TWI483548B - Method of manufacturing proximity sensor module - Google Patents
Method of manufacturing proximity sensor module Download PDFInfo
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- TWI483548B TWI483548B TW100141607A TW100141607A TWI483548B TW I483548 B TWI483548 B TW I483548B TW 100141607 A TW100141607 A TW 100141607A TW 100141607 A TW100141607 A TW 100141607A TW I483548 B TWI483548 B TW I483548B
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
- H03K17/955—Proximity switches using a capacitive detector
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960755—Constructional details of capacitive touch and proximity switches
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Description
本發明是有關於一種近接感應模組的製造方法,特別是指一種用以貼附於一行動裝置的殼體內表面的近接感應模組的製造方法。
目前在例如行動電話、平板電腦等的行動裝置中,通常設有電容式的近接感測器(proximity sensor),用以在偵測到使用者接近行動裝置時,降低行動裝置發射的電磁波強度,以減少電磁波對人體的傷害。
然而,現有用於行動裝置的電容式距離感測器的感應模組(電極片)是設置在行動裝置的主機電路板上,不僅製作工序繁瑣,也因為感應模組必須具有特定的形狀以具有較佳的感應效果,而且感應模組需在主機電路板上佔用特定的空間,導致感應模組的形狀與主機電路板的機構設計必須互相遷就,降低了感應模組的設計彈性及主機電路板機構設計的設計彈性。
因此,本發明之目的,即在提供一種製作工序簡單且能貼附於行動裝置的殼體內表面之近接感應模組的製造方法,可以簡化製程並降低製造成本,且不佔用行動裝置之主機電路板的空間,以增加近接感應模組的設計彈性及主機電路板之機構設計的設計彈性。
於是,本發明近接感應模組的製造方法,該近接感應模組用以貼附於一行動裝置的殼體內表面,並與該行動裝置的主機電路板之對應接點接觸形成電連接,該製造方法的步驟包含:提供一導電膜,並裁切該導電膜形成一導接部及一連接該導接部的感應電路圖案,該導接部用以與該主機電路板的對應接點電連接;及以一面積能涵蓋該導接部與該感應電路圖案的黏膠片,覆蓋於該導接部及該感應電路圖案並與其黏合,且該黏膠片形成一穿孔以露出該導接部。
較佳地,該導電膜先貼合於一離形膜上,再裁切移除該導電膜的多餘部分,以形成該導接部與該感應電路圖案。
較佳地,該製造方法還包含由另一導電膜形成一補強墊的步驟,即先由一第一導電膜製備一補強墊,再提供一第二導電膜與該補強墊可導電地貼合,並依據該補強墊位置裁切該第二導電膜及該補強墊以形成該導接部及該感應電路圖案,使該導接部與該補強墊對應疊合。
較佳地,該第一導電膜先貼合於一離形膜,再裁切移除該第一導電膜的多餘部份以形成該補強墊,且該第二導電膜覆蓋該補強墊並貼合於該離形膜上,再裁切移除該第二導電膜及該補強墊的多餘部分,以形成該導接部與該感應電路圖案。
較佳地,該製造方法還包含在該黏膠片的另一表面覆蓋一保護膜的步驟,且該保護膜形成一穿孔以露出該導接部。
較佳地,該製造方法還包含在該保護膜與該黏膠片貼合後,進一步切除非必要範圍的步驟。
本發明之功效,本發明不僅製作工序簡單,且材料選擇較有彈性,能夠大幅降低製程時間及製造成本,並具有薄形及重量輕的優點。再者,近接感應模組與行動裝置的主機電路板分開製造,可以提供主機電路板的機構設計者有較多的設計彈性空間,同時對於近接感應模組的感應電路圖案也有較多的設計彈性空間。
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。
在本發明被詳細描述之前,要注意的是,在以下的說明內容中,類似的元件是以相同的編號來表示。
本發明近接感應模組的製造方法之一較佳實施例所製得的近接感應模組用以貼附於一行動裝置的殼體內表面,並與行動裝置的主機電路板之對應接點接觸形成電連接,前述行動裝置可例如平板電腦、行動電話等。參閱圖1,本較佳實施例主要步驟包含:步驟100,製備一補強墊;步驟200,對應補強墊形成一導接部及一連接導接部的感應電路圖案;步驟300,於導接部及感應電路圖案覆蓋一黏膠片並與其黏合;及步驟400,在黏膠片的另一表面覆蓋一保護膜。
每一步驟的具體做法詳述如下:參閱圖2與圖3,步驟100的具體做法是先將一具有預定寬度的長條狀第一導電膜1利用貼合機在第一導電膜1的表面塗佈背膠並貼合於一離形膜2上,再利用沖壓機裁切第一導電膜1,並將第一導電膜1的多餘部分撕去移除以形成一補強墊11。在同一離形膜2上可以同時形成多個相間隔的補強墊11,相鄰補強墊11的間隔距離是依據近接感應模組的整體結構而定,藉此可於後續步驟同步進行或連續進行多個近接感應模組的製作,以加快生產的速度。
參閱圖4與圖5,為方便說明起見,圖4與圖5僅圖示製作單一近接感應模組為代表說明,步驟200的具體做法是提供一第二導電膜3,並將第二導電膜3與補強墊11可導電地貼合,亦即利用貼合機將第二導電膜3的表面塗佈導電膠使其覆蓋並貼合於補強墊11及離形膜2上,並依據補強墊11位置利用沖壓機裁切第二導電膜3及補強墊11以切出一導接部31及一感應電路圖案32的形狀,再將第二導電膜3及補強墊11的多餘部分撕去移除以形成導接部31及感應電路圖案32,使導接部31與補強墊11對應疊合,導接部31與補強墊11共同構成與行動裝置的主機電路板(未圖示)電連接的接點(本實施例共有三個接點),而具有雙層導電箔的厚度以增加接點的機械強度,並且設於行動裝置的殼體內表面時可以較為凸出,以容易與主機電路板的對應接點相接觸,當然,若省去補強墊11,僅利用導接部31為接點亦可實施。在本實施例中,感應電路圖案32包括多個感應區塊321及一連接線路322,連接線路322連接該等感應區塊321及導接部31,其中感應區塊321的形狀大小及位置是配合行動裝置(未圖示)的主機電路板所設計,可以依據實際設計而調整。此外,在本實施例中,第一導電膜1及第二導電膜2皆為銅箔,以具有較佳的導電效果,但是第一導電膜1及第二導電膜2也可以採用其它可導電的膜材。
參閱圖6、圖7與圖8,步驟300與步驟400的具體做法一併說明。參閱圖6,步驟300是以一面積能涵蓋導接部31與感應電路圖案32的黏膠片4,覆蓋於導接部31及感應電路圖案32並與其黏合,黏膠片4亦與離形膜2未覆蓋導接部31與感應電路圖案32的部份貼合。參閱圖7,步驟400是在黏膠片4的另一表面覆蓋一保護膜5,保護膜5亦可先貼覆於黏膠片4的表面後,再將黏膠片4的另一表面相對與離形膜2、導接部31及感應電路圖案32貼合。參閱圖8,以沖壓機在黏膠片4及保護膜5上對應導接部31的區域裁切,將此部分移除而在黏膠片4及保護膜5上分別形成對應導接部31的穿孔6以露出導接部31。在本實施例中,黏膠片4是採用3M公司之商品(型號1683),雙面具有黏性且較軟,所以再覆蓋以PET材質製成的保護膜5,來保護黏膠片4的表面並提昇整體結構的剛性,以容易將製得的近接感應模組安裝於行動裝置的殼體內表面。若採用材質較具有剛性的黏膠片4,且僅在相對導接部31與感應電路圖案32的表面設有黏膠,則可以省去設置保護膜5。
參閱圖9,進一步地,以沖壓機裁切黏膠片4及保護膜5以界定出近接感應模組整體的輪廓,並移除非必要範圍,以減少近接感應模組整體的體積及重量,而製得近接感應模組。
參閱圖10,藉由補強墊11、感應電路圖案32及黏膠片4的表面均有黏膠,欲將近接感應模組安裝於行動裝置的殼體7內表面時,只要移除離形膜2,即可將近接感應模組貼附於殼體7內表面的對應位置,組裝工序簡單方便。而且,利用黏膠片4及保護膜5覆蓋感應電路圖案32僅露出導接部31與主機電路板的對應接點接觸,如此可以保護感應電路圖案32避免受外力作用而損壞。
本較佳實施例的近接感應模組主要由導電膜3、黏膠片4與保護膜5疊合構成,不僅製作工序簡單,且材料選擇較有彈性,能夠大幅降低製程時間及製造成本,並具有薄形及重量輕的優點。再者,近接感應模組與行動裝置的主機電路板分開製造,可以提供主機電路板的機構設計者有較多的設計彈性空間,同時對於近接感應模組的感應電路圖案32也有較多的設計彈性空間,因此確實能達成本發明之目的。
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。
100...步驟
200...步驟
300...步驟
400...步驟
1...第一導電膜
11...補強墊
2...離形膜
3...第二導電膜
31...導接部
32...感應電路圖案
321...感應區塊
322...連接線路
4...黏膠片
5...保護膜
6...穿孔
7...殼體
圖1是一流程圖,說明本發明近接感應模組的製造方法之一較佳實施例;
圖2與圖3是說明該較佳實施例製備一補強墊之示意圖;
圖4與圖5是說明該較佳實施例形成一導接部及一感應電路圖案之示意圖;
圖6是說明該較佳實施例覆蓋一黏膠片的示意圖;
圖7是說明該較佳實施例覆蓋一保護膜的示意圖;
圖8是說明該較佳實施例在黏膠片與保護膜形成一穿孔的示意圖;
圖9是說明該較佳實施例切除非必要範圍的示意圖;及
圖10是說明該較佳實施例安裝於行動裝置的殼體內表面之示意圖。
100...步驟
200...步驟
300...步驟
400...步驟
Claims (6)
- 一種近接感應模組的製造方法,該近接感應模組用以貼附於一行動裝置的殼體內表面,並與該行動裝置的主機電路板之對應接點接觸形成電連接,該製造方法的步驟包含:將一第一導電膜貼合於一離形膜,再裁切該第一導電膜以形成一補強墊;將一第二導電膜覆蓋該補強墊並貼合於該離形膜上,且使該第二導電膜與該補強墊可導電地貼合,並依據該補強墊位置裁切該第二導電膜形成一與該補強墊對應疊合的導接部及一連接該導接部的感應電路圖案,該導接部用以與該主機電路板的對應接點電連接;及以一面積能涵蓋該導接部與該感應電路圖案的黏膠片,覆蓋於該導接部及該感應電路圖案並與其黏合,且該黏膠片形成一穿孔以露出該導接部。
- 依據申請專利範圍第1項所述之近接感應模組的製造方法,其中,該黏膠片還與該離形膜未覆蓋該導接部與該感應電路圖案的部份貼合。
- 依據申請專利範圍第1或2項所述之近接感應模組的製造方法,還包含在該黏膠片的另一表面覆蓋一保護膜的步驟,且該保護膜形成一穿孔以露出該導接部。
- 依據申請專利範圍第3項所述之近接感應模組的製造方法,還包含在該保護膜與該黏膠片貼合後,進一步切除非必要範圍的步驟。
- 依據申請專利範圍第1項所述之近接感應模組的製造方法,其中,該感應電路圖案包括多個感應區塊及一連接線路,該連接線路連接該等感應區塊及該導接部。
- 依據申請專利範圍第1項所述之近接感應模組的製造方法,該導電膜為銅箔。
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TW100141607A TWI483548B (zh) | 2011-11-15 | 2011-11-15 | Method of manufacturing proximity sensor module |
CN201110402238.3A CN103105182B (zh) | 2011-11-15 | 2011-12-06 | 近接感应模块的制造方法 |
US13/551,041 US8657982B2 (en) | 2011-11-15 | 2012-07-17 | Method for fabricating a proximity sensing module |
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TW100141607A TWI483548B (zh) | 2011-11-15 | 2011-11-15 | Method of manufacturing proximity sensor module |
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US6262692B1 (en) * | 1999-01-13 | 2001-07-17 | Brady Worldwide, Inc. | Laminate RFID label and method of manufacture |
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JP4358679B2 (ja) * | 2004-05-14 | 2009-11-04 | 株式会社フジクラ | 静電容量式近接センサ |
EP1760886B1 (de) * | 2005-08-19 | 2011-04-20 | E.G.O. Control Systems GmbH | Sensorvorrichtung |
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DE102009007917A1 (de) * | 2009-02-06 | 2010-08-12 | Preh Gmbh | Kapazitiver Berührungsensor |
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2011
- 2011-11-15 TW TW100141607A patent/TWI483548B/zh not_active IP Right Cessation
- 2011-12-06 CN CN201110402238.3A patent/CN103105182B/zh not_active Expired - Fee Related
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US6320140B1 (en) * | 1996-06-14 | 2001-11-20 | Ibiden Co., Ltd. | One-sided circuit board for multi-layer printed wiring board, multi-layer printed wiring board, and method of its production |
US20080297176A1 (en) * | 2006-01-19 | 2008-12-04 | Douglas Malcolm F | Capacitive Sensor and Method for Manufacturing the Same |
US20080180217A1 (en) * | 2007-01-25 | 2008-07-31 | Avery Dennison Corporation | RFID tag |
US20110175774A1 (en) * | 2010-01-19 | 2011-07-21 | Lite-On Technology Corporation | Built-in fm transmitting antenna applied to a mobile device |
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CN103105182A (zh) | 2013-05-15 |
US8657982B2 (en) | 2014-02-25 |
CN103105182B (zh) | 2015-11-18 |
US20130118676A1 (en) | 2013-05-16 |
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