TWM511699U - Electrical connector and ball grid array package assembly - Google Patents

Description

Electrical connector and ball grid array package assembly

This new type relates to electrical connectors. In particular, the present invention relates to electrical connectors for use in ball grid array (BGA) packages.

The BGA socket connector is used to electrically connect a chip module in a BGA package form to a circuit board, such as a motherboard or a PCB board. 1(A) to 1(E) show a typical BGA socket connector 1, wherein FIG. 1(A) and FIG. 1(D) are connectors viewed from the chip module side and the opposite circuit board side, respectively. Figure 1 (B) and Figure 1 (E) are partial enlarged views of a portion of the connector shown in Figure 1 (A) and Figure 1 (D), respectively, Figure 1 (C) illustrates one of the terminals of the connector .

As shown, the BGA socket connector 1 includes an insulator 2 and a terminal module 3 fixed in a central region of the insulator 2. Each terminal of the terminal module 3 has a first end or solder tail 31 and a second The end or resilient end 32, the first end 31 is provided with a solder ball 5 on one side facing the circuit board, the soldering array is adapted to be soldered to a solder pad on a circuit board (not shown), and the elastic end 32 is adapted to electrically contact the wafer die Group (not shown) contacts, such as solder balls. Also provided in the peripheral region of the insulator 2 is a structure for connecting a housing (not shown) of the connector, such as a nut 4, which cooperates with the screw to secure the housing to the insulator.

Currently, the socket connector and the mating module are basically connected by a buckle or a screw, and the structural member of the buckle or the screw generally needs to be drilled and fixed on the circuit board.

In view of the above, the present invention proposes an improved electrical connector that can be soldered to a circuit board without drilling holes in the circuit board.

Further, the present invention also proposes an electrical connector that can be soldered on a circuit board in a BGA package to achieve a package form conforming to the BGA package terminal module of the electrical connector, thereby reducing product complexity and simplifying Manufacturing process.

According to one aspect of the present invention, an electrical connector is provided that is configured to electrically connect a wafer module in a ball grid array (BGA) package form to a circuit board, the electrical connector comprising: an insulator; a terminal a module fixed in a central region of the insulator and including a plurality of terminals, each terminal having a first end and a second end adapted to electrically contact the wafer module; and a plurality of connection structures positioned in the insulator In the peripheral region and configured to be soldered to the circuit board.

Preferably, the electrical connector can also include a housing that is secured to the insulator and exposes the second end such that the second end can electrically contact a corresponding contact or pad on the wafer module.

Preferably, the electrical connector may also include a plurality of coupling nuts positioned in a peripheral region of the insulator to secure the housing to the insulator.

Preferably, in the electrical connector, the insulator has a first side facing the housing and a second side facing the first facing surface of the circuit board, and each connecting structure has the second side One or more solder ends are exposed and a base embedded and fixed in the insulator.

Preferably, in the electrical connector, one solder ball configured to be soldered to the circuit board may be disposed on each soldering end.

Preferably, in the electrical connector, the plurality of connection structures are arranged in pairs At least one corner of the body.

Preferably, in the electrical connector, each of the connection structures may include at least one threaded structure positioned at at least one corner of the insulator, each threaded structure being configured to secure the housing to the insulator, and each thread The structure has a solder portion configured to be soldered to the circuit board at one end facing the circuit board.

Preferably, in the electrical connector, one of the connecting nuts and at least two of the connecting structures may form an L-shaped body structure positioned in a corner of the insulator, wherein the two connections The structures respectively form the first arm and the second arm of the unitary structure.

Preferably, in the electrical connector, the insulator has a first face facing the housing and a second face facing the first facing surface of the circuit board, and each of the first arm and the second arm One or more solder ends are exposed on the second side.

Preferably, in the electrical connector, one solder ball configured to be soldered to the circuit board may be disposed on each soldering end.

Preferably, in the electrical connector, a solder ball adapted to be soldered to the circuit board is disposed on the first end of each of the terminals.

According to another aspect of the present invention, a ball grid array (BGA) package assembly includes a circuit board; a wafer module constructed in a ball grid array (BGA) package; In the foregoing electrical connector, the plurality of terminals of the electrical connector are used to electrically connect the chip module to the circuit board.

The reader will be able to better understand the other objects, features and advantages of the present invention after the following detailed description of the embodiments and the accompanying drawings and claims.

1‧‧‧BGA socket connector

2‧‧‧Insulator

3‧‧‧Terminal module

4‧‧‧ nuts

5‧‧‧ solder balls

31‧‧‧First end or solder fillet

32‧‧‧Second or elastic end

100‧‧‧Electrical connector

110‧‧‧Insulator

111‧‧‧ first side

112‧‧‧ second side

120‧‧‧Terminal module

130‧‧‧Connecting nut or threaded structure

131‧‧‧Welding Department

140‧‧‧ Connection structure

140'‧‧‧ Connection structure

140"‧‧‧ connection structure

141‧‧‧welding end

142‧‧‧ base

143‧‧‧ solder balls

145‧‧‧First arm

146‧‧‧second arm

150‧‧‧ solder balls

The principles and concepts of the present invention will be better understood by reference to the following drawings and description. For a non-limiting example that is not detailed herein, please refer to the description of the subsequent figures. The components in the diagram are not It must be proportionate, but the principle of the new model is drawn in an emphasis. In the drawings, the same elements are labeled with the same corresponding parts in the different drawings.

1(A) is a perspective view showing a typical BGA socket connector viewed from the housing side; FIG. 1(B) is an enlarged schematic view showing a portion A shown in FIG. 1(A); FIG. 1(C) is a view Figure 1 (A) is a perspective view showing one of the terminals shown in Figure 1 (A); Figure 1 (D) is a perspective view showing the connector shown in Figure 1 (A) viewed from the side of the circuit board; Figure 1 (E) 1(A) is a perspective view showing the BGA socket connector according to the first exemplary embodiment of the present invention as seen from the side of the casing; 2(B) is a perspective view showing the connector shown in FIG. 2(A) viewed from the circuit board side; FIG. 2(C) is a terminal, connection structure and connecting nut of the connector shown in FIG. 2(A). FIG. 3(A) is a perspective view showing the BGA socket electrical connector according to the second exemplary embodiment of the present invention as seen from the side of the housing; 3(B) is shown in FIG. 3(A) FIG. 4 is a perspective view showing a terminal of a connector, a connection structure, and a connection nut; FIG. 4 is a view showing a BGA socket electrical connector self-housing according to a third exemplary embodiment of the present invention; FIG. 5(A) is a perspective view showing the BGA socket electrical connector according to the fourth exemplary embodiment of the present invention viewed from the housing side; FIG. 5(B) is a view showing 5(A) A perspective view of the connection structure of the connector shown; FIG. 5(C) is another perspective view showing the connection structure shown in FIG. 5(B); and FIG. 6 is a view showing a fifth exemplary embodiment according to the present invention. BGA socket electrical connector A schematic view of the terminal and the connection structure.

The technical solution of the present invention will be further described below by way of specific embodiments and with reference to the accompanying drawings. In this specification, the same or similar components are denoted by the same or similar reference numerals. The description of the various embodiments of the present invention is intended to be illustrative of the present invention, and is not to be construed as limiting.

2(A) through 2(C) are perspective views showing an embodiment of an electrical connector 100 in accordance with the present invention. For example, such an electrical connector 100 is a BGA receptacle connector for electrically connecting a wafer module in the form of a BGA package to a circuit board such as a motherboard or PCB. 2(A) is a perspective view of the electrical connector viewed from the side of the chip module, and FIG. 2(B) is a connector viewed from the side of the circuit board opposite to the chip module side, and 2 (C) is a partial enlarged view of a portion of the electrical connector 100 shown in Fig. 2(A).

As shown in FIG. 2(A) and FIG. 2(B), the electrical connector 100 according to the first exemplary embodiment of the present invention includes an insulator 110, a terminal module 120, a housing (not shown), and a plurality of Connection structure 140. The insulator 110 may be made of an insulating material such as a plastic or plastic member, and may be an integrally molded member such as formed by injection molding. The insulator 110 is generally generally rectangular having a first side 111 facing the wafer module and a second side 112 facing the first facing surface of the circuit board.

The terminal module 120 is fixed in a central region of the insulator 110 and includes a plurality of terminals, each terminal having a first end and a second end adapted to electrically contact the wafer module, the first end being provided with a soldering to One of the board's solder balls 150. As shown, the solder balls 150 form an array of solder balls on the second side 112 that are adapted to be soldered to pads or conductive traces on the circuit board for electrical connection to circuitry on the circuit board. The housing of the electrical connector 100 can be an insulating structure that is fixed on the insulator 110 and exposes the second end of the terminal module such that the second end is in elastic electrical contact with the contact or solder ball of the inserted wafer module, thereby Realize reliable electrical communication between the board and the chip module.

According to the present invention, the electrical connector 100 also includes a plurality of connection structures 140 that are positioned in the peripheral region of the insulator 110 and that are configured to be soldered to the circuit board, for example, when the electrical connector 100 is mounted on the circuit board. 150 is soldered together on the board. These connection structures 140 are electrically insulated from the terminal module 120, but are capable of soldering to the circuit board, thereby obviating the need for a lock or screw for securing the electrical connector and drilling holes in the circuit board.

In one example, the electrical connector 100 can also include a plurality of connection nuts or threaded structures 130 that are also positioned in a peripheral region of the insulator 110, such as on four corners of the insulator for electrical connection. The housing of the device 100 is secured to its insulator 110. Obviously, the position of the coupling nut 130 is not limited to such a position, but may be set at any suitable position depending on the structure of the insulator 110 and the housing and the specific fixing requirements.

As shown in FIGS. 3(A) to 3(C), each of the connection structures 140 may have one or more solder ends 141 exposed on the second surface 112 and one base portion 142 embedded and fixed in the insulator 110. A plurality of weld ends 141 are coupled to or integral with the base 142. The solder end 141 faces the circuit board like the solder ball 150 so that it can be soldered to the board simultaneously with the solder ball. In the illustrated example, the connection structure 140 is in the form of a generally T-shaped flat member that can be disposed in pairs in a peripheral region of the insulator 110, such as two pairs of connection structures disposed at each corner of the insulator 110. For example, a groove or slot is formed in the peripheral region of the insulator 110 that conforms to the shape of the connecting structure 140, and the connecting structure 140 can be positioned and fixed in such a groove or slot. In the case where the connecting nut 130 is provided at the corner of the insulator 110, the two pairs of connecting structures 140 may be disposed on both sides of the connecting nut 130 in an L-shape.

3(A) and 3(B) show another embodiment of the connection structure according to the present invention, wherein FIG. 3(B) is a partial enlarged view of a portion of the electrical connector shown in FIG. 3(A). As shown, each soldering end 141 can be provided with a solder ball 143 configured to be soldered to the circuit board. The soldering process can be simultaneously soldered to the circuit board by the same soldering process as the solder ball 150. Keep the package consistent. The solder balls 143 are exposed on the same second surface 112 as the solder balls 150 of the terminal module 120, preferably at the same height as the solder balls 150, even with solder balls 150 has the same materials and dimensions to further simplify the manufacturing process.

Figure 4 shows another example of a connection structure. In this example, the connection structure used to secure the electrical connector 100 to the circuit board can include a threaded structure or the coupling nut itself. Each of the threaded structures has a solder portion 131 that is configured to be soldered to one of the circuit boards at one end of the circuit board, and the solder portion 131 is exposed on the same second surface 112 as the solder balls 150 of the terminal module 120. At the same time, such a threaded structure or coupling nut is also configured to secure the housing of the electrical connector 100 to its insulator 110, for example, at the other end opposite the end, thereby enabling the use of such a form of connection The structure simultaneously secures the insulator to the circuit board and to the housing of the electrical connector 100.

5(A) to 5(C) show another embodiment of an electrical connector according to the present invention, wherein FIGS. 5(B) and 5(C) illustrate a connection structure 140 for use in such an electrical connector. 'Three-dimensional diagram. As shown, the connection structure 140' is fixed in an insulator of the electrical connector, such as an L-shaped body structure positioned in a corner of the insulator, each integral structure including a first arm 145, a second arm 146, and a A coupling nut or threaded structure 144 is provided. The threaded structure 144 can be the aforementioned coupling nut integrally formed in the connecting structure 140' to secure the housing of the electrical connector to its insulator 110. As shown, each of the first arm 145 and the second arm 146 has one or more solder ends 141 exposed on the second side of the insulator 110, thereby enabling the electrical connector to be soldered to the circuit board. In one example, each of the first arm 145 and the second arm 146 can have two rows of weld ends 141 that are integrally formed, for example, by two of the foregoing connection structures 140. Alternatively, each of the first arm 145 and the second arm 146 may have only one row of solder ends 141, such as formed by a previously described connection structure 140. It is obvious that the number of the welded ends 141 and the number of rows are not limited.

Figure 6 illustrates a connection structure 140" according to another form of the present invention. As previously described with reference to 3(A) through 3(C), the connection structure 140" differs from the aforementioned connection structure 140' only in that each The soldering end 141 is provided with a solder ball 143 configured to be soldered to one of the circuit boards.

The present invention also provides a ball grid array (BGA) package assembly including a circuit A board, a wafer module constructed in a ball grid array (BGA) package, and the aforementioned electrical connector for electrically connecting a wafer module to a circuit board according to the present invention.

It should be understood that the above-described embodiments and drawings are only for a general understanding of the various embodiments of the present invention. The illustrations and illustrations are not intended to describe the integrity of all of the elements and features in the devices and systems that utilize the structures or methods described herein. Many other embodiments of the present invention, which will be apparent from the disclosure of the present invention, will be apparent to those skilled in the art. The present invention can be replaced and changed in structure and logic without departing from the scope of the novel protection. In addition, the drawings of the present invention are intended to be illustrative only and not to scale. Some parts of the drawings may be enlarged for emphasis, while others may be simplified. The specification and drawings of the present invention are to be regarded as the description It should be noted that the word "comprising" does not exclude other elements or steps. The word "a" or "an" does not exclude a plurality. In addition, any component numbering of the patent application scope should not be construed as limiting the scope of the invention.

100‧‧‧Electrical connector

112‧‧‧ second side

130‧‧‧Connecting nut or threaded structure

140‧‧‧ Connection structure

141‧‧‧welding end

150‧‧‧ solder balls

Claims (12)

An electrical connector configured to electrically connect a wafer module in a spherical grid array package form to a circuit board, wherein the electrical connector comprises: an insulator; and a terminal module fixed to the insulator The central region includes a plurality of terminals, each terminal having a first end and a second end adapted to electrically contact the wafer module; and a plurality of connection structures positioned in a peripheral region of the insulator and It is configured to be soldered to the board. The electrical connector of claim 1, wherein the electrical connector further comprises: a housing secured to the insulator and exposing the second end. The electrical connector of claim 2, wherein the electrical connector further comprises: a plurality of coupling nuts positioned in the peripheral region of the insulator to secure the housing to the insulator. The electrical connector of any one of claims 1 to 3, wherein the insulator has a first side facing the housing and a second side facing the first surface facing the circuit board, and each connection The structure has one or more solder ends exposed on the second side and one of the bases embedded and fixed in the insulator. The electrical connector of claim 4, wherein each soldering end is provided with a solder ball configured to be soldered to the circuit board. The electrical connector of any one of claims 1 to 3, wherein the plurality of connection structures are disposed in pairs in at least one corner of the insulator. The electrical connector of claim 2, wherein each of the connection structures includes at least one positioned at at least one corner of the insulator A threaded structure, each threaded structure being configured to secure the housing to the insulator, and each threaded structure has a weld configured to be welded to one of the circuit boards at one end facing the circuit board. The electrical connector of claim 3, wherein one of the connection nuts and at least two of the connection structures form an L-shaped connection structure positioned in a corner of the insulator, wherein the two connection structures The first arm and the second arm of the connecting structure are respectively formed. The electrical connector of claim 8, wherein the insulator has a first side facing the one of the wafer modules and a second side facing the first surface facing the circuit board, and the first arm and the first Each of the two arms has one or more solder ends exposed on the second side. The electrical connector of claim 9, wherein each soldering end is provided with a solder ball configured to be soldered to the circuit board. The electrical connector of any one of claims 1 to 3 and 7 to 10, wherein the first end of each of the terminals is provided with a solder ball adapted to be soldered to the circuit board. A ball grid array package assembly, characterized in that the ball grid array package assembly comprises a circuit board; a wafer module constructed in a spherical grid array package; and The electrical connector of any of the eleventh, wherein the plurality of terminals of the electrical connector electrically connect the die module to the circuit board.