TWI483019B - Socket and optical transmission module - Google Patents

Description

Socket and optical transmission module

The present invention relates to a socket and an optical transmission module, and more particularly to a socket and an optical transmission module for converting an electrical signal into an optical signal and transmitting the same.

As a conventional socket, for example, an optical coupler described in Patent Document 1 is known. Fig. 17 is an exploded perspective view of the optical coupler described in Patent Document 1.

As shown in FIG. 17, the optical coupler 500 includes an optical connector 510A and an optical communication module 510B. Further, the optical connector 510A includes an optical fiber array 520A composed of a plurality of optical fibers 502A, an optical waveguide 504A, and a lens substrate 530A. Furthermore, the optical communication module 510B includes a lens housing 560 for connecting the optical connector 510A and a VCSEL 505 which is a vertical resonator surface illuminating laser (hereinafter referred to as VCSEL). In addition, in the optical communication module 510B, a laser array in one element is combined with a VCSEL 505 having the same number of fibers 502A.

In the optical communication module 510B, the electrical signal is converted into an optical signal by the VCSEL 505. The converted optical signal is emitted from a plurality of VCSELs 505, and transmitted to the optical fiber array 520A through the lens substrate 530A and the optical waveguide 504A of the optical connector 510A.

However, the use of a laser array of VCSEL 505 as with optocoupler 500 has the problem of not being sufficiently isolated between VCSELs 505. In this regard, the VCSEL 600 described in Patent Document 2 will be described in detail as an example. Fig. 18 is a cross-sectional view showing a VCSEL described in Patent Document 2.

As shown in FIG. 18, the schematic structure of the VCSEL 600 is such that a first DBR (Multilayer Distributed Bragg Reflector) layer 614 is formed on the N-type semiconductor substrate 612 on which the cathode electrode 630 is formed. A first spacer layer 616 is formed on the upper layer of the first DBR layer 614. An active layer 618 having a quantum well is formed on the upper layer of the first spacer layer 616. A second spacer layer 620 is formed on the upper layer of the active layer 618. A second DBR layer 622 is formed on the second spacer layer 620. An anode electrode 628 is formed on the upper layer of the second DBR layer 622. Further, by applying a driving signal between the anode electrode 628 and the cathode electrode 630, a laser having sharp directivity in a direction perpendicular to the substrate (parallel to the lamination direction) is generated.

When a plurality of VCSELs 600 are formed on the one N-type semiconductor substrate 612 (array), the respective driving signals applied to the respective VCSELs 600 leak in the N-type semiconductor substrate 612. Therefore, crosstalk of the drive signal is generated between the VCSELs 600. Therefore, it is not sufficiently isolated between the VCSELs 600.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-158001

Patent Document 2: Japanese Patent Publication No. 2003-508928

Accordingly, it is an object of the present invention to provide a socket and an optical transmission module that ensure isolation between VCSELs.

The socket of the present invention is a plug for connecting one end of the optical fiber, and is characterized in that: the light-emitting element array is formed by integrating a plurality of vertical resonator surface-emitting lasers; and the positioning member makes a plurality of the optical fibers. The core portion is optically coupled to the plurality of vertical resonator surface-emitting lasers; and the substrate is configured to form the light-emitting element array; the light-emitting element array includes: a base substrate; and a plurality of light-emitting region portions formed at the bottom The surface of the substrate and contains N-type half a conductor multilayer reflective layer, an active layer provided with a quantum well, and a P-type semiconductor multilayer film reflective layer; an anode electrode connected to the P-type semiconductor multilayer film reflective layer; and a cathode electrode connected to the N-type semiconductor multilayer film a reflective layer; at least a predetermined portion of the multi-layer portion side of the light-emitting region is composed of a semi-insulating semiconductor; the cathode electrode is formed on a surface side of the base substrate; and the light-emitting region multilayer portion, the anode electrode, and the anode A group of vertical resonator surface-emitting laser beams composed of cathode electrodes is formed in plural numbers on the base substrate.

An optical transmission module according to an aspect of the present invention includes: the socket; and a plug provided at a front end of the optical fiber; and a third convex lens positioned on an optical axis of the optical fiber and facing the positioning member.

According to the socket and the optical transmission module of the present invention, isolation between the VCSELs can be ensured.

E1‧‧‧Surface electrode

R1, R2‧‧‧ total reflection surface

10‧‧‧Optical transmission module

20‧‧‧ socket

22‧‧‧Construction substrate

24‧‧‧ sealing resin

30‧‧‧metal cover

32a~32d‧‧‧With the Ministry

40‧‧‧ plug

50‧‧‧Light-receiving element array

60‧‧‧ fiber

100‧‧‧Lighting element array

100A, 100B‧‧‧VCSEL (Vertical Resonator Surface Illuminated Laser)

128‧‧‧ bottom substrate

160‧‧‧Multi-layer of light-emitting area

200‧‧‧ Positioning members

230,232,234,250,252,254‧‧‧ lenticular lens

911‧‧‧electrode for cathode

921‧‧‧Anode ring electrode

Fig. 1 is a perspective view showing the appearance of an optical transmission module according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view of the socket according to the embodiment of the present invention.

Fig. 3 is a perspective view showing the appearance of a metal cover and a positioning member removed from a socket according to an embodiment of the present invention.

Fig. 4 is a plan view of a light-emitting element array according to an embodiment of the present invention as seen from the positive side in the z-axis direction.

Fig. 5 is a cross-sectional view showing A-A or B-B of the light-emitting element array shown in Fig. 4.

Fig. 6 is an external perspective view showing a state in which a metal cover is removed from a socket according to an embodiment of the present invention.

Fig. 7 is a perspective view showing the appearance of a positioning member according to an embodiment of the present invention.

Fig. 8 is a plan view of the positioning member according to the embodiment of the present invention as seen from the negative side in the z-axis direction.

Fig. 9 is a view showing a configuration of a structure substrate and a plug according to an embodiment of the present invention in a C-C or D-D cross section of the positioning member shown in Fig. 7.

Fig. 10 is a perspective view showing the appearance of a metal cover according to an embodiment of the present invention.

Figure 11 is a perspective view showing the appearance of a plug according to an embodiment of the present invention.

Fig. 12 is a plan view showing a plug according to an embodiment of the present invention from the negative side in the z-axis direction.

Figure 13 is a diagram showing the process of a socket according to an embodiment of the present invention.

Figure 14 is a cross-sectional view of a conventional socket and plug.

Figure 15 is a diagram of the process of a conventional socket.

Fig. 16 is a view showing a configuration of a structure substrate and a plug according to an embodiment of the present invention in a cross section of a positioning member according to a modification of the embodiment of the present invention.

Fig. 17 is an exploded perspective view of the optical coupler described in Patent Document 1.

Fig. 18 is a cross-sectional view showing a VCSEL described in Patent Document 2.

Hereinafter, a socket, an optical transmission module, and a method of manufacturing the same according to an embodiment of the present invention will be described.

(Composition of optical transmission module)

Hereinafter, the configuration of the socket and the optical transmission module according to the embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing the appearance of an optical transmission module 10 according to an embodiment of the present invention. Fig. 2 is an exploded perspective view of the socket 20 according to an embodiment of the present invention. 3 is an external perspective view of the metal cover 30 and the positioning member 200 removed from the socket 20 according to an embodiment of the present invention. Further, the upper and lower directions of the optical transmission module 10 are defined as the z-axis direction, and the direction of the long side of the optical transmission module 10 is determined from a plan view in the z-axis direction. Yicheng x-axis direction. Furthermore, the direction along the short side of the light transmission module 10 is defined as the y-axis direction. The x-axis, the y-axis, and the z-axis are orthogonal to each other.

As shown in FIG. 1, the optical transmission module 10 includes a socket 20 and a plug 40. Further, the plug 40 is connected to the socket 20.

As shown in FIG. 2, the socket 20 includes a metal cover 30, a light receiving element array 50, a light emitting element array 100, a positioning member 200, a build substrate 22, and a sealing resin 24.

As shown in FIG. 3, the package substrate 22 has a rectangular shape when viewed in plan from the z-axis direction. Further, when the surface of the package substrate 22 on the negative side in the z-axis direction (hereinafter, the "surface on the negative side in the z-axis direction" is referred to as the back surface) is provided when the optical transmission module 10 is mounted on the circuit board. The surface mount electrode E1 (not shown in FIG. 3) that is in contact with the pad of the circuit board.

The surface on the positive side in the z-axis direction of the package substrate 22 (hereinafter, the "surface on the positive side in the z-axis direction" is referred to as a surface), and the side L1 and the y located on the negative side in the x-axis direction A ground conductor exposed portion E2 in which one of the ground conductors provided in the package substrate 22 is partially exposed is provided in the vicinity of the corner formed by the side L2 on the negative side in the axial direction. The ground conductor exposed portion E2 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.

Further, the surface of the package substrate 22 is provided in the vicinity of the corner formed by the side L1 on the negative side in the x-axis direction and the side L3 on the positive side in the y-axis direction. The ground conductor exposed portion E3 is partially exposed to one of the ground conductors. The ground conductor exposed portion E3 has a rectangular shape with a long side in the x-axis direction when viewed from the positive side in the z-axis direction.

The light-receiving element array 50 and the light-emitting element array 100 are provided on a portion of the surface of the package substrate 22 on the positive side in the x-axis direction. The light-receiving element array 50 is an element including a plurality of photodiodes that convert optical signals into electrical signals. The light-emitting element array 100 is comprised of electrical information The number is converted into a plurality of diode components of the optical signal.

Further, the drive circuit 26 is provided on the positive side in the x-axis direction of the light-receiving element array 50 and the light-emitting element array 100 on the positive side in the x-axis direction of the surface of the package substrate 22. The drive circuit 26 is a semiconductor circuit element for driving the light-receiving element array 50 and the light-emitting element array 100.

Moreover, as shown in FIG. 3, the drive circuit 26 has a rectangular shape having a long side parallel to the y-axis direction when viewed in plan from the z-axis direction. The drive circuit 26 and the light-receiving element array 50 are connected by wire bonding through the lead wires U. Further, the drive circuit 26 and the light-emitting element array 100 are connected by wire bonding via the lead wires U. Thereby, the electrical signal from the driving circuit 26 is transmitted to the light emitting element array 100 through the lead U, and the electrical signal from the light receiving element array 50 is transmitted to the driving circuit 26 through the lead U.

As shown in FIG. 3, the sealing resin 24 is provided with a sealing portion 24a and leg portions 24b to 24e, and is made of a transparent resin such as epoxy resin. The sealing portion 24a has a substantially rectangular parallelepiped shape and is provided on a portion of the surface of the package substrate 22 on the positive side in the x-axis direction. The sealing portion 24a covers the light receiving element array 50, the light emitting element array 100, and the drive circuit 26.

The leg portions 24b and 24c are arranged at intervals from the negative side to the positive side in the x-axis direction. The leg portions 24b and 24c are rectangular parallelepiped members that protrude from the surface on the negative side in the y-axis direction of the sealing portion 24a toward the side L2 of the package substrate 22. Further, a space H1 in which the convex portion C3 of the metal cover 30 to be described later is fitted is provided between the leg portion 24b and the leg portion 24c.

The leg portions 24d, 24e are arranged at intervals from the negative side to the positive side in the x-axis direction. The leg portions 24d and 24e are members having a rectangular parallelepiped shape that protrudes from the surface on the positive side in the y-axis direction of the sealing portion 24a toward the side L3 of the package substrate 22. Also, at the foot 24d and the foot A space H2 in which the convex portion C6 of the metal cover 30 to be described later is fitted is provided between the portions 24e.

(Composition of light-emitting element array)

Next, the light emitting element array 100 will be described with reference to the drawings. Fig. 4 is a plan view of the light-emitting element array 100 according to the embodiment of the present invention as seen from the positive side in the z-axis direction. Fig. 5 is a cross-sectional view showing A-A or B-B of the light-emitting element array 100 shown in Fig. 4. Further, in the present embodiment, only the two VCSELs 100A and 100B are described, but the number of VCSELs constituting the light-emitting element array 100 of the present invention is not limited thereto.

The light emitting element array 100, as shown in FIG. 4, is provided with two VCSELs 100A, 100B. That is, the VCSELs 100A, 100B are integrated and arrayed, and the VCSELs 100A, 100B are independently driven. Further, the laser beam B1 is emitted from the respective VCSELs 100A, 100B toward the positive side in the z-axis direction. Two VCSELs 100A, 100B, as shown in FIG. 5, are provided on the surface of the common base substrate 128.

The base substrate 128 is made of a semi-insulating semiconductor, specifically, a substrate made of GaAs. The base substrate 128 preferably has a specific resistance of 1.0 × 10 ⁷ Ω ‧ cm or more. By using the base substrate 128 composed of the above-described semi-insulating semiconductor of resistivity, the isolation between the VCESL 100A and the VCSEL 100B can be more surely ensured.

On the surface of the base substrate 128, as shown in FIG. 5, an N-type semiconductor contact layer 130 is laminated. The N-type semiconductor contact layer 130 is provided in each of the VCESL 100A and the VCSEL 100B. Further, the N-type semiconductor contact layer 130 of the VCESL 100A and the N-type semiconductor contact layer 130 of the VCESL 100B are insulated from each other. Further, the N-type semiconductor contact layer 130 is composed of a compound semiconductor having N-type conductivity.

On the surface of the N-type semiconductor contact layer 130, as shown in FIG. 5, a layer of N is laminated. A semiconductor multilayer film reflective layer (hereinafter referred to as an N-type DBR layer) 132. Further, the N-type DBR layer 132 is provided with an arc-shaped groove W when viewed from the positive side in the z-axis direction. The groove W is wound half a turn in the negative side of the x-axis direction near the center of each of the VCESLs 100A and 100B. The bottom of the trench W reaches the surface of the N-type semiconductor contact layer 130. The N-type DBR layer 132 is made of AlGaAs, and is formed by laminating a plurality of layers of Al having different composition ratios with respect to Ga. Thereby, the N-type DBR layer 132 functions as a first reflector for generating laser light of a predetermined frequency. Further, the N-type DBR layer 132 may also serve as an N-type semiconductor contact layer. That is, an N-type semiconductor contact layer is not necessary.

On the surface of the N-type DBR layer 132, as shown in FIG. 5, the layer has an N-type semiconductor Body cover layer 134. The N-type semiconductor cladding layer 134 has a circular shape at the center of the VCESL 100A and 100B when viewed in plan from the z-axis direction. Each of the N-type semiconductor cladding layers 134 is insulated from each other. The N-type semiconductor cladding layer 134 is composed of AlGaAs.

On the surface of the N-type semiconductor cladding layer 134, as shown in FIG. 5, an active layer is provided. Layer 136. Further, the active layer 136 is composed of GaAs and AlGaAs. Further, the GaAs layer is provided by being sandwiched by the AlGaAs layer. In addition, the energy of AlGaAs is prohibited to have a larger bandwidth than GaAs. Moreover, the refractive index of GaAs is larger than that of AlGaAs.

On the surface of the active layer 136, as shown in FIG. 5, a P-type semiconductor cladding layer 138 is provided. The P-type semiconductor cladding layer 138 is composed of AlGaAs.

On the surface of the P-type semiconductor cladding layer 138, as shown in FIG. 5, an oxidized narrow layer 150 is provided. When the oxidized narrow layer 150 is viewed from the z-axis direction, a circular hole 152 is provided substantially at the center of the oxidized narrow layer 150. The oxidized narrow layer 150 is composed of AlGaAs.

On the surface of the oxidized narrow layer 150, as shown in FIG. 5, a P-type semiconductor multilayer film reflective layer (hereinafter referred to as a P-type DBR layer) 140 is provided. Also, one part of the P-type DBR layer 140 is also provided. The P-type semiconductor cladding layer 138 is in contact with the hole 152 provided in the oxidized constricted layer. The P-type DBR layer 140 is made of AlGaAs, and is formed by laminating a plurality of layers of Al with respect to a composition ratio of Ga. Thereby, the P-type DBR layer 140 functions as a second reflector for generating laser light of a predetermined frequency. In addition, the reflectivity of the P-type DBR layer 140 is lower than that of the N-type DBR layer 132. Here, although a semiconductor coating layer is provided to sandwich the active layer, the configuration is not limited thereto. It is also possible to provide a layer having a film thickness generated by resonance as an active layer.

On the surface of the P-type DBR layer 140, as shown in FIG. 5, a P-type semi-conductive layer is laminated. Body contact layer 142. The P-type semiconductor contact layer 142 is composed of a compound semiconductor having P-type conductivity. Further, the P-type DBR layer may also serve as a P-type semiconductor contact layer. That is, a P-type semiconductor contact layer is not necessary.

By the above-mentioned N-type semiconductor contact layer 130, N-type DBR layer 132, N-type half The conductor cladding layer 134, the active layer 136, the P-type semiconductor cladding layer 138, the P-type DBR layer 140, and the P-type semiconductor contact layer 142 constitute a light-emitting region multilayer portion 160.

In addition, the thickness of each layer and the composition ratio of Al to Ga are set to be in light. The position of the abdomen of the center of the standing wave distribution has a peak wavelength of the luminescence spectrum and is configured with a plurality of quantum wells. Thereby, the light-emitting region multilayer portion 160 functions as a light-emitting portion of the VCSELs 100A and 100B. Further, as shown in FIG. 5, by providing the oxidized constriction layer 150, a current can be efficiently injected into the active layer 136, thereby realizing VCSELs 100A and 100B having low power consumption.

On the surface of the P-type semiconductor contact layer 142, as shown in FIG. 5, a ring electrode 921 for an anode is provided. As shown in FIG. 4, the anode ring electrode 921 has a ring shape when viewed in plan from the z-axis direction. Further, the anode electrode does not have to be annular, and may be, for example, a C-shape or a rectangular shape in which one of the annular portions is opened.

The groove W of the N-type DBR layer 132 is provided as shown in FIGS. 4 and 5 Electrode electrode 911. Further, the cathode electrode 911 is in contact with the N-type semiconductor contact layer 130 as shown in FIG. Thereby, the cathode electrode 911 is electrically connected to the N-type semiconductor contact layer 130. Further, as shown in FIG. 4, the cathode electrode 911 has an arc shape when viewed in plan from the z-axis direction. Further, this circular arc is substantially concentric with the ring of the annular anode electrode 921.

The insulating film 162 is provided with a cathode electrode 911 and an anode ring electrode. The surface of the multi-layer portion 160 of the light-emitting region of the VCSEL 100A, 100B other than the portion 921 is provided. Moreover, the material of the insulating film 162 is, for example, tantalum nitride.

In the positive side of the x-axis direction of the VCSEL 100A, 100B, as shown in FIG. As shown, an insulating layer 170 is provided. Further, as shown in FIG. 5, the insulating layer 170 is provided on the insulating film 162 covering the N-type DBR layer 132. As shown in FIG. 4, the insulating layer 170 has a rectangular shape having long sides in the y-axis direction when viewed in plan from the z-axis direction. Further, as a material of the insulating layer 170, for example, polyimide.

The portion on the negative side of the surface of the insulating layer 170 in the y-axis direction is as shown in FIG. A cathode pad electrode 912 is provided. The cathode pad electrode 912 is connected to the cathode electrode 911 through the cathode wiring electrode 913.

In the portion on the positive side of the surface of the insulating layer 170 in the y-axis direction, as shown in FIG. As shown, an anode pad electrode 922 is provided. Further, the anode pad electrode 922 and the cathode pad electrode 912 are separated by a predetermined distance. The anode pad electrode 922 is connected to the anode ring electrode 921 through the anode wiring electrode 923.

Further, as shown in FIGS. 4 and 5, the light-emitting element array 100 is provided with a groove 180 for dividing the VCSELs 100A and 100B. The groove 180, as shown in FIG. 4, is designed to be viewed from the z-axis direction. A lattice-like groove parallel to the x-axis direction and the y-axis direction. Moreover, as shown in FIG. 5, the groove 180 penetrates the insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 in the lamination direction. Furthermore, the bottom of the trench 180 reaches a predetermined depth from the surface of the base substrate 128. Thereby, the VCSELs 100A, 100B can be prevented from being turned on through the N-type semiconductor contact layer 130.

In each VCSEL 100A of the light-emitting element array 100 configured as described above, 100B, by causing a current (driving signal) to flow from the anode pad electrode 922 toward the cathode pad electrode 912, induction discharge is caused in the active layer 136. The light emitted from the active layer is emitted by induction, and is reflected by the N-type DBR layer 132 and the P-type DBR layer 140 to and from the active layer. During and after the round trip, the light is amplified by the induction release, and the laser beam is emitted toward the positive side of the z-axis direction. In addition, since the N-type semiconductor contact layer 130 of the VCSEL 100A is separated from the N-type semiconductor contact layer 130 of the VCSEL 100B, crosstalk between the driving signal of the VCSEL 100A and the driving signal of the VCSEL 100B can be suppressed.

(composition of positioning member)

Next, the socket 20 will be described with reference to the drawings. Fig. 6 is a perspective view showing the appearance of the socket 20 according to the embodiment of the present invention (the metal cover 30 is not shown). Fig. 7 is a perspective view showing the appearance of a positioning member 200 according to an embodiment of the present invention. Fig. 8 is a plan view of the positioning member 200 according to the embodiment of the present invention as seen from the negative side in the z-axis direction. Fig. 9 is a view showing a structure of a package substrate 22 and a plug 40 according to an embodiment of the present invention in a C-C or D-D cross section of the positioning member 200 shown in Fig. 7.

As shown in FIG. 6, the positioning member 200 is provided across the structure substrate 22 and the sealing resin 24 so as to cover the entire surface of the package substrate 22 and the entire sealing resin 24. Further, the positioning member 200 includes a positioning member 220 for a light-emitting element and a positioning member 240 for a light-receiving element. The positioning members 220, 240 are arranged in order from the negative side to the positive side in the y-axis direction. Settings. Further, the positioning member 200 is made of, for example, an epoxy-based or an anti-loning resin.

As shown in FIGS. 7 and 8 , the positioning member 220 for a light-emitting element has a rectangular shape when viewed in plan from the z-axis direction. Further, the positioning member 220 includes a plug guiding portion 222 and a light coupling portion 224.

As shown in FIG. 7, the plug guide portion 222 constitutes a portion of the positioning member 220 on the negative side in the x-axis direction. Further, as shown in FIG. 8, the plug guide portion 222 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Further, the end surface S1 of the plug guiding portion 222 on the positive side in the x-axis direction faces the negative side of the sealing resin 24 in the x-axis direction as shown in FIG. Therefore, the plug guiding portion 222 is located on the mounting substrate 22 on the negative side of the sealing resin 24 in the x-axis direction.

Further, as shown in FIG. 7, the groove G1 for guiding the plug 40 to be described later is substantially parallel to the x-axis at the center of the surface of the plug guiding portion 222 in the y-axis direction. In the plug guide portion 222, a portion on the negative side in the y-axis direction of the groove G1 is referred to as a flat portion F1, and a portion on the positive side in the y-axis direction from the groove G1 is referred to as a flat portion F2. The height H1 of the groove G1 from the substrate 22 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction as shown in FIG.

As shown in FIGS. 7 to 9, the optical coupling portion 224 is placed on the sealing resin 24 so as to constitute a portion of the positioning member 220 on the positive side in the x-axis direction.

Further, as shown in FIG. 7, the optical coupling unit 224 has a main body 226 and a contact portion 228. The body 226 has a rectangular parallelepiped shape. The abutting portion 228 protrudes from the flat surface portion S2 of the plug guiding portion 222 from the end surface S2 on the negative side in the x-axis direction of the main body 226 to substantially the center in the x-axis direction of the flat portion F1. Thereby, the optical coupling unit 224 has an L shape when viewed in plan from the z-axis direction. In addition, it will arrive An end surface of the joint portion 228 on the negative side in the x-axis direction is referred to as an end surface S3. Further, the optical coupling portion 224 is provided with a concave portion D1 and a convex lens 230.

The recess D1 is provided in the y-axis direction of the optical coupling portion 224 as shown in FIG. Near the side of the positive side. Moreover, the recessed portion D1 overlaps with the light-emitting element array 100 when viewed in plan from the z-axis direction. Further, the recessed portion D1 overlaps with the optical axis of the optical fiber 60 connected to the plug 40 to be described later when viewed in plan from the x-axis direction. In addition, the optical axis of the optical fiber 60 is parallel to the x-axis. Moreover, as shown in FIG. 7, the recessed part D1 has a rectangular shape in planar view from the z-axis direction. Further, as shown in FIG. 9, the concave portion D1 has a V shape when viewed in plan from the y-axis direction.

The inner peripheral surface of the concave portion D1 on the negative side in the x-axis direction is the total reflection surface R1. all The reflecting surface R1, as shown in Fig. 9, is parallel to the y-axis. Further, the total reflection surface R1 is inclined counterclockwise by 45° with respect to the z-axis when viewed from the negative side in the y-axis direction. Also, the refractive index of the positioning member 200 is sufficiently larger than air. The laser beam B1 emitted from the light-emitting element array 100 toward the positive side in the z-axis direction enters the optical coupling portion 224, and is totally reflected by the total reflection surface R1 toward the negative side in the x-axis direction, and is transmitted through the sealing resin. 24 travels toward fiber 60. At this time, when the light beam of the laser beam B1 is viewed from the y-axis direction, the angle between the optical axis of the laser beam B1 emitted from the light-emitting element array 100 and the total reflection surface R1 is 45°, and the laser beam toward the optical fiber 60 is obtained. The angle between the optical axis of B1 and the total reflection surface R1 is 45°. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the light-emitting element array 100.

The convex lens 230 (first convex lens) is provided in the optical coupling as shown in FIGS. 8 and 9 The surface of the portion 224 on the negative side in the z-axis direction. Further, the convex lens 230 overlaps the light-emitting element array 100 and each VCSEL when viewed in plan from the z-axis direction. Thereby, the convex lens 230 opposes the light-emitting element array 100 and is located on the optical path of the laser beam B1. Further, the convex lens 230 is inclined from the direction orthogonal to the z-axis The time-dependent shape is a semicircular shape that protrudes toward the negative side of the z-axis. Therefore, the laser beam B1 emitted from the light-emitting element array 100 is condensed or collimated by the convex lens 230, and is incident on the total reflection surface R1.

The positioning member 240 for the light receiving element is as shown in FIGS. 7 and 8 from the z-axis side. It is rectangular in plan view. Further, the positioning member 240 includes a plug guiding portion 242 and a light coupling portion 244.

The plug guiding portion 242, as shown in FIG. 7, constitutes the x-axis side of the positioning member 240 The part on the negative side. Further, as shown in FIG. 8, the plug guide portion 242 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Further, the end surface S4 of the plug guiding portion 242 on the positive side in the x-axis direction faces the negative side of the sealing resin 24 in the x-axis direction as shown in FIG. Therefore, the plug guiding portion 242 is located on the mounting substrate 22 on the negative side of the sealing resin 24 in the x-axis direction.

Further, in the center of the y-axis direction of the surface of the plug guiding portion 242, as shown in the figure As shown in Fig. 7, the groove G2 for guiding the plug 40 to be described later is provided substantially in parallel with the x-axis. In the plug guide portion 242, a portion on the negative side in the y-axis direction of the groove G2 is referred to as a flat portion F3, and a portion on the positive side in the y-axis direction from the groove G2 is referred to as a flat portion F4. The height H3 of the groove G2 from the substrate 22 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction as shown in FIG.

As shown in FIGS. 7 to 9, the optical coupling portion 244 is placed on the sealing resin 24 so as to form a portion of the positioning member 240 on the positive side in the x-axis direction.

Further, as shown in FIG. 7, the optical coupling unit 244 has a main body 246 and a contact portion 248. The body 246 has a rectangular parallelepiped shape. The abutting portion 248 protrudes from the flat surface portion S5 of the main body 246 on the negative side in the x-axis direction along the flat portion F4 of the plug guiding portion 242 to the x-axis direction of the flat portion F4. Basically central. Thereby, the light coupling portion 244 has an L shape when viewed in plan from the z-axis direction. Further, an end surface of the contact portion 248 on the negative side in the x-axis direction is referred to as an end surface S6. Further, the light coupling portion 244 is provided with a concave portion D2 and a convex lens 250.

The recess D2 is provided in the y-axis direction of the optical coupling portion 244 as shown in FIG. Near the side of the negative direction side. Moreover, the concave portion D2 overlaps with the light receiving element array 50 when viewed in plan from the z-axis direction. Further, the recessed portion D2 overlaps with the optical axis of the optical fiber 60 connected to the plug 40, which will be described later, when viewed in plan from the x-axis direction. In addition, the optical axis of the optical fiber 60 is parallel to the x-axis. Moreover, as shown in FIG. 7, the recessed part D2 has a rectangular shape in planar view from the z-axis direction. Further, as shown in FIG. 9, the concave portion D2 has a V shape when viewed in plan from the y-axis direction.

The inner peripheral surface of the concave portion D2 on the negative side in the x-axis direction is the total reflection surface R2. all The reflecting surface R2, as shown in Fig. 9, is parallel to the y-axis. Further, the total reflection surface R2 is inclined counterclockwise by 45° with respect to the z-axis when viewed from the negative side in the y-axis direction. Also, the refractive index of the positioning member 200 is sufficiently larger than air. Therefore, the laser beam B2 emitted from the optical fiber 60 toward the positive side in the x-axis direction enters the optical coupling portion 244, is totally reflected by the total reflection surface R2 toward the negative side in the z-axis direction, and is transmitted through the plug 40 to receive light. The array of elements 50 travels. At this time, when the light beam of the laser beam B2 is viewed from the y-axis direction, the angle between the optical axis of the laser beam B2 emitted from the optical fiber 60 and the total reflection surface R2 is 45°, and the laser beam toward the light-receiving element array 50 is obtained. The angle between the optical axis of B2 and the total reflection surface R2 is 45°. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the light receiving element array 50.

The convex lens 250 is provided on the back surface of the optical coupling portion 244 as shown in FIGS. 8 and 9 . Further, each of the convex lenses 250 overlaps with each VCSEL of the light receiving element array 50 when viewed in plan from the z-axis direction. Thereby, the convex lens 250 faces the light-receiving element array 50 and is located on the optical path of the laser beam B2. also, The convex lens 250 has a semicircular shape that protrudes toward the negative side of the z-axis when viewed from a direction orthogonal to the z-axis. Therefore, the laser beam B2 emitted from the optical fiber 60 is reflected by the total reflection surface R2, and is condensed or collimated by the convex lens 250 to be incident on the light receiving element array 50.

(Composition of metal cover)

Next, the metal cover 30 will be described with reference to the drawings. Fig. 10 is a perspective view showing the appearance of a metal cover 30 according to an embodiment of the present invention.

The metal cover 30 is a piece of metal plate (for example, SUS301) bent into Made with fonts. Further, as shown in FIG. 1, the metal cover 30 covers the positioning member 200 from the positive side in the z-axis direction and the positive side in the y-axis direction and the negative side in the y-axis direction.

The metal cover 30, as shown in FIG. 10, includes an upper surface 32 and side surfaces 34, 36. Above 32 is a plane orthogonal to the z-axis and has a rectangular shape. The side surface 34 is formed by bending the long side of the metal cover 30 from the negative side in the y-axis direction of the upper surface 32 toward the negative side in the z-axis direction. The side surface 36 is formed by bending the long side of the metal cover 30 from the positive side in the y-axis direction of the upper surface 32 toward the negative side in the z-axis direction.

The portion on the negative side of the x-axis direction of the upper surface 32, as shown in FIG. There are engaging portions 32a, 32b for fixing the plug 40 to the socket 20. The engaging portions 32a and 32b are arranged in order from the negative side in the y-axis direction toward the positive side.

The engaging portions 32a, 32b are cut by the upper 32 Formed by a glyph. More specifically, the engaging portions 32a, 32b are opened by being cut in the upper surface 32 toward the positive side in the x-axis direction. Font gap and make The portion surrounded by the notch is formed by being concavely curved toward the negative side in the z-axis direction. Thereby, the engaging portions 32a and 32b have a V-shaped shape that protrudes toward the negative side in the z-axis direction when viewed in plan from the y-axis direction.

Further, as shown in Fig. 10, the short sides on the negative side in the x-axis direction of the upper surface 32 are provided with engaging portions 32c, 32d for fixing the plug 40 to the socket 20. The engaging portions 32c and 32d are metal pieces that protrude from the upper surface 32 toward the negative side in the x-axis direction. The engaging portions 32c and 32d are concavely curved toward the negative side in the z-axis direction at positions substantially at the center in the x-axis direction of the engaging portions 32c and 32d. Thereby, the engaging portions 32c and 32d have a V-shaped shape that protrudes toward the negative side in the z-axis direction when viewed in plan from the y-axis direction.

As shown in FIG. 10, the long sides of the side surface 34 on the negative side in the z-axis direction are sequentially projected from the negative side toward the positive side in the x-axis direction toward the positive side in the negative direction side in the z-axis direction. Arrange the settings. The convex portions C1 to C3 are fixed to the structural substrate 22 by an adhesive, respectively. Further, the convex portion C1 is connected to the ground conductor exposed portion E2 of the package substrate 22. Further, the convex portion C3 is fitted into the space H1 provided between the leg portion 24b of the sealing resin 24 and the leg portion 24c. Thereby, the metal cover 30 is positioned relative to the package substrate 22.

As shown in FIG. 10, the long sides of the side surface 36 on the negative side in the z-axis direction are sequentially projected from the negative side toward the positive side in the x-axis direction toward the positive side in the negative direction side in the z-axis direction. Arrange the settings. The convex portions C4 to C6 are fixed to the package substrate 22 by an adhesive, respectively. Further, the convex portion C4 is connected to the ground conductor exposed portion E3 of the package substrate 22. Further, the convex portion C6 is fitted into the space H2 provided between the leg portion 24d of the sealing resin 24 and the leg portion 24e. Thereby, the metal cover 30 is positioned relative to the package substrate 22.

Further, as shown in FIG. 1, the metal cover 30 covers the positioning member 200 from the positive side in the z-axis direction and the positive side in the y-axis direction and the negative side in the y-axis direction. Further, in the negative side of the socket 20 in the x-axis direction, as shown in FIG. 1, an opening A3 into which the plug 40 to be described later is inserted is formed.

(composition of the plug)

A plug 40 according to an embodiment of the present invention will be described with reference to the drawings. Figure 11 is a perspective view showing the appearance of a plug according to an embodiment of the present invention. Fig. 12 is a plan view showing a plug according to an embodiment of the present invention from the negative side in the z-axis direction.

The plug 40, as shown in Fig. 11, is provided at one end of the optical fiber 60. Plug 40 is provided The transmitting side plug 42 and the receiving side plug 46. Further, the plug 40 is made of, for example, an epoxy-based or an anti-loning resin.

The transmitting side plug 42 transmits the laser beam B1 from the optical fiber 60. As shown in FIG. 11, the signal transmitting side plug 42 includes an optical fiber insertion portion 42a and an ear portion 42b. The optical fiber insertion portion 42a constitutes a portion on the positive side in the y-axis direction of the transmitting-side plug 42, and has a rectangular parallelepiped shape extending in the x-axis direction. An opening A1 for inserting the optical fiber 60 is provided in a portion on the negative side in the x-axis direction of the optical fiber insertion portion 42a.

As shown in FIG. 11, the opening A1 is formed by cutting the upper surface S7 of the optical fiber insertion portion 42a on the positive side in the z-axis direction and the end surface S8 on the negative side in the x-axis direction. Further, an inner peripheral surface on the positive side in the x-axis direction of the opening A1 is provided with a hole H7 for guiding the core of the inserted optical fiber 60 to the front end of the transmitting-side plug 42. Further, the number of holes H7 corresponds to the number of the optical fibers 60, and is two in the present embodiment.

Further, as shown in FIG. 11, a portion D3 for injecting an adhesive for fixing the optical fiber 60 is provided in a portion on the positive side in the x-axis direction of the optical fiber insertion portion 42a. The concave portion D3 is recessed from the surface of the optical fiber insertion portion 42a toward the back surface. A hole H7 is provided in the inner circumferential surface of the concave portion D3 on the negative side in the x-axis direction. The hole H7 is connected to the inner peripheral surface of the opening A1 on the positive side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the concave portion D3 from the opening A1 through the hole H7. Reaching the recess D3 The core wire of the optical fiber 60 abuts against the inner circumferential surface (abutment surface) S9 on the positive side in the x-axis direction of the concave portion D3. Further, the optical fiber 60 is fixed to the communication side plug 42 by injecting an adhesive made of a transparent resin, for example, an epoxy resin into the opening A1 and the recess D3.

As shown in FIGS. 9 and 12, a convex lens 44 (third convex lens) is provided on the end surface S10 of the optical fiber insertion portion 42a on the positive side in the x-axis direction. The convex lens 44 has a semicircular shape that protrudes toward the positive side in the x-axis direction when viewed from a direction orthogonal to the x-axis direction. Thereby, the laser beam B1 emitted from the light-emitting element array 100 and reflected by the total reflection surface R1 is condensed or collimated by the convex lens 44.

Further, the convex lens 44 overlaps the optical axis of the optical fiber when viewed in plan from the x-axis direction. Therefore, the laser beam B1 condensed or collimated by the convex lens 44 passes through the resin of the optical fiber insertion portion 42a. Further, the laser beam B1 is transmitted to the core of the core wire abutting against the optical fiber 60 of the abutting surface S9.

As shown in FIG. 11, the upper surface S7 of the optical fiber insertion portion 42a is provided with a projection N1 that engages with the engagement portion 32a of the metal cover 30. The projection N1 is provided between the opening A1 and the recess D3 in the x-axis direction and extends in the y-axis direction. Further, the projection N1 has a triangular shape that protrudes toward the positive side in the z-axis direction when viewed in plan from the y-axis direction.

On the back surface of the optical fiber insertion portion 42a, as shown in Figs. 11 and 12, a convex portion C7 is provided. The convex portion C7 corresponds to the groove G1 of the plug guiding portion 222 of the positioning member 220. The convex portion C7 is disposed in parallel with the x-axis from the end surface S8 toward the end surface S10.

As shown in FIG. 11 and FIG. 12, the ear portion 42b protrudes from the vicinity of the end portion on the negative side in the x-axis direction of the optical fiber insertion portion 42a toward the negative side in the y-axis direction. Thereby, the transmitting side plug 42 has an L shape. Further, the ear portion 42b functions as a grip portion when the communication side plug 42 is inserted and removed. Further, in a substantially central portion of the ear portion 42b, a substantially rectangular shape is drawn in a plan view from the z-axis direction. hole.

In addition, the connection operation between the transmitting side plug 42 and the socket 20 is performed by making the convex portion C7 is press-fitted along the groove G1 toward the positive side in the x-axis direction. At this time, the end surface S11 of the ear portion 42b on the positive side in the x-axis direction abuts against the end surface S3 of the abutting portion 228 of the positioning member 220 shown in FIG.

Moreover, by the connection operation of the transmitting side plug 42 and the socket 20, as shown in FIG. The signal transmitting side plug 42 is placed on the positioning member 220. Further, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the transmitting-side plug 42 is pressed into the socket 20 is the positive side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 is parallel to the insertion direction of the transmitting side plug 42.

Moreover, when the transmitting side plug 42 is connected to the socket 20, the engaging portion of the metal cover 30 32a is engaged with the projection N1, and the engaging portion 32c is engaged with the corner formed by the upper surface S7 of the transmitting side plug 42 and the end surface S8, whereby the transmitting side plug 42 is fixed to the socket 20.

The receiving side plug 46 is sent to the laser beam B2 of the light receiving element array 50. Receiving As shown in FIG. 11, the side plug 46 includes an optical fiber insertion portion 46a and an ear portion 46b. The optical fiber insertion portion 46a constitutes a portion on the negative side in the y-axis direction of the reception side plug 46, and has a rectangular parallelepiped shape. An opening portion A2 through which the optical fiber 60 is inserted is provided in a portion of the optical fiber insertion portion 46a on the negative side in the x-axis direction.

As shown in FIG. 11, the opening A2 is formed by cutting the upper surface S12 of the optical fiber insertion portion 46a on the positive side in the z-axis direction and the end surface S13 on the negative side in the x-axis direction. Further, an inner peripheral surface of the opening A2 on the positive side in the x-axis direction is provided with a hole H8 for guiding the core of the inserted optical fiber 60 to the front end of the receiving side plug 46. Further, the number of holes H8 corresponds to the number of the optical fibers 60, and is two in the present embodiment.

Further, in the portion on the positive side in the x-axis direction of the optical fiber insertion portion 46a, As shown in Fig. 11, a recess D4 for injecting an adhesive for fixing the optical fiber 60 is provided. The recess D4 is recessed from the surface of the optical fiber insertion portion 46a toward the back surface. A hole H8 is provided in the inner peripheral surface of the concave portion D4 on the negative side in the x-axis direction. The hole H8 is connected to the inner peripheral surface of the opening A2 on the positive side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the concave portion D4 from the opening portion A2 through the hole H8. The core wire of the optical fiber 60 that has reached the concave portion D4 abuts against the inner circumferential surface (contact surface) S14 on the positive side in the x-axis direction of the concave portion D4. Further, the optical fiber 60 is fixed to the reception side plug 46 by injecting an adhesive made of a transparent resin, for example, an epoxy resin into the opening A2 and the recess D4.

A convex lens 48 is provided on the end surface S15 of the optical fiber insertion portion 46a on the positive side in the x-axis direction as shown in Figs. 9 and 12 . The convex lens 48 has a semicircular shape that protrudes toward the positive side in the x-axis direction when viewed from a direction orthogonal to the x-axis direction.

Further, the convex lens 48 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Therefore, the laser beam B2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 48, and travels toward the total reflection surface R2. Further, the laser beam B2 is reflected by the total reflection surface R2 and transmitted to the light receiving element array 50.

As shown in FIG. 11, the upper surface S12 of the optical fiber insertion portion 46a is provided with a projection N2 that engages with the engagement portion 32b of the metal cover 30. The projection N2 is provided between the opening A2 and the recess D4 in the x-axis direction and extends in the y-axis direction. Moreover, the projection N2 has a triangular shape that protrudes toward the positive side in the z-axis direction when viewed in plan from the y-axis direction.

On the back surface of the optical fiber insertion portion 46a, as shown in Figs. 11 and 12, a convex portion C8 is provided. The convex portion C8 corresponds to the groove G2 of the plug guiding portion 242 of the positioning member 240. The convex portion C8 is disposed in parallel with the x-axis from the end surface S13 toward the end surface S15.

The ear portion 46b, as shown in Figs. 11 and 12, is from the x-axis of the optical fiber insertion portion 46a. The end portion on the negative side of the direction protrudes toward the positive side in the y-axis direction. Thereby, the receiving side plug 46 has an L shape. Further, the ear portion 46b functions as a grip portion when the receiving side plug 46 is inserted and removed. Further, an extraction hole having a substantially rectangular shape when viewed from the z-axis direction is provided substantially at the center of the ear portion 46b.

Further, the connection operation between the receiving side plug 46 and the socket 20 is performed by pressing the convex portion C8 along the groove G2 toward the positive side in the x-axis direction. At this time, the end surface S16 of the ear portion 46b on the positive side in the x-axis direction abuts against the end surface S6 of the abutting portion 248 of the positioning member 200 shown in FIG.

Further, by the connection operation of the receiving side plug 46 and the socket 20, as shown in FIG. 9, the receiving side plug 46 is placed on the positioning member 240. Further, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the receiving side plug 46 is pressed into the socket 20 is the positive side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 is parallel to the insertion direction of the receiving side plug 46.

Further, when the receiving side plug 46 is connected to the socket 20, the engaging portion 32b of the metal cover 30 is engaged with the projection N2, and the engaging portion 32d is engaged with the corner formed by the upper surface S12 and the end surface S13 of the receiving side plug 46. Thereby, the receiving side plug 46 is fixed to the socket 20.

In the optical transmission module 10 configured as described above, as shown in FIG. 9, the laser beam B1 emitted from the light-emitting element array 100 toward the positive side in the z-axis direction passes through the sealing resin 24 and the positioning member 220. Further, the laser beam B1 is reflected by the total reflection surface R1 toward the negative side in the x-axis direction, and is transmitted through the plug 40 to the core of the optical fiber 60. Therefore, the positioning member 220 has a function of optically coupling the core of the optical fiber 60 to the light emitting element array 100.

Further, in the optical transmission module 10, as shown in FIG. 9, the laser beam B2 emitted from the optical fiber 60 toward the positive side in the x-axis direction passes through the positioning member 240. Further, the laser beam B2 is reflected by the total reflection surface R2 toward the negative side in the z-axis direction, passes through the sealing resin 24, and goes to the light-receiving element array 50. Transfer. Therefore, the positioning member 240 has a function of optically coupling the core of the optical fiber 60 to the light receiving element array 50.

(Production method)

Hereinafter, a method of manufacturing the optical transmission module 10 according to an embodiment of the present invention will be described in the order of the light-emitting element array 100, the socket 20, the plug 40, and the optical transmission module 10.

(Method of Manufacturing Light-Emitting Element Array)

First, an N-type semiconductor contact layer 130, an N-type DBR layer 132, an N-type semiconductor cladding layer 134, an active layer 136, a P-type semiconductor cladding layer 138, and a P-type DBR layer 140 are sequentially laminated on the surface of the base substrate 128. P-type semiconductor contact layer 142.

Next, the P-type semiconductor contact layer 142, the P-type DBR layer 140, the P-type semiconductor cladding layer 138, the active layer 136, and the N-type semiconductor cladding layer are formed in addition to the portions constituting the light-emitting region multilayer portion 160 of each of the VCSELs 100A and 100B. 134 is sequentially etched in a predetermined pattern. At this step, etching is performed to the surface of the N-type DBR layer 132. Thereby, in addition to the N-type semiconductor contact layer 130 and the N-type DBR layer 132, the light-emitting region multilayer portion 160 of the VCSELs 100A, 100B is separated by a predetermined distance.

The N-type semiconductor contact layer 130 is exposed by etching a position close to the light-emitting region multilayer portion 160 in a region exposed on the surface of the N-type DBR layer 132. A cathode electrode 911 is formed in a region where the N-type semiconductor contact layer 130 is exposed.

Further, an anode ring electrode 921 is formed on the surface of the P-type semiconductor contact layer 142 of the unetched light-emitting region multilayer portion 160.

On the surface side of the base substrate 128, an insulating film 162 is formed in addition to the surfaces of the cathode electrode 911 and the anode ring electrode 921.

An insulating layer 170 is formed in a region of the surface of the insulating film 162 which is close to the light-emitting region multilayer portion 160.

A cathode pad electrode 912 and an anode pad electrode 922 are formed on the surface of the insulating layer 170.

A cathode wiring electrode 913 that connects the cathode electrode 911 and the cathode pad electrode 912 is formed. An anode wiring electrode 923 that connects the anode ring electrode 921 and the anode pad electrode 922 is formed.

The insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 are formed so as to divide the regions of the adjacent VCSELs 100A and 100B so as to form recesses having a concave shape from the surface of the base substrate 128 to the inside to a predetermined depth. 180. Through the above steps, the light emitting element array 100 is formed.

(Method of manufacturing the socket)

Next, a method of manufacturing the socket 20 will be described with reference to the drawings. Figure 13 is a diagram showing the process of a socket according to an embodiment of the present invention.

First, solder is applied on the upper surface of the mother substrate 122 (not shown in the drawing) which is an assembly of the constituent substrates 22. More specifically, the cream solder is pressed using a squeegee on the mother substrate 122 on which the metal mask is placed. Next, the metal mask is removed from the mother substrate 122, thereby printing the solder to the mother substrate 122.

Next, the capacitor is placed on the solder of the mother substrate 122. Thereafter, the mother substrate 122 is heated to solder the capacitor.

After the capacitor is soldered, an Ag paste is applied to a predetermined position on the mother substrate 122. The coated Ag is placed on the driving circuit 26, the light receiving element array 50, and the light emitting element array 100. Row die bonding. Further, the drive circuit 26 and the light-receiving element array 50 are connected by wire bonding using Au leads, and the drive circuit 26 is connected to the light-emitting element array 100 by wire bonding.

After that, the capacitor, the driving circuit 26, the light receiving element array 50, and the illuminating element The array 100 is subjected to resin molding. Further, the mother substrate 122 is cut using a cutter, thereby obtaining a plurality of package substrates 22.

Next, the positioning member 220 is placed on the package substrate 22 and the sealing resin 24 on. More specifically, a UV-curable adhesive is applied to a region on the negative side in the x-axis direction of the surface of the sealing resin 24a. After the application of the adhesive, as shown in FIG. 13, the position of the center T100 of the light-emitting portion of the light-emitting element array 100 is confirmed by the position recognition camera V1.

Next, a loading machine for placing the positioning member 220 on the sealing resin 24 The V2 suction lifts the positioning member 220. Then, as shown in FIG. 13, the position of the lens center T230 of the convex lens 230 of the positioning member 220 is confirmed by the position recognition camera V3 in a state where the positioning device 220 is adsorbed by the mounting machine V2.

Illumination of the light-emitting element array 100 confirmed by the position recognition camera V1 The positional data of the center T100 of the part and the positional data of the lens center T230 of the convex lens 230 of the positioning member 220 confirmed by the position recognition camera V3 are used to calculate the relative positions of the light-emitting portion of the light-emitting element array 100 and the convex lens 230. Based on the calculated result, the amount of movement of the loading machine V2 is determined.

Next, the positioning member 220 is moved by the loading machine V2 to determine the amount of movement. Thereby, the lens center T230 of the convex lens 230 coincides with the optical axis of the light emitting element array 100.

The operation of placing the positioning member 240 on the package substrate 22 and the sealing resin 24 is performed in parallel with the mounting operation of the positioning member 220. More specifically, in the sealing resin 24a After the UV-curable adhesive is applied to the region on the negative side in the x-axis direction of the surface, the position of the center T50 of the light-receiving portion of the light-receiving element array 50 is confirmed by the position recognition camera V4 as shown in FIG.

Next, a mounting machine for placing the positioning member 240 on the sealing resin 24 The V5 suction lifts the positioning member 240. Next, as shown in FIG. 13, in the state where the positioning device 240 is adsorbed by the mounting machine V5, the position of the lens center T250 of the convex lens 250 of the positioning member 240 is confirmed by the position recognition camera V6.

Receiving light from the light-receiving element array 50 confirmed by the position recognition camera V4 The positional data of the center T50 of the part and the positional data of the lens center T250 of the convex lens 250 of the positioning member 240 confirmed by the position recognition camera V6 are used to calculate the relative positions of the light-emitting portion of the light-receiving element array 50 and the convex lens 250. Based on the calculated result, the amount of movement of the mounted machine V5 is determined.

Next, the positioning member 240 is moved by the loading machine V5 to determine the amount of movement. Thereby, the lens center T250 of the convex lens 250 coincides with the optical axis of the light receiving element array 50.

The disposed positioning members 220, 240 are irradiated with ultraviolet rays. Further, in the ultraviolet irradiation, the positioning members 220 and 240 are in a state in which the mounting machines V2 and V5 are pressed against the package substrate 22 and the sealing resin 24. Thereby, when the UV-type hardener located between the positioning members 220, 240 and the sealing resin 24 is hardened, the positioning members 220, 240 are fixed to the structure substrate 22 and the sealing resin 24 without causing a positional displacement.

Next, the metal cover 30 is attached to the package substrate 22 on which the positioning member 200 is placed. More specifically, the space H1 between the leg portions 24b and 24c on the surface of the structure substrate 22, the space H2 between the leg portions 24d and 24e, and the portion where the convex portions C2 and C5 of the metal cover 30 are in contact with each other are coated with an epoxy system. A thermosetting adhesive such as a thermosetting adhesive. Further, the ground conductor exposed portions E2 and E3 of the package substrate 22 are coated. Conductive paste such as Ag.

After applying the adhesive and the conductive paste, the convex portion C3 of the metal cover 30 is fitted to The portion of the leg portion 24b of the sealing resin 24 on the substrate 22 and the portion of the leg portion 24c, that is, the space H1. Further, the convex portion C6 is fitted to the portion of the leg portion 24d of the sealing resin 24 and the leg portion 24e, that is, the space H2. Thereby, the position of the metal cover 30 with respect to the structure substrate 22 is determined. Further, at the same time as the positioning of the metal cover 30, the convex portions C1 to C6 are in contact with the adhesive or the conductive paste on the package substrate 22.

After the metal cover 30 is fitted, the package substrate 22 is heated to make an adhesive and a guide. Electrical paste hardening. Thereby, the metal cover 30 is fixed to the package substrate 22. Further, by attaching the metal cover 30 to the package substrate 22, the convex portions C1, C4 of the metal cover 30 are in contact with the ground conductor exposed portions E2, E3 of the package substrate 22. Thereby, the metal cover 30 is connected to the ground conductor in the package substrate 22, and the ground potential is maintained. The socket 20 is completed by the above steps.

(Method of manufacturing plug)

First, the optical fiber 60 inserted into the plug 40 is cut to a predetermined length.

Next, the coating near the front end of the optical fiber 60 is removed using a fiber stripper. After the coating near the front end is removed, the opening of the core wire of the optical fiber 60 is exposed.

Next, a transparent adhesive such as an epoxy resin for fixing the optical fiber 60 is injected into the openings A1 and A2 and the recesses D3 and D4 of the plug 40 shown in FIG. Furthermore, the core of the optical fiber 60 is pressed into contact with the faces S9, S14 of the plug 40. Next, the optical fiber 60 is fixed to the plug 40 by hardening the transparent adhesive.

(Manufacturing method of optical transmission module)

The plug 40 is attached to the socket 20. The connection of the plug 40, as described above, is made by the plug 40 The convex portions C7 and C8 are press-fitted along the grooves G1 and G2 of the positioning members 220 and 240 from the opening A3 provided between the metal cover 30 and the socket 20 toward the positive side in the x-axis direction. The optical transmission module 10 is completed through the above process.

(effect)

According to the optical transmission module 10 and the socket 20 configured as described above, isolation can be sufficiently obtained between the VCSELs 100A and 100B. In more detail, the VCSELs 100A, 100B are placed on a substrate, that is, the base substrate 128. The base substrate 128 is a semi-insulating semiconductor substrate. Thereby, the current (drive signal) flowing from the anode ring electrode 921 in the VCSELs 100A, 100B sequentially passes through the P-type semiconductor contact layer 142, the P-type DBR layer 140, the P-type semiconductor cladding layer 138, the active layer 136, Since the N-type semiconductor cladding layer 134, the N-type DBR layer 132, the N-type semiconductor contact layer 130, and the cathode electrode 911 do not pass through the base substrate 128. Therefore, the driving signal transmitted to the VCSEL 100A is not transmitted to the VCSEL 100B through the base substrate 128, and the driving signal transmitted to the VCSEL 100B is not transmitted to the VCSEL 100A through the base substrate 128. Furthermore, the N-type semiconductor contact layer 130 of the VCSEL 100A is separated from the N-type semiconductor contact layer 130 of the VCSEL 100B. Therefore, the driving signal transmitted to the VCSEL 100A is not transmitted to the VCSEL 100B through the N-type semiconductor contact layer 130, and the driving signal transmitted to the VCSEL 100B is not transmitted to the VCSEL 100A through the N-type semiconductor contact layer 130. That is, according to the optical transmission module 10 and the socket 20, isolation can be sufficiently obtained between the VCSELs 100A, 100B.

Further, in the optical transmission module 10 and the socket 20, as described below, the optical loss of the laser beam B1 can be reduced. More specifically, the laser beam B1 is refracted when the resin having a relatively large refractive index is emitted toward the air having a relatively small refractive index. Therefore, the laser beam B1 traveling in the air is more diffused and simultaneously transmitted than the laser beam B1 traveling in the resin. Therefore, in the optical beam of the laser beam B1 The path is such that the ratio of the resin is high and the ratio of the air is low, whereby the diffusion of the laser beam B1 can be suppressed. Therefore, in the socket 20, the laser beam B1 emitted from the light-emitting element array 100 passes through the positioning member 200 made of resin. Thereby, in the optical path of the laser beam B1, the proportion of the resin becomes high, and the proportion of the air becomes low. As a result, the diffusion of the laser beam B1 can be suppressed. Therefore, the intensity of the laser beam B1 incident on the optical fiber 60 becomes large, and the optical loss of the laser beam B1 can be reduced. Further, for the same reason, the optical loss of the laser beam B2 can also be reduced.

Moreover, the optical transmission module 10 and the socket 20 can be further reduced as described below. Optical loss of low laser beam B1. At the socket 20, the laser beam B1 emitted from the light-emitting element array 100 passes through the sealing resin 24. Thereby, in the optical path of the laser beam B1, the proportion of the resin becomes large, and the proportion of the air becomes small. As a result, the diffusion of the laser beam B1 can be suppressed. Therefore, the intensity of the laser beam B1 incident on the optical fiber 60 becomes large, and the optical loss of the laser beam B1 can be reduced. Further, for the same reason, the optical loss of the laser beam B2 can also be reduced.

In the optical transmission module 10 and the socket 20, as shown in FIG. 9, in the laser beam B1 A total reflection surface R1 is provided on the light path. Further, the total reflection surface R1 and the optical axis of the optical fiber 60 form an angle of 45, and the total reflection surface R1 and the light-emitting element array 100 form an angle of 45°. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 and the total reflection surface R1 are equal to the angle formed by the light-emitting element array 100. Thereby, in the optical transmission module 10 and the socket 20, the optical fiber 60 and the light-emitting element array 100 can be made even if the optical axis of the optical fiber 60 is not in the z-axis direction which is the same as the emission direction of the laser beam B1 from the light-emitting element array 100. Optical coupling.

In the optical transmission module 10 and the socket 20, as shown in FIG. 9, in the laser beam B2 A total reflection surface R2 is provided on the light path. Further, the total reflection surface R2 forms an angle of 45 with the optical axis of the optical fiber 60, and the total reflection surface R2 and the light receiving element array 50 form an angle of 45°. Total reflection The angle formed by the plane R2 and the optical axis of the optical fiber 60 and the angle formed by the total reflection surface R2 and the light receiving element array 50 are equal. Thereby, in the optical transmission module 10 and the socket 20, the optical fiber 60 and the light receiving element array 50 can be optically coupled even if the optical axis of the optical fiber 60 is not in the z-axis direction which is the same as the light receiving direction of the light receiving element array 50.

Moreover, in the optical transmission module 10 and the socket 20, as described above, by making light in the resin Internal transfer can suppress the diffusion of the laser beams B1, B2 with respect to the optical axis. Thereby, the convex lenses 230 and 250 and the total reflection surfaces R1 and R2 provided in the socket 20 can be made small. As a result, the optical transmission module 10 and the socket 20 can be made smaller and lower in height.

Moreover, as shown in FIG. 9, the insertion direction of the plug 40 to the socket 20, and the optical fiber The optical axis of 60 is the same as the x-axis direction. Thereby, even if the plug 40 is insufficiently mounted to the socket 20, the optical axis of the optical fiber 60 does not deviate as long as the distance from the front end of the optical fiber 60 to the light-receiving element array 50 or the light-emitting element array 100 becomes long. Therefore, according to the optical transmission module 10, optical loss of the optical fiber 60 and the light receiving element array 50 or the light emitting element array 100 accompanying the mounting failure of the plug 40 can be suppressed.

In the optical transmission module 10 and the socket 20, a table is provided on the back surface of the package substrate 22. Surface mount electrode E1. Thereby, the optical transmission module 10 can be surface-mounted without providing a connector for connection on the circuit board on which the optical transmission module 10 is mounted. Therefore, the substantial area occupied by the optical transmission module 10 on the circuit substrate on which the optical transmission module 10 is mounted can be suppressed.

In the optical transmission module 10 and the socket 20, as shown in FIG. 9, at the positioning member 220 A convex lens 230 is provided on the back surface of the light coupling portion 224. Therefore, the laser beam B1 from the light-emitting element array 100 passes through the convex lens 230. At this time, even if the position of the light-emitting element array 100 is displaced relative to the positioning member 220, the laser beam B1 is concentrated or collimated by the convex lens 230. It travels toward the total reflection surface R1. Therefore, according to the socket 20 and the optical transmission module 10, optical loss due to positional displacement of the light-emitting element array 100 can be suppressed.

In the optical transmission module 10 and the socket 20, as shown in FIG. 9, at the positioning member 200 A convex lens 250 is provided on the back surface of the light coupling portion 244. Therefore, the laser beam B2 emitted from the optical fiber 60 passes through the convex lens 250. At this time, even if the optical axis of the laser beam B2 reflected by the total reflection surface R2 is shifted, the laser beam B2 is collected or collimated by the convex lens 250 to travel toward the light receiving element array 50. Therefore, according to the socket 20 and the optical transmission module 10, the optical loss caused by the shift of the optical axis of the laser beam B2 can be suppressed.

In the optical transmission module 10, as shown in FIG. 9, the end face of the transmitting side plug 42 S10 is provided with a convex lens 44. Therefore, the laser beam B1 reflected by the total reflection surface R1 passes through the convex lens 44. At this time, the laser beam B1 is concentrated or collimated by the convex lens 44 to travel toward the optical fiber 60. Therefore, according to the optical transmission module 10, the optical loss caused by the shift of the optical axis of the laser beam B1 can be suppressed.

In the optical transmission module 10, as shown in FIG. 9, on the end face of the receiving side plug 46 S15 is provided with a convex lens 48. Therefore, the laser beam B2 emitted from the optical fiber 60 passes through the convex lens 48. At this time, even if the position of the optical fiber 60 is displaced from the plug 40, the laser beam B2 is condensed or collimated by the convex lens 48 to travel toward the total reflection surface R2. Therefore, according to the optical transmission module 10, the optical loss caused by the positional deviation of the optical fiber 60 can be suppressed.

In the optical transmission module 10, the strength of the plug 40 can be improved. Figure 14 is a study A cross-sectional view of the socket 400 and the plug 41 is known. More specifically, when the positioning member 200 is entirely provided on the surface of the sealing resin 25 as in the optical transmission module 400 shown in FIG. 14, the thickness of the plug 41 in the z-axis direction is reduced. Therefore, the strength of the plug 41 is lowered. Therefore, in the optical transmission module 10, as shown in FIG. 9, the positioning member 200 is provided across the package substrate 22 and the sealing resin 24. Also, plug 40 On the plug guides 222, 242 of the positioning member 200. Further, the heights h1, h3 of the grooves G1, G2 of the plug guiding portions 222, 242 are lower than the height h2 of the sealing resin 24. Further, the optical axis of the optical fiber 60 is located on the positive side of the sealing resin 24 in the z-axis direction. Thereby, in the optical transmission module 10, the plug 40 can be made larger in the z-axis direction than the optical transmission module 400 shown in FIG. Therefore, in the optical transmission module 10, the strength can be improved.

Further, in the optical transmission module 10, since the plug 40 can be made larger in the z-axis direction, Therefore, the plug 41 of the optical transmission module 400 is easier to grasp. Therefore, in the optical transmission module 10, the connection work of the plug 40 to the socket 20 is easy.

Moreover, between the metal cover 30 of the optical transmission module 10 and the socket 20, as shown in FIG. As shown, an opening A3 is provided. The connection of the plug 40 is performed by inserting the plug 40 from the opening A3. Therefore, in the optical transmission module 10, when the plug 40 is detached, the metal cover 30 does not need to be removed, and the attachment and detachment work of the plug 40 is easy.

Further, the metal cover 30 is provided with engaging portions 32a to 32d for fixing the plug 40. Thereby, the positional displacement of the plug 40 with respect to the positioning member 200 can be prevented. As a result, the optical axis shift of the optical fiber 60 can be prevented. Therefore, according to the optical transmission module 10, the optical axis shift of the optical fiber 60 can be prevented, and optical loss can be suppressed.

The manufacturing method of the optical transmission module 10 and the socket 20 is as described below. Suppression of a positional shift between the light emitting element array 100 and the convex lens 230 is suppressed. More specifically, when the positioning member 200 is mounted on the package substrate 22, the pin P1 provided on the package substrate 22 shown in FIG. 15 is conventionally used. The positioning member 200 is fixed to the package substrate 22 by inserting the pin P1 provided on the package substrate 22 into the hole H9 provided in the positioning member 200. In this case, the positional shift at the time of manufacture of the pin P1 on the package substrate 22 or the positional shift when the light-emitting element array 100 is mounted is in the light-emitting element array. A positional shift occurs between the 100 and the convex lens 230 of the positioning member 200.

Therefore, in the manufacturing method of the optical transmission module 10 and the socket 20, the positioning structure will be When the component 200 is mounted on the package substrate 22, the position confirmation camera confirms the positional relationship between the center T100 of the light-emitting portion of the light-emitting element array 100 and the lens center T230 of the convex lens 230, and simultaneously mounts the positioning member 200 on the package substrate 22. . Thereby, the light-emitting element array 100 and the convex lens 230 are directly positioned without being transmitted through the pin P1. As a result, in the manufacturing method of the optical transmission module 10 and the socket 20, it is not necessary to consider the positional shift of the pin P1 of the package substrate 22 or the positional shift of the light-emitting element array 100, and it is possible to suppress the light-emitting element array 100 and the convex lens. A positional offset occurs between 230. Further, for the same reason, it is also possible to suppress occurrence of a positional shift between the light-receiving element array 50 and the convex lens 250.

(Modification)

Hereinafter, the configuration of the optical transmission module 10' according to the modification will be described. Figure 16 is a cross-sectional view showing a light transmitting module 10' and a socket 20' according to a modification. For the appearance, use Figure 1.

The difference between the optical transmission module 10 and the optical transmission module 10' is that the positioning member 200 is further provided with a convex lens. The other points are not different between the optical transmission module 10 and the optical transmission module 10', and therefore the description thereof will be omitted. In addition, in FIG. 16, the same structure as the optical transmission module 10 is given the same symbol as the optical transmission module 10.

As shown in FIG. 16, a convex lens 232 is provided on the total reflection surface R1 of the positioning member 220. Thereby, the laser beam B1 emitted from the light-emitting element array 100 is collected or collimated by the convex lens 232, and is transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10', the optical loss can be further suppressed as compared with the optical transmission module 10.

Moreover, in the opposite direction of the positioning member 220 and the transmitting side plug 42, as shown in FIG. As shown, a convex lens 234 (second convex lens) is provided. Thereby, the laser beam B1 reflected by the total reflection surface R1 is condensed or collimated by the convex lens 234, and is transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10', the optical loss can be further suppressed as compared with the optical transmission module 10.

A convex lens 252 is provided on the total reflection surface R2 of the positioning member 240. Thereby, the laser beam B2 emitted from the optical fiber 60 is collected or collimated by the convex lens 252, and is transmitted to the light receiving element array 50. Therefore, according to the optical transmission module 10', the optical loss can be further suppressed as compared with the optical transmission module 10.

Further, as shown in FIG. 16, a convex lens 254 is provided on the surface of the positioning member 240 opposed to the receiving side plug 46. Thereby, the laser beam B2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 254, and is transmitted to the total reflection surface R2. Therefore, according to the optical transmission module 10', the optical loss can be further suppressed as compared with the optical transmission module 10.

(Other embodiments)

The optical transmission module and the socket of the present invention are not limited to the optical transmission modules 10 and 10' of the above embodiment, and can be modified within the scope of the gist.

As described above, the present invention is useful in an optical transmission module and a socket, and is particularly excellent in that it can ensure isolation between VCSELs.

A3‧‧‧ openings

10‧‧‧Optical transmission module

20‧‧‧ socket

40‧‧‧ plug

Claims (10)

A socket for optical communication, which is a plug for connecting one end of an optical fiber, and is characterized in that: an array of light-emitting elements is integrated by a plurality of vertical resonator surface-emitting lasers; a positioning member makes a plurality of The core of the optical fiber is optically coupled to the plurality of vertical resonator surface-emitting lasers; and the substrate is configured to form the light-emitting element array; and the light-emitting element array has a resistivity of 1.0×10 ⁷ Ω·cm or more a bottom substrate; a light-emitting region multilayer portion formed on a surface of the base substrate, comprising an N-type semiconductor multilayer film reflective layer, an active layer provided with a quantum well, and a P-type semiconductor multilayer film reflective layer; and an anode electrode connected thereto a P-type semiconductor multilayer film reflective layer; and a cathode electrode connected to the N-type semiconductor multilayer film reflective layer; at least a predetermined portion of the base substrate side of the light-emitting region multilayer portion is composed of a semi-insulating semiconductor; and the cathode electrode is formed a group of a vertical resonator surface illuminating laser formed of the light-emitting region multilayer portion, the anode electrode, and the cathode electrode on the surface side of the base substrate In the base substrate is formed with a plurality of lines. The socket for optical communication according to the first aspect of the patent application, wherein each of the plurality of vertical resonator surface-emitting laser beams is formed in an N-type semiconductor contact layer, the N-type semiconductor The contact layer is composed of a compound having N-type conductivity, is separated from each other and insulated from each other, and is laminated on the surface of the base substrate. The socket for optical communication according to the second aspect of the patent application, wherein the base substrate is composed of a substrate made of GaAs; the N-type semiconductor contact layer is composed of AlGaAs having a composition ratio different from that of Ga. The constituent layers are composed of a plurality of layers. The socket for optical communication according to the third aspect of the patent application is further provided with a sealing resin covering the array of the light-emitting elements; and an optical path connecting the optical fiber and the array of the light-emitting elements passes through the sealing resin. The socket for optical communication according to any one of claims 1 to 4, wherein the positioning member is provided with a laser beam that is opposed to the array of light-emitting elements and that is emitted from the array of light-emitting elements Or a collimated first convex lens. The optical communication socket according to any one of claims 1 to 4, wherein the positioning member is provided with a second convex lens that condenses or collimates a laser beam emitted from the light emitting element array; The second convex lens is located on the optical axis of the optical fiber of the positioning member and faces the plug. A socket for optical communication according to any one of claims 1 to 4, wherein a surface mounting electrode is provided on a back surface of the substrate. An optical transmission module comprising: a socket for optical communication according to any one of claims 1 to 7; and a plug disposed at one end of the optical fiber; wherein the optical axis of the optical fiber is disposed at the plug a third convex lens that faces the positioning member. An optical transmission module comprising: a socket for optical communication according to any one of claims 1 to 7; and The plug is disposed at one end of the optical fiber; the optical axis of the optical fiber is parallel to the insertion direction of the plug. An optical transmission module comprising: a socket for optical communication according to any one of claims 1 to 7; and a plug disposed at a front end of the optical fiber; the socket further comprising a cover, the positioning member, And a cover of the light-emitting element array; and the plug and the cover are provided with a snapping means.