TWI495034B - - Google Patents

Info

Publication number
TWI495034B
TWI495034B TW101143552A TW101143552A TWI495034B TW I495034 B TWI495034 B TW I495034B TW 101143552 A TW101143552 A TW 101143552A TW 101143552 A TW101143552 A TW 101143552A TW I495034 B TWI495034 B TW I495034B
Authority
TW
Taiwan
Application number
TW101143552A
Other languages
Chinese (zh)
Other versions
TW201334113A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201334113A publication Critical patent/TW201334113A/zh
Application granted granted Critical
Publication of TWI495034B publication Critical patent/TWI495034B/zh

Links

TW101143552A 2012-02-01 2012-11-21 一種設有埋入射頻電極的靜電吸盤 TW201334113A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210022296.8A CN102789949B (zh) 2012-02-01 2012-02-01 一种等离子反应器

Publications (2)

Publication Number Publication Date
TW201334113A TW201334113A (zh) 2013-08-16
TWI495034B true TWI495034B (enExample) 2015-08-01

Family

ID=47155325

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101143552A TW201334113A (zh) 2012-02-01 2012-11-21 一種設有埋入射頻電極的靜電吸盤

Country Status (2)

Country Link
CN (1) CN102789949B (enExample)
TW (1) TW201334113A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104112638B (zh) * 2013-04-22 2017-07-18 中微半导体设备(上海)有限公司 一种等离子体反应室及其静电夹盘
CN110600357B (zh) * 2019-11-14 2020-03-31 北京北方华创微电子装备有限公司 用等离子体加工系统进行加工的方法及等离子体加工系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200845090A (en) * 2007-01-30 2008-11-16 Applied Materials Inc Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources
TW201013830A (en) * 2008-09-19 2010-04-01 Ips Ltd Electrostatic chuck and manufacturing method for the same
TW201016078A (en) * 2008-06-23 2010-04-16 Applied Materials Inc Cathode with inner and outer electrodes at different heights
TW201041082A (en) * 2009-05-15 2010-11-16 Advanced Micro Fab Equip Inc Electrostatic chuck device, plasma processing apparatus and manufacturing method for electrostatic chuck
TW201101414A (en) * 2009-04-24 2011-01-01 Applied Materials Inc Substrate support having side gas outlets and methods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3847363B2 (ja) * 1996-02-02 2006-11-22 富士通株式会社 半導体ウェハ処理装置及び半導体ウェハ処理方法
US6741446B2 (en) * 2001-03-30 2004-05-25 Lam Research Corporation Vacuum plasma processor and method of operating same
US20050130620A1 (en) * 2003-12-16 2005-06-16 Andreas Fischer Segmented radio frequency electrode apparatus and method for uniformity control
US20070215284A1 (en) * 2006-03-16 2007-09-20 Tokyo Electron Limited Plasma processing apparatus and electrode assembly for plasma processing apparatus
JP5233092B2 (ja) * 2006-08-10 2013-07-10 東京エレクトロン株式会社 プラズマ処理装置用の載置台及びプラズマ処理装置
JP2008103403A (ja) * 2006-10-17 2008-05-01 Tokyo Electron Ltd 基板載置台及びプラズマ処理装置
CN102098862A (zh) * 2009-12-10 2011-06-15 北京北方微电子基地设备工艺研究中心有限责任公司 一种下电极装置及应用该下电极装置的等离子体处理设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200845090A (en) * 2007-01-30 2008-11-16 Applied Materials Inc Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources
TW201016078A (en) * 2008-06-23 2010-04-16 Applied Materials Inc Cathode with inner and outer electrodes at different heights
TW201013830A (en) * 2008-09-19 2010-04-01 Ips Ltd Electrostatic chuck and manufacturing method for the same
TW201101414A (en) * 2009-04-24 2011-01-01 Applied Materials Inc Substrate support having side gas outlets and methods
TW201041082A (en) * 2009-05-15 2010-11-16 Advanced Micro Fab Equip Inc Electrostatic chuck device, plasma processing apparatus and manufacturing method for electrostatic chuck

Also Published As

Publication number Publication date
CN102789949B (zh) 2015-06-24
CN102789949A (zh) 2012-11-21
TW201334113A (zh) 2013-08-16

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