TWI489176B - 行動電子裝置的螢幕控制模組及其控制器 - Google Patents

行動電子裝置的螢幕控制模組及其控制器 Download PDF

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TWI489176B
TWI489176B TW101147414A TW101147414A TWI489176B TW I489176 B TWI489176 B TW I489176B TW 101147414 A TW101147414 A TW 101147414A TW 101147414 A TW101147414 A TW 101147414A TW I489176 B TWI489176 B TW I489176B
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touch panel
package
panel controller
width
control module
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TW101147414A
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TW201423217A (zh
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Ming Lung Ho
Chien Wen Tsai
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Elan Microelectronics Corp
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Application filed by Elan Microelectronics Corp filed Critical Elan Microelectronics Corp
Priority to TW101147414A priority Critical patent/TWI489176B/zh
Priority to CN201310011173.9A priority patent/CN103869891A/zh
Priority to US13/802,845 priority patent/US9207719B2/en
Priority to CN201320827431.6U priority patent/CN203630719U/zh
Publication of TW201423217A publication Critical patent/TW201423217A/zh
Priority to US14/738,291 priority patent/US20150279775A1/en
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Publication of TWI489176B publication Critical patent/TWI489176B/zh
Priority to US14/927,051 priority patent/US9591761B2/en
Priority to US15/416,725 priority patent/US20170148725A1/en

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Description

行動電子裝置的螢幕控制模組及其控制器
本發明係關於一種行動電子裝置的螢幕控制模組及其控制器，尤指一種可擴大體積長寬比以滿足行動電子裝置縮小螢幕邊框寬度需求的螢幕控制模組。
由於平板電腦(Tablet Computer)的崛起，使既有電腦市場中各式電腦的市佔比重新洗牌並形成推擠效應，一般認為受平板電腦影響最深的莫過於筆記型電腦(Notebook)。從時尚與科技的角度，平板電腦能夠席捲市場的理由不難想像，但從實用性的角度比較，筆記型電腦仍有平板電腦無法超過的優點與特性。例如平板電腦憑藉優異的觸控介面支援人性化的直覺式操作，但在需要大量輸入文字的場合，即明顯暴露手寫輸入的缺點，因為手寫速度遠遠不及使用鍵盤動輒每分鐘數十字的輸入速度。儘管筆記型電腦在體積、重量及電池待機時間等項目上不如平板電腦，但基於不同的使用目的、用途，筆記型電腦仍保有平板電腦無法完全取代的地位。
由上述可知，筆記型電腦在市場上依然可以保持一定的優勢，而業者也持續地進行筆記型電腦相關技術的研發與改進。在研發改進的各項技術中，筆記型電腦的螢幕上蓋也是其中一個備受關注的項目，如圖8所示，已知筆記型電腦包括一含有鍵盤71的主機70、一透過樞紐器樞設在主機70一側邊 緣上而內嵌有顯示器73的螢幕上蓋72。請參閱圖9所示，已知的螢幕上蓋72是在相對主機70的內側面上具有一矩形邊框720，該顯示器73設於邊框720內側，而由邊框720定義出顯示器73的有效顯示區域，在此狀況下，邊框720的寬度W即直接影響顯示器73的有效顯示區域大小。儘管如此，螢幕上蓋72的邊框720事實上有其存在的必要性，其主要作用在於顯示器73的固定與防護，更重要的是：用以驅動顯示器73及/或觸控面板(若顯示器73上覆設有觸控面板)的螢幕控制模組也設置在邊框720內。
所謂的螢幕控制模組主要是在一電路板80上設有一個以上的控制器81，該控制器81透過電路板80上的線路及連接器82和顯示器73及/或觸控面板電連接。當消費市場有進一步放大顯示器73的有效顯示區域的需求時，則首先必須考慮縮小螢幕上蓋72的邊框720寬度，然而縮小邊框720寬度必須一併考慮的是螢幕控制模組的寬度，惟有在螢幕控制模組寬度可能縮小的情況下，邊框720才可能縮小。
但以既有螢幕控制模組的構成，縮小其寬度確實存在障礙，請參閱圖10所示，前述螢幕控制模組主要係在電路板80上設有一個以上的控制器81、一個以上的連接器82及多個被動元件83，而縮小螢幕控制模組的寬度，首先必須縮小電路板80的寬度，但電路板80能否縮小其寬度，端視其上安裝的元件尺寸，而其上的主要元件為控制器81，但既有控制器81的封裝構造具有相當的寬度，在此狀況下，電路板80寬度勢必要大於控制器81的寬度，始能符合安裝元件的需求。
由上述可知，筆記型電腦市場對於螢幕上蓋的顯示器有效顯示區域有進一步擴大的需求，欲擴大有效顯示區域則必須考慮縮小螢幕上蓋的邊框寬度，而邊框寬度則受內裝螢幕控制模組的寬度所限制，因此欲縮小螢幕上蓋的邊框寬度，必須對縮小螢幕控制模組的寬度提出具體的因應方案。
本發明主要目的在提供一種行動電子裝置的螢幕控制模組，主要是在電路板上安裝具特殊比例封裝體的控制器，使電路板得以擴大其長度與寬度的比例，從而可以縮小螢幕控制模組的寬度，以消除既有筆記型電腦縮小螢幕上蓋邊框寬度的障礙。
為達成前述目的採取的主要技術手段係令前述行動電子裝置的螢幕控制模組包括：一電路板，具有一表面，該表面設有複數分別沿一第一方向及一第二方向排列的焊墊，且沿著第一方向設置的焊墊數量大於沿著第二方向設置的焊墊數量；及一個以上的控制器，設置於前述電路板的表面且該控制器由一具有封裝體的積體電路所構成，該控制器的封裝體具有一長度及一寬度，其長度與寬度的比值不小於2；該封裝體上設有複數分別沿長度方向及寬度方向排列的電性觸點，該電性觸點分別對應於該電路板上的焊墊且構成電連接；在前述行動電子裝置的螢幕控制模組中，是使電路板上的複數焊墊分別沿不同的第一方向及第二方向排列，並使沿著第一方向設置的焊墊數量大於沿著第二方向設置的焊墊數量，以構成一狹長的電連接介面；而控制器封裝體上的電性觸點也作對應的排列，並對應電連接在電路板的各個焊墊上；如此一來，該控制器的封裝體長度、寬度比例可以不小於2，在控制器的封裝體寬度得以縮小的情況下，螢幕控制模組的電路板寬度自得以對應縮小，從而使螢幕上蓋縮小其邊框以擴大顯示器有效顯示區域的需求成為可能。
本發明又一目的在提供一種螢幕控制模組的控制器，其封裝體尺寸具有特殊比例，可滿足具有狹長電連接介面的應用場合。
為達成前述目的採取的技術手段係令前述螢幕控制模組的控制器係由一具有狹長封裝體的積體電路所構成，該控制器的封裝體具有一長度及一寬度，其長度與寬度的比值不小於2，該封裝體上設有複數分別沿長度方向及寬度方向排列的電性觸點，其沿著該長度方向設置的電性觸點數量大於沿著該寬度方向設置的電性觸點數量；由於前述控制器的封裝體長度、寬度比例不小於2，其封裝體上的複數電性觸點得以分別在長度方向及寬度方向排列，且沿長度方向設置的電性觸點數量大於沿著寬度方向設置的電性觸點數量，藉此可適用在具有狹長電連接介面的載體上。
10‧‧‧電路板
11‧‧‧電連接介面
110‧‧‧焊墊
20‧‧‧控制器
200‧‧‧封裝體
210‧‧‧電性觸點
31,32‧‧‧連接器
33‧‧‧被動元件
40‧‧‧矽基材
41‧‧‧晶片
42‧‧‧防護膠層
43‧‧‧凸塊
44‧‧‧介電層
440‧‧‧內層線路
45‧‧‧錫球
50‧‧‧封裝載板
51‧‧‧晶片
52,55‧‧‧錫球
53‧‧‧封膠層
54‧‧‧凸塊
501,501A‧‧‧介電層
502‧‧‧銅線路層
503‧‧‧玻纖布
60‧‧‧筆記型電腦
61‧‧‧螢幕上蓋
610‧‧‧邊框
70‧‧‧主機
71‧‧‧鍵盤
72‧‧‧螢幕上蓋
720‧‧‧邊框
73‧‧‧顯示器
80‧‧‧電路板
81‧‧‧控制器
82‧‧‧連接器
83‧‧‧被動元件
圖1 係本發明螢幕控制模組的外觀圖。
圖2 係本發明螢幕控制模組的平面圖。
圖3 係本發明螢幕控制模組安裝在筆記型電腦的外觀圖。
圖4 係本發明螢幕控制模組在螢幕上蓋內的平面圖。
圖5 係本發明控制器所採用晶圓級晶片尺寸封裝元件的平面圖。
圖6A、6B 係本發明控制器所採用兩種晶片尺寸封裝元件的平面圖。
圖7 係本發明控制器所採用封裝載板的平面圖。
圖8 係既有筆記型電腦的外觀圖。
圖9 係既有筆記型電腦在螢幕上蓋內設螢幕控制模組的平面示意圖。
圖10 係既有螢幕控制模組的平面圖。
本發明的螢幕控制模組係應用在行動電子裝置，所稱的行動電子裝置包含但不限於：筆記型電腦、電子辭典及具有掀蓋式構造且將顯示器設在螢幕上蓋的其他電子裝置。當螢幕控制模組應用在筆記型電腦上，係安裝在筆記型電腦的螢幕上蓋內。
關於本發明的一較佳實施例，請參閱圖1所示，主要係使一螢幕控制模組是在一電路板10上設有一個以上的控制器20、一個以上的連接器31,32，或進一步設有複數的被動元件33，在本實施例中，該電路板10上設有兩個控制器20、兩個連接器31,32和多個被動元件33，必須說明的是：其僅為示例而已，非用以限制螢幕控制模組的具體組成元件。該螢幕控制模組係透過連接器31,32與螢幕上蓋內的液晶顯示面板及/或觸控面板連接，與液晶顯示面板連接時，前述至少一個控制器20是一液晶面板控制器，與觸控面板連接時，則至少一個控制器20係作為觸控面板控制器。
在本實施例中，前述電路板10是在其中一表面安裝該控制器20、連接器31,32及被動元件33，就連接器31,32及被動元件33的安裝可分別使用插件焊接、表面黏著(SMT)等方式，其屬已知技術，容不再贅述。
前述電路板10係呈狹長狀，其可實現的長度、寬度範圍分別是長度50~80mm，寬度為小於等於9mm。又電路板10表面設有一個以上的狹長狀電連接介面11，用以安裝前述控制器20，該電連接介面11係由複數形成在電路板10表面的焊墊110所組成，該等焊墊110分別沿著一第一方向和一第二方向排列，在本實施例中，所稱第一方向是指電路板10的長度方向，第二方向則指在電路板10上垂直於長度方向的寬度方向，亦即該等焊墊110是呈矩陣排列，而位在長度方向的焊墊110數量大於位在寬度方向上的焊墊110數量，舉例而言，其位在長度方向的焊墊110為20個，位在寬度方向的焊墊110為8個。
請配合參閱圖2所示，該控制器20係由積體電路構成而具有一封裝體200，該封裝體200具有一長度L及一寬度W，其長度L大於寬度W，且長度與寬度的比例不小於2，可以實現的比例範圍為2~4，可以實現的封裝體200尺寸分別為：長度不大於20mm，優選為10~13mm，寬度則小於等於6mm。因而所稱的封裝體200是呈狹長狀，而封裝體20底面設有不少於100個的複數電性觸點210，該等電性觸點210分別沿著該封裝體200之長度方向和寬度方向排列，且該封裝體200的長度方向與前述第一方向相對應，該封裝體200上垂直於長度方向的寬度方向則與該第二方向相對應，亦即該等電性觸點210是呈矩陣排列，而位在長度方向的電性觸點210數量大於位在寬度方向上的電性觸點210數量，其排列方式與位置與電路板10上的各個焊墊110匹配，因此可對應電連接。
以下例舉數種封裝體200可行的長度、寬度比例及對應的電性觸點210數量：
前述控制器20的封裝體200所設電性觸點210形式視其採用的封裝技術而有不同，在本實施例中，該控制器20是一球格陣列(BGA)元件，因此封裝體200上的電性觸點210係由錫球構成；另外，當控制器20是一晶片尺寸封裝(CSP)元件或一晶圓級晶片尺寸封裝(WLCSP)元件時，封裝體200上的電性觸 點210依然係由錫球構成。若控制器20是一無錫球的觸點陣列(LGA)元件時，則封裝體200上的電性觸點210是由其底面的焊墊所構成。
由上述可知，本發明的螢幕控制模組是使電路板10上的複數焊墊110分別沿第一方向及第二方向排列，並使沿著第一方向設置的焊墊110數量大於沿著第二方向設置的焊墊110數量，以構成一狹長的電連接介面11，以便與具有複數電性觸點210且作相同形式排列的控制器20對應連接；在前述匹配關係下，該控制器20的封裝體200得以擴大其長度L與寬度W的比例，在長度L拉長而寬度W縮小的狀況下，控制器20可以縮小與電路板10的相對寬度比(寬度對寬度)(如圖2所示)，因此電路板10的寬度與螢幕控制模組的整體寬度均得以縮小，藉此可以消除縮小螢幕上蓋的邊框寬度但受限於螢幕控制模組的限制因素。因此如圖3、圖4所示，當螢幕控制模組安裝筆記型電腦60的螢幕上蓋61內，該螢幕上蓋61的邊框610寬度W1即得以縮小，從而擴大顯示器的有效顯示區域。
由前述實施例可知，本發明係拉長控制器20的封裝體200的長寬比，以降低其與電路板10間的相對寬度比。為確保控制器20在安裝(例如回焊)時不致發生撓曲(warp)現象，本發明進一步提出以下技術方案，以因應可能的撓曲的問題：其中一個技術方案是令前述控制器20採用晶圓級晶片尺寸封裝(WLCSP)元件，請參閱圖5，其揭示一晶圓級晶片尺寸封裝元件，主要係在一矽基材40的一表面上裝設有一晶片41，晶片41周圍設有一防護膠層42，又晶片41表面植設有複數凸塊(pad)43，該晶片41與防護膠層42上層又覆設有一介電層44，該介電層44具有內層線路440，且在表面植設有錫球45，各錫球45係透過介電層44的內層線路440與晶片41上的凸塊43電連接。
如前揭所述的晶圓級晶片尺寸封裝元件因在晶圓製程中完成，其晶片41與矽基材40均為矽晶材料，因此其接合面的熱浪係數小，可有效降低回焊時的熱對元件產生的撓曲效應。
本發明採用的另一技術手段係採用CCL基材作為封裝載板，利用CCL基板的抗撓曲能力因應回焊時對封裝載板的撓曲效應。請參閱圖6A所示，係一典型的晶片尺寸(CSP)元件，主要係在一封裝載板50的表面設有一晶片51，該封裝載板50具有內層線路，且表面形成多數凸塊54，其底面植設有多數錫球52，該凸塊54與錫球52係透過內層線路相互連接；該晶片51表面設有焊墊，透過打線方式與封裝載板50表面的凸塊54電連接，而後在封裝載板50與晶片51外形成一封膠層53以完成封裝。
又如圖6B所示，則係一採用覆晶(FC)技術的晶片尺寸(CSP)元件，主要係在一封裝載板50的表面以覆晶(FC)植設有一晶片51，該封裝載板50具有內層線路，且表面形成多數凸塊54，其底面植設有多數錫球52，該凸塊54與錫球52係透過內層線路相互連接；該晶片51表面植設有錫球55，透過覆晶方式與封裝載板50表面的凸塊54電連接，而後在封裝載板50與晶片51外形成一封膠層53以完成封裝。
當前述封裝載板50由CCL基板構成時，其構造係如圖7所示，主要係由多層介電層501與多層銅線路層502交疊構成一多層基板，其中每一介電層501,501A內分別設有一層玻纖布503。而為提升多層基板的抗撓強度，本發明係可降低至少一介電層501A內的玻纖布503厚度，但增加該介電層501A內的玻纖布層數，亦即在該介電層501A內設有二層以上的玻纖布503，例如當介電層501A厚度為0.15mm時，原配置厚度為0.14mm(料號1056)的玻纖布503，則可降低玻纖布503的厚度至0.05mm(料號1086)，並增加其層數。當介電層501A厚 度為0.25mm時，原配置2層厚度為0.09mm(料號2116)的玻纖布503，則可將玻纖布503的厚度降低至0.08mm(料號3313)，並增加其層數。
一般CCL基板在介電層501,501A內設置玻纖布503，原本即具有相當的抗撓曲能力，本發明在原有厚度的介電層501A內增加玻纖布503層數，則可進一步提升抗撓曲強度。
由上述可知，本發明的螢幕控制模組是在電路板上設以分別沿第一方向及第二方向排列的複數焊墊，並使沿著第一方向設置的焊墊數量大於沿著第二方向設置的焊墊數量，以構成一狹長的電連接介面；又配合一控制器在其狹長狀封裝體上設以相同排列方式的複數電性觸點，以對應連接；在前述設計下，該控制器的封裝體得以擴大其長度與寬度的比例，在長度拉長而寬度縮小的狀況下，控制器可以縮小與電路板的相對寬度比，因此電路板的寬度得以縮小，從而螢幕控制模組的整體寬度亦可隨之縮小，藉以滿足縮小螢幕上蓋的邊框寬度的需求。
10‧‧‧電路板
20‧‧‧控制器
200‧‧‧封裝體
31,32‧‧‧連接器
33‧‧‧被動元件

Claims (13)

  1. 一種行動電子裝置的螢幕控制模組，包括：一電路板，具有一表面，該表面設有複數分別沿一第一方向及一第二方向排列的焊墊，且沿著第一方向設置的焊墊數量大於沿著第二方向設置的焊墊數量；及一個以上的觸控面板控制器，設置於該電路板之表面且由一具有封裝體的積體電路所構成，該觸控面板控制器的封裝體具有一長度及一寬度，其長度與寬度的比值為2至4之間；其中，該觸控面板控制器為一球格陣列(BGA)元件或一觸點陣列(LGA)元件，該封裝體上設有複數分別沿長度方向及寬度方向排列的電性觸點，該電性觸點分別對應於該電路板上的焊墊且構成電連接，其中該長度方向對應該電路板之第一方向，該寬度方向對應該電路板之第二方向。
  2. 如請求項1所述行動電子裝置的螢幕控制模組，該觸控面板控制器的封裝體長度不大於20mm，寬度小於等於6mm。
  3. 如請求項2所述行動電子裝置的螢幕控制模組，該觸控面板控制器的封裝體上所設電性觸點的數量不少於100個。
  4. 如請求項1至3中任一項所述行動電子裝置的螢幕控制模組，該電路板寬度為小於等於9mm。
  5. 如請求項4所述行動電子裝置的螢幕控制模組，該觸控面板控制器是一晶圓級晶片尺寸封裝(WLCSP)元件。
  6. 如請求項1至3中任一項所述行動電子裝置的螢幕控制模組，該觸控面板控制器的封裝體內具有一封裝載板，該封裝載板主要係由多層介電層與多層銅線路層交疊構成，各介電層內設有一層以上的玻纖布，且其中至少一介電層內設有二層以上的玻纖布。
  7. 如請求項6所述行動電子裝置的螢幕控制模組，該觸控面板控制器是一晶片尺寸封裝(CSP)元件。
  8. 一種觸控面板控制器，係由一具有狹長封裝體的積體電路所構成，該觸控面板控制器的封裝體具有一長度及一寬度，其長度與寬度的比值為2至4之間，其中該觸控面板控制器是一球格陣列(BGA)元件或一觸點陣列(LGA)元件，該封裝體上設有複數分別沿長度方向及寬度方向排列的電性觸點，其沿著該長度方向設置的電性觸點數量大於沿著該寬度方向設置的電性觸點數量。
  9. 如請求項8所述觸控面板控制器，該觸控面板控制器的封裝體長度為不大於20mm，寬度小於等於6mm。
  10. 如請求項9所述觸控面板控制器，該觸控面板控制器的封裝體上所設電性觸點的數量不少於100個。
  11. 如請求項10所述觸控面板控制器，該觸控面板控制器是一晶圓級晶片尺寸封裝(WLCSP)元件。
  12. 如請求項8至10中任一項所述觸控面板控制器，該觸控面板控制器的封裝體內具有一封裝載板，該封裝載板主要係由多層介電層與多層銅線路層交疊構成，各介電層內設有一層以上的玻纖布，其中至少一介電層內設有二層以上的玻纖布。
  13. 如請求項12所述觸控面板控制器，該觸控面板控制器是一晶片尺寸封裝(CSP)元件。
TW101147414A 2012-12-14 2012-12-14 行動電子裝置的螢幕控制模組及其控制器 TWI489176B (zh)

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CN201310011173.9A CN103869891A (zh) 2012-12-14 2013-01-11 行动电子装置的屏幕控制模块及其控制器
US13/802,845 US9207719B2 (en) 2012-12-14 2013-03-14 Screen control module of a mobile electronic device and controller thereof with multiple dielectric layers
CN201320827431.6U CN203630719U (zh) 2012-12-14 2013-12-13 移动电子装置的屏幕控制模块及其控制器
US14/738,291 US20150279775A1 (en) 2012-12-14 2015-06-12 Screen control module of a mobile electronic device and controller thereof
US14/927,051 US9591761B2 (en) 2012-12-14 2015-10-29 Screen control module having greater anti-warp strength of a mobile electronic device and controller thereof
US15/416,725 US20170148725A1 (en) 2012-12-14 2017-01-26 Package of a controller and screen control module with the same

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