CN104655653B - Method and apparatus for inspecting printed circuit board - Google Patents

Method and apparatus for inspecting printed circuit board Download PDF

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Publication number
CN104655653B
CN104655653B CN201310716905.4A CN201310716905A CN104655653B CN 104655653 B CN104655653 B CN 104655653B CN 201310716905 A CN201310716905 A CN 201310716905A CN 104655653 B CN104655653 B CN 104655653B
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circuit board
printed circuit
wave length
pcb
image data
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CN104655653A (en
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汪光夏
陈辉毓
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Machvision Inc
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Machvision Inc
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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention discloses a method and equipment for detecting the appearance of a printed circuit board, which are used for detecting the printed circuit board coated with a covering layer on a metal circuit. Therefore, the invention can provide accurate, quick and efficient metal circuit detection procedures in the appearance detection procedures of the printed circuit board, and does not need to set a detection neglect visual area or a calculation procedure for comparing image data with complex design at the boundary of the covering layer coated on the metal circuit.

Description

The detection method and its equipment of printed circuit board (PCB)
Technical field
The present invention relates to a kind of optical detecting method and its equipment, more particularly to a kind of printed circuit board (PCB) detection method and Its equipment.
Background technology
For example rigid printed circuit board (PCB) of printed circuit board (PCB)(PCB)Or soft printed circuit board(FPC), its in manufacturing process all Need accurate check problem check the circuit on printed circuit board (PCB), sheet material situation and each component allocation position it is correct Property.
Several processes are generally divided into the manufacture of printed circuit board (PCB), in general can be divided into the formation of circuit, have been Into the production process turned between circuit(Such as drilling, the making of conducting circuit)And follow-up anti-welding and anti-oxidant treatment.Generally exist In the whole manufacturing process of circuit board, the detection of circuit has completed detection, follow-up making when the circuit of last stage makes Detection again can't be carried out in flow to circuit again, moreover, follow-up Making programme can be in the subregion of circuit board On be coated with coating(Such as:Welding resisting layer), this is that the circuit below the coating can be allowed shielded and can not be detected, Jin Er Circuit can't be detected again in the Making programme of printed circuit board (PCB) rear end.
However, in this follow-up Making programme, being also possible to because collision, scratch or other various reasons cause part Situations such as damage of circuit, defect, fracture, and also have in the covering layer formation process carried out in anti-welding and anti-oxidant treatment The circuit on printed circuit board (PCB) may be injured because of high temperature or other reasonses so that the circuit on printed circuit board (PCB) may not be certain to tie up The quality during circuit formation fabrication schedule of last stage is held, and then influences the manufacture qualification rate of printed circuit board (PCB).
The content of the invention
It is an object of the present invention to printed circuit board (PCB) when the outward appearance in stage after fabrication schedule detects program, enter one Walk and wireline inspection is carried out to the printed circuit board (PCB) for being coated with coating on metallic circuit.
The metallic circuit can be obtained another object of the present invention is to not influenceed by the coating on metallic circuit Contour image data.
It is still another object of the present invention to provide a kind of high efficiency and the wireline inspection method and its equipment of low cost.
For up to above-mentioned purpose and other purposes, the present invention proposes a kind of detection method of printed circuit board (PCB), for printing electricity The outward appearance detection program of road plate, to be detected to the printed circuit board (PCB) for being coated with coating on metallic circuit, the party Method is included:Test print circuit board is irradiated with the first light source with first wave length section;Obtain and contain on the test print circuit board There is the first image data of the composition of first wave length section;And enter first image data with acquiescence metallic circuit image data Row alignment programs, wherein, the first wave length section be long wavelength and be black light wavelength period.
In one embodiment of the invention, also comprising visible detection step, the visible detection step is included:To have There is the secondary light source irradiation test print circuit board of second wave length section;Obtain and contain the second wave length on the test print circuit board Second image data of the composition of section;And second image data is compared with acquiescence printed circuit board (PCB) outward appearance image data Program, wherein, second wave length section is the wavelength period of visible ray.
In one embodiment of the invention, the coating can be welding resisting layer, organic protective film or green enamelled coating etc..
In one embodiment of the invention, the irradiation of first light source is with the incident test print circuit of oblique angle Plate.Further, first light source can be also ring-type configuration, to provide the test print circuit board irradiation light of enclosed.
For up to above-mentioned purpose and other purposes, the present invention reintroduces a kind of detection device of printed circuit board (PCB), for printing The outward appearance detection program of circuit board, should to be detected to the printed circuit board (PCB) for being coated with coating on metallic circuit Detection device is included:Plummer, for carrying test print circuit board;First light-source generation device, is configured on the plummer Side, for irradiating the test print circuit board with the first light source with first wave length section;Source-collector device, is configured at this and holds Above microscope carrier, the first image data for obtaining the composition containing first wave length section on the test print circuit board;And fortune Main frame is calculated, the source-collector device is connected, for first image data to be compared with acquiescence metallic circuit image data Program, wherein, the first wave length section be long wavelength and be black light wavelength period.
In one embodiment of the invention, the detection device of printed circuit board (PCB) is also included:Secondary light source generation device, matches somebody with somebody It is placed in above the plummer, for irradiating the test print circuit board with the secondary light source with second wave length section, wherein, the light Source collection device obtains the second image data of the composition containing second wave length section on the test print circuit board, computing master Program is compared with acquiescence printed circuit board (PCB) outward appearance image data in second image data by machine, and second wave length section is visible The wavelength period of light.
In one embodiment of the invention, first wave length section is the wave band of infrared light.First wave length section is preferably 850nm~950nm.
Whereby, the irradiation light of wave band of the present invention using long wavelength and for black light, is irradiated to printed circuit board (PCB), So that the metallic circuit for being even coated with coating still can clearly show its profile, and it is not necessary to carry out additionally circuit Electrified regulation program can rapidly obtain the profile for the metallic circuit being covered, and then need not be again to having on metallic circuit The calculation program of area or the complicated and cumbersome comparison image data of design is ignored in intersection setting detection without the coating coating, And then greatly improve detection efficiency and reliability.
Brief description of the drawings
Fig. 1 a-1c are the position relationship schematic diagram of metallic circuit and covering interlayer on printed circuit board (PCB).
Fig. 2 be one embodiment of the invention in printed circuit board testing device schematic diagram.
Fig. 3 be another embodiment of the present invention in printed circuit board testing device schematic diagram.
Fig. 4 is the first light-source generation device of the invention in a diagrammatic cross-section implemented under aspect.
Fig. 5 be one embodiment of the invention in printed circuit board detecting method flow chart.
Fig. 6 be another embodiment of the present invention in printed circuit board detecting method flow chart.
The image data that Fig. 7 a are captured under visible light illumination by printed circuit board (PCB).
The image data that Fig. 7 b are captured by printed circuit board (PCB) under the black light irradiation of long wavelength.
The image data with the circuit disconnected that Fig. 8 a are captured under visible light illumination by printed circuit board (PCB).
The image with the circuit disconnected that Fig. 8 b are captured by printed circuit board (PCB) under the black light irradiation of long wavelength Data.
The image data that Fig. 9 a are captured under visible light illumination for the printed circuit board (PCB) of the coating with darker.
Fig. 9 b are captured for the printed circuit board (PCB) of the coating with darker under the black light irradiation of long wavelength Image data.
Critical piece reference:
110 first light-source generation devices
120 secondary light source generation devices
150 source-collector devices
170 plummers
190 computing hosts
200 test print circuit boards
CL coatings
F line defcts area
ML metallic circuits
The top/bottom latitude in region is ignored in R detections
PCB printed circuit board (PCB)s
S101~S105 steps
S201~S205 steps
Embodiment
To be fully understood by the purpose of the present invention, feature and technique effect, hereby by following specific embodiments, and with reference to accompanying drawing, The present invention is elaborated, is described as follows:
The outward appearance detection of printed circuit board (PCB), such as existing automatic shape inspection machine(Auto Final Inspection), It can claim outward appearance whole inspection machine again, be that overall outward appearance detection is carried out to the later stage that makes of printed circuit board (PCB), the present invention is i.e. in this outward appearance Implement new detection technique in detection program.
Referring initially to Fig. 1 a to 1c, it is the position relationship signal of metallic circuit and covering interlayer on printed circuit board (PCB) Figure.Wherein, the metallic circuit ML below coating CL can not be regarded under the wireline inspection of visible ray, but for convenience of distinguishing, it is attached Shielded metallic circuit ML is shown in phantom on figure.
The problem of contraposition precision is had on processing procedure due to coating CL, therefore it is formed at the covering on printed circuit board (PCB) " can be allowed to " skew can more or less occur on originally predetermined position for layer CL, and this skew can influence the metal of lower section Degree capped circuit ML, therefore the metallic circuit ML of every a piece of printed circuit board (PCB) is caused coating coating CL's Intersection has the uncertainty of position.
For Fig. 1 a, when the metallic circuit ML on printing board PCB is linear circuit compared with simplification, cover Even if cap rock CL covering edge produce skew, for example above and below skew, the metallic circuit ML revealed still be straight line.
However, when the cabling of the metallic circuit ML on printing board PCB is more complicated, as shown in Fig. 1 b and 1c, Fig. 1 b And 1c is respectively to have identical metallic circuit ML cablings, but the coating CL with different degrees of offset, in both skews The metallic circuit ML revealed under state just becomes considerably complicated, and the circuit on printed circuit board (PCB) is what more, to draw up One standard come allow a set of algorithm be applied to various situations detection will be extremely difficult and time-consuming.
Therefore, for the analysis interpretation of the image data of optical detection, to be covered with a set of algorithm and all " can be permitted Perhaps all algorithm can will be caused by correct interpretation for shift state ", the metallic circuit ML so that various differences are appeared with degree Must be considerably complicated and become extremely difficult, it is excessively multiple further, since detection program quickly efficient must could improve production capacity Miscellaneous calculation, which judges not only to take, is easier to error;If using the setting of " region is ignored in detection ", such as inspections of Fig. 1 a into 1c The top/bottom latitude R for ignoring region is surveyed, although algorithm and detection can be allowed to become rapidly and simply(Ignore what can be allowed to during because of detection The formed scope of skew), but ignore region in metallic circuit ML will not be detected, once occur defect will be unable to be detected Go out, so cause a kind of insecure detection program.
Then referring to Fig. 2, its be one embodiment of the invention in printed circuit board testing device schematic diagram.The present invention Printed circuit board (PCB) detection device, for printed circuit board (PCB) outward appearance detect program, to the coating on metallic circuit The printed circuit board (PCB) for having coating is detected that the detection device is included:Plummer 170, the first light-source generation device 110, light Source collection device 150 and computing host 190.
Plummer 170 is used to carry test print circuit board 200.First light-source generation device 110 is configured at the plummer 170 tops, for irradiating the test print circuit board 200 with the first light source with first wave length section, wherein, the first wave length Section be long wavelength and be black light wavelength period.In addition, being configured at first light-source generation device of the top of plummer 170 110 are not limited to the surface of the plummer 170, as long as positioned at all applicable present invention of superjacent air space of plummer 170, For example, when plummer is smaller, although first light-source generation device 110 is located at the oblique upper space of plummer 170, its Still fall within the category for being configured at the top of plummer 170.
Source-collector device 150 is configured at the top of plummer 170, contains for obtaining on the test print circuit board 200 There is the first image data of the composition of first wave length section.Wherein, it is configured at the source-collector device of the top of plummer 170 150 also suitable for the aspect described in leading portion.
Computing host 190 connect the source-collector device 150, for by first image data with acquiescence metallic circuit shadow As program is compared in data, to produce the testing result of the test print circuit board 200, the wherein acquiescence metallic circuit image Data are the configuration relation figure of former designed lines.
Then referring to Fig. 3, its be another embodiment of the present invention in printed circuit board testing device schematic diagram.This hair The detection device of bright printed circuit board (PCB), for example, can be also combined together with the whole inspection machine of outward appearance, i.e., as shown in figure 3, also wrapping Contain:Secondary light source generation device 120.The secondary light source generation device 120 is configured at the top of the plummer 170, for with The secondary light source of second wave length section irradiates the test print circuit board 200.Wherein, second wave length section is the wavelength of visible ray Section, the source-collector device 150 obtains the second image of the composition containing second wave length section on the test print circuit board 200 Program is compared with acquiescence printed circuit board (PCB) outward appearance image data in second image data by data, the computing host 190.Its In, Fig. 3 is configured at the top of the first light-source generation device 110 as an example, people in the art with secondary light source generation device 120 Member is not it will be appreciated that the present invention is limited with this configuration mode, and the figure is only a kind of example, various secondary light source generation devices 120 and the first all applicable present invention of configuration relation between light-source generation device 110.
Then referring to Fig. 4, it implements the diagrammatic cross-section under aspect for the first light-source generation device of the present invention in one. The present invention the first light-source generation device 110 can for single configuration, symmetrical expression it is oppositely disposed(As shown in Figure 2)Or as schemed Ring-type configuration shown in 4, cyclic formula configuration will can provide more sufficient radiation source.Wherein, the first light source of the invention production Generating apparatus 110 can preferably adopt the incident test print circuit board 200 of oblique angle(As shown in Figure 2,4).
Then referring to Fig. 5, its be one embodiment of the invention in printed circuit board detecting method flow chart.Based on upper State the description of equipment, the detection method of printed circuit board (PCB) of the invention, the outward appearance for printed circuit board (PCB) detects program, to right The printed circuit board (PCB) for being coated with coating on metallic circuit is detected that this method is included:
Step S101:Test print circuit board is irradiated with the first light source with first wave length section, wherein, the first wave length Section be long wavelength and be black light wavelength period;
Step S103:Obtain the first image data of the composition containing first wave length section on the test print circuit board; And
Step S105:Program is compared with acquiescence metallic circuit image data in first image data.
Further, the detection that the detection method of the present invention is examined to machine eventually with outward appearance is combined, by abovementioned steps S101 extremely On the premise of step S105 is referred to as black light detecting step, follow-up visible detection step can be with black light detecting step Carry out simultaneously(Configuration as shown in Figure 3 and be irradiated simultaneously and image capture), or first carry out visible detection step again Black light detecting step is performed, or first carry out black light detecting step performs visible detection step again, and it is all applicable The present invention.Visible detection step can simultaneously be carried out with black light detecting step in the case of preferably, as shown in fig. 6, this can See that light detecting step is included:
Step S201:Test print circuit board is irradiated with the secondary light source with second wave length section, wherein, the second wave length Section is the wavelength period of visible ray;
Step S203:Obtain the second image data of the composition containing second wave length section on the test print circuit board; And
Step S205:Program is compared with acquiescence printed circuit board (PCB) outward appearance image data in second image data.
The light source radiation modality used in the method for the present invention is same as the description of aforementioned device, is repeated no more in this.
Coating CL mentioned by the present invention can be welding resisting layer, organic protective film(Organic Soldering Preservative,OSP)Or other must be covered in the coating on metallic circuit ML, for example, can be green enamelled coating.This Wave band of the first wave length section of invention preferably from infrared light, and 850nm~950nm wave band is can select using with being used as light source The line scan camera of collection device 150 matches and then reaches that more preferably image data captures effect.
Then the image data that Fig. 7 a and 7b, Fig. 7 a are captured under visible light illumination by printed circuit board (PCB) is referred to, is schemed The image data that 7b is captured by printed circuit board (PCB) under the black light irradiation of long wavelength.So can clearly it identify visible The lower Different Results regarded of the irradiation of light and the black light of long wavelength, compared to Fig. 7 a image data, Fig. 7 b image Data are by the cabling situation for being available for computing host clearly to identify the metallic circuit ML under coating CL, also therefore, the present invention The detection that metallic circuit is added in the program that outward appearance detects will can be made, and this is detected as with high reliability, high efficiency and low The metallic circuit detection program of cost, high-quality standard is reached by the finished printed circuit board product for finally to produce.
Then refer to Fig. 8 a and 8b, Fig. 8 a has the line disconnected by what printed circuit board (PCB) was captured under visible light illumination The image data on road, the circuit with disconnection that Fig. 8 b are captured by printed circuit board (PCB) in the case where the black light of long wavelength irradiates Image data.As illustrated, under visible light, the line defct area F being positioned under floor ML will be unable to be recognized easily, review Under the irradiation of the black light of long wavelength, the line defct area F under coating ML can be recognized easily.
Then refer to Fig. 9 a and 9b, Fig. 9 a be the coating with darker printed circuit board (PCB) under visible light illumination The image data captured, Fig. 9 b are the printed circuit board (PCB) of the coating with darker under the black light irradiation of long wavelength The image data captured.As illustrated, even coating darker and can not almost recognize under visible light illumination During metallic circuit under coating, under the irradiation of the black light of long wavelength, the metallic circuit below coating still may be used Recognized easily.Accordingly, the present invention can provide accurate and quick and efficient in the outward appearance detection program of printed circuit board (PCB) Metallic circuit detection program, and then greatly improve detection efficiency and reliability.
The present invention has hereinbefore been disclosed with preferred embodiment, but it will be understood by those skilled in the art that the implementation Example is only used for describing the present invention, and is not construed as limiting the scope of the present invention.It should be noted that every equivalent with the embodiment Change and displacement, be regarded as being covered by scope of the invention.Therefore, protection scope of the present invention is when with claims The content limited is defined.

Claims (14)

1. the circuit and appearance detecting method of a kind of printed circuit board (PCB), it is characterised in that for the circuit of printed circuit board (PCB) and outer Detection program is seen, to be detected to the printed circuit board (PCB) for being coated with coating on metallic circuit;Wherein, this method bag Detecting step containing black light, the black light detecting step is included:
Test print circuit board is irradiated with the first light source with first wave length section;
Obtain the first image data of the composition containing first wave length section on the test print circuit board;And
Program is compared in first image data and default metallic circuit image data,
Wherein, the first wave length section be long wavelength and be black light wavelength period;
Wherein, this method also includes visible detection step, and the visible detection step is included:
Test print circuit board is irradiated with the secondary light source with second wave length section;
Obtain the second image data of the composition containing second wave length section on the test print circuit board;And
Program is compared in second image data and default printed circuit board (PCB) outward appearance image data,
Wherein, second wave length section is the wavelength period of visible ray.
2. detection method as claimed in claim 1, it is characterised in that the coating is both welding resisting layer, organic protective film At least one.
3. detection method as claimed in claim 1, it is characterised in that the coating is green enamelled coating.
4. detection method as claimed in claim 1, it is characterised in that the irradiation of first light source is treated with incident this of oblique angle Survey printed circuit board (PCB).
5. detection method as claimed in claim 4, it is characterised in that first light source configures for ring-type, with to the print to be measured Printed circuit board provides the irradiation light of enclosed.
6. the detection method as any one of claim 1 to 5, it is characterised in that first wave length section is infrared light Wave band.
7. detection method as claimed in claim 6, it is characterised in that first wave length section is 850nm~950nm.
8. the circuit and appearance detecting device of a kind of printed circuit board (PCB), it is characterised in that for the circuit of printed circuit board (PCB) and outer See detection program, to be detected to the printed circuit board (PCB) for being coated with coating on metallic circuit, the detection device bag Contain:
Plummer, for carrying test print circuit board;
First light-source generation device, is configured above the plummer, for being somebody's turn to do with the first light source irradiation with first wave length section Test print circuit board;
Source-collector device, is configured above the plummer, contains the first wave length on the test print circuit board for obtaining First image data of the composition of section;And
Computing host, connects the source-collector device, for first image data to be entered with default metallic circuit image data Row alignment programs,
Wherein, the first wave length section be long wavelength and be black light wavelength period;
Wherein, the detection device is also included:
Secondary light source generation device, is configured above the plummer, for being somebody's turn to do with the secondary light source irradiation with second wave length section Test print circuit board,
Wherein, the source-collector device obtains the second image of the composition containing second wave length section on the test print circuit board Program is compared in second image data and default printed circuit board (PCB) outward appearance image data by data, the computing host, and this Two wavelength periods are the wavelength period of visible ray.
9. detection device as claimed in claim 8, it is characterised in that the coating is both welding resisting layer, organic protective film At least one.
10. detection device as claimed in claim 8, it is characterised in that the coating is green enamelled coating.
11. detection device as claimed in claim 8, it is characterised in that the irradiation light of first light-source generation device is with oblique The angle incidence test print circuit board.
12. detection device as claimed in claim 11, it is characterised in that first light-source generation device configures for ring-type, with The irradiation light of enclosed is provided the test print circuit board.
13. the detection device as any one of claim 8 to 12, it is characterised in that first light-source generation device is produced The first wave length section of raw first light source is the wave band of infrared light.
14. detection device as claimed in claim 13, it is characterised in that first wave length section is 850nm~950nm.
CN201310716905.4A 2013-11-19 2013-12-23 Method and apparatus for inspecting printed circuit board Active CN104655653B (en)

Applications Claiming Priority (2)

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TW102141994 2013-11-19
TW102141994A TWI487924B (en) 2013-11-19 2013-11-19 Method and device for inspecting printed circuit board

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CN104655653B true CN104655653B (en) 2017-08-04

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TW201700966A (en) * 2015-06-18 2017-01-01 Machvision Inc Inspection method and device of hole location information for PCB without the need to turn or rotate the PCB during the inspection process
CN109187585A (en) * 2018-10-22 2019-01-11 珠海格力智能装备有限公司 Laser icon information acquisition methods and device
KR20210126650A (en) * 2019-02-15 2021-10-20 아토테크더치랜드게엠베하 How to obtain information about the layer of organic solderable preservative on a printed circuit board
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TWI487924B (en) 2015-06-11
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