TWI494450B - Carbene alloy and its manufacturing method - Google Patents

Carbene alloy and its manufacturing method Download PDF

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TWI494450B
TWI494450B TW101133105A TW101133105A TWI494450B TW I494450 B TWI494450 B TW I494450B TW 101133105 A TW101133105 A TW 101133105A TW 101133105 A TW101133105 A TW 101133105A TW I494450 B TWI494450 B TW I494450B
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thickness
annealing
alloy
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rolling
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TW201317371A (en
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Takaaki Hatano
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Jx Nippon Mining & Metals Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Description

卡遜合金及其製造方法Carson alloy and its manufacturing method

本發明係關於一種卡遜合金及其製造方法,該卡遜合金具有適合作為連接器、端子、繼電器、開關等之導電性彈簧材料或電晶體、積體電路(IC)等之半導體機器之引線框架材料之優異的強度、彎曲加工性、耐應力緩和特性及導電性等。The present invention relates to a Carson alloy having a conductive spring material suitable for use as a connector, a terminal, a relay, a switch, or the like, or a lead wire for a semiconductor device such as an integrated circuit (IC). The frame material has excellent strength, bending workability, stress relaxation resistance, and electrical conductivity.

近年來,隨著電氣、電子零件之小型化,對於該等零件所使用之銅合金要求良好之強度、導電率及彎曲加工性。應該要求,對於取代先前之磷青銅或黃銅等固溶強化型銅合金,具有高強度及導電率之卡遜合金等析出強化型銅合金之需求日益增加。卡遜合金係於Cu基質中使Ni-Si、Co-Si、Ni-Co-Si等金屬間化合物析出而成之合金,其兼具高強度、高導電率及良好之彎曲加工性。一般而言,強度與彎曲加工性為相反之性質,對於卡遜合金而言亦期待維持高強度並且改善彎曲加工性。In recent years, with the miniaturization of electrical and electronic components, the copper alloy used for these components requires good strength, electrical conductivity, and bending workability. It is required to increase the demand for precipitation-strengthened copper alloys such as Carson alloys having high strength and electrical conductivity in place of the solid solution-strengthened copper alloys such as phosphor bronze or brass. The Carson alloy is an alloy obtained by depositing an intermetallic compound such as Ni-Si, Co-Si, or Ni-Co-Si in a Cu matrix, and has high strength, high electrical conductivity, and good bending workability. In general, the strength and bending workability are opposite, and it is expected that the Carson alloy maintains high strength and improves bending workability.

於將銅合金板壓製加工成連接器等電氣、電子零件時,有時為了提高彎曲加工部之尺寸精度,而預先對銅合金板表面實施稱為缺口加工之切口加工,並沿該切口而彎曲銅合金板(以下亦稱為缺口彎曲)。該缺口彎曲例如多用於車載用母頭端子之壓製加工。銅合金因缺口加工而加工硬化並失去延展性,因而於後續之彎曲加工中銅合金易發生破裂。因此,對於用於缺口彎曲之銅合金,尤其要求 具有良好之彎曲加工性。When the copper alloy sheet is press-formed into an electrical or electronic component such as a connector, in order to improve the dimensional accuracy of the bent portion, the surface of the copper alloy sheet may be subjected to a slit process called a notch process in advance, and may be bent along the slit. Copper alloy plate (hereinafter also referred to as notched bending). This notch bending is often used, for example, for press working of a female terminal for a vehicle. The copper alloy is hardened by the notch processing and loses ductility, so the copper alloy is prone to cracking in the subsequent bending process. Therefore, it is especially required for copper alloys used for notch bending. Has good bending processability.

近年來,作為改善卡遜合金之彎曲性之技術,提出有控制Cube方位({001}<100>)之面積率之方法。例如,專利文獻1(日本特開2006-283059號)中藉由依序進行(1)鑄造、(2)熱壓延、(3)冷壓延(加工度為95%以上)、(4)固溶處理、(5)冷壓延(加工度為20%以下)、(6)時效處理(ageing treatment)、(7)冷壓延(加工度為1~20%)、(8)短時間退火之步驟,而將Cube方位之面積率控制於50%以上,從而改善彎曲加工性。In recent years, as a technique for improving the bendability of the Caston alloy, a method of controlling the area ratio of the Cube orientation ({001}<100>) has been proposed. For example, in Patent Document 1 (JP-A-2006-283059), (1) casting, (2) hot rolling, (3) cold rolling (processing degree: 95% or more), and (4) solid solution are sequentially performed. Treatment, (5) cold rolling (degree of processing is 20% or less), (6) ageing treatment, (7) cold rolling (processing degree: 1 to 20%), (8) short-time annealing step, The area ratio of the Cube orientation is controlled to 50% or more, thereby improving the bending workability.

又,專利文獻2(日本特開2010-275622號)中藉由依序進行(1)鑄造、(2)熱壓延(一面使溫度自950℃下降至400℃一面進行)、(3)冷壓延(加工度為50%以上)、(4)中間退火(於450~600℃將導電率調整至1.5倍以上,並將硬度調整至0.8倍以下)、(5)冷壓延(加工度為70%以上)、(6)固溶處理、(7)冷壓延(加工度為0~50%)、(8)時效處理,而將{200}(與{001}同義)之X射線繞射強度控制於銅粉標準試樣之X射線繞射強度以上,從而改善彎曲加工性。Further, in Patent Document 2 (JP-A-2010-275622), (1) casting, (2) hot rolling (the temperature is lowered from 950 ° C to 400 ° C), and (3) cold rolling are sequentially performed. (Processing degree is 50% or more), (4) Intermediate annealing (conductivity is adjusted to 1.5 times or more at 450 to 600 ° C, and hardness is adjusted to 0.8 times or less), (5) Cold rolling (processing degree is 70%) Above), (6) solution treatment, (7) cold rolling (working degree 0 to 50%), (8) aging treatment, and {200} (synonymous with {001}) X-ray diffraction intensity control The X-ray diffraction intensity of the copper powder standard sample is improved to improve the bending workability.

進而,專利文獻3(日本特開2011-17072號)中,將Cube方位之面積率控制於5~60%,並且將Brass方位及Copper方位之面積率均控制於20%以下,從而改善彎曲加工性。為此之製造步驟,於依序進行(1)鑄造、(2)熱壓延、(3)冷壓延(加工度為85~99%)、(4)熱處 理(於300~700℃進行5分鐘~20小時)、(5)冷壓延(加工度為5~35%)、(6)固溶處理、(7)時效處理、(8)冷壓延(加工度為2~30%)、(9)調質退火之步驟之情形時,可獲得最佳之彎曲性。Further, in Patent Document 3 (JP-A-2011-17072), the area ratio of the Cube orientation is controlled to 5 to 60%, and the area ratios of the Brass orientation and the Copper orientation are controlled to 20% or less, thereby improving the bending process. Sex. For this manufacturing step, (1) casting, (2) hot rolling, (3) cold rolling (processing degree: 85 to 99%), and (4) heat (5 minutes to 20 hours at 300~700°C), (5) cold rolling (5~35% processing), (6) solution treatment, (7) aging treatment, (8) cold rolling (processing) The best bendability is obtained when the degree is 2 to 30%) and (9) the step of quenching and tempering.

另一方面,專利文獻4中(WO2011/068126號公報)中,並非控制Cube方位,而是藉由減少(111)面朝向寬度方向之區域而改善彎曲加工性。為此之製造步驟,提出有由(1)鑄造、(2)熱壓延(於500~1020℃加工30~98%後,進行水冷)、(3)冷壓延(加工度為50~99%)、(4)中間熱處理(於600~900℃保持10秒~5分鐘,成為不均勻再結晶組織)、(5)冷壓延(加工度為5~55%)、(6)中間再結晶熱處理(於比溶質固溶溫度低10~200℃之溫度保持1秒~20小時,成為再結晶組織)、(7)固溶處理(於比溶質固溶溫度高10~150℃之溫度保持1秒~10分鐘)、(8)時效處理、(9)冷壓延(加工度為2~45%)、(10)調質退火所構成之步驟。On the other hand, in Patent Document 4 (WO2011/068126), the bending workability is improved by reducing the (111) plane toward the width direction instead of controlling the Cube orientation. The manufacturing steps for this are proposed by (1) casting, (2) hot rolling (water cooling after processing 30 to 98% at 500 to 1020 °C), and (3) cold rolling (processing degree is 50 to 99%). (4) Intermediate heat treatment (maintaining 10 to 5 minutes at 600 to 900 ° C to become uneven recrystallized structure), (5) cold rolling (degree of processing is 5 to 55%), and (6) intermediate recrystallization heat treatment (maintained at a temperature lower than the solute solution temperature by 10 to 200 ° C for 1 second to 20 hours to become a recrystallized structure), and (7) solution treatment (for a temperature of 10 to 150 ° C higher than the solute solution temperature for 1 second) ~10 minutes), (8) aging treatment, (9) cold rolling (degree of processing 2 to 45%), (10) steps of quenching and tempering.

[專利文獻1]日本特開2006-283059號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-283059

[專利文獻2]日本特開2010-275622號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-275622

[專利文獻3]日本特開2011-17072號公報[Patent Document 3] Japanese Patent Laid-Open Publication No. 2011-17072

[專利文獻4]WO2011/068126號公報[Patent Document 4] WO2011/068126

本發明人針對上述先前發明之效果進行了驗證試驗。結果於利用W彎曲試驗評價彎曲加工性之情形時,可見一定之改善效果。然而,對於缺口彎曲,無法獲得可謂充分 之彎曲加工性。因此,本發明之課題在於提供一種兼具高強度及高缺口彎曲性之卡遜合金及其製造方法。The inventors conducted a verification test on the effects of the above prior invention. As a result, when the bending workability was evaluated by the W bending test, a certain improvement effect was observed. However, for the notch bending, it is impossible to obtain sufficient Bending workability. Accordingly, an object of the present invention is to provide a Carson alloy having both high strength and high notch bendability and a method for producing the same.

於先前技術中,例如利用EBSD法解析銅合金之結晶方位,並基於所獲得之資料來改良銅合金之特性。此處,所謂EBSD(Electron Back Scatter Diffraction:電子背向散射繞射),係利用於SEM(Scanning Electron Microscope:掃描電子顯微鏡)內對試樣照射電子束時所產生之反射電子菊池線繞射(菊池圖案)而解析結晶方位之技術。通常,電子束照射至銅合金表面時所獲得之資訊為電子束侵入至深度數10nm的方位資訊,即極表層之方位資訊。In the prior art, for example, the crystal orientation of the copper alloy was analyzed by the EBSD method, and the characteristics of the copper alloy were improved based on the obtained data. Here, EBSD (Electron Back Scatter Diffraction) is a reflection electron electron mirror line diffraction generated when an electron beam is irradiated to a sample in an SEM (Scanning Electron Microscope) ( The technique of analyzing the crystal orientation by the Kikuchi pattern). Generally, the information obtained when the electron beam is irradiated onto the surface of the copper alloy is that the electron beam intrudes into the azimuth information of the depth of 10 nm, that is, the orientation information of the surface layer.

另一方面,本發明人發現對於缺口彎曲,需要控制銅合金板內部之結晶方位。其原因在於彎曲之內角因缺口加工而向板內部移動。並且,使板厚方向中央部之結晶方位相對於缺口彎曲而精確化,明確了用以獲得該結晶方位之製造方法。On the other hand, the inventors have found that it is necessary to control the crystal orientation of the inside of the copper alloy sheet for the notch bending. The reason for this is that the inner corner of the bend moves toward the inside of the panel due to the notch processing. Further, the crystal orientation of the central portion in the thickness direction is curved with respect to the notch, and the manufacturing method for obtaining the crystal orientation is clarified.

以如上見解為背景而完成之本發明於一態樣係一種卡遜合金,其係含有Ni及Co中之一種以上:0.8~5.0質量%、Si:0.2~1.5質量%,剩餘部分由銅及不可避免之雜質構成的壓延材料,於相對於板厚為45~55%之剖面位置之板厚方向的中央部,與板厚方向平行地進行EBSD測定並解析結晶方位時,配向於Cube方位{001}<100>之結晶的面積率為5%以上,並且<111>方向配向於壓延材料之寬度方向(TD)之結晶的面積率為50%以下。The present invention, which is completed in the context of the above findings, is a Carson alloy which contains one or more of Ni and Co: 0.8 to 5.0% by mass, Si: 0.2 to 1.5% by mass, and the balance is copper and The rolled material composed of the unavoidable impurities is aligned with the Cube orientation when the EBSD measurement is performed in parallel with the thickness direction of the center portion in the thickness direction of the cross-sectional position of 45 to 55% of the sheet thickness. The area ratio of the crystal of 001}<100> is 5% or more, and the area ratio of the crystal in the width direction (TD) of the rolled material in the <111> direction is 50% or less.

本發明之卡遜合金於一實施形態中,於相對於板厚為 45~55%之剖面位置之板厚方向的中央部,與板厚方向平行地進行EBSD測定並解析結晶方位時,配向於Cube方位{001}<100>之結晶的面積率為5~70%。In one embodiment, the Carson alloy of the present invention is relative to the thickness of the plate. When the EBSD measurement is performed in parallel with the thickness direction of the center portion of the 45 to 55% cross-sectional position and the crystal orientation is analyzed, the area ratio of the crystals oriented to the Cube orientation {001}<100> is 5 to 70%. .

本發明之卡遜合金於另一實施形態中,含有以總量計為0.005~3.0質量%之Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Co、Cr及Ag中的1種以上。In another embodiment, the Carson alloy of the present invention contains 0.005 to 3.0% by mass of total of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, Co, Cr, and Ag. One or more of them.

本發明之卡遜合金於又一實施形態中,壓延方向之彎曲變形係數為106~119GPa。In still another embodiment of the Carson alloy of the present invention, the bending deformation coefficient in the rolling direction is 106 to 119 GPa.

又,本發明於另一態樣中,係一種卡遜合金之製造方法,製作含有Ni及Co中之一種以上:0.8~5.0質量%、Si:0.2~1.5質量%,剩餘部分由銅及不可避免之雜質構成的鑄錠,藉由將該鑄錠自800~1000℃之溫度進行熱壓延,以將厚度調整至5~20mm,並將導電率調整至30%IACS以上之後,依序進行加工度為30~99.5%之冷壓延、軟化度為0.20~0.80之預退火、加工度為3~50%之冷壓延、於700~950℃之5~300秒的固溶處理、加工度為0~60%之冷壓延、於350~600℃之2~20小時的時效處理、加工度為0~50%之冷壓延;其中將軟化度設為S,以下式表示上述軟化度:S=(σ0 -σ)/(σ0950 )Further, in another aspect of the invention, a method for producing a Carson alloy is provided, which comprises one or more of Ni and Co: 0.8 to 5.0% by mass, Si: 0.2 to 1.5% by mass, and the balance being copper and not An ingot composed of impurities is subjected to hot rolling at a temperature of 800 to 1000 ° C to adjust the thickness to 5 to 20 mm, and the conductivity is adjusted to 30% IACS or more, followed by The processing degree is 30~99.5% cold rolling, softening degree is 0.20~0.80, pre-annealing, processing degree is 3~50% cold rolling, 700~950°C 5~300 seconds solution treatment, processing degree is 0~60% cold rolling, aging treatment at 350~600 °C for 2~20 hours, processing degree is 0~50% cold rolling; wherein softness is set to S, the following formula indicates the above softness: S= (σ 0 -σ)/(σ 0950 )

(此處,σ0 為預退火前之拉伸強度,σ及σ950 分別為預退火後及於950℃退火後之拉伸強度)。(here, σ 0 is the tensile strength before pre-annealing, and σ and σ 950 are tensile strengths after pre-annealing and annealing at 950 ° C, respectively).

本發明之卡遜合金之製造方法於一實施形態中,上述鑄錠含有以總量計為0.005~3.0質量%之Sn、Zn、Mg、 Fe、Ti、Zr、Cr、Al、P、Mn、Co、Cr及Ag中的1種以上。In a preferred embodiment of the method for producing a Carson alloy according to the present invention, the ingot contains 0.005 to 3.0% by mass of Sn, Zn, and Mg, based on the total amount. One or more of Fe, Ti, Zr, Cr, Al, P, Mn, Co, Cr, and Ag.

本發明於又一態樣中,係一種具備有上述卡遜合金之伸銅品。In another aspect of the invention, there is provided a copper-clad product having the above-described Carson alloy.

本發明於又一態樣中,係一種具備有上述卡遜合金之電子機器零件。In another aspect, the invention is an electronic machine component provided with the above-described Carson alloy.

根據本發明,可提供一種兼具高強度及高缺口彎曲性之卡遜合金及其製造方法。According to the present invention, a Carson alloy having both high strength and high notch bending property and a method for producing the same can be provided.

(Ni、Co及Si之添加量)(addition of Ni, Co and Si)

Ni、Co及Si藉由進行適當之時效處理,而以Ni-Si、Co-Si、Ni-Co-Si等金屬間化合物之形式析出。藉由該析出物之作用,使強度提高,固溶於Cu基質中之Ni、Co及Si因析出而減少,因此導電率提高。然而,若Ni與Co之合計量未達0.8質量%或Si未達0.2質量%,則無法獲得所欲之強度,反之,若Ni與Co之合計量超過5.0質量%或Si超過1.5質量%,則缺口彎曲性明顯劣化。因此,於本發明之卡遜合金中,將Ni與Co中之一種以上之添加量設為0.8~5.0質量%,並且將Si之添加量設為0.2~1.5質量%。Ni與Co中之一種以上之添加量更佳為1.0~4.0質量%,Si之添加量更佳為0.25~0.90質量%。Ni, Co, and Si are precipitated as an intermetallic compound such as Ni-Si, Co-Si, or Ni-Co-Si by performing an appropriate aging treatment. By the action of the precipitate, the strength is increased, and Ni, Co, and Si which are dissolved in the Cu matrix are reduced by precipitation, and thus the electrical conductivity is improved. However, if the total amount of Ni and Co is less than 0.8% by mass or Si is less than 0.2% by mass, the desired strength cannot be obtained. On the other hand, if the total amount of Ni and Co exceeds 5.0% by mass or Si exceeds 1.5% by mass, Then, the notch bendability is remarkably deteriorated. Therefore, in the Carson alloy of the present invention, the addition amount of one or more of Ni and Co is set to 0.8 to 5.0% by mass, and the addition amount of Si is set to 0.2 to 1.5% by mass. The addition amount of one or more of Ni and Co is preferably 1.0 to 4.0% by mass, and the addition amount of Si is more preferably 0.25 to 0.90% by mass.

(其他添加元素)(other added elements)

Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Co、Cr及Ag有助於提高強度。進而,Zn對於鍍Sn之耐熱剝離 性之提高有效,Mg對於應力緩和特性之提高有效,Zr、Cr、Mn對於熱加工性之提高有效。若Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Co、Cr及Ag之總量未達0.005質量%,則無法獲得上述效果,若超過3.0質量%,則缺口彎曲性明顯降低。因此,於本發明之卡遜合金中,較佳為含有以總量計為0.005~3.0質量%、更佳為0.01~2.5質量%之該等元素。Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, Co, Cr, and Ag contribute to the improvement of strength. Further, Zn is resistant to heat removal of Sn plating The improvement of the effectiveness is effective, and Mg is effective for improving the stress relaxation property, and Zr, Cr, and Mn are effective for improving the hot workability. If the total amount of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, Co, Cr, and Ag is less than 0.005% by mass, the above effect cannot be obtained, and if it exceeds 3.0% by mass, the notch is bent. Significantly reduced sex. Therefore, in the Carson alloy of the present invention, it is preferred to contain the elements in an amount of 0.005 to 3.0% by mass, more preferably 0.01 to 2.5% by mass based on the total amount.

(結晶方位)(crystal orientation)

若Cube方位增加,則不均勻之變形獲得抑制,彎曲性提高。此處,所謂Cube方位,係指(001)面朝向壓延面法線方向(ND)且(100)面朝向壓延方向(RD)之狀態,以{001}<100>之指數表示。If the Cube orientation is increased, uneven deformation is suppressed and the bendability is improved. Here, the Cube orientation refers to a state in which the (001) plane faces the normal direction (ND) of the rolling surface and the (100) plane faces the rolling direction (RD), and is expressed by an index of {001}<100>.

若板厚中央部之Cube方位之面積率未達5%,則缺口彎曲性急遽地降低。因此,將配向於板厚中央部之Cube方位之結晶的面積率設為5%以上,更佳為設為10%以上。If the area ratio of the Cube orientation in the central portion of the thickness is less than 5%, the notch bending property is drastically lowered. Therefore, the area ratio of the crystal of the Cube orientation which is aligned to the central portion of the thickness is 5% or more, and more preferably 10% or more.

配向於板厚中央部之Cube方位之結晶之面積率的上限值就本發明之目的之缺口彎曲性之方面而言並無特別限制。但是,若板厚中央部之Cube方位面積率超過70%,則彎曲變形係數明顯降低。若彎曲變形係數降低,則加工成連接器時,無法獲得接點處之充分接觸力,而使接觸電阻上升。因此,該Cube方位面積率較佳為70%以下。只要將該Cube方位面積率控制於70%以下,則可獲得116GPa以上之足夠高之彎曲變形係數。本發明之卡遜合金 之彎曲變形係數典型為106~119GPa。The upper limit of the area ratio of the crystal of the Cube orientation of the center portion of the sheet thickness is not particularly limited in terms of the notch curvature of the object of the present invention. However, if the Cube azimuth area ratio in the central portion of the plate thickness exceeds 70%, the bending deformation coefficient is remarkably lowered. When the bending deformation coefficient is lowered, when the connector is processed into a connector, sufficient contact force at the contact is not obtained, and the contact resistance is increased. Therefore, the Cube azimuth area ratio is preferably 70% or less. When the Cube azimuth area ratio is controlled to 70% or less, a sufficiently high bending deformation coefficient of 116 GPa or more can be obtained. Carson alloy of the invention The bending deformation coefficient is typically 106 to 119 GPa.

除上述Cube方位之控制以外,針對<111>方向配向於本發明之合金壓延材料之寬度方向(垂直於ND與RD之方法,以下稱為TD)的結晶,可藉由將其板厚中央部之面積率控制於50%以下,更佳為控制於30%以下,而使缺口彎曲成為可能。In addition to the above-described control of the Cube orientation, the crystallization of the width direction of the alloy rolled material of the present invention (the method perpendicular to ND and RD, hereinafter referred to as TD) for the <111> direction can be made by the center portion of the plate thickness The area ratio is controlled to be 50% or less, and more preferably controlled to 30% or less, which makes it possible to bend the notch.

板厚中央部之<111>方向配向於TD之結晶之面積率的下限值就缺口彎曲性之方面而言並無限制,但以下述條件而製造之本發明合金中,該面積率未達1%之情況較少。The lower limit of the area ratio of the TD crystal in the <111> direction of the central portion of the plate thickness is not limited in terms of the notch bending property, but the area ratio is not reached in the alloy of the present invention produced under the following conditions. 1% is less.

此處,所謂板厚之中央部,係指相對於板厚為45~55%之剖面位置。Here, the central portion of the plate thickness means a cross-sectional position of 45 to 55% with respect to the thickness of the plate.

(製造方法)(Production method)

於卡遜合金之一般製造步驟中,首先於熔解爐中使電解銅、Ni、Co、Si等原料熔解而獲得所欲組成之熔液。繼而,將該熔液鑄造成鑄錠。其後,依照熱壓延、冷壓延、固溶處理、時效處理之順序,加工成具有所欲之厚度及特性的條或箔。於熱處理後,為了除去熱處理時所生成之表面氧化膜,亦可進行表面之酸洗或研磨等。又,為了使其高強度化,亦可於固溶處理與時效之間或於時效之後進行冷壓延。In the general manufacturing process of the Carson alloy, first, electrolytic copper, Ni, Co, Si, and the like are melted in a melting furnace to obtain a melt of a desired composition. The melt is then cast into an ingot. Thereafter, it is processed into a strip or foil having a desired thickness and characteristics in the order of hot calendering, cold calendering, solution treatment, and aging treatment. After the heat treatment, in order to remove the surface oxide film formed during the heat treatment, pickling or polishing of the surface may be performed. Further, in order to increase the strength, cold rolling may be performed between the solution treatment and the aging or after the aging.

本發明中,為了獲得上述結晶方位,於固溶處理之前進行熱處理(以下亦稱為預退火)及相對低加工度之冷壓延(以下亦稱為輕壓延),進而將熱壓延結束後之導電率 調整至特定範圍。In the present invention, in order to obtain the crystal orientation described above, heat treatment (hereinafter also referred to as pre-annealing) and cold rolling (hereinafter also referred to as light calendering) with a relatively low degree of work are performed before the solution treatment, and further, after the hot rolling is completed Conductivity Adjust to a specific range.

為了使再結晶粒部分生成於藉由熱壓延後之冷壓延所形成之壓延組織中而進行預退火。壓延組織中之再結晶粒之比例有最佳值,過少或過多均無法獲得上述結晶方位。最佳比例之再結晶粒係藉由使以下述所定義之軟化度S成為0.20~0.80之方式調整預退火條件而獲得。Pre-annealing is performed in order to form a recrystallized grain portion in a rolled structure formed by cold rolling after hot rolling. The proportion of recrystallized grains in the calendered structure has an optimum value, and the above crystal orientation cannot be obtained with too little or too much. The optimum ratio of recrystallized grains is obtained by adjusting the pre-annealing conditions so that the softening degree S defined below becomes 0.20 to 0.80.

圖1中舉例說明將本發明之合金於各種溫度退火時之退火溫度與拉伸強度的關係。將安裝有熱電偶之試樣插入至1000℃之管狀爐中,於利用熱電偶所測定之試樣溫度到達特定溫度時,自爐中取出試樣並進行水冷,測定拉伸強度。於試樣極限溫度為500~700℃之間進行再結晶,拉伸強度急遽降低。高溫側之拉伸強度之緩慢降低係由再結晶粒之成長引起。The relationship between the annealing temperature and the tensile strength of the alloy of the present invention when annealed at various temperatures is illustrated in FIG. A sample in which a thermocouple was attached was inserted into a tubular furnace at 1000 ° C, and when the temperature of the sample measured by the thermocouple reached a specific temperature, the sample was taken out from the furnace and water-cooled to measure the tensile strength. The sample is recrystallized at a limit temperature of 500 to 700 ° C, and the tensile strength is rapidly lowered. The slow decrease in tensile strength on the high temperature side is caused by the growth of recrystallized grains.

根據下式定義預退火中之軟化度S。The softness S in the pre-annealing is defined according to the following formula.

S=(σ0 -σ)/(σ0950 )S=(σ 0 -σ)/(σ 0950 )

此處,σ0 為退火前之拉伸強度,σ及σ950 分別為預退火後及於950℃退火後之拉伸強度。若將本發明之合金於950℃退火,則可穩定地完全再結晶,因此採用950℃之溫度作為用以獲知再結晶後之拉伸強度的基準溫度。Here, σ 0 is the tensile strength before annealing, and σ and σ 950 are tensile strengths after pre-annealing and annealing at 950 ° C, respectively. When the alloy of the present invention is annealed at 950 ° C, it can be stably completely recrystallized, so that a temperature of 950 ° C is used as a reference temperature for knowing the tensile strength after recrystallization.

若S未達0.20,則板厚中央部Cube方位之面積率未達5%,<111>方向配向於TD之結晶的面積率增加。When S is less than 0.20, the area ratio of the Cube orientation in the center portion of the sheet thickness is less than 5%, and the area ratio of the crystal in the <111> direction to the TD is increased.

若S超過0.80,則板厚中央部Cube方位之面積率未達5%,<111>方向配向於TD之結晶的面積率增加。When S exceeds 0.80, the area ratio of the Cube orientation in the center portion of the sheet thickness is less than 5%, and the area ratio of the crystal in the <111> direction to the TD is increased.

預退火之溫度及時間並無特別限制,重要的是將S調 整至上述範圍內。一般而言,於使用連續退火爐之情形時,以爐溫400~750℃於5秒~10分鐘之範圍進行,於使用批次退火爐之情形時,以爐溫350~600℃於30分鐘~20小時之範圍進行。The temperature and time of pre-annealing are not particularly limited. It is important to adjust the S Into the above range. Generally, in the case of using a continuous annealing furnace, the furnace temperature is 400 to 750 ° C for 5 seconds to 10 minutes, and when the batch annealing furnace is used, the furnace temperature is 350 to 600 ° C for 30 minutes. ~20 hours range.

再者,預退火條件之設定可藉由如下順序進行。Furthermore, the setting of the pre-annealing conditions can be performed by the following sequence.

(1)測定預退火前之材料之拉伸強度(σ0 )。(1) The tensile strength (σ 0 ) of the material before pre-annealing was measured.

(2)使預退火前之材料於950℃退火。具體而言,將安裝有熱電偶之材料插入至1000℃之管狀爐中,於利用熱電偶所測得之試樣溫度到達950℃時,自爐中取出試樣並進行水冷。(2) The material before pre-annealing was annealed at 950 °C. Specifically, the material to which the thermocouple was attached was inserted into a tubular furnace at 1000 ° C, and when the temperature of the sample measured by the thermocouple reached 950 ° C, the sample was taken out from the furnace and water-cooled.

(3)求出上述950℃退火後之材料之拉伸強度(σ950 )。(3) The tensile strength (σ 950 ) of the material after annealing at 950 ° C was determined.

(4)例如於σ0 為800MPa,σ950 為300MPa之情形時,與軟化度0.20及0.80相當之拉伸強度分別為700MPa及400MPa。(4) For example, when σ 0 is 800 MPa and σ 950 is 300 MPa, the tensile strengths corresponding to the softening degrees of 0.20 and 0.80 are 700 MPa and 400 MPa, respectively.

(5)以使退火後之拉伸強度成為400~700MPa之方式求出預退火之條件。(5) The conditions of the pre-annealing were determined so that the tensile strength after annealing became 400 to 700 MPa.

上述預退火之後,於固溶處理之前,進行加工度為3~50%之輕壓延。加工度R(%)以下式定義。After the pre-annealing described above, a light calendering degree of 3 to 50% is performed before the solution treatment. The degree of processing R (%) is defined by the following formula.

R=(t0 -t)/t0 ×100(t0 :壓延前之板厚,t:壓延後之板厚)R=(t 0 -t)/t 0 ×100 (t 0 : plate thickness before rolling, t: plate thickness after rolling)

若加工度超出該範圍,則Cube方位面積率未達5%,亦會發生<111>方向配向於TD之結晶之面積率增加。If the degree of processing exceeds this range, the Cube azimuth area ratio is less than 5%, and the area ratio of the crystals in the <111> direction aligned with TD also increases.

除上述預退火及輕壓延之實施以外,可藉由將熱壓延結束後之導電率調整至30%IACS以上,更佳為調整至 32%IACS以上,來獲得本發明之結晶方位。若該導電率未達30%IACS,則Cube方位面積率未達5%,亦會發生<111>方向配向於TD之結晶之面積率增加。In addition to the above-described pre-annealing and light calendering, the conductivity after the end of hot rolling can be adjusted to 30% IACS or more, and more preferably adjusted to 32% IACS or more to obtain the crystal orientation of the present invention. If the conductivity is less than 30% IACS, the Cube azimuth area ratio is less than 5%, and the area ratio of the crystallization of the TD in the <111> direction increases.

通常之卡遜合金之熱壓延為了降低其後之固溶熱處理時的負載,而於儘可能使Ni、Co及Si固溶(固溶於Cu中)之條件下進行。因此,卡遜合金之通常之熱壓延後的導電率為25%IACS左右。為了使Ni、Co及Si固溶,需要於熱壓延結束後之冷卻時抑制Ni-Si、Co-Si、Ni-Co-Si等之析出,因此熱壓延後之材料藉由水冷等而急遽冷卻。The usual calendering of the Carson alloy is carried out under the conditions of solid solution of Ni, Co and Si (solid solution in Cu) in order to reduce the load during subsequent solution heat treatment. Therefore, the electrical conductivity of the Carson alloy after the usual hot rolling is about 25% IACS. In order to solid-dissolve Ni, Co, and Si, it is necessary to suppress precipitation of Ni-Si, Co-Si, Ni-Co-Si, etc. at the time of cooling after completion of hot rolling, so that the material after hot rolling is water-cooled or the like. Irritable cooling.

本發明之意圖在於熱壓延中儘可能使Ni、Co及Si析出,將加熱至800~1000℃之鑄錠壓延至厚度為5~20mm後,例如藉由空氣冷卻等進行緩慢冷卻,藉此可獲得上述導電率。亦可將熱壓延後之材料立即插入至隔熱容器內、利用燃燒器加熱、或插入至加熱爐內進行爐內冷卻等,積極地延緩冷卻,藉此來進一步促進Ni、Co及Si析出。但是,若將導電率提高至高於50%IACS,則冷卻需要長時間,生產效率極度降低,因此較佳為將導電率之上限值設為50%IACS。進而,就將板厚中央部之Cube方位面積率控制於70%以下之方面而言,該導電率更佳為未達40%。The present invention is intended to precipitate Ni, Co, and Si as much as possible in hot rolling, and to heat the ingot heated to 800 to 1000 ° C to a thickness of 5 to 20 mm, for example, by air cooling or the like, thereby slowly cooling. The above conductivity can be obtained. The hot rolled material can be immediately inserted into a heat-insulating container, heated by a burner, or inserted into a heating furnace to be cooled in the furnace, and the cooling can be actively delayed, thereby further promoting the precipitation of Ni, Co, and Si. . However, if the conductivity is increased above 50% IACS, the cooling takes a long time and the production efficiency is extremely lowered. Therefore, it is preferable to set the upper limit of the conductivity to 50% IACS. Further, the conductivity is more preferably less than 40% in terms of controlling the Cube azimuth area ratio at the central portion of the thickness to 70% or less.

若將本發明合金之製造方法依照步驟之順序列出,則為如下。If the manufacturing method of the alloy of the present invention is listed in the order of the steps, it is as follows.

(1)鑄錠之鑄造(厚度為20~300mm)(1) Casting of ingots (thickness 20~300mm)

(2)熱壓延(溫度至800~1000℃,厚度至5~ 20mm,導電率為30%IACS以上)(2) Hot rolling (temperature to 800~1000 °C, thickness to 5~ 20mm, conductivity is 30% IACS or more)

(3)冷壓延(加工度為30~99.5%)(3) Cold rolling (processing degree is 30~99.5%)

(4)預退火(軟化度:S=0.20~0.80)(4) Pre-annealing (softening degree: S=0.20~0.80)

(5)輕壓延(加工度為3~50%)(5) Light rolling (processing degree is 3~50%)

(6)固溶處理(於700~950℃進行5~300秒)(6) Solution treatment (5~300 seconds at 700~950°C)

(7)冷壓延(加工度為0~60%)(7) Cold rolling (processing degree is 0~60%)

(8)時效處理(於350~600℃進行2~20小時)(8) Aging treatment (2~20 hours at 350~600°C)

(9)冷壓延(加工度為0~50%)(9) Cold rolling (processing degree is 0~50%)

(10)去應變退火(於300~700℃進行5秒~10小時)(10) Strain annealing (5 to 10 hours at 300~700 °C)

此處,冷壓延(3)之加工度較佳為設為30~99.5%。為了於預退火(4)中使再結晶粒部分生成,需要於冷壓延(3)中導入應變,可利用30%以上之加工度獲得有效之應變。另一方面,存在若加工度超過99.5%,則於壓延材料之邊緣等處發生破裂,從而發生壓延中之材料斷裂之情況。Here, the degree of processing of the cold rolling (3) is preferably set to 30 to 99.5%. In order to partially form the recrystallized grains in the pre-annealing (4), it is necessary to introduce strain into the cold rolling (3), and an effective strain can be obtained by using a working degree of 30% or more. On the other hand, when the degree of work exceeds 99.5%, cracking occurs at the edge of the rolled material or the like, and the material in the rolling is broken.

冷壓延(7)及(9)係為了實現高強度化而任意進行者。但是,存在如下傾向:壓延加工度增加時強度亦增加,另一方面,<111>方向配向於TD之結晶之面積率增加,Cube方位面積率減少。若冷壓延(7)及(9)中之各自之加工度超過上述上限值,則板厚中央部之<111>方向配向於TD之結晶的面積率超出本發明之規定,於缺口彎曲時會發生破裂。Cold rolling (7) and (9) are arbitrarily carried out in order to achieve high strength. However, there is a tendency that the strength increases as the degree of calendering increases, and on the other hand, the area ratio of the crystals in the <111> direction aligned with TD increases, and the Cube azimuth area ratio decreases. When the degree of processing of each of the cold rollings (7) and (9) exceeds the above upper limit value, the area ratio of the crystal in the <111> direction of the center portion of the sheet thickness to the TD exceeds the specification of the present invention, and when the notch is bent There will be a break.

去應變退火(10)係為了使進行冷壓延(9)之情形 時因該冷壓延而降低之彈性極限值等恢復而任意進行者。無論有無去應變退火(10),均可獲得藉由控制板厚中央部之結晶方位而提高缺口彎曲性的本發明之效果。去應變退火(10)可進行亦可不進行。Strain annealing (10) is for the case of cold rolling (9) In the case where the elastic limit value which is lowered by the cold rolling is restored, it is arbitrarily performed. The effect of the present invention in which the notch bendability is improved by controlling the crystal orientation of the central portion of the thickness of the sheet can be obtained with or without strain relief annealing (10). The strain relief annealing (10) may or may not be performed.

再者,關於步驟(6)及(8),只要選擇卡遜合金之一般製造條件即可。Further, in the steps (6) and (8), the general manufacturing conditions of the Carson alloy may be selected.

本發明之卡遜合金可加工成各種伸銅品,例如板、條及箔,進而本發明之卡遜合金可用於引線框架、連接器、銷、端子、繼電器、開關、二次電池用箔材等電子機器零件等。The Carson alloy of the invention can be processed into various copper products, such as plates, strips and foils, and the Carson alloy of the invention can be used for lead frames, connectors, pins, terminals, relays, switches, foils for secondary batteries Such as electronic machine parts and so on.

[實施例][Examples]

以下,一併揭示本發明之實施例與比較例,但該等實施例係為了更充分地理解本發明及其優勢而提供者,並非意在限定本發明。In the following, the embodiments and comparative examples of the present invention are disclosed, but the embodiments are provided to more fully understand the present invention and its advantages, and are not intended to limit the present invention.

(實施例1)(Example 1)

以含有Ni:2.6質量%、Si:0.58質量%、Sn:0.5質量%、及Zn:0.4質量%,剩餘部分由銅及不可避免之雜質構成之合金作為實驗材料,研究預退火條件、輕壓延條件及熱壓延結束後之導電率與結晶方位之關係,進而研究結晶方位對製品之彎曲性及機械特性所產生之影響。Pre-annealing conditions and light calendering were studied using an alloy containing Ni: 2.6 mass%, Si: 0.58 mass%, Sn: 0.5 mass%, and Zn: 0.4 mass%, and the remainder consisting of copper and unavoidable impurities as experimental materials. The relationship between the electrical conductivity and the crystal orientation after the end of the hot rolling, and the influence of the crystal orientation on the bendability and mechanical properties of the product.

於高頻熔解爐中在氬環境中使用內徑為60mm、深度為200mm之石墨坩鍋使電解銅2.5kg熔解。以可獲得上述合金組成之方式添加合金元素,將熔液溫度調整至1300℃之後,澆鑄至鑄鐵製之鑄模中,從而製造厚度為30mm、 寬度為60mm、長度為120mm之鑄錠。其後,利用下述步驟順序對該鑄錠進行加工,而製作板厚為0.15mm之製品試樣。In a high-frequency melting furnace, a graphite crucible having an inner diameter of 60 mm and a depth of 200 mm was used to melt 2.5 kg of electrolytic copper in an argon atmosphere. The alloying element is added in such a manner that the above alloy composition can be obtained, the temperature of the melt is adjusted to 1300 ° C, and then cast into a mold made of cast iron to produce a thickness of 30 mm. An ingot having a width of 60 mm and a length of 120 mm. Thereafter, the ingot was processed in the following procedure, and a product sample having a thickness of 0.15 mm was produced.

(1)熱壓延:將鑄錠於950℃加熱3小時,並壓延至厚度為10mm。為了使熱壓延結束後之導電率變化,而立即將壓延後之材料利用如下三種方法進行冷卻。(1) Hot rolling: The ingot was heated at 950 ° C for 3 hours and calendered to a thickness of 10 mm. In order to change the conductivity after the end of the hot rolling, the calendered material is immediately cooled by the following three methods.

(A)投入至水槽中(水冷)。(A) Put into the water tank (water-cooled).

(B)放置於大氣中(空氣冷卻)。(B) placed in the atmosphere (air cooled).

(C)插入至升溫至300℃或400℃之電爐中之後,切斷爐之通電,並於爐內進行冷卻(爐內冷卻)。(C) After being inserted into an electric furnace heated to 300 ° C or 400 ° C, the furnace is turned off and cooled in the furnace (cooling in the furnace).

(2)研磨:利用研磨機除去熱壓延所生成之氧化皮。研磨後之厚度為9mm。(2) Grinding: The scale formed by hot calendering was removed by a grinder. The thickness after grinding was 9 mm.

(3)冷壓延:根據輕壓延之壓延加工度,冷壓延至特定之厚度。(3) Cold rolling: cold rolling to a specific thickness according to the calendering degree of light rolling.

(4)預退火:於調整至特定溫度之電爐中插入試樣,並保持特定時間之後,將試樣放入水槽中冷卻。(4) Pre-annealing: After inserting a sample into an electric furnace adjusted to a specific temperature and holding it for a certain period of time, the sample is placed in a water tank for cooling.

(5)輕壓延:以各種壓延加工度進行冷壓延直至厚度成為0.18mm。(5) Light calendering: cold rolling was performed at various calendering degrees until the thickness became 0.18 mm.

(6)固溶處理:於調整至800℃之電爐中插入試樣,並保持10秒之後,將試樣放入水槽中冷卻。固溶處理後之結晶粒徑約為10μm。(6) Solution treatment: The sample was inserted into an electric furnace adjusted to 800 ° C and held for 10 seconds, and then the sample was placed in a water bath to be cooled. The crystal grain size after the solution treatment was about 10 μm.

(7)時效處理:使用電爐於450℃、氬氣環境中加熱5小時。(7) Aging treatment: heating in an electric furnace at 450 ° C for 5 hours in an argon atmosphere.

(8)冷壓延:以17%之加工度自0.18mm冷壓延至 0.15mm。(8) Cold rolling: cold rolling from 0.18mm to 17% processing degree 0.15mm.

(9)去應變退火:於調整至400℃之電爐中插入試樣,並保持10秒後,將試樣放置於大氣中冷卻。(9) Strain annealing: The sample was inserted into an electric furnace adjusted to 400 ° C, and after holding for 10 seconds, the sample was placed in the atmosphere and cooled.

對於熱壓延後之試樣、預退火後之試樣及製品試樣(此情形時為去應變退火結束)進行如下評價。The sample after hot rolling, the sample after pre-annealing, and the sample of the product (in this case, the end of strain relief annealing) were evaluated as follows.

(熱壓延後之導電率測定)(Measurement of electrical conductivity after hot rolling)

對熱壓延後之試樣表面進行機械研磨,除去氧化皮並使其平坦化。於其表面使用FOERSTER公司製造之SIGMATEST D2.068,於頻率為60kHz之條件測定導電率。The surface of the sample after hot rolling was mechanically ground to remove the scale and planarize it. Conductivity was measured at a frequency of 60 kHz using SIGMATEST D2.068 manufactured by FOERSTER Co., Ltd. on its surface.

(預退火之軟化度評價)(Evaluation of softening degree of pre-annealing)

使用拉伸試驗機,依據JIS Z 2241,與壓延方向平行地測定預退火前及預退火後之試樣各自之拉伸強度,並將各自之值分別設為σ0 及σ。又,於950℃以上述順序(插入至1000℃之爐中,並於試樣到達950℃時進行水冷)製作退火試樣,同樣地與壓延方向平行地測定拉伸強度並求出σ950 。由σ0 、σ、σ950 求出軟化度S。The tensile strength of each of the samples before pre-annealing and after pre-annealing was measured in parallel with the rolling direction using a tensile tester in accordance with JIS Z 2241, and the respective values were set to σ 0 and σ, respectively. Further, an annealing sample was produced at 950 ° C in the above-described order (inserted into a furnace at 1000 ° C and water-cooled when the sample reached 950 ° C), and the tensile strength was measured in parallel with the rolling direction to obtain σ 950 . The softening degree S is obtained from σ 0 , σ, and σ 950 .

S=(σ0 -σ)/(σ0950 )S=(σ 0 -σ)/(σ 0950 )

(製品之結晶方位測定)(Measurement of crystal orientation of products)

測定於板厚方向表層及板厚方向中央部{100}<001>方位之面積率及<111>方向配向於TD之結晶的面積率。The area ratio of the {100}<001> direction in the center portion of the thickness direction and the thickness direction of the plate thickness direction and the area ratio of the TD crystal in the <111> direction were measured.

作為用以解析表層之結晶方位之試樣,對試樣表面進行機械研磨而除去由壓延式樣等所產生之微小凹凸之後,藉由電解研磨而加工成鏡面。藉此而進行之表面之研磨深 度為2~3μm之範圍。As a sample for analyzing the crystal orientation of the surface layer, the surface of the sample was mechanically polished to remove fine irregularities generated by a rolled pattern or the like, and then processed into a mirror surface by electrolytic polishing. The depth of the surface The degree is in the range of 2 to 3 μm.

又,作為用以解析板厚中央部之結晶方位之試樣,藉由使用氯化鐵溶液之蝕刻自其一個表面除去至板厚中央部,其後藉由機械研磨與電解研磨而加工成鏡面。加工後之試樣之厚度相對於原來之板厚為45~55%之範圍。Further, the sample for analyzing the crystal orientation of the central portion of the thickness is removed from one surface to the center portion of the thickness by etching using a ferric chloride solution, and then processed into a mirror surface by mechanical polishing and electrolytic polishing. . The thickness of the processed sample is in the range of 45 to 55% with respect to the original thickness.

於EBSD測定中,對含有200個以上結晶粒、500μm見方之試樣面積,以0.5μm之步長進行掃描,而測定結晶方位分佈。接著,進行結晶方位密度函數解析,求出自{100}<001>方位起具有15°以內之方位差之區域的面積,用該面積除以全部測定面積作為「配向於Cube方位{001}<100>之結晶之面積率」。In the EBSD measurement, the area of the sample containing 200 or more crystal grains and 500 μm square was scanned in a step of 0.5 μm to measure the crystal orientation distribution. Next, the crystal orientation density function is analyzed, and the area of the region having an orientation difference of 15° or less from the {100}<001> orientation is obtained, and the area is divided by the total measurement area as the "alignment to the Cube orientation {001}< 100>The area ratio of the crystal".

又,求出結晶之<111>方向與TD所成角度為15°以內之區域的面積,用該面積除以全部測定面積作為「<111>方向配向於TD之結晶之面積率」。Further, the area of the region in which the angle between the <111> direction of the crystal and the TD is 15° or less is obtained, and the area is divided by the entire measurement area as the area ratio of the crystal of the TD in the <111> direction.

於藉由EBSD所進行之方位解析中所獲得之資訊包括電子束侵入至試樣數10nm深的方位資訊,但因相對於所測定之寬度足夠小,故而記載為面積率。The information obtained by the azimuth analysis performed by EBSD includes the electron beam intrusion into the azimuth information of the sample length of 10 nm, but is described as the area ratio because it is sufficiently small with respect to the measured width.

(製品之拉伸試驗)( tensile test of the product)

使用拉伸試驗機,依據JIS Z 2241,與壓延方向平行地測定拉伸強度。The tensile strength was measured in parallel with the rolling direction in accordance with JIS Z 2241 using a tensile tester.

(製品之W彎曲試驗)(W bending test of product)

依據JIS H 3100,將內彎曲半徑設為t(板厚),於Good Way方向(彎曲軸與壓延方向成正交)進行W彎曲試驗。接著,利用機械研磨及拋光研磨對彎曲剖面進行研 磨而加工成鏡面,並利用光學顯微鏡觀察有無破裂。將未見破裂之情形評價為○,將可見破裂之情形評價為×。According to JIS H 3100, the inner bending radius was set to t (thickness), and the W bending test was performed in the Good Way direction (the bending axis and the rolling direction were orthogonal). Next, the bending profile is studied by mechanical grinding and polishing. It was ground into a mirror surface and observed by an optical microscope for cracking. The case where no crack was observed was evaluated as ○, and the case where visible cracking was evaluated as ×.

(製品之缺口彎曲試驗)(notch bending test of product)

將試驗順序示於圖2。對板厚t實施深度為1/2t之缺口加工。將缺口前端之角度設為90度,並於前端設置寬度為0.1mm之平坦部。其次,依據JIS H 3100,將內彎曲半徑設為t,於Good Way方向(彎曲軸與壓延方向成正交)進行W彎曲試驗。接著,利用機械研磨及拋光研磨對彎曲剖面進行研磨而加工成鏡面,並利用光學顯微鏡觀察有無破裂。將未見破裂之情形評價為○,將可見破裂之情形評價為×。The test sequence is shown in Figure 2. A notch processing having a depth of 1/2 t is applied to the plate thickness t. The angle of the front end of the notch was set to 90 degrees, and a flat portion having a width of 0.1 mm was set at the front end. Next, according to JIS H 3100, the inner bending radius was set to t, and the W bending test was performed in the Good Way direction (the bending axis and the rolling direction were orthogonal). Next, the curved section was polished by mechanical polishing and polishing to form a mirror surface, and the presence or absence of cracking was observed by an optical microscope. The case where no crack was observed was evaluated as ○, and the case where visible cracking was evaluated as ×.

(彎曲變形係數之測定)(Measurement of bending deformation coefficient)

壓延方向之彎曲變形係數係依據日本伸銅協會(JCBA)技術標準「銅及銅合金板條之利用懸臂梁之彎曲變形係數測定方法」而測定。The bending deformation coefficient in the rolling direction is measured in accordance with the JCBA technical standard "Method for Measuring Bending Deformation Coefficient of Cantilever Beam Using Copper and Copper Alloy Strips".

以試樣之長度方向與壓延方向平行之方式取得板厚為t、寬度為w(=10mm)、長度為100mm之短條形狀之試樣。將該試樣之一端固定,並於距離固定端L(=100t)之位置施加P(=0.15N)之負載,根據此時之彎曲d,使用下式求出楊氏模數E。A sample having a short strip shape having a thickness t, a width w (= 10 mm), and a length of 100 mm was obtained in such a manner that the longitudinal direction of the sample was parallel to the rolling direction. One end of the sample was fixed, and a load of P (= 0.15 N) was applied at a position from the fixed end L (= 100 t), and according to the bending d at this time, the Young's modulus E was obtained by the following formula.

E=4×P×(L/t)3 /(w×d)E=4×P×(L/t) 3 /(w×d)

將試驗條件及評價結果示於表1。The test conditions and evaluation results are shown in Table 1.

發明例1~11均為於本發明所規定之條件下進行預退火、輕壓延及熱壓延者,板厚中央部之結晶方位滿足本發明之規定,且於W彎曲、缺口彎曲時均未發生破裂,可獲得超過800MPa之高拉伸強度。但是,於板厚中央部之Cube方位面積率超過70%之發明例11中,彎曲變形係數明顯低於其他實施例。由於此種彎曲變形係數之降低於加工成連接器時會導致接點之接觸力降低,故而就接觸力之觀點而言欠佳。Inventive examples 1 to 11 are all pre-annealed, lightly rolled, and hot-rolled under the conditions specified in the present invention, and the crystal orientation of the central portion of the thickness of the sheet satisfies the requirements of the present invention, and is not observed when W is bent or notched. When cracking occurs, a high tensile strength of more than 800 MPa can be obtained. However, in the invention example 11 in which the Cube azimuth area ratio at the central portion of the plate thickness exceeded 70%, the bending deformation coefficient was remarkably lower than that of the other examples. Since such a bending deformation coefficient is lowered when the connector is processed into a connector, the contact force of the contact is lowered, so that the contact force is not preferable.

比較例1中,因預退火中之軟化度未達0.20,故而板厚中央部之Cube方位面積率未達5%。In Comparative Example 1, since the softening degree in the pre-annealing was less than 0.20, the Cube azimuth area ratio in the central portion of the thickness was less than 5%.

比較例2中,因預退火中之軟化度超過0.80,故而板厚中央部之Cube方位面積率未達5%。In Comparative Example 2, since the softening degree in the pre-annealing exceeded 0.80, the Cube azimuth area ratio in the central portion of the thickness was less than 5%.

比較例3中,因預退火中之軟化度超過0.80進而過大,故而板厚中央部之Cube方位面積率未達5%,且板厚中央部之<111>方向配向於TD之結晶的面積率超過50%。In Comparative Example 3, since the softening degree in the pre-annealing was more than 0.80 and was too large, the Cube azimuth area ratio in the central portion of the thickness was less than 5%, and the area ratio of the TD crystal in the <111> direction of the central portion of the thickness was aligned. More than 50%.

比較例4及5中,輕壓延之加工度超出本發明之規定,板厚中央部之Cube方位面積率未達5%。In Comparative Examples 4 and 5, the degree of processing of the light rolling was beyond the specification of the present invention, and the Cube azimuth area ratio at the center portion of the sheet thickness was less than 5%.

比較例6中,因熱壓延結束後之導電率未達30%IACS,故而板厚中央部之Cube方位面積率未達5%,且板厚中央部之<111>方向配向於TD之結晶的面積率超過50%。再者,比較例6係於專利文獻3推薦之條件下製造者。In Comparative Example 6, since the conductivity after the end of the hot rolling was less than 30% IACS, the Cube azimuth area ratio at the center portion of the sheet thickness was less than 5%, and the <111> direction at the center portion of the sheet thickness was aligned with the crystallization of TD. The area ratio is over 50%. Further, Comparative Example 6 is manufactured under the conditions recommended by Patent Document 3.

比較例7係於專利文獻4推薦之條件下製造者。因熱壓延結束後立即進行水冷,故而熱壓延結束後之導電率未達 30%IACS。預退火係於整個面不進行再結晶之條件下實施,軟化度偶然處於本發明之範圍內。於固溶處理之前追加熱處理,並於650℃(低於溶質固溶溫度10~200℃之溫度)加熱1小時使其再結晶。與其他實施例同樣地,固溶處理係於800℃(高於溶質固溶溫度10~150℃之溫度)進行10秒。比較例7中,<111>方向配向於TD之結晶之面積率雖於板厚表層部成為較低值,但於板厚中央部超過50%。又,Cube方位面積率於板厚表層部及中央部均未滿足5%。Comparative Example 7 is a manufacturer under the conditions recommended by Patent Document 4. Since the water is cooled immediately after the end of the hot rolling, the electrical conductivity after the end of the hot rolling is not reached. 30% IACS. The pre-annealing is carried out under the condition that the entire surface is not subjected to recrystallization, and the degree of softness is occasionally within the scope of the present invention. The heat treatment was added before the solution treatment, and it was heated at 650 ° C (temperature lower than the solute solid solution temperature of 10 to 200 ° C) for 1 hour to recrystallize. In the same manner as in the other examples, the solution treatment was carried out at 800 ° C (temperature higher than the solute solid solution temperature of 10 to 150 ° C) for 10 seconds. In Comparative Example 7, the area ratio of the crystal in which the <111> direction is aligned with TD is lower than the thickness of the surface layer portion, but is more than 50% in the central portion of the thickness. Further, the Cube azimuth area ratio was not satisfied by 5% in the surface layer portion and the center portion of the sheet thickness.

於以上比較例中,雖於W彎曲時未發生破裂,但於缺口彎曲時發生破裂。In the above comparative example, although cracking did not occur at the time of W bending, cracking occurred when the notch was bent.

比較例8中,於熱壓延並進行水冷後,進行表面研磨,不進行預退火及輕壓延而自板厚為9mm壓延至板厚為0.18mm。該步驟相當於先前之卡遜合金之一般製造方法。於板厚中央部及表層部,Cube方位面積率均未達5%,<111>方向配向於TD之結晶之面積率超過50%。結果於W彎曲及缺口彎曲時均發生破裂。In Comparative Example 8, after hot rolling and water-cooling, surface polishing was carried out, and rolling was carried out from a thickness of 9 mm to a thickness of 0.18 mm without pre-annealing and light rolling. This step is equivalent to the general manufacturing method of the previous Carson alloy. In the central portion and the surface layer of the plate thickness, the Cube azimuth area ratio is less than 5%, and the area ratio of the <111> direction to the TD crystal is more than 50%. As a result, cracking occurred both when W was bent and when the notch was bent.

(實施例2)(Example 2)

為了進一步驗證板厚中央部作為用以控制缺口彎曲性之結晶方位測定位置妥當,分別測定比較例1及3之試樣中板厚之1/4位置之結晶方位。即,對藉由利用氯化鐵溶液所進行之蝕刻將自其一表面除去至板厚1/4之深度(0.038mm)之後藉由機械研磨與電解研磨來加工成鏡面之面,利用上述方法進行測定。結果可獲得如下極為接近表層之測定值的值:In order to further verify that the center portion of the thickness of the sheet was properly measured as the crystal orientation for controlling the notch bendability, the crystal orientation of the sheet thickness of the samples of Comparative Examples 1 and 3 was measured. That is, after etching by using a ferric chloride solution, the surface is removed from a surface to a depth of 1/4 (0.038 mm), and then processed into a mirror surface by mechanical polishing and electrolytic polishing. The measurement was carried out. As a result, the following values which are very close to the measured values of the surface layer can be obtained:

[比較例1]Cube:10%,{111}方向配向於TD:21%[Comparative Example 1] Cube: 10%, {111} direction is aligned with TD: 21%

[比較例3]Cube:7%,{111}方向配向於TD:19%[Comparative Example 3] Cube: 7%, {111} direction is aligned with TD: 19%

由此明確,板厚1/4位置之測定無法評價缺口彎曲性,而需要板厚中央部之測定。From this, it was confirmed that the measurement of the 1/4 position of the sheet thickness could not evaluate the notch bending property, and the measurement of the center portion of the sheet thickness was required.

(實施例3)(Example 3)

實施例3係研究利用不同成分及製造條件之卡遜合金是否可獲得如實施例1所示之缺口彎曲性之改善效果。In Example 3, it was investigated whether or not the improvement of the notch bending property as shown in Example 1 can be obtained by using a Carson alloy having different compositions and manufacturing conditions.

首先,利用與實施例1同樣之方法進行鑄造,獲得具有表2之成分之鑄錠。First, casting was carried out in the same manner as in Example 1 to obtain an ingot having the composition of Table 2.

(1)熱壓延:將鑄錠於950℃加熱3小時,並壓延至厚度為10mm。立即藉由水冷或空氣冷卻將壓延後之材料冷卻。(1) Hot rolling: The ingot was heated at 950 ° C for 3 hours and calendered to a thickness of 10 mm. The calendered material is immediately cooled by water cooling or air cooling.

(2)研磨:利用研磨機除去熱壓延時所生成之氧化皮。研磨後之厚度為9mm。(2) Grinding: The scale generated by the hot pressing delay is removed by a grinder. The thickness after grinding was 9 mm.

(3)冷壓延(3) Cold rolling

(4)預退火:於調整至特定溫度之電爐中插入試樣,並保持特定時間之後,將試樣放入水槽中冷卻。(4) Pre-annealing: After inserting a sample into an electric furnace adjusted to a specific temperature and holding it for a certain period of time, the sample is placed in a water tank for cooling.

(5)輕壓延(5) Light rolling

(6)固溶處理:於調整至特定溫度之電爐中插入試樣,並保持10秒之後,將試樣放入水槽中冷卻。該溫度係於使再結晶粒之平均直徑成為5~25μm之範圍的範圍內選擇。(6) Solution treatment: The sample was inserted into an electric furnace adjusted to a specific temperature, and after holding for 10 seconds, the sample was placed in a water tank to be cooled. This temperature is selected within a range in which the average diameter of the recrystallized grains is in the range of 5 to 25 μm.

(7)冷壓延(壓延1)(7) Cold rolling (calendering 1)

(8)時效處理:使用電爐於特定溫度、氬氣環境中加 熱5小時。該溫度係以時效後之拉伸強度成為最大之方式選擇。(8) Aging treatment: use electric furnace to add in specific temperature and argon atmosphere Heat for 5 hours. This temperature is selected such that the tensile strength after aging is maximized.

(9)冷壓延(壓延2)(9) Cold rolling (calendering 2)

(10)去應變退火:於調整至特定溫度之電爐中插入試樣,並保持10秒之後,將試樣放置於大氣中冷卻。(10) De-strain annealing: The sample was inserted into an electric furnace adjusted to a specific temperature, and after holding for 10 seconds, the sample was placed in the atmosphere to be cooled.

對於熱壓延後之試樣、預退火後之試樣及製品試樣,進行與實施例1同樣之評價。將試驗條件及評價結果示於表2及3。於未進行壓延1、壓延2、去應變退火中之任一者之情形時,於加工度或溫度欄之各者中記作「無」。The same evaluation as in Example 1 was carried out on the sample after hot rolling, the sample after pre-annealing, and the sample of the product. The test conditions and evaluation results are shown in Tables 2 and 3. In the case where any of calendering 1, rolling, and strain relief annealing is not performed, it is referred to as "none" in each of the processing degrees or temperature columns.

發明例12~29均為含有本發明所規定濃度之Ni、Co及Si,且於本發明所規定之條件進行預退火、輕壓延及熱壓延者,板厚中央部之結晶方位滿足本發明之規定,可進行缺口彎曲,且可獲得超過650MPa之高拉伸強度。Inventive Examples 12 to 29 are all containing Ni, Co, and Si having the concentrations specified in the present invention, and pre-annealing, light rolling, and hot rolling are carried out under the conditions specified in the present invention, and the crystal orientation of the central portion of the thickness of the sheet satisfies the present invention. It is stipulated that the notch can be bent and a high tensile strength exceeding 650 MPa can be obtained.

比較例10、17中,壓延2之加工度超過50%,比較例11中壓延1之加工度超過60%。該等比較例中,板厚中央部之結晶方位超出發明之規定,且於缺口彎曲時發生破裂。In Comparative Examples 10 and 17, the degree of processing of the rolling 2 exceeded 50%, and in Comparative Example 11, the degree of processing of the rolling 1 exceeded 60%. In these comparative examples, the crystal orientation of the central portion of the plate thickness exceeded the specifications of the invention, and cracking occurred when the notch was bent.

比較例9、16中,輕壓延之加工度未滿足本發明之規定。比較例12、14中,預退火之軟化度未滿足本發明之規定。比較例13、15中,熱壓延結束後之導電率未達30%IACS。該等比較例中,與實施例1之比較例之合金同樣地,板厚中央部之結晶方位超出發明之規定,且於缺口彎曲時發生破裂。In Comparative Examples 9 and 16, the degree of processing of the light rolling did not satisfy the requirements of the present invention. In Comparative Examples 12 and 14, the softening degree of the pre-annealing did not satisfy the requirements of the present invention. In Comparative Examples 13 and 15, the electrical conductivity after the end of hot rolling was less than 30% IACS. In the comparative examples, similarly to the alloy of the comparative example of Example 1, the crystal orientation of the central portion of the thickness was exceeded in the specification of the invention, and cracking occurred when the notch was bent.

比較例18中,Ni與Co之合計濃度及Si之濃度低於本發明之規定,雖缺口彎曲性良好,但拉伸強度亦未達500MPa。In Comparative Example 18, the total concentration of Ni and Co and the concentration of Si were lower than the specifications of the present invention, and the notch bending property was good, but the tensile strength was also less than 500 MPa.

比較例19中,Ni與Co之合計濃度超過本發明之規定,雖板厚中央部之結晶方位滿足本發明之規定,但於缺口彎曲時發生破裂。In Comparative Example 19, the total concentration of Ni and Co exceeded the specification of the present invention, and the crystal orientation of the central portion of the thickness of the sheet satisfies the requirements of the present invention, but cracks occur when the notch is bent.

圖1係表示將本發明之合金於各種溫度下退火時之退火溫度與拉伸強度之關係的圖表。Fig. 1 is a graph showing the relationship between the annealing temperature and the tensile strength when the alloy of the present invention is annealed at various temperatures.

圖2係表示實施例中之缺口彎曲試驗之試驗順序的圖。Fig. 2 is a view showing a test procedure of a notch bending test in the examples.

Claims (12)

一種卡遜合金,其係含有Ni及Co中之一種以上:0.8~5.0質量%、Si:0.2~1.5質量%,剩餘部分由銅及不可避免之雜質構成的壓延材料,於相對於板厚為45~55%之剖面位置之板厚方向的中央部,與板厚方向平行地進行EBSD測定並解析結晶方位時,配向於Cube方位{001}<100>之結晶的面積率為5%以上,並且<111>方向配向於壓延材料之寬度方向(TD)之結晶的面積率為50%以下。A Carson alloy containing one or more of Ni and Co: 0.8 to 5.0% by mass, Si: 0.2 to 1.5% by mass, and the remainder consisting of a rolled material composed of copper and unavoidable impurities, relative to the thickness of the sheet When the EBSD measurement is performed in parallel with the thickness direction of the center portion in the thickness direction of the 45 to 55% cross-sectional position, and the crystal orientation is analyzed, the area ratio of the crystals oriented to the Cube orientation {001}<100> is 5% or more. Further, the area ratio of the crystal in the width direction (TD) of the rolled material in the <111> direction is 50% or less. 如申請專利範圍第1項之卡遜合金,其含有以總量計為0.005~3.0質量%之Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Co、Cr及Ag中的1種以上。For example, the Carson alloy of claim 1 contains 0.005 to 3.0% by mass of total of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, Co, Cr and Ag. One or more of them. 如申請專利範圍第1項之卡遜合金,其中,於相對於板厚為45~55%之剖面位置之板厚方向的中央部,與板厚方向平行地進行EBSD測定並解析結晶方位時,配向於Cube方位{001}<100>之結晶的面積率為5~70%。In the case of the Carson alloy of the first aspect of the invention, in the center portion in the thickness direction of the cross-sectional position of 45 to 55% of the sheet thickness, when the EBSD measurement is performed in parallel with the thickness direction and the crystal orientation is analyzed, The area ratio of the crystals assigned to the Cube orientation {001}<100> is 5 to 70%. 如申請專利範圍第3項之卡遜合金,其含有以總量計為0.005~3.0質量%之Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Co、Cr及Ag中的1種以上。For example, the Carson alloy of claim 3 contains 0.005 to 3.0% by mass of total of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, Co, Cr and Ag. One or more of them. 如申請專利範圍第1項之卡遜合金,其中,壓延方向之彎曲變形係數為106~119GPa。For example, the Carson alloy of the first application of the patent scope, wherein the bending deformation coefficient of the rolling direction is 106 to 119 GPa. 如申請專利範圍第2項之卡遜合金,其中,壓延方向之彎曲變形係數為106~119GPa。For example, the Carson alloy of claim 2, wherein the bending deformation coefficient in the rolling direction is 106 to 119 GPa. 如申請專利範圍第3項之卡遜合金,其中,壓延方向之彎曲變形係數為106~119GPa。For example, the Carson alloy of the third application patent scope, wherein the bending deformation coefficient of the rolling direction is 106 to 119 GPa. 如申請專利範圍第4項之卡遜合金,其中,壓延方向之彎曲變形係數為106~119GPa。For example, the Carson alloy of the fourth application patent scope, wherein the bending deformation coefficient of the rolling direction is 106 to 119 GPa. 一種卡遜合金之製造方法,製作含有Ni及Co中之一種以上:0.8~5.0質量%、Si:0.2~1.5質量%,剩餘部分由銅及不可避免之雜質構成的鑄錠,藉由將該鑄錠自800~1000℃之溫度進行熱壓延,以將厚度調整至5~20mm,並將導電率調整至30%IACS以上之後,依序進行加工度為30~99.5%之冷壓延、軟化度為0.20~0.80之預退火、加工度為3~50%之冷壓延、於700~950℃之5~300秒的固溶處理、加工度為0~60%之冷壓延、於350~600℃之2~20小時的時效處理、加工度為0~50%之冷壓延;其中將軟化度設為S,以下式表示該軟化度:S=(σ0 -σ)/(σ0950 )(此處,σ0 為預退火前之拉伸強度,σ及σ950 分別為預退火後及於950℃退火後之拉伸強度)。A method for producing a Carson alloy, which comprises forming an ingot containing one or more of Ni and Co: 0.8 to 5.0% by mass, Si: 0.2 to 1.5% by mass, and the balance being composed of copper and unavoidable impurities. The ingot is hot rolled from 800 to 1000 ° C to adjust the thickness to 5 to 20 mm, and the conductivity is adjusted to 30% IACS or more, followed by cold rolling and softening with a processing degree of 30 to 99.5%. Pre-annealing of 0.20~0.80, cold rolling of 3~50%, solid solution treatment of 5~300 seconds at 700~950°C, cold rolling of 0~60%, 350~600 The aging treatment of °C for 2~20 hours, the processing degree is 0~50% cold rolling; wherein the softness is set to S, the following formula indicates the softness: S=(σ 0 -σ)/(σ 0950 ) (here, σ 0 is the tensile strength before pre-annealing, and σ and σ 950 are tensile strengths after pre-annealing and annealing at 950 ° C, respectively). 如申請專利範圍第9項之卡遜合金之製造方法,其中,該鑄錠含有以總量計為0.005~3.0質量%之Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Co、Cr及Ag中的1種以上。The method for producing a Carson alloy according to Item 9 of the patent application, wherein the ingot contains 0.005 to 3.0% by mass of total of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, One or more of Mn, Co, Cr, and Ag. 一種伸銅品,其具備有申請專利範圍第1至8項中任一項之卡遜合金。A copper-strength article comprising a Carson alloy having any one of claims 1 to 8. 一種電子機器零件,其具備有申請專利範圍第1至8項中任一項之卡遜合金。An electronic machine part comprising the Carson alloy of any one of claims 1 to 8.
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