TWI483022B - Positioning components, sockets and optical transmission modules - Google Patents

Positioning components, sockets and optical transmission modules Download PDF

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Publication number
TWI483022B
TWI483022B TW102128819A TW102128819A TWI483022B TW I483022 B TWI483022 B TW I483022B TW 102128819 A TW102128819 A TW 102128819A TW 102128819 A TW102128819 A TW 102128819A TW I483022 B TWI483022 B TW I483022B
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TW
Taiwan
Prior art keywords
optical
plug
axis direction
socket
optical fiber
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Application number
TW102128819A
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Chinese (zh)
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TW201423188A (en
Inventor
Hiroshi Asai
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Murata Manufacturing Co
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Publication of TW201423188A publication Critical patent/TW201423188A/en
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Publication of TWI483022B publication Critical patent/TWI483022B/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206Optical features
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4246Bidirectionally operating package structures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/428Electrical aspects containing printed circuit boards [PCB]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4292Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Description

定位構件、插座及光傳送模組Positioning member, socket and optical transmission module

本發明係關於一種用以使光纖與光元件光學耦合之定位構件、包含該定位構件之插座及光傳送模組,尤其是關於用以使插頭設在一端之光纖與設在構裝基板上之光元件光學耦合之定位構件、具備該定位構件之插座及光傳送模組。The present invention relates to a positioning member for optically coupling an optical fiber to an optical element, a socket including the positioning member, and an optical transmission module, and more particularly to an optical fiber for setting the plug at one end and the optical substrate disposed on the mounting substrate. A positioning member optically coupled to the optical element, a socket including the positioning member, and an optical transmission module.

作為習知用以使光纖與光元件光學耦合之定位構件,已知有例如專利文獻1記載之光連接器用插槽。此種光連接器用插槽500,如圖15所示,在光元件504之上載置成覆蓋該光元件504。此外,將設在光纖510之端部之光連接器(本發明之插頭)514安裝於光連接器用插槽500時,在光連接器用插槽500之上進一步安裝光連接器514。As a positioning member for optically coupling an optical fiber to an optical element, for example, a socket for an optical connector described in Patent Document 1 is known. Such an optical connector slot 500 is placed on the optical element 504 so as to cover the optical element 504 as shown in FIG. Further, when the optical connector (plug of the present invention) 514 provided at the end of the optical fiber 510 is attached to the optical connector slot 500, the optical connector 514 is further mounted on the optical connector slot 500.

如上述,在使用專利文獻1記載之光連接器用插槽500之插座,採用該光連接器用插槽500載置於光元件504之上且進一步在其上載置光連接器514之構成。此處,為了上述插座之低高度化,雖考量抑制光連接器514本身之高度,但為了確保該光連接器514之強度,無法成為一定以下之高度。是以,在使用專利文獻1記載之光連接器用插槽之模組,不易確保光連接器514之強度並同時謀求低高度化。As described above, the socket of the optical connector slot 500 described in Patent Document 1 is configured such that the optical connector slot 500 is placed on the optical element 504 and the optical connector 514 is placed thereon. Here, in order to reduce the height of the optical connector 514 itself, in order to reduce the height of the optical connector 514, it is not possible to have a height equal to or lower than the height of the optical connector 514. In the module using the socket for an optical connector described in Patent Document 1, it is difficult to ensure the strength of the optical connector 514 and at the same time reduce the height.

專利文獻1:日本特開2009-276477號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2009-276477

因此,本發明之目的在於提供一種可確保設在光纖一端之插頭之強度並同時謀求連接該插頭之插座之低高度化之定位構件、具備該定位構件之插座及光傳送模組。Accordingly, an object of the present invention is to provide a positioning member capable of securing a strength of a plug provided at one end of an optical fiber and at the same time reducing the height of a socket to which the plug is connected, a socket including the positioning member, and an optical transmission module.

本發明一形態之定位構件,係使在端部設有插頭之光纖與設在構裝基板之上表面之光元件光學耦合,其特徵在於,具備:插頭載置部,設在該構裝基板之上表面,且載置該插頭;以及光耦合部,夾著該光元件設在該構裝基板之上,藉由反射使該光纖之光軸與該光元件之光軸一致。A positioning member according to an aspect of the present invention is characterized in that an optical fiber having a plug at an end portion is optically coupled to an optical element provided on an upper surface of the mounting substrate, and is characterized in that: a plug mounting portion is provided on the mounting substrate The upper surface is mounted with the plug; and the optical coupling portion is disposed on the structure substrate with the optical element interposed therebetween, and the optical axis of the optical fiber is aligned with the optical axis of the optical element by reflection.

本發明一形態之插座,具備:複數個該定位構件;複數個該光元件;以及該構裝基板;該定位構件係分別對各光元件設置。A socket according to an aspect of the present invention includes: a plurality of the positioning members; a plurality of the optical elements; and the mounting substrate; the positioning members are respectively provided for the respective optical elements.

本發明一形態之光傳送模組,具備:該定位構件;該光元件;該構裝基板;該光纖;以及該插頭。An optical transmission module according to an aspect of the present invention includes: the positioning member; the optical element; the mounting substrate; the optical fiber; and the plug.

在本發明一形態之定位構件、具備該定位構件之插座及光傳送模組,定位構件之插頭載置部與光元件一起設在構裝基板之上表面。亦即,定位構件之插頭載置部,並非如專利文獻1記載之光連接器用插槽500 般設在光元件之上,而是與光元件設在相同面上。是以,具備本發明一形態之定位構件之插座及光傳送模組之高度,沒有使插頭本身之高度變低,亦即,在確保該插頭之強度之狀態下,能較使用光連接器用插槽500之插座及光傳送模組低。In the positioning member according to the aspect of the invention, the socket and the optical transmission module including the positioning member, the plug mounting portion of the positioning member is provided on the upper surface of the mounting substrate together with the optical element. In other words, the plug mounting portion of the positioning member is not the optical connector slot 500 described in Patent Document 1. Generally, it is disposed above the optical element, but is disposed on the same surface as the optical element. Therefore, the height of the socket and the optical transmission module having the positioning member according to the aspect of the present invention does not lower the height of the plug itself, that is, the optical connector can be used in a state where the strength of the plug is ensured. The socket of the slot 500 and the optical transmission module are low.

根據本發明一形態之定位構件、插座及光傳送模組,可確保設在光纖一端之插頭之強度並同時謀求連接該插頭之插座或光模組之低高度化。According to the positioning member, the socket, and the optical transmission module of one aspect of the present invention, the strength of the plug provided at one end of the optical fiber can be ensured, and at the same time, the height of the socket or the optical module to which the plug is connected can be lowered.

G1,G2,G3,G4‧‧‧槽G1, G2, G3, G4‧‧‧ slots

h1~h6‧‧‧高度H1~h6‧‧‧height

10,10A‧‧‧光傳送模組10,10A‧‧‧Optical transmission module

20,20A‧‧‧插座20,20A‧‧‧ socket

40‧‧‧插頭40‧‧‧ plug

50‧‧‧受光元件陣列(光元件)50‧‧‧Light-receiving element array (optical component)

60‧‧‧光纖60‧‧‧ fiber

100‧‧‧發光元件陣列(光元件)100‧‧‧Lighting element array (optical components)

200,200A,200B‧‧‧定位構件200,200A,200B‧‧‧ positioning member

222,242‧‧‧插頭載置部222, 242 ‧ ‧ plug placement

224,244‧‧‧光耦合部224,244‧‧‧Photocoupler

圖1係具備一實施形態之定位構件之光傳送模組之外觀立體圖。Fig. 1 is a perspective view showing the appearance of an optical transmission module having a positioning member according to an embodiment.

圖2係插座之分解立體圖。Figure 2 is an exploded perspective view of the socket.

圖3係從插座移除金屬罩及定位構件之外觀立體圖。Figure 3 is an external perspective view of the metal cover and the positioning member removed from the socket.

圖4係從插座移除金屬罩之狀態之外觀立體圖。Fig. 4 is an external perspective view showing a state in which a metal cover is removed from a socket.

圖5係定位構件之外觀立體圖。Fig. 5 is a perspective view showing the appearance of a positioning member.

圖6係從z軸方向之負方向側俯視定位構件之圖。Fig. 6 is a plan view of the positioning member taken from the negative side in the z-axis direction.

圖7係在圖5記載之定位構件之C-C或D-D剖面追加構裝基板及插頭之圖。Fig. 7 is a view showing a C-C or D-D cross-section additional structure substrate and a plug of the positioning member shown in Fig. 5.

圖8係金屬罩之外觀立體圖。Fig. 8 is a perspective view showing the appearance of a metal cover.

圖9係光纖連接元件之外觀立體圖。Fig. 9 is a perspective view showing the appearance of an optical fiber connecting member.

圖10係從z軸方向之負方向側俯視插頭之圖。Fig. 10 is a plan view of the plug from the negative side in the z-axis direction.

圖11係插座之製程之圖。Figure 11 is a diagram of the process of the socket.

圖12係第1變形例之定位構件之剖面圖。Fig. 12 is a cross-sectional view showing a positioning member of a first modification.

圖13係第2變形例之定位構件之外觀立體圖。Fig. 13 is a perspective view showing the appearance of a positioning member according to a second modification.

圖14係載置於第2變形例之定位構件之插頭之外觀立體圖。Fig. 14 is a perspective view showing the appearance of a plug placed on the positioning member of the second modification.

圖15係與專利文獻1記載之光連接器用插槽同種之光連接器用插槽之剖面圖。FIG. 15 is a cross-sectional view of the optical connector slot of the same type as the optical connector slot described in Patent Document 1.

以下,說明具備一實施形態之定位構件之光傳送模組及其製造方法。Hereinafter, an optical transmission module including a positioning member according to an embodiment and a method of manufacturing the same will be described.

(光傳送模組之構成,參照圖1~圖3)(The structure of the optical transmission module, see Fig. 1 to Fig. 3)

以下,參照圖式說明具備一實施形態之定位構件之光傳送模組之構成。此外,將光傳送模組10之上下方向定義成z軸方向,將從z軸方向俯視時沿著光傳送模組10之長邊之方向定義成x軸方向。再者,將沿著光傳送模組10之短邊之方向定義成y軸方向。x軸、y軸及z軸彼此正交。Hereinafter, a configuration of an optical transmission module including a positioning member according to an embodiment will be described with reference to the drawings. Further, the upper and lower directions of the optical transmission module 10 are defined as the z-axis direction, and the direction along the long side of the optical transmission module 10 when viewed from the z-axis direction is defined as the x-axis direction. Furthermore, the direction along the short side of the light transmission module 10 is defined as the y-axis direction. The x-axis, the y-axis, and the z-axis are orthogonal to each other.

光傳送模組10,如圖1所示,具備插座20及光纖連接元件70。As shown in FIG. 1, the optical transmission module 10 includes a socket 20 and an optical fiber connecting element 70.

插座20,如圖2所示,具備金屬罩30、受光元件陣列50、發光元件陣列100、定位構件200、構裝基板22、密封樹脂24及驅動電路26。As shown in FIG. 2, the socket 20 includes a metal cover 30, a light receiving element array 50, a light emitting element array 100, a positioning member 200, a build substrate 22, a sealing resin 24, and a drive circuit 26.

構裝基板22,如圖3所示,從z軸方向俯視時,呈矩形狀。又,在構裝基板22之z軸方向之負方向側之面(以下,稱為下表面)設有將光傳送模組10構裝在電路基板時與電路基板之焊墊接觸之表面構裝用電極E1(圖3中未圖示)。As shown in FIG. 3, the package substrate 22 has a rectangular shape when viewed in plan from the z-axis direction. Further, a surface on the negative side in the z-axis direction of the package substrate 22 (hereinafter referred to as a lower surface) is provided with a surface mount which is in contact with the pads of the circuit board when the optical transfer module 10 is mounted on the circuit board. Electrode E1 (not shown in Fig. 3) is used.

在構裝基板22之z軸方向之正方向側之面(以下,稱為上表 面),在位於x軸方向之負方向側之邊L1與位於y軸方向之負方向側之邊L2構成之角之附近設有設在構裝基板22內之接地導體之一部分露出之接地導體露出部E2。接地導體露出部E2,從z軸方向之正方向側俯視時,呈以x軸方向為長邊之長方形狀。The surface on the positive side in the z-axis direction of the package substrate 22 (hereinafter, referred to as the above table) In the vicinity of the corner formed by the side L1 on the negative side in the x-axis direction and the side L2 on the negative side in the y-axis direction, a ground conductor partially exposed in one of the ground conductors in the package substrate 22 is provided. The portion E2 is exposed. The ground conductor exposed portion E2 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.

再者,在構裝基板22之上表面,在位於x軸方向之負方向側之邊L1與位於y軸方向之正方向側之邊L3構成之角之附近設有設在構裝基板22內之接地導體之一部分露出之接地導體露出部E3。接地導體露出部E3,從z軸方向之正方向側俯視時,呈以x軸方向為長邊之長方形狀。Further, the upper surface of the package substrate 22 is provided in the package substrate 22 in the vicinity of the corner formed by the side L1 on the negative side in the x-axis direction and the side L3 on the positive side in the y-axis direction. The ground conductor exposed portion E3 is partially exposed to one of the ground conductors. The ground conductor exposed portion E3 has a rectangular shape with a long side in the x-axis direction when viewed from the positive side in the z-axis direction.

受光元件陣列50及發光元件陣列100係設在構裝基板22之上表面之x軸方向之正方向側之部分。受光元件陣列50為包含將光訊號轉換成電氣訊號之複數個光二極體之元件。發光元件陣列100為包含將電氣訊號轉換成光訊號之複數個二極體之元件。The light-receiving element array 50 and the light-emitting element array 100 are provided on a portion of the upper surface of the upper surface of the package substrate 22 on the positive side in the x-axis direction. The light-receiving element array 50 is an element including a plurality of photodiodes that convert optical signals into electrical signals. The light emitting element array 100 is an element including a plurality of diodes that convert electrical signals into optical signals.

又,驅動電路26,在構裝基板22表面之x軸方向之正方向側之部分,設在較受光元件陣列50及發光元件陣列100更靠x軸方向之正方向側。驅動電路26為用以驅動受光元件陣列50及發光元件陣列100之半導體電路元件。Further, the drive circuit 26 is provided on the positive side in the x-axis direction of the light-receiving element array 50 and the light-emitting element array 100 on the positive side in the x-axis direction of the surface of the package substrate 22. The drive circuit 26 is a semiconductor circuit element for driving the light-receiving element array 50 and the light-emitting element array 100.

又,驅動電路26,如圖3所示,從z軸方向俯視時,呈具有與y軸方向平行之長邊之矩形狀。驅動電路26與受光元件陣列50係透過引線U藉由引線接合連接。又,驅動電路26與發光元件陣列100係透過引線U藉由引線接合連接。藉此,來自驅動電路26之電氣訊號透過引線U傳送至發光元件陣列100,來自受光元件陣列50之電氣訊號透過引線U傳送至驅動電路26。又,驅動電路26與構裝基板22係透過引線U藉由引線接 合連接。Moreover, as shown in FIG. 3, the drive circuit 26 has a rectangular shape having a long side parallel to the y-axis direction when viewed in plan from the z-axis direction. The drive circuit 26 and the light-receiving element array 50 are connected by wire bonding through the lead wires U. Further, the drive circuit 26 and the light-emitting element array 100 are connected by wire bonding via the lead wires U. Thereby, the electrical signal from the driving circuit 26 is transmitted to the light emitting element array 100 through the lead U, and the electrical signal from the light receiving element array 50 is transmitted to the driving circuit 26 through the lead U. Moreover, the driving circuit 26 and the package substrate 22 are connected by the lead wires through the leads Connected.

密封樹脂24,如圖3所示,具備密封部24a及腳部24b~24e,由環氧樹脂等透明樹脂構成。密封部24a呈大致長方體狀,設在構裝基板22上表面之x軸方向之正方向側之部分。此外,密封部24a覆蓋受光元件陣列50、發光元件陣列100及驅動電路26。As shown in FIG. 3, the sealing resin 24 is provided with a sealing portion 24a and leg portions 24b to 24e, and is made of a transparent resin such as epoxy resin. The sealing portion 24a has a substantially rectangular parallelepiped shape and is provided on a portion of the upper surface of the mounting substrate 22 on the positive side in the x-axis direction. Further, the sealing portion 24a covers the light receiving element array 50, the light emitting element array 100, and the drive circuit 26.

腳部24b,24c以從x軸方向之負方向側往正方向側依序排列之方式相隔間隔設置。腳部24b,24c為從密封部24a之y軸方向之負方向側之面朝向構裝基板22之邊L2突出之長方體狀之構件。又,在腳部24b與腳部24c之間設有後述金屬罩30之凸部C3嵌入之空間H1。The leg portions 24b and 24c are arranged at intervals from the negative side to the positive side in the x-axis direction. The leg portions 24b and 24c are rectangular parallelepiped members that protrude from the surface on the negative side in the y-axis direction of the sealing portion 24a toward the side L2 of the package substrate 22. Further, a space H1 in which the convex portion C3 of the metal cover 30 to be described later is fitted is provided between the leg portion 24b and the leg portion 24c.

腳部24d,24e以從x軸方向之負方向側往正方向側依序排列之方式相隔間隔設置。腳部24d,24e為從密封部24a之y軸方向之正方向側之面朝向構裝基板22之邊L3突出之長方體狀之構件。又,在腳部24d與腳部24e之間設有後述金屬罩30之凸部C6嵌入之空間H2。The leg portions 24d, 24e are arranged at intervals from the negative side to the positive side in the x-axis direction. The leg portions 24d and 24e are members having a rectangular parallelepiped shape that protrudes from the surface on the positive side in the y-axis direction of the sealing portion 24a toward the side L3 of the package substrate 22. Further, a space H2 in which the convex portion C6 of the metal cover 30 to be described later is fitted is provided between the leg portion 24d and the leg portion 24e.

(定位構件之構成,參照圖4~圖7)(Configuration of positioning member, see Figures 4 to 7)

接著,參照圖式說明定位構件200。Next, the positioning member 200 will be described with reference to the drawings.

定位構件200,如圖4所示,以覆蓋構裝基板22上表面及密封樹脂24之大致整體之方式橫跨設在構裝基板22及密封樹脂24。又,定位構件200具備發光元件用之定位構件220與受光元件用之定位構件240。亦即,定位構件220,240分別對各光元件設置。定位構件220,240係以從y軸方向之負方向側朝向正方向側依序排列之方式設置。此外,定位構件200係藉由例如環氧系或耐隆系之樹脂構成。As shown in FIG. 4, the positioning member 200 is provided over the entire surface of the mounting substrate 22 and the sealing resin 24 so as to straddle the mounting substrate 22 and the sealing resin 24. Further, the positioning member 200 includes a positioning member 220 for a light-emitting element and a positioning member 240 for a light-receiving element. That is, the positioning members 220, 240 are respectively disposed for the respective optical elements. The positioning members 220 and 240 are disposed to be sequentially arranged from the negative side to the positive side in the y-axis direction. Further, the positioning member 200 is made of, for example, an epoxy-based or an anti-loning resin.

發光元件用之定位構件220,從z軸方向俯視時,呈矩形狀。 再者,定位構件220,如圖5所示,具備插頭載置部222與光耦合部224。The positioning member 220 for a light-emitting element has a rectangular shape when viewed in plan from the z-axis direction. Further, as shown in FIG. 5, the positioning member 220 includes a plug mounting portion 222 and a light coupling portion 224.

插頭載置部222為載置設在光纖60端部之插頭42之部分且構成定位構件220之x軸方向之負方向側之部分。又,插頭載置部222,如圖6所示,為從z軸方向俯視時呈矩形狀之板狀構件。再者,插頭載置部222,如圖7所示,位於構裝基板22之上表面。此外,關於插頭42之詳細將於後述。The plug mounting portion 222 is a portion on which the plug 42 provided at the end of the optical fiber 60 is placed and constitutes the negative direction side of the x-axis direction of the positioning member 220. Moreover, as shown in FIG. 6, the plug mounting part 222 is a plate-shaped member which has a rectangular shape in planar view from the z-axis direction. Further, as shown in FIG. 7, the plug mounting portion 222 is located on the upper surface of the package substrate 22. Further, the details of the plug 42 will be described later.

又,在插頭載置部222之上表面之y軸方向之大致中央,如圖5所示,設有沿著將插頭42朝向光耦合部224壓入時之插入方向、亦即本實施例之x軸方向之槽G1。此外,在插頭載置部222,將較槽G1靠y軸方向之負方向側之部分稱為平坦部F1,將較槽G1靠y軸方向之正方向側之部分稱為平坦部F2。從構裝基板22之上表面至插頭42之下表面接觸之插頭載置部222之上表面之高度h1,如圖7所示,較從構裝基板22之上表面至密封樹脂24之上表面之高度h2低。Further, in the approximate center of the upper surface of the plug mounting portion 222 in the y-axis direction, as shown in FIG. 5, the insertion direction when the plug 42 is pressed toward the optical coupling portion 224 is provided, that is, the embodiment. Groove G1 in the x-axis direction. In the plug mounting portion 222, a portion on the negative side in the y-axis direction of the groove G1 is referred to as a flat portion F1, and a portion on the positive side in the y-axis direction from the groove G1 is referred to as a flat portion F2. The height h1 from the upper surface of the package substrate 22 to the upper surface of the plug mounting portion 222 which is in contact with the lower surface of the plug 42, as shown in Fig. 7, is from the upper surface of the package substrate 22 to the upper surface of the sealing resin 24. The height h2 is low.

光耦合部224,如圖5所示,構成定位構件220之x軸方向之正方向側之部分。光耦合部224之下表面較插頭載置部222之下表面位於z軸方向之正方向側。又,光耦合部224,如圖7所示,夾著發光元件陣列100載置於構裝基板22上之密封樹脂24上。As shown in FIG. 5, the optical coupling portion 224 constitutes a portion of the positioning member 220 on the positive side in the x-axis direction. The lower surface of the optical coupling portion 224 is located on the positive side in the z-axis direction from the lower surface of the plug mounting portion 222. Further, as shown in FIG. 7, the optical coupling unit 224 is placed on the sealing resin 24 on the package substrate 22 with the light-emitting element array 100 interposed therebetween.

再者,光耦合部224,如圖5所示,具有本體226及抵接部228。本體226呈長方體狀。抵接部228從本體226之x軸方向之負方向側之端面S2沿著插頭載置部222之平坦部F1突出至平坦部F1之x軸方向之大致中央。藉此,光耦合部224從z軸方向俯視時呈L字型。此外,將抵接部228之x軸方向之負方向側之端面稱為端面S3。又,在光耦合部224 設有凹部D1及凸透鏡230。Further, as shown in FIG. 5, the optical coupling portion 224 has a main body 226 and a contact portion 228. The body 226 has a rectangular parallelepiped shape. The contact portion 228 protrudes from the flat surface portion F2 of the plug mounting portion 222 from the end surface S2 of the main body 226 on the negative side in the x-axis direction to substantially the center of the flat portion F1 in the x-axis direction. Thereby, the optical coupling unit 224 has an L shape when viewed in plan from the z-axis direction. Further, an end surface of the contact portion 228 on the negative side in the x-axis direction is referred to as an end surface S3. Also, in the optical coupling portion 224 A recess D1 and a convex lens 230 are provided.

凹部D1係設在光耦合部224之y軸方向之正方向側之邊L4附近。又,凹部D1,從z軸方向俯視時,與發光元件陣列100之光軸重疊。再者,凹部D1,從x軸方向俯視時,與連接於插頭42之光纖60之光軸重疊。此外,發光元件陣列100之光軸與z軸方向平行,光纖60之光軸與x軸平行。又,凹部D1從z軸方向俯視時呈矩形狀。再者,凹部D1,如圖7所示,從y軸方向俯視時呈V字型。The concave portion D1 is provided in the vicinity of the side L4 on the positive side in the y-axis direction of the optical coupling portion 224. Moreover, the recessed portion D1 overlaps with the optical axis of the light-emitting element array 100 when viewed in plan from the z-axis direction. Further, the concave portion D1 overlaps with the optical axis of the optical fiber 60 connected to the plug 42 when viewed in plan from the x-axis direction. Further, the optical axis of the light-emitting element array 100 is parallel to the z-axis direction, and the optical axis of the optical fiber 60 is parallel to the x-axis. Moreover, the recessed portion D1 has a rectangular shape when viewed in plan from the z-axis direction. Further, as shown in FIG. 7, the concave portion D1 has a V shape when viewed from the y-axis direction.

凹部D1之x軸方向之負方向側之內周面為全反射面R1。全反射面R1與y軸平行,從y軸方向之負方向側俯視時相對於z軸逆時針傾斜45°。又,定位構件200之折射率充分地大於空氣。是以,從發光元件陣列100往z軸方向之正方向側射出之雷射束B1,沿著發光元件陣列100之光軸射入光耦合部224,藉由全反射面R1往與光纖60之光軸平行之x軸方向之負方向側全反射,透過插頭40往光纖60行進。亦即,定位構件220,藉由反射使發光元件陣列100與光纖60之光軸一致,藉此使光纖60與發光元件陣列100光學耦合。此外,若從y軸方向俯視雷射束B1之光跡,則從發光元件陣列100射出之雷射束B1之光軸與全反射面R1之夾角為45°,朝向光纖60之雷射束B1之光軸與全反射面R1之夾角為45°。亦即,全反射面R1與光纖60之光軸構成之角度與全反射面R1與發光元件陣列100構成之角度相等。The inner peripheral surface of the concave portion D1 on the negative side in the x-axis direction is the total reflection surface R1. The total reflection surface R1 is parallel to the y-axis, and is inclined counterclockwise by 45° with respect to the z-axis when viewed from the negative side in the y-axis direction. Also, the refractive index of the positioning member 200 is sufficiently larger than air. Therefore, the laser beam B1 emitted from the light-emitting element array 100 toward the positive side in the z-axis direction enters the optical coupling portion 224 along the optical axis of the light-emitting element array 100, and passes through the total reflection surface R1 to the optical fiber 60. The optical axis is totally reflected on the negative side in the x-axis direction, and travels through the plug 40 to the optical fiber 60. That is, the positioning member 220 optically couples the light-emitting element array 100 with the optical axis of the optical fiber 60 by reflection, thereby optically coupling the optical fiber 60 to the light-emitting element array 100. Further, when the light trace of the laser beam B1 is viewed from the y-axis direction, the angle between the optical axis of the laser beam B1 emitted from the light-emitting element array 100 and the total reflection surface R1 is 45°, and the laser beam B1 toward the optical fiber 60 The angle between the optical axis and the total reflection surface R1 is 45°. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the light-emitting element array 100.

凸透鏡230,如圖6及圖7所示,設在光耦合部224之下表面。又,凸透鏡230,從z軸方向俯視時與發光元件陣列100重疊。藉此,凸透鏡230與發光元件陣列100對向,位於雷射束B1之光路上。又,凸透 鏡230,從與z軸正交之方向俯視時,呈朝向z軸之負方向側突出之半圓狀。是以,從發光元件陣列100射出之雷射束B1藉由凸透鏡230聚光或準直,射向全反射面R1。The convex lens 230 is provided on the lower surface of the light coupling portion 224 as shown in FIGS. 6 and 7 . Further, the convex lens 230 overlaps with the light-emitting element array 100 when viewed in plan from the z-axis direction. Thereby, the convex lens 230 opposes the light-emitting element array 100 and is located on the optical path of the laser beam B1. Again The mirror 230 has a semicircular shape that protrudes toward the negative side of the z-axis when viewed from a direction orthogonal to the z-axis. Therefore, the laser beam B1 emitted from the light-emitting element array 100 is condensed or collimated by the convex lens 230, and is incident on the total reflection surface R1.

受光元件用之定位構件240,從z軸方向俯視時,呈矩形狀。再者,定位構件240,如圖5所示,具備插頭載置部242與光耦合部244。The positioning member 240 for the light receiving element has a rectangular shape when viewed in plan from the z-axis direction. Further, as shown in FIG. 5, the positioning member 240 includes a plug mounting portion 242 and a light coupling portion 244.

插頭載置部242為載置設在光纖60端部之插頭46之部分且構成定位構件240之x軸方向之負方向側之部分。又,插頭載置部242,如圖6所示,為從z軸方向俯視時呈矩形狀之板狀構件。再者,插頭載置部242,如圖7所示,位於構裝基板22之上表面。此外,關於插頭46之詳細將於後述。The plug mounting portion 242 is a portion on which the plug 46 provided at the end of the optical fiber 60 is placed and constitutes the negative direction side of the x-axis direction of the positioning member 240. Further, as shown in FIG. 6, the plug mounting portion 242 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Further, as shown in FIG. 7, the plug mounting portion 242 is located on the upper surface of the package substrate 22. Further, the details of the plug 46 will be described later.

又,在插頭載置部242之上表面之y軸方向之大致中央,如圖5所示,設有沿著將插頭46朝向光耦合部244壓入時之插入方向、亦即本實施例之x軸方向之槽G2。此外,在插頭載置部242,將較槽G2靠y軸方向之負方向側之部分稱為平坦部F3,將較槽G2靠y軸方向之正方向側之部分稱為平坦部F4。從構裝基板22之上表面至插頭46之下表面接觸之插頭載置部242之上表面之高度h3,如圖7所示,較從構裝基板22之上表面至密封樹脂24之上表面之高度h2低。Further, in the approximate center of the upper surface of the plug mounting portion 242 in the y-axis direction, as shown in FIG. 5, the insertion direction when the plug 46 is pressed toward the optical coupling portion 244 is provided, that is, the embodiment. Groove G2 in the x-axis direction. In the plug mounting portion 242, a portion on the negative side in the y-axis direction of the groove G2 is referred to as a flat portion F3, and a portion on the positive side in the y-axis direction from the groove G2 is referred to as a flat portion F4. The height h3 from the upper surface of the package substrate 22 to the upper surface of the plug mounting portion 242 which is in contact with the lower surface of the plug 46 is larger than the upper surface of the package substrate 22 to the upper surface of the sealing resin 24 as shown in FIG. The height h2 is low.

光耦合部244,如圖5所示,構成定位構件240之x軸方向之正方向側之部分。光耦合部244之下表面較插頭載置部242之下表面位於z軸方向之正方向側。又,光耦合部244,如圖7所示,夾著受光元件陣列50載置於構裝基板22上之密封樹脂24上。As shown in FIG. 5, the optical coupling portion 244 constitutes a portion of the positioning member 240 on the positive side in the x-axis direction. The lower surface of the optical coupling portion 244 is located on the positive side in the z-axis direction from the lower surface of the plug mounting portion 242. Moreover, as shown in FIG. 7, the optical coupling unit 244 is placed on the sealing resin 24 placed on the package substrate 22 with the light receiving element array 50 interposed therebetween.

再者,光耦合部244具有本體246及抵接部248。本體246 呈長方體狀。抵接部248從本體246之x軸方向之負方向側之端面S5沿著插頭導引部242之平坦部F4突出至平坦部F4之x軸方向之大致中央。藉此,光耦合部244從z軸方向俯視時呈L字型。此外,將抵接部248之x軸方向之負方向側之端面稱為端面S6。又,在光耦合部244設有凹部D2及凸透鏡250。Furthermore, the optical coupling portion 244 has a body 246 and an abutting portion 248. Ontology 246 It has a rectangular parallelepiped shape. The abutting portion 248 protrudes from the flat surface portion S5 of the plug guide portion 242 from the end surface S5 on the negative side in the x-axis direction of the main body 246 to substantially the center of the flat portion F4 in the x-axis direction. Thereby, the light coupling portion 244 has an L shape when viewed in plan from the z-axis direction. Further, an end surface of the contact portion 248 on the negative side in the x-axis direction is referred to as an end surface S6. Further, the light coupling portion 244 is provided with a concave portion D2 and a convex lens 250.

凹部D2係設在光耦合部244之y軸方向之正方向側之邊L5附近。又,凹部D2,從z軸方向俯視時,與受光元件陣列50重疊。再者,凹部D2,從x軸方向俯視時,與連接於插頭46之光纖60之光軸重疊。此外,受光元件陣列50之光軸與z軸方向平行。又,凹部D2從z軸方向俯視時呈矩形狀。再者,凹部D2,如圖7所示,從y軸方向俯視時呈V字型。The concave portion D2 is provided in the vicinity of the side L5 on the positive side in the y-axis direction of the optical coupling portion 244. Moreover, the concave portion D2 overlaps with the light receiving element array 50 when viewed in plan from the z-axis direction. Further, the recessed portion D2 overlaps with the optical axis of the optical fiber 60 connected to the plug 46 when viewed in plan from the x-axis direction. Further, the optical axis of the light receiving element array 50 is parallel to the z-axis direction. Further, the concave portion D2 has a rectangular shape when viewed in plan from the z-axis direction. Further, as shown in FIG. 7, the concave portion D2 has a V shape when viewed from the y-axis direction.

凹部D2之x軸方向之負方向側之內周面為全反射面R2。全反射面R2與y軸平行,從y軸方向之負方向側俯視時相對於z軸逆時針傾斜45°。又,定位構件200之折射率充分地大於空氣。是以,從光纖60往x軸方向之正方向側射出之雷射束B2,沿著光纖60之光軸射入光耦合部244,藉由全反射面R2往與受光元件陣列50之光軸平行之z軸方向之負方向側全反射,透過密封樹脂24往受光元件陣列50行進。亦即,定位構件240,藉由反射使受光元件陣列50與光纖60之光軸一致,藉此使光纖60與受光元件陣列50光學耦合。此外,若從y軸方向俯視雷射束B2之光跡,則從光纖60射出之雷射束B2之光軸與全反射面R2之夾角為45°,朝向受光元件陣列50之雷射束B2之光軸與全反射面R2之夾角為45°。亦即,全反射面R2與光纖60之光軸構成之角度與全反射面R2與受光元件陣列50構成之角度相等。The inner peripheral surface of the concave portion D2 on the negative side in the x-axis direction is the total reflection surface R2. The total reflection surface R2 is parallel to the y-axis, and is inclined counterclockwise by 45° with respect to the z-axis when viewed from the negative side in the y-axis direction. Also, the refractive index of the positioning member 200 is sufficiently larger than air. Therefore, the laser beam B2 emitted from the optical fiber 60 toward the positive side in the x-axis direction enters the optical coupling portion 244 along the optical axis of the optical fiber 60, and passes through the total reflection surface R2 to the optical axis of the light receiving element array 50. The negative side of the parallel z-axis direction is totally reflected, and travels through the sealing resin 24 to the light-receiving element array 50. That is, the positioning member 240 optically couples the optical fiber 60 to the light receiving element array 50 by causing the light receiving element array 50 to coincide with the optical axis of the optical fiber 60 by reflection. Further, when the light beam of the laser beam B2 is viewed from the y-axis direction, the angle between the optical axis of the laser beam B2 emitted from the optical fiber 60 and the total reflection surface R2 is 45°, and the laser beam B2 toward the light receiving element array 50 The angle between the optical axis and the total reflection surface R2 is 45°. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the light receiving element array 50.

凸透鏡250,如圖6及圖7所示,設在光耦合部244之下表面。又,凸透鏡250,從z軸方向俯視時與受光元件陣列50重疊。藉此,凸透鏡250與受光元件陣列50對向,位於雷射束B2之光路上。又,凸透鏡250,從與z軸正交之方向俯視時,呈朝向z軸之負方向側突出之半圓狀。是以,從光纖60射出之雷射束B2被全反射面R2反射後,藉由凸透鏡250聚光或準直,射向受光元件陣列50。The convex lens 250 is provided on the lower surface of the light coupling portion 244 as shown in FIGS. 6 and 7 . Further, the convex lens 250 is overlapped with the light receiving element array 50 when viewed in plan from the z-axis direction. Thereby, the convex lens 250 faces the light-receiving element array 50 and is located on the optical path of the laser beam B2. Further, the convex lens 250 has a semicircular shape that protrudes toward the negative side of the z-axis when viewed from a direction orthogonal to the z-axis. Therefore, the laser beam B2 emitted from the optical fiber 60 is reflected by the total reflection surface R2, and then condensed or collimated by the convex lens 250 to be incident on the light receiving element array 50.

(金屬罩之構成,參照圖1及圖8)(The structure of the metal cover, see Fig. 1 and Fig. 8)

接著,參照圖式說明金屬罩30。Next, the metal cover 30 will be described with reference to the drawings.

金屬罩30係一片金屬板(例如,SUS301)折曲成字型而製作。又,金屬罩30,如圖1所示,從z軸方向之正方向側以及y軸方向之正方向側及y軸方向之負方向側覆蓋定位構件200。此外,在插座20之x軸方向之負方向側形成有後述插頭40插入之開口部A3。The metal cover 30 is a piece of metal plate (for example, SUS301) bent into Made with fonts. Further, as shown in FIG. 1, the metal cover 30 covers the positioning member 200 from the positive side in the z-axis direction and the positive side in the y-axis direction and the negative side in the y-axis direction. Further, an opening A3 into which the plug 40 to be described later is inserted is formed on the negative side in the x-axis direction of the socket 20.

金屬罩30,如圖8所示,包含頂板部32及側板部34,36。頂板部32與相對於z軸正交之面平行,呈矩形狀。側板部34,係金屬罩30從頂板部32之y軸方向之負方向側之長邊L6往z軸方向之負方向側折曲而形成。側板部36,係金屬罩30從頂板部32之y軸方向之正方向側之長邊L7往z軸方向之負方向側折曲而形成。As shown in FIG. 8, the metal cover 30 includes a top plate portion 32 and side plate portions 34, 36. The top plate portion 32 is parallel to the surface orthogonal to the z-axis and has a rectangular shape. The side plate portion 34 is formed by bending the metal cover 30 from the long side L6 on the negative side in the y-axis direction of the top plate portion 32 to the negative side in the z-axis direction. The side plate portion 36 is formed by bending the metal cover 30 from the long side L7 on the positive side in the y-axis direction of the top plate portion 32 to the negative side in the z-axis direction.

在頂板部32之x軸方向之負方向側之部分設有用以將插頭40固定在插座20之卡合部32a,32b。卡合部32a,32b從y軸方向之負方向側朝向正方向側依序排列設置。At the portion on the negative side in the x-axis direction of the top plate portion 32, engaging portions 32a, 32b for fixing the plug 40 to the socket 20 are provided. The engaging portions 32a and 32b are arranged in order from the negative side in the y-axis direction toward the positive side.

卡合部32a,32b係藉由在頂板部32切入字型缺口而形成。具體而言,卡合部32a,32b係藉由在頂板部32切入往x軸方向之正方 向側開口之字型缺口且使字型缺口所包圍之部分往z軸方向之負方向側凹陷彎曲而形成。藉此,卡合部32a,32b,從y軸方向俯視時,呈往z軸方向之負方向側突出之V字型之形狀。The engaging portions 32a, 32b are cut in by the top plate portion 32. Formed by a glyph. Specifically, the engaging portions 32a and 32b are opened by the top plate portion 32 in the positive direction side in the x-axis direction. Font gap and make The portion surrounded by the notch is formed by being concavely curved toward the negative side in the z-axis direction. Thereby, the engaging portions 32a and 32b have a V-shaped shape that protrudes toward the negative side in the z-axis direction when viewed in plan from the y-axis direction.

又,在頂板部32之x軸方向之負方向側之短邊L8設有用以將插頭40固定在插座20之卡合部32c,32d。卡合部32c,32d係從頂板部32往x軸方向之負方向側突出之金屬片。卡合部32c,32d,在卡合部32c,32d之x軸方向之大致中央之位置,往z軸方向之負方向側凹陷彎曲。藉此,卡合部32c,32d,從y軸方向俯視時,呈往z軸方向之負方向側突出之V字型之形狀。Further, the short sides L8 on the negative side in the x-axis direction of the top plate portion 32 are provided with engaging portions 32c, 32d for fixing the plug 40 to the socket 20. The engaging portions 32c and 32d are metal pieces that protrude from the top plate portion 32 toward the negative side in the x-axis direction. The engaging portions 32c and 32d are concavely curved toward the negative side in the z-axis direction at positions substantially at the center in the x-axis direction of the engaging portions 32c and 32d. Thereby, the engaging portions 32c and 32d have a V-shaped shape that protrudes toward the negative side in the z-axis direction when viewed in plan from the y-axis direction.

在側板部34之z軸方向之負方向側之長邊L9,朝向z軸方向之負方向側突出之凸部C1~C3從x軸方向之負方向側朝向正方向側依序排列設置。凸部C1~C3分別藉由接著劑與構裝基板22固定。此外,凸部C1與構裝基板22之接地導體露出部E2連接。又,凸部C3嵌入設在密封樹脂24之腳部24b與腳部24c之間之空間H1。藉此,金屬罩30相對於構裝基板22定位。In the long side L9 on the negative side in the z-axis direction of the side plate portion 34, the convex portions C1 to C3 projecting toward the negative side in the z-axis direction are arranged in order from the negative side toward the positive side in the x-axis direction. The convex portions C1 to C3 are fixed to the structural substrate 22 by an adhesive, respectively. Further, the convex portion C1 is connected to the ground conductor exposed portion E2 of the package substrate 22. Further, the convex portion C3 is fitted into the space H1 provided between the leg portion 24b of the sealing resin 24 and the leg portion 24c. Thereby, the metal cover 30 is positioned relative to the package substrate 22.

在側板部36之z軸方向之負方向側之長邊L10,朝向z軸方向之負方向側突出之凸部C4~C6從x軸方向之負方向側朝向正方向側依序排列設置。凸部C4~C6分別藉由接著劑與構裝基板22固定。此外,凸部C4與構裝基板22之接地導體露出部E3連接。又,凸部C6嵌入設在密封樹脂24之腳部24d與腳部24e之間之空間H2。藉此,金屬罩30相對於構裝基板22定位。In the long side L10 on the negative side in the z-axis direction of the side plate portion 36, the convex portions C4 to C6 projecting toward the negative side in the z-axis direction are arranged in order from the negative side in the x-axis direction toward the positive side. The convex portions C4 to C6 are fixed to the package substrate 22 by an adhesive, respectively. Further, the convex portion C4 is connected to the ground conductor exposed portion E3 of the package substrate 22. Further, the convex portion C6 is fitted into the space H2 provided between the leg portion 24d of the sealing resin 24 and the leg portion 24e. Thereby, the metal cover 30 is positioned relative to the package substrate 22.

(光纖連接元件之構成,參照圖9及圖10)(Configuration of optical fiber connecting element, see Figs. 9 and 10)

以下,參照圖式說明一實施形態之光纖連接元件70。光纖連接元件70具備光纖60與插頭40。Hereinafter, an optical fiber connecting element 70 according to an embodiment will be described with reference to the drawings. The optical fiber connecting element 70 is provided with an optical fiber 60 and a plug 40.

光纖60由芯線及覆蓋該芯線之被覆材構成,該芯線由芯部及包覆部構成。芯部由玻璃材構成,包覆部由玻璃材或在玻璃材被覆有氟系樹脂之構成所構成。再者,該被覆材由聚乙烯等樹脂構成。The optical fiber 60 is composed of a core wire and a covering material covering the core wire, and the core wire is composed of a core portion and a covering portion. The core portion is made of a glass material, and the coating portion is composed of a glass material or a glass material coated with a fluorine resin. Further, the covering material is made of a resin such as polyethylene.

在插頭40,如圖9所示,光纖60之端部插入。又,插頭40有送訊側插頭42及收訊側插頭46,雙方皆由環氧系或耐隆系樹脂等構成。At the plug 40, as shown in Fig. 9, the end of the optical fiber 60 is inserted. Further, the plug 40 has a transmitting side plug 42 and a receiving side plug 46, and both of them are made of an epoxy-based or an anti-loning resin.

送訊側插頭42係用於將光纖60固定在定位構件220。又,送訊側插頭42具備光纖插入部42a及突起部42b。The signal transmitting side plug 42 is for fixing the optical fiber 60 to the positioning member 220. Moreover, the transmission side plug 42 is provided with the optical fiber insertion part 42a and the protrusion part 42b.

光纖插入部42a構成送訊側插頭42之y軸方向之正方向側之部分,呈往x軸方向延伸之長方體狀。在光纖插入部42a之x軸方向之負方向側之部分設有開口部A1。開口部A1注入用以固定光纖60之樹脂。The optical fiber insertion portion 42a constitutes a portion on the positive side in the y-axis direction of the transmitting-side plug 42, and has a rectangular parallelepiped shape extending in the x-axis direction. An opening A1 is provided in a portion of the optical fiber insertion portion 42a on the negative side in the x-axis direction. The opening A1 is filled with a resin for fixing the optical fiber 60.

開口部A1係藉由切開位於光纖插入部42a上表面之面S7及x軸方向之負方向側之端面S8而形成。又,在開口部A1之x軸方向之正方向側之內周面設有用以將插入之光纖60之芯線導至送訊側插頭42前端之插入口H7。此外,插入口H7與光纖60之條數對應,本實施形態中為二個。The opening A1 is formed by cutting the surface S7 located on the upper surface of the optical fiber insertion portion 42a and the end surface S8 on the negative side in the x-axis direction. Further, an inner peripheral surface on the positive side in the x-axis direction of the opening A1 is provided with an insertion port H7 for guiding the core of the inserted optical fiber 60 to the front end of the transmitting-side plug 42. Further, the number of insertion ports H7 corresponds to the number of the optical fibers 60, and is two in the present embodiment.

再者,在光纖插入部42a之x軸方向之正方向側之部分設有用以注入匹配劑之凹部D3。匹配劑係使光纖60與送訊側插頭42之間之折射率匹配,減輕光之折射作用之透明樹脂。又,凹部D3從光纖插入部42a之上表面朝向下表面凹陷。Further, a concave portion D3 for injecting a matching agent is provided in a portion of the optical fiber insertion portion 42a on the positive side in the x-axis direction. The matching agent is a transparent resin that matches the refractive index between the optical fiber 60 and the transmitting side plug 42 to reduce the refraction of light. Further, the concave portion D3 is recessed from the upper surface of the optical fiber insertion portion 42a toward the lower surface.

在凹部D3之x軸方向之負方向側之內周面設有插入口H7。 插入口H7與開口部A1之x軸方向之正方向側之內周面連接。是以,光纖60之芯線通過插入口H7從開口部A1到達凹部D3。到達凹部D3之光纖60之芯線之端面位於極為接近凹部D3之x軸方向之正方向側之內周面S9之處。此外,藉由將透明樹脂所構成之匹配劑、例如環氧系樹脂注入開口部A1及凹部D3,光纖60固定於送訊側插頭42。此外,光纖60之芯線之端面未與內周面S9相接。其原因在於,設置吸收因溫度變動等產生之光纖60之伸縮之間隙,又,防止樹脂之白濁化或形狀變形導致之樹脂之透射率降低。An insertion port H7 is provided on the inner circumferential surface of the concave portion D3 on the negative side in the x-axis direction. The insertion port H7 is connected to the inner peripheral surface of the opening A1 on the positive side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the concave portion D3 from the opening portion A1 through the insertion port H7. The end surface of the core wire of the optical fiber 60 reaching the concave portion D3 is located at an inner circumferential surface S9 which is very close to the positive side in the x-axis direction of the concave portion D3. Further, the optical fiber 60 is fixed to the communication side plug 42 by injecting a matching agent made of a transparent resin, for example, an epoxy resin into the opening A1 and the recess D3. Further, the end face of the core of the optical fiber 60 is not in contact with the inner peripheral surface S9. This is because the gap between the expansion and contraction of the optical fiber 60 due to temperature fluctuation or the like is absorbed, and the transmittance of the resin due to whitening or shape deformation of the resin is prevented from being lowered.

在光纖插入部42a之x軸方向之正方向側之端面S10,如圖10所示,設有凸透鏡44。凸透鏡44,從與x軸方向正交之方向俯視時,呈往x軸方向之正方向側突出之半圓狀。藉此,從發光元件陣列100射出且被全反射面R1反射之雷射束B1藉由凸透鏡44聚光或準直。A convex lens 44 is provided on the end surface S10 of the optical fiber insertion portion 42a on the positive side in the x-axis direction as shown in FIG. The convex lens 44 has a semicircular shape that protrudes toward the positive side in the x-axis direction when viewed from a direction orthogonal to the x-axis direction. Thereby, the laser beam B1 emitted from the light-emitting element array 100 and reflected by the total reflection surface R1 is condensed or collimated by the convex lens 44.

又,凸透鏡44,從x軸方向俯視時,與光纖60之光軸重疊。是以,被凸透鏡44聚光或準直之雷射束B1通過光纖插入部42a之樹脂。此外,雷射束B1傳送至光纖60之芯線之芯部。Further, the convex lens 44 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Therefore, the laser beam B1 that is condensed or collimated by the convex lens 44 passes through the resin of the optical fiber insertion portion 42a. In addition, the laser beam B1 is transmitted to the core of the core of the optical fiber 60.

在光纖插入部42a之面S7,如圖9所示,設有與金屬罩30之卡合部32a卡合之突起N1。突起N1在x軸方向設在開口部A1與凹部D3之間,往y軸方向延伸。又,突起N1,從y軸方向俯視時,呈往z軸方向之正方向側突出之三角形狀。As shown in FIG. 9, the surface S7 of the optical fiber insertion portion 42a is provided with a projection N1 that engages with the engagement portion 32a of the metal cover 30. The projection N1 is provided between the opening A1 and the recess D3 in the x-axis direction and extends in the y-axis direction. Further, the projection N1 has a triangular shape that protrudes toward the positive side in the z-axis direction when viewed in plan from the y-axis direction.

在光纖插入部42a之下表面,如圖9及圖10所示,設有凸部C7。凸部C7與定位構件220之插頭載置部222之槽G1對應。凸部C7從端面S8朝向端面S10與x軸平行設置。On the lower surface of the optical fiber insertion portion 42a, as shown in Figs. 9 and 10, a convex portion C7 is provided. The convex portion C7 corresponds to the groove G1 of the plug mounting portion 222 of the positioning member 220. The convex portion C7 is disposed in parallel with the x-axis from the end surface S8 toward the end surface S10.

突起部42b,如圖9及圖10所示,從光纖插入部42a之x軸方向之負方向側之端部附近往y軸方向之負方向側突出。藉此,送訊側插頭42呈L字型。此外,突起部42b在送訊側插頭42之插拔作業時作用為把持部。又,在突起部42b之大致中央設有從z軸方向俯視時大致矩形狀之拔出孔。As shown in FIG. 9 and FIG. 10, the projection 42b protrudes from the vicinity of the end portion on the negative side in the x-axis direction of the optical fiber insertion portion 42a toward the negative side in the y-axis direction. Thereby, the transmitting side plug 42 has an L shape. Further, the protruding portion 42b functions as a grip portion when the communication side plug 42 is inserted and removed. Further, a substantially rectangular extraction hole is formed in a substantially central portion of the projection 42b from a plan view in the z-axis direction.

此外,送訊側插頭42與插座20之連接作業係藉由使凸部C7沿著槽G1往x軸方向之正方向側壓入而進行。此時,突起部42b之x軸方向之正方向側之端面S11抵接於圖5所示之定位構件220之抵接部228之端面S3。此外,凸透鏡44未與本體226之端面S2相接,設有約5μm之間隙。其原因在於,防止因相接在凸透鏡44或本體226之端面S2產生傷痕或污損而產生透射率降低。Further, the connection operation between the transmitting side plug 42 and the socket 20 is performed by pressing the convex portion C7 along the groove G1 toward the positive side in the x-axis direction. At this time, the end surface S11 of the projection portion 42b on the positive side in the x-axis direction abuts against the end surface S3 of the abutting portion 228 of the positioning member 220 shown in Fig. 5 . Further, the convex lens 44 is not in contact with the end surface S2 of the body 226, and is provided with a gap of about 5 μm. This is because the transmittance is prevented from being lowered due to the occurrence of scratches or stains on the end surface S2 of the convex lens 44 or the body 226.

又,送訊側插頭42與插座20連接時,金屬罩30之卡合部32a與突起N1卡合,且卡合部32c與送訊側插頭42之面S7與端面S8構成之角卡合,藉此送訊側插頭42固定於插座20。Further, when the transmitting side plug 42 is connected to the socket 20, the engaging portion 32a of the metal cover 30 is engaged with the projection N1, and the engaging portion 32c is engaged with the corner formed by the surface S7 of the transmitting side plug 42 and the end surface S8. Thereby, the communication side plug 42 is fixed to the socket 20.

收訊側插頭46係用於將光纖60固定在定位構件240。又,收訊側插頭46,如圖9所示,具備光纖插入部46a及突起部46b。The receiving side plug 46 is for fixing the optical fiber 60 to the positioning member 240. Moreover, as shown in FIG. 9, the receiving side plug 46 is provided with the optical fiber insertion part 46a and the protrusion part 46b.

光纖插入部46a構成收訊側插頭46之y軸方向之負方向側之部分,呈往x軸方向延伸之長方體狀。在光纖插入部46a之x軸方向之負方向側之部分設有開口部A2。開口部A2注入用以固定光纖60之樹脂。The optical fiber insertion portion 46a constitutes a portion on the negative side in the y-axis direction of the reception side plug 46, and has a rectangular parallelepiped shape extending in the x-axis direction. An opening A2 is provided in a portion of the optical fiber insertion portion 46a on the negative side in the x-axis direction. The opening A2 is filled with a resin for fixing the optical fiber 60.

開口部A2係藉由切開位於光纖插入部46a上表面之面S12及x軸方向之負方向側之端面S13而形成。又,在開口部A2之x軸方向之正方向側之內周面設有用以將插入之光纖60之芯線導至收訊側插頭46前端 之插入口H8。此外,插入口H8與光纖60之條數對應,本實施形態中為二個。The opening A2 is formed by cutting the surface S12 located on the upper surface of the optical fiber insertion portion 46a and the end surface S13 on the negative side in the x-axis direction. Further, an inner peripheral surface of the opening portion A2 on the positive side in the x-axis direction is provided to guide the core wire of the inserted optical fiber 60 to the front end of the receiving side plug 46. The insertion port H8. Further, the number of insertion ports H8 corresponds to the number of the optical fibers 60, and is two in the present embodiment.

再者,在光纖插入部46a之x軸方向之正方向側之部分設有用以注入匹配劑之凹部D4。又,凹部D4從光纖插入部46a之上表面朝向下表面凹陷。Further, a concave portion D4 for injecting a matching agent is provided in a portion of the optical fiber insertion portion 46a on the positive side in the x-axis direction. Further, the concave portion D4 is recessed from the upper surface of the optical fiber insertion portion 46a toward the lower surface.

在凹部D4之x軸方向之負方向側之內周面設有插入口H8。插入口H8與開口部A2之x軸方向之正方向側之內周面連接。是以,光纖60之芯線通過插入口H8從開口部A2到達凹部D4。到達凹部D4之光纖60之芯線之端面位於極為接近凹部D4之x軸方向之正方向側之內周面S14之處。此外,藉由將透明樹脂所構成之匹配劑、例如環氧系樹脂注入開口部A2及凹部D4,光纖60固定於收訊側插頭46。此外,光纖60之芯線之端面未與內周面S14相接。An insertion port H8 is provided on the inner circumferential surface of the concave portion D4 on the negative side in the x-axis direction. The insertion port H8 is connected to the inner peripheral surface of the opening A2 on the positive side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the concave portion D4 from the opening portion A2 through the insertion port H8. The end surface of the core wire of the optical fiber 60 reaching the concave portion D4 is located very close to the inner circumferential surface S14 on the positive side in the x-axis direction of the concave portion D4. Further, the optical fiber 60 is fixed to the reception side plug 46 by injecting a matching agent made of a transparent resin, for example, an epoxy resin into the opening A2 and the recess D4. Further, the end face of the core of the optical fiber 60 is not in contact with the inner peripheral surface S14.

在光纖插入部46a之x軸方向之正方向側之端面S15,如圖10所示,設有凸透鏡48。凸透鏡48,從與x軸方向正交之方向俯視時,呈往x軸方向之正方向側突出之半圓狀。A convex lens 48 is provided on the end surface S15 of the optical fiber insertion portion 46a on the positive side in the x-axis direction as shown in FIG. The convex lens 48 has a semicircular shape that protrudes toward the positive side in the x-axis direction when viewed from a direction orthogonal to the x-axis direction.

又,凸透鏡48,從x軸方向俯視時,與光纖60之光軸重疊。是以,從光纖60射出之雷射束B2被凸透鏡48聚光或準直,往全反射面R2行進。此外,雷射束B2被全反射面R2反射,傳送至受光元件陣列50。Further, the convex lens 48 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Therefore, the laser beam B2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 48, and travels toward the total reflection surface R2. Further, the laser beam B2 is reflected by the total reflection surface R2 and transmitted to the light receiving element array 50.

在光纖插入部46a之面S12,如圖9所示,設有與金屬罩30之卡合部32b卡合之突起N2。突起N2在x軸方向設在開口部A2與凹部D4之間,往y軸方向延伸。又,突起N2,從y軸方向俯視時,呈往z軸方向之正方向側突出之三角形狀。As shown in FIG. 9, the surface S12 of the optical fiber insertion portion 46a is provided with a projection N2 that engages with the engagement portion 32b of the metal cover 30. The projection N2 is provided between the opening A2 and the recess D4 in the x-axis direction and extends in the y-axis direction. Moreover, the projection N2 has a triangular shape that protrudes toward the positive side in the z-axis direction when viewed in plan from the y-axis direction.

在光纖插入部46a之下表面,如圖9及圖10所示,設有凸部C8。凸部C8與定位構件240之插頭載置部242之槽G2對應。凸部C8從端面S13朝向端面S15與x軸平行設置。On the lower surface of the optical fiber insertion portion 46a, as shown in Figs. 9 and 10, a convex portion C8 is provided. The convex portion C8 corresponds to the groove G2 of the plug mounting portion 242 of the positioning member 240. The convex portion C8 is disposed in parallel with the x-axis from the end surface S13 toward the end surface S15.

突起部46b,如圖9及圖10所示,從光纖插入部46a之x軸方向之負方向側之端部往y軸方向之正方向側突出。藉此,收訊側插頭46呈L字型。此外,突起部46b在收訊側插頭46之插拔作業時作用為把持部。又,在突起部46b之大致中央設有從z軸方向俯視時大致矩形狀之拔出孔。As shown in FIG. 9 and FIG. 10, the projection 46b protrudes from the end portion on the negative side in the x-axis direction of the optical fiber insertion portion 46a toward the positive side in the y-axis direction. Thereby, the receiving side plug 46 has an L shape. Further, the protruding portion 46b functions as a grip portion when the receiving side plug 46 is inserted and removed. Further, an extraction hole having a substantially rectangular shape when viewed from the z-axis direction is provided substantially at the center of the projection 46b.

此外,收訊側插頭46與插座20之連接作業係藉由使凸部C8沿著槽G2往x軸方向之正方向側壓入而進行。此時,突起部46b之x軸方向之正方向側之端面S16抵接於圖5所示之定位構件240之抵接部248之端面S6。此外,凸透鏡48未與本體246之端面S5相接,設有約5μm之間隙。其原因在於,防止因相接在凸透鏡48或本體246之端面S5產生傷痕或污損而產生透射率降低。Further, the connection operation between the receiving side plug 46 and the socket 20 is performed by pressing the convex portion C8 along the groove G2 toward the positive side in the x-axis direction. At this time, the end surface S16 of the projection portion 46b on the positive side in the x-axis direction abuts against the end surface S6 of the abutting portion 248 of the positioning member 240 shown in FIG. Further, the convex lens 48 is not in contact with the end surface S5 of the body 246, and is provided with a gap of about 5 μm. This is because the transmittance is prevented from being lowered due to the occurrence of scratches or stains on the end surface S5 of the convex lens 48 or the body 246.

又,收訊側插頭46與插座20連接時,金屬罩30之卡合部32b與突起N2卡合,且卡合部32d與收訊側插頭46之面S12與端面S13構成之角卡合,藉此收訊側插頭46固定於插座20。Further, when the receiving side plug 46 is connected to the socket 20, the engaging portion 32b of the metal cover 30 is engaged with the projection N2, and the engaging portion 32d is engaged with the corner formed by the surface S12 of the receiving side plug 46 and the end surface S13. Thereby, the receiving side plug 46 is fixed to the socket 20.

在以上述方式構成之光傳送模組10,如圖7所示,從發光元件陣列100往z軸方向之正方向側射出之雷射束B1通過密封樹脂24及定位構件220。再者,雷射束B1被全反射面R1往x軸方向之負方向側反射,通過插頭40並往光纖60之芯部傳送。In the optical transmission module 10 configured as described above, as shown in FIG. 7, the laser beam B1 emitted from the light-emitting element array 100 toward the positive side in the z-axis direction passes through the sealing resin 24 and the positioning member 220. Further, the laser beam B1 is reflected by the total reflection surface R1 toward the negative side in the x-axis direction, and is transmitted through the plug 40 to the core of the optical fiber 60.

又,在光傳送模組10,從光纖60往x軸方向之正方向側射出之雷射束B2通過定位構件240。再者,雷射束B2被全反射面R2往z軸 方向之負方向側反射,通過密封樹脂24並往受光元件陣列50傳送。Further, in the optical transmission module 10, the laser beam B2 emitted from the optical fiber 60 toward the positive side in the x-axis direction passes through the positioning member 240. Furthermore, the laser beam B2 is totally reflected from the surface R2 to the z-axis The light is reflected by the sealing resin 24 and transmitted to the light receiving element array 50.

(製造方法)(Production method)

以下,以插座20、插頭40與光纖60之連接方法及光傳送模組10之組裝之順序說明光傳送模組10之製造方法。Hereinafter, a method of manufacturing the optical transmission module 10 will be described in the order of the socket 20, the method of connecting the plug 40 to the optical fiber 60, and the assembly of the optical transmission module 10.

(插座之製造方法,參照圖11)(How to manufacture the socket, refer to Figure 11)

參照圖式說明插座20之製造方法。A method of manufacturing the socket 20 will be described with reference to the drawings.

首先,在構裝基板22之集合體即母基板122(本圖式中未圖示)之上表面塗布焊料。更具體而言,在載置有金屬光罩之母基板122上使用刮漿板按壓糊狀焊料。接著,從母基板122移除金屬光罩,藉此將焊料印刷至母基板122。First, solder is applied to the upper surface of the mother substrate 122 (not shown in the drawing) which is an assembly of the constituent substrates 22. More specifically, the cream solder is pressed using a squeegee on the mother substrate 122 on which the metal mask is placed. Next, the metal mask is removed from the mother substrate 122, thereby printing the solder to the mother substrate 122.

接著,將電容器載置於母基板122之焊料上。之後,對母基板122進行加熱,焊接電容器。Next, the capacitor is placed on the solder of the mother substrate 122. Thereafter, the mother substrate 122 is heated to solder the capacitor.

焊接電容器後,在母基板122上之既定位置塗布Ag糊。在塗布之Ag上載置驅動電路26、受光元件陣列50及發光元件陣列100,進行晶粒接合。再者,使用Au引線藉由引線接合將驅動電路26與受光元件陣列50加以連接,再者,藉由引線接合將驅動電路26與發光元件陣列100加以連接。再者,藉由引線接合將驅動電路26與母基板122加以連接。After the capacitor is soldered, an Ag paste is applied to a predetermined position on the mother substrate 122. The driver circuit 26, the light-receiving element array 50, and the light-emitting element array 100 are placed on the applied Ag to perform die bonding. Further, the drive circuit 26 and the light-receiving element array 50 are connected by wire bonding using Au leads, and the drive circuit 26 is connected to the light-emitting element array 100 by wire bonding. Furthermore, the drive circuit 26 is connected to the mother substrate 122 by wire bonding.

之後,對電容器、驅動電路26、受光元件陣列50及發光元件陣列100進行樹脂鑄模。再者,使用切刀將母基板122裁切,藉此獲得複數個構裝基板22。Thereafter, the capacitor, the drive circuit 26, the light-receiving element array 50, and the light-emitting element array 100 are subjected to resin molding. Further, the mother substrate 122 is cut using a cutter, thereby obtaining a plurality of package substrates 22.

接著,將定位構件220載置於構裝基板22及密封樹脂24上。更具體而言,在密封樹脂24a上表面之x軸方向之負方向側之區域塗布 UV硬化型之接著劑。塗布接著劑後,如圖11所示,以位置辨識用攝影機V1確認發光元件陣列100之發光部之中心T100之位置。Next, the positioning member 220 is placed on the package substrate 22 and the sealing resin 24. More specifically, the coating is applied to the region on the negative side in the x-axis direction of the upper surface of the sealing resin 24a. UV hardening type of adhesive. After the application of the adhesive, as shown in FIG. 11, the position of the center T100 of the light-emitting portion of the light-emitting element array 100 is confirmed by the position recognition camera V1.

接著,用以將定位構件220載置於密封樹脂24上之搭載機V2吸附提起定位構件220。接著,在搭載機V2吸附定位構件220之狀態下,以位置辨識用攝影機V3確認定位構件220之凸透鏡230之透鏡中心T230之位置。Next, the loading machine V2 for placing the positioning member 220 on the sealing resin 24 sucks up the positioning member 220. Next, in a state where the mounting machine V2 adsorbs the positioning member 220, the position of the lens center T230 of the convex lens 230 of the positioning member 220 is confirmed by the position recognition camera V3.

從以位置辨識用攝影機V1確認之發光元件陣列100之發光部之中心T100之位置資料及以位置辨識用攝影機V3確認之定位構件220之凸透鏡230之透鏡中心T230之位置資料,算出發光元件陣列100之發光部與凸透鏡230之相對位置。根據算出之結果,決定搭載機V2之移動量。The positional data of the center T100 of the light-emitting portion of the light-emitting element array 100 confirmed by the position recognition camera V1 and the positional data of the lens center T230 of the convex lens 230 of the positioning member 220 confirmed by the position recognition camera V3 are used to calculate the light-emitting element array 100. The relative position of the light emitting portion and the convex lens 230. Based on the calculated result, the amount of movement of the loading machine V2 is determined.

接著,藉由搭載機V2,使定位構件220移動決定之移動量。藉此,凸透鏡230之透鏡中心T230與發光元件陣列100之光軸一致。Next, the positioning member 220 is moved by the loading machine V2 to determine the amount of movement. Thereby, the lens center T230 of the convex lens 230 coincides with the optical axis of the light emitting element array 100.

與定位構件220之載置作業並行地,進行將定位構件240載置於構裝基板22及密封樹脂24上之作業。更具體而言,在密封樹脂24a上表面之x軸方向之負方向側之區域塗布UV硬化型之接著劑後,如圖11所示,以位置辨識用攝影機V4確認受光元件陣列50之受光部之中心T50之位置。The operation of placing the positioning member 240 on the package substrate 22 and the sealing resin 24 is performed in parallel with the mounting operation of the positioning member 220. More specifically, a UV-curable adhesive is applied to a region on the negative side in the x-axis direction of the upper surface of the sealing resin 24a, and the light-receiving portion of the light-receiving element array 50 is confirmed by the position recognition camera V4 as shown in FIG. The location of the center T50.

接著,用以將定位構件240載置於密封樹脂24上之搭載機V5吸附提起定位構件240。接著,在搭載機V5吸附定位構件240之狀態下,以位置辨識用攝影機V6確認定位構件240之凸透鏡250之透鏡中心T250之位置。Next, the loading machine V5 for placing the positioning member 240 on the sealing resin 24 sucks up the positioning member 240. Next, in a state where the loading device V5 adsorbs the positioning member 240, the position of the lens center T250 of the convex lens 250 of the positioning member 240 is confirmed by the position recognition camera V6.

從以位置辨識用攝影機V4確認之受光元件陣列50之受光 部之中心T50之位置資料及以位置辨識用攝影機V6確認之定位構件240之凸透鏡250之透鏡中心T250之位置資料,算出受光元件陣列50之受光部與凸透鏡250之相對位置。根據算出之結果,決定搭載機V5之移動量。Receiving light from the light-receiving element array 50 confirmed by the position recognition camera V4 The positional data of the center T50 of the part and the positional data of the lens center T250 of the convex lens 250 of the positioning member 240 confirmed by the position recognition camera V6 are used to calculate the relative positions of the light receiving portion of the light receiving element array 50 and the convex lens 250. Based on the calculated result, the amount of movement of the mounted machine V5 is determined.

接著,藉由搭載機V5,使定位構件240移動決定之移動量。藉此,凸透鏡250之透鏡中心T250與受光元件陣列50之光軸一致。Next, the positioning member 240 is moved by the loading machine V5 to determine the amount of movement. Thereby, the lens center T250 of the convex lens 250 coincides with the optical axis of the light receiving element array 50.

對配置之定位構件220,240照射紫外線。此外,紫外線照射中,定位構件220,240為藉由搭載機V2,V5往構裝基板22及密封樹脂24按壓之狀態。藉此,位於定位構件220,240與密封樹脂24之間之UV型硬化劑硬化時,定位構件220,240不會引起位置偏移,固定在構裝基板22及密封樹脂24。The disposed positioning members 220, 240 are irradiated with ultraviolet rays. Further, in the ultraviolet irradiation, the positioning members 220 and 240 are in a state in which the mounting machines V2 and V5 are pressed against the package substrate 22 and the sealing resin 24. Thereby, when the UV-type hardener located between the positioning members 220, 240 and the sealing resin 24 is hardened, the positioning members 220, 240 are fixed to the structure substrate 22 and the sealing resin 24 without causing a positional displacement.

接著,對載置有定位構件200之構裝基板22安裝金屬罩30。更具體而言,在構裝基板22之上表面之密封樹脂24之腳部24b與24c間之空間H1、腳部24d與24e間之空間H2、及金屬罩30之凸部C2,C5接觸之部分塗布環氧系等之熱硬化性接著劑。又,在構裝基板22之接地導體露出部E2,E3塗布Ag等導電性糊。Next, the metal cover 30 is attached to the package substrate 22 on which the positioning member 200 is placed. More specifically, the space H1 between the leg portions 24b and 24c of the sealing resin 24 on the upper surface of the mounting substrate 22, the space H2 between the leg portions 24d and 24e, and the convex portions C2, C5 of the metal cover 30 are in contact with each other. A thermosetting adhesive such as an epoxy resin is partially coated. Moreover, a conductive paste such as Ag is applied to the ground conductor exposed portions E2 and E3 of the package substrate 22.

塗布接著劑及導電性糊後,使金屬罩30之凸部C3嵌合於構裝基板22上之密封樹脂24之腳部24b與腳部24c所夾之部分、亦即空間H1。再者,使凸部C6嵌合於密封樹脂24之腳部24d與腳部24e所夾之部分、亦即空間H2。藉此,決定金屬罩30相對於構裝基板22之位置。又,與金屬罩30之定位同時地,凸部C1~C6與構裝基板22上之接著劑或導電性糊接觸。After the application of the adhesive and the conductive paste, the convex portion C3 of the metal cover 30 is fitted to the portion of the sealing portion 24b of the sealing resin 24 and the portion of the leg portion 24c, that is, the space H1. Further, the convex portion C6 is fitted to the portion of the leg portion 24d of the sealing resin 24 and the leg portion 24e, that is, the space H2. Thereby, the position of the metal cover 30 with respect to the structure substrate 22 is determined. Further, at the same time as the positioning of the metal cover 30, the convex portions C1 to C6 are in contact with the adhesive or the conductive paste on the package substrate 22.

使金屬罩30嵌合後,對構裝基板22加熱,使接著劑及導電 性糊硬化。藉此,將金屬罩30固定於構裝基板22。此外,藉由將金屬罩30安裝在構裝基板22,金屬罩30之凸部C1,C4與構裝基板22之接地導體露出部E2,E3接觸。藉此,金屬罩30連接於構裝基板22內之接地導體,保持接地電位。藉由以上步驟完成插座20。After the metal cover 30 is fitted, the package substrate 22 is heated to make the adhesive and conductive Hardening of the paste. Thereby, the metal cover 30 is fixed to the package substrate 22. Further, by attaching the metal cover 30 to the package substrate 22, the convex portions C1, C4 of the metal cover 30 are in contact with the ground conductor exposed portions E2, E3 of the package substrate 22. Thereby, the metal cover 30 is connected to the ground conductor in the package substrate 22, and the ground potential is maintained. The socket 20 is completed by the above steps.

(插頭與光纖之連接方法)(How to connect the plug to the optical fiber)

首先,將插入插頭40之光纖60切斷成既定長度。First, the optical fiber 60 inserted into the plug 40 is cut to a predetermined length.

接著,使用光纖用剝除器除去光纖60之前端附近之被覆。除去前端附近之被覆後,為了使光纖60之芯線之劈開面露出,進行劈開。Next, the coating near the front end of the optical fiber 60 is removed using a fiber stripper. After the coating near the front end is removed, the opening of the core wire of the optical fiber 60 is exposed.

接著,以光纖60之芯線前端來到極接近插頭40之面S9,S14之處之方式,將光纖60從開口部A1,A2壓入。再者,對圖9所示之插頭40之開口部A1,A2及凹部D3,D4注入用以固定光纖60之環氧樹脂等透明樹脂。接著,藉由使透明樹脂硬化,光纖60固定在插頭40。Next, the optical fiber 60 is pressed from the openings A1, A2 so that the front end of the core of the optical fiber 60 comes close to the faces S9, S14 of the plug 40. Further, the openings A1, A2 and the recesses D3, D4 of the plug 40 shown in Fig. 9 are filled with a transparent resin such as an epoxy resin for fixing the optical fiber 60. Next, the optical fiber 60 is fixed to the plug 40 by hardening the transparent resin.

(光傳送模組之組裝方法)(Assembling method of optical transmission module)

將插頭40連接於插座20。插頭40之連接,如上述,係藉由使插頭40之凸部C7,C8沿著定位構件220,240之槽G1,G2從設在金屬罩30與插座20之間之開口部A3朝向x軸方向之正方向側壓入來進行。經由以上製程完成光傳送模組10。The plug 40 is attached to the socket 20. The connection of the plug 40 is as described above by the projections C7, C8 of the plug 40 along the slots G1, G2 of the positioning members 220, 240 from the opening A3 provided between the metal cover 30 and the socket 20 toward the x-axis direction. Pressing in the positive direction side is performed. The optical transmission module 10 is completed through the above process.

(效果)(effect)

在定位構件200,插頭載置部222,242、受光元件陣列50及發光元件陣列100皆設在構裝基板之上表面。亦即,插頭載置部222,242,並非如光連接器用插槽500般設在發光元件504上,而是設在與受光元件陣列50或發光元件陣列100相同之面上。是以,包含定位構件200之插座20及光傳送 模組10之高度,沒有使插頭40本身之高度變低,亦即,在確保該插頭40之強度之狀態下,能較使用光連接器用插槽500之插座及光傳送模組低。又,伴隨於此,可確保在插頭40內之固定光纖60之接著劑之塗布空間,因此能使光纖60更強固地固定於插頭40。In the positioning member 200, the plug mounting portions 222, 242, the light receiving element array 50, and the light emitting element array 100 are all provided on the upper surface of the package substrate. That is, the plug mounting portions 222, 242 are not provided on the light-emitting element 504 as in the optical connector slot 500, but are provided on the same surface as the light-receiving element array 50 or the light-emitting element array 100. Therefore, the socket 20 including the positioning member 200 and the optical transmission The height of the module 10 does not lower the height of the plug 40 itself, that is, the socket and the optical transmission module of the socket 500 for the optical connector can be made lower in the state in which the strength of the plug 40 is ensured. Further, with this, the application space of the adhesive of the fixed optical fiber 60 in the plug 40 can be secured, so that the optical fiber 60 can be more firmly fixed to the plug 40.

再者,從構裝基板22之上表面至插頭42,46之下表面接觸之插頭載置部222,242之上表面之高度h1,h3,如圖7所示,較從構裝基板22之上表面至密封樹脂24之上表面之高度h2低。是以,能將包含定位構件200之插座20及光傳送模組10之高度抑制地更低。又,若使從構裝基板22之上表面至插頭42,46之下表面接觸之插頭載置部222,242之上表面之高度h1,h3較各光元件之高度低,則能將包含定位構件200之插座20及光傳送模組10之高度進一步抑制地更低。Further, the heights h1, h3 from the upper surface of the package substrate 22 to the upper surfaces of the plug mounting portions 222, 242 which are in contact with the lower surfaces of the plugs 42, 46 are as shown in Fig. 7, from the upper surface of the package substrate 22. The height h2 to the upper surface of the sealing resin 24 is low. Therefore, the height of the socket 20 and the optical transmission module 10 including the positioning member 200 can be suppressed to be lower. Further, if the heights h1, h3 of the upper surfaces of the plug mounting portions 222, 242 which are in contact with the lower surface of the package substrate 22 from the upper surface of the package substrate 22 are lower than the heights of the respective optical elements, the positioning member 200 can be included. The height of the socket 20 and the optical transmission module 10 is further suppressed to a lower level.

然而,在插頭載置部222,242之上表面之y軸方向之大致中央,如圖5所示,設有沿著將插頭40朝向光耦合部224,244壓入時之插入方向、亦即本實施例之x軸方向之槽G1,G2。藉此,能使插頭40之凸部C7,C8沿著槽G1,G2將插頭40安裝於插座20。因此,能將插頭40高精度地載置於插頭載置部222,242。其結果,可抑制光纖60之光軸偏移導致之光學損耗。However, in the approximate center of the y-axis direction of the upper surface of the plug mounting portions 222, 242, as shown in FIG. 5, the insertion direction when the plug 40 is pressed toward the optical coupling portions 224, 244 is provided, that is, the embodiment. Grooves G1, G2 in the x-axis direction. Thereby, the convex portions C7, C8 of the plug 40 can be attached to the socket 20 along the grooves G1, G2. Therefore, the plug 40 can be placed on the plug mounting portions 222, 242 with high precision. As a result, optical loss due to the optical axis shift of the optical fiber 60 can be suppressed.

又,複數個光元件搭載於構裝基板上之情形,會有複數個光元件之相對位置關係產生偏移之虞。此外,與各光元件對應之定位構件一體化之情形,若將特定之光元件與定位構件加以定位,則其他光元件與定位構件之位置關係產生偏移。因此,定位構件220,240分別對各光元件設置。藉此,能與各光元件搭載時之位置偏移對應地配置定位構件220,240。 是以,在定位構件200,與定位構件220,240為一體之情形相較,能有彈性地對應各光元件搭載時之位置偏移。Further, when a plurality of optical elements are mounted on the package substrate, the relative positional relationship of the plurality of optical elements may be shifted. Further, in the case where the positioning members corresponding to the respective optical elements are integrated, when the specific optical element and the positioning member are positioned, the positional relationship between the other optical elements and the positioning member is shifted. Therefore, the positioning members 220, 240 are respectively provided for the respective optical elements. Thereby, the positioning members 220 and 240 can be disposed corresponding to the positional shift when each optical element is mounted. Therefore, in the case where the positioning member 200 is integrated with the positioning members 220 and 240, the positional displacement of each of the optical elements can be flexibly matched.

(第1變形例,參照圖12)(First modification, see FIG. 12)

如圖12所示,第1變形例之定位構件200A與定位構件200之不同點為插頭載置部222,242之高度h4,h5。其他構成與上述實施例相同。是以,本變形例中,插頭載置部222,242以外之說明如在上述實施例之說明。As shown in FIG. 12, the difference between the positioning member 200A of the first modification and the positioning member 200 is the heights h4, h5 of the plug mounting portions 222, 242. Other configurations are the same as those of the above embodiment. Therefore, in the present modification, the description other than the plug mounting portions 222, 242 is as described in the above embodiment.

在第1變形例之定位構件200A,插頭載置部222,242之高度h4,h5較光元件之高度h6之高度低。是以,在使用定位構件200A之插座20A及光傳送模組10A,相較於使用定位構件200之插座20及光傳送模組10,可謀求進一步之低高度化。In the positioning member 200A of the first modification, the heights h4 and h5 of the plug mounting portions 222 and 242 are lower than the height h6 of the optical element. Therefore, in the socket 20A and the optical transmission module 10A using the positioning member 200A, it is possible to further reduce the height compared to the socket 20 and the optical transmission module 10 using the positioning member 200.

(第2變形例,參照圖13及圖14)(Second modification, see Figs. 13 and 14)

第2變形例之定位構件200B與定位構件200之不同點為插頭載置部222,242之形狀。具體而言,如圖13所示,在插頭載置部222,242之上表面之y軸方向之大致中央,設有沿著將插頭40朝向光耦合部224,244壓入時之插入方向、亦即本實施例之x軸方向之凸部C9,C10。伴隨於此,如圖14所示,在插頭42,46之下表面設有槽G3,G4。其他構成與上述實施例相同。是以,本變形例中,插頭42,46及插頭載置部222,242以外之說明如在上述實施例之說明。The difference between the positioning member 200B of the second modification and the positioning member 200 is the shape of the plug mounting portions 222, 242. Specifically, as shown in FIG. 13 , in the substantially y-axis direction of the upper surface of the plug mounting portions 222 and 242, the insertion direction when the plug 40 is pressed toward the optical coupling portions 224 and 244 is provided, that is, the present embodiment. For example, the convex portions C9 and C10 in the x-axis direction. Along with this, as shown in Fig. 14, grooves G3, G4 are provided on the lower surface of the plugs 42, 46. Other configurations are the same as those of the above embodiment. Therefore, in the present modification, the descriptions other than the plugs 42, 46 and the plug mounting portions 222, 242 are as described in the above embodiments.

藉此,能將插頭40高精度地載置於插頭載置部222,242。其結果,可抑制光纖60之光軸偏移導致之光學損耗。Thereby, the plug 40 can be placed on the plug mounting portions 222, 242 with high precision. As a result, optical loss due to the optical axis shift of the optical fiber 60 can be suppressed.

(其他實施形態)(Other embodiments)

本發明之定位構件、插座及光傳送模組,並不限於上述實施形態之定 位構件200,200A,200B、插座20A,20B及光傳送模組10,10A,在其要旨範圍內可進行變更。The positioning member, the socket and the optical transmission module of the present invention are not limited to the above embodiments. The position members 200, 200A, 200B, the sockets 20A, 20B, and the optical transmission modules 10, 10A can be modified within the scope of the gist.

如上述,本發明在用以使光纖與光元件光學耦合之定位構件、包含該定位構件之插座及光傳送模組有用,尤其是在可確保設在光纖一端之插頭之強度並同時謀求連接該插頭之插座之低高度化之點優異。As described above, the present invention is useful for a positioning member for optically coupling an optical fiber and an optical element, a socket including the positioning member, and an optical transmission module, in particular, for securing the strength of the plug provided at one end of the optical fiber while achieving the connection. The socket of the plug is excellent in the low degree of height.

B1,B2‧‧‧雷射束B1, B2‧‧‧ laser beam

D1,D2,D3,D4‧‧‧凹部D1, D2, D3, D4‧‧‧ recess

h1~h3‧‧‧高度H1~h3‧‧‧height

R1,R2‧‧‧全反射面R1, R2‧‧‧ total reflection surface

22‧‧‧構裝基板22‧‧‧Construction substrate

24‧‧‧密封樹脂24‧‧‧ sealing resin

26‧‧‧驅動電路26‧‧‧Drive circuit

40,42,46‧‧‧插頭40,42,46‧‧‧ plug

44,48‧‧‧凸透鏡44,48‧‧‧ convex lens

50‧‧‧受光元件陣列(光元件)50‧‧‧Light-receiving element array (optical component)

60‧‧‧光纖60‧‧‧ fiber

100‧‧‧發光元件陣列(光元件)100‧‧‧Lighting element array (optical components)

200,220,240‧‧‧定位構件200,220,240‧‧‧ Positioning members

222,242‧‧‧插頭載置部222, 242 ‧ ‧ plug placement

224,244‧‧‧光耦合部224,244‧‧‧Photocoupler

230,250‧‧‧凸透鏡230,250‧‧‧ convex lens

Claims (7)

一種使用於光通訊之插座,係具備:光元件;驅動電路;具有接地導體露出部之構裝基板,係於上表面設有該驅動電路及該光元件;金屬罩,係固定於該構裝基板,且具有凸部;密封樹脂,係具有覆蓋該光元件及該驅動電路之密封部、及為從該密封部突出之複數個長方體狀之構件且為於其間設有供該金屬罩之該凸部嵌入之空間的腳部;以及定位構件,係由該金屬罩覆蓋,載置於該構裝基板及該密封樹脂上,使於端部設有插頭之光纖與該光元件光學耦合;其特徵在於:該定位構件,具備:插頭載置部,設在該構裝基板上表面,且載置該插頭;以及光耦合部,夾著該光元件設在該構裝基板之上,藉由反射使該光纖之光軸與該光元件之光軸一致;在該金屬罩之該凸部嵌入於其間之該空間,設有將該凸部與該接地導體露出部連接之導電性糊、及固定於該凸部與該構裝基板之接著劑。 A socket for optical communication includes: an optical element; a driving circuit; a mounting substrate having a grounding conductor exposed portion; the driving circuit and the optical element are disposed on an upper surface; and the metal cover is fixed to the mounting substrate And a sealing portion; the sealing resin having a sealing portion covering the optical element and the driving circuit; and a plurality of rectangular parallelepiped members protruding from the sealing portion and having the convex portion for the metal cover therebetween a foot portion of the embedded space; and a positioning member covered by the metal cover, placed on the structure substrate and the sealing resin, such that an optical fiber having a plug at the end is optically coupled to the optical element; The positioning member includes: a plug mounting portion provided on an upper surface of the mounting substrate, and the plug is placed; and an optical coupling portion provided on the mounting substrate with the optical element interposed therebetween, and the optical fiber is reflected by reflection The optical axis is aligned with the optical axis of the optical element; and the conductive paste in which the convex portion is connected to the exposed portion of the ground conductor is provided in the space between the convex portion of the metal cover, and is fixed to the convex A mounting substrate of the adhesive. 如申請專利範圍第1項之使用於光通訊之插座,其中,從該構裝基板上表面至該插頭下表面接觸之該插頭載置部上表面之高度,較從該構裝基板上表面至密封該光元件之密封樹脂上表面之高度低。 The socket for optical communication according to Item 1, wherein the height of the upper surface of the plug mounting portion contacting the upper surface of the mounting substrate to the lower surface of the plug is higher than the upper surface of the mounting substrate to the sealing. The height of the upper surface of the sealing resin of the optical element is low. 如申請專利範圍第1項之使用於光通訊之插座,其中,從該構裝基板上 表面至該插頭下表面接觸之該插頭載置部上表面之高度,較從該構裝基板上表面至該光元件上表面之高度低。 The socket for optical communication, as in the first aspect of the patent application, wherein the package substrate is used The height of the upper surface of the plug mounting portion contacting the surface to the lower surface of the plug is lower than the height from the upper surface of the mounting substrate to the upper surface of the optical element. 如申請專利範圍第1至3項中任一項之使用於光通訊之插座,其中,在該插頭載置部上表面設有沿著將該插頭朝向該光耦合部壓入時之插入方向之槽。 The socket for optical communication according to any one of claims 1 to 3, wherein an upper surface of the plug mounting portion is provided along an insertion direction when the plug is pressed toward the optical coupling portion. groove. 如申請專利範圍第1至3項中任一項之使用於光通訊之插座,其中,在該插頭載置部上表面設有沿著將該插頭朝向該光耦合部壓入時之插入方向延伸之凸部。 The socket for optical communication according to any one of claims 1 to 3, wherein an upper surface of the plug mounting portion is provided to extend in an insertion direction when the plug is pressed toward the optical coupling portion. The convex part. 如申請專利範圍第1至3項中任一項之使用於光通訊之插座,其具備複數個該光元件;該定位構件係分別對各光元件設置。 The socket for optical communication according to any one of claims 1 to 3, which is provided with a plurality of the optical components; the positioning members are respectively provided for the respective optical components. 一種光傳送模組,具備:申請專利範圍第1至6項中任一項之使用於光通訊之插座;該光纖;以及該插頭。 An optical transmission module comprising: a socket for optical communication according to any one of claims 1 to 6; the optical fiber; and the plug.
TW102128819A 2012-08-23 2013-08-12 Positioning components, sockets and optical transmission modules TWI483022B (en)

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