TWI489923B - Panel disassembly fixture - Google Patents

Panel disassembly fixture Download PDF

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TWI489923B
TWI489923B TW101139926A TW101139926A TWI489923B TW I489923 B TWI489923 B TW I489923B TW 101139926 A TW101139926 A TW 101139926A TW 101139926 A TW101139926 A TW 101139926A TW I489923 B TWI489923 B TW I489923B
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Taiwan
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panel
airbag
inflated
electronic device
casing
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TW101139926A
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Chinese (zh)
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TW201417667A (en
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Chenghsin Chen
Yaoyu Lai
Yuanjui Chang
Shihjung Huang
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Inventec Corp
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Publication of TWI489923B publication Critical patent/TWI489923B/en

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Description

面板拆卸治具Panel demolition fixture

本發明是有關於一種面板拆卸治具,特別是有關於一種將面板與機殼分離的拆卸治具。The present invention relates to a panel demolition jig, and more particularly to a disassembly jig for separating a panel from a casing.

隨著科技的進步,輕薄、省電及可攜帶式的電子產品越來越普及,例如手機、個人數位助理(Personal Digital Assistant,PDA)、筆記型電腦、平板電腦等。其中,液晶顯示面板所具有的輕薄特性亦逐漸地將傳統陰極射線管(Cathode Ray Tube,CRT)顯示器取而代之。另外,面板結構也進一步應用在智慧型手機當中或是其它產品中。一般來說,在製造面板的過程中,面板的機殼必須加入防摔壞之設計,藉以在拆卸時保護面板結構。另外,在製造組裝面板或是電子產品之面板需要檢修時,常須進行拆卸後再次組裝的動作。With the advancement of technology, thin, power-saving and portable electronic products are becoming more and more popular, such as mobile phones, personal digital assistants (PDAs), notebook computers, and tablets. Among them, the thin and light characteristics of the liquid crystal display panel have gradually replaced the conventional cathode ray tube (CRT) display. In addition, the panel structure is further applied to smart phones or other products. In general, in the process of manufacturing the panel, the panel of the panel must be designed to prevent damage, thereby protecting the panel structure during disassembly. In addition, when manufacturing panels for assembly panels or electronic products require inspection, it is often necessary to perform reassembly after disassembly.

目前,面板的組合方式通常是使用黏貼結合方式。舉例來說,平板電腦的觸控面板與機殼之間通常會藉由雙面皆具有黏性的襯帶(rim tape)貼附於觸控面板與機殼的邊框之間,藉以使觸控面板與機殼相互黏合。而對於於中小尺寸的智慧型手機來說,由於其具有較寬的觸控面板以及邊框較窄的機殼,並且為了提升兩者之間抵抗落摔試驗時的剝離力(peeling force)的能力,觸控面板與機殼之間相互固定的設計會由襯帶黏合方式改為以膠體(glue)直接膠合的方式。Currently, the combination of panels is usually a combination of adhesive bonding. For example, the touch panel of the tablet and the casing are usually attached between the touch panel and the frame of the casing by a rim tape having a double-sided adhesive layer, thereby making the touch The panel and the casing are bonded to each other. For small and medium-sized smart phones, it has a wide touch panel and a narrow frame, and the ability to resist the peeling force between the two. The design of fixing the touch panel and the casing to each other is changed from the bonding method of the lining to the direct bonding of the glue.

然而,當組裝人員在組裝觸控面板與機殼的過程中發生失誤,或者組裝後的產品於後續品管階段被判定為不良品時,則在黏固件已經凝固的情況下硬將觸控面板與機殼分離,往往會使觸控面板及/或機殼產生損壞的問題而面臨無法重工的問題,進而導致整體的製造成本無法降低。因此,發展出可於重工階段不會造成觸控面板及/或機殼損壞的技術,是此業界必須刻不容緩投入探討與研究的課題。However, when the assembler makes a mistake in assembling the touch panel and the casing, or the assembled product is judged to be defective in the subsequent quality control stage, the touch panel is hardened when the adhesive has solidified. Separation from the casing often causes problems with damage to the touch panel and/or the casing, and the problem of being unable to rework is faced, resulting in an inability to reduce the overall manufacturing cost. Therefore, the development of technologies that do not cause damage to the touch panel and/or the chassis during the rework phase is a topic that the industry must invest in research and research.

為解決習知技術的問題,本發明的一技術樣態是一種面板拆卸治具,其主要是利用加熱的方式先將面板與機殼之間的黏固件黏度降低,再分別對面板與機殼施以相反方向的外力,藉以在盡可能不造成損壞的前提下讓面板與機殼分離。並且,本發明的面板拆卸治具容易達成標準化及自動化的效果。因此,只要依照欲拆解的電子裝置設定對應的參數(例如,加熱時間、充氣時間、充氣壓力值等),放置於本發明的面板拆卸治上的電子裝置即可標準地且自動地完成拆卸。In order to solve the problems of the prior art, a technical aspect of the present invention is a panel demolition jig, which mainly uses a heating method to first reduce the viscosity of the adhesive between the panel and the casing, and then separately to the panel and the casing. Apply an external force in the opposite direction to separate the panel from the casing without causing damage. Further, the panel detaching jig of the present invention easily achieves the effects of standardization and automation. Therefore, as long as the corresponding parameters (for example, heating time, inflation time, inflation pressure value, etc.) are set according to the electronic device to be disassembled, the electronic device placed on the panel removal treatment of the present invention can be completely and automatically disassembled. .

根據本發明一實施方式,一種面板拆卸治具供電子裝置使用。電子裝置包含機殼與面板。機殼與面板的外緣以黏固件黏固。面板拆卸治具包含承載座、吸附裝置、箝制件、氣囊以及加熱件。承載座具有承載面。吸附裝置設置於承載面上,用以吸附面板。箝制件操作性連接承載座,並可朝向或遠離承載面移動,用以箝制機殼並裸露出面板。氣囊設置於承載面上,用以接收氣體以依序充氣至第 一充氣狀態以及第二充氣狀態。加熱件位於承載面與電子裝置之間,用以對面板的外緣加熱。氣囊於第一充氣狀態接觸箝制件。氣囊由第一充氣狀態充氣至第二充氣狀態期間推擠箝制件遠離承載面移動,致使機殼受箝制件帶動而與面板分離。According to an embodiment of the invention, a panel removal jig is provided for use with an electronic device. The electronic device includes a casing and a panel. The outer edge of the casing and the panel are adhered with a fixing. The panel removal jig includes a carrier, an adsorption device, a clamp, an air bag, and a heating member. The carrier has a bearing surface. The adsorption device is disposed on the bearing surface for adsorbing the panel. The clamp is operatively coupled to the carrier and movable toward or away from the load surface for clamping the housing and exposing the panel. The air bag is disposed on the bearing surface for receiving gas to be inflated to the first An inflated state and a second inflated state. The heating element is located between the bearing surface and the electronic device for heating the outer edge of the panel. The bladder contacts the clamp in a first inflated state. The airbag is moved from the first inflated state to the second inflated state to push the jaws away from the bearing surface, causing the casing to be driven by the clamp to separate from the panel.

於本發明的一實施方式中,上述的氣體為高溫氣體。加熱件為氣囊上的接觸部。氣囊充氣至第一充氣狀態期間使接觸部上升而接觸面板的外緣,致使高溫空氣經由接觸部與面板對黏固件進行加熱。In an embodiment of the invention, the gas is a high temperature gas. The heating element is a contact on the airbag. The airbag is inflated to the first inflated state to raise the contact portion to contact the outer edge of the panel, such that the high temperature air heats the adhesive via the contact portion and the panel.

於本發明的一實施方式中,上述的氣囊由具有彈性之高導熱材料所製成。In an embodiment of the invention, the airbag described above is made of a highly thermally conductive material having elasticity.

於本發明的一實施方式中,上述的加熱件為電熱片。電熱片設置於氣囊上。氣囊充氣至第一充氣狀態期間使電熱片上升而接觸面板的外緣。In an embodiment of the invention, the heating element is a heating sheet. The heating sheet is disposed on the airbag. The airbag is inflated to the outer edge of the panel during inflation to the first inflated state.

於本發明的一實施方式中,上述的氣囊由具有彈性之耐熱材料所製成。In an embodiment of the invention, the airbag is made of a heat-resistant material having elasticity.

於本發明的一實施方式中,上述的加熱件包含凸塊以及電熱片。凸塊設置於承載面上。電熱片設置於凸塊上並接觸面板的外緣。In an embodiment of the invention, the heating element comprises a bump and a heating sheet. The bump is disposed on the bearing surface. The heating sheet is disposed on the bump and contacts the outer edge of the panel.

於本發明的一實施方式中,上述的面板拆卸治具進一步包含充氣裝置。充氣裝置連通氣囊,用以產生氣體。充氣裝置對氣囊充氣至第一充氣狀態之後停止充氣預定時間,並於預定時間之後對氣囊充氣至第二充氣狀態。In an embodiment of the invention, the panel removal jig further includes an inflator. The inflator communicates with the air bag to generate a gas. The inflator stops the inflating for a predetermined time after inflating the airbag to the first inflated state, and inflates the airbag to the second inflated state after the predetermined time.

於本發明的一實施方式中,上述的承載座包含底板以及兩側壁。承載面位於底板上。兩側壁連接底板並大體上 彼此平行地設置於承載面上。箝制件位於側壁之間。箝制件於朝向或遠離承載面移動期間受側壁導引。In an embodiment of the invention, the above-mentioned carrier includes a bottom plate and two side walls. The bearing surface is located on the bottom plate. The two side walls are connected to the bottom plate and substantially They are arranged parallel to each other on the bearing surface. The clamp is located between the side walls. The jaws are guided by the side walls during movement towards or away from the bearing surface.

於本發明的一實施方式中,上述的箝制件包含本體、兩抵靠部以及兩勾部。抵靠部分別連接於本體的兩對立邊緣。每一抵靠部抵靠對應之側壁。電子裝置位於抵靠部之間。勾部分別連接至抵靠部的末端,用以箝制機殼的邊框。In an embodiment of the invention, the clamp member includes a body, two abutting portions, and two hook portions. The abutting portions are respectively connected to the two opposite edges of the body. Each abutment abuts against a corresponding side wall. The electronic device is located between the abutments. The hooks are respectively connected to the ends of the abutting portions for clamping the frame of the casing.

於本發明的一實施方式中,上述的本體具有開口。開口允許電子裝置通過。In an embodiment of the invention, the body has an opening. The opening allows the electronic device to pass.

以下將以圖式揭露本發明的複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示。The embodiments of the present invention are disclosed in the following drawings, and for the purpose of clarity However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic representation.

請參照第1圖以及第2圖。第1圖為繪示依照本發明一實施方式的面板拆卸治具1與電子裝置2的立體組合圖。第2圖為繪示第1圖中之氣囊18連接至充氣裝置16的示意圖。Please refer to Figure 1 and Figure 2. 1 is a perspective assembled view of a panel removal jig 1 and an electronic device 2 according to an embodiment of the present invention. 2 is a schematic view showing the airbag 18 of FIG. 1 connected to the inflator 16.

於本實施方式中,面板拆卸治具1主要是用以拆卸電子裝置2。電子裝置2至少包含機殼20與面板22。電子裝置2的機殼20與面板22的外緣以黏固件21(請參照第3A圖)黏固。舉例來說,上述的電子裝置2可以是智慧型手機(smart phone)、個人數位助理(Personal Digital Assistant, PDA)、個人導航裝置(Portable Navigation Device,PND)、平板電腦(Tablet PC),並且上述的面板22可以是觸控面板,但本發明並不以此為限。換言之,上述的電子裝置2可以是任何藉由黏固件21黏固面板與機殼的電子產品,只要於拆卸過程中有降低元件損壞、提高自動化程度等需求,皆可應用本發明之面板拆卸治具1的概念導入電子產品的拆卸製程中。In the present embodiment, the panel removal jig 1 is mainly used to disassemble the electronic device 2. The electronic device 2 includes at least a casing 20 and a panel 22. The casing 20 of the electronic device 2 and the outer edge of the panel 22 are adhered by a sticker 21 (please refer to FIG. 3A). For example, the electronic device 2 described above may be a smart phone or a personal digital assistant (Personal Digital Assistant, PDA), a Portable Navigation Device (PND), a Tablet PC, and the above-mentioned panel 22 may be a touch panel, but the invention is not limited thereto. In other words, the above-mentioned electronic device 2 can be any electronic product for fixing the panel and the casing by the adhesive 21, and the panel disassembly treatment of the present invention can be applied as long as the component is damaged during the disassembly process, and the degree of automation is improved. The concept of 1 is introduced into the disassembly process of electronic products.

請參照第3A圖。第3A圖為繪示第1圖中之面板拆卸治具1與電子裝置2的剖面圖,其中氣囊18尚未充氣。Please refer to Figure 3A. FIG. 3A is a cross-sectional view showing the panel removal jig 1 and the electronic device 2 in FIG. 1 in which the air bag 18 has not been inflated.

如第1圖、第2圖與第3A圖所示,於本實施方式中,面板拆卸治具1包含承載座10、吸附裝置12、箝制件14、氣囊18以及充氣裝置16。面板拆卸治具1的承載座10包含底板100以及兩側壁102。承載座10的底板100上具有承載面100a。承載座10的兩側壁102連接底板100並大體上彼此平行地設置承載面100a上。面板拆卸治具1的吸附裝置12設置於底板100的承載面100a上,用以吸附電子裝置2的面板22。As shown in FIGS. 1 , 2 , and 3A , in the present embodiment, the panel removal jig 1 includes a carrier 10 , an adsorption device 12 , a clamp 14 , an air bag 18 , and an inflator 16 . The carrier 10 of the panel removal jig 1 includes a bottom plate 100 and two side walls 102. The bottom plate 100 of the carrier 10 has a bearing surface 100a thereon. The two side walls 102 of the carrier 10 are connected to the bottom plate 100 and are disposed substantially parallel to each other on the bearing surface 100a. The adsorption device 12 of the panel removal jig 1 is disposed on the bearing surface 100a of the bottom plate 100 for adsorbing the panel 22 of the electronic device 2.

於本實施方式中,面板拆卸治具1的吸附裝置12為貫穿承載座10之底板100,並與承載座10之底板100一體成型的抽氣裝置,但本發明並不以此為限。於另一實施方式中,面板拆卸治具1的吸附裝置12亦可為吸盤。In the present embodiment, the suction device 12 of the panel removal jig 1 is an air suction device that penetrates the bottom plate 100 of the carrier 10 and is integrally formed with the bottom plate 100 of the carrier 10, but the invention is not limited thereto. In another embodiment, the adsorption device 12 of the panel removal jig 1 may also be a suction cup.

如第1圖與第3A圖所示,於本實施方式中,面板拆卸治具1的箝制件14被夾持並導引於承載座10的二側壁102之間,並可朝向或遠離底板100的承載面100a移動,用以箝制電子裝置2的機殼20。進一步來說,承載座10 的每一側壁102上皆包含導引部102a,並且導引部102a大體上沿著垂直底板100的承載面100a的方向設置。面板拆卸治具1的箝制件14包含本體140、兩抵靠部142以及兩勾部144。箝制件14的抵靠部142分別連接於本體140的兩對立邊緣。箝制件14的每一抵靠部142抵靠承載座10上對應之側壁102,並滑動連接於側壁102上的對應的導引部102a。藉此,面板拆卸治具1的箝制件14即可沿著大體上垂直底板100的承載面100a的方向朝向或遠離底板100的承載面100a移動。箝制件14的勾部144分別連接至抵靠部142的末端,用以箝制機殼20的邊框,且裸露出面板22。詳細來說,箝制件14的勾部144係卡勾於機殼20邊框的底部。As shown in FIG. 1 and FIG. 3A , in the present embodiment, the clamp 14 of the panel removal jig 1 is clamped and guided between the two side walls 102 of the carrier 10 and can face or away from the bottom plate 100. The bearing surface 100a moves to clamp the casing 20 of the electronic device 2. Further, the carrier 10 Each of the side walls 102 includes a guiding portion 102a, and the guiding portion 102a is disposed substantially along a direction of the bearing surface 100a of the vertical bottom plate 100. The clamp 14 of the panel removal jig 1 includes a body 140, two abutting portions 142, and two hook portions 144. The abutting portions 142 of the clamp members 14 are respectively coupled to the opposite edges of the body 140. Each abutting portion 142 of the clamping member 14 abuts against a corresponding side wall 102 of the carrier 10 and is slidably coupled to a corresponding guiding portion 102a on the side wall 102. Thereby, the clamp 14 of the panel removal jig 1 can be moved toward or away from the bearing surface 100a of the bottom plate 100 in a direction substantially perpendicular to the bearing surface 100a of the bottom plate 100. The hook portions 144 of the clamp members 14 are respectively coupled to the ends of the abutting portions 142 for clamping the frame of the casing 20 and exposing the panel 22. In detail, the hook portion 144 of the clamp member 14 is hooked to the bottom of the frame of the casing 20.

如第2圖與第3A圖所示,於本實施方式中,面板拆卸治具1的充氣裝置16連通氣囊18,用以產生並通入高溫氣體至氣囊18。面板拆卸治具1的氣囊18設置於底板100的承載面100a上,用以接收充氣裝置16所通入的高溫氣體。進一步來說,面板拆卸治具1的充氣裝置16包含充氣單元160以及控制器162。充氣裝置16的充氣單元160連通氣囊18,用以並通入產生高溫氣體。充氣裝置16的控制器162電連接充氣單元160,用以控制充氣單元160對氣囊18充氣至第一充氣狀態之後停止充氣預定時間,並於預定時間之後對氣囊18充氣至第二充氣狀態。As shown in FIGS. 2 and 3A, in the present embodiment, the inflator 16 of the panel removal jig 1 communicates with the air bag 18 for generating and passing high temperature gas to the air bag 18. The air bag 18 of the panel removal jig 1 is disposed on the bearing surface 100a of the bottom plate 100 for receiving the high temperature gas introduced by the inflator 16. Further, the inflator 16 of the panel demolition jig 1 includes an inflating unit 160 and a controller 162. The inflator unit 160 of the inflator 16 communicates with the air bag 18 for the passage of high temperature gas. The controller 162 of the inflator 16 is electrically coupled to the inflating unit 160 for controlling the inflating unit 160 to stop inflating for a predetermined time after inflating the air bag 18 to the first inflated state, and inflating the air bag 18 to the second inflated state after a predetermined time.

請參照第3B圖以及第3C圖。第3B圖為繪示第1圖中之面板拆卸治具1與電子裝置2的另一剖面圖,其中氣囊18充氣至第一充氣狀態。第3C圖為繪示第1圖中之面 板拆卸治具1與電子裝置2的另一剖面圖,其中氣囊18充氣至第二充氣狀態。Please refer to FIG. 3B and FIG. 3C. FIG. 3B is another cross-sectional view showing the panel removal jig 1 and the electronic device 2 in FIG. 1 , wherein the air bag 18 is inflated to the first inflated state. Figure 3C shows the surface in Figure 1 Another cross-sectional view of the board removal jig 1 and the electronic device 2 in which the air bag 18 is inflated to a second inflated state.

如第2圖與第3B圖所示,於本實施方式中,當充氣裝置16的控制器162控制充氣單元160將氣囊18充氣至第一充氣狀態時,面板拆卸治具1的氣囊18的接觸部180會隨著氣囊18膨脹而上升,並接觸電子裝置2的面板22的外緣。因此,儲存於氣囊18中的高溫空氣會經由(隔著)氣囊18的接觸部180與電子裝置2的面板22對黏固於面板22與機殼20之間的黏固件21進行加熱。在充氣裝置16的控制器162控制充氣單元160停止對氣囊18充氣並經過預定時間之後,黏固於面板22與機殼20之間的黏固件21會因為溫度升高而黏性下降。此時,面板拆卸治具1的吸附裝置12仍持續吸附電子裝置2的面板22。As shown in FIGS. 2 and 3B, in the present embodiment, when the controller 162 of the inflator 16 controls the inflation unit 160 to inflate the airbag 18 to the first inflated state, the contact of the airbag 18 of the panel removal jig 1 is performed. The portion 180 rises as the air bag 18 expands and contacts the outer edge of the panel 22 of the electronic device 2. Therefore, the high-temperature air stored in the airbag 18 heats the adhesive 21 adhered between the panel 22 and the casing 20 via the contact portion 180 of the airbag 18 and the panel 22 of the electronic device 2. After the controller 162 of the inflator 16 controls the inflation unit 160 to stop inflating the airbag 18 and after a predetermined time elapses, the adhesive 21 adhered between the panel 22 and the casing 20 may be degraded due to an increase in temperature. At this time, the adsorption device 12 of the panel removal jig 1 continues to adsorb the panel 22 of the electronic device 2.

如第2圖與第3C圖所示,於本實施方式中,在預定時間之後,充氣裝置16的控制器162隨即控制充氣單元160對氣囊18充氣至第二充氣狀態。在充氣裝置16的控制器162控制充氣單元160對氣囊18由第一充氣狀態充氣至第二充氣狀態期間,氣囊18會推擠箝制件14。並且,隨著充氣裝置16的充氣單元160持續對氣囊18充氣,氣囊18推擠箝制件14的推力也會持續增大。在氣囊18推擠箝制件14的推力大於面板22與機殼20之間的黏固件21持續減弱的黏固力之後,氣囊18即可推擠箝制件14朝遠離底板100的承載面100a的方向移動,致使電子裝置2的機殼20受箝制件14帶動而與面板22分離。換言之,面板拆卸治具1的吸附裝置12對電子裝置2的面板22的吸附力與 氣囊18推擠箝制件14的推力為分別施加於面板22與機殼20的相反方向力量,使得面板22與機殼20得以分離而拆卸。As shown in FIGS. 2 and 3C, in the present embodiment, after a predetermined time, the controller 162 of the inflator 16 then controls the inflator unit 160 to inflate the air bag 18 to the second inflated state. The air bag 18 pushes the clamp 14 during the controller 162 of the inflator 16 to control the inflation unit 160 to inflate the air bag 18 from the first inflated state to the second inflated state. Also, as the inflator unit 160 of the inflator 16 continues to inflate the air bag 18, the thrust of the air bag 18 pushing the pliers 14 will continue to increase. After the airbag 18 pushes the force of the clamp 14 to be greater than the adhesive force of the adhesive 21 between the panel 22 and the casing 20, the airbag 18 can push the clamp 14 away from the bearing surface 100a of the bottom plate 100. The movement causes the casing 20 of the electronic device 2 to be driven by the clamp 14 to be separated from the panel 22. In other words, the adsorption force of the adsorption device 12 of the panel removal jig 1 on the panel 22 of the electronic device 2 is The thrust of the airbag 18 pushing the clamp 14 is applied to the opposite direction of the panel 22 and the casing 20, respectively, so that the panel 22 and the casing 20 are separated and detached.

於實際應用中,充氣裝置16的控制器162控制充氣單元160將氣囊18充氣至第一充氣狀態所花的充氣時間與對應的充氣壓力值、將氣囊18由第一充氣狀態充氣至第二充氣狀態所花的充氣時間與對應的充氣壓力值等參數,皆可根據實際需求而彈性地調整。In a practical application, the controller 162 of the inflator 16 controls the inflation time and the corresponding inflation pressure value of the inflation unit 160 to inflat the airbag 18 to the first inflation state, and inflates the airbag 18 from the first inflation state to the second inflation state. The parameters such as the inflation time and the corresponding inflation pressure value can be flexibly adjusted according to actual needs.

如第2圖所示,於本實施方式中,面板拆卸治具1的氣囊18呈環狀,並大體上對齊電子裝置2的面板22的外緣(亦即,對齊面板22與機殼20之間的黏固件21的位置),藉以於充氣至第一充氣狀態時達到經由氣囊18的接觸部180與面板22對黏固件21加熱的目的。然而,本發明並不以此為限,可依據黏固件21黏固於面板22與機殼20之間的位置修改氣囊18的外型,只要氣囊18的外型(特別是接觸部180)涵蓋黏固件21的位置即可。As shown in FIG. 2, in the present embodiment, the airbag 18 of the panel removal jig 1 is annular and substantially aligned with the outer edge of the panel 22 of the electronic device 2 (ie, the alignment panel 22 and the casing 20). The position of the adhesive 21 is such that the purpose of heating the adhesive 21 via the contact portion 180 of the airbag 18 and the panel 22 is achieved when inflating to the first inflated state. However, the present invention is not limited thereto, and the outer shape of the airbag 18 can be modified according to the position where the adhesive 21 is adhered between the panel 22 and the casing 20, as long as the outer shape of the airbag 18 (particularly the contact portion 180) covers The position of the adhesive 21 is sufficient.

另外,為了使位於氣囊18內的高溫氣體能夠順利地隔著氣囊18與電子裝置2的面板22對黏固件21加熱,於一實施方式中,氣囊18可由具有彈性之高導熱材料所製成,但本發明並不以此為限。In addition, in order to allow the high temperature gas located in the airbag 18 to smoothly heat the adhesive 21 via the airbag 18 and the panel 22 of the electronic device 2, in one embodiment, the airbag 18 may be made of a highly thermally conductive material having elasticity. However, the invention is not limited thereto.

於一實施方式中,黏固於面板22與機殼20之間的黏固件21可以是雙面膠帶(double-sided adhesive tape),但本發明並不以此為限。In one embodiment, the adhesive 21 adhered between the panel 22 and the casing 20 may be a double-sided adhesive tape, but the invention is not limited thereto.

請參照第4圖。第4圖為繪示第1圖中之箝制件14的另一實施方式的剖面圖。Please refer to Figure 4. Fig. 4 is a cross-sectional view showing another embodiment of the clamp member 14 in Fig. 1.

如第4圖所示,並同時參考第1圖,於本實施方式中,箝制件34包含本體340、兩抵靠部342以及兩勾部344。箝制件34的抵靠部342分別連接於本體340的兩對立邊緣。箝制件34的每一抵靠部342皆可抵靠第1圖中承載座10上對應之側壁102,並滑動連接於側壁102上的對應的導引部102a。藉此,箝制件34即可沿著大體上垂直底板100的承載面100a的方向朝向或遠離底板100的承載面100a移動。As shown in FIG. 4, and referring to FIG. 1 at the same time, in the present embodiment, the clamp 34 includes a body 340, two abutting portions 342, and two hook portions 344. The abutting portions 342 of the clamp members 34 are respectively coupled to the opposite edges of the body 340. Each abutting portion 342 of the clamping member 34 can abut the corresponding side wall 102 of the carrier 10 in FIG. 1 and is slidably coupled to the corresponding guiding portion 102a on the side wall 102. Thereby, the clamping member 34 can be moved toward or away from the bearing surface 100a of the bottom plate 100 in a direction substantially perpendicular to the bearing surface 100a of the bottom plate 100.

在此要特別說明的是,於本實施方式中,箝制件34的本體340的上方具有開口340a。本體340的開口340a的尺寸可允許電子裝置2通過。因此,電子裝置2即可由箝制件34的上方通過本體340的開口340a而放置於箝制件34的勾部344上。並且,在電子裝置2的機殼20受箝制件34帶動而與面板22分離之後,只要吸附裝置12停止吸附面板22,即可由箝制件34的上方將電子裝置2的機殼20與面板22從本體340的開口340a取出。Specifically, in the present embodiment, the body 340 of the clamp member 34 has an opening 340a above it. The opening 340a of the body 340 is sized to allow the electronic device 2 to pass. Therefore, the electronic device 2 can be placed on the hook portion 344 of the clamp member 34 through the opening 340a of the body 340 from above the clamp member 34. Moreover, after the casing 20 of the electronic device 2 is driven by the clamp member 34 and separated from the panel 22, the casing 20 and the panel 22 of the electronic device 2 can be removed from above the clamp member 34 as long as the adsorption device 12 stops the adsorption panel 22. The opening 340a of the body 340 is taken out.

請參照第5圖。第5圖為繪示第1圖中之箝制件14的另一實施方式的剖面圖。Please refer to Figure 5. Fig. 5 is a cross-sectional view showing another embodiment of the clamp member 14 in Fig. 1.

如第4圖所示,並同時參考第1圖,於本實施方式中,箝制件54僅包含兩抵靠部540以及兩勾部542。箝制件54的每一抵靠部540皆可抵靠第1圖中承載座10上對應之側壁102,並與側壁102上的對應的導引部102a相互卡合。藉此,箝制件54即可沿著大體上垂直底板100的承載面100a的方向朝向或遠離底板100的承載面100a移動。As shown in FIG. 4, and referring to FIG. 1 at the same time, in the present embodiment, the clamp 54 includes only two abutting portions 540 and two hook portions 542. Each of the abutting portions 540 of the clamping member 54 can abut the corresponding side wall 102 of the carrier 10 in FIG. 1 and engage with the corresponding guiding portion 102a of the side wall 102. Thereby, the clamp 54 can be moved toward or away from the bearing surface 100a of the bottom plate 100 in a direction substantially perpendicular to the bearing surface 100a of the bottom plate 100.

在此要特別說明的是,於本實施方式中,由於箝制件 54的抵靠部540之間並未相互連接,因此電子裝置2即可由箝制件54的上方通過抵靠部540之間的空間而放置於箝制件54的勾部542上。並且,在電子裝置2的機殼20受箝制件54帶動而與面板22分離之後,只要吸附裝置12停止吸附面板22,即可由箝制件54的上方將電子裝置2的機殼20與面板22從抵靠部540之間的空間取出。It should be particularly noted here that in the present embodiment, due to the clamp The abutting portions 540 of the 54 are not connected to each other, so that the electronic device 2 can be placed on the hook portion 542 of the clamp 54 by the space between the abutting portions 540 from above the clamp 54. Moreover, after the casing 20 of the electronic device 2 is driven by the clamp 54 to be separated from the panel 22, the casing 20 and the panel 22 of the electronic device 2 can be removed from above the clamp 54 as long as the adsorption device 12 stops the adsorption panel 22. The space between the abutting portions 540 is taken out.

請參照第6A圖、第6B圖以及第6C圖。第6A圖為繪示依照本發明另一實施方式的面板拆卸治具7與電子裝置2的剖面圖,其中氣囊18尚未充氣。第6B圖為繪示第6A圖中之面板拆卸治具7與電子裝置2的另一剖面圖,其中氣囊18充氣至第一充氣狀態。第6C圖為繪示第6A圖中之面板拆卸治具7與電子裝置2的另一剖面圖,其中氣囊18充氣至第二充氣狀態。Please refer to FIG. 6A, FIG. 6B and FIG. 6C. FIG. 6A is a cross-sectional view showing the panel removal jig 7 and the electronic device 2 according to another embodiment of the present invention, wherein the air bag 18 has not been inflated. FIG. 6B is another cross-sectional view showing the panel removal jig 7 and the electronic device 2 in FIG. 6A, wherein the air bag 18 is inflated to the first inflated state. FIG. 6C is another cross-sectional view showing the panel removal jig 7 and the electronic device 2 in FIG. 6A, wherein the air bag 18 is inflated to a second inflated state.

如第6A圖、第6B圖與第6C圖所示,於本實施方式中,面板拆卸治具7同樣包含承載座10、吸附裝置12、箝制件14以及氣囊18,並且氣囊18同樣可連接如第2圖所示的充氣裝置16,因此各元件的結構、功能與各元件之間的連接關係可參考第1圖至第3C圖所示的實施方式以及相關說明,在此不再贅述。As shown in FIGS. 6A, 6B, and 6C, in the present embodiment, the panel removal jig 7 also includes a carrier 10, an adsorption device 12, a clamp 14 and an air bag 18, and the air bag 18 can also be connected as The inflator 16 shown in FIG. 2, therefore, the structure and function of each element and the connection relationship between the elements can be referred to the embodiment shown in FIGS. 1 to 3C and the related description, and will not be described herein.

在此要說明的是,於本實施方式中,面板拆卸治具7進一步包含電熱片70。面板拆卸治具7的電熱片70設置於設置於氣囊18上。如第6B圖所示,在充氣裝置16的控制器162控制充氣單元160將氣囊18充氣至第一充氣狀態期間,面板拆卸治具7的氣囊18會使電熱片70上升而接觸電子裝置2的面板22的外緣。藉此,設置於氣囊18上 的電熱片70即可經由(隔著)電子裝置2的面板22對黏固於面板22與機殼20之間的黏固件21進行加熱。在電熱片70接觸面板22的外緣進行加熱且充氣裝置16的控制器162控制充氣單元160停止對氣囊18充氣並經過預定時間之後,黏固於面板22與機殼20之間的黏固件21會因為溫度升高而黏性下降。此時,面板拆卸治具7的吸附裝置12仍持續吸附電子裝置2的面板22。It should be noted that in the present embodiment, the panel removal jig 7 further includes a heating sheet 70. The heater chip 70 of the panel removal jig 7 is disposed on the airbag 18. As shown in FIG. 6B, during the controller 162 of the inflator 16 controls the inflation unit 160 to inflate the airbag 18 to the first inflated state, the airbag 18 of the panel removal jig 7 causes the heating fin 70 to rise to contact the electronic device 2. The outer edge of the panel 22. Thereby, it is disposed on the airbag 18 The heating sheet 70 can heat the adhesive 21 adhered between the panel 22 and the casing 20 via the panel 22 of the electronic device 2 (separated). After the heating sheet 70 is heated to contact the outer edge of the panel 22 and the controller 162 of the inflator 16 controls the inflation unit 160 to stop inflating the airbag 18 and after a predetermined time elapses, the adhesive 21 adhered between the panel 22 and the casing 20 is adhered. It will decrease in viscosity due to the increase in temperature. At this time, the adsorption device 12 of the panel removal jig 7 continues to adsorb the panel 22 of the electronic device 2.

如第6C圖所示,在預定時間之後,充氣裝置16的控制器162隨即控制充氣單元160對氣囊18充氣至第二充氣狀態。在充氣裝置16的控制器162控制充氣單元160對氣囊18由第一充氣狀態充氣至第二充氣狀態期間,氣囊18會推擠箝制件14。並且,隨著充氣裝置16的充氣單元160持續對氣囊18充氣,氣囊18推擠箝制件14的推力也會持續增大。在氣囊18推擠箝制件14的推力大於面板22與機殼20之間的黏固件21持續減弱的黏固力之後,氣囊18即可推擠箝制件14遠離底板100的承載面100a移動,致使電子裝置2的機殼20受箝制件14帶動而與面板22分離。As shown in FIG. 6C, after a predetermined time, the controller 162 of the inflator 16 then controls the inflator unit 160 to inflate the air bag 18 to the second inflated state. The air bag 18 pushes the clamp 14 during the controller 162 of the inflator 16 to control the inflation unit 160 to inflate the air bag 18 from the first inflated state to the second inflated state. Also, as the inflator unit 160 of the inflator 16 continues to inflate the air bag 18, the thrust of the air bag 18 pushing the pliers 14 will continue to increase. After the airbag 18 pushes the force of the clamp 14 to be greater than the adhesive force of the adhesive 21 between the panel 22 and the casing 20, the airbag 18 can push the clamp 14 to move away from the bearing surface 100a of the bottom plate 100, thereby causing the airbag 18 to move away from the bearing surface 100a of the bottom plate 100. The casing 20 of the electronic device 2 is driven by the clamp 14 to be separated from the panel 22.

換言之,相較於第1圖至第3C圖所示的實施方式,本實施方式的充氣裝置16所產生且通入至氣囊18的氣體可以為常溫氣體,並非一定要高溫氣體。加熱以使黏固於面板22與機殼20之間的黏固件21的黏性下降的工作由電熱片70來執行。In other words, compared with the embodiment shown in FIGS. 1 to 3C, the gas generated by the inflator 16 of the present embodiment and introduced into the airbag 18 may be a normal temperature gas, and is not necessarily a high temperature gas. The work of heating to lower the viscosity of the adhesive 21 adhered between the panel 22 and the casing 20 is performed by the electric heating sheet 70.

另外,由於面板拆卸治具7的電熱片70設置於氣囊18上,因此為了防止氣囊18受到電熱片70的高溫而發生材料變質的問題,於一實施方式中,面板拆卸治具7的氣 囊18由具有彈性之耐熱材料所製成,但本發明並不以此為限。Further, since the heater chip 70 of the panel detaching jig 7 is provided on the airbag 18, in order to prevent the airbag 18 from being deteriorated by the high temperature of the heater chip 70, in one embodiment, the panel detaches the gas of the jig 7. The bladder 18 is made of a heat resistant material having elasticity, but the invention is not limited thereto.

於另一實施方式中,面板拆卸治具7的電熱片70亦可由其他可產生高溫的加熱件取代。In another embodiment, the heating sheet 70 of the panel removal jig 7 can also be replaced by other heating elements that can generate high temperatures.

請參照第7圖。第7圖為繪示依照本發明另一實施方式的面板拆卸治具9與電子裝置2的剖面圖,其中氣囊98尚未充氣。Please refer to Figure 7. Figure 7 is a cross-sectional view showing the panel removal jig 9 and the electronic device 2 in accordance with another embodiment of the present invention, wherein the air bag 98 has not been inflated.

如第7圖所示,於本實施方式中,面板拆卸治具9同樣包含承載座10、吸附裝置12以及箝制件14,因此各元件的結構、功能與各元件之間的連接關係可參考第1圖至第3C圖所示的實施方式以及相關說明,在此不再贅述。As shown in FIG. 7, in the present embodiment, the panel removal jig 9 also includes the carrier 10, the adsorption device 12, and the clamp member 14. Therefore, the structure, function, and connection relationship between the components can be referred to The embodiment shown in FIG. 1 to FIG. 3C and related descriptions are not described herein again.

在此要說明的是,於本實施方式中,面板拆卸治具9進一步包含凸塊90與電熱片92。凸塊90設置於底板100的承載面100a上,並且電熱片92設置於凸塊90上。在電子裝置2的面板22吸附於吸附裝置12上且機殼20受箝制件14箝制時,電熱片92接觸面板22的外緣,並且面板拆卸治具9所包含的氣囊98僅位於箝制件14的勾部144與承載座10的底板100之間,並未延伸至電子裝置2的面板22與承載座10的底板100之間。It should be noted that in the present embodiment, the panel removal jig 9 further includes a bump 90 and a heating sheet 92. The bumps 90 are disposed on the bearing surface 100a of the bottom plate 100, and the heating fins 92 are disposed on the bumps 90. When the panel 22 of the electronic device 2 is adsorbed on the adsorption device 12 and the casing 20 is clamped by the clamp member 14, the heating fin 92 contacts the outer edge of the panel 22, and the airbag 98 included in the panel removal jig 9 is located only on the clamp member 14. The hook portion 144 and the bottom plate 100 of the carrier 10 do not extend between the panel 22 of the electronic device 2 and the bottom plate 100 of the carrier 10.

換言之,在電子裝置2的面板22吸附於吸附裝置12上且機殼20受箝制件14箝制時,電熱片92會一直接觸面板22的外緣,因此面板拆卸治具9的氣囊98並不需如前述的各實施方式一樣依序充氣至上述的第一充氣狀態與第二充氣狀態。在電熱片92接觸面板22的外緣進行加熱並經過預定時間之後,黏固於面板22與機殼20之間的黏固 件21會因為溫度升高而黏性下降。在預定時間之後,面板拆卸治具9可藉由第2圖中的充氣裝置16的控制器162控制充氣單元160持續對氣囊98充氣。在氣囊98推擠箝制件14的推力大於面板22與機殼20之間的黏固件21持續減弱的黏固力之後,氣囊98即可推擠箝制件14遠離底板100的承載面100a移動,致使電子裝置2的機殼20受箝制件14帶動而與面板22分離。In other words, when the panel 22 of the electronic device 2 is adsorbed on the adsorption device 12 and the casing 20 is clamped by the clamp member 14, the heating fin 92 will always contact the outer edge of the panel 22, so the airbag 98 of the panel removal jig 9 does not need to be The first inflated state and the second inflated state are sequentially inflated as in the foregoing embodiments. After the heating sheet 92 contacts the outer edge of the panel 22 for heating and after a predetermined time, the adhesion between the panel 22 and the casing 20 is adhered. Piece 21 will decrease in viscosity due to an increase in temperature. After the predetermined time, the panel removal jig 9 can control the inflation unit 160 to continue inflating the air bag 98 by the controller 162 of the inflator 16 in FIG. After the airbag 98 pushes the force of the clamp 14 to be greater than the adhesive force of the adhesive 21 between the panel 22 and the casing 20, the airbag 98 can push the clamp 14 away from the bearing surface 100a of the bottom plate 100, resulting in movement. The casing 20 of the electronic device 2 is driven by the clamp 14 to be separated from the panel 22.

由以上對於本發明的具體實施方式的詳述,可以明顯地看出,本發明的面板拆卸治具主要是利用加熱的方式先將面板與機殼之間的黏固件黏度降低,再分別對面板與機殼施以相反方向的外力,藉以在盡可能不造成損壞的前提下讓面板與機殼分離。並且,本發明的面板拆卸治具容易達成標準化及自動化的效果。因此,只要依照欲拆解的電子裝置設定對應的參數(例如,加熱時間、充氣時間、充氣壓力值等),放置於本發明的面板拆卸治上的電子裝置即可標準地且自動地完成拆卸。From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the panel demolition jig of the present invention mainly uses the heating method to first reduce the viscosity of the adhesive between the panel and the casing, and then separately to the panel. Apply external force in the opposite direction to the casing to separate the panel from the casing without causing damage. Further, the panel detaching jig of the present invention easily achieves the effects of standardization and automation. Therefore, as long as the corresponding parameters (for example, heating time, inflation time, inflation pressure value, etc.) are set according to the electronic device to be disassembled, the electronic device placed on the panel removal treatment of the present invention can be completely and automatically disassembled. .

雖然本發明已以實施方式揭露如上,然其並不用以限定本發明,任何熟習此技藝者,在不脫離本發明的精神和範圍內,當可作各種的更動與潤飾,因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。The present invention has been disclosed in the above embodiments, and is not intended to limit the scope of the present invention, and the invention may be modified and modified in various ways without departing from the spirit and scope of the invention. The scope is subject to the definition of the scope of the patent application.

1‧‧‧面板拆卸治具1‧‧‧ Panel Demolition Fixture

10‧‧‧承載座10‧‧‧Hosting

100‧‧‧底板100‧‧‧floor

100a‧‧‧承載面100a‧‧‧ bearing surface

102‧‧‧側壁102‧‧‧ side wall

102a‧‧‧導引部102a‧‧‧Guidance

12‧‧‧吸附裝置12‧‧‧Adsorption device

14‧‧‧箝制件14‧‧‧Clamping parts

140‧‧‧本體140‧‧‧ Ontology

142‧‧‧抵靠部142‧‧‧Abutment

144‧‧‧勾部144‧‧‧Hook

16‧‧‧充氣裝置16‧‧‧Inflator

160‧‧‧充氣單元160‧‧‧Inflatable unit

162‧‧‧控制器162‧‧‧ Controller

18‧‧‧氣囊18‧‧‧Airbag

180‧‧‧接觸部180‧‧‧Contacts

2‧‧‧電子裝置2‧‧‧Electronic devices

20‧‧‧機殼20‧‧‧Chassis

21‧‧‧黏固件21‧‧‧Sticker

22‧‧‧面板22‧‧‧ panel

34‧‧‧箝制件34‧‧‧Clamping parts

340‧‧‧本體340‧‧‧ Ontology

340a‧‧‧開口340a‧‧‧ openings

342‧‧‧抵靠部342‧‧‧Abutment

344‧‧‧勾部344‧‧‧Hook

54‧‧‧箝制件54‧‧‧Clamping parts

540‧‧‧抵靠部540‧‧‧Abutment

542‧‧‧勾部542‧‧‧Hook

70‧‧‧電熱片70‧‧‧Electric heating film

90‧‧‧凸塊90‧‧‧Bumps

92‧‧‧電熱片92‧‧‧Electric heating film

第1圖為繪示依照本發明一實施方式的面板拆卸治具與電子裝置的立體組合圖。FIG. 1 is a perspective assembled view of a panel removal jig and an electronic device according to an embodiment of the present invention.

第2圖為繪示第1圖中之氣囊連接至充氣裝置的示意 圖。Figure 2 is a schematic view showing the connection of the airbag of Figure 1 to the inflator Figure.

第3A圖為繪示第1圖中之面板拆卸治具與電子裝置的剖面圖,其中氣囊尚未充氣。FIG. 3A is a cross-sectional view showing the panel removal jig and the electronic device in FIG. 1 , wherein the air bag is not inflated.

第3B圖為繪示第1圖中之面板拆卸治具與電子裝置的另一剖面圖,其中氣囊充氣至第一充氣狀態。FIG. 3B is another cross-sectional view showing the panel dismounting jig and the electronic device in FIG. 1 , wherein the air bag is inflated to the first inflated state.

第3C圖為繪示第1圖中之面板拆卸治具與電子裝置的另一剖面圖,其中氣囊充氣至第二充氣狀態。FIG. 3C is another cross-sectional view showing the panel dismounting jig and the electronic device in FIG. 1 , wherein the air bag is inflated to a second inflated state.

第4圖為繪示第1圖中之箝制件的另一實施方式的剖面圖。Fig. 4 is a cross-sectional view showing another embodiment of the clamp member of Fig. 1.

第5圖為繪示第1圖中之箝制件的另一實施方式的剖面圖。Fig. 5 is a cross-sectional view showing another embodiment of the clamp of Fig. 1.

第6A圖為繪示依照本發明另一實施方式的面板拆卸治具與電子裝置的剖面圖,其中氣囊尚未充氣。FIG. 6A is a cross-sectional view showing a panel dismounting jig and an electronic device according to another embodiment of the present invention, wherein the air bag is not inflated.

第6B圖為繪示第6A圖中之面板拆卸治具與電子裝置的另一剖面圖,其中氣囊充氣至第一充氣狀態。FIG. 6B is another cross-sectional view showing the panel dismounting jig and the electronic device in FIG. 6A, wherein the air bag is inflated to the first inflated state.

第6C圖為繪示第6A圖中之面板拆卸治具與電子裝置的另一剖面圖,其中氣囊充氣至第二充氣狀態。FIG. 6C is another cross-sectional view showing the panel removal jig and the electronic device in FIG. 6A, wherein the airbag is inflated to a second inflated state.

第7圖為繪示依照本發明另一實施方式的面板拆卸治具與電子裝置的剖面圖,其中氣囊尚未充氣。FIG. 7 is a cross-sectional view showing a panel dismounting jig and an electronic device according to another embodiment of the present invention, wherein the air bag is not inflated.

1‧‧‧面板拆卸治具1‧‧‧ Panel Demolition Fixture

10‧‧‧承載座10‧‧‧Hosting

100‧‧‧底板100‧‧‧floor

100a‧‧‧承載面100a‧‧‧ bearing surface

102‧‧‧側壁102‧‧‧ side wall

12‧‧‧吸附裝置12‧‧‧Adsorption device

14‧‧‧箝制件14‧‧‧Clamping parts

140‧‧‧本體140‧‧‧ Ontology

142‧‧‧抵靠部142‧‧‧Abutment

144‧‧‧勾部144‧‧‧Hook

18‧‧‧氣囊18‧‧‧Airbag

180‧‧‧接觸部180‧‧‧Contacts

2‧‧‧電子裝置2‧‧‧Electronic devices

20‧‧‧機殼20‧‧‧Chassis

21‧‧‧黏固件21‧‧‧Sticker

22‧‧‧面板22‧‧‧ panel

Claims (9)

一種面板拆卸治具,供一電子裝置使用,該電子裝置包含一機殼與一面板,該機殼與該面板的外緣以一黏固件黏固,該面板拆卸治具包含:一承載座,具有一承載面,該承載座包含:一底板,其中該承載面位於該底板上;以及兩側壁,連接該底板並大體上彼此平行地設置於該承載面上;一吸附裝置,設置於該承載面上,用以吸附該面板;一箝制件,操作性連接該承載座,並可朝向或遠離該承載面移動,用以箝制該機殼並裸露出該面板,其中該箝制件位於該些側壁之間,並且該箝制件於朝向或遠離該承載面移動期間受該些側壁導引;以及一氣囊,設置於該承載面上,用以接收一氣體以依序充氣至一第一充氣狀態以及一第二充氣狀態;以及一加熱件,位於該承載面與該電子裝置之間,用以對該面板的外緣加熱,其中該氣囊於該第一充氣狀態接觸該箝制件,並且該氣囊由該第一充氣狀態充氣至該第二充氣狀態期間推擠該箝制件遠離該承載面移動,致使該機殼受該箝制件帶動而與該面板分離。 A panel dismounting jig for use in an electronic device, the electronic device comprising a casing and a panel, the casing and the outer edge of the panel being adhered by a glue, the panel demolition fixture comprising: a carrier Having a bearing surface, the carrier includes: a bottom plate, wherein the bearing surface is located on the bottom plate; and two side walls connected to the bottom plate and disposed substantially parallel to each other on the bearing surface; a suction device disposed on the bearing a surface for absorbing the panel; a clamping member operatively connecting the carrier and movable toward or away from the bearing surface for clamping the casing and exposing the panel, wherein the clamping member is located on the sidewall And being guided by the side walls during movement toward or away from the bearing surface; and an air bag disposed on the bearing surface for receiving a gas to be sequentially inflated to a first inflated state and a second inflated state; and a heating member between the bearing surface and the electronic device for heating the outer edge of the panel, wherein the airbag contacts the clamping in the first inflated state And pushing the clamp member moves away from the supporting surface, so that the casing by clamping the driven member of the panel and separated from the second state of the inflated airbag inflator period from the first state to the inflated. 如請求項1所述之面板拆卸治具,其中該氣體為一高溫氣體,該加熱件為該氣囊上的一接觸部,並且該氣囊充氣至該第一充氣狀態期間使該接觸部上升而接觸該面 板的外緣,致使該高溫空氣經由該接觸部與該面板對該黏固件進行加熱。 The panel removal jig according to claim 1, wherein the gas is a high temperature gas, the heating member is a contact portion on the air bag, and the air bag is inflated to the first inflated state to raise the contact portion to contact The face The outer edge of the plate causes the high temperature air to heat the adhesive via the contact portion and the panel. 如請求項2所述之面板拆卸治具,其中該氣囊由具有彈性之一高導熱材料所製成。 The panel demolition jig according to claim 2, wherein the airbag is made of a material having high elasticity and high thermal conductivity. 如請求項1所述之面板拆卸治具,其中該加熱件為一電熱片,設置於該氣囊上,並且該氣囊充氣至該第一充氣狀態期間使該電熱片上升而接觸該面板的外緣。 The panel removal jig according to claim 1, wherein the heating member is a heating sheet disposed on the airbag, and the airbag is inflated to the outer edge of the panel during inflation to the first inflation state. . 如請求項4所述之面板拆卸治具,其中該氣囊由具有彈性之一耐熱材料所製成。 The panel demolition jig according to claim 4, wherein the airbag is made of a heat-resistant material having elasticity. 如請求項1所述之面板拆卸治具,其中該加熱件包含一凸塊以及一電熱片,該凸塊設置於該承載面上,並且該電熱片設置於該凸塊上並接觸該面板的外緣。 The panel dismounting tool of claim 1, wherein the heating member comprises a bump and a heating sheet, the bump is disposed on the bearing surface, and the heating fin is disposed on the bump and contacts the panel Outer edge. 如請求項1所述之面板拆卸治具,進一步包含一充氣裝置,連通該氣囊,用以產生該氣體,該充氣裝置對該氣囊充氣至該第一充氣狀態之後停止充氣一預定時間,並於該預定時間之後對該氣囊充氣至該第二充氣狀態。 The panel removal jig according to claim 1, further comprising an inflating device that communicates with the airbag to generate the gas, and the inflating device inflates the airbag to the first inflated state and then stops inflating for a predetermined time, and The air bag is inflated to the second inflated state after the predetermined time. 如請求項1所述之面板拆卸治具,其中該箝制件包含: 一本體;兩抵靠部,分別連接於該本體的兩對立邊緣,每一該些抵靠部抵靠對應之該側壁,其中該電子裝置位於該些抵靠部之間;以及兩勾部,分別連接至該些抵靠部的末端,用以箝制該機殼的邊框。 The panel removal jig of claim 1, wherein the clamp comprises: a body; two abutting portions respectively connected to the two opposite edges of the body, each of the abutting portions abutting the corresponding side wall, wherein the electronic device is located between the abutting portions; and the two hook portions, They are respectively connected to the ends of the abutments for clamping the frame of the casing. 如請求項8所述之面板拆卸治具,其中該本體具有一開口,允許該電子裝置通過。The panel removal jig of claim 8, wherein the body has an opening to allow the electronic device to pass.
TW101139926A 2012-10-29 2012-10-29 Panel disassembly fixture TWI489923B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200719375A (en) * 2005-08-01 2007-05-16 3M Innovative Properties Co Separation apparatus for PDP panel assembly and method for controlling the same
TW200831237A (en) * 2007-01-16 2008-08-01 Taiwan Semiconductor Mfg CMP system with temperature-controlled polishing head
TW201234443A (en) * 2010-08-23 2012-08-16 Tokyo Electron Ltd Peeling apparatus, peeling system, peeling method, and computer storage medium

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200719375A (en) * 2005-08-01 2007-05-16 3M Innovative Properties Co Separation apparatus for PDP panel assembly and method for controlling the same
TW200831237A (en) * 2007-01-16 2008-08-01 Taiwan Semiconductor Mfg CMP system with temperature-controlled polishing head
TW201234443A (en) * 2010-08-23 2012-08-16 Tokyo Electron Ltd Peeling apparatus, peeling system, peeling method, and computer storage medium

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