TWI487924B - Method and device for inspecting printed circuit board - Google Patents
Method and device for inspecting printed circuit board Download PDFInfo
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- TWI487924B TWI487924B TW102141994A TW102141994A TWI487924B TW I487924 B TWI487924 B TW I487924B TW 102141994 A TW102141994 A TW 102141994A TW 102141994 A TW102141994 A TW 102141994A TW I487924 B TWI487924 B TW I487924B
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Description
本發明係關於一種光學檢測方法及其裝置,更特別的是關於一種印刷電路板的檢測方法及其裝置。The present invention relates to an optical detecting method and apparatus thereof, and more particularly to a method and apparatus for detecting a printed circuit board.
印刷電路板如硬式印刷電路板(PCB)或軟式印刷電路板(FPC),其於製造過程中皆需要精確的檢驗程序來檢查印刷電路板上之線路、板材狀況及各元件之配置位置的正確性。Printed circuit boards, such as hard printed circuit boards (PCBs) or flexible printed circuit boards (FPCs), require precise inspection procedures during the manufacturing process to check the correctness of the wiring, board conditions, and placement of components on the printed circuit board. Sex.
印刷電路板的製造通常區分為好幾個過程,一般來說可區分為線路的形成、為完成線路間導通的製作程序(如鑽孔、導通線路的製作)、及後續的防焊及抗氧化處理。通常在電路板的整個製造過程中,線路的檢測係在前階段之線路製作時即已完成檢測,後續的製作流程中並不會再對線路進行再一次的檢測,況且,後續的製作流程會在電路板的部分區域上披覆有覆蓋層(如:防焊層),此即會讓該覆蓋層下方的線路被遮蔽而無法被檢測,進而在印刷電路板後端的製作流程中並不會再對線路進行檢測。The manufacture of printed circuit boards is usually divided into several processes, which can be generally divided into the formation of lines, the production process for completing the conduction between lines (such as drilling, the fabrication of conduction lines), and the subsequent soldering and oxidation treatment. . Usually, in the entire manufacturing process of the circuit board, the detection of the line is completed when the line is produced in the previous stage, and the line is not tested again in the subsequent production process. Moreover, the subsequent production process will be A portion of the board is covered with a cover layer (eg, a solder mask), which causes the line under the cover to be shielded from being detected, and thus not in the manufacturing process of the back end of the printed circuit board. Then test the line.
然而,在此後續的製作流程中,亦有可能因為碰撞、刮傷或其他種種原因造成部分線路的毀損、缺陷、斷裂等情況,且在防焊及抗氧化處理時所進行的覆蓋層形成過程中亦有可能因高溫或其他原因而傷及印刷電路板上之 線路,使得印刷電路板上的線路不見得能維持前階段之線路形成製造程序時的品質,進而影響印刷電路板的製造良率。However, in this subsequent production process, it is also possible to cause damage, defects, fractures, etc. of some lines due to collision, scratching or other various reasons, and the formation process of the cover layer during the anti-welding and anti-oxidation treatment. It may also be damaged by high temperature or other reasons on the printed circuit board. The circuit makes it impossible for the circuit on the printed circuit board to maintain the quality of the circuit in the previous stage to form the manufacturing process, thereby affecting the manufacturing yield of the printed circuit board.
本發明之一目的在於印刷電路板於製造程序之後階段的外觀檢測程序時,進一步對已於金屬線路上披覆有覆蓋層的印刷電路板進行線路檢測。One of the objects of the present invention is to perform line detection on a printed circuit board having a cover layer on a metal line when the printed circuit board is subjected to an appearance inspection program at a later stage of the manufacturing process.
本發明之另一目的在於不受金屬線路上之覆蓋層的影響而可取得該金屬線路之輪廓影像資料。Another object of the present invention is to obtain contour image data of the metal line without being affected by the cover layer on the metal line.
本發明之再一目的在於提供一種高效率且低成本之線路檢測方法及其設備。It is still another object of the present invention to provide a high efficiency and low cost line detection method and apparatus therefor.
為達上述目的及其他目的,本發明提出一種印刷電路板的檢測方法,係用於印刷電路板之外觀檢測程序,用以對已於金屬線路上披覆有覆蓋層的印刷電路板進行檢測,該方法包含:以具有第一波長段之第一光源照射待測印刷電路板;取得該待測印刷電路板上含有該第一波長段之成分的第一影像資料;及將該第一影像資料與一預設金屬線路影像資料進行比對程序,其中,該第一波長段係為長波長且為不可見光的波長段。To achieve the above and other objects, the present invention provides a method for detecting a printed circuit board, which is used for an appearance inspection program of a printed circuit board for detecting a printed circuit board having a cover layer on a metal line. The method includes: illuminating a printed circuit board to be tested with a first light source having a first wavelength band; obtaining first image data of a component of the first wavelength segment on the printed circuit board to be tested; and the first image data Performing a comparison procedure with a predetermined metal line image data, wherein the first wavelength band is a long wavelength and is a wavelength range of invisible light.
於本發明之一實施例中,更包含一可見光檢測步驟,該可見光檢測步驟包含:以具有第二波長段之第二光源照射待測印刷電路板;取得該待測印刷電路板上含有該第二波長段之成分的第二影像資料;及將該第二影像資料與一預設印刷電路板外觀影像資料進行比對程序,其中,該第二波長段係為可見光的波長段。In an embodiment of the present invention, the method further includes: a visible light detecting step, comprising: illuminating the printed circuit board to be tested with a second light source having a second wavelength segment; and obtaining the printed circuit board to be tested a second image data of the components of the two wavelength segments; and a comparison process between the second image data and a predetermined printed circuit board appearance image data, wherein the second wavelength segment is a wavelength segment of visible light.
於本發明之一實施例中,該覆蓋層係可為防焊層、有機保護膜或綠漆層等。In an embodiment of the invention, the cover layer may be a solder resist layer, an organic protective film or a green paint layer or the like.
於本發明之一實施例中,該第一光源的照射係以斜向角度入射該待測印刷電路板。進一步地,該第一光源更可為環狀配置,以對該待測印刷電路板提供包圍式的照射光。In an embodiment of the invention, the illumination of the first light source is incident on the printed circuit board to be tested at an oblique angle. Further, the first light source may be configured in an annular shape to provide the surrounding illumination light to the printed circuit board to be tested.
為達上述目的及其他目的,本發明復提出一種印刷電路板的檢測設備,係用於印刷電路板之外觀檢測程序,用以對已於金屬線路上披覆有覆蓋層的印刷電路板進行檢測,該檢測設備包含:一承載台,用於乘載待測印刷電路板;一第一光源產生裝置,係配置於該承載台上方,用於以具有第一波長段之第一光源照射該待測印刷電路板;一光源收集裝置,係配置於該承載台上方,用於取得該待測印刷電路板上含有該第一波長段之成分的第一影像資料;及一運算主機,係連接該光源收集裝置,用於將該第一影像資料與一預設金屬線路影像資料進行比對程序,其中,該第一波長段係為長波長且為不可見光的波長段。In order to achieve the above and other objects, the present invention provides a test apparatus for a printed circuit board, which is used for an appearance inspection program of a printed circuit board for detecting a printed circuit board having a cover layer on a metal line. The detecting device includes: a carrying platform for carrying the printed circuit board to be tested; a first light source generating device disposed above the carrying platform for illuminating the first light source having the first wavelength band Measuring a printed circuit board; a light source collecting device is disposed above the carrying platform for obtaining the first image data of the component of the first wavelength segment on the printed circuit board to be tested; and a computing host connecting the The light source collecting device is configured to compare the first image data with a preset metal line image data, wherein the first wavelength segment is a long wavelength band and is a wavelength segment of invisible light.
於本發明之一實施例中,印刷電路板的檢測設備更包含:一第二光源產生裝置,係配置於該承載台上方,用於以具有第二波長段之第二光源照射該待測印刷電路板,其中,該光源收集裝置係取得該待測印刷電路板上含有該第二波長段之成分的第二影像資料,該運算主機係將該第二影像資料與一預設印刷電路板外觀影像資料進行比對程序,該第二波長段係為可見光的波長段。In an embodiment of the invention, the detecting device of the printed circuit board further comprises: a second light source generating device disposed above the carrying platform for illuminating the printing to be tested with a second light source having a second wavelength band a circuit board, wherein the light source collecting device obtains second image data of a component of the second wavelength segment on the printed circuit board to be tested, the computing host is configured to view the second image data and a predetermined printed circuit board The image data is subjected to an alignment program, and the second wavelength band is a wavelength band of visible light.
於本發明之一實施例中,該第一波長段係為紅外光的波段。該第一波長段較佳係為850nm~950nm。In an embodiment of the invention, the first wavelength band is a band of infrared light. The first wavelength band is preferably 850 nm to 950 nm.
藉此,本發明利用長波長且為不可見光之波段的照射光,對印刷電路板進行照射,使得即便是已披覆有覆蓋層的金屬線路仍可清楚地顯現其輪廓,且不須對線路進行額外的通電加熱程序即可快速地取得被覆蓋住之金屬線路的輪廓,進而無須再對金屬線路上之有無披覆該覆蓋層的交界處設定檢測忽視區或設計複雜且繁瑣之比對影像資料的演算程序,進而大幅提高檢測效率及可靠度。Thereby, the present invention illuminates the printed circuit board by using the long-wavelength and the invisible light, so that even the metal line covered with the cover layer can clearly show its outline without the need for the line. An additional power-on heating procedure can be used to quickly obtain the contour of the covered metal line, eliminating the need to set the inspection neglect area or the complex and cumbersome comparison image on the metal line. The calculation program of the data greatly improves the detection efficiency and reliability.
110‧‧‧第一光源產生裝置110‧‧‧First light source generating device
120‧‧‧第二光源產生裝置120‧‧‧Second light source generating device
150‧‧‧光源收集裝置150‧‧‧Light source collection device
170‧‧‧承載台170‧‧‧Loading station
190‧‧‧運算主機190‧‧‧ computing host
200‧‧‧待測印刷電路板200‧‧‧Printed circuit board to be tested
CL‧‧‧覆蓋層CL‧‧‧ Coverage
F‧‧‧線路缺陷區F‧‧‧Line defect area
ML‧‧‧金屬線路ML‧‧‧ metal lines
R‧‧‧檢測忽視區域之上下範圍R‧‧‧Detecting the upper and lower ranges of the neglected area
PCB‧‧‧印刷電路板PCB‧‧‧Printed circuit board
S101~S105‧‧‧步驟S101~S105‧‧‧Steps
S201~S205‧‧‧步驟S201~S205‧‧‧Steps
第1a-1c圖係為印刷電路板上金屬線路與覆蓋層間的位置關係示意圖。Figure 1a-1c is a schematic diagram showing the positional relationship between the metal lines and the cover layer on the printed circuit board.
第2圖係為本發明一實施例中之印刷電路板檢測設備的示意圖。Fig. 2 is a schematic view showing a printed circuit board detecting apparatus in an embodiment of the invention.
第3圖係為本發明另一實施例中之印刷電路板檢測設備的示意圖。Fig. 3 is a schematic view showing a printed circuit board detecting apparatus in another embodiment of the present invention.
第4圖係為本發明之第一光源產生裝置於一實施態樣下的剖面示意圖。Figure 4 is a schematic cross-sectional view showing the first light source generating device of the present invention in an embodiment.
第5圖係為本發明一實施例中之印刷電路板檢測方法的流程圖。Figure 5 is a flow chart showing a method of detecting a printed circuit board in an embodiment of the present invention.
第6圖係為本發明另一實施例中之印刷電路板檢測方法的流程圖。Figure 6 is a flow chart showing a method of detecting a printed circuit board in another embodiment of the present invention.
第7a圖係為印刷電路板在可見光照射下所擷取的影像資料。Figure 7a is the image data captured by the printed circuit board under visible light.
第7b圖係為印刷電路板在長波長之不可見光照射下所擷取的影像資料。Figure 7b is the image data captured by the printed circuit board under long-wavelength invisible light.
第8a圖係為印刷電路板在可見光照射下所擷取之具有斷開之線路的影像資料。Figure 8a is the image data of the printed circuit board with the broken line taken under visible light illumination.
第8b圖係為印刷電路板在長波長之不可見光照射下所擷取之具有斷開之線路的影像資料。Figure 8b is image data of a printed circuit board with a broken line taken under long-wavelength invisible illumination.
第9a圖係為具有較深色之覆蓋層的印刷電路板在可見光照射下所擷取的影像資料。Figure 9a is an image of a printed circuit board having a darker cover layer under visible light illumination.
第9b圖係為具有較深色之覆蓋層的印刷電路板在長波長之不可見光照射下所擷取的影像資料。Figure 9b is image data taken by a printed circuit board having a darker cover layer under long-wavelength invisible light.
為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後:印刷電路板的外觀檢測,例如習知的自動外觀檢查機(Auto Final Inspection),又可稱外觀終檢機,係對印刷電路板之製作後期進行整體的外觀檢測,本發明即於此外觀檢測程序中實施新的檢測技術。In order to fully understand the objects, features and effects of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings. The known Auto Final Inspection, which can also be called the final appearance inspection machine, is an overall appearance inspection of the printed circuit board during the production process. The present invention implements a new detection technology in the appearance inspection program.
首先請參閱第1a至1c圖,係為印刷電路板上金屬線路與覆蓋層間的位置關係示意圖。其中,覆蓋層CL下方之金屬線路ML在可見光之線路檢測下係無法視得,但為方便辨別,圖式上係以虛線顯示被遮蔽之該金屬線路ML。First, please refer to Figures 1a to 1c, which are schematic diagrams showing the positional relationship between the metal lines and the cover layer on the printed circuit board. Wherein, the metal line ML under the cover layer CL is not visible under the line detection of visible light, but for convenience of identification, the metal line ML to be shielded is shown by a broken line in the drawing.
由於覆蓋層CL在製程上會有對位精準度的問題,因此形成於印刷電路板上之覆蓋層CL或多或少會在原本預定的位置上發生「可被允許的」偏移,此偏移即會影響下方之金屬線路ML被覆蓋的程度,因此即造成了每一片印刷電路板之金屬線路ML在披覆該覆蓋層CL的交界處係具有位置的不確定性。Since the overlay layer CL has a problem of alignment accuracy in the process, the overlay layer CL formed on the printed circuit board is more or less "permitted" at the originally predetermined position. The shift affects the extent to which the underlying metal line ML is covered, thus causing the positional uncertainty of the metal line ML of each printed circuit board at the interface covering the cover layer CL.
以第1a圖來說,當印刷電路板PCB上之金屬線路ML較單純化而為直線型的線路時,覆蓋層CL的覆蓋邊緣即便產生偏移,例如上下之偏移,所顯露出來之金屬線路ML仍為直線。In the case of Fig. 1a, when the metal line ML on the printed circuit board PCB is simplistic and linear, the covering edge of the cover layer CL is offset even if it is offset, for example, the upper and lower offsets. Line ML is still a straight line.
然而,當印刷電路板PCB上之金屬線路ML的走線較複雜時,如第1b及1c圖所示,第1b及1c圖各為具有相同之金屬線路ML走線,但具有不同偏移程度之覆蓋層CL,在這兩種偏移狀態下所顯露出來之金屬線路ML就變得相當複 雜,且印刷電路板上的線路何其多,要訂出一標準來讓一套演算法適用於各種狀況的檢測將相當困難且耗時。However, when the traces of the metal lines ML on the printed circuit board PCB are complicated, as shown in FIGS. 1b and 1c, the 1b and 1c diagrams each have the same metal line ML trace, but have different degrees of offset. The cover layer CL, the metal line ML exposed in these two offset states becomes quite complex Miscellaneous, and there are so many lines on the printed circuit board, it is quite difficult and time consuming to set a standard to make a set of algorithms suitable for various conditions.
因此,就光學檢測之影像資料的分析判讀來說,要以一套演算法來涵蓋所有「可允許的」偏移狀態,以對各種不同顯露程度的金屬線路ML來說皆可被正確判讀就會使得演算法必須相當複雜而變得相當困難,此外,由於檢測程序必須快速有效率才能提高產能,過於複雜之演算判斷不但耗時更易於出錯;倘若是採用「檢測忽視區域」的設定,如第1a至1c圖中之檢測忽視區域之上下範圍R,縱然可讓演算法及檢測變的快速且簡單(因檢測時忽視可被允許之偏移所形成的範圍),但忽視區域中的金屬線路ML將不被檢測,一旦發生缺陷將無法被檢出,如此即造成了一種不可靠的檢測程序。Therefore, in the analysis and interpretation of optically detected image data, a set of algorithms is used to cover all "allowable" offset states, so that the metal lines ML of different degrees of exposure can be correctly interpreted. It will make the algorithm must be quite complicated and become quite difficult. In addition, because the detection program must be fast and efficient to increase productivity, the overly complex calculation judgment is not only time-consuming and error-prone; if the "detection neglect area" setting is used, such as The lower range R above the detection neglected area in Figures 1a to 1c allows the algorithm and detection to be fast and simple (due to the scope of the allowable offset being ignored in the detection), but the metal in the area is ignored. The line ML will not be detected, and once a defect occurs, it cannot be detected, thus causing an unreliable detection procedure.
接著請參閱第2圖,係為本發明一實施例中之印刷電路板檢測設備的示意圖。本發明之印刷電路板的檢測設備,係用於印刷電路板之外觀檢測程序,用以對已於金屬線路上披覆有覆蓋層的印刷電路板進行檢測,該檢測設備包含:承載台170、第一光源產生裝置110、光源收集裝置150及運算主機190。Next, please refer to FIG. 2, which is a schematic diagram of a printed circuit board detecting apparatus in an embodiment of the present invention. The detecting device for the printed circuit board of the present invention is used for the appearance detecting program of the printed circuit board for detecting the printed circuit board which has been covered with the covering layer on the metal circuit, and the detecting device comprises: a carrying platform 170, The first light source generating device 110, the light source collecting device 150, and the computing host 190.
承載台170係用於承載待測印刷電路板200。第一光源產生裝置110係配置於該承載台170上方,用於以具有第一波長段之第一光源照射該待測印刷電路板200,其中,該第一波長段係為長波長且為不可見光的波長段。此外,配置於該承載台170上方的該第一光源產生裝置110係並非限定於該承載台170的正上方,只要是位於承載台170的上方空間皆可適用本發明,舉例來說,當承載台較小時,縱然該第一光源產生裝置110位於承載台170的斜上方空間,其仍屬於配置於該承載台170上方的範疇。The carrier 170 is used to carry the printed circuit board 200 to be tested. The first light source generating device 110 is disposed above the carrying platform 170 for illuminating the printed circuit board 200 to be tested with a first light source having a first wavelength band, wherein the first wavelength segment is a long wavelength and is not The wavelength range of visible light. In addition, the first light source generating device 110 disposed above the carrying platform 170 is not limited to directly above the carrying platform 170, and the present invention can be applied to any space above the carrying platform 170, for example, when carrying When the stage is small, even if the first light source generating device 110 is located in the obliquely upward space of the stage 170, it still belongs to the category disposed above the stage 170.
光源收集裝置150係配置於該承載台170上方,用於取得該待測印刷電路板200上含有該第一波長段之成分的第一影像資料。其中,配置於該承載台170上方的該光源收集裝置150亦適用於前段所述的態樣中。The light source collecting device 150 is disposed above the carrying platform 170 for obtaining the first image data of the component of the first wavelength band on the printed circuit board 200 to be tested. The light source collecting device 150 disposed above the carrying platform 170 is also applicable to the aspect described in the preceding paragraph.
運算主機190係連接該光源收集裝置150,用於將該第一影像資料與一預設金屬線路影像資料進行比對程序,以產生該待測印刷電路板200的檢測結果,其中該預設金屬線路影像資料即是原設計線路的配置關係圖。The computing host 190 is connected to the light source collecting device 150 for comparing the first image data with a preset metal line image data to generate a detection result of the printed circuit board 200 to be tested, wherein the preset metal The line image data is the configuration relationship diagram of the original design line.
接著請參閱第3圖,係為本發明另一實施例中之印刷電路板檢測設備的示意圖。本發明之印刷電路板的檢測設備,舉例來說,亦可與外觀終檢機結合在一起,即如第3圖所示,更包含:第二光源產生裝置120。該第二光源產生裝置120係配置於該承載台170上方,用於以具有第二波長段之第二光源照射該待測印刷電路板200。其中,該第二波長段係為可見光的波長段,該光源收集裝置150係取得該待測印刷電路板200上含有該第二波長段之成分的第二影像資料,該運算主機190係將該第二影像資料與一預設印刷電路板外觀影像資料進行比對程序。其中,第3圖係以第二光源產生裝置120配置於第一光源產生裝置110上方作為示例,熟悉該項技術者應了解的是本發明並不以此配置方式為限,該圖僅為一種示例,各種第二光源產生裝置120與第一光源產生裝置110間的配置關係皆可適用本發明。Next, please refer to FIG. 3, which is a schematic diagram of a printed circuit board detecting apparatus in another embodiment of the present invention. The detecting device of the printed circuit board of the present invention, for example, may also be combined with the appearance final inspection machine, that is, as shown in FIG. 3, further comprising: a second light source generating device 120. The second light source generating device 120 is disposed above the carrying platform 170 for illuminating the printed circuit board 200 to be tested with a second light source having a second wavelength band. The second wavelength band is a wavelength range of visible light, and the light source collecting device 150 obtains second image data of the component of the second wavelength band on the printed circuit board 200 to be tested, and the computing host 190 The second image data is compared with a predetermined printed circuit board appearance image data. In the third embodiment, the second light source generating device 120 is disposed above the first light source generating device 110 as an example. It should be understood by those skilled in the art that the present invention is not limited to this configuration, and the figure is only one type. For example, the configuration relationship between the various second light source generating devices 120 and the first light source generating device 110 can be applied to the present invention.
接著請參閱第4圖,係為本發明之第一光源產生裝置於一實施態樣下的剖面示意圖。本發明之第一光源產生裝置110可為單一的配置、對稱式的對向配置(如第2圖所示)或是如第4圖所示之環狀配置,該環狀式配置將可提供更充 足的照射光源。其中,本發明之第一光源產生裝置110較佳係可採斜向角度入射該待測印刷電路板200(如第2、4圖所示)。Next, please refer to FIG. 4, which is a cross-sectional view of the first light source generating device of the present invention in an embodiment. The first light source generating device 110 of the present invention may be a single configuration, a symmetric opposite configuration (as shown in FIG. 2) or a ring configuration as shown in FIG. 4, which may be provided. More charge The illumination source of the foot. The first light source generating device 110 of the present invention preferably enters the printed circuit board 200 to be tested at an oblique angle (as shown in FIGS. 2 and 4).
接著請參閱第5圖,係為本發明一實施例中之印刷電路板檢測方法的流程圖。基於上述設備的描述,本發明之印刷電路板的檢測方法,係用於印刷電路板之外觀檢測程序,用以對已於金屬線路上披覆有覆蓋層的印刷電路板進行檢測,該方法包含:步驟S101:以具有第一波長段之第一光源照射待測印刷電路板,其中,該第一波長段係為長波長且為不可見光的波長段;步驟S103:取得該待測印刷電路板上含有該第一波長段之成分的第一影像資料;及步驟S105:將該第一影像資料與一預設金屬線路影像資料進行比對程序。Next, please refer to FIG. 5, which is a flow chart of a method for detecting a printed circuit board according to an embodiment of the present invention. Based on the description of the above apparatus, the method for detecting a printed circuit board of the present invention is used for an appearance inspection program of a printed circuit board for detecting a printed circuit board having a cover layer on a metal line, the method comprising Step S101: illuminating the printed circuit board to be tested with the first light source having the first wavelength band, wherein the first wavelength segment is a wavelength segment of long wavelength and invisible light; and step S103: obtaining the printed circuit board to be tested The first image data containing the component of the first wavelength segment; and step S105: comparing the first image data with a preset metal line image data.
進一步地,將本發明之檢測方法與外觀終檢機之檢測做結合,將前述步驟S101至步驟S105稱為不可見光檢測步驟的前提下,後續之可見光檢測步驟係可與不可見光檢測步驟同時進行(如第3圖所示之配置而同時進行照射及影像擷取),或是先執行可見光檢測步驟再執行不可見光檢測步驟,或是先執行不可見光檢測步驟再執行可見光檢測步驟,皆可適用本發明。較佳之情況下係可見光檢測步驟係可與不可見光檢測步驟同時進行,如第6圖所示,該可見光檢測步驟包含:步驟S201:以具有第二波長段之第二光源照射待測印刷電路板其中,該第二波長段係為可見光的波長段; 步驟S203:取得該待測印刷電路板上含有該第二波長段之成分的第二影像資料;及步驟S205:將該第二影像資料與一預設印刷電路板外觀影像資料進行比對程序。Further, the detection method of the present invention is combined with the detection of the final inspection machine, and the steps S101 to S105 are referred to as the invisible light detection step, and the subsequent visible light detection step can be performed simultaneously with the invisible light detection step. (If the configuration shown in Figure 3 is simultaneous for illumination and image capture), either perform the visible light detection step and then perform the invisible light detection step, or perform the invisible light detection step and then perform the visible light detection step. this invention. Preferably, the visible light detecting step is performed simultaneously with the invisible light detecting step. As shown in FIG. 6, the visible light detecting step includes: Step S201: illuminating the printed circuit board to be tested with the second light source having the second wavelength band Wherein the second wavelength segment is a wavelength segment of visible light; Step S203: obtaining second image data of the component on the printed circuit board to be tested that has the second wavelength segment; and step S205: comparing the second image data with a predetermined printed circuit board appearance image data.
本發明之方法中採用之光源照射方式係同於前述之設備的描述,於此不再贅述。The illumination method of the light source used in the method of the present invention is the same as that of the foregoing apparatus, and details are not described herein again.
本發明所提及之覆蓋層CL係可為防焊層、有機保護膜(Organic Soldering Preservative,OSP)或其他必須覆蓋於金屬線路ML上的覆蓋層,舉例來說,可為綠漆層。本發明之該第一波長段較佳係選用紅外光的波段,並可選用850nm~950nm的波段以與作為光源收集裝置150之線掃描相機作匹配進而達到更佳的影像資料擷取效果。The cover layer CL mentioned in the present invention may be a solder resist layer, an organic protective film (OSP) or other cover layer which must be covered on the metal line ML, for example, may be a green paint layer. Preferably, the first wavelength segment of the present invention selects a wavelength band of infrared light, and a wavelength band of 850 nm to 950 nm can be selected to match with a line scan camera as the light source collecting device 150 to achieve better image data capturing effect.
接著請參閱第7a及7b圖,第7a圖係為印刷電路板在可見光照射下所擷取的影像資料,第7b圖係為印刷電路板在長波長之不可見光照射下所擷取的影像資料。如此可清楚地識別出可見光及長波長之不可見光的照射下所視得的不同結果,相較於第7a圖的影像資料,第7b圖的影像資料將可供運算主機清楚地辨別出覆蓋層CL下之金屬線路ML的走線情況,也因此,本發明將可令外觀檢測的程序中再加上金屬線路的檢測,且該檢測係為具有高可靠性、高效率、且低成本之金屬線路檢測程序,將使得最終出產之印刷電路板成品達到高品質的標準。Next, please refer to Figures 7a and 7b. Figure 7a shows the image data captured by the printed circuit board under visible light. Figure 7b shows the image data of the printed circuit board under the long-wavelength invisible light. . In this way, the different results seen under the illumination of visible light and long wavelength invisible light can be clearly recognized. Compared with the image data of FIG. 7a, the image data of FIG. 7b can be used for the computing host to clearly distinguish the cover layer. The routing of the metal line ML under the CL, therefore, the present invention will enable the detection of the metal line in the procedure of the appearance inspection, and the detection is a metal with high reliability, high efficiency, and low cost. The line inspection program will enable the finished printed circuit board to meet high quality standards.
接著請參閱第8a及8b圖,第8a圖係為印刷電路板在可見光照射下所擷取之具有斷開之線路的影像資料,第8b圖係為印刷電路板在長波長之不可 見光照射下所擷取之具有斷開之線路的影像資料。如圖所示,在可見光下,位於覆蓋層ML下之線路缺陷區F將無法被輕易辨識,反觀長波長之不可見光的照射下,覆蓋層ML下之線路缺陷區F將可被輕易的辨識。Next, please refer to Figures 8a and 8b. Figure 8a is the image data of the circuit with the disconnected circuit taken by the printed circuit board under visible light. Figure 8b is the printed circuit board at the long wavelength. See the image data of the disconnected line taken under the illumination of the light. As shown in the figure, under visible light, the line defect area F under the cover layer ML cannot be easily identified. In contrast to the long-wavelength invisible light, the line defect area F under the cover layer ML can be easily identified. .
接著請參閱第9a及9b圖,第9a圖係為具有較深色之覆蓋層的印刷電路板在可見光照射下所擷取的影像資料,第9b圖係為具有較深色之覆蓋層的印刷電路板在長波長之不可見光照射下所擷取的影像資料。如圖所示,即便是覆蓋層的顏色更深而在可見光照射下幾乎無法辨識覆蓋層底下之金屬線路時,在長波長之不可見光的照射下,覆蓋層下方之金屬線路仍舊可被輕易的辨識。據此,本發明可於印刷電路板之外觀檢測程序中提供精確且快速及有效率的金屬線路檢測程序,進而大幅提高檢測效率及可靠度。Next, please refer to Figures 9a and 9b. Figure 9a shows the image data captured by the printed circuit board with a darker cover layer under visible light. Figure 9b shows the printing with a darker cover layer. The image data captured by the board under long-wavelength invisible light. As shown in the figure, even if the color of the cover layer is deeper and the metal line under the cover layer is hardly recognized under visible light irradiation, the metal line under the cover layer can be easily identified under the illumination of long wavelength invisible light. . Accordingly, the present invention can provide an accurate, fast, and efficient metal line detection procedure in the appearance inspection program of a printed circuit board, thereby greatly improving detection efficiency and reliability.
本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.
S101~S105‧‧‧步驟S101~S105‧‧‧Steps
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