KR101118237B1 - Portable memory device using of superspeed usb protocol - Google Patents
Portable memory device using of superspeed usb protocol Download PDFInfo
- Publication number
- KR101118237B1 KR101118237B1 KR1020110042060A KR20110042060A KR101118237B1 KR 101118237 B1 KR101118237 B1 KR 101118237B1 KR 1020110042060 A KR1020110042060 A KR 1020110042060A KR 20110042060 A KR20110042060 A KR 20110042060A KR 101118237 B1 KR101118237 B1 KR 101118237B1
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- KR
- South Korea
- Prior art keywords
- case
- insulating substrate
- usb plug
- memory device
- usb
- Prior art date
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
Abstract
The present portable memory device relates to a portable memory device using a high speed USB protocol including a data line and a high speed communication line. The device comprises a USB plug; COB package; And a case covering a region of the USB plug and the COB package. Here, a case fixing hole is formed in the metal cover constituting the USB plug, and a case fixing protrusion fitted into the case fixing hole is formed inside the case.
Description
The present invention relates to a portable memory device, and more particularly, to a portable memory device having a connector suitable for a high speed Universal Serial Bus (USB) protocol.
In 2008, the USB Implementer's Forum announced the new USB 3.0 protocol. Ultra-fast USB (Universal Serial Bus) is designed to provide faster data transfer rates and support higher levels of current for each port to improve power delivery capabilities compared to traditional USB 2.0 protocols. The new USB 3.0 protocol offers new power management capabilities, as well as new cables and connectors that are compatible with existing USB 2.0 specifications. In particular, the most striking change in connectors defined as standard in the new USB 3.0 protocol is the addition of five high-speed communication lines in parallel to the existing four data lines used in the USB 2.0 protocol.
The four data lines used in the USB 2.0 protocol consist of a power pin, a serial differential pair ("D-" pin and "D +" pin), and a ground pin. In the high-speed USB protocol, there are five pins for high-speed communication: a pair of SuperSpeed receiver differential pairs ("RX-" and "RX +" pins), ground pins, and a pair of transmit pins (SuperSpeed). Transmitter differential pairs ("TX-" Pin and "TX +" Pin) have been added. Therefore, electronic devices using the high-speed USB protocol should use connectors (sockets and plugs) complying with the new standard.
Figure 10 shows a standard A type socket as defined by the high speed USB protocol. As shown in FIG. 10, the ultra-fast USB standard A type socket has the same appearance as a conventional USB 2.0 standard type A socket. That is, as shown in FIGS. 10A and 10B, the USB
On the other hand, portable memory devices are gradually decreasing in size, and in order to implement a memory device having a desired capacity in a narrow space, the mounting density of the memory device must be increased. In order to solve this problem, a memory device is implemented using a chip on board process. COB technology is one of semiconductor assembly technologies in which a memory chip, which is a core component of a memory device, is directly bonded to a printed circuit board (PCB) by a bonding wire in a wafer state. In particular, because the high speed USB protocol requires multiple channels, a larger number of memory chips are required than the conventional USB 2.0 protocol. Therefore, in order to miniaturize a portable memory device suitable for a high speed USB protocol, it is necessary to implement a memory device in a COB package.
However, when manufacturing a COB package for miniaturization of a portable memory device, it is difficult to form a metal contact for a data line and a metal contact for a high speed communication line required in a high speed USB protocol in one COB package. Although U.S. Publication No. 2008/0218799 discloses a technique of forming a metal contact for data lines and a metal contact for a high speed communication line in a single COB package, a metal contact for a high speed communication line formed in a spring form is a COB package. Installation in the inside not only entails a very complicated process, but also secures physical contact reliability because the metal contact for the high-speed communication line is fixed by the plastic housing.
Accordingly, in order to miniaturize a portable memory device that is suitable for the ultra-high speed USB protocol, a new structure is required to implement the portable memory device as a COB package and further secure contact reliability between the plug and the COB package required by the ultra-high speed USB protocol.
The present invention is to solve the above-mentioned problems of the prior art, and to provide a portable memory device that can secure the contact reliability of the plug of the standard standard required by the high-speed USB protocol while using a COB package for miniaturization of the product. It aims to do it.
A portable memory device according to the present invention is a portable memory device using a high-speed USB protocol including a data line and a high-speed communication line, the portable memory device comprising an insulating substrate having a front end and a rear end and spaced apart from each other at the front end of the insulating substrate. The data line and the high speed communication line, a plurality of leads each extending from the data line and the high speed communication line and exposed to the rear end of the insulating substrate, and the insulating substrate disposed therein, wherein the front end and the rear end are disposed. A USB plug including a metal cover whose ends are open so that the portions are respectively exposed; A printed circuit board, a circuit element including at least a memory chip, a plurality of metal contacts respectively connected to the plurality of leads of the USB plug, and the printed circuit board and the circuit with the plurality of metal contacts exposed. A COB package including a resin molding for packaging the device; And a case covering a region of the USB plug in which the rear end of the insulating substrate is disposed and the COB package. Here, a case fixing hole is formed on at least one surface of the metal cover that protects the rear end of the insulating substrate, and a case fixing protrusion fitted to the case fixing hole is formed inside the case.
Here, the data line may include a power pin, a pair of data pins, and a ground pin, and the high speed communication line may include a pair of receiving pins, a ground pin, and a pair of transmission pins. The USB plug is preferably a USB 3.0 standard Type A plug. At the front end of the case fixing protrusion, a locking protrusion protruding in the lateral direction to be caught by the case fixing hole formed in the metal cover may be further formed. In addition, a flange portion may be further formed on one side of the metal cover that protects the rear end portion of the insulating substrate, and a flange fixing groove into which the flange portion may be inserted may be formed in the case.
In addition, the case includes a first and a second case, the through hole is formed in the flange portion, any one of the first and the second case is formed with a flange fixing projection fitted to the through hole and the other The projection receiving groove may be formed in which the fixing projection is accommodated. The metal contacts of the COB package may be spaced apart from each other on one side of the resin molding.
The portable memory device according to the present invention has a structure in which a case is directly fixed to a USB plug. Thus, when the USB plug is inserted into or removed from the corresponding socket, the force transmitted to the case is transferred directly to the USB plug. When the memory device is configured as a COB package, the USB plug and the COB package are simply electrically connected to a plurality of leads and metal contacts, and thus the USB plug and the COB package are difficult to be physically and firmly fixed. In particular, when the memory device is configured as a COB package for miniaturization of the device, it is difficult to form a physical binding structure with the USB plug in the COB package itself. In addition, when the portable memory device is inserted into or removed from the socket, it is difficult to secure the reliability of the electrical connection between the USB plug and the COB package when a force is transmitted to the COB package. However, in the portable memory device according to the present invention, since the force transmitted to the case is directly transmitted only to the USB plug, connection reliability between the USB plug and the COB package can be secured.
1 is a schematic diagram of a portable memory device according to the present invention.
Figure 2 is a view showing a USB plug constituting a portable memory device according to the present invention, Figures 2 (a) and 2 (b) is a perspective view of the USB plug from the front and rear, respectively, Figure 2 (c And FIG. 2 (d) is a top view and a rear view of the USB plug.
3 is a perspective view illustrating a state in which a data line, a high speed communication line, and a plurality of leads formed therefrom are formed on an insulating substrate with a metal cover removed.
4 (a) and 4 (b) are schematic diagrams illustrating a manufacturing process of a COB package constituting a portable memory device according to the present invention.
5 (a) and 5 (b) are perspective views, respectively, seen from the front and rear of the COB package.
6 is a cross-sectional view of the first case as viewed through the AA cutting line of FIG. 1.
7 is a partially enlarged cross-sectional view illustrating a case in which a case is fixed to a USB plug.
8 is a schematic diagram illustrating a portable memory device having a rotation cap.
9 (a) and 9 (b) are perspective views illustrating various embodiments of the flange portion formed on the metal cover.
FIG. 10 is a diagram illustrating a standard A-type socket suitable for a high speed USB protocol, in which FIG. 10 (a) is a perspective view and FIG. 10 (b) is a sectional view seen through a BB cutting line.
Hereinafter, with reference to the accompanying drawings a preferred embodiment of a portable memory device using a high-speed USB protocol according to the present invention will be described in detail.
First, referring to FIG. 1, the overall structure of a portable memory device according to the present invention is as follows. As shown in FIG. 1, the portable memory device may include a
2 (a) to 2 (d) and 3, the
In particular, as shown in FIG. 3, the
The insulating
Meanwhile,
Next, a detailed configuration of the
After the molding process, the single chip package region P is cut and separated into individual COB packages 200. The
On the other hand, when manufacturing a memory device through a COB process as described above, it is possible to mount a multi-channel memory chip with a minimum area. For example, as shown in FIG. 5A, a plurality of
Next, a detailed configuration of the
In order to further secure the fixing state of the
In addition, in order to further strengthen the coupling structure between the
On the other hand, the
In addition, FIG. 1 illustrates an example in which the
The portable memory device according to the present invention has a structure in which a case is directly fixed to a USB plug. Thus, when the USB plug is inserted into or removed from the corresponding socket, the force transmitted to the case is transferred directly to the USB plug. When the memory device is configured as a COB package, the USB plug and the COB package are simply electrically connected to a plurality of leads and metal contacts, and thus the USB plug and the COB package are difficult to be physically and firmly fixed. In particular, when the memory device is configured as a COB package for miniaturization of the device, it is difficult to form a physical binding structure with the USB plug in the COB package itself. Therefore, when the portable memory device is inserted into or removed from the socket, it is difficult to secure the reliability of the electrical connection state between the USB plug and the COB package when a force is transmitted to the COB package. However, in the portable memory device according to the present invention, since the force transmitted to the case is directly transmitted only to the USB plug, connection reliability between the USB plug and the COB package can be secured.
Although a preferred embodiment of the present invention has been described so far, those skilled in the art will be able to implement in a modified form without departing from the essential characteristics of the present invention. For example, in the above-described embodiment, although the USB plug of the portable memory device according to the present invention has been described on the premise that the USB 3.0 standard A-type plug is applied, it may be applied to other types of plugs. And when the shape is different, it can be easily applied.
Therefore, the embodiments of the present invention described herein are to be considered in descriptive sense only and not for purposes of limitation, and the scope of the present invention is shown in the appended claims rather than the foregoing description, and all differences within the equivalent scope of the present invention Should be interpreted as being included in.
Claims (7)
An insulating substrate having a front end and a rear end formed therein, a data line and an ultra high speed communication line disposed to be spaced apart from the front end of the insulating substrate, respectively, each of which extends from the data line and the ultra high speed communication line and extends from the rear end of the insulating substrate A USB plug including a plurality of leads exposed to each other and a metal cover having an insulating substrate disposed therein, the both ends of which are open to expose the front end and the rear end;
A printed circuit board, a circuit element including at least a memory chip, a plurality of metal contacts respectively connected to the plurality of leads of the USB plug, and the printed circuit board and the circuit with the plurality of metal contacts exposed. A COB package including a resin molding for packaging the device; And
And a case covering one region of the USB plug and the COB package in which the rear end of the insulating substrate is disposed and exposing the other region of the USB plug in which the front end portion of the insulating substrate is disposed.
At least one surface of the metal cover that protects the front end of the insulating substrate is formed with a spring fixing hole is inserted into the spring formed in the socket corresponding to the USB plug, at least of the metal cover to protect the rear end of the insulating substrate Case fixing hole is formed on one side,
A case fixing protrusion is formed inside the case, and the case fixing protrusion is inserted into the case fixing hole while the spring fixing hole of the metal cover is exposed, thereby fixing the case to the USB plug. Portable memory device.
The data line includes a power pin, a pair of data pins and a ground pin, and the ultra-high speed communication line includes a pair of receiving pins, a ground pin and a pair of transmitting pins.
The USB plug is a USB 3.0 standard A-type plug.
The front end of the case fixing projection, the portable memory device, characterized in that the locking projection protruding in the lateral direction to be caught by the case fixing hole formed in the metal cover.
A flange portion is further formed on one side of the metal cover that protects the rear end portion of the insulating substrate, and the case has a flange fixing groove in which the flange portion is inserted.
The case includes a first case and a second case, the through hole is formed in the flange portion, one of the first and second case is formed with a flange fixing projection to be fitted to the through hole and the other Portable memory device, characterized in that the projection receiving groove is formed to accommodate the fixing projections.
The plurality of metal contacts of the COB package is disposed in a line spaced apart from each other on one side of the resin molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020110042060A KR101118237B1 (en) | 2011-05-03 | 2011-05-03 | Portable memory device using of superspeed usb protocol |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020110042060A KR101118237B1 (en) | 2011-05-03 | 2011-05-03 | Portable memory device using of superspeed usb protocol |
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KR101118237B1 true KR101118237B1 (en) | 2012-03-16 |
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KR1020110042060A KR101118237B1 (en) | 2011-05-03 | 2011-05-03 | Portable memory device using of superspeed usb protocol |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101502464B1 (en) * | 2013-07-16 | 2015-03-18 | 주식회사 바른전자 | USB memory package and manufacturing method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090093136A1 (en) | 2003-12-02 | 2009-04-09 | Super Talent Electronics, Inc. | Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs |
US20100321905A1 (en) | 2009-06-17 | 2010-12-23 | Industrial Technology Research Institute | Card structure, socket structure, and assembly structure thereof |
US20110021043A1 (en) | 2009-07-27 | 2011-01-27 | Via Technologies, Inc. | Electric connector and electric assembly |
-
2011
- 2011-05-03 KR KR1020110042060A patent/KR101118237B1/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090093136A1 (en) | 2003-12-02 | 2009-04-09 | Super Talent Electronics, Inc. | Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs |
US20100321905A1 (en) | 2009-06-17 | 2010-12-23 | Industrial Technology Research Institute | Card structure, socket structure, and assembly structure thereof |
US20110021043A1 (en) | 2009-07-27 | 2011-01-27 | Via Technologies, Inc. | Electric connector and electric assembly |
Non-Patent Citations (1)
Title |
---|
Universal Serial Bus 3.0 Specification, rev. 1.0, 2008.11.12. |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101502464B1 (en) * | 2013-07-16 | 2015-03-18 | 주식회사 바른전자 | USB memory package and manufacturing method thereof |
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