12 (1) and one ^ drive wheels 12, 13 are set by the inside of the device 1 - group power = = move. Position under the two drive wheels 12, 13 center line as a wafer The weight of the driving wheel 12, 13 and the lion receiving and maintaining the position of the round is mainly borne by the sheave 14, so that the power can drive the wafer to rotate with the driving wheels 12 and 13 with less power. The handsome company is through the number of guide wheels 16 and - belt 17 and the drive wheel 12 and ^ ^ ^ Π ^ ^ 16 and two of the guide wheels are synchronized with the two main drive wheels 12 and 13 .... 13 in the same - The axis "can make two indications, this creation is mainly to improve the structure of the sheave 14, as shown in the figure: two =; 141 'the axis, is inserted in the foot, the creation is ^==^:22__2· ''σ σ--the induction magnet 3, and the machine seat 2 5 M408788 has another - the wire 4 'the position of the sensor 4 corresponds to the sense When the magnet L is rotated by the job U, the magnet 3 is synchronously rotated, and the sensor 4 senses the rotation of the induction magnet 3, and supplies the rotation speed of the wheel 14 to the device i. In addition, the components are hidden in the base 2 and the paste-side disc 23 is closed. This can contaminate the cleaning solution during the cleaning process. θ As shown in the third figure, when the wafer 5 is placed When the ultrasonic vibration plate is cleaned in the groove u, the driving wheels 12, 13 and 14 are distributed on the circumference of the lower half of the wafer 5 to fix the position of the wafer 5. The cleaning liquid (not shown in the figure) The wafer 5 is continuously swirled during the process of filling the groove and using the ultrasonic vibration m to peel off the surface of the wafer surface immersed in the cleaning (4), since most of the weight of the wafer 5 is determined by the boring wheel 14 Under the bearing, the sheave 14 will rotate synchronously with the wafer 5. When the driving wheels 12, 13 drive the wafer to rotate, it is inferred that the sheave 14 will also generate the same rotational speed if the device 1 is obtained by the sensor 4. The message that the speed of the sheave 14 is different from the driving wheels 12, 13 may be that the wafer 5 is not in The correct position, or the situation that the driving wheels 12, 12 may be faulty, allows the user to clean the program according to the possible reasons, and adjust to maintain the good cleaning quality of the wafer. This creation is mainly based on the fact that the wheel is originally located at the axis of the base, and the induction magnet and the sensor are added to detect the rotation state of the wheel of the ultrasonic oscillating cleaning tank to synchronously know the wafer. The state of rotation is used to determine whether the cleaning conditions are in the correct state during the cleaning process to maintain good cleaning quality. 6 M408788 The above is only the preferred embodiment of the creation, and is not intended to limit the creation. The scope of the examples. All changes and modifications made in accordance with the scope of the patent application for this creation are covered by the scope of the patent. [Simple description of the diagram] The first diagram is a schematic diagram of the structure of the ultrasonic wave oscillation cleaning tank of the chemical mechanical polishing equipment of the creation; the second diagram is an exploded view of the creation of the wheel and its fixed base; Schematic diagram of the cleaning mode of the created ultrasonic wave oscillating cleaning tank. [Main component symbol description] 1 Cleaning equipment 11 Ultrasonic vibration cleaning tank 12 Driving wheel 13 Driving wheel 14 Precision wheel 141 Axis 15 Power unit 16 Guide wheel 17 Belt 2 Base 21 Ball M408788 22 Fixing piece 23 Side cover 3 Induction magnet