TWI485360B - 用於量測直通矽晶穿孔的設備及方法 - Google Patents

用於量測直通矽晶穿孔的設備及方法 Download PDF

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Publication number
TWI485360B
TWI485360B TW103111809A TW103111809A TWI485360B TW I485360 B TWI485360 B TW I485360B TW 103111809 A TW103111809 A TW 103111809A TW 103111809 A TW103111809 A TW 103111809A TW I485360 B TWI485360 B TW I485360B
Authority
TW
Taiwan
Prior art keywords
light
reflected
measuring
amount
aperture
Prior art date
Application number
TW103111809A
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English (en)
Chinese (zh)
Other versions
TW201447222A (zh
Inventor
Young Min Hwang
Seong Ryong Kim
Tae Young Jo
Original Assignee
Snu Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Snu Precision Co Ltd filed Critical Snu Precision Co Ltd
Publication of TW201447222A publication Critical patent/TW201447222A/zh
Application granted granted Critical
Publication of TWI485360B publication Critical patent/TWI485360B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
TW103111809A 2013-03-29 2014-03-28 用於量測直通矽晶穿孔的設備及方法 TWI485360B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130034050A KR101414255B1 (ko) 2013-03-29 2013-03-29 Ｔｓｖ 측정장치 및 측정방법

Publications (2)

Publication Number Publication Date
TW201447222A TW201447222A (zh) 2014-12-16
TWI485360B true TWI485360B (zh) 2015-05-21

Family

ID=51624778

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103111809A TWI485360B (zh) 2013-03-29 2014-03-28 用於量測直通矽晶穿孔的設備及方法

Country Status (5)

Country Link
JP (1) JP6052700B2 (ja)
KR (1) KR101414255B1 (ja)
CN (1) CN105164518B (ja)
TW (1) TWI485360B (ja)
WO (1) WO2014157882A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101658982B1 (ko) * 2014-11-13 2016-09-26 주식회사 고영테크놀러지 회절 격자를 이용한 3차원 형상 측정 장치
KR101551609B1 (ko) 2015-06-10 2015-09-08 한국기초과학지원연구원 웨이퍼 홀 특성 분석 장치 및 그 제어 방법
JP6685849B2 (ja) * 2016-06-17 2020-04-22 株式会社ミツトヨ 光干渉測定装置及び光干渉測定方法
CN109540004B (zh) * 2018-11-29 2020-06-30 中国科学院微电子研究所 一种光学检测系统及其检测方法
KR102346827B1 (ko) * 2021-05-31 2022-01-05 주식회사 에이케이씨 컬러 광학 검사 장치 및 이를 포함하는 시스템

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5450201A (en) * 1993-02-12 1995-09-12 Orbotech Ltd. Apparatus and method for optical inspection of articles
TW201232686A (en) * 2011-01-31 2012-08-01 Ind Tech Res Inst System, method and computer readable medium for through silicon via structure measurement
KR101186464B1 (ko) * 2011-04-13 2012-09-27 에스엔유 프리시젼 주식회사 Ｔｓｖ 측정용 간섭계 및 이를 이용한 측정방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235807A (ja) * 1988-03-16 1989-09-20 Toshiba Corp 深さ測定装置
IL188029A0 (en) * 2007-12-10 2008-11-03 Nova Measuring Instr Ltd Optical method and system
JP2011089897A (ja) * 2009-10-22 2011-05-06 Mitsutoyo Corp 形状測定装置及び形状データの位置合わせ方法
CN201666783U (zh) * 2010-04-23 2010-12-08 浙江大学 一种具有快速调零系统的白光干涉仪
EP2665990B1 (en) * 2011-01-19 2015-03-04 Nova Measuring Instruments Ltd. Optical system and method for measuring in three-dimensional structures
JP5740230B2 (ja) * 2011-07-12 2015-06-24 株式会社アルバック 走査型白色干渉計による試料の表面形状の測定方法
KR101245097B1 (ko) * 2011-07-25 2013-03-25 에스엔유 프리시젼 주식회사 박막 두께 측정장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5450201A (en) * 1993-02-12 1995-09-12 Orbotech Ltd. Apparatus and method for optical inspection of articles
TW201232686A (en) * 2011-01-31 2012-08-01 Ind Tech Res Inst System, method and computer readable medium for through silicon via structure measurement
KR101186464B1 (ko) * 2011-04-13 2012-09-27 에스엔유 프리시젼 주식회사 Ｔｓｖ 측정용 간섭계 및 이를 이용한 측정방법

Also Published As

Publication number Publication date
CN105164518B (zh) 2018-07-27
WO2014157882A1 (ko) 2014-10-02
KR101414255B1 (ko) 2014-07-01
JP2016519427A (ja) 2016-06-30
TW201447222A (zh) 2014-12-16
JP6052700B2 (ja) 2016-12-27
CN105164518A (zh) 2015-12-16

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