TWI489119B - Usb memory package and manufacturing method thereof - Google Patents

Description

USB memory package and method of manufacturing same

The present invention relates to a USB memory package and a method of fabricating the same, and in particular to a USB memory package and a method of manufacturing the same that are easy to perform hard software recording and memory testing after the USB memory package is fabricated.

USB (Universal Serial Bus) is one of the buses (bus: channel for transmitting data) used when transmitting and receiving data between a computer and peripheral devices. Flash memory is a semiconductor that can store data. It has the feature of being able to store or delete data freely, and to turn off the power and save the data as it is.

Combining the two factors of USB and flash memory into one product is a USB flash drive or USB memory. The USB memory is composed of a flash memory chip that stores data, a connector, and a controller that controls data transfer between the memory chips.

As a technique for mounting various components in a memory module, a representative surface mount technology (SMT: Surface Mounting Technology) is used. The surface mount technology is a technology capable of directly mounting a surface mount component on a surface of a printed circuit board (PCB) to be connected to an electronic circuit. However, the surface mounting technology has the convenience of being able to directly mount components on the surface of a printed circuit board, but the size of the surface mounting member is large, and it is difficult to miniaturize the memory module.

Recently, wafer level packaging technology has been developed to make the miniaturization of memory modules an epoch-making development. Wafer-level packaging technology is a technique in which a wafer is diced after a single-time execution of a packaging process in a wafer state to manufacture a finished product. This technology is utilized in the manufacture of a memory module of the COB (Chip-On-Board) type built in a wafer state.

Figure 1 shows a USB 3.0 memory body of the past chip package (COB) type.

Referring to Fig. 1, the memory body is formed with a 5-foot contact pad 12 on the upper surface of the printed circuit board 10, and various components are mounted on the other surface, and an insulating substance is molded thereon to constitute a COB type.

4 foot contact pads 11 and 5 foot contact pads 12 constitute 9 feet for use in USB3.0, 4-foot contact pads 11 can be used separately for USB2.0. A 5-pin connector 20 is mounted on the 5-foot contact pad 12, wherein the 5-pin connector 20 is fabricated separately. The 5-pin connector 20 is constructed by inserting a pin spring 22 into the slot 21.

If the COB type USB 3.0 memory body is thus produced, the connector portion of the memory body is inserted into the test device to record the hard software and perform the memory test.

However, inserting the memory bodies one by one into the test device for the memory test is very cumbersome, and the process of inserting and detaching from the memory body has a problem of a reduction in the yield of mass production. Further, there is a high possibility that an error occurs during the process of pasting the 5-pin connector 20, so that the defective rate is increased.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a USB memory package and a method of manufacturing the same, which can be easily subjected to hard software recording and memory testing after the memory package is manufactured.

Another object of the present invention is to provide a USB memory package with a low failure rate and a method of manufacturing the same.

To this end, the memory package according to the present invention includes: a memory body having a test terminal formed on one side of the upper surface, a connector bonding terminal formed on the other side, and various components mounted on the lower surface to be molded And a connector that is coupled to the connector terminal for the connector.

In addition, the USB memory package according to the present invention includes: a memory body of a COB type, that is, an on-chip chip package type, and a 4-foot contact pad and a 9-foot contact pad are formed on the first surface of the PCB, that is, the printed circuit board. The second surface of the PCB is molded with various components and molded; and the USB connector is bonded to the 9-foot contact pad of the memory body by surface mounting technology.

In addition, the manufacturing method of the USB memory package according to the present invention includes the steps of forming a 4-foot contact pad and a 9-foot contact pad on a surface of a PCB, that is, a printed circuit board; mounting various components on the lower surface of the PCB and performing a step of molding the memory body by molding; and a step of recording the rigid soft body on the memory body by connecting the 4-foot contact pad to the test device.

As described above, according to the present invention, the memory body and the USB connector in which the test terminals are formed are separately fabricated and connected, and the hard package and the memory test can be easily performed after the memory package is manufactured.

In other words, the 4-pin contact pad, which is a test terminal, is exposed on the opposite side of the USB connector connection portion of the memory main body, and the test device can be easily accessed from above. The memory test has no effect of inserting and detaching the memory body, so it has the effect of improving productivity.

In addition, the present invention installs the independently manufactured and verified USB 3.0 connector on the 9-pin contact pad of the memory main body to make a memory package, so that the memory can be reduced as in the past 5 foot connector installation process. The effect of the body failure rate.

10‧‧‧Printed circuit board

11‧‧‧4 foot contact pads

12‧‧‧5 foot contact pads

20‧‧‧5 foot connector

21‧‧‧ slot

22‧‧‧Prong spring

30‧‧‧ memory body

31‧‧‧Printed circuit board

32‧‧‧Molding parts/insulating substances

33‧‧‧Test terminals (4-foot contact pads)

34‧‧‧Connector terminal (9-foot contact pad)

40‧‧‧Connector

41‧‧‧ Shell

42‧‧‧joining feet (9 feet)

43‧‧‧Side support

44‧‧‧End face support

1(a) and 1(b) are views showing a conventional USB3.0 memory body; and Figs. 2(a)-(c) are views showing a memory body according to an embodiment of the present invention; a)-(c) is a diagram showing a connector according to an embodiment of the present invention; and FIGS. 4(a)-(c) are diagrams showing a memory package in which a memory body and a connector are connected according to an embodiment of the present invention; And Figures 5(a)-(c) are diagrams showing memory packages of other ways in which the memory body and the connector are connected in accordance with an embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings. The constitution of the present invention and the effects thereof based on the present invention should be clearly understood from the following detailed description.

Before the detailed description of the present invention, the same constituent elements are denoted by the same reference numerals as the same as the different drawings, and it is noted that the specific configuration is omitted when it is judged that it is possible to confuse the gist of the present invention. Description.

Figure 2 shows a memory body in accordance with an embodiment of the present invention.

Referring to Fig. 2, the memory main body 30 is formed on one surface of the printed circuit board 31 to expose the test terminal 33 and the connector bonding terminal 34, and after mounting various elements (not shown) on the other surface, it is made of resin. The insulating substance 32 of the substance is applied.

That is, the memory body 30 includes the COB type of the molded portion 32 on which the various components are mounted in a wafer state or after being mounted by surface mounting technology. Among the components mounted in the memory body 30 are passive components such as flash memory chips, controllers, resistors or capacitors.

The test terminal 33 formed on one side of the printed circuit board 31 is constituted by a 4-foot contact pad, and the connector bonding terminal 34 formed on the other side is constituted by a 9-foot contact pad.

The test terminal 33 is used for the USB 2.0 4-pin terminal, and the connector bonding terminal 34 is used for the USB 3.0 9-pin terminal. The 4-foot contact pad 33 according to the embodiment of the present invention is not intended to use the memory package as the USB 2.0, but is used for hard software recording in the test memory package.

When the memory main body 30 is produced, a test device (not shown) on the memory main body 30 is placed on the 4-foot contact pad 33, and the hard body is recorded in the memory main body 31 to perform a memory test.

In the past, in order to record a hard software on a memory body and perform a test, a process of inserting a memory device into the test device is required, but according to the present invention, the insertion process of the memory body is not required, which may increase memory productivity.

Figure 3 shows a connector in accordance with an embodiment of the present invention.

In Fig. 3, the connector 40 is constituted by a casing 41 in which a USB 3.0 connector is built. The right side of the outer casing 41 is a portion that is inserted into the USB jack, and a joint leg 42 for bonding to the memory body 30 is provided on the left side of the outer casing 41. The joint leg 42 is composed of nine legs, and the nine joint legs are joined to the 9-foot contact pad 34 of the memory body 30 by surface mount technology (SMT).

The connector 40 according to the present invention is independently manufactured, and it has been verified whether the connector 40 is defective or not by an independent manufacturing process, and it is possible to prevent the occurrence of failure in the connector connecting process of one package manufacturing process as in the past.

Figure 4 is a diagram showing a memory package in which a memory body and a connector are connected in accordance with an embodiment of the present invention.

As shown in FIG. 4, the memory body 30 and the connector 40 are connected to the memory body 30 and the connector 40 by mounting the bonding pins 42 of the connector 40 in the SMT manner in the 9-foot contact pad 34 of the memory body 30, thereby completing the memory package.

Referring to FIGS. 3 and 4, reference numeral 43 in the casing 41 is a side support portion that supports the side surface of the memory body 30 when the memory body 30 and the connector 40 are connected, and reference numeral 44 is the end of the memory 30. The end surface support portion that is in surface contact.

When the memory body 30 and the connector 40 are connected, the side support portion 43 can contact the memory body 30 in contact with the side surface of the memory body, or can be fixedly supported by the memory body 30 through the inner side of the memory body 30. The end face support portion 44 is provided at a position where the engaging leg 42 of the connector 40 can exactly coincide with the 9-foot contact pad 34 of the memory body 30 when the end faces of the memory 30 are in contact.

Figure 5 shows a memory package connecting a memory body and a connector in accordance with other embodiments of the present invention.

As shown in Fig. 5, when the memory main body 30 and the connector 40 are connected, the side support portion 43 is inserted and fixed to the inner side of the memory body, and the memory package exhibits a more stable connection structure.

In this connection structure, the width of the memory body 30 is larger than that of the connector 40. In the case where the size of the connector 40 is fixed, the width of the connector 40 is reduced, and in the case where the size of the connector 40 is fixed, the width of the memory body 30 can be increased.

The above description is merely illustrative of the invention, and various modifications may be made without departing from the spirit and scope of the invention.

Therefore, the embodiments disclosed in the specification of the present invention are not intended to limit the invention. The scope of the present invention should be construed as being included in the scope of the present invention.

30‧‧‧ memory body

31‧‧‧Printed circuit board

32‧‧‧Molding Department

40‧‧‧Connector

41‧‧‧ Shell

42‧‧‧joining feet (9 feet)

43‧‧‧Side support

44‧‧‧End face support

Claims (8)

A memory package comprising: a memory body having a test terminal formed at one side end portion of the upper surface, a connector bonding terminal formed on the other side, and various components mounted on the lower surface to be molded, wherein a test device placed on the test terminal to record a rigid soft body; and a connector coupled to the connector joint terminal; wherein the connector has a housing having a receptacle at one end thereof The other end of the outer casing is provided with a plurality of engaging legs, and two sides of the outer casing are respectively formed with side supporting portions for contacting and supporting the memory body. The memory package according to claim 1, wherein the test terminal is used for a 4-pin terminal of USB2.0. The memory package according to claim 1, wherein the connector bonding terminal is used for a USB 3.0 9-pin terminal. A USB memory package comprising: a memory body of a COB type, that is, an on-chip chip package type, and a 4-foot contact pad formed on one end of the first surface of the PCB, that is, the printed circuit board, in the first The other side of the surface is formed with a 9-foot contact pad, and various components are mounted on the second surface of the PCB to be molded, wherein a test device is placed on the test terminal to record the hard software; a USB connector, a 9-foot contact pad bonded to the memory body by surface mounting technology; wherein the connector has a casing, the casing has a socket at one end, and the other end of the casing is provided with a plurality of And a side support portion for contacting and supporting the memory body is formed on each side of the outer casing. The USB memory package of claim 4, wherein the 4-foot contact pad is used as a test terminal. A method for manufacturing a USB memory package, comprising: forming a 4-foot contact pad and a 9-foot contact pad on a surface of a PCB, that is, a printed circuit board; mounting various components on the lower surface of the PCB and performing molding processing a step of manufacturing a memory body; and a step of recording a rigid soft body on the memory body by connecting the 4-foot contact pad to the test device. The method for manufacturing a USB memory package according to claim 6, wherein the method further comprises: The step of preparing the USB3.0 connector; the step of SMT bonding the 9-pin of the USB3.0 connector and the 9-foot contact pad. The method of manufacturing a USB memory package according to claim 6, wherein the various components include: a flash memory, a controller, a passive component, and the like.